Mixed With Additional Aldehyde Or Aldehyde-type Reactants Which Are Part Of A Spfi System Or Polymer Thereof Patents (Class 525/491)
- Contains 1,2-epoxy-containing reactant or polymer derived therefrom (Class 525/496)
- Heterocyclic nitrogen reactant or polymer therefrom, e.g., melamine, etc. (Class 525/497)
- -N-C(=X)-N-containing reactant or polymer, e.g., urea, etc. (X is chalcogen) (Class 525/498)
- Contains sulfur reactant or polymer therefrom (Class 525/499)
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Patent number: 9359464Abstract: The present invention relates to water-dispersible core-shell microcapsules essentially free of formaldehyde. In particular it concerns oligomeric compositions comprising, and the microcapsules obtained from, particular reaction product between a polyamine component and a particular mixture of glyoxal and a C4-6 2,2-dialkoxy-ethanal. The present invention comprises also the invention's core-shell microcapsules as part of a perfuming composition or of a perfuming consumer product.Type: GrantFiled: July 30, 2014Date of Patent: June 7, 2016Assignee: Firmenich SAInventors: Damien Berthier, Géraldine Leon, Nicolas Paret
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Patent number: 8623585Abstract: Provided is a positive photoresist composition containing, as an essential component, a novolac phenolic resin (C) prepared by condensing an aromatic compound (A) represented by general formula (1) or (2) with an aliphatic aldehyde (B). This positive photoresist composition has high sensitivity and high heat resistance at the same time, and is suitable for use as a positive photoresist in, for example, the manufacture of semiconductor devices such as ICs and LSIs, the manufacture of displays such as LCDs, and the manufacture of printing plates. (In the formulas, R1, R2, and R3 are each independently an alkyl group having 1 to 8 carbon atoms; m, n, and p are each independently an integer of 0 to 4; q is an integer of 1 to (5?p); and s is an integer of 1 to (9?p).Type: GrantFiled: October 25, 2011Date of Patent: January 7, 2014Assignee: DIC CorporationInventors: Tomoyuki Imada, Takakazu Kage, Norifumi Imaizumi
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Publication number: 20130266731Abstract: Methods for making and using phenol/formaldehyde/furfural-based resins and furfural alcohol-based resins and are provided. The method for making a phenol/formaldehyde/furfural-based resin can include combining a phenol/formaldehyde-based resin with furfural to produce a phenol/formaldehyde/furfural-based resin. The phenol/formaldehyde/furfural-based resin can have a viscosity of about 1 cP to about 1,000 cP at a temperature of about 25° C.Type: ApplicationFiled: April 10, 2013Publication date: October 10, 2013Applicant: Georgia-Pacific Chemicals LLCInventors: Kim Tutin, Benjamin D. Gapud
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Publication number: 20130116386Abstract: The present invention relates to methods for the production of a resin such as a thermosetting resin, particularly a bioresin, components for use in the methods, and products obtained from the methods. In one aspect the method of forming a resin comprising the steps of: (1) providing an aldehyde-cross-linking agent condensate obtained by reacting a volatile aldehyde with a cross-linking agent; (2) providing a non-volatile aldehyde; and (3) combining the aldehyde-cross-linking agent condensate and the non-volatile aldehyde, thereby forming the resin.Type: ApplicationFiled: December 10, 2010Publication date: May 9, 2013Applicant: CAMBRIDGE BIOPOLYMERS LIMITEDInventors: Colin Fitchett, Colin Chappell
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Patent number: 8101711Abstract: Disclosed is a method for modifying a polymer by carrying out a thermally-induced reaction in a mixing apparatus having a high shear environment and devolatilization capabilities. Also disclosed are the resulting materials.Type: GrantFiled: October 26, 2009Date of Patent: January 24, 2012Assignee: 3M Innovative Properties CompanyInventors: James M. Nelson, Ryan F. Marx, Jeffrey J. Cernohous, James R. McNerney, Todd D. Jones, Kenneth J. Hanley
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Patent number: 7829638Abstract: Hardmask compositions having antireflective properties useful in lithographic processes, methods of using the same, and semiconductor devices fabricated by such methods, are provided.Type: GrantFiled: February 6, 2006Date of Patent: November 9, 2010Assignee: Cheil Industries, Inc.Inventors: Dong Seon Uh, Chang Il Oh, Do Hyeon Kim, Jin Kuk Lee, Irina Nam
