Abstract: A latent curing agent formed by holding an imidazole compound in porous resin particles is produced by emulsifying an oil phase obtained by dissolving a polyfunctional isocyanate compound in an organic solvent in an amount of 1.5 to 5 times by mass the amount of polyfunctional isocyanate compound in an aqueous phase obtained by dissolving a water-soluble polypeptide and a surfactant in water, then subjecting the emulsion to interfacial polymerization, adding a proteolytic enzyme to carry out an enzyme degradation treatment, then recovering the porous resin particles, and making an imidazole compound solution permeate into the recovered porous resin particles.

Abstract: The invention provides a process for continuously producing a urethane (meth)acrylate, containing causing a mixed liquid of a compound (A) having a hydroxyl group and a (meth) acryloyl group and a compound (B) having an isocyanate group to pass continuously and densely through a tubular microchannel formed in a heat-conducting reaction device, and reacting the hydroxyl group of the compound (A) with the isocyanate group of the compound (B).

Abstract: A solder resist having both adequate sensitivity at photo-irradiation and alkali developability, and the solder resist forming a cured product which is excellent in dimensional stability against temperature change, does not exhibit brittleness, and further, is excellent in water resistance, electrical insulation, thermal cycle test resistance (TCT resistance) and the like is provided, and further, a dry film having a solder resist layer, a cured product and a printed wiring board are provided. The solder resist comprising an acid-modified vinyl ester synthesized from an epoxy compound, a phenol compound, an unsaturated monobasic acid and a polybasic acid anhydride, wherein the epoxy compound contains a crystalline epoxy resin having a melting point of 90° C. or more, and the phenol compound contains a compound having a bisphenol S structure.

Abstract: A process for the solid phase continuous polymerization of polyester in order to achieve a molecular weight increase, measurable by the intrinsic viscosity IV increase of the polyester, wherein the use of at least a reactor (15) is provided, the reactor (15) being cylindrical, rotary around its own central axis (S), substantially horizontal, slightly inclined so as to produce the polymerization of the polyester granules passing through the reactor by gravity thanks to the inclination and the rotation of the reactor (15), inside the reactor there being produced a purge gas flow having the same or the opposite direction with respect to the flow of the polyester granules.

Abstract: Disclosed is a phenol aralkyl epoxy resin having a structure wherein at least a phenol or a naphthol is bound by using an aralkyl group as a linking group and a structure represented by formula (1) below, while satisfying the condition 1 below. This epoxy resin is excellent in workability during production of a composition and is easy to control quality. Condition 1: The following relation (?) is satisfied with A being the hydroxyl equivalent (as measured in accordance with JIS K 0070) of a phenol-modified epoxy resin obtained by adding an equivalent molar amount of phenol relative to the epoxy equivalent of the epoxy resin, and B being the epoxy equivalent of the epoxy resin. 50?1000×(A?B)/B?250 (?).

Abstract: A thermosetting resin composition include a liquid epoxy resin, a solid epoxy resin, a semisolid epoxy resin, an epoxy curing agent, and a filler. The liquid epoxy resin is liquid at 20° C. and has at least two epoxy groups in a molecule. A solid epoxy resin is solid at 40° C. and has at least three epoxy groups in a molecule. A semisolid epoxy resin is solid at 20° C. and liquid at 40° C. and has at least two epoxy groups in a molecule. A ratio of mass of the liquid epoxy resin to a sum of mass of the solid epoxy resin and mass of the semisolid epoxy resin is about 1:1 to about 1:10, and a ratio of the mass of the solid epoxy resin to the mass of the semisolid epoxy resin is about 1:0.5 to about 1:2.

Abstract: There is provided a method for obtaining an aqueous solution of an alkali metal salt of an aromatic dihydroxy compound by decomposing a waste aromatic polycarbonate by an alkali metal hydroxide aqueous solution. The method comprises (1) a dissolution step of dissolving a waste aromatic polycarbonate in a chlorinated hydrocarbon solvent, (2) a decomposition step of adding an alkali metal hydroxide aqueous solution to this solution to decompose the aromatic polycarbonate, (3) a re-dissolution step of adding water to this decomposed solution to dissolve a solid, (4) a two phase formation step of leaving the treated solution obtained in the step (3) to stand to form an organic solvent phase (organic phase) and an aqueous solution phase (aqueous phase), and (5) a separation/collection step of separating the aqueous phase from the organic solvent phase and collecting the aqueous phase.

