Mixed With Additional Aldehyde Or Aldehyde-type Reactants Which Are Part Of A Spfi System Or Polymer Thereof Patents (Class 525/491)
  • Patent number: 9359464
    Abstract: The present invention relates to water-dispersible core-shell microcapsules essentially free of formaldehyde. In particular it concerns oligomeric compositions comprising, and the microcapsules obtained from, particular reaction product between a polyamine component and a particular mixture of glyoxal and a C4-6 2,2-dialkoxy-ethanal. The present invention comprises also the invention's core-shell microcapsules as part of a perfuming composition or of a perfuming consumer product.
    Type: Grant
    Filed: July 30, 2014
    Date of Patent: June 7, 2016
    Assignee: Firmenich SA
    Inventors: Damien Berthier, Géraldine Leon, Nicolas Paret
  • Patent number: 8623585
    Abstract: Provided is a positive photoresist composition containing, as an essential component, a novolac phenolic resin (C) prepared by condensing an aromatic compound (A) represented by general formula (1) or (2) with an aliphatic aldehyde (B). This positive photoresist composition has high sensitivity and high heat resistance at the same time, and is suitable for use as a positive photoresist in, for example, the manufacture of semiconductor devices such as ICs and LSIs, the manufacture of displays such as LCDs, and the manufacture of printing plates. (In the formulas, R1, R2, and R3 are each independently an alkyl group having 1 to 8 carbon atoms; m, n, and p are each independently an integer of 0 to 4; q is an integer of 1 to (5?p); and s is an integer of 1 to (9?p).
    Type: Grant
    Filed: October 25, 2011
    Date of Patent: January 7, 2014
    Assignee: DIC Corporation
    Inventors: Tomoyuki Imada, Takakazu Kage, Norifumi Imaizumi
  • Publication number: 20130266731
    Abstract: Methods for making and using phenol/formaldehyde/furfural-based resins and furfural alcohol-based resins and are provided. The method for making a phenol/formaldehyde/furfural-based resin can include combining a phenol/formaldehyde-based resin with furfural to produce a phenol/formaldehyde/furfural-based resin. The phenol/formaldehyde/furfural-based resin can have a viscosity of about 1 cP to about 1,000 cP at a temperature of about 25° C.
    Type: Application
    Filed: April 10, 2013
    Publication date: October 10, 2013
    Applicant: Georgia-Pacific Chemicals LLC
    Inventors: Kim Tutin, Benjamin D. Gapud
  • Publication number: 20130116386
    Abstract: The present invention relates to methods for the production of a resin such as a thermosetting resin, particularly a bioresin, components for use in the methods, and products obtained from the methods. In one aspect the method of forming a resin comprising the steps of: (1) providing an aldehyde-cross-linking agent condensate obtained by reacting a volatile aldehyde with a cross-linking agent; (2) providing a non-volatile aldehyde; and (3) combining the aldehyde-cross-linking agent condensate and the non-volatile aldehyde, thereby forming the resin.
    Type: Application
    Filed: December 10, 2010
    Publication date: May 9, 2013
    Applicant: CAMBRIDGE BIOPOLYMERS LIMITED
    Inventors: Colin Fitchett, Colin Chappell
  • Patent number: 8101711
    Abstract: Disclosed is a method for modifying a polymer by carrying out a thermally-induced reaction in a mixing apparatus having a high shear environment and devolatilization capabilities. Also disclosed are the resulting materials.
    Type: Grant
    Filed: October 26, 2009
    Date of Patent: January 24, 2012
    Assignee: 3M Innovative Properties Company
    Inventors: James M. Nelson, Ryan F. Marx, Jeffrey J. Cernohous, James R. McNerney, Todd D. Jones, Kenneth J. Hanley
  • Patent number: 7829638
    Abstract: Hardmask compositions having antireflective properties useful in lithographic processes, methods of using the same, and semiconductor devices fabricated by such methods, are provided.
    Type: Grant
    Filed: February 6, 2006
    Date of Patent: November 9, 2010
    Assignee: Cheil Industries, Inc.
    Inventors: Dong Seon Uh, Chang Il Oh, Do Hyeon Kim, Jin Kuk Lee, Irina Nam
  • Patent number: 7655386
    Abstract: An antireflective hardmask composition includes an organic solvent, and at least one polymer represented by Formulae A, B or C: In Formulae A and B, the fluorene group is unsubstituted or substituted, in Formula C, the naphthalene group is unsubstituted or substituted, n is at least 1 and is less than about 750, m is at least 1, and m+n is less than about 750, G is an aromatic ring-containing group having an alkoxy group, and R1 is methylene or includes a non-fluorene-containing aryl linking group.
