Abstract: A varnish composition includes (1) a benzoxazine resin having highly symmetric molecular structure; (2) at least one of naphthol novolac resins, aniline novolac resins and phenolic novolac resins; (3) fillers. The benzoxazine resin having highly symmetric molecular structure, and the at least one of naphthol novolac resins, aniline novolac resins and phenolic novolac resins contribute to increase the glass transition temperature of the varnish composition, while decrease the coefficient of thermal expansion and moisture absorbability due to their small and highly symmetric molecular structures. A copper substrate can meet the requirement of high glass transition temperature (TMA?200° C.) and low coefficient of thermal expansion (?1/??30/135 (?m/m° C.). Therefore, the composition of the invention can be widely used as high-performance electronic material.

Abstract: The present invention provides N,N?-dimethyl secondary diamine polymers including methylamine-terminated poly-(N-methylazetidine) and methylamine-terminated poly-(N-methylazacycloheptane). Amine compositions and amine-epoxy compositions comprising N,N?-dimethyl secondary diamine polymers are also disclosed.

Abstract: The present invention discloses both amine compositions and amine-epoxy compositions containing N,N?-dimethyl-meta-xylylenediamine. A novel process for producing amines such as N,N?-dimethyl-meta-xylylenediamine, and structurally similar amines, is also disclosed.

Abstract: Disclosed is a photosensitive novolac resin including a structural unit represented by the following Chemical Formula 1 and structural unit represented by the following Chemical Formula 2, wherein R11, R12, R13, and R14 in Chemical Formulae 1 and 2 are the same as defined in the detailed description, a positive photosensitive resin composition including the same, a photosensitive resin film fabricated using the same, and a semiconductor device including the photosensitive resin composition.

Abstract: Compounds having the formula (I) wherein L is a linking group, at least one of R1 to R10 comprises the group C?N, at least one of R1 to R5 and at least one of R6 to R10 comprise the group NH2 for use as curing agents in an epoxy resin, together with a process for their synthesis and composites comprising the curing agents.

Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.

Abstract: A modified novolak phenolic resin is obtained by reacting a novolak phenolic resin containing at least 50 wt % of p-cresol with a crosslinker. This method increases the molecular weight of the existing novolak phenolic resin containing at least 50 wt % of p-cresol to such a level that the resulting modified novolak phenolic resin has heat resistance enough for the photoresist application.

Abstract: Epoxy adhesive compositions contain a heat-activatable catalyst. The heat-activatable catalyst includes a tertiary amine catalyst and a novolac resin that has a weight average molecular weight of at least 3000. One-component epoxy adhesive formulations that contain the heat-activatable catalyst have unexpectedly good storage stability.

Abstract: A thermoplastic molding composition, comprising 10 to 98.99% of a thermoplastic polyester, 0.01 to 20% of a hyperbranched polycarbonate, and/or hyperbranched AxBy polyester, wherein Ax and By are different monomers and indices x and y are functional groups in A and B, x is at least 1.1 and y at least 2.1; 1 to 60% of a graft polymer comprising 20 to 80% of a graft base comprising an elastomeric polymer based on alkyl acrylates, 20 to 80% of a graft of 60 to 95% of styrene or of substituted styrenes of formula 1 R is an alkyl radical or hydrogen, R1 is an alkyl radical, n is 1-3, and 5 to 40% by weight of an unsaturated nitrite, 0 to 60% of a copolymer comprising, 60 to 95 of styrene and/or substituted styrenes of formula 1, 5 to 40% of an unsaturated nitrile, 0 to 60% of other additives.

Abstract: The subject matter of the present Application is two-component compositions whose first component is a mixture of reactive epoxy resins and optionally further formulation constituents which contains, based on the mass of all epoxy resins, a) at least 10 wt % of an epoxy group-containing reaction product of epichlorohydrin with polypropylene glycol which has an epoxy equivalent weight of at least 250 g/eq, and b) at least 10 wt % of an epoxy group-containing reaction product of epichlorohydrin with a novolac resin which has an epoxy equivalent weight of at least 175 g/eq, and whose second component contains at least one thiol group-containing hardener for epoxy resins.