Abstract: The present invention relates to an epoxy resin varnish composition with high glass transition temperature for laminate plate, wherein the resin composition comprises: (A) a new dihydrobenzoxazine thermosetting resin obtained by reacting compounds: (a) phenolic products from reaction of di- or multifunctional epoxy resin and di-functional phenolic compounds; (b) mono- or di-functional primary amines; (c) di-functional phenols; and (d) formaldehyde or paraformaldehyde, (B) one or more epoxy resins, (C) novolac resin curing agents, and (D) curing promoters. For the epoxy resin varnish composition, crosslinking density of resin is increased due to using modified dihydrobenzoxazine thermosetting resin with multiple functional groups, so that mechanical strength and heat resistance of the obtained substrate are remarkably improved, and solubility problem of dihydrobenzoxazine in solvent is solved to greatly elevate production efficiency.

Abstract: In accordance with the present invention, it has now been found that glycidyl epoxy resins containing substitution on the epoxide ring can be used with conventional epoxy curing agents and fluxing agents to produce underfill adhesives that are suitable for use with silver-based alloys. Owing to the structural similarity of the new materials to conventional epoxy resins, physical and material properties of the invention formulations are altered little, if at all, relative to products currently in use, and so are highly compatible with existing processes.

Abstract: A flexibilized resorcinolic novolak resin is prepared by reacting a phenolic compound, such as resorcinol, with an unsaturated dihydroxy, an unsaturated aldehyde, an aliphatic dialdehyde, or a mixture thereof. An aldehyde (different from the unsaturated aldehyde and the aliphatic dialdehyde) is either simultaneously or subsequently added to the reaction mixture. The flexibilized resorcinolic novolak resin can be used in an adhesive composition for enhancing the adhesion between tire cords and rubber for tire applications.

Abstract: A composite material including a thermoplastic polymer matrix and a non-carbonaceous resistivity modifier dispersed in the thermoplastic polymer matrix. The composite material has a surface resistivity of about 1.0×104 ohm/sq to about 1.0×1011 ohm/sq and at least a portion of a surface of the composite material has a surface roughness (Ra) not greater than about 500 nm.

Abstract: Adhesive compositions comprising epoxy resins, including epoxy novalac resin, and at least one reactive multi-functional acrylate. In preferred embodiments, the compositions also include amine-curing agent having at least one a cyclic group. The adhesive compositions according to the present invention are capable of enhancing the bonding strength of the adhesive, particularly at relatively high temperatures, such as at about 80° C.

Abstract: A flexibilized resorcinolic novolak resin is prepared by reacting a phenolic compound, such as resorcinol, with an unsaturated dihydroxy, an unsaturated aldehyde, an aliphatic dialdehyde, or a mixture thereof. An aldehyde (different from the unsaturated aldehyde and the aliphatic dialdehyde) is either simultaneously or subsequently added to the reaction mixture. The flexibilized resorcinolic novolak resin can be used in an adhesive composition for enhancing the adhesion between tire cords and rubber for tire applications.

Abstract: This invention relates to thermosetting resin compositions useful for mounting onto a circuit board semiconductor devices, such as CSPs, BGAs, LGAs and the like, each of which having a semiconductor chip, such as LSI, on a carrier substrate. The compositions of this invention are reworkable when subjected to appropriate conditions.

Abstract: A latent fluxing agent comprising a material which liberates phenol or a carboxylic acid containing compound when heated above 140° C. The latent fluxing agent may be incorporated into a thermoset resin, which includes an epoxy resin. The uncured epoxy resin, which includes the epoxy resin, the latent fluxing agent and an epoxy curing agent are useful as an underfill composition in a method for applying a chip die, having one or more solder balls, to a substrate. The method is used to produce an integrated circuit chip that includes a chip die having electrical contacts arranged in a predetermined pattern and capable of providing electrical engagement with a carrier substrate.

Abstract: The present invention provides a cationic paint composition containing, as a vehicle component, a xylene-formaldehyde resin-modified amino group-containing epoxy resin obtained by reacting an epoxy resin having an epoxy equivalent of 180 to 2,500 with an alkyl phenol and/or a carboxylic acid, a xylene-formaldehyde resin, and an amino group-containing compound.

Abstract: A silicone compound, either alone or in combination with a photoacid generator, is added to a branched polysilane compound. According to this constitution, highly reliable polymer material and polymer film can be realized which have excellent stability of refractive index against heat and high transparency and, when the photoacid generator is contained, can cause a change in refractive index upon exposure to ultraviolet light with high sensitivity and high resolution.