    Type: Grant
    Filed: December 20, 2007
    Date of Patent: February 2, 2010
    Assignee: Cheil Industries, Inc.
    Inventors: Kyung Hee Hyung, Jong Seob Kim, Dong Seon Uh, Chang Il Oh, Kyong Ho Yoon, Min Soo Kim, Jin Kuk Lee
  • Patent number: 7632916
    Abstract: Disclosed is a method for modifying a polymer by carrying out a thermally-induced reaction in a mixing apparatus having a high shear environment and devolatilization capabilities. Also disclosed are the resulting materials.
    Type: Grant
    Filed: August 2, 2002
    Date of Patent: December 15, 2009
    Assignee: 3M Innovative Properties Company
    Inventors: James M. Nelson, Ryan E. Marx, Jeffrey J. Cernohous, James R. McNerney, Todd D. Jones, Kenneth J. Hanley
  • Patent number: 7541410
    Abstract: A thermosetting resin composition comprising a novolac-type phenolic resin, a polyacetal resin and a cyclohexyl compound represented by the general formula (1) as a curing catalyst, a thermosetting resin molding compound comprising the thermosetting resin composition and a filler, and a cured product formed by curing the thermosetting resin composition or the thermosetting resin molding compound are provided. In the formula, R1 to R12 are defined in the claims and description.
    Type: Grant
    Filed: September 30, 2005
    Date of Patent: June 2, 2009
    Assignee: Sumitomo Bakelite Co., Ltd.
    Inventors: Masayasu Horie, Yukio Tokunaga, Shigeyoshi Furuhara
  • Patent number: 7381788
    Abstract: Provided is a continuous production method of a polyamide with stabilized polymerization degree and good quality, particularly an aromatic-containing polyamide.
    Type: Grant
    Filed: August 27, 2003
    Date of Patent: June 3, 2008
    Assignee: Toyo Boseki Kabushiki Kaisha
    Inventors: Yasuhito Tsujii, Gaku Maruyama, Kaoru Ogawa, Yoshinori Takada, Kazuhisa Koishi, Kenta Susuki
  • Patent number: 7226765
    Abstract: Processes for the extraction of PHAs from biomass, said processes comprising: combining the biomass containing the PHAs with a single main solvent to form a biomass liquor; heating the biomass liquor to at least partially solubilize the PHAs from the biomass to form a PHA liquor; separating the biomass from the PHA liquor to form a PHA-enriched liquor; evaporating from 0% to about 50% of the single main solvent from the PHA-enriched liquor to form a solvent vapor and a concentrated PHA-enriched liquor; and cooling the concentrated PHA-enriched liquor to form precipitated PHAs and an impure solvent liquor. Optionally, further recovering the precipitated PHAs from the impure solvent liquor by filtration under pressure. A PHA-enriched liquor and a concentrated PHA-enriched liquor.
    Type: Grant
    Filed: June 29, 2005
    Date of Patent: June 5, 2007
    Assignee: The Procter & Gamble Company
    Inventors: Karunakaran Narasimhan, Kenneth Yee, Angella Christine Cearley, Donald Levengood, Guo-Qiang Chen
  • Patent number: 6939926
    Abstract: A phenol novolak resin has a peak intensity ratio of ortho-ortho bond (o-o)/ortho-para bond (o-p)/para-para bond (p-p) in a resin structure not substantially varying in each molecular weight fraction and has a weight average molecular weight (Mw) of 3000 to 20000 in terms of polystyrene, which peak intensity ratio is detected by 13C-NMR analysis. The phenol novolak resin can form both dense pattern and isolation pattern with good shapes in the formation of a fine resist pattern of not more than 0.35 ?m and has satisfactory sensitivity, definition, and focal depth range properties, and has a resin composition being uniform in each molecular weight fraction. A process for producing the phenol novolak resin, and a positive photoresist composition using the resin are also provided.
    Type: Grant
    Filed: February 9, 2004
    Date of Patent: September 6, 2005
    Assignee: Tokyo Ohka Kogyo Co., Ltd.