Abstract: The present invention provides novel phosphinated compounds of monofunctional, bifunctional, multifunctional phenols represented by the following formulae and their derivatives, and preparation methods thereof:

Abstract: The present invention relates to non-aging, impact-modified polycarbonate compositions and molding compositions comprising: A) from 60 to 86 parts by weight (based on the sum of components A+B+C) of aromatic polycarbonate and/or aromatic polyester carbonate, B) from 4 to 12 parts by weight (based on the sum of components A+B+C) of graft polymer comprising: B.1 from 10 to 50 wt. % (based on the graft polymer B) of a shell of at least one vinyl monomer, and B.2 from 90 to 50 wt. % (based on the graft polymer B) of a graft base of silicone-acrylate composite rubber, C) from 10 to 30 parts by weight (based on the sum of components A+B+C) of a polymer or copolymer based on vinyl monomer, and D) from 0 to 20 parts by weight of polymer additives. Components B and C are present in a ratio of the parts by weight of B:C in the range from 1:1.3 to 1:3.5.

Abstract: A multi-component curable composition which is reactive upon admixing of the components and wherein the composition comprises a first component which comprises a first amine functional adduct and a second amine functional adduct; and a second component which comprises at least one compound having an average of more than 2.0 groups per molecule which are reactive with amines.

Abstract: A multi-component curable composition which is reactive upon admixing of the components and wherein the composition comprises: A. a first component which comprises: (i) a first amine functional adduct which comprises the reaction product of a stoichiometric excess of a diamine and a compound having an epoxide group and an alpha, beta unsaturated carbonyl group; B. a second component which comprises: (i) at least one compound having an average of more than 2.0 groups per molecule which are reactive with amines.

Abstract: A process for applying a coating to a substrate and broadcasting solid decorative or protective materials onto the liquid surface of the coating before it completely cures or dries, wherein the coating is a multi-component curable composition which is reactive upon admixing of the components and wherein the composition comprises at least a first amine functional adduct and at least one compound reactive with amines.

Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.

Abstract: The object of the present invention is to provide an adhesive composition which can form a thinner adhesive layer, which has good storage stability and which can actualize high package reliability even when exposed to severe reflow conditions in a semiconductor package in which a semiconductor chip being reduced in a thickness is mounted, and an adhesive sheet having an adhesive layer comprising the adhesive composition. The adhesive composition of the present invention comprises an epoxy thermosetting resin (A), a thermosetting agent (B) and a thermosetting accelerating agent (C); the thermosetting accelerating agent (C) being soluble in methyl ethyl ketone and inactive as a thermosetting accelerating agent at room temperature.

Abstract: The use of 1,3-substituted imidazolium salts of the formula I in which R1 and R3 independently of one another are an organic radical having 1 to 20 C atoms, R2, R4, and R5 independently of one another are an H atom or an organic radical having 1 to 20 C atoms, it also being possible for R4 and R5 together to form an aliphatic or aromatic ring, and X is a dicyanamide anion as latent catalysts for curing compositions comprising epoxy compounds.

Abstract: A prepreg composite material that includes a fiber layer and a resin comprising a thermoset resin component, a curing agent and a fibrous micropulp. The micropulp component is an aramid fiber having a volume average length of from 0.01 to 100 micrometers. The prepreg is useful in composite panel construction for minimizing fluid permeation into the cured structure. This prepreg is particularly suitable for making honeycomb sandwich panels. Film adhesives, liquid and paste resins containing aramid fiber micropulp are also disclosed.

