Abstract: There are provided a thermosetting resin composition for a semiconductor package and a prepreg and a metal clad laminate using the same. More particularly, there are provided a thermosetting resin composition for a semiconductor package capable of improving desmear characteristics by using a cyanate based ester resin and a benzoxazine resin in a thermosetting resin composition based on an epoxy resin and improving chemical resistance by using a slurry type filler to have high heat resistance and reliability, and a prepreg and a metal clad laminate using the same.

Abstract: A method for the production of polyoxazolidinone compounds, comprising the step of reacting an isocyanate compound (A) with an epoxide compound (B) in the presence of a catalyst (C), wherein the isocyanate compound (A) comprises a isocyanate compound (A1) wherein the a isocyanate compound (A1) comprising at least two isocyanate groups (I1?2), preferred two isocyanate groups (I1=2), wherein the epoxide compound (B) comprises a epoxide compound (B1) and an epoxide compound (B2), wherein the epoxide compound (B2) is different from the epoxide compound (B1) wherein the epoxide compound (B1) comprising at least two terminal epoxide groups (F1?2), preferred two terminal epoxide groups (F1=2), linked together by a linking group (L1) and the epoxide compound (B2) comprising at least two terminal epoxide groups (F2?2)), preferred two terminal epoxide groups (F2=2), linked together by a linking group (L2), wherein the linking group (L2) comprises acyclic and covalent bonds to each other free of conjugated multiple bond

Abstract: The present invention relates to a conductive composition containing a conductive metal powder and a resin component, in which the conductive metal powder contains at least a metal flake having a crystalline structure in which a metal crystal grows in a flake shape, and the resin component contains an aromatic amine skeleton.

Abstract: Provided is a composition for forming a hard coating layer, which includes an epoxy siloxane resin, a crosslinking agent including a compound having an alicyclic epoxy group, a thermal initiator including a compound represented by Chemical Formula 2, and a photoinitiator to decrease curls and increase hardness of the hard coating film.

Abstract: The present disclosure provides a curable, one-part epoxy/thiol resin composition. The composition comprises an epoxy/thiol resin mixture including: an epoxy resin component including an epoxy resin having at least two epoxide groups per molecule, a thiol component including a polythiol compound having at least two primary thiol groups, and a nitrogen-containing catalyst for the epoxy resin. The epoxy/thiol resin mixture further includes metal nanoparticles (e.g., silver nanoparticles, copper nanoparticles, or both), dispersed in the epoxy/thiol resin mixture. The present disclosure provides a method of curing a curable, one-part epoxy/thiol resin composition, including providing a curable, one-part epoxy/thiol resin composition and heating the composition to a temperature of at least 50° C.

Abstract: Disclosed is a resin composition that contains conductive particles, a resin component and a curing agent. The conductive particles contain solder, and the resin component contains an epoxy resin and a phenoxy resin. The curing agent contains a first compound having at least one thiol group and a second compound having an amino group.

Abstract: A catalyst composition for making polyurethane foam, the catalyst composition including a compound having a general formula R1R2R3N, wherein each of R1, R2 and R3 are independently selected from the group consisting of: a compound according to formula (I): wherein n=1 to 5; and R4, R5 and R6 are each independently hydrogen, methyl, ethyl and propyl groups; hydrogen, a C1-C6 alkyl group compound, a C1-C6 cycloalkyl group compound, a C1-C6 alkenyl group compound, a C1-C6 alkynyl group compound, a C1-C6 aryl group compound, and a C1-C6 aralkyl group compound, each group being substituted or unsubstituted; wherein at least one of R1, R2 and R3 is a compound according to formula (I). A polyurethane composition and method for forming a polyurethane foam are also disclosed.

Abstract: A film-shaped packaging material for a cell in which a coating layer is provided as the outermost layer instead of a substrate layer and an adhesive layer in a conventional film-shaped packaging material for a cell, thereby making it possible to produce a thinner film; wherein the packaging material is provided with exceptional moldability and insulation performance and enables lead time to be reduced. The packaging material is a laminate having at least a coating layer, a barrier layer, and a sealant layer in the stated order, the coating layer including a single- or multiple-layer configuration formed by a cured product of a resin composition containing a heat-curable resin and curing accelerator, the laminate having a piercing strength of at least 5 N, as measured in compliance with JIS 1707:1997, and the coating layer having a breakdown voltage of at least 1.0 kV, as measured in compliance with JIS C2110-1.

