Abstract: A flame retardant resin composition comprising (A) a silicone resin, (B) a triazine-modified phenol novolak compound, and (C) a filler can be formed in film form. The resin film possesses satisfactory covering or encapsulating performance to large size/thin wafers.

Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.

Abstract: This invention relates to a novel phosphorus-containing phenol novolac resin, use of the phosphorus-containing phenol novolac resin as a halogen-free flame retardant epoxy hardener, and an epoxy resin composition having high phosphorus content because it includes the phosphorus-containing phenol novolac resin, thereby exhibiting superior flame retardancy and heat resistance.

Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.

Abstract: A low dielectric resin varnish composition for laminated printed circuit boards, wherein the resin composition includes (A) Dicyclo-pentadiene-Phenolic Novolac resin (abbreviated as DCPD-PN); or (B) at least one kind of dicyclopentadiene Phenolic Novolac Epoxy resins(DCPD-PNE, referred to as Resin 1); or (C) a novel Dicyclopentadiene-Dihydrobenzoxazine resin (DCPD-BX, referred to as Resin 2); and (D) Flame retardant agent, curing agent and accelerating agent solutions.

Abstract: A heat curable epoxy composition comprising the contact product of an epoxy resin, an epoxy curing agent and an accelerator for the epoxy curing agent, the curing agent or the accelerator comprising the reaction product of (a) a phenolic resin (a) of general formula: Where R1, R2, R3, R4 are each independently of one another a hydrogen or unbranched or branched alky group having 1 to 17 carbon atoms, and n is an integer form 0 to 50; and (b) a modified amine compound which is the reaction product of an epoxy resin and a methylated polyalkylenepolyamine having one primary or secondary amine and at least two tertiary amines of the general formula: Where R1, R2, R3, R4 and R5 represent hydrogen, methyl or ethyl; n and m independently are integers from 1 to 10 and; X is an integer from 1 to 10.

Abstract: A composition is disclosed, which comprises a hydroxyaromatic-aldehyde resole resin comprising an aldehyde and a hydroxyaromatic compound, modified with a urea-aldehyde condensate. The hydroxyaromatic-aldehyde resole resin is prepared without ammonia or a primary amine and the composition does not contain a triazone or a substituted triazone compound. The composition has improved premix stability, improved cure efficiency, comparable tensile strength, and lower volatiles than the hydroxyaromatic-aldehyde resole resin unmodified with a urea-aldehyde condensate. Also disclosed are articles prepared therefrom.

Abstract: There is provided a method for obtaining an aqueous solution of an alkali metal salt of an aromatic dihydroxy compound by decomposing a waste aromatic polycarbonate by an alkali metal hydroxide aqueous solution. The method comprises (1) a dissolution step of dissolving a waste aromatic polycarbonate in a chlorinated hydrocarbon solvent, (2) a decomposition step of adding an alkali metal hydroxide aqueous solution to this solution to decompose the aromatic polycarbonate, (3) a re-dissolution step of adding water to this decomposed solution to dissolve a solid, (4) a two phase formation step of leaving the treated solution obtained in the step (3) to stand to form an organic solvent phase (organic phase) and an aqueous solution phase (aqueous phase), and (5) a separation/collection step of separating the aqueous phase from the organic solvent phase and collecting the aqueous phase.

Abstract: The present invention relates to an epoxy resin varnish composition with high glass transition temperature for laminate plate, wherein the resin composition comprises: (A) a new dihydrobenzoxazine thermosetting resin obtained by reacting compounds: (a) phenolic products from reaction of di- or multifunctional epoxy resin and di-functional phenolic compounds; (b) mono- or di-functional primary amines; (c) di-functional phenols; and (d) formaldehyde or paraformaldehyde, (B) one or more epoxy resins, (C) novolac resin curing agents, and (D) curing promoters. For the epoxy resin varnish composition, crosslinking density of resin is increased due to using modified dihydrobenzoxazine thermosetting resin with multiple functional groups, so that mechanical strength and heat resistance of the obtained substrate are remarkably improved, and solubility problem of dihydrobenzoxazine in solvent is solved to greatly elevate production efficiency.