Abstract: A halogen-free, phosphorus-free poly-cyclic compound is used a flame retardant. This compound has amide and hydroxy groups, and thus it is able to react with an epoxy resin to form a reactive type flame-retardant advanced epoxy resin. The advanced epoxy resin together with an inorganic additive are mixed with an epoxy resin to form a halogen-free, phosphorus-free flame-retardant epoxy composition, which can be used in the manufacture of a printed circuit board and as an encapsulation material for a semi-conductor device.

Abstract: An epoxy resin composition having a viscosity of from 50 to 400 P at 25° C. is disclosed. The composition provides by casting a resin plate, particularly a transparent resin plate for a liquid crystal display, which has satisfactory thickness precision.

Abstract: A latent fluxing agent comprising a material which liberates phenol or a carboxylic acid containing compound when heated above 140° C. The latent fluxing agent may be incorporated into a thermoset resin, which includes an epoxy resin. The uncured epoxy resin, which includes the epoxy resin, the latent fluxing agent and an epoxy curing agent are useful as an underfill composition in a method for applying a chip die, having one or more solder balls, to a substrate. The method is used to produce an integrated circuit chip that includes a chip die having electrical contacts arranged in a predetermined pattern and capable of providing electrical engagement with a carrier substrate.

Abstract: Curable mixtures based on epoxy resins and amine hardeners, if required additionally using solvents, water, plasticisers, UV stabilisers, colourants, pigments, fillers, which mixtures contain as accelerator at least one compound of general formula (I), wherein R1, R2, R3, R4 are each independently of one another H or an unbranched or branched alkyl radical containing 1 to 15 carbon atoms, and n is 0 to 10.

Abstract: A modified phenolic hydroxyl-containing resin having a low free difunctional phenol content and represented by general formula (1); a solid epoxy resin having an epoxy equivalent of 450 to 2,500 g/eq and prepared by epoxidizing the above resin; and another solid epoxy resin having an epoxy equivalent of 1,500 to 60,000 g/eq and a number-average molecular weight of 3,000 to 15,000 and prepared by reacting the above epoxy resin with a difunctional phenol compound. Resin compositions containing these resins have many applications as powder coatings and can paints. In formula (1), X represents a residue of a difunctional phenol compounds; X's may be the same or different; and n is the number of repeating units and is an integer of 0 or above.

Abstract: A composition useful as a sealant, coating, a potting agent for a printed circuit board, a prepreg or an adhesive comprises a compound (A) wherein all or a part of the oxirane rings in an epoxy compound is replaced with thiirane rings represented by the following formula (1): or compound (A) and compound (B) which contains oxirane rings and no thiirane ring in the molecule, wherein the ratio of oxirane ring/thiirane ring is from 90/10 to 10/90.

Abstract: A multilayer printed circuit board having resinous insulating layers and conductor layers alternately superposed on a circuit board with ample adhesive strength, a method for the production thereof, and a curable resin composition useful for the formation of resinous insulating layers are disclosed. The manufacture of the multilayer printed circuit board is accomplished by applying the curable resin composition to the surface of conductor layer of the circuit board, thermally curing the applied layer thereby forming resinous insulating layer, then boring a through-hole in the circuit board, treating the resinous insulating layer with a coarsening agent thereby imparting undulating coarsened surface thereto, subsequently coating the surface of resinous insulating layer and the inner surface of the through-hole with a conductor layer as by electroless plating, and thereafter forming a prescribed circuit pattern in the conductor layer.

Abstract: Novel epoxy acrylates and carboxyl group-containing epoxy acrylates of formulae II and III of the claims that are relatively highmolecular and are chemically crosslinkable can be used in photoresist formulations with the additional use of highly polymerised polymer binders. Such resist formulations are used in particular in the field of printed circuit boards and printing plates, are applicable from aqueous medium, are almost tack-free and have very good edge coverage, especially on conductors.

Abstract: Disclosed is a liquid epoxy resin composition for sealing a semiconductor device which comprises (A) a cyanic acid ester, (B) an epoxy resin, (C) an inorganic filler, (D) a metal chelate and/or a metal salt, and at least one of (E1) an acid anhydride, (E2) a dihydrazide compound and (F) a silicone resin gel, wherein at least one of components A and B is liquid at room temperature, component E1 is liquid at room temperature, and the weight ratio of component C to the total weight of the composition, the weight ratio of component A to component B, and the weight ratio of component E1, E2 or F to the total weight of the composition except component C each ranges a specific ratio.