Abstract: Disclosed are a variety of amphoteric ester sulfonates, including 3-(N, N-dimethyl-cocoylpropylammonio-1-yl)-2-hydroxypropanesulfonate. These amphoteric ester sulfonates can be advantageously prepared in high yield and purity by a two-step chemoenzymatic process, and have excellent surfactant properties.

Abstract: An epoxy resin composition which exhibits excellent storage stability while having a low initial viscosity and favorable low temperature curability and an electro-conductive adhesive containing the same. An epoxy resin composition includes components (A) to (C): component (A): an epoxy resin (excluding the following component (B)); component (B): an epoxy resin having one epoxy group in a molecule and a surface tension of from 28.5 to 35.0 mN/m; and component (C): a latent curing agent.

Abstract: The present invention provides a heat-curable resin composition, which comprises (1) a heat-curable resin mixture comprising a heat-curable resin (a) and thickener particles (b) and exhibiting a viscosity (150° C.) after having been held at a temperature of 150° C. for 30 seconds that is a viscosity (S), and (2) a curing agent, and is characterized in that the heat-curable resin composition exhibits a lowest viscosity (R) at 80-120° C., the lowest viscosity (R) is 0.1-10 Pa·s, and the viscosity (S) and lowest viscosity (R) satisfy the relationship of formula (1): 5<S/R<200??formula (1).

Abstract: A phenol novolak resin having an excellent balance between the mold shrinkage of a composition containing the phenol novolak resin during heat curing and the modulus of elasticity at high temperature. A phenol novolak resin that is an alkyl phenol novolak resin produced by bonding alkyl phenol (I), in which an alkyl group having a carbon number of 4 to 8 is included as a substituent on an aromatic ring, to each other with a methylene group interposed therebetween, wherein the ratio (a)/(b) of a value (a) of integration from 146 to 148 ppm to a value (b) of integration from 146 to 153 ppm based on the 13C-NMR measurement is within the range of 0.05 to 0.30, and the area ratio of alkyl phenol (I) based on GPC measurement is within the range of 0.01% to 3.0%, a curable resin composition using the same, and a cured product thereof.

Abstract: The present invention relates to methods for recycling reinforced composites. The reinforced composite comprises a reinforcement material in a cross-linked polymer matrix, wherein the cross-linked polymer comprises a cross-linking group derived from a curing agent represented by formula I, wherein R1 is hydrogen, alkyl, cylcoalkyl, heterocycloalkyl, alkenyl, cycloalkenyl, aryl, heteroaryl, alkoxy alkyl or alkynyl; A is alkyl, alkenyl, alkenene, alkylene-hetero-alkylene, alkylene-heterocyclo-alkylene, alkylene, alkylene-oxy-alkylene, 1,4-alkyl substituted piperazine, carbonyl, thiocarbonyl; B is alkyl, alkenyl, alkenene, alkylene-hetero-alkylene, alkylene-heterocyclo-alkylene, alkylene, alkylene-oxy-alkylene, 1,4-alkyl substituted piperazine, carbonyl, thiocarbonyl; R2 is hydrogen, alkyl, aminoalkyl, alkyl-amino-alkyl, cylcoalkyl, heterocycloalkyl, alkenyl, aryl, or heteroaryl; and R3 is hydrogen, alkyl, aminoalkyl, alkyl-amino-alkyl, cylcoalkyl, heterocycloalkyl, alkenyl, aryl, or heteroaryl.

Abstract: A circuitized structure with a 3-dimensional configuration. A base structure is provided that includes an insulating substrate of electrically insulating material with a flat configuration, and further includes an electric circuit including at least one layer of electrically conductive material arranged on the insulating substrate. The insulating material includes a thermosetting material being partially cured by stopping a cure thereof at a B-stage before reaching a gel point. The base structure is formed according to the 3-dimensional configuration, and the cure of the thermosetting material is completed.

Abstract: The present invention relates to the use of substituted benzyl alcohols as modifiers in epoxy systems.

