Mixed With Nitrogen-containing Chemical Treating Agent Patents (Class 525/504)
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Patent number: 7501461Abstract: One aspect of the current invention is a halogen containing epoxy composition and a method of producing the same. A functional halogen group, fluorine in one case, is incorporated into an epoxy coating by using a functionalized amine curing agent in small amounts. Functionalized amine curing agents are cheaper and easier to produce from small amine precursors when compared to the cost and complexity of functionalizing bulky epoxy resins. Amine curing agents are incorporated into a cured epoxy network. However, many functional groups will affect the reactivity of the curing reaction due to electronegativity effects. By using small amounts of functionalized amines with a large amount of non-functionalized agent, the effect is small and in the case of migration, it can be advantageous for tribological, mechanical and other properties of epoxies and epoxy-containing materials.Type: GrantFiled: April 12, 2005Date of Patent: March 10, 2009Assignee: University of North TexasInventors: Bryan Bilyeu, Witold Brostow, Kevin Menard
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Patent number: 7495060Abstract: The present invention has an object to provide curatives for epoxy resins and curing accelerators for epoxy resins, which both have improved subliming and decomposing properties and which, when mixed with an epoxy resin, enable the mixture to be greatly improved in thermal stability that is extremely important for the control of a curing reaction and to have a prolonged pot life (stability as a one-pack mixture comprising the epoxy resin, curative, etc.) and improved curability at low temperatures.Type: GrantFiled: August 25, 2006Date of Patent: February 24, 2009Assignee: Nippon Soda Co., Ltd.Inventors: Hiroshi Suzuki, Satoru Abe, Midori Aoki, legal representative, Izuo Aoki
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Patent number: 7470752Abstract: Low-cure powder coating compositions are disclosed, comprising at least one epoxy-containing resin and/or at least one siloxane-containing resin, and at least one material having the structure wherein R1 is an organic radical having 6 to 25 carbon atoms; each R2 is independently a multivalent hydrocarbon group having 1 to 20 carbon atoms; Y is each R3 and R4 are independently alkyl or aryl groups having 1 to 8 carbon atoms; each Z is independently oxygen or nitrogen; R5 is absent when Z is oxygen and R5 is hydrogen, an alkyl or aryl group having 1 to 20 carbon atoms, or (Y)a—R2— when Z is nitrogen; a and b are integers; a is at least 1; b is 1 to 3; and (b) at least one epoxy-containing resin and/or at least one siloxane-containing resin. The material can optionally be reacted with an acidic hydrogen-containing compound. Some compositions are curable without using crosslinking agents or accelerators.Type: GrantFiled: June 7, 2006Date of Patent: December 30, 2008Assignee: PPG Industries Ohio, Inc.Inventors: Shawn P. Duffy, Anthony M. Chasser, Ronald R. Ambrose
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Patent number: 7432335Abstract: There are provided a composition for functioning as an effective additive for epoxy resin that is solid at room temperature and has high storage stability, and a method thereof. The composition of the present invention is a basic silane coupling agent organic carboxylate composition obtained by first synthesizing an organic carboxylate of a basic silane coupling agent by reacting a basic silane coupling agent and an organic carboxylic acid, and subsequently heating and mixing the organic carboxylate of the basic silane coupling agent with a compound exhibiting good affinity for the basic silane coupling agent or organic carboxylic acid and having a softening point or melting point of 40° C. or greater.Type: GrantFiled: June 1, 2006Date of Patent: October 7, 2008Assignee: Nikko Materials Co., Ltd.Inventors: Masashi Kumagai, Takashi Ouchi, Katsuyuki Tsuchida
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Patent number: 7378461Abstract: The invention relates to (1) a curable epoxy resin composition comprising (A) a non-gel type amine-modified epoxy resin which is obtained by reacting an epoxy resin with a polyamine and (B) at least one of boric acid and boric ester, (2) a powder form of the curable epoxy resin composition and a process for its production, and (3) a process for production of heat-resistant laminated sheets by using the curable epoxy resin composition. The invention provides (1) a curable epoxy resin composition capable of giving a cured article having a high glass transition temperature and excellent mechanical properties, (2) a powder form of curable epoxy resin composition having a high glass transition temperature, excellent mechanical properties and excellent storage stability and a process for its production, and (3) heat-resistant laminated sheets made by using the curable epoxy resin compositions and having excellent heat resistance and mechanical properties.Type: GrantFiled: October 31, 2002Date of Patent: May 27, 2008Assignee: Kawamura Institute of Chemical ResearchInventors: Kazutoshi Haraguchi, Akira Ohbayashi
