Abstract: A resin composition for a laminate comprises 100 parts by weight of a polyfunctional epoxy resin (I) obtained by (i)(1) glycidylizing a polycomposite formed from a blend of brominated bisphenol A and bisphenol A, or brominated bisphenol A and formaldehyde; or (2) a mixture of a polyfunctional epoxy resin and a bisphenol A-advanced epoxy resin reacted with brominated bisphenol A in a hydroxyl:epoxy equivalent ratio of from 0.05-0.5:1 and (ii) a bisphenol A-formaldehyde phenolic resin having a weight average molecular weight of from 1,000-10,000 in a hydroxyl:epoxy equivalent ratio with respect to epoxy resin (i) of from 0.7-1.2:1; and (II) from 1-60 parts by weight of a straight chain polymer (c) such as a poly(ether)sulfone, aromatic polyester, phenoxy resin, polyparabanic acid, polyetherimide or polyphenylene sulfide.

Abstract: The invention relates to the use of tripotassium citrate monohydrate and other alkali metal salts of polybasic acid as bench life extenders in heat curable hot box foundry mixtures comprising sand, thermosetting binder resin, and a latent acid catalyst composition. In one embodiment, the thermosetting binder resin is a phenolic resole resin modified with urea formaldehyde resin. In another embodiment, the thermosetting binder resin is a furfuryl alcohol resin modified with urea formaldehyde resin.

Abstract: A novel epoxy-functional hydroxy ester composition is produced by reacting (a) dimethylolpropionic acid and (b) an aliphatic or cycloaliphatic glycidyl ether, an epoxy novolac or a cycloaliphatic epoxy having a functionality of at least about 1.5 epoxide group per molecule.

Abstract: Novel epoxy acrylates and carboxyl group-containing epoxy acrylates of formulae II and III of the claims that are relatively highmolecular and are chemically crosslinkable can be used in photoresist formulations with the additional use of highly polymerized polymer binders. Such resist formulations are used in particular in the field of printed circuit boards and printing plates, are applicable from aqueous medium, are almost tack-free and have very good edge coverage, especially on conductors.

Abstract: A molding material useful in the fabrication of an electrical or electronic part comprises a modified phenolic resin (A), an epoxy resin (B) and a curing agent (C), said modified phenolic resin prepared by heating heavy oil or pitch and a formaldehyde in a molar ratio of formaldehyde: (oil or pitch) of from 1-15:1 in the presence of an acid catalyst, adding phenol in a molar ratio of phenol: (oil or pitch) of from 0.5-5:1 to form a modified phenolic resin, and purifying by performing in optional sequence (i) a treatment with an aliphatic or alicyclic hydrocarbon and (ii) an extraction with an aromatic hydrocarbon solvent wherein the catalyst has a solubility of 0.1 or less to remove the catalyst.

Abstract: A process for producing a modified phenolic resin comprises heating (a) petroleum heavy oil or pitch and (b) a formaldehyde polymer in a molar ratio of formaldehyde:oil or pitch of from 1 to 15:1 in the presence of an acid catalyst, adding phenol in a molar ratio of phenol:oil or pitch of from 0.5 to 5:1 to form a crude modified phenolic resin, and purifying by performing in optional sequence (i) a treatment with an aliphatic or alicyclic hydrocarbon to remove unreacted components and (ii) an extraction with a solvent wherein the catalyst has a solubility of 0.1 or less to remove the catalyst.

Abstract: The present invention relates to a modified epoxy resin, a method for the preparation thereof and an epoxy resin composition using the modified epoxy resin. In particular, it relates to a modified epoxy resin of the general formula (I) which is prepared by incorporating a monomaleimide having a carboxy group useful as a heat resistance-improving agent of a resin composition containing an epoxy resin and maleimides into an epoxy resin, and an epoxy resin composition for sealing a semiconductor element having the improved heat resistance and moldability by the modified epoxy resin. ##STR1## wherein, R represents a hydrogen atom or an alkyl group having from 1 to 10 carbon atoms (C.sub.1 to C.sub.10), andn is 0 to 100, and m is 1 to 100.

Abstract: Compositions of coreactant resins, such as an epoxy resin, and polyanhydrides that contain non-cyclic anhydride moieties are cured to provide coatings that have good exterior durability. Preferred high molecular weight polyanhydrides contain a central polymer moiety that has no more than about 25 weight percent repeating units derived from unsaturated aliphatic hydrocarbon monomers. In other preferred polyanhydrides, the anhydride moleties are linked to a central moiety by an ester moiety.