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Patent number: 7655386Abstract: An antireflective hardmask composition includes an organic solvent, and at least one polymer represented by Formulae A, B or C: In Formulae A and B, the fluorene group is unsubstituted or substituted, in Formula C, the naphthalene group is unsubstituted or substituted, n is at least 1 and is less than about 750, m is at least 1, and m+n is less than about 750, G is an aromatic ring-containing group having an alkoxy group, and R1 is methylene or includes a non-fluorene-containing aryl linking group.Type: GrantFiled: December 20, 2007Date of Patent: February 2, 2010Assignee: Cheil Industries, Inc.Inventors: Kyung Hee Hyung, Jong Seob Kim, Dong Seon Uh, Chang Il Oh, Kyong Ho Yoon, Min Soo Kim, Jin Kuk Lee
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Patent number: 7632916Abstract: Disclosed is a method for modifying a polymer by carrying out a thermally-induced reaction in a mixing apparatus having a high shear environment and devolatilization capabilities. Also disclosed are the resulting materials.Type: GrantFiled: August 2, 2002Date of Patent: December 15, 2009Assignee: 3M Innovative Properties CompanyInventors: James M. Nelson, Ryan E. Marx, Jeffrey J. Cernohous, James R. McNerney, Todd D. Jones, Kenneth J. Hanley
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Patent number: 7541410Abstract: A thermosetting resin composition comprising a novolac-type phenolic resin, a polyacetal resin and a cyclohexyl compound represented by the general formula (1) as a curing catalyst, a thermosetting resin molding compound comprising the thermosetting resin composition and a filler, and a cured product formed by curing the thermosetting resin composition or the thermosetting resin molding compound are provided. In the formula, R1 to R12 are defined in the claims and description.Type: GrantFiled: September 30, 2005Date of Patent: June 2, 2009Assignee: Sumitomo Bakelite Co., Ltd.Inventors: Masayasu Horie, Yukio Tokunaga, Shigeyoshi Furuhara
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Patent number: 7381788Abstract: Provided is a continuous production method of a polyamide with stabilized polymerization degree and good quality, particularly an aromatic-containing polyamide.Type: GrantFiled: August 27, 2003Date of Patent: June 3, 2008Assignee: Toyo Boseki Kabushiki KaishaInventors: Yasuhito Tsujii, Gaku Maruyama, Kaoru Ogawa, Yoshinori Takada, Kazuhisa Koishi, Kenta Susuki
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Patent number: 7226765Abstract: Processes for the extraction of PHAs from biomass, said processes comprising: combining the biomass containing the PHAs with a single main solvent to form a biomass liquor; heating the biomass liquor to at least partially solubilize the PHAs from the biomass to form a PHA liquor; separating the biomass from the PHA liquor to form a PHA-enriched liquor; evaporating from 0% to about 50% of the single main solvent from the PHA-enriched liquor to form a solvent vapor and a concentrated PHA-enriched liquor; and cooling the concentrated PHA-enriched liquor to form precipitated PHAs and an impure solvent liquor. Optionally, further recovering the precipitated PHAs from the impure solvent liquor by filtration under pressure. A PHA-enriched liquor and a concentrated PHA-enriched liquor.Type: GrantFiled: June 29, 2005Date of Patent: June 5, 2007Assignee: The Procter & Gamble CompanyInventors: Karunakaran Narasimhan, Kenneth Yee, Angella Christine Cearley, Donald Levengood, Guo-Qiang Chen
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Patent number: 6939926Abstract: A phenol novolak resin has a peak intensity ratio of ortho-ortho bond (o-o)/ortho-para bond (o-p)/para-para bond (p-p) in a resin structure not substantially varying in each molecular weight fraction and has a weight average molecular weight (Mw) of 3000 to 20000 in terms of polystyrene, which peak intensity ratio is detected by 13C-NMR analysis. The phenol novolak resin can form both dense pattern and isolation pattern with good shapes in the formation of a fine resist pattern of not more than 0.35 ?m and has satisfactory sensitivity, definition, and focal depth range properties, and has a resin composition being uniform in each molecular weight fraction. A process for producing the phenol novolak resin, and a positive photoresist composition using the resin are also provided.Type: GrantFiled: February 9, 2004Date of Patent: September 6, 2005Assignee: Tokyo Ohka Kogyo Co., Ltd.Inventors: Ken Miyagi, Yasuhide Ohuchi, Atsuko Hirata, Kousuke Doi, Hidekatsu Kohara, Toshimasa Nakayama
