Abstract: Hardmask compositions having antireflective properties useful in lithographic processes, methods of using the same, and semiconductor devices fabricated by such methods, are provided.

Abstract: An antireflective hardmask composition includes an organic solvent, and at least one polymer represented by Formulae A, B or C: In Formulae A and B, the fluorene group is unsubstituted or substituted, in Formula C, the naphthalene group is unsubstituted or substituted, n is at least 1 and is less than about 750, m is at least 1, and m+n is less than about 750, G is an aromatic ring-containing group having an alkoxy group, and R1 is methylene or includes a non-fluorene-containing aryl linking group.

Abstract: A rubber composition including 100 parts by weight of a rubber component composed of 50 to 80 parts by weight of natural rubber (NR) and/or polyisoprene rubber (IR), 15 to 45 parts by weight of polybutadiene rubber (BR) and 2 parts by weight to less than 10 parts by weight of a solution polymerized styrene-butadiene copolymer rubber (S-SBR) having a styrene content of 15 to 35% by weight and a vinyl bond content of a butadiene portion thereof of more than 30% to less than 75%.

Abstract: In an epoxy resin composition comprising an epoxy resin, a curing agent, and an inorganic filler, the filler is porous silica having a specific surface area of 6-200 m2/g, a true specific gravity of 2.0-2.2, and a mean particle size of 2-50 &mgr;m. The epoxy resin composition is readily moldable, has a low moisture permeability and reliability in the cured state, and is suitable for forming a premolded hollow semiconductor package.

Abstract: A resin composition comprising predetermined amounts of a specific polyamide resin (A), a modified polyphenylene ether resin (B), a fibrous inorganic filler (C) having an average fiber-diameter of 10 .mu.m or less, a powdery inorganic filler (D) having an average particle diameter of 10 .mu.m or less, an epoxy resin (E) and a copper compound (F-1) and/or a powdery phenolic resin (F-2); a molded article formed from the resin composition; and a lamp reflector formed from the molded article. The molded article formed from the above resin composition can give an automotive lamp reflector excellent in resistance to heat generated when a lamp is on, rigidity at high temperatures, clear reflection performance on a mold article surface, adhesion to deposited aluminum and adhesion to a primer coating composition.

Abstract: Disclosed are a resorcinol resin adhesive composition which comprises a resorcinol resin modified by m-aminophenol, and a process for bonding wood materials by using the same.

Abstract: A composition which contains thermosettable monomers from which continuous products can be made without using continuous carrier material, the composition containing bismaleimide monomers and a thermoplastic polymer having a high molecular weight.Products made from a composition of the present invention are suitable for use in those fields where good temperature resistance, good fire resistance and/or good corrosion and solvent resistance are required in addition to good mechanical properties. Examples are cable sheathing, fire-resistant clothing, asbestos substitutes, high-temperature filters, aircraft interiors, precursors for carbon fiber , food packagings (for example, for use in a microwave oven), capacitor films and filament winding products.

Abstract: Webs composed of inorganic or organic fiber material are bonded with a cured resin mixture consisting essentially of(A) from 5 to 80% by weight of a water-soluble condensation product of carbonyl number 0-200 which has been prepared by alkaline condensation from 0.1 to 0.4 mole of an aliphatic or cycloaliphatic condensable ketone and 1 mole of formaldehyde, and(B) from 20 to 95% by weight of a water-soluble amino and/or phenolic resin.

Abstract: A bath composition for cataphoretic electrocoating of conductive surfaces contains coating agents which have been rendered soluble or dispersible with acid, contain basic nitrogen groups and carry groups of the general formulae (1) and (11) ##STR1## and, optionally, also groups of the general formulae (III) and/or (IV) ##STR2## where R.sup.1 and R.sup.2 are each alkyl, hydroxyalkyl or alkoxyalkyl, R.sup.3 and R.sup.4 are each hydrogen or methyl, R.sup.5 and R.sup.6 are each hydrogen, alkyl or a divalent radical of a polymer molecule which is bonded to a phenol or phenol ether, n.sup.1 is 1, 2 or 3 and n.sup.2 is 1 or 2, and where the oxygen bonded to the phenyl radical is either in the form of the OH group or etherified.

Abstract: This invention is directed to low molecular weight, solid addition products having a softening point above 100.degree. F. and the method of preparing same and more particularly to the use of said addition products as crosslinking agents in various polymeric powder coatings, e.g. polyesters. The solid, low molecular weight products are derived from the addition reaction of at least one monohydroxy, single-ring aromatic carbon compound and hexakis (alkoxymethyl) amino-triazine.

Abstract: A process for preparing bonding agents for light-colored weatherproof wood materials, based on alkali-condensed phenol-formaldehyde mixed condensates.