Abstract: A flame retardant epoxy molding compound comprises an epoxy, a hardener preferably of the novolac or anhydride type, a catalyst, a mold release agent, preferably a filler, preferably a colorant, preferably a coupling agent, an organic compound containing a higher percent of halogen (which can be part of the resin or the hardener), preferably the meta-brominated cresol epoxy novolac type, preferably containing at least about 0.5% of bromine by weight of the molding compound, a lower percent of sodium, preferably in the range of 0.03-0.06% by weight of the antimony pentoxide, a lower percent of antimony pentoxide, preferably in the range of from less than about 0.8% by weight of the molding compound, and an amount of magnesium aluminum carbonate hydrate less than or about 4.0% by weight of the molding compound. The flame retardant epoxy compounds when used to encapsulated the semiconductor devices have improved high temperature stability and reliability compared to similar prior art molding compounds.

Abstract: Compositions comprising epoxy resins containing one or more rodlike mesogenic moieties per molecule are cured with polyamines containing one or more rodlike mesogenic moieties per molecule. These curable compositions can be oriented by the application of an electric field or magnetic field or drawing and/or shear flow prior to and/or during curing. The resultant cured products exhibit an improvement in one or more physical and/or mechanical and/or thermal properties as compared to a like epoxy resin system which does not contain any rodlike mesogenic moieties.

Abstract: Polymer modified adducts are prepared by (A) reacting (1) an epoxy resin having an average of more than one vicinal epoxide group with (2) a compound containing an average of two or more hydrogen atoms reactive with an epoxide group; and (B) partially vinylizing reacting the product from step (A); and (C) polymerizing the partially vinylized product from step (B) with (3) a polymerizable ethylenically unsaturated monomer; with the proviso that at least one of the components (1), (2) or (3) contain one or more mesogenic or rodlike moieties. These adducts are useful as epoxy resin curing agents.

Abstract: Compositions containing an aryl phosphite and water to hydrolyze the aryl phosphite provide controlled and extended work time when used as hardening agents for the ambient temperature hardening of phenolic resins and for rapid hardening of such resins at modestly elevated temperatures. Pre-solvolysis with small quantities of water, alkanols of 1 to 4 carbon atoms or alkylene glycols of 2 to 4 carbon atoms improve compatibility of trisubstituted phosphites with the resin. Pre-hydrolysis of the phosphites as well as addition of furfuryl alcohol or alkylene glycols of 2 to 4 carbon atoms accelerate the hardening (curing) of the resin. Various compounds such as: carboxylic acid amides, urea, dicyandiamide, N-methylolated amides, N-alkyl 2-pyrrolidinones having 1 to 4 carbon atoms in the alkyl group, those having an internal epoxide group, alkanols, and Schiff bases retard the ambient temperature hardening of the resin with the aryl phosphite hardening agents.

Abstract: The present invention provides an epoxy resin composition which is obtained by melt-mixing 100 parts by weight of an epoxy resin with 3 to 33 parts by weight of a thermoplastic resin alone or in combination with other components and additives than a hardener in the first mixing step and then with a hardener alone or in combination with other components and additives in the second mixing step, said epoxy resin having a number-average molecular weight of at least 200 and lower than 5000 and said thermoplastic resin having a number-average molecular weight of at least 5000; an adhesive epoxy resin molded article which is obtained by molding said epoxy resin composition; a process for producing an adhesive epoxy resin molded article which comprises molding said epoxy resin composition into a 0.01 to 10 mm thick film or sheet in a substantially uncured state and subsequently punching the film or sheet at temperatures higher than 15.degree. C. and lower than 70.degree. C.

Abstract: A resin composition for fiber reinforced plastic comprising the following components A, B, C, D and E as essential components:A: a bisphenol A epoxy resin having an epoxy equivalent of at most 250 and being liquid at room temperature,B: a bisphenol A epoxy resin having an epoxy equivalent within a range of from 400 to 5,000 and softening point of from 60.degree. to 200.degree. C.,C: a phenol novolak type epoxy resin,D: a nitrile rubber, andE: a curing agent.

Abstract: A resin composition comprising a polymeleimide compound having two or more maleimide groups in one molecule, a phenol novolac resin of which phenolic hydroxyl groups are epoxidized and allyl-etherified and, as an optional ingredient, a curing agent, or a resin composition comprising a polymaleimide compound having two or more maleimide groups in one molecule, a phenol novolac resin of which phenolic hydroxyl groups are allyl-etherified and an epoxy resin; and a heat resistant composite material comprising cured product of said resin composition as its matrix phase and containing a fiber as its reinforcing material.