Abstract: A flexibilized resorcinolic novolak resin is prepared by reacting a phenolic compound, such as resorcinol, with an unsaturated dihydroxy, an unsaturated aldehyde, an aliphatic dialdehyde, or a mixture thereof. An aldehyde (different from the unsaturated aldehyde and the aliphatic dialdehyde) is either simultaneously or subsequently added to the reaction mixture. The flexibilized resorcinolic novolak resin can be used in an adhesive composition for enhancing the adhesion between tire cords and rubber for tire applications.

Abstract: A composition is disclosed, which comprises a hydroxyaromatic-aldehyde resole resin comprising an aldehyde and a hydroxyaromatic compound, modified with a urea-aldehyde condensate. The composition has improved premix stability, improved cure efficiency, comparable tensile strength, and lower volatiles than the hydroxyaromatic-aldehyde resole resin unmodified with a urea-aldehyde condensate. Also disclosed are articles prepared therefrom.

Abstract: This invention relates to epoxy resins containing indole as structural unit, indole resins and resin compositions containing said epoxy resins and indole resins useful for applications such as laminating, molding, casting and adhesion on account of their excellent fire retardance, adhesiveness, moisture resistance and heat resistance. The indole resins of this invention and the epoxy resins obtained therefrom are represented by the following general formulas I and II wherein R1 is H, alkyl or the like, X is a crosslinking group represented by —C(R2R3)— or C(R4R5)—Ar—C(R4R5)— (wherein R2-R5 are H, alkyl or the like and Ar is a benzene or biphenyl ring), G is glycidyl group and n is an integer of 1-20.

Abstract: A flexibilized resorcinolic novolak resin is prepared by reacting a phenolic compound, such as resorcinol, with an unsaturated dihydroxy, an unsaturated aldehyde, an aliphatic dialdehyde, or a mixture thereof. An aldehyde (different from the unsaturated aldehyde and the aliphatic dialdehyde) is either simultaneously or subsequently added to the reaction mixture. The flexibilized resorcinolic novolak resin can be used in an adhesive composition for enhancing the adhesion between tire cords and rubber for tire applications.

Abstract: The present invention relates to a method of gluing wood based materials by providing an adhesive system onto wood based materials followed by curing, the adhesive system comprises a urea based amino resin and a hardener composition, wherein the hardener composition comprises an acid and a phenolic resin. The invention also relates to an adhesive system and a hardener composition as well as wood based products obtained by the method or through the use of the adhesive system.

Abstract: An inter-laminar adhesive composition containing: (A) a liquid epoxy resin; (B) a polyfunctional epoxy resin having a softening point higher than a lamination temperature of the adhesive and with two or more epoxy groups within the molecule; and (C) a latent epoxy curing agent initiating a reaction at a temperature higher than the lamination temperature; wherein the adhesive composition optionally contains a liquid resin other than component (A) and/or an organic solvent and wherein the liquid resin including component (A), the organic solvent or both constitute from 10 to 55% by weight of the composition, and the use of this interlaminar adhesive composition to prepare a multilayer printed wiring board, and the process for preparing the multilayer printed wiring board are provided.

Abstract: An epoxy resin composition for printed wiring boards which comprises as the essential components (a) an epoxy resin obtained by epoxidizing a condensation product of a phenol with hydroxybenzaldehyde, (b) a condensation product of bisphenol A with formaldehyde, (c) a flame retardant, and (d) a curing accelerator, and a laminate for printed wiring boards which has a low hygroscopicity, a high heat resistance, good high-temperature characteristics, a high resistance against electrolytic corrosion, a high resistance against color change due to heating, and a high Tg.

Abstract: An epoxy resin composition contains (A) an epoxy resin, (B) a phenolic resin curing agent, (C) a curing catalyst, and (D) an inorganic filler. The catalyst is a quaternary phosphorus compound or a quaternary phosphorus compound which has been mixed and reacted with a phenolic resin having at least two hydroxyl groups. The composition is effectively flowable, moldable and curable and thus suitable for semiconductor encapsulation.