Abstract: There is described a curable coating composition having at least one effect pigment which, upon cure, exhibits substantially improved orientation of the effect pigment and a corresponding improvement in appearance. The composition comprises: (A) a carbamate-functional component having a hydrophobicity equivalent to or greater than that of a carbamate-functional compound (A′) which is the reaction product of: (1) a compound comprising a plurality of hydroxyl groups, at least one of which is the result of a ring-opening reaction between an epoxy group and an organic acid group, and (2) cyanic acid or a compound comprising a carbamate group, and (B) a component comprising a plurality of groups that are reactive with the carbamate functional groups on component (A), and (C) at least one effect pigment, the curable coating composition when cured having a substantially improved effect pigment orientation. Preferably, the composition further comprises particular rheology control agents.

Abstract: An epoxy resin composition having a viscosity of from 50 to 400 P at 25° C. is disclosed. The composition provides by casting a resin plate, particularly a transparent resin plate for a liquid crystal display, which has satisfactory thickness precision.

Abstract: This invention relates to hydrolytically degradable gels of crosslinked poly(ethylene) glycol (PEG) structures. Addition of water causes these crosslinked structures to swell and become hydrogels. The hydrogels can be prepared by reacting two different PEG derivatives containing functional moieties at the chain ends that react with each other to form new covalent linkages between polymer chains. The PEG derivatives are chosen to provide covalent linkages within the crosslinked structure that are hydrolytically degradable. Hydrolytic degradation can provide for dissolution of the gel components and for controlled release of trapped molecules, including drugs. Reagents other than PEG can be avoided. The hydrolysis rates can be controlled by varying atoms adjacent to the hydrolytically degradable functional groups to provide substantially precise control for drug delivery in vivo.

Abstract: The present invention provides an epoxy resin composition having excellent moldability, flame retardancy and soldering resistance and low in water absorption. More specifically, it provides an epoxy resin composition for semiconductor encapsulation comprising (A) an epoxy resin in which the proportion of the carbon atoms of aromatic derivation to the whole carbon atoms in the epoxy resin is 70% or more, (B) a phenol resin in which the proportion of the carbon atoms of aromatic derivation to the whole carbon atoms in the phenol resin is 70% or more and whose phenolic hydroxy equivalent is 140 to 300, (C) a curing accelerator, and (D) an inorganic filler whose content W (wt %) in the whole epoxy resin composition satisfies 88≦W≦94, characterized in that the combustion starting temperature in thermogravimetric analysis of the cured epoxy resin composition in the air atmosphere is 280° C. or higher, or the retention A (wt %) of the cured product in said TG analysis satisfies W+[0.

Abstract: Heat sensitive substrates, as well as others such as metal or glass, are electrostatically coated with a thermosetting coating powder comprising a melt-mixed, chilled, chipped, and powdered blend of an epoxy resin and a catalyst therefore, and a polyamine as a powdered low temperature curing agent along with a scavenger which will react secondarily with residual polyamine domains that do not contact the base epoxy resin during curing. The coating powder is deposited on the substrate and heated to fuse, flow and cure. The mixture of resin and catalyst does not cure within the extruder but it is made to cure at low temperatures on the desired substrate by the separate addition of the curing agent to the powdered melt-mixed blend.

Abstract: A rational technical process for producing dialkylnaphthalenes from petroleum-derived starting materials which exist in abundance is established.

Abstract: The present invention provides a curable coating composition that includes at least three components. The coating composition includes a component (a) that includes one or both of a compound (a)(1) having at least one carbamate group or terminal urea group according to the invention and having at least two linking groups that are urethane or urea or a compound (a)(2) having at least two groups selected from carbamate groups, terminal urea groups, or combinations of the two and at least four urethane or urea linking groups. The second component (b) of the coating composition includes an acrylic polymer comprising active hydrogen-containing functional groups reactive with the third component(c). Component (c) of the coating composition is a curing agent that is reactive with the first two components. Preparation of coated articles using the compositions of the invention is also disclosed.