Abstract: Adhesive compositions of a selected class of epoxy resins combined with a selected class of carboxylic group-containing acrylonitrile-butadiene and methacrylonitrile-butadiene copolymers, maleimide derivatives and an imidazole compound. The resultant compositions are electrically insulative, thermally resistant, highly capable of fabrication at low pressure and storage stable.

Abstract: Intimate blends of macrocyclic oligomer compositions, such as cyclic polycarbonate or poly(alkylene dicarboxylate) oligomer mixtures, are blended with linear polymers, especially addition polymers. The blends flow easily and are frequently homogeneous. The macrocyclic oligomers therein may be polymerized to produce resin blends having advantageous properties.

Abstract: There are disclosed methods and compositions for retarding the ambient temperature hardening of a phenolic resole resin alone or with an aggregate when such resin is contacted with a nitroalkane and a hardening agent such as lightburned magnesium oxide, an organic ester functional hardening agent, and mixtures of lightburned magnesium oxide and an organic ester functional hardening agent in an alkaline medium. There is also disclosed a hardener composition for phenolic resole resins wherein the hardener composition consists essentially of a solution of a nitroalkane in an organic ester functional hardening agent.

Abstract: An epoxy resin composition for sealing semiconductor elements comprising o-cresol-novolak type epoxy resins, curing agents, curing accelerators, inorganic fillers, plasticizers and imide-epoxy resins having the formula (I) is disclosed. Use of the imide-epoxy resin in an amount of 0.1 to 20.0% by weight improves the heat and moisture resistant properties of the epoxy resin composition. ##STR1## wherein, R.sub.1 and R.sub.2 denote independently H or (CH.sub.2)nCH.sub.3 radical,n denotes 0 or an integer of 1 above.

Abstract: A rodlike mesogenic moiety-containing polythiirane resin is blended with an epoxy resin and when cured with a curing agent is useable in molding applications.

Abstract: Compositions comprising epoxy resins containing one or more rodlike mesogenic moieties per molecule are cured with polyamines containing one or more rodlike mesogenic moieties per molecule. These curable compositions can be oriented by the application of an electric field or magnetic field or drawing and/or shear flow prior to and/or during curing. The resultant cured products exhibit an improvement in one or more physical and/or mechanical and/or thermal properties as compared to a like epoxy resin system which does not contain any rodlike mesogenic moieties.

Abstract: A polymeric material used in laminates with metal-comprises an interpenetrating polymer network composed of a cyclic moiety-containing pollyallyl compound optionally with an aromatic difunctional compound (co)polymerized and cross-linked in the presence of a free radical initiator, and an epoxy resin cross-linked with a polyhydric phenol.

Abstract: A rodlike mesogenic moiety-containing polythiirane resin is blended with an epoxy resin, is curable with a curing agent and can be employed in molding applications.

Abstract: The invention relates to a binder (A) which contains hydroxyl groups and carboxyl groups, the latter optionally in neutralized form, wherein the binder (A) is essentially composed of a mixture of polyalkylidenepolyphenols (B) having average degrees of condensation of 2.3 to 8.0 and average molecular weights M.sub.n of 250 to 1,000, these polyalkylidenepolyphenols (B) containing phenolic OH groups and carboxyl groups, and polyaddition products (C) containing structural units (d) which are derived from epoxide compounds (D) which on average contain at least two (1,2-)epoxide groups per molecule, the structural units (d) having an average molecular weight M.sub.n of 600 to 10,000, and containing structural units (b) which are derived from the polyalkylidenephenols (B), and these polyaddition products (C) have average molecular weights M.sub.n of at least 1,100.

Abstract: A composition comprising a curable epoxy resin, a reactive diluent, a curing agent for the epoxy resin, and an isocyanate compound is stable at room temperature for extended periods of time and cures to form a part which has good high-temperature properties.

Abstract: An epoxy resin powder coating composition comprises 100 parts by weight of bisphenol A mixed epoxy resin having number average molecular weight from 1,700 to 4,500 comprising a bisphenol A epoxy resin (A) having a number average molecular weight from 2,500 to 8,000 and a bisphenol A epoxy resin (B) having a number average molecular weight from 300 to 1,000 (C) a novolak epoxy resin 5 to 20 parts by weight of polyvinyl butyral resin or polyviny formal resin, a hardener, and a filler.