Abstract: A flame retardant epoxy resin composition which can improve heat resistance and exhibit an excellent adhesion strength and insulation reliability when applied to a printed circuit board or to a multilayered interconnection laminate is provided, and a prepreg and a metal foil clad laminate using the same composition are manufactured. This flame retardant epoxy resin composition consists of: (a) an epoxy resin containing a glicidylether compound which is a condensate of bisphenol A or bisphenol F with formaldehyde; (b) a condensate of bisphenol A with formaldehyde; (c) haloganated bisphenol A as a flame retardant agent; and (d) a hardening accelerator, wherein the haloganated bisphenol A is contained in 45 weight % or less of a total solid resin weight. A metal foil clad laminate is provided using this composition as a varnish, impregnating the same into a base material to obtain the prepreg, laminating the prepreg, depositing a metal foil on one or both surfaces thereof, and heating under pressure.

Abstract: An epoxy resin composition comprising an epoxy resin of a specific structure, a phenolic resin of a specific structure, and an inorganic filler is suited for semiconductor encapsulation since it is effectively moldable and cures into products having improved flame retardance, reflow crack resistance and dielectric properties.

Abstract: An epoxy resin composition comprising a crystalline epoxy resin, a phenolic resin, and an inorganic filler is improved in moldability by previously reacting phenolic hydroxyl groups on the phenolic resin with epoxy groups on the crystalline epoxy resin to form a reaction product and blending the reaction product in the composition. The composition is moldable over semiconductor devices without voids and wire flow. The encapsulated semiconductor devices thus remain reliable.

Abstract: Disclosed is a phenol resin composition containing a specific triazines-modified novolak phenol resin comprising phenols, triazines and aldehydes, and a method for producing the triazines-modified novolak phenol resin comprising the steps of as a first step reaction, successively effecting processes (i), (ii) and (iii), wherein said process (i) is a process for adjusting a pH of a system of a mixture of phenols, triazines and aldehydes in a range of 5 to 10, said process (ii) is a process for reacting said mixture under the condition that the aldehydes are not volatilized and said process (iii) is a process for removing a reaction water in the system; then as a second step reaction, successively effecting said processes (ii) and (iii) at a higher temperature than that of the first step reaction; thereafter as a third step reaction, successively effecting said processes (ii) and (iii) at a higher temperature than that of the second step reaction; and further, depending upon a necessity, repeating the second st

Abstract: A binder solution of a phenolic novolak resin in solvent, preferably furfuryl alcohol containing at least one chemical agent such as amines containing one to five, preferably two to four, nitrogen atoms, glycerine or mixtures thereof. Preferably, the binder solution contains about 0.2 to about 1.5 weight percent water. The binder solution is for binding refractory objects, preferably those containing doloma (calcined dolomite) aggregate. Methods of mixing these ingredients and using the mixture are also disclosed. Bricks made from the doloma aggregate mixed with the binder solution show good ambient temperature green strength and enhanced modulus of rupture after curing and coking.

Abstract: There is disclosed a conductive adhesive comprising(A) conductive particles having a surface of at least one of nickel and nickel-boron alloy, and the surface of which has been subjected to surface treatment with a mixture of a polyoxyalkylene phosphate compound and a polyoxyalkylenealkyl or polyoxyalkylenealkenyl amine or a derivative thereof;(B) an epoxy compound which contains a diglycidyl epoxy compound used as a reactive diluent in an amount of 20 to 70 weight % based on the total amount of the epoxy compound; and(C) a phenolic resin hardener which contains at least one of an alkyl resol phenolic resin and alkyl novolak phenolic resin in an amount of 50% by weight or more based on the total amount of the phenolic resin hardener.

Abstract: Novel polymers of general formula: ##STR1## wherein where n is a whole number from 2 to 10; R is a spacing group comprising (a) at least one of m methylene units where m is a whole number from 1 to 20, m' methine units where m' is a whole number from 0 to 20, a mixture of m methylene units and m' methine units where m+m'.ltoreq.20, and units of formula --(CH.sub.2 -CHX-O).sub.m" --, where m" is a whole number from 0 to 200 and X is H, CH.sub.3 or C.sub.2 H.sub.5, or (b) an aromatic ring having one, two or three members; R' is H, an alkyl group having no more than 20 carbon atoms, an aryl group having no more than three rings, or a combination thereof; R" is a group containing at least two active hydrogen atoms and having at least two but no more than 20 carbon atoms; and R'" is a group containing at least two active hydrogen atoms and is selected from the group consisting of alkyl, aryl and mixed alkyl-aryl species having from 1 to 200 carbon atoms; polyalkylene oxides; and urea formaldehyde resin.