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Patent number: 6864354Abstract: The invention relates to modified polyamides, and more particularly to polyamides containing units of the type obtained by reacting a diacid with a diamine, modified with a multifunctional compound. The finished articles shaped from these polyamides or from compositions based on these polyamides have excellent mechanical properties and also a very good surface aspect. The modified polyamide according to the invention is obtained by melt-blending polyamides of different natures, in the presence of a multifunctional compound.Type: GrantFiled: June 15, 2001Date of Patent: March 8, 2005Assignee: Rhodia Engineering Plastics S.r.l.Inventors: Nicolangelo Peduto, Franco Speroni, Haichun Zhang
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Patent number: 6773864Abstract: Antihalation compositions and methods for reducing the reflection of exposure radiation of a photoresist overcoated said compositions. The antihalation compositions of the invention comprise a resin binder and material capable of causing a thermally induced crosslinking reaction of the resin binder.Type: GrantFiled: December 31, 2002Date of Patent: August 10, 2004Assignee: Shipley Company, L.L.C.Inventors: James W. Thackeray, George W. Orsula
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Patent number: 6723801Abstract: An object of the present invention is to provide an epoxy resin composition which has high flexibility, can be molded to a thin membrane, and can become a noninflammable cured product. The present invention comprises a polyphenol compound obtained by reacting to condense phenol with bischloromethyl biphenyl or bismethoxymethyl biphenyl, removing unreacted phenol and then reacting with BCMB again, wherein the polyphenol compound has a weight-average molecular weight of 3,000 or more as determined by GPC, and using the polyphenol compound as an agent for curing an epoxy resin.Type: GrantFiled: May 31, 2002Date of Patent: April 20, 2004Assignee: Nippon Kayaku Kabushiki KaishaInventors: Yasumasa Akatsuka, Toyofumi Asano, Masahiro Imaizumi, Katsuhiko Oshimi, Syouichi Tomida
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Patent number: 6503638Abstract: A composition for impregnation of a lignocellulosic material such as wood or wood particles, comprises a high boiling point tar acid or a pitch derived from coal; a solvent for the tar acid or pitch selected from a low carbon alcohol, an aceotrope of a low carbon alcohol and another solvent, and a mixture of a lower carbon alcohol and water; a phenol formaldehyde resole resin; an acid catalyst for the phenol formaldehyde resole resin; and preferably a formaldehyde donor or a precursor thereof. There is also disclosed a method of preparing a finished product from a lignocellulosic material by using the impregnating composition.Type: GrantFiled: October 27, 2000Date of Patent: January 7, 2003Assignee: Windsor Technologies LimitedInventor: Michael Windsor Symons
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Patent number: 6372862Abstract: The present invention provides phenolic resin-based adhesives which do not produce waste water and industrial wastes and which have good adhesive force, especially after being exposed to thermal history. That is, the present invention provides a phenolic resin-based adhesive composition which contains a polyvinyl butyral, a novolak type phenolic resin or a novolak type phenolic resin and a resol type phenolic resin, and hexamethylenetetramine and which is obtained by uniformly melt-mixing these components, or a phenolic resin-based adhesive composition which contains a polyvinyl butyral, an epoxy resin, a novolak type phenolic resin or a novolak type phenolic resin and a resol type phenolic resin, and hexamethylenetetramine and which is obtained by uniformly melt-mixing these components.Type: GrantFiled: May 30, 2000Date of Patent: April 16, 2002Assignee: Sumitomo Durez Company, Ltd.Inventor: Shinichi Ozeki
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Patent number: 6201095Abstract: A process is described for preparing a dialkoxyethanal-amine derivative resin low in color by adding low amounts of formaldehyde to the reactants before acidification and heating. The reaction product is also claimed. The composition is useful in a variety of coating and overcoating applications where a brown, yellow or amber color would be aesthetically undesirable.Type: GrantFiled: June 22, 1999Date of Patent: March 13, 2001Assignee: Omnova Solutions Inc.Inventors: William C. Floyd, Bernard F. North