    Inventors: Ken Miyagi, Yasuhide Ohuchi, Atsuko Hirata, Kousuke Doi, Hidekatsu Kohara, Toshimasa Nakayama
  • Patent number: 6864354
    Abstract: The invention relates to modified polyamides, and more particularly to polyamides containing units of the type obtained by reacting a diacid with a diamine, modified with a multifunctional compound. The finished articles shaped from these polyamides or from compositions based on these polyamides have excellent mechanical properties and also a very good surface aspect. The modified polyamide according to the invention is obtained by melt-blending polyamides of different natures, in the presence of a multifunctional compound.
    Type: Grant
    Filed: June 15, 2001
    Date of Patent: March 8, 2005
    Assignee: Rhodia Engineering Plastics S.r.l.
    Inventors: Nicolangelo Peduto, Franco Speroni, Haichun Zhang
  • Patent number: 6773864
    Abstract: Antihalation compositions and methods for reducing the reflection of exposure radiation of a photoresist overcoated said compositions. The antihalation compositions of the invention comprise a resin binder and material capable of causing a thermally induced crosslinking reaction of the resin binder.
    Type: Grant
    Filed: December 31, 2002
    Date of Patent: August 10, 2004
    Assignee: Shipley Company, L.L.C.
    Inventors: James W. Thackeray, George W. Orsula
  • Patent number: 6723801
    Abstract: An object of the present invention is to provide an epoxy resin composition which has high flexibility, can be molded to a thin membrane, and can become a noninflammable cured product. The present invention comprises a polyphenol compound obtained by reacting to condense phenol with bischloromethyl biphenyl or bismethoxymethyl biphenyl, removing unreacted phenol and then reacting with BCMB again, wherein the polyphenol compound has a weight-average molecular weight of 3,000 or more as determined by GPC, and using the polyphenol compound as an agent for curing an epoxy resin.
    Type: Grant
    Filed: May 31, 2002
    Date of Patent: April 20, 2004
    Assignee: Nippon Kayaku Kabushiki Kaisha
    Inventors: Yasumasa Akatsuka, Toyofumi Asano, Masahiro Imaizumi, Katsuhiko Oshimi, Syouichi Tomida
  • Patent number: 6503638
    Abstract: A composition for impregnation of a lignocellulosic material such as wood or wood particles, comprises a high boiling point tar acid or a pitch derived from coal; a solvent for the tar acid or pitch selected from a low carbon alcohol, an aceotrope of a low carbon alcohol and another solvent, and a mixture of a lower carbon alcohol and water; a phenol formaldehyde resole resin; an acid catalyst for the phenol formaldehyde resole resin; and preferably a formaldehyde donor or a precursor thereof. There is also disclosed a method of preparing a finished product from a lignocellulosic material by using the impregnating composition.
    Type: Grant
    Filed: October 27, 2000
    Date of Patent: January 7, 2003
    Assignee: Windsor Technologies Limited
    Inventor: Michael Windsor Symons
  • Patent number: 6372862
    Abstract: The present invention provides phenolic resin-based adhesives which do not produce waste water and industrial wastes and which have good adhesive force, especially after being exposed to thermal history. That is, the present invention provides a phenolic resin-based adhesive composition which contains a polyvinyl butyral, a novolak type phenolic resin or a novolak type phenolic resin and a resol type phenolic resin, and hexamethylenetetramine and which is obtained by uniformly melt-mixing these components, or a phenolic resin-based adhesive composition which contains a polyvinyl butyral, an epoxy resin, a novolak type phenolic resin or a novolak type phenolic resin and a resol type phenolic resin, and hexamethylenetetramine and which is obtained by uniformly melt-mixing these components.
    Type: Grant
    Filed: May 30, 2000
    Date of Patent: April 16, 2002
    Assignee: Sumitomo Durez Company, Ltd.
    Inventor: Shinichi Ozeki
  • Patent number: 6201095
    Abstract: A process is described for preparing a dialkoxyethanal-amine derivative resin low in color by adding low amounts of formaldehyde to the reactants before acidification and heating. The reaction product is also claimed. The composition is useful in a variety of coating and overcoating applications where a brown, yellow or amber color would be aesthetically undesirable.
    Type: Grant
    Filed: June 22, 1999
    Date of Patent: March 13, 2001
    Assignee: Omnova Solutions Inc.