Abstract: Disclosed are a resin composition, and prepreg, laminate and copper clad laminate using the same, and degrading method thereof, the resin composition comprising: an epoxy resin, a degradable amine curing agent, a degradable mercaptan curing agent and an inorganic filler. A copper clad laminate manufactured by the resin composition comprises several pieces of stacked prepreg, and copper foil arranged at one side or two sides of stacked prepreg, each of the prepreg comprising a reinforced material and the resin composition adhered thereon after soaking and drying. The present invention mixes the degradable amine curing agent and the degradable mercaptan curing agent to obtain a curing system having an adjustable reaction rate, thus facilitating process control when manufacturing the copper clad laminate, and the manufactured copper clad laminate has high overall performance and is completely degradable, thus recycling and reusing each of the effective components.

Abstract: A composition containing an epoxide compound with two or more epoxide groups, a thiol ester with two or more ester groups and two or more thiol groups and/or a thiol ether with two or more thiol groups, and 0.005-2 wt. %, based on the total weight of the composition, of a tertiary amine which has a 5- or 6-membered aliphatic nitrogen heterocycle, said composition containing less than 1 wt. % of a primary amine. The composition can be used as an embedding medium for microscopy and as an adhesive and to an optical element which comprises the composition.

Abstract: An adhesive tape containing an adhesive comprising at least one polymer optionally a tackifier resin at least one reactive resin, the adhesive comprising at least 104 parts of the at least one reactive resin per 100 parts of polymer and tackifier resin at least one initiator and/or curing agent and/or accelerator where the adhesive is a pressure sensitive adhesive, the at least one polymer being present as continuous polymer phase in the uncured state of the pressure sensitive adhesive.

Abstract: Use of a curable composition comprising at least one epoxy resin and at least one epoxy curative composition as a curable shim for filling gaps between two assembled parts of an assembly, wherein the epoxy curative composition comprises at least a first and a second curative wherein the first curative is selected from a cyclic amine having at least one primary amino (—NH2) group and a second curative selected from at least one polyether polyamine comprising at least one polyether unit and separated therefrom by a linking group at least one polyamine unit and further comprising at least one terminal aminoalkyl residue that is branched and comprises a primary amino group (—NH2) and an alkyl branch in an ?-, ?- or ?-position to the primary amino group wherein the alkyl branch contains from 1 to 6 carbon atoms.

Abstract: A polyurea comprises at least urea base units of formula —NH—CO—NH— and additional units. The additional units comprise at least, on the one hand, a secondary alcohol functional group and, on the other hand, an ether, thioether or secondary amine functional group in the alpha position with respect to the secondary alcohol functional group. Such a polymer can be used as an adhesion primer for the adhesive bonding of a substrate, for example, glass or metal, to an unsaturated rubber or as corrosion-resistant protective coating for a metal substrate. Metal reinforcers, such as thread, cord, film or plate, coated can also be coated with such a polymer.

Abstract: Disclosed is a sealant composition, a liquid crystal device and a method for preventing liquid crystal contamination using the sealant composition. The sealant composition consists of 20-30 parts by weight of an ultraviolet polymerizable double bond monomer, 15-20 parts by weight of a heat polymerization monomer, 5-20 parts by weight of a polymerizable oligomer, 0.1-5 parts by weight of a photoinitiator, 10-20 parts by weight of a heat curing agent and 0-20 parts by weight of a particulate additive, wherein said polymerizable oligomer is poly(ethylene glycol) diacrylate or derivatives thereof. Through the reaction between the polymerizable oligomers and the polymer of the ultraviolet polymerizable double bond monomers to generate a reticular high molecular polymer, the anchoring effect of the polymer on the surrounding unreacted heat polymerization monomers is effectively enhanced, thereby reducing the contamination of the crystal liquid by the sealant.

Abstract: A sulphur-comprising polyaromatic polyamine compound can be used as a monomer or prepolymer, when n is different from zero, in the synthesis of polyurea. The compound corresponds to the formula (I): H2N—Ar1—NH—CH2—CH(OH)—(CH2)m—O—Z1—O—(CH2)m—CH(OH)—CH2—[X]n—HN—Ar2—NH2 in which X represents the string: —HN—Ar3—NH—(CH2)—CH(OH)—(CH2)m—O—Z2—O—(CH2)m—CH(OH)—(CH2)— and in which n represents an integer equal to zero or different from zero; m, which are identical or different, represent an integer within a range from 1 to 10; Z1 and Z2, which are identical or different, represent a divalent bonding group comprising from 1 to 30 carbon atoms; and Ar1, Ar2 and Ar3, which are identical or different, each represent a phenylene group, at least one of these phenylene groups bearing one, two, three or four groups of formula —Sx—R in which “x” is an integer from 1 to 8 and R represents hydrogen or a hydrocarbon group which can comprise a heteroatom and which comprises from 1 to 10 carbon atoms.