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Patent number: 6165697Abstract: Antihalation compositions and methods for reducing the reflection of exposure radiation of a photoresist overcoated said compositions. The antihalation compositions of the invention comprise a resin binder and material capable of causing a thermally induced crosslinking reaction of the resin binder.Type: GrantFiled: November 15, 1991Date of Patent: December 26, 2000Assignee: Shipley Company, L.L.C.Inventors: James W. Thackeray, George W. Orsula
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Patent number: 5928836Abstract: The present invention provides a method for producing a film forming, fractionated novolak resin copolymer exhibiting fast photospeed and superior performance in a photoresist composition. A method is also provided for producing photoresist composition from such a fractionated novolak resin copolymer and for producing semiconductor devices using such a photoresist composition.Type: GrantFiled: September 29, 1997Date of Patent: July 27, 1999Assignee: Clariant Finance (BVI) LimitedInventors: M. Dalil Rahman, Stanley F. Wanat, Michelle M. Cook, Douglas S. McKenzie, Sunit S. Dixit
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Patent number: 5847058Abstract: A process for the production of a storage-stable, modified phenol-aldehyde resol resin includes the use of an alkylresorcinol modifier and preferably a readily-available mixture of alkylresorcinols. A binder system includes the modified phenol-aldehyde resin combined with a curing agent that includes an additional source of an aldehyde, e.g., a phenol-formaldehyde resin. The resin and binder system are useful in the production of a wood composite (such as plywood, oriented strandboard, or fiberboard).Type: GrantFiled: April 5, 1996Date of Patent: December 8, 1998Assignee: Masonite CorporationInventor: Zygmunt Teodorczyk
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Patent number: 5756599Abstract: A process for producing a phenol-aldehyde (e.g., cresol-aldehyde) resin that is modified with a dihydroxybenzene compound. The resin may form a binder system when combined with a curing agent which includes an additional source of an aldehyde. The resin and adhesive are useful in the production of wood composite articles by a steam injection process.Type: GrantFiled: July 7, 1997Date of Patent: May 26, 1998Assignee: Masonite CorporationInventor: Zygmunt Teodorczyk
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Patent number: 5714544Abstract: An aromatic hydrocarbon formaldehyde resin novolak, useful as a raw phenolic compound for producing a curing agent and an epoxy resin, an epoxy resin composition which contains a novolak type epoxy resin derived from the above novolak resin and an epoxy resin and is therefore excellent in heat resistance, adhesion and humidity resistance, and a process for the production of a phenolic resin, which comprises reacting an aromatic hydrocarbon formaldehyde resin, phenol and formaldehyde in a novolak-forming reaction in the presence of a catalyst to prepare an aromatic hydrocarbon formaldehyde resin novolak, and treating the reaction product with steam while maintaining the temperature of a reaction mixture at 120.degree. to 195.degree. C. to remove unreacted substances and to decompose high-molecular-weight polymers.Type: GrantFiled: November 19, 1996Date of Patent: February 3, 1998Assignee: Mitsubishi Gas Chemical Company, Inc.Inventors: Kazuyuki Ohya, Seiji Kita, Takaaki Fukai, Michio Ohba
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Patent number: 5691426Abstract: A resin composition useful as a binder is provided comprising a mixture of a formaldehyde-based resin with a resin substitute comprising the reaction product of an amine derivative chosen from melamine, glycolurile or their mixtures with 1 to 2 moles of a C.sub.1 to C.sub.8 dialkoxyethanal, the reaction product is mixed, preferably reacted, with a polyol.Type: GrantFiled: February 28, 1997Date of Patent: November 25, 1997Assignee: Sequa Chemicals, Inc.Inventor: William Floyd
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Patent number: 5646219Abstract: A process for the production of a modified phenol-aldehyde resin which may form a binder system when combined with a curing agent which includes an additional source of an aldehyde, e.g., a phenol-formaldehyde resin. The inventive phenol-aldehyde resin may be modified with compounds from one of the following classes: (1) dihydroxybenzenes, (2) aminophenols, and (3) phenylenediamines. The resin and adhesive are useful in the production of a wood composite (such as plywood, oriented strandboard, or fiberboard).Type: GrantFiled: June 7, 1995Date of Patent: July 8, 1997Assignee: Masonite CorporationInventor: Zygmunt Teodorczyk