    Inventors: William C. Floyd, Bernard F. North
  • Patent number: 6165697
    Abstract: Antihalation compositions and methods for reducing the reflection of exposure radiation of a photoresist overcoated said compositions. The antihalation compositions of the invention comprise a resin binder and material capable of causing a thermally induced crosslinking reaction of the resin binder.
    Type: Grant
    Filed: November 15, 1991
    Date of Patent: December 26, 2000
    Assignee: Shipley Company, L.L.C.
    Inventors: James W. Thackeray, George W. Orsula
  • Patent number: 5928836
    Abstract: The present invention provides a method for producing a film forming, fractionated novolak resin copolymer exhibiting fast photospeed and superior performance in a photoresist composition. A method is also provided for producing photoresist composition from such a fractionated novolak resin copolymer and for producing semiconductor devices using such a photoresist composition.
    Type: Grant
    Filed: September 29, 1997
    Date of Patent: July 27, 1999
    Assignee: Clariant Finance (BVI) Limited
    Inventors: M. Dalil Rahman, Stanley F. Wanat, Michelle M. Cook, Douglas S. McKenzie, Sunit S. Dixit
  • Patent number: 5847058
    Abstract: A process for the production of a storage-stable, modified phenol-aldehyde resol resin includes the use of an alkylresorcinol modifier and preferably a readily-available mixture of alkylresorcinols. A binder system includes the modified phenol-aldehyde resin combined with a curing agent that includes an additional source of an aldehyde, e.g., a phenol-formaldehyde resin. The resin and binder system are useful in the production of a wood composite (such as plywood, oriented strandboard, or fiberboard).
    Type: Grant
    Filed: April 5, 1996
    Date of Patent: December 8, 1998
    Assignee: Masonite Corporation
    Inventor: Zygmunt Teodorczyk
  • Patent number: 5756599
    Abstract: A process for producing a phenol-aldehyde (e.g., cresol-aldehyde) resin that is modified with a dihydroxybenzene compound. The resin may form a binder system when combined with a curing agent which includes an additional source of an aldehyde. The resin and adhesive are useful in the production of wood composite articles by a steam injection process.
    Type: Grant
    Filed: July 7, 1997
    Date of Patent: May 26, 1998
    Assignee: Masonite Corporation
    Inventor: Zygmunt Teodorczyk
  • Patent number: 5714544
    Abstract: An aromatic hydrocarbon formaldehyde resin novolak, useful as a raw phenolic compound for producing a curing agent and an epoxy resin, an epoxy resin composition which contains a novolak type epoxy resin derived from the above novolak resin and an epoxy resin and is therefore excellent in heat resistance, adhesion and humidity resistance, and a process for the production of a phenolic resin, which comprises reacting an aromatic hydrocarbon formaldehyde resin, phenol and formaldehyde in a novolak-forming reaction in the presence of a catalyst to prepare an aromatic hydrocarbon formaldehyde resin novolak, and treating the reaction product with steam while maintaining the temperature of a reaction mixture at 120.degree. to 195.degree. C. to remove unreacted substances and to decompose high-molecular-weight polymers.
    Type: Grant
    Filed: November 19, 1996
    Date of Patent: February 3, 1998
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Kazuyuki Ohya, Seiji Kita, Takaaki Fukai, Michio Ohba
  • Patent number: 5691426
    Abstract: A resin composition useful as a binder is provided comprising a mixture of a formaldehyde-based resin with a resin substitute comprising the reaction product of an amine derivative chosen from melamine, glycolurile or their mixtures with 1 to 2 moles of a C.sub.1 to C.sub.8 dialkoxyethanal, the reaction product is mixed, preferably reacted, with a polyol.
    Type: Grant
    Filed: February 28, 1997
    Date of Patent: November 25, 1997
    Assignee: Sequa Chemicals, Inc.
    Inventor: William Floyd
  • Patent number: 5646219
    Abstract: A process for the production of a modified phenol-aldehyde resin which may form a binder system when combined with a curing agent which includes an additional source of an aldehyde, e.g., a phenol-formaldehyde resin. The inventive phenol-aldehyde resin may be modified with compounds from one of the following classes: (1) dihydroxybenzenes, (2) aminophenols, and (3) phenylenediamines. The resin and adhesive are useful in the production of a wood composite (such as plywood, oriented strandboard, or fiberboard).