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Patent number: 7345101Abstract: A corrosion resistant, alkali resistant coating composition is disclosed. The composition comprises a binder comprising a reaction product of an epoxy-containing material and a phosphorus-containing material together with a curing agent. Aminoplasts, especially melamine-based aminoplasts, are particularly suitable curing agents. A source of silicon can optionally be included. The compositions also provide excellent adhesion and can be used with or without a weldable primer. The compositions are applied to and cured on a metal substrate.Type: GrantFiled: February 2, 2006Date of Patent: March 18, 2008Assignee: PPG Industries Ohio, Inc.Inventors: Michael J. Pawlik, Dennis W. Jones, Ralph C. Gray, Richard M. Nugent, Jr., Yves Le Disert, Laurent Deronne
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Patent number: 7223820Abstract: Compounds of formula Ia or Ib wherein A is an (n+1)-valent aliphatic, cycloaliphatic, araliphatic or aromatic radical and n is an integer from 0 to 5, E is an (m+1)-valent aliphatic, cycloaliphatic, araliphatic or aromatic radical and m is an integer from 0 to 3, X is —O—, —C(?O)O or —CHR4—, with R4 and R3 together forming an ethylene group, R1 and R2 are, each independently of the other, hydrogen or methyl, R3 is hydrogen, or R3 and R4 together form an ethylene group, and R5 is a monovalent aliphatic, cycloaliphatic, araliphatic or aromatic radical, are highly reactive curing agents for epoxy resins and yield cured products having improved resistance to chemicals.Type: GrantFiled: March 31, 2004Date of Patent: May 29, 2007Assignee: Huntsman Advanced Materials Americas, Inc.Inventors: Walter Fischer, Claudio A Gabutti, Isabelle Frischinger, Rolf Wiesendanger
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Patent number: 7148308Abstract: The present invention provides an one-part moisture-curable urethane composition which exhibits excellent adhesion particularly to a coated steel plate difficult to bond with no-primer and is useful in the bonding of automobile window glass. The urethane composition of the present invention comprises an isocyanate-terminated urethane prepolymer as the main component, and additional components comprising (A) a compound having solubility parameter value of 6.0 to 9.0 and/or (B) a compound having in the molecule at least one structure represented by the following formula: (wherein n is 0 to 3).Type: GrantFiled: October 1, 2002Date of Patent: December 12, 2006Assignee: Sunstar Giken Kabushiki KaishaInventors: Atsushi Inoue, Yoshinori Mayama, Yoshihiro Nakata
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Patent number: 7094845Abstract: There is provided a composition for functioning as an effective additive for an epoxy resin that is a solid at room temperature and has a high storage stability, and a method thereof. The composition of the present invention is a basic silane coupling agent organic carboxylate composition obtained by first synthesizing an organic carboxylate of a basic silane coupling agent by reacting a basic silane coupling agent and an organic carboxylic acid, and subsequently heating and mixing the organic carboxylate of the basic silane coupling agent with a compound exhibiting a good affinity for the basic silane coupling agent or organic carboxylic acid and having a softening point or melting point of 40° C. or greater.Type: GrantFiled: August 27, 2002Date of Patent: August 22, 2006Assignee: Nikko Materials Co., Ltd.Inventors: Masashi Kumagai, Takashi Ouchi, Katsuyuki Tsuchida
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Patent number: 7091286Abstract: Low-cure powder coating compositions are disclosed, comprising at least one epoxy-containing resin and/or at least one siloxane-containing resin, and at least one material having the structure wherein R1 is an organic radical having 6 to 25 carbon atoms; each R2 is independently a multivalent hydrocarbon group having 1 to 20 carbon atoms; Y is each R3 and R4 are independently alkyl or aryl groups having 1 to 8 carbon atoms; each Z is independently oxygen or nitrogen; R5 is absent when Z is oxygen and R5 is hydrogen, an alkyl or aryl group having 1 to 20 carbon atoms, or (Y)a —R2— when Z is nitrogen; a and b are integers; a is at least 1; b is 1 to 3; and (b) at least one epoxy-containing resin and/or at least one siloxane-containing resin. The material can optionally be reacted with an acidic hydrogen-containing compound. Some compositions are curable without using crosslinking agents or accelerators.Type: GrantFiled: September 29, 2003Date of Patent: August 15, 2006Assignee: PPG Industries Ohio, Inc.Inventors: Shawn P. Duffy, Anthony M. Chasser, Ronald R. Ambrose