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Patent number: 5623032Abstract: A process for preparing ashless and low-ash phenolic resole resins having no amine odor, and a process for preparing storage-stable mixtures or premix solutions of phenol-formaldehyde resin and urea or unrea-formaldehyde resins. These processes react phenol and formaldehyde in the presence of an effective catalytic amount of a low-volatile and strongly basic tertiary amino alcohol either alone or in combination with an inorganic base.Type: GrantFiled: June 23, 1995Date of Patent: April 22, 1997Assignee: Angus Chemical CompanyInventor: Gaoming Wu
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Patent number: 5525684Abstract: A phenolic resin composition comprises a mixture of 100 parts by weight of a phenol aralkyl resin and 5 to 60 parts by weight of a novolak type phenolic resin having a content of binuclear components of not more than 10% by area, and a content of trinuclear components of not less than 50% by area and a sum content of tri- and tetra-nuclear components of 75% by area based on the total novolak phenolic resin except for the binuclear components, and an epoxy-cured product obtained by curing an epoxy resin while using the phenolic resin composition as set forth in claim 1 as a curing agent. The phenolic resin composition has a low viscosity and, when it is used as a curing agent for epoxy resins, the resulting epoxy-cured product has a low water absorption rate, is excellent in resistance to moisture and has a high glass transition temperature as compared with the cured product obtained using a novolak type phenolic resin as a curing agent.Type: GrantFiled: January 20, 1995Date of Patent: June 11, 1996Assignee: Mitsui Toatsu Chemicals, Inc.Inventors: Tomoyuki Kawabata, Shigeru Iimuro, Teruo Yuasa
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Patent number: 5498647Abstract: The invention relates to the use of a resorcinol-glutaraldehyde reaction product as an accelerator for thermosetting phenolic resin and to a method of making the accelerator. Further, the invention relates to a resin blend comprising phenol-formaldehyde and the accelerator and a process for making cellulosic board, oriented strandboard and plywood wherein the binder for the cellulosic board, oriented strandboard and plywood in its uncured form comprises the resin blend of the invention. In another embodiment the accelerator for thermosetting resin comprises resorcinol and glutaraldehyde.Type: GrantFiled: June 7, 1995Date of Patent: March 12, 1996Assignee: Borden, Inc.Inventors: David W. Shiau, William D. Detlefsen, Earl K. Phillips
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Patent number: 5492998Abstract: Novel polymers of general formula: ##STR1## wherein R is an alkyl or aryl group that contains an active hydrogen atom (as determined by the Zerewitinoff test); A is a spacing group having at least one carbon atom; B is a spacing group having at least two carbon atoms; and R and R' are alkyl or aryl groups. The polymer is synthesized via the Mannich pathway, involving formation of an imine intermediate.Type: GrantFiled: January 20, 1995Date of Patent: February 20, 1996Assignees: Lifesource International, Ltd., Jojani Inc.Inventor: Nicholas M. Irving
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Patent number: 5491031Abstract: A coating composition for application to primed metal substrates as a topcoat is disclosed. The coating composition is especially useful on metal closures for vacuum-packed food products. The coating composition is free of a halide-containing vinyl polymer and comprises: (a) an epoxy novolac resin, (b) a phenolic resin, (c) a polyester, and (d) an elastomer, in (e) a nonaqueous carrier.Type: GrantFiled: November 14, 1994Date of Patent: February 13, 1996Assignee: The Dexter CorporationInventor: Lawrence P. Seibel
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Patent number: 5374678Abstract: A wood adhesive composition including an effective amount of a phenol-formaldehyde resin; and a modifying agent which agent renders the composition capable of bonding to a hard wood.Type: GrantFiled: January 15, 1993Date of Patent: December 20, 1994Assignees: Commonwealth Scientific & Industrial Research Organization, Huntsman Chemical Company Australia LimitedInventors: Peter J. Collins, Michael J. Delaney, Yoshikazu Yazaki