Abstract: There is described a curable coating composition having at least one effect pigment which, upon cure, exhibits substantially improved orientation of the effect pigment and a corresponding improvement in appearance. The composition comprises:(A) a carbamate-functional component having a hydrophobicity equivalent to or greater than that of a carbamate-functional compound (A') which is the reaction product of:(1) a compound comprising a plurality of hydroxyl groups, at least one of which is the result of a ring-opening reaction between an epoxy group and an organic acid group, and(2) cyanic acid or a compound comprising a carbamate group, and(B) a component comprising a plurality of groups that are reactive with the carbamate functional groups on component (A), and(C) at least one effect pigment,the curable coating composition when cured having a substantially improved effect pigment orientation. Preferably, the composition further comprises particular rheology control agents.

Abstract: The present invention provides a curable coating composition that includes at least three components. The coating composition includes a component (a) having at least one carbamate group or urea group and having a lactone or hydroxy carboxylic acid moiety. The second component (b) of the coating composition is one or more of three materials. First, the second component can be a polymer resin (b)(1) comprising active hydrogen-containing functional groups reactive with the third component(c). Secondly, the second component can be a compound (b)(2) having at least one carbamate group or terminal urea group according to the invention and having at least two linking groups that are urethane or urea. Finally, the second component can be a compound (b)(3) having at least two groups selected from carbamate groups, terminal urea groups, or combinations of the two and at least four urethane or urea linking groups.

Abstract: The present invention provides a curable coating composition that includes at least three components. The coating composition includes a component (a) that includes one or both of a compound (a)(1) having at least one carbamate group or terminal urea group according to the invention and having at least two linking groups that are urethane or urea or a compound (a)(2) having at least two groups selected from carbamate groups, terminal urea groups, or combinations of the two and at least four urethane or urea linking groups. The second component (b) of the coating composition includes a polymer resin comprising active hydrogen-containing functional groups reactive with the third component (c). The resins is selected from polyester, polyurethane, or polyester-polyurethane copolymers Component (c) of the coating composition is a curing agent that is reactive with the first two components. Preparation of coated articles using the compositions of the invention is also disclosed.

Abstract: Providing a modified epoxy resin which is suitable for utilized as a coating for repairing, a process for the preparation thereof, and a composition. It is a modified epoxy resin obtained by reacting at least one epoxy resin (a) having at least one or more epoxy groups in a molecule with at least one kind of aliphatic monocarboxylic acid (b) having carbon atoms of 10 to 30 in a molecule in proportion of 20 to 80% by equivalent with respect to the epoxy groups in said epoxy resin, a process for the preparation of said resin by the use of a phosphorus-based catalyst, and a composition comprising said resin and a solvent.

Abstract: A modified phenolic hydroxyl-containing resin having a low free difunctional phenol content and represented by general formula (1); a solid epoxy resin having an epoxy equivalent of 450 to 2,500 g/eq and prepared by epoxidizing the above resin; and another solid epoxy resin having an epoxy equivalent of 1,500 to 60,000 g/eq and a number-average molecular weight of 3,000 to 15,000 and prepared by reacting the above epoxy resin with a difunctional phenol compound. Resin compositions containing these resins have many applications as powder coatings and can paints. In formula (1), X represents a residue of a difunctional phenol compounds; X's may be the same or different; and n is the number of repeating units and is an integer of 0 or above.

Abstract: A thermally curable adhesive composition that includes a fluxing agent that also acts as an adhesive is provided. The composition includes: (a) a fluxing agent represented by the formula RCOOH, wherein R comprises a moiety having two or more carbon-carbon double bonds wherein in one embodiment, at least one is within an acrylate or methacrylate group, and which may further contain at least one aromatic moiety; (b) a carboxylic acid neutralizing agent; (c) optionally, a crosslinkable diluent; (d) optionally, a source of free radical initiators; and (e) optionally, a resin. The composition can be applied directly onto the surface(s) of devices that are to be joined electrically and mechanically. These devices include, printed circuit substrates, connectors, components, cables, and other electrical devices having metallization patterns to be soldered together by means of a solder-bumped pattern on one or both surfaces.

Abstract: The present invention provides a curable coating composition comprising(a) a first component comprising at least two functional groups, at least one of which is a carbamate or urea group that is the reaction product of:(1) a hydroxyl group that is the result of a ring-opening reaction between an epoxy group and an organic acid group, and(2) cyanic acid or a carbamate or urea group;(b) a curing agent having a plurality of functional groups that are reactive with component (a), and(c) a second component having functional groups that are reactive with component (a) or component (b) or both components (a) and (b).