Abstract: Dental composition comprising a water-soluble polymerizable compound of the following formula (1): wherein A is a linear or branched linker group represented by the following formula (3), wherein the nitrogen atom of at least two of the termini forms an amide bond with an X moiety; wherein R? represents a hydrogen atom or a substituted or unsubstituted aliphatic or cycloaliphatic hydrocarbon group, wherein each R may be the same or different L1, L2, and L3 which may be the same or different, independently represent a single bond, or a C2-20 straight-chain, branched or cyclic hydrocarbon group optionally containing from 1 to 6 heteroatoms selected from nitrogen and oxygen in the backbone of the hydrocarbon group, and optionally from 1 to 6 functional groups selected from carboxylic acid groups or a salt thereof, hydroxyl groups, thiol groups and amino groups, and in case a plurality of L1 and L2 are present, each of L1 and L2 may be the same or different; Q1 and Q2, which may be the same or different, independ

Abstract: Disclosed is a sealant composition, a liquid crystal device and a method for preventing liquid crystal contamination using the sealant composition. The sealant composition consists of 20-30 parts by weight of an ultraviolet polymerizable double bond monomer, 15-20 parts by weight of a heat polymerization monomer, 5-20 parts by weight of a polymerizable oligomer, 0.1-5 parts by weight of a photoinitiator, 10-20 parts by weight of a heat curing agent and 0-20 parts by weight of a particulate additive, wherein said polymerizable oligomer is poly(ethylene glycol) diacrylate or derivatives thereof. Through the reaction between the polymerizable oligomers and the polymer of the ultraviolet polymerizable double bond monomers to generate a reticular high molecular polymer, the anchoring effect of the polymer on the surrounding unreacted heat polymerization monomers is effectively enhanced, thereby reducing the contamination of the crystal liquid by the sealant.

Abstract: The method includes disposing semiconductor chips on a package substrate having sawing lines, forming an encapsulant to cover the semiconductor chips on the package substrate, forming a package assembly by a first curing of the encapsulant, forming first grooves by cutting the encapsulant along the sawing lines, performing a second curing of the encapsulant, and dividing the package assembly into unit semiconductor packages by cutting the package substrate along the sawing lines and forming second grooves to overlap the first grooves.

Abstract: The present invention provides a curable resin composition that can provide a cured material excellent in insulation reliability while maintaining adhesiveness and provide a composition for forming a solder resist, a dry film and a printed wiring board, a laminate having a resin insulating layer excellent in insulation reliability while maintaining adhesiveness, a dry film for forming this and a process for preparing a laminate using the dry film. The curable resin composition contains (A) an imidazole-isocyanate adduct, (B) a carboxyl group-containing resin and (C) a thermosetting resin. The above laminate has a substrate and a plurality of resin insulating layers formed on the substrate, in which one of the plural resin insulating layers in contact with the substrate is a layer formed of the curable resin composition.

Abstract: A heat curable sheet-like adhesive for an organic EL panel, comprising components (A) to (C), which has tack in the surface of a composition comprising the components (A) to (C) at 25° C.: the component (A): a film forming component having an epoxy equivalent of 7000 to 20000 g/eq and having compatibility with the component (B); the component (B): an epoxy resin having an epoxy equivalent of 150 to 5000 g/eq and comprising 0 to 20% by weight of a solid epoxy resin at 25° C. with respect to the whole of the component (B); and the component (C): an encapsulated epoxy adduct-type latent curing agent.

Abstract: The present disclosure relates to an isocyanate terminated saturated hydrocarbon polymer that can be used as a crosslinking agent in a coating composition. The coating composition can provide a composition that adheres well to resinous substrates. Also provided are coating composition comprising the crosslinking agent and methods for producing the adherent coating composition.

Abstract: A modified novolak phenolic resin is obtained by reacting a novolak phenolic resin containing at least 50 wt % of p-cresol with a crosslinker. This method increases the molecular weight of the existing novolak phenolic resin containing at least 50 wt % of p-cresol to such a level that the resulting modified novolak phenolic resin has heat resistance enough for the photoresist application.