Abstract: Binder mixtures crosslinkable by radiation comprising as component A a product obtained by reaction of an epoxy compound with more than one epoxide group per molecule with at least one carboxylic acid in a molar ratio of epoxide groups to carboxyl groups of 1:0.5-0.9 and subsequent reaction of the reaction product with at least one unsaturated isocyanatocarbamate esters and as component B a product obtained by reaction of an epoxy compound with more than one epoxide group per molecule with at least one olefinic unsaturated carboxylic acid in a molar ratio of epoxide groups to carboxyl groups of 1:>>1 and subsequent reaction of the reaction product with at least one polybasic carboxylic acid or anhydride(s) thereof, components A and B being present in a weight ratio of 3:1 to 1:3 useful for the product of superior photo-resists and protective lacquers.

Abstract: An aromatic polyglycidyl polyether resin having an average of 1.5 to 4.5 epoxy groups and 0.1 to 18 primary or secondary --OR groups per molecule, wherein from 5 to 95% of the --OR groups have the general formula --O--CH.sub.2 --CHOH--CH.sub.2 --O--C(O)--R', in which R' is a branched C.sub.4-17 alkyl group, the remainder of the --OR groups being hydroxyl groups, and a process for preparing the same wherein an epoxy compound (A) is reacted with one or more hydroxyl groups contained in a polyglycidyl polyether (B) of a polyhydric aromatic compound in the presence of an etherification catalyst (C), in which (A) is a glycidylester of a C.sub.5-18 branched aliphatic monocarboxylic acid, (B) is a polyglycidyl polyether having on average of from 1.5 to 4.5 epoxy groups and of form 0.1 to 18 primary or secondary hydroxyl groups per molecule, and (C) is a tin, zinc or iron compound.

Abstract: Nonaqueous organic solvent solutions of phosphate esters of epoxy resins. Coating compositions containing these compositions have improved thermal properties as compared to like compositions which are dispersed in water.

Abstract: A resin composition for sealing semiconductors which comprises (a) an epoxy resin having a specific structure, a modified epoxy resin composed of (i) an epoxy resin having a specific structure or a graft polymer of an epoxy resin having a specific structure and a vinyl polymer and (ii) a silicone polymer in an oily state or as particles having an average particle size of not more than 1.0 micron, which are uniformly dispersed in the epoxy resin or the graft polymer, (b) a hardening agent (c) an inorganic filler and (d) a special polymaleimide is herein provided. The resin composition for sealing semiconductors exhibits a low thermal expansion coefficient and a low elastic modulus, generates low stress when thermal shock is applied thereto and exhibits high heat resistance during soldering even after moisture absorption.

Abstract: Disclosed in a polyamide epoxy ester resin having a weight average molecular weight of 1,000 to 100,000, an epoxy equivalent of 500 to 10,000, and an acid value of not greater than 10, which is prepared by reacting(i) at least one epoxy resin which is a glycidyl ether of a dihydric phenol,(ii) at least one dihydric phenol and(iii) a polyamide dicarboxylic acid having an amine value of not greater than 20 and an acid value of at least 20, which is prepared by reacting a polymerized fatty acid composed mainly of a dimer acid with a diamine at a polymerized fatty acid/diamine molar ratio of from 2/1.0 to 2/1.9,at a ratio of such that the amount of the polyamide dicarboxylic acid segment in the resin ranges 1 to 30 percent by weight based on the weight of the resin.Also, disclosed are a process for preparing the polyamide epoxy ester resin and a coating composition comprising the resin. The coating composition is particularly useful for can coating.

Abstract: A resin composition comprising a polymeleimide compound having two or more maleimide groups in one molecule, a phenol novolac resin of which phenolic hydroxyl groups are epoxidized and allyl-etherified and, as an optional ingredient, a curing agent, or a resin composition comprising a polymaleimide compound having two or more maleimide groups in one molecule, a phenol novolac resin of which phenolic hydroxyl groups are allyl-etherified and an epoxy resin; and a heat resistant composite material comprising cured product of said resin composition as its matrix phase and containing a fiber as its reinforcing material.

Abstract: Stain-resistant compositions comprising sulfonated phenol-formaldehyde condensation products and polymers of maleic anhydride and one or more ethylenically unsaturated monomers, polyamide textile substrates treated with the same, and processes for their preparation. The stain-resistant compositions and substrates possess improved stain resistance but do not suffer from yellowing to the extent that previously known materials do.