Abstract: Curable coating compositions are described comprising(a) a polymer resin comprising active hydrogen-containing functional groups,(b) a curing agent having groups that are reactive with said functional groups on (a), and(c) a compound comprising at least one carbamate group that is the reaction product of:(1) a hydroxyl group that is the result of a ring-opening reaction between an epoxy group and an organic acid group, and(2) cyanic acid or a compound comprising a carbamate group.

Abstract: A composition useful as a die-attach adhesive, polymer bump or encapsulant comprises from about 5-100% by weight of a base resin and from zero to 95% by weight of a particulate filler such as silver, wherein the base resin contains (a) from 10-95 parts by weight of a cycloaliphatic epoxy-functional siloxane, (b) from about 5-90 parts by weight of a non-silicon-containing polyepoxy resin, .COPYRGT. from about 0.1-3 parts by weight of an iodonium salt, (d) from zero to about 3 parts by weight of a copper compound and, optionally, a silane adhesion promotor and/or an elastomeric toughener.

Abstract: A coating composition is described comprising, in an aqueous medium:A) a resin having a plurality of primary amine groups, andB) a curing agent having a plurality of cyclic carbonate groups.

Abstract: There is described a curable coating composition comprising:(A) a carbamate-functional component that is the reaction product of:(1) a compound comprising a plurality of hydroxyl groups, at least one of which is the result of a ring-opening reaction between an epoxy group and an organic acid group, and(2) cyanic acid or a compound comprising a carbamate group, and(B) a component comprising a plurality of groups that are reactive with the carbamate functional groups on component (A).

Abstract: A composite, polymer bonded abrasive wheel is disclosed for grinding operations and especially for use with multiple station, glass beveling machines. The abrasive wheel breaks in quickly and delivers consistent performance with little or no dressing needed over the entire life of the wheel. In one aspect, the novel abrasive wheel includes a concentrically mounted, annular abrasive rim on a cup shaped hub. The rim can contain an abrasive such as diamond or cubic boron nitride which is embedded in a bonding composition that includes amino aldehyde and phenolic thermoset polymers, a plasticizer, and optionally filler. The hub includes a crosslinkable, strong and rigid, engineering polymer, preferably melamine phenolic thermoset polymer, mixed with spodumene in amount effective to make the coefficient of thermal expansion of the hub match that of the rim. The wheel can be made by simultaneously hot pressing rim and hub preforms and without an additional baking step.

Abstract: A binder solution of a phenolic novolak resin in solvent, preferably furfuryl alcohol containing at least one chemical agent such as amines containing one to five, preferably two to four, nitrogen atoms, glycerine or mixtures thereof. Preferably, the binder solution contains about 0.2 to about 1.5 weight percent water. The binder solution is for binding refractory objects, preferably those containing doloma (calcined dolomite) aggregate. Methods of mixing these ingredients and using the mixture are also disclosed. Bricks made from the doloma aggregate mixed with the binder solution show good ambient temperature green strength and enhanced modulus of rupture after curing and coking.

Abstract: The invention relates to an organic phosphorus compound-containing which comprises an interpenetrating polymer network (IPN) produced by polymerizing free-radically polymerizable monomers comprising at least an allyl group-containing monomer and an epoxy resin.

Abstract: Stoving enamels comprising epoxy resins and carboxyl-functional alkylidenepolyphenols in a quantity such that the carboxyl groups are present at least in equimolar quantities relative to the epoxide groups of the epoxy resins are suitable for coating the inside of metallic food containers and give, on the packaging, baked coating films which are essentially free from migratable constituents carrying epoxide groups.

Abstract: There is described a curable coating composition comprising:(A) a carbamate-functional component that is the reaction product of:(1) a compound having a plurality of hydroxyl groups that is the reaction product of:(a) a compound comprising at least one epoxide group and(b) a compound comprising a plurality of organic acid groups,(2) a compound comprising a carbamate group, and(B) a component comprising a plurality of groups that are reactive with the carbamate functional groups on component (A).

Abstract: There is described a curable coating composition comprising:(A) a carbamate-functional component that is the reaction product of:(1) a compound having a plurality of hydroxyl groups that is the reaction product of:(a) a compound comprising at least one epoxide group and(b) a compound comprising at least one organic acid group and at least one hydroxyl group,(2) a compound comprising a carbamate group, and(B) a component comprising a plurality of groups that are reactive with the carbamate functional groups on component (A).