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Patent number: 5371156Abstract: There are disclosed a modified oriented polyacetal product, the surface of said product being coated partly or entirely with a phenolic compound-polyacetal composite layer, the application thereof and a process for preparing the same.Type: GrantFiled: December 20, 1993Date of Patent: December 6, 1994Assignee: Asahi Kasei Kogyo Kabushiki KaishaInventors: Tamikuni Komatsu, Tadao Kanuma
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Patent number: 5371169Abstract: The present invention provides mixture of at least two novolak resins with a molecular weight distribution overlap of at least 50% and having dissolution rates which differ by a factor of at least 2.0. A method is also provided for producing such novolak resin mixtures.Type: GrantFiled: September 28, 1992Date of Patent: December 6, 1994Assignee: Hoechst Celanese CorporationInventors: Ping H. Lu, Anthony Canize, Dinesh N. Khanna, M. Dalil Rahman
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Patent number: 5364902Abstract: The invention relates to the use of a resorcinol-glutaraldehyde reaction product as an accelerator for thermosetting phenolic resin and to a method of making the accelerator. Further, the invention relates to a resin blend comprising phenol-formaldehyde and the accelerator and a process for making cellulosic board, oriented strandboard and plywood wherein the binder for the cellulosic board, oriented strandboard and plywood in its uncured form comprises the resin blend of the invention. In another embodiment the accelerator for thermosetting resin comprises resorcinol and glutaraldehyde.Type: GrantFiled: December 15, 1992Date of Patent: November 15, 1994Assignee: Borden, Inc.Inventors: David W. Shiau, William D. Detlefsen, Earl K. Phillips
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Patent number: 5364703Abstract: The present invention is directed to improving the peel strength of copper foil laminated to polyetherimide substrates which optionally are reinforced. The improvement in process comprises coating one side of the copper foil with an adhesive composition, placing the coated side of the copper foil in contact with pre-formed polyetherimide substrate, and heat-pressing the resulting build-up to form a cured laminate of improved peel strength. The adhesive composition utilized comprises a blend of a polyvinyl butyral resin; one or more resole resins, and an organic solvent. Heat-pressing conditions comprise a temperature ranging from about 450.degree. to 550.degree. F. and pressing conditions ranging from about 100 to 700 psi. Within this temperature/pressure range, the adhesive-coated copper foil mated with the pre-formed polyetherimide substrate yields desired peel strengths without inducing excessive flow of the polyetherimide substrate, i.e. maintaining a pre-desired thickness .+-.7.5%.Type: GrantFiled: January 16, 1990Date of Patent: November 15, 1994Assignee: General Electric CompanyInventors: James E. Tracy, John T. Bartholomew
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Patent number: 5260405Abstract: A binding agent for molding compositions and molded bodies produced by reacting a low molecular weight lignin from the Organosolv process with phenol in a weight ratio of 1:20 to 3:1 at 100.degree. to 180.degree. C., adjusting the pH to an acidic value and condensing the mixture with 0.2 to 0.9 moles of formaldehyde per mole of phenol at 60.degree. to 120.degree. C. to form the binding agent useful for producing curable molding compositions, high-temperature molding compositions, refractory products, textile fleeces and friction coatings as well as carbon materials.Type: GrantFiled: October 26, 1992Date of Patent: November 9, 1993Assignee: Rutgerswerke Aktiengesellschaft AGInventors: Arno Gardziella, Achim Hansen, Stephan Schroter, Josef Suren
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Patent number: 5256742Abstract: A process for preparing a poly(arylene sulfide) and copolymer thereof from a poly(arylene sulfide disulfide) is provided which comprises contacting the poly(arylene sulfide disulfide) with a polyhalo-substituted cyclic compound having unsaturation between adjacent ring carbon atoms and having halogen atoms attached to the ring carbon atoms in a polar organic compound and a basic compound at an elevated temperature. Alternatively, the poly(arylene sulfide disulfide) can be substantially dissolved in the polar organic solvent at elevated temperature to form fragments which can be contacted with the polyhalo-substituted cyclic compound in a polar organic compound and a basic compound at an elevated temperature. The fragments also can be isolated, recovered and then contacted with the polyhalo-substituted cyclic compound in a polar organic compound and a basic compound at an elevated temperature.Type: GrantFiled: October 8, 1992Date of Patent: October 26, 1993Assignee: Phillips Petroleum CompanyInventors: William E. Sattich, Owen H. Decker, Dwayne R. Senn, Darryl R. Fahey