Abstract: An abrasive product includes a plurality of abrasive particles and a resin cured with a polythiol group. A method of preparing the abrasive product includes contacting the plurality of abrasive particles with a curable composition that includes a resin and a polythiol group, and curing the curable composition to produce the abrasive product. A method of abrading a work surface includes applying an abrasive product to a work surface in an abrading motion to remove a portion of the work surface. A curable composition includes a formaldehyde resin and a polythiol group. A formaldehyde resin is crosslinked by a polythiol group. A method of crosslinking the formaldehyde resin includes reacting the polythiol group with the formaldehyde resin.

Abstract: A composition for preparing a halogen-free resin is provided, the composition including a halogen-free phosphorated epoxy, a urethane-modified copolyester, a curing agent, a filler, a surfactant, and a solvent. A halogen-free prepreg is also provided, including a glass fabric cloth and a halogen-free resin layer on the glass fabric. The halogen-free resin layer is made from the foregoing halogen-free resin.

Abstract: A composition comprising a reaction product of reactants comprising (a) a compound comprising (i) a polysulfide moiety and (ii) an oxygen atom in a ?-position to a sulfur link having the formula: where each R is independently selected from H or a C1 to C20 organyl group, R? is independently selected from a C1 to C20 organyl group, R?? is independently selected from H or a C1 to C20 organyl group, and x has an average of greater than 2, (b) a compound comprising a nucleophilic moiety; and (c) a compound comprising a moiety reactive to active hydrogen.

Abstract: Phosphorus-containing compounds are disclosed which are obtainable by reacting: (A) at least one organophosphorus compound having a group selected from the group H—P?O; the group P—H and the group P—OH; and (B) at least one compound having the following Formula (I): [R?(Y)m?]m(X—O—R?)n??Formula (I) wherein R? is an organic group; Y is a functional group selected from the group consisting of hydroxy, carboxylic acid, and amine; X is a hydrocarbylene group; R? is hydrogen or a hydrocarbyl group having from 1 to 8 carbon atoms, R is alkyl or aryl group having from 1 to 12 carbon atoms; m?, m and n are, independently, numbers equal to or greater than 1. These compounds are useful for making flame retardant epoxy and polyurethane resins and ignition resistant thermoplastic resins, each of which is useful for a variety of end uses requiring flame retardancy or ignition resistance. Flame retardant epoxy resins may be used to make electrical laminates.

Abstract: An amine functional adduct is obtained by admixing a stoichiometric excess of a cycloaliphatic diamine and a compound having an epoxide group and an alpha, beta unsaturated carbonyl group.

Abstract: The invention provides an improvement to the useable lifetimes of phenolic-epoxy, phenolic-benzoxazine, phenolic-epoxy-benzoxazine mixtures and other phenolic mixtures through the use of protected phenolics, where a phenolic compound, polymer, or resin is released on demand by the addition of a deblocking agent.

Abstract: The invention provides a benzoxazine resin composition having excellent resistance to heat and moisture and providing excellent handleability when made into prepreg, and prepreg and a fiber-reinforced composite material prepared from the composition. The composition contains (A) a compound having in its molecule a benzoxazine ring represented by the formula (1), (B) an epoxy resin, (C) a curing agent, and (D) a toughness improver: (R1: C1 to C12 chain alkyl group, etc., and H is bonded to at least one of C of the aromatic ring at o- or p-position to the carbon atom to which the oxygen atom is bonded).

Abstract: A method of preparation for a layer of material for use with a power and/or telecommunications cable includes mixing a composition including a thermoplastic polymer matrix and a phenolic resin. The phenolic resin is selected from the group consisting of novolac phenol-formaldehyde resins and novolac cyanate ester resins. The phenolic resin is hardened within the thermoplastic polymer matrix to obtain nodules of hardened phenolic resin dispersed throughout the material.

Abstract: An active-hydrogen-containing (carboxyl or hydroxyl) phosphorus compound is provided. An epoxy resin semi-thermoset formed by bonding the phosphorus compound to an epoxy group is also provided. A flame-retardant epoxy resin thermoset is formed after reacting the epoxy resin semi-thermoset with a curing agent. The epoxy resin thermoset possesses excellent flame retardancy, heat stability, and high glass transition temperature (Tg), does not produce toxic and corrosive fumes during combustion, and thus is an environmentally friendly flame-retardant material.