    Type: Grant
    Filed: June 7, 1995
    Date of Patent: July 8, 1997
    Assignee: Masonite Corporation
    Inventor: Zygmunt Teodorczyk
  • Patent number: 5623032
    Abstract: A process for preparing ashless and low-ash phenolic resole resins having no amine odor, and a process for preparing storage-stable mixtures or premix solutions of phenol-formaldehyde resin and urea or unrea-formaldehyde resins. These processes react phenol and formaldehyde in the presence of an effective catalytic amount of a low-volatile and strongly basic tertiary amino alcohol either alone or in combination with an inorganic base.
    Type: Grant
    Filed: June 23, 1995
    Date of Patent: April 22, 1997
    Assignee: Angus Chemical Company
    Inventor: Gaoming Wu
  • Patent number: 5525684
    Abstract: A phenolic resin composition comprises a mixture of 100 parts by weight of a phenol aralkyl resin and 5 to 60 parts by weight of a novolak type phenolic resin having a content of binuclear components of not more than 10% by area, and a content of trinuclear components of not less than 50% by area and a sum content of tri- and tetra-nuclear components of 75% by area based on the total novolak phenolic resin except for the binuclear components, and an epoxy-cured product obtained by curing an epoxy resin while using the phenolic resin composition as set forth in claim 1 as a curing agent. The phenolic resin composition has a low viscosity and, when it is used as a curing agent for epoxy resins, the resulting epoxy-cured product has a low water absorption rate, is excellent in resistance to moisture and has a high glass transition temperature as compared with the cured product obtained using a novolak type phenolic resin as a curing agent.
    Type: Grant
    Filed: January 20, 1995
    Date of Patent: June 11, 1996
    Assignee: Mitsui Toatsu Chemicals, Inc.
    Inventors: Tomoyuki Kawabata, Shigeru Iimuro, Teruo Yuasa
  • Patent number: 5498647
    Abstract: The invention relates to the use of a resorcinol-glutaraldehyde reaction product as an accelerator for thermosetting phenolic resin and to a method of making the accelerator. Further, the invention relates to a resin blend comprising phenol-formaldehyde and the accelerator and a process for making cellulosic board, oriented strandboard and plywood wherein the binder for the cellulosic board, oriented strandboard and plywood in its uncured form comprises the resin blend of the invention. In another embodiment the accelerator for thermosetting resin comprises resorcinol and glutaraldehyde.
    Type: Grant
    Filed: June 7, 1995
    Date of Patent: March 12, 1996
    Assignee: Borden, Inc.
    Inventors: David W. Shiau, William D. Detlefsen, Earl K. Phillips
  • Patent number: 5492998
    Abstract: Novel polymers of general formula: ##STR1## wherein R is an alkyl or aryl group that contains an active hydrogen atom (as determined by the Zerewitinoff test); A is a spacing group having at least one carbon atom; B is a spacing group having at least two carbon atoms; and R and R' are alkyl or aryl groups. The polymer is synthesized via the Mannich pathway, involving formation of an imine intermediate.
    Type: Grant
    Filed: January 20, 1995
    Date of Patent: February 20, 1996
    Assignees: Lifesource International, Ltd., Jojani Inc.
    Inventor: Nicholas M. Irving
  • Patent number: 5491031
    Abstract: A coating composition for application to primed metal substrates as a topcoat is disclosed. The coating composition is especially useful on metal closures for vacuum-packed food products. The coating composition is free of a halide-containing vinyl polymer and comprises: (a) an epoxy novolac resin, (b) a phenolic resin, (c) a polyester, and (d) an elastomer, in (e) a nonaqueous carrier.
    Type: Grant
    Filed: November 14, 1994
    Date of Patent: February 13, 1996
    Assignee: The Dexter Corporation
    Inventor: Lawrence P. Seibel
  • Patent number: 5374678
    Abstract: A wood adhesive composition including an effective amount of a phenol-formaldehyde resin; and a modifying agent which agent renders the composition capable of bonding to a hard wood.
    Type: Grant
    Filed: January 15, 1993
    Date of Patent: December 20, 1994
    Assignees: Commonwealth Scientific & Industrial Research Organization, Huntsman Chemical Company Australia Limited
    Inventors: Peter J. Collins, Michael J. Delaney, Yoshikazu Yazaki
  • Patent number: 5371169
    Abstract: The present invention provides mixture of at least two novolak resins with a molecular weight distribution overlap of at least 50% and having dissolution rates which differ by a factor of at least 2.0. A method is also provided for producing such novolak resin mixtures.
