Abstract: A container assembly includes a flexible bag having an interior surface bounding a chamber and an opposing exterior surface. The bag has a bottom end wall that includes a first sparger and a second sparger. The first sparger and the second sparger each have a flexible first sheet overlying a flexible second sheet, the first sheet and the second sheet being secured together so as to form a sparging area bounded between the first sheet and the second sheet, at least a portion of the first sheet overlying the sparging area being gas permeable so that gas can pass from the sparging area, through the first sheet, and into the chamber.
Type:
Grant
Filed:
November 19, 2020
Date of Patent:
October 29, 2024
Assignee:
LIFE TECHNOLOGIES CORPORATION
Inventors:
Michael E. Goodwin, Nephi D. Jones, Derik R. West
Abstract: It is aimed to provide a polyarylene sulfide film for an acoustic instrument vibrating plate excellent in heat resistance, molding processability, acoustic properties, and also heat moldability. Provided is a polyarylene sulfide film wherein the elongation at break in either a longitudinal direction or a width direction of the film is 100% or more and 250% or less, and the Young's modulus in either a longitudinal direction or a width direction of the film is 1.5 GPa or more and less than 4 GPa.
Abstract: A composition for forming a crystalline thermoplastic (such as polyacetal) composition for improving compatibility using a ternary blend that includes a mineral filler and elastomer material and an article made therefrom. The mineral filler may be coated or uncoated.
Type:
Grant
Filed:
September 11, 2003
Date of Patent:
August 30, 2005
Assignee:
E. I. du Pont de Nemours and Company
Inventors:
Edmund Arthur Flexman, Mark Gary Weinberg
Abstract: A curable resin composition comprises a compound containing a primary hydroxyl group and a compound containing a ketone group, in which the compound containing the ketone group is a compound in which at least one of the carbon atoms adjacent to the carbonyl carbon bonds to a hydrogen atom, and the curable resin composition can give a cured product having a high crosslink density by means of a dehydrating reaction between the primary hydroxyl group and the ketone group and the subsequent crosslinking of a vinyl bond formed by the dehydrating reaction.
Abstract: A method for preparing wood laminates from a plurality of wood veneers using as the adhesive a combination of a phenolaldehyde resin with a low molecular weight acetone-formaldehyde resin as a cure rate accelerator.
Abstract: Webs composed of inorganic or organic fiber material are bonded with a cured resin mixture consisting essentially of(A) from 5 to 80% by weight of a water-soluble condensation product of carbonyl number 0-200 which has been prepared by alkaline condensation from 0.1 to 0.4 mole of an aliphatic or cycloaliphatic condensable ketone and 1 mole of formaldehyde, and(B) from 20 to 95% by weight of a water-soluble amino and/or phenolic resin.
Type:
Grant
Filed:
February 22, 1988
Date of Patent:
September 19, 1989
Assignee:
BASF Aktiengesellschaft
Inventors:
Fritz E. Kempter, Franz Matejcek, Werner Neubach, Gerd Busse
Abstract: The resins resulting from converting the phenol-formaldehyde type condensation products of dicyclopentadiene-phenol adducts with selected aldehydes and ketones to their corresponding vinylbenzyl ethers are an excellent matrix in which to embed fibers to produce a composite. Such resins, especially as a blend of materials with varying molecular weight distribution, are amorphous materials whose glass transition temperature is well under the curing temperature, and whose solubility permits solutions with high solids content so as to afford coatings with high resin content. The extensively crosslinked polymer resulting from thermal, photochemical, or free radical initiated polymerization has excellent thermal and electrical properties for use in multilayer circuit boards.
Abstract: A composition containing an epoxy polymer, 4,4'(2-acetoxy-1,3 glyceryl)bis anhydro trimellitate; a polyanhydride; and a solid filler; method of preparation, and the sealing of integrated circuit modules therewith are provided.
Type:
Grant
Filed:
November 28, 1980
Date of Patent:
October 18, 1983
Assignee:
International Business Machines Corporation
Abstract: A granular thermosetting composition free from a tendency to release dust and transformable into molded articles free from surface defects, is obtained by forming the composition into granules of from 2 to 8 mm in size and mixing said granules with from 0.5 to 3 wt.% of one or more substances, in liquid form, chosen from acetone, phenol, aniline and reaction products of phenol with styrene.
Type:
Grant
Filed:
December 7, 1976
Date of Patent:
October 2, 1979
Assignee:
Societa' Italiana Resine S.I.R. S.p.A.
Inventors:
Silvio Vargiu, Pier L. Manzoni, Mario Bernasconi, Antonio Parodi