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Patent number: 7087664Abstract: A resin film comprising (A) an epoxy resin having two or more glycidyl groups in a molecule, (B) an epoxy resin curing agent, (C) a thermoplastic resin, and (D) a filler, wherein the filler content in at least either one of the surface regions on the cross-section of the film is less than the filler concentration in the central region. The resin film has not only toughness but also fire retardancy, high interlayer adhesion strength and good processability of metal plating.Type: GrantFiled: January 23, 2004Date of Patent: August 8, 2006Assignee: Sumitomo Chemical Company, LimitedInventors: Toshiaki Hayashi, Katsuhiro Furuta
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Patent number: 7030197Abstract: There is provided an aqueous resin composition excellent in settability, flexibility, retort resistance, hygienicity, sprayability and dispersibility in water, and used to coat an internal surface of a can.Type: GrantFiled: July 3, 2002Date of Patent: April 18, 2006Assignee: Toyo Boseki Kabushiki KaishaInventors: Osamu Morimoto, Hideki Tanaka, Kayoko Takino, Katsuya Shimeno, Yasunari Hotta
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Patent number: 7022779Abstract: A one-pack moisture-curing epoxy resin composition which can be cured at ordinary temperatures and is improved in storage stability without impairing the quickness of curing, i.e., is excellent in two properties incompatible with each other. This composition includes one ore more members selected from the group consisting of vinyl carboxylates of the general formula (1) and epoxy-containing silyl compounds of the general formula (2), one or more members selected from the group consisting of ketimines and oxazolidines, and an epoxy resin.Type: GrantFiled: December 17, 2001Date of Patent: April 4, 2006Assignee: Konishi Co., Ltd.Inventors: Takeshi Endo, Fumio Sanda, Hisakazu Horii, Kentaro Suzuki, Nobuki Matsuura
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Patent number: 7012719Abstract: The aperture correction system variably adjusts a correction efficient value based upon a sign and an original relative light intensity value or its equivalent. Because the correction is relative light intensity sensitive, the aperture correction is optimized, and the average light intensity is maintained before and after the aperture correction for natural appearance of the image.Type: GrantFiled: June 23, 1999Date of Patent: March 14, 2006Assignee: Ricoh Co., Ltd.Inventor: Sadao Takahashi
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Patent number: 7012120Abstract: This invention relates to thermosetting resin compositions useful for mounting onto a circuit board semiconductor devices, such as CSPs, BGAs, LGAs and the like, each of which having a semiconductor chip, such as LSI, on a carrier substrate. The compositions of this invention are reworkable when subjected to appropriate conditions.Type: GrantFiled: March 27, 2001Date of Patent: March 14, 2006Assignee: Henkel CorporationInventors: Philp T. Klemarczyk, Andrew D. Messana, Afranio Torres-Filho, Erin K. Yaeger, Takahisa Doba
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Patent number: 6992151Abstract: The present invention discloses an active-hydrogen-containing curing agent having a phosphorus group, and a flame retardant cured epoxy resin which can be prepared via an addition reaction between the active hydrogen and the epoxide group of an epoxy resin. The cured flame retardant epoxy resin is environmentally friendly and is suitable for printed circuit board and semiconductor encapsulation applications. The phosphorus group of the curing agent has a chemical structure as follows: wherein Ar is a substituted or un-substituted phenyl or phenoxy.Type: GrantFiled: July 14, 2003Date of Patent: January 31, 2006Assignee: National Science CouncilInventors: Chun-Shan Wang, Jeng-Yueh Shieh
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Patent number: 6977279Abstract: The present invention relates to novel solventless reactive systems curable at room temperature, based on blocked polyisocyanates, primary amines, compounds with oxirane groups, and 2,3-dimethyl-3,4,5,6-tetrahydropyrimidine, and to processes for the preparation of these solventless reactive systems curable at room temperature.Type: GrantFiled: July 17, 2