Abstract: A two-part adhesive is provided wherein the first part comprises a stable aqueous alkaline monohydroxylic phenolic resole resin solution containing a methylene donor such as oxazolidine or a methylolurea and the second part comprises a stable resorcinolic resin precondensate having a shortage of formaldehyde and optionally containing a catalyst such as an ester functional compound for the resole resin. The resin in each part exhibits viscosity stability of an unmodified resin until mixed with the other part wherein the methylene donor, of the first part catalyzes the resorcinolic resin of the second part and the catalyst, when used, of the second part catalyzes the monohydroxylic phenolic resole resin of the first part. The adhesive finds utility in the production of structural lignocellulosic panels.

Abstract: Cyclic acetal derivative of a resole includes the reaction product of an ortho resole compound with a carbonyl compound or a carbonyl compound derivative. The cyclic acetal derivatives of phenolic resole compounds exhibit enhanced storage stability and can be readily activated at elevated temperatures to prepare phenolic based adhesives and coatings.

Abstract: Cyclic acetal derivative of a resole includes the reaction product of an ortho resole compound with a carbonyl compound or a carbonyl compound derivative. The cyclic acetal derivatives of phenolic resole compounds exhibit enhanced storage stability and can be readily activated at elevated temperatures to prepare phenolic based adhesives and coatings.

Abstract: The present invention provides novel thermoset copolymers, and methods for preparing same, having both the strength and the thermo-oxidative stability required for high performance, high temperature applications. The copolymers comprise (a) a thermoplastic resin having unreacted phenolic OH groups, and (b) bis-oxazoline monomers which have been modified to have at least one substituent on the oxazoline ring selected from the group consisting of a methyl group, a group having at least a substituent capable of undergoing addition polymerization, and a cyclic group capable of undergoing ring opening polymerization.

Abstract: A modified liquid epoxy resin composition is provided by reacting a crystalline epoxy resin, from about 3 to about 20 parts by weight, based on the epoxy resin, of a compound having two or more phenolic hydroxyl groups and/or carboxyl groups in one molecule and from about 3 to about 20 parts by weight of a compound having one phenolic hydroxyl group or carboxyl group in one molecule. The crystalline epoxy resin is preferably selected from various glycidylethers of biphenol compounds. The modified liquid epoxy resin composition has a low viscosity and good liquid stability at low temperatures, resulting in cured resins having excellent heat resistance and water resistance.

Abstract: A phenolic resin composition comprises a mixture of 100 parts by weight of a phenol aralkyl resin and 5 to 60 parts by weight of a novolak type phenolic resin having a content of binuclear components of not more than 10% by area, and a content of trinuclear components of not less than 50% by area and a sum content of tri- and tetra-nuclear components of 75% by area based on the total novolak phenolic resin except for the binuclear components, and an epoxy-cured product obtained by curing an epoxy resin while using the phenolic resin composition as set forth in claim 1 as a curing agent. The phenolic resin composition has a low viscosity and, when it is used as a curing agent for epoxy resins, the resulting epoxy-cured product has a low water absorption rate, is excellent in resistance to moisture and has a high glass transition temperature as compared with the cured product obtained using a novolak type phenolic resin as a curing agent.

Abstract: An epoxy resin composition having high epoxy curing property and sufficient storage stability, and an epoxy curing agent therefor. The curing agent or the cure accelerating agent obtained by treating the surfaces of (1) an epoxy adduct obtained by adding a nitrogen-containing heterocyclic compound, an aliphatic amine or an aromatic amine to an epoxy compound having one, two or more epoxy groups in one molecule, with (2) a boric acid compound or (3) a boric acid compound and a phenolic compound, exhibits high curing property and storage stability, and can be favorably used as a curing agent for the epoxy resin composition. The epoxy resin composition prepared by mixing the epoxy resin with (1) and (2) or (1) and (3), exhibits excellent curing property and storage stability.

Abstract: This invention relates to a process for the preparation of self-crosslinking cationic paint binders which can be diluted with water after protonation and are based on modified aminoalkylation products of phenols; to the binders prepared by this process and to their use for formulating water-dilutable paints, in particular electrodeposition paints which can be deposited cathodically. The process is characterized in that an aminoalkylation product of a phenol containing at least one secondary amino group is reacted with epoxide compounds, and after temperature treatment, the reaction product is reacted with partly blocked isocyanate compounds. The process permits the use of blocking agents which allow stoving temperatures in the range of 130 to 150.degree. C.

Abstract: A binder mixture containing lignin or lignins with reactive groups and phenol-novolac in a weight ratio of 95:5 to 50:50 useful for the production of non-woven fabrics and wood fiber materials.

Abstract: Polymer modified adducts are prepared by (A) reacting (1) an epoxy resin having an average of more than one vicinal epoxide group with (2) a compound containing an average of two or more hydrogen atoms reactive with an epoxide group; and (B) partially vinylizing reacting the product from step (A); and (C) polymerizing the partially vinylized product from step (B) with (3) a polymerizable ethylenically unsaturated monomer; with the proviso that at least one of the components (1), (2) or (3) contain one or more mesogenic or rodlike moieties. These adducts are useful as epoxy resin curing agents.

Abstract: Compositions containing an aryl phosphite and water to hydrolyze the aryl phosphite provide controlled and extended work time when used as hardening agents for the ambient temperature hardening of phenolic resins and for rapid hardening of such resins at modestly elevated temperatures. Pre-solvolysis with small quantities of water, alkanols of 1 to 4 carbon atoms or alkylene glycols of 2 to 4 carbon atoms improve compatibility of trisubstituted phosphites with the resin. Pre-hydrolysis of the phosphites as well as addition of furfuryl alcohol or alkylene glycols of 2 to 4 carbon atoms accelerate the hardening (curing) of the resin. Various compounds such as: carboxylic acid amides, urea, dicyandiamide, N-methylolated amides, N-alkyl 2-pyrrolidinones having 1 to 4 carbon atoms in the alkyl group, those having an internal epoxide group, alkanols, and Schiff bases retard the ambient temperature hardening of the resin with the aryl phosphite hardening agents.

Abstract: A resin composition for fiber reinforced plastic comprising the following components A, B, C, D and E as essential components:A: a bisphenol A epoxy resin having an epoxy equivalent of at most 250 and being liquid at room temperature,B: a bisphenol A epoxy resin having an epoxy equivalent within a range of from 400 to 5,000 and softening point of from 60.degree. to 200.degree. C.,C: a phenol novolak type epoxy resin,D: a nitrile rubber, andE: a curing agent.

Abstract: A binding agent for molding compositions and molded bodies produced by reacting a low molecular weight lignin from the Organosolv process with phenol in a weight ratio of 1:20 to 3:1 at 100.degree. to 180.degree. C., adjusting the pH to an acidic value and condensing the mixture with 0.2 to 0.9 moles of formaldehyde per mole of phenol at 60.degree. to 120.degree. C. to form the binding agent useful for producing curable molding compositions, high-temperature molding compositions, refractory products, textile fleeces and friction coatings as well as carbon materials.

Abstract: A rodlike mesogenic moiety-containing polythiirane resin is blended with an epoxy resin and when cured with a curing agent is useable in molding applications.

Abstract: A rodlike mesogenic moiety-containing polythiirane resin is blended with an epoxy resin, is curable with a curing agent and can be employed in molding applications.

Abstract: An hydrolytically stable, heat-curable composition useful as an hermetic varnish for electrical conductors comprising an aqueous solution with or without organic co-solvents of:1) an adduct of an epoxide of a phenol-formaldehyde condensate and a dialkanolamine, and2) a water-soluble curing agent comprising both a phenoplast alcohol and an aminoplast such as a melamine for example, hexamethoxymethylmelamine;the cured products thereof which are useful as hermetic varnishes for electrical conductors. i.e. varnishes exposed to refrigerants such as fluorocarbons.

Abstract: A resin composition, comprisng a glycidyl ether of a hydrogenated conjugated diene polymer, an epoxy resin, and a reaction product of a phenolic compound with formaldehyde, having improved flexibility and thermal stability and useful for sealing a semiconductor device, whereby thermal stress can be effectively reduced.

Abstract: A curable composition for a fiber-reinforced resin, comprises (A) 60-90 weight % of an epoxy-containing (meth)acrylate resin which contains an epoxy group and an unsaturated-monobasic acid ester group in its molecules and which is formed by the reaction of an epoxy resin containing at least two epoxy groups per molecule and having an epoxy equivalent of 100-1000 with an unsaturated-monobasic acid in an amount such that there are 0.2-0.7 equivalents of carboxyl groups per 1 equivalent of epoxy groups, (B) 40-10 weight % of a radical polymerizable monomer, (C) an organic peroxide, (D) a curing agent for the epoxy resin, and (E) one or more reinforcing materials selected from continuous fiber and fiber cloth.

Abstract: The invention discloses a high solids wire enamel having a surprisingly low viscosity. The enamel comprises a mixture of high molecular weight and low molecular weight linear hydroxy polyethers, a phenolic resin, an isocyanate and possibly a melamine. The resulting enamel has excellent flexibility and resistance to crazing.

Abstract: An epoxy resin composition comprising a trifunctional epoxy resin derived from a trisphenol having the structure represented by the following general formula ##STR1## wherein R represents a hydrogen atom, an alkyl group or a halogen atom, and a novolak-type phenolic resin. This epoxy resin composition gives a cured product having excellent pliability and a high glass transition temperature. It is especially useful as a semiconductor encapsulating material.

Abstract: Self-crosslinking paint binders, particularly for the formulation of water-dilutable, cathodically depositable paints (CED-paints), are obtained through reaction of formaldehyde with the reaction product of aminoalkylation products of phenols carrying at least one NH-group and semi-blocked diisocyanates and their subsequent reaction with epoxy compounds. The binders, when cathodically deposited, cure rapidly at low stoving temperatures to provide hard, solvent-resistant coatings.

Abstract: A non-woven textiles comprising a web of organic fibers bonded together by a binder applied to the fibers as a powdered mixture of a non-heat reactive phenolic resin and at least one thermoreactive condensation resin selected from the group consisting of phenolic resins, epoxy resins and amino resins and then fused and a method of producing said textiles.

Abstract: Self-crosslinking paint binders, particularly for the formulation of water-dilutable, cathodically depositable paints (CED-paints), are obtained through reaction of formaldehyde with the reaction product of aminoalkylation products of phenols carrying at least one NH-group and semi-blocked diisocyanates and their subsequent reaction with epoxy compounds. The binders, when cathodically deposited, cure rapidly at low stoving temperatures to provide hard, solvent-resistant coatings.

Abstract: A polyfunctional reaction product having functional phenolic OH groups is made available by reacting a phenol and an alkoxylated amino-aldehyde condensation product in the presence of a solvent and of an acid catalyst. This method makes it possible to prepare a polyfunctional phenolic reaction product which is soluble in organic solvents at a low ratio of phenolic OH groups to alkoxy groups without gelling. The reaction product is particularly useful as a curing agent for epoxy resins.

Abstract: A resinous composition for friction materials, especially for non-asbestos type friction materials is disclosed. The composition is composed of a phenolic resin modified by the reaction product of an acrylonitrile-butadiene liquid rubber with an epoxy resin, and further modification with a triazine resin. This composition when blended with non-asbestos fibers, such as fiberglass, etc., retains the flexibility desired, provides excellent friction characteristics and a reduced wear rate.

Abstract: This invention provides compositions which are curable to hydrophilic, water-absorbing silicone-organic copolymer elastomers via free radical polymerization such as by the use of free radical precursors, UV or electron beam. The compositions are mixtures of (A) from 50 to 95 parts by weight of block copolymers containing polydiorganosiloxane segments and polyalkyleneoxy segments which block copolymers contain terminal aliphatically unsaturated groups such as those derived from the reaction of isocyanoethyl methacrylate with terminal free hydroxyl groups present on the polyalkyleneoxy segments and (B) from 5 to 50 parts by weight of at least one substantially water insoluble aliphatically unsaturated organic monomer which is compatible with (A) such as methyl methacrylate. The cured elastomers, some of which are optically clear, are useful as membranes for gas or fluid separations or for the controlled release of bioactive agents such as insecticides or herbicides.