Abstract: Epoxy adhesive compositions contain a heat-activatable catalyst. The heat-activatable catalyst includes a tertiary amine catalyst and a novolac resin that has a weight average molecular weight of at least 3000. One-component epoxy adhesive formulations that contain the heat-activatable catalyst have unexpectedly good storage stability.

Abstract: A modified novolak phenolic resin is obtained by reacting a novolak phenolic resin containing at least 50 wt % of p-cresol with a crosslinker. This method increases the molecular weight of the existing novolak phenolic resin containing at least 50 wt % of p-cresol to such a level that the resulting modified novolak phenolic resin has heat resistance enough for the photoresist application.

Abstract: The disclosure relates to solving problems associated with conventional latent epoxy curing agents by providing a new class of latent epoxy curing agents. In particular, the disclosure relates to epoxy curing agents with improved storage stability and low use level (e.g., less than about 10 wt % relative to the epoxy compound) by forming solid solutions of certain classes of amines in polyphenolic resins.

Abstract: Provided are an organic binder for a mold, which can advantageously extend the pot life without causing uneven curing, reduction in mold strength and an increase in the amount of use of a catalyst; a molding sand composition which is obtained by using the organic binder for a mold, and which exhibits an extended pot life; and a mold produced by curing such a molding sand composition through gas hardening. The urethane-curable type organic binder for a mold, which is used for production of a urethane-based mold, is constituted by comprising a specific alkoxysilyl group-containing ketimine compound, together with a polyol compound and a polyisocyanate compound.

Abstract: A multifunctional aromatic amine hardener composition including the reaction condensation product of (a) at least one aniline and (b) at least one non-aromatic cyclic dicarboxaldehyde; and a reactive thermosettable resin composition including (i) at least one multifunctional aromatic amine hardener composition curing agent, (ii) at least one thermoset resin, and optionally (c) at least one catalyst; and a process for preparing a thermoset product from the thermosettable composition. The hardener composition above and a thermoset resin may be used to prepare a thermoset product with improved thermo-mechanical behavior.

Abstract: The present invention provides a composition which comprises at least one epoxy resin and a mixture comprising the 7 stereoisomers of diaminomethylcyclohexane in very specific ratios relative to one another, a process for preparing the composition, the use of the composition for producing hardened epoxides, adhesives, composite materials and moldings, a mixture comprising the 7 stereoisomers of diaminomethylcyclohexane in the specific ratios, and the use of this mixture for producing the composition.

Abstract: The invention relates to a process for preparing a reinforced and reactive thermoplastic composition having a continuous phase which is based on at least one thermoplastic polymer and dispersed in which is a discontinuous phase based on at least one reactive reinforcing agent that may be immiscible with said at least one thermoplastic polymer, and also to a composition obtained by this process.

Abstract: This invention relates to an epoxy resin composition, in particular a curable phosphorus containing flame retardant epoxy resin composition comprising epoxy resin and an epoxy resin chain-extending amount of a diaryl alkylphosphonate and/or diaryl arylphosphonate and a cross-linking agent. The curable flame retardant compositions are useful in e.g., printed wiring boards or molding compounds for electronic applications, protective coatings, adhesives, as well as structural and decorative composite materials.

Abstract: Aromatic polycyanate compounds which comprise cycloaliphatic moieties, a process for the production thereof and resins and thermoset products which are based on these compounds.

Abstract: A curing agent composition including at least one benzylated polyamine compound. The benzylated polyamine compound is a reaction product of a benzaldehyde compound or benzyl halide compound and a polyamine according to the following formula: H2N—CH2-A-CH2-NH2 where A is a phenylene group or a cyclohexylene group. A method for making the curing agent composition and an amine-epoxy composition are also disclosed.

Abstract: This invention discloses cationic electrodeposition paint compositions which comprise specific amino group-containing modified epoxy resin, specific xylene-formaldehyde resin-modified, amino group-containing epoxy resin and blocked polyisocyanate curing agent at specific blend ratios, and which can form coating film of excellent film thickness retention, finished appearance and electrocoatability on galvanized alloy steel sheet and of good corrosion resistance, even when the amount of volatile organic compound in the cationic electrodeposition paint is reduced.