    Type: Grant
    Filed: September 28, 1992
    Date of Patent: December 6, 1994
    Assignee: Hoechst Celanese Corporation
    Inventors: Ping H. Lu, Anthony Canize, Dinesh N. Khanna, M. Dalil Rahman
  • Patent number: 5371156
    Abstract: There are disclosed a modified oriented polyacetal product, the surface of said product being coated partly or entirely with a phenolic compound-polyacetal composite layer, the application thereof and a process for preparing the same.
    Type: Grant
    Filed: December 20, 1993
    Date of Patent: December 6, 1994
    Assignee: Asahi Kasei Kogyo Kabushiki Kaisha
    Inventors: Tamikuni Komatsu, Tadao Kanuma
  • Patent number: 5364902
    Abstract: The invention relates to the use of a resorcinol-glutaraldehyde reaction product as an accelerator for thermosetting phenolic resin and to a method of making the accelerator. Further, the invention relates to a resin blend comprising phenol-formaldehyde and the accelerator and a process for making cellulosic board, oriented strandboard and plywood wherein the binder for the cellulosic board, oriented strandboard and plywood in its uncured form comprises the resin blend of the invention. In another embodiment the accelerator for thermosetting resin comprises resorcinol and glutaraldehyde.
    Type: Grant
    Filed: December 15, 1992
    Date of Patent: November 15, 1994
    Assignee: Borden, Inc.
    Inventors: David W. Shiau, William D. Detlefsen, Earl K. Phillips
  • Patent number: 5364703
    Abstract: The present invention is directed to improving the peel strength of copper foil laminated to polyetherimide substrates which optionally are reinforced. The improvement in process comprises coating one side of the copper foil with an adhesive composition, placing the coated side of the copper foil in contact with pre-formed polyetherimide substrate, and heat-pressing the resulting build-up to form a cured laminate of improved peel strength. The adhesive composition utilized comprises a blend of a polyvinyl butyral resin; one or more resole resins, and an organic solvent. Heat-pressing conditions comprise a temperature ranging from about 450.degree. to 550.degree. F. and pressing conditions ranging from about 100 to 700 psi. Within this temperature/pressure range, the adhesive-coated copper foil mated with the pre-formed polyetherimide substrate yields desired peel strengths without inducing excessive flow of the polyetherimide substrate, i.e. maintaining a pre-desired thickness .+-.7.5%.
    Type: Grant
    Filed: January 16, 1990
    Date of Patent: November 15, 1994
    Assignee: General Electric Company
    Inventors: James E. Tracy, John T. Bartholomew
  • Patent number: 5260405
    Abstract: A binding agent for molding compositions and molded bodies produced by reacting a low molecular weight lignin from the Organosolv process with phenol in a weight ratio of 1:20 to 3:1 at 100.degree. to 180.degree. C., adjusting the pH to an acidic value and condensing the mixture with 0.2 to 0.9 moles of formaldehyde per mole of phenol at 60.degree. to 120.degree. C. to form the binding agent useful for producing curable molding compositions, high-temperature molding compositions, refractory products, textile fleeces and friction coatings as well as carbon materials.
    Type: Grant
    Filed: October 26, 1992
    Date of Patent: November 9, 1993
    Assignee: Rutgerswerke Aktiengesellschaft AG
    Inventors: Arno Gardziella, Achim Hansen, Stephan Schroter, Josef Suren
  • Patent number: 5256742
    Abstract: A process for preparing a poly(arylene sulfide) and copolymer thereof from a poly(arylene sulfide disulfide) is provided which comprises contacting the poly(arylene sulfide disulfide) with a polyhalo-substituted cyclic compound having unsaturation between adjacent ring carbon atoms and having halogen atoms attached to the ring carbon atoms in a polar organic compound and a basic compound at an elevated temperature. Alternatively, the poly(arylene sulfide disulfide) can be substantially dissolved in the polar organic solvent at elevated temperature to form fragments which can be contacted with the polyhalo-substituted cyclic compound in a polar organic compound and a basic compound at an elevated temperature. The fragments also can be isolated, recovered and then contacted with the polyhalo-substituted cyclic compound in a polar organic compound and a basic compound at an elevated temperature.