Abstract: The present invention relates to modified phenolic resins which contain silicic acid ester units. The modified phenolic resins may, for example, be used as components of a foundry binder system. The invention also relates to a method for producing such modified phenolic resins and to two-component binder systems which contain these modified phenolic resins. The invention furthermore relates to methods for producing foundry molds and foundry cores which contain the modified phenolic resins, and to the foundry molds and foundry cores themselves.

Abstract: The present invention relates to modified phenolic resins which contain silicic acid ester units. The modified phenolic resins may, for example, be used as components of a foundry binder system. The invention also relates to a method for producing such modified phenolic resins and to two-component binder systems which contain these modified phenolic resins. The invention furthermore relates to methods for producing foundry molds and foundry cores which contain the modified phenolic resins, and to the foundry molds and foundry cores themselves.

Abstract: The present invention provides a brominated epoxy resin, which has a molecular segment of low polarity in the polymer chain, while the molecular segment of low polarity is attributed to the symmetric or saturated cyclic alphatic molecular structure with low “molecular dipole moment” characteristics; making a printed circuit board for high frequency signal transformation applications needs a proper copper clad laminate which processes the properties of a low dielectric constant and of a low dissipation factor; a copper clad laminate can meet above requirements by using the inventive resin as a laminate binder. The inventive resin is prepared by the following steps: 1. Reacting a 2,6-disubstituted mono-phenol compound (A) with an aldehyde or a cyclic diene compound (B), so as to obtain a bisphenol compound (C) having a high symmetry or saturated aliphatic heterocyclic structure; 2.

Abstract: The invention relates to a modified hydrocarbylphenol-aldehyde resin prepared by reacting a hydrocarbylphenol-aldehyde resin with a primary or secondary amine and further with an epoxide. The invention also provides a process for preparing a modified, hydrocarbylphenol-aldehyde resin and a rubber composition containing such resin.

Abstract: A composition comprising one or more siloxane cross-linked demulsifiers wherein said siloxane cross-linked demulsifiers are prepared by reacting one or more alkylphenol-formaldehyde resin alkoxylates, one or more polyalkylene glycols, or a mixture thereof, with up to about 1.0 molar equivalents of one or more silicon-based cross-linkers of formula R1R2R3R4Si wherein R1, R2, R3, R5, R6 and R7 are independently selected from H, Cl, C1-C4 alkyl and C1-C4 alkoxy; R4. is selected from H, Cl, C1-C4 alkyl, C1-C4 alkoxy and a group of formula L1SiR5R6R7; L1 is absent or is selected from —O—, arylene and C1-C12 alkylene, optionally interrupted by one or more —O— or —N(R8)—; and R8 is H or C1-C4 alkyl and a method of using the demulsifier composition to resolve water-in-oil emulsions.

Abstract: A new class of compounds, namely diamino alcohols, is described, along with a process for their production and their use as hardeners, or curing agents, for epoxy resin systems, some of which have high glass transition temperatures, Tgs, such as greater than about 120° C.

Abstract: A redispersible polymer powder including: a polymer to be redispersed; and an ortho-cresol based condensation product or salt thereof; wherein the ortho-cresol based condensation product or salt thereof includes N-containing units derived from a N-based component incorporated into the ortho-cresol based condensation product or salt thereof during polymerization.

Abstract: Aromatic polycyanate compounds which comprise cycloaliphatic moieties, a process for the production thereof and resins and thermoset products which are based on these compounds.

Abstract: One aspect of the current invention is a halogen containing epoxy composition and a method of producing the same. A functional halogen group, fluorine in one case, is incorporated into an epoxy coating by using a functionalized amine curing agent in small amounts. Functionalized amine curing agents are cheaper and easier to produce from small amine precursors when compared to the cost and complexity of functionalizing bulky epoxy resins. Amine curing agents are incorporated into a cured epoxy network. However, many functional groups will affect the reactivity of the curing reaction due to electronegativity effects. By using small amounts of functionalized amines with a large amount of non-functionalized agent, the effect is small and in the case of migration, it can be advantageous for tribological, mechanical and other properties of epoxies and epoxy-containing materials.