Abstract: A solder resist having both adequate sensitivity at photo-irradiation and alkali developability, and the solder resist forming a cured product which is excellent in dimensional stability against temperature change, does not exhibit brittleness, and further, is excellent in water resistance, electrical insulation, thermal cycle test resistance (TCT resistance) and the like is provided, and further, a dry film having a solder resist layer, a cured product and a printed wiring board are provided. The solder resist comprising an acid-modified vinyl ester synthesized from an epoxy compound, a phenol compound, an unsaturated monobasic acid and a polybasic acid anhydride, wherein the epoxy compound contains a crystalline epoxy resin having a melting point of 90° C. or more, and the phenol compound contains a compound having a bisphenol S structure.

Abstract: The present invention provides a rubber composition capable of forming an inner tube and/or an outer cover having high adhesion to a brass-plated wire and having excellent heat resistance, and oil resistance in a hose using a brass-plated wire as a reinforcing layer. The rubber composition includes 100 parts by mass of a rubber component (A) that includes ethylene-(meth)acrylate copolymer rubber and/or hydrogenated acrylonitrile-diene copolymer rubber, 1 to 30 parts by mass of a phenol resin (B), 1 to 30 parts by mass of silica (C), 0.1 to 5 parts by mass of a triazine compound (D) represented by the following formula (I), and 1 to 15 parts by mass of an organic peroxide (E) (in the formula (I), R represents a mercapto group, alkoxy group, monoalkylamino group, dialkylamino group, monocycloalkylamino group, dicycloalkylamino group, or N-alkyl-N-arylamino group).

Abstract: The subject matter of the present Application is two-component compositions whose first component is a mixture of reactive epoxy resins and optionally further formulation constituents which contains, based on the mass of all epoxy resins, a) at least 10 wt % of an epoxy group-containing reaction product of epichlorohydrin with polypropylene glycol which has an epoxy equivalent weight of at least 250 g/eq, and b) at least 10 wt % of an epoxy group-containing reaction product of epichlorohydrin with a novolac resin which has an epoxy equivalent weight of at least 175 g/eq, and whose second component contains at least one thiol group-containing hardener for epoxy resins.

Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.

Abstract: A tire having a strip layer between breaker and ply using a rubber composition for a strip layer between breaker and ply capable of improving tensile strength at break and elongation at break, capable of also lessening the lowering rate of fracture property after thermal aging, and also being excellent in separation resistance property is provided. A tire having a strip layer between breaker and ply using a rubber composition for a strip layer between breaker and ply comprising (A) 2.0 to 3.9 parts by mass of sulfur, (B) 0.5 to 4 parts by mass of a cresol resin, a modified cresol resin, resorcinol or a modified resorcinol condensate and (C) 0.3 to 3 parts by mass of a partial condensate of hexamethylolmelaminepentamethylether or a partial condensate of hexamethoxymethylolmelamine, based on 100 parts by mass of a diene rubber component, wherein the thickness of the strip layer between breaker and ply is 0.3 to 3.9 mm.

Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.

Abstract: The invention relates to a modified hydrocarbylphenol-aldehyde resin prepared by reacting a hydrocarbylphenol-aldehyde resin with a primary or secondary amine and further with an epoxide. The invention also provides a process for preparing a modified, hydrocarbylphenol-aldehyde resin and a rubber composition containing such resin.

Abstract: The present invention relates to a polyurethane-based binder using isocyanates containing uretonimine and/or carbodiimide groups for producing cores and casting molds, to a mold material mixture containing the binder, and to a method using the binder for producing casting molds.

Abstract: The invention relates to a modified hydrocarbylphenol-aldehyde resin prepared by reacting a hydrocarbylphenol-aldehyde resin with a primary or secondary amine and further with an epoxide. The invention also provides a process for preparing a modified, hydrocarbylphenol-aldehyde resin and a rubber composition containing such resin.

Abstract: Adhesive compositions having a reduced cure time and methods for making and using same are provided. In at least one specific embodiment, the adhesive composition can include a mixture of one or more phenolic-aldehyde resins and one or more cure accelerants. The one or more cure accelerants can be selected from the group consisting of: ammonia, ammonium hydroxide, one or more primary amines, one or more secondary amines, one or more tertiary amines, one or more alkanolamines, one or more aromatic amines, one or more polyamines, one or more amides, one or more polyamides, one or more compounds containing at least one amine functional group and at least one sulfur functional group, and any mixture thereof. In one or more embodiments, the adhesive composition can also include one or more hardeners.