    Type: Grant
    Filed: October 8, 1992
    Date of Patent: October 26, 1993
    Assignee: Phillips Petroleum Company
    Inventors: William E. Sattich, Owen H. Decker, Dwayne R. Senn, Darryl R. Fahey
  • Patent number: 5254639
    Abstract: A binding agent for molded bodies and molding compositions produced by prereacting a mixture of 5 to 60% by weight of lignin or a lignin fraction produced by the Organosolv process and 40 to 95% by weight of a phenol novolac resin and subjecting the latter to high shear forces in a kneader or extruder and optionally mixing the same with a curing agent useful in molding compositions and high temperature-stable molded products such as refractory products, friction coatings, textile fleeces and carbon or graphite materials.
    Type: Grant
    Filed: October 26, 1992
    Date of Patent: October 19, 1993
    Assignee: Rutgerswerke Aktiengesellschaft AG
    Inventors: Arno Gardziella, Achim Hansen, Stephan Schroter, Josef Suren
  • Patent number: 5223587
    Abstract: Disclosed is an adhesive composition for wood comprising a phenol resin adhesive and a phenol resin highly condensed in a mole ratio (F/P) of formaldehyde (F) to a phenol (P) in the range of 0.8:1 to 1.5:1, having a softening point of 100.degree. to 200.degree. C. and having a number average molecular weight of 2,000 or more, whereby the adhesive is accelerated in hardening to impart fast setting-ability thereto, which causes the pressing temperature to be reduced and makes it possible to raise the allowable moisture content of adherends.
    Type: Grant
    Filed: August 7, 1992
    Date of Patent: June 29, 1993
    Assignee: Oshika Shinko Co. Ltd.
    Inventor: Natsuhi Tsuruta
  • Patent number: 5202189
    Abstract: The specification discloses fire retardant composites which are curable at ambient temperatures and based on resorcinol-formaldehyde resins having specified molar ratios of phenol and aldehyde and specific viscosities.
    Type: Grant
    Filed: February 13, 1989
    Date of Patent: April 13, 1993
    Inventor: Lawrence E. Shea
  • Patent number: 5162428
    Abstract: A phenolic resin composition comprising (a) 30-55% by weight of an alkylbenzene-modified novolac type phenolic resin, (b) 30-55% by weight of a novolac type phenolic resin and (c) 15-30% by weight of a dimethylene ether resole type phenolic resin, and a phenolic resin molding material comprising said composition.
    Type: Grant
    Filed: August 21, 1990
    Date of Patent: November 10, 1992
    Assignee: Sumitomo Bakelite Company Limited
    Inventors: Ken Katoh, Keiji Ooi
  • Patent number: 5130410
    Abstract: This invention relates to alternating and block copolymer resins and methods for preparing the same. The alternating copolymer resins are formed from the reaction of a preformed bishydroxymethyl phenol and a reactive phenolic compound. The alternating copolymer may then be further reacted with a second reactive compound in the presence of an aldehyde to form the substantially block copolymer. The alternating and block copolymer resins are characterized by enhanced ortho-, ortho-coupling and low molecular weight distribution.
    Type: Grant
    Filed: February 27, 1991
    Date of Patent: July 14, 1992
    Assignee: Shipley Company Inc.
    Inventor: Anthony Zampini
  • Patent number: 5036116
    Abstract: A hardener composition for alkaline phenolic resole resin binders which comprises a solution of a benzylic ether resole resin in an ester. Binder compositions comprising this hardener with alkaline phenolic resole resins are further provided as are foundry molding compositions and methods for making foundry cores and molds using the molding compositions.
    Type: Grant
    Filed: October 18, 1990
    Date of Patent: July 30, 1991
    Assignee: Acme Resin Corporation
    Inventors: S. Raja Iyer, Sudhir K. Trikha
  • Patent number: 4988745
    Abstract: A hardener composition for alkaline phenolic resole resin binders which comprises a solution of a benzylic ether resole resin in an ester. Binder compositons comprising this hardener with alkaline phenolic resole resins are further provided as are foundry molding compositions and methods for making foundry cores and molds using the molding compositions.