Abstract: Composition comprising as component A) a 1-imidazoly[mothyl-substituted 2-naphthol compound of the general formula (I) where R1, R2 and R3 each independently of one another are H; C1-17alkyl; C3-12cycloalkyl, optionally substituted by c1-4alkyl groups; C4-20cycloalkyl-alkyl, optionally substituted by C1-4alkyl groups; C6-10aryl, optionally substituted by 1-3 C1-4-alkyl groups; C7-15,phonylalkyl, optionally substituted by 1-3 C1-4alkyl groups; C3-17alkenyl; C3-12alkynyl; or aromatic or aliphatic C3-12acyf; R4, R5, R6, R7, R8, and R9 each independently of one another are H; C1-12alkyl; C3-12cycloalkyl, optionally substituted by C1-4alkyl groups; C4-20cycloalkyl-alkyl, optionally substituted by C1-4alkyf groups; C6-10aryl, optionally substituted by 1-3 C1-4alkyl groups; C7-15phenylalkyl, optionally substituted by 1-3 C1-4alkyl groups; C3-17alkenyl; C3-12alkynyl; C1-12alkoxy; or OH; and as component B) a phenol which is liquid at room temperature, the weight ratio of component A) to component B) being from 10:90

Abstract: The invention relates to a liquid resin composition intended for manufacturing abrasives that comprises at least one novolac resin having a glass transition temperature less than or equal to 60° C., at least one reactive diluent and optionally at least one crosslinking agent. Application of the resin composition for producing abrasive articles, especially bonded abrasives and coated abrasives. It also relates to the abrasive articles comprising abrasive grains connected by such a liquid resin composition.

Abstract: The present invention provides an aqueous emulsion resin composition which comprises: (a) a resin composition containing at least one fluoroolefin polymer having crosslinkable group(s) at a terminus and/or a side chain of its molecule and at least one non-fluoroolefin polymer having crosslinkable group(s) at a terminus and/or a side chain of its molecule; and (b) at least one curing agent selected from the group consisting of isocyanates, melamines, hydrazides, carbodiimides, silanes and epoxides; and provides an aqueous emulsion resin compositions containing at least one chemically bonded product of a fluoroolefin polymer and a non-fluoroolefin polymer bonded to each other via at least one covalent bond at a terminus and/or a side chain of the molecules wherein one or both of the fluoroolefin polymer and the non-fluoroolefin polymer have crosslinkable group(s).

Abstract: The present invention relates to a liquid resin intended more particularly for the sizing of mineral fibers which exhibits a dilutability in water at 20° C. at least equal to 1 000% and a level of free formaldehyde preferably of less than 0.4%, expressed as total weight of liquid, this resin being characterized in that it is composed essentially of condensates obtained from a phenolic compound, from formaldehyde and from an aminoalcohol according to the Mannich reaction. The invention also relates to a sizing composition including said resin, to the mineral fibers sized by means of this composition and to the products formed from the mineral fibers, in particular for thermal and/or sound insulation.

Abstract: Curing agent for epoxy resins, comprising A) 1-99 wt % of an adduct obtainable by reaction of a1) a polyethylene polyamine having up to five nitrogen atoms in the molecule, with a2) a monoglycidylether, wherein the adduct of a1) and a2) is isolated by removing the excessive polyethylene-polyamine, and B) 99-1 wt % of an amine compound having at least two reactive amine hydrogen atoms in the molecule, as well as curable compositions additionally comprising an epoxy compound and the use of said curable compositions for the preparation of moulded articles and sheet materials, as well as for applications in the field of adhesives and sealing compounds.