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Patent number: 5254639Abstract: A binding agent for molded bodies and molding compositions produced by prereacting a mixture of 5 to 60% by weight of lignin or a lignin fraction produced by the Organosolv process and 40 to 95% by weight of a phenol novolac resin and subjecting the latter to high shear forces in a kneader or extruder and optionally mixing the same with a curing agent useful in molding compositions and high temperature-stable molded products such as refractory products, friction coatings, textile fleeces and carbon or graphite materials.Type: GrantFiled: October 26, 1992Date of Patent: October 19, 1993Assignee: Rutgerswerke Aktiengesellschaft AGInventors: Arno Gardziella, Achim Hansen, Stephan Schroter, Josef Suren
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Patent number: 5223587Abstract: Disclosed is an adhesive composition for wood comprising a phenol resin adhesive and a phenol resin highly condensed in a mole ratio (F/P) of formaldehyde (F) to a phenol (P) in the range of 0.8:1 to 1.5:1, having a softening point of 100.degree. to 200.degree. C. and having a number average molecular weight of 2,000 or more, whereby the adhesive is accelerated in hardening to impart fast setting-ability thereto, which causes the pressing temperature to be reduced and makes it possible to raise the allowable moisture content of adherends.Type: GrantFiled: August 7, 1992Date of Patent: June 29, 1993Assignee: Oshika Shinko Co. Ltd.Inventor: Natsuhi Tsuruta
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Patent number: 5202189Abstract: The specification discloses fire retardant composites which are curable at ambient temperatures and based on resorcinol-formaldehyde resins having specified molar ratios of phenol and aldehyde and specific viscosities.Type: GrantFiled: February 13, 1989Date of Patent: April 13, 1993Inventor: Lawrence E. Shea
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Patent number: 5162428Abstract: A phenolic resin composition comprising (a) 30-55% by weight of an alkylbenzene-modified novolac type phenolic resin, (b) 30-55% by weight of a novolac type phenolic resin and (c) 15-30% by weight of a dimethylene ether resole type phenolic resin, and a phenolic resin molding material comprising said composition.Type: GrantFiled: August 21, 1990Date of Patent: November 10, 1992Assignee: Sumitomo Bakelite Company LimitedInventors: Ken Katoh, Keiji Ooi
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Patent number: 5130410Abstract: This invention relates to alternating and block copolymer resins and methods for preparing the same. The alternating copolymer resins are formed from the reaction of a preformed bishydroxymethyl phenol and a reactive phenolic compound. The alternating copolymer may then be further reacted with a second reactive compound in the presence of an aldehyde to form the substantially block copolymer. The alternating and block copolymer resins are characterized by enhanced ortho-, ortho-coupling and low molecular weight distribution.Type: GrantFiled: February 27, 1991Date of Patent: July 14, 1992Assignee: Shipley Company Inc.Inventor: Anthony Zampini
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Patent number: 5036116Abstract: A hardener composition for alkaline phenolic resole resin binders which comprises a solution of a benzylic ether resole resin in an ester. Binder compositions comprising this hardener with alkaline phenolic resole resins are further provided as are foundry molding compositions and methods for making foundry cores and molds using the molding compositions.Type: GrantFiled: October 18, 1990Date of Patent: July 30, 1991Assignee: Acme Resin CorporationInventors: S. Raja Iyer, Sudhir K. Trikha
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Patent number: 4988745Abstract: A hardener composition for alkaline phenolic resole resin binders which comprises a solution of a benzylic ether resole resin in an ester. Binder compositons comprising this hardener with alkaline phenolic resole resins are further provided as are foundry molding compositions and methods for making foundry cores and molds using the molding compositions.Type: GrantFiled: April 27, 1989Date of Patent: January 29, 1991Assignee: Acme Resin CorporationInventors: S. Raja Iyer, Sudhir K. Trikha