Abstract: A process for preparing an epoxy resin and a process for preparing a hardened and cured epoxy resin adhesive is provided, together with the epoxy resins and adhesives made thereby. The epoxy resin is prepared by mixing together about 76 parts per hundred of a novolac epoxy resin, about 19 parts per hundred of a bisphenol F epoxy resin, and about 5 parts per hundred of carboxy-terminated butadiene acrylonitrile, heating the mixture to a temperature of from about 290 to about 350 degrees Fahrenheit for a time of from about two to about three hours, and then cooling. An epoxy adhesive is prepared by mixing 100 parts of the material so prepared with about 20 parts of a curing agent consisting essentially of diethyltriamine. The resulting adhesive mixture has a paste-like consistency that is easily applied and cured at ambient temperature. The shear strength of the cured adhesive is about 4000 psi at ambient temperature and about 2000 psi at 250 degrees Fahrenheit.

Abstract: An epoxy resin composition for semiconductor sealing which comprises, as essential components,(A) an epoxy resin comprising 50-100% by weight, based on total epoxy resin amount, of a polyfunctional epoxy resin represented by the formula (I) ##STR1## wherein n and m are each an integer of 0 or more, n+m=1-10, and R.sub.1, R.sub.2 and R.sub.3 which may be the same or different, are each selected from hydrogen atom, an alkyl group and a halogen atom, with the proviso that all of R.sub.1, R.sub.2 and R.sub.3 must not be hydrogen atom simultaneously,(B) a phenolic resin curing agent,(C) a silica filler, and(D) a curing accelerator.

Abstract: The process of reacting an epoxy resin with a reactive hydrogen-containing compound or a carboxylic acid anhydride in the presence of a phosphonium catalyst is improved by employing a phosphonium compound having an amino substituent on the cation portion of the phosphonium compound as the catalyst. The invention also concerns precatalyzed epoxy resin compositions, curable compositions and cured compositions.

Abstract: A non-fluorinated epoxy prepolymer of known type is mixed with a fluorinated epoxy prepolymer containing perfluoropolyether blocks or perfluoroalkylene blocks of type --(CF.sub.2 CF.sub.2).sub.n -- and/or of type ##STR1## and the two prepolymers are co-cured by treating the mixture with cross-linking agents of known type suitable for epoxy resins, thereby obtaining a cross-linked epoxy resin having a fluorine content.ltoreq.30% by weight, preferably.ltoreq.25% by weight.

Abstract: Epoxide compounds and phenolic compounds are reacted in the presence of phosphonium compounds represented by the formula .crclbar.Z'R.sup.1 R.sup.2 R.sup.3 P.sym.-Z-P.sym.R.sup.1 R.sup.2 R.sup.3 Z'.crclbar. wherein each R.sup.1, R.sup.2 and R.sup.3 is independently an aromatic group or an inertly substituted aromatic group; Z is --(C(R.sup.4).sub.2).sub.a --; each R.sup.4 is independently hydrogen or a hydrocarbyl group containing from 1 to about 20 carbon atoms; Z' is any suitable anion and a has a value of at least 4.

Abstract: Curable compositions comprise:(A) an epoxide resin(B) as latent curing agent for (A), dicyandiamide or a polycarboxylic acid hydrazide, and(C) as cure accelerator dispersed as a powder in the composition, a Mannich base of a polymeric phenol.The compositions are particularly useful as adhesives and sealants.

Abstract: Anthraquinones of formula I ##STR1## wherein X is the group --CR.sup.2 R.sup.3 --, where R.sup.2 is H, --CH or C.sub.1 -C.sub.5 -alkyl and R.sup.3 is H or --CN, R.sup.1 is H or C.sub.1 -C.sub.5 -alkyl and R is a direct bond or linear or branched C.sub.1 -C.sub.18 -alkylene which, alone or together with the --CR.sup.2 R.sup.3 -- group, can be interrupted by one or more --O-- when R.sup.2 and/or R.sup.3 are not --CN, and curable compositions comprising (a) an epoxy resin, (b) a hardener if necessary, (c) an anthraquinone of formula I and (d) an amino alcohol. The cured compositions are photosensitive and are suitable for the preparation of coatings and metallic images by electroless metal deposition.

Abstract: An epoxy resin composition which is adapted for use as an encapsulator of electronic or electric parts and which comprises an epoxy resin and a curing agent for the epoxy resin. A modified polymer obtained by reaction between an aromatic polymer and a fluorine-containing material is added to the epoxy resin, so that good characteristic properties are imparted to the resultant cured product.

Abstract: An epoxy resin composition comprising an epoxy resin and a polyfluoroalkyl group-containing polymer uniformly dispersed therein, said polymer having been formed by polymerizing a polyfluoroalkyl group-containing polymerizable compound in said epoxy resin.

Abstract: This invention relates to a new composition and process that affords "total stain protection" finishing of polyamide products, i.e., carpet. This composition of non-ionic fluorocarbon and sulfomethylated phenolformaldehyde condensates provides protection against oil and waterborne soils and in addition, protects the treated substrate against food colors by means of a one-step application.

Abstract: A curable composition for a fiber-reinforced resin, comprises (A) 60-90 weight % of an epoxy-containing (meth)acrylate resin which contains an epoxy group and an unsaturated-monobasic acid ester group in its molecules and which is formed by the reaction of an epoxy resin containing at least two epoxy groups per molecule and having an epoxy equivalent of 100-1000 with an unsaturated-monobasic acid in an amount such that there are 0.2-0.7 equivalents of carboxyl groups per 1 equivalent of epoxy groups, (B) 40-10 weight % of a radical polymerizable monomer, (C) an organic peroxide, (D) a curing agent for the epoxy resin, and (E) one or more reinforcing materials selected from continuous fiber and fiber cloth.

Abstract: A process for producing self-crosslinking cationic paint binders, water-dilutable upon protonation, on the basis of urea group carrying reaction products of modified phenols and epoxy resins as well as with the binders produced according to the process and their use in stoving paints, particularly in electrodeposition paints is described. The process is characterized in that either an aminoalkylation product of a phenol and a semi-blocked diisocyanate carrying an average of at least one secondary amino group, or a substituted urea prepared from a semi-blocked diisocyanate and an amine, which is further reacted with formaldehyde and a phenol, are reacted with an epoxy compound. The paints formulated with these products, at stoving temperatures of from 150.degree. to 170.degree. C., give films with excellent corrosion resistance and adhesion.

Abstract: Modified advanced epoxy resins are prepared by reacting (A) and advanced epoxy resin prepared by reacting (1) an epoxy resin having at least one aromatic ring, an average of more than one, but not more than abotu 2 vicinal epoxy groups per molecule and which contains at least one oxyalkylene or substituted oxyalkylene group per molecule; with (2) a dihydric phenol; with (B) a monoamine.

Abstract: Modified advanced epoxy resins are prepared by reacting (A) an advanced epoxy resin prepared by reacting (1) an epoxy resin having at least one aromatic ring, an average of more than one, but not more than about 2 vicinal epoxy groups per molecule and which contains at least one oxyalkylene or substituted oxyalkylene group per molecule; with (2) a dihydric phenol; with (B) a phosphorus-containing compound.

Abstract: A curable composition is provided comprising a bismaleimide resin, an epoxy resin, and a phenolic resin curing agent. The composition can also contain an accelerator for enhanced low-temperature cure. The composition is useful for high-performance applications such as electrical lamination and filament-wound parts.

Abstract: Disclosed is a coating composition for metals containing (A) a modified bisphenol type epoxy resin and (b) a phenol resin and/or an amino resin, which composition has excellent properties in fabricating properties, corrosion resistance, etc. and is suitably applicable to both inner and outer surfaces of the vessels for use in food and drink.

Abstract: Disclosed is a process for the preparation of water-thinnable, hydrolytically stable, thermosettable, cationic coating compositions, with process comprises blending:(1) 5-35 weight percent of a carboxylated crosslinking compound, and(2) 65-95 weight percent of an amino group-containing resin binder, which binder comprises the reaction product of ammonia and a blend of(a) a polyglycidyl ether having n epoxy groups per molecule, wherein 1<n<1.9, said polyglycidyl ether being the reaction product of a multifunctional polyglycidyl ether having x epoxy groups per molecule, wherein x>2, and (x-n) mol of a monofunctional phenol per mole of the multifunctional polyglycidyl ether, and(b) a diglycidyl ether having an epoxy group concentration in the range of from 1000 to 5500 mmol/kg,the average molar epoxy functionality of the glycidyl ethers, present in the blend of polyglycidyl ether and digylcidyl ethers, being <1.75.and wherein (1) and (2) are blended before or after neutralization of (2).