Abstract: Special amine compositions comprising a) 30-70% by weight of a polyetherdiamine of the general formula (I) in which n is from 10 to 70, b) 3-30% by weight of a monoamine of the general formula R1—NH2, in which R1 is the straight-chain or branched, saturated or preferably unsaturated radical of a hydrocarbon having 5 to 22 carbon atoms or of a monofunctional polyetheramine having a molecular weight of up to 400 g/mol and c) 3-30% by weight of a di- or triamine and d) 5-40% by weight of an alkylphenol of the general formula (II) in which R2 is the straight-chain, branched or cyclic, saturated or unsaturated radical of a hydrocarbon having 5 to 14 carbon atoms, and curable epoxy resin compositions comprising these special amine compositions, the use of which results in thermosets which have a low degree of crosslinking, are resilient even at low temperatures and are resistant to chemical compositions, and the production of shaped articles and coatings using these curable compositions.

Abstract: Stable dispersions of phenolic resins, particularly bisphenol-A/formaldehyde resins, for use in e.g., baking enamels, coatings, adhesives, binders, etc., are disclosed. The dispersions have low levels (e.g., <0.1% by weight) of free aldehyde, thereby reducing environmental harms associated with aldehyde emissions. Low free aldehyde levels are achieved using melamine as an aldehyde scavenger during preparation. It has now been discovered that melamine, in contrast to other scavengers of aldehydes, does not adversely affect dispersion stability, interfere with later processing operations, or negatively impact the final resin product quality (e.g., after curing).

Abstract: The present invention provides N,N?-dimethyl secondary diamine polymers including methylamine-terminated poly-(N-methylazetidine) and methylamine-terminated poly-(N-methylazacycloheptane). Amine compositions and amine-epoxy compositions comprising N,N?-dimethyl secondary diamine polymers are also disclosed.

Abstract: The present invention concerns a composition containing: an aqueous dispersion of at least one phenol-formaldehyde resin; at least one amine compound, wherein the molecular mass of the amine compound does not exceed approximately 20 000 g/mole, at least one activated silane, as well as at least one aromatic hydroxyl compound. The composition may be employed as a formaldehyde-free binder for the manufacture of mineral wool.

Abstract: One aspect of the current invention is a halogen containing epoxy composition and a method of producing the same. A functional halogen group, fluorine in one case, is incorporated into an epoxy coating by using a functionalized amine curing agent in small amounts. Functionalized amine curing agents are cheaper and easier to produce from small amine precursors when compared to the cost and complexity of functionalizing bulky epoxy resins. Amine curing agents are incorporated into a cured epoxy network. However, many functional groups will affect the reactivity of the curing reaction due to electronegativity effects. By using small amounts of functionalized amines with a large amount of non-functionalized agent, the effect is small and in the case of migration, it can be advantageous for tribological, mechanical and other properties of epoxies and epoxy-containing materials.

Abstract: The present invention provides curing agent compositions comprising benzylated polyalkylene polyamine compounds. Amine-epoxy compositions and articles produced from these amine-epoxy compositions are also disclosed.

Abstract: The invention provides an electrically conductive polyaniline composition comprising polyaniline which contains at least one of novolac resins selected from the group consisting of phenolsulfonic acid novolac resin and naphtholsulfonic acid novolac resin as a dopant. The electrically conductive polyaniline composition is obtained by contacting polyaniline with an aqueous solution of the novolac resin to dope the polyaniline with the novolac resin. The invention further provides an electrically conductive polyaniline film which comprises the polyaniline containing the novolac resin as a dopant. The electrically conductive polyaniline film is obtained by contacting film of polyaniline with an aqueous solution of the novolac resin to dope the polyaniline.

Abstract: A composition comprising (A) an epoxide containing at least two epoxy groups per molecule, (B) a polyol containing at least two hydroxy groups per molecule or a primary or secondary amine containing at least two amino-hydrogen atoms per molecule, and (C) a solid compound containing at least two isocyanate groups, exhibits high storage stability and is useful as protective coating or adhesive.