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Patent number: 4987198Abstract: There is provided thermosetting resin compositions suitable for injection molding compounds having an apparent curing rate of 0.7 and 0.008 cm/sec respectively at 170.degree. C. and 110.degree. C. by a disk cure tester and an apparent activation energy of at least 26 Kcal/mol, by the addition of fluidity modifiers selected from ether compounds having methylene ether type structure, ester compounds having methylene groups connected with carbonyl ether groups and alcohol compounds having methylene groups connected with hydroxyl groups, to phenolic resin, hexamethylenetetramine, fillers and additives.Type: GrantFiled: October 24, 1988Date of Patent: January 22, 1991Assignee: Mitsui Toatsu Chemicals, Inc.Inventors: Tsukuru Izukawa, Shuhei Ikado, Toshiyuki Enomoto
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Patent number: 4832748Abstract: A coating composition comprising (a) an imine obtained by reaction of an organic silicon compound having an aminoalkyl group and at least one alkoxy group with an organic carbonyl compound, (b) a compound having at least one oxirane ring, and optionally (c) a compound having at least one acryloyl or methacryloyl group.Type: GrantFiled: October 19, 1987Date of Patent: May 23, 1989Assignee: Toagosei Chemical Industry Co., Ltd.Inventors: Kunio Tawara, Toshiro Hirose
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Patent number: 4833215Abstract: A new segmented polymer comprising alternately cross-linked multiblocks of duroplast type and linear multiblocks of thermoplast type and a method of producing these new segmented polymers. The polymers have the structure of a multiblock A-B copolymer, where A denotes a spatially cross-linked oligomeric block and B denotes an oligomeric block of thermoplast type. The method according to the invention consists in that a linear reactive trifunctional A oligomer having two reactive terminal groups and at least one reactive internal group is polyreacted with a reactive bifunctional B oligomer having two reactive terminal groups. The linear multiblock A-B prepolymer, having in A blocks at least one unutilized reactive group, is subject to cross-linking. The A oligomer is selected from the group of non-saturated oligoesters, oligoepoxides, phenol-formaldehyde resins and reactive amino resins.Type: GrantFiled: March 27, 1986Date of Patent: May 23, 1989Inventors: Zbigniew Jedlinski, Antoni Kotas
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Patent number: 4500691Abstract: Phenol-novolaks containing amino groups of formulas VI and VII ##STR1## wherein R.sup.1 is halogen, nitro, alkyl, alkoxy or phenyl, R.sup.2 is hydrogen, alkyl, cycloalkyl, phenyl or furfuryl, R.sup.3 is hydrogen or alkyl, R.sup.4 and R.sup.5 independently are alkyl, halogen, nitro or cyano, and x is 1 to 8, are obtained by reacting the corresponding phenol-novolak with an aldehyde or ketone of formula II ##STR2## and with a substituted aniline of formula III or IV ##STR3## in a molar ratio of 1 mol of phenol-novolak to 2 mols of compound of formula II and to 2 mols of compound of formula III or IV in an acid medium at a pH value of 0.5 to 3.0. The phenol-novolaks containing amino groups are useful curing agents for epoxy resins and are also suitable as starting compounds for the preparation of epoxy resins.Type: GrantFiled: January 6, 1984Date of Patent: February 19, 1985Assignee: Ciba-Geigy CorporationInventors: Friedrich Stockinger, Theobald Haug
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Patent number: 4483968Abstract: Cementitious resin solutions for chemicals-resistant cements are prepared by dissolving a resin in furfuryl alcohol or preparing a resin solution by acidic condensation with the use of furfuryl alcohol. 0.01 to 0.1 equivalents of a primary amine per liter are added to the resin solution.Type: GrantFiled: September 29, 1983Date of Patent: November 20, 1984Assignee: Hoechst AktinegesellschaftInventor: Hans-Joachim Semmler
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Patent number: 4474929Abstract: Branched epoxy novolacs having from 5 to 10 (or more) glycidyl ether groups per molecule are prepared by the epoxidation of novolacs made by the reaction of mono- or dihydric phenols with mono- or dinuclear diphenols ring-substituted with 3- or 4-methylol and/or alkoxymethyl groups.Type: GrantFiled: September 30, 1983Date of Patent: October 2, 1984Assignee: The Dow Chemical CompanyInventor: Paul G. Schrader