    Type: Grant
    Filed: April 27, 1989
    Date of Patent: January 29, 1991
    Assignee: Acme Resin Corporation
    Inventors: S. Raja Iyer, Sudhir K. Trikha
  • Patent number: 4987198
    Abstract: There is provided thermosetting resin compositions suitable for injection molding compounds having an apparent curing rate of 0.7 and 0.008 cm/sec respectively at 170.degree. C. and 110.degree. C. by a disk cure tester and an apparent activation energy of at least 26 Kcal/mol, by the addition of fluidity modifiers selected from ether compounds having methylene ether type structure, ester compounds having methylene groups connected with carbonyl ether groups and alcohol compounds having methylene groups connected with hydroxyl groups, to phenolic resin, hexamethylenetetramine, fillers and additives.
    Type: Grant
    Filed: October 24, 1988
    Date of Patent: January 22, 1991
    Assignee: Mitsui Toatsu Chemicals, Inc.
    Inventors: Tsukuru Izukawa, Shuhei Ikado, Toshiyuki Enomoto
  • Patent number: 4833215
    Abstract: A new segmented polymer comprising alternately cross-linked multiblocks of duroplast type and linear multiblocks of thermoplast type and a method of producing these new segmented polymers. The polymers have the structure of a multiblock A-B copolymer, where A denotes a spatially cross-linked oligomeric block and B denotes an oligomeric block of thermoplast type. The method according to the invention consists in that a linear reactive trifunctional A oligomer having two reactive terminal groups and at least one reactive internal group is polyreacted with a reactive bifunctional B oligomer having two reactive terminal groups. The linear multiblock A-B prepolymer, having in A blocks at least one unutilized reactive group, is subject to cross-linking. The A oligomer is selected from the group of non-saturated oligoesters, oligoepoxides, phenol-formaldehyde resins and reactive amino resins.
    Type: Grant
    Filed: March 27, 1986
    Date of Patent: May 23, 1989
    Inventors: Zbigniew Jedlinski, Antoni Kotas
  • Patent number: 4832748
    Abstract: A coating composition comprising (a) an imine obtained by reaction of an organic silicon compound having an aminoalkyl group and at least one alkoxy group with an organic carbonyl compound, (b) a compound having at least one oxirane ring, and optionally (c) a compound having at least one acryloyl or methacryloyl group.
    Type: Grant
    Filed: October 19, 1987
    Date of Patent: May 23, 1989
    Assignee: Toagosei Chemical Industry Co., Ltd.
    Inventors: Kunio Tawara, Toshiro Hirose
  • Patent number: 4500691
    Abstract: Phenol-novolaks containing amino groups of formulas VI and VII ##STR1## wherein R.sup.1 is halogen, nitro, alkyl, alkoxy or phenyl, R.sup.2 is hydrogen, alkyl, cycloalkyl, phenyl or furfuryl, R.sup.3 is hydrogen or alkyl, R.sup.4 and R.sup.5 independently are alkyl, halogen, nitro or cyano, and x is 1 to 8, are obtained by reacting the corresponding phenol-novolak with an aldehyde or ketone of formula II ##STR2## and with a substituted aniline of formula III or IV ##STR3## in a molar ratio of 1 mol of phenol-novolak to 2 mols of compound of formula II and to 2 mols of compound of formula III or IV in an acid medium at a pH value of 0.5 to 3.0. The phenol-novolaks containing amino groups are useful curing agents for epoxy resins and are also suitable as starting compounds for the preparation of epoxy resins.
    Type: Grant
    Filed: January 6, 1984
    Date of Patent: February 19, 1985
    Assignee: Ciba-Geigy Corporation
    Inventors: Friedrich Stockinger, Theobald Haug
  • Patent number: 4483968
    Abstract: Cementitious resin solutions for chemicals-resistant cements are prepared by dissolving a resin in furfuryl alcohol or preparing a resin solution by acidic condensation with the use of furfuryl alcohol. 0.01 to 0.1 equivalents of a primary amine per liter are added to the resin solution.
    Type: Grant
    Filed: September 29, 1983
    Date of Patent: November 20, 1984
    Assignee: Hoechst Aktinegesellschaft
    Inventor: Hans-Joachim Semmler
  • Patent number: 4474929
    Abstract: Branched epoxy novolacs having from 5 to 10 (or more) glycidyl ether groups per molecule are prepared by the epoxidation of novolacs made by the reaction of mono- or dihydric phenols with mono- or dinuclear diphenols ring-substituted with 3- or 4-methylol and/or alkoxymethyl groups.
    Type: Grant
    Filed: September 30, 1983
    Date of Patent: October 2, 1984
    Assignee: The Dow Chemical Company
    Inventor: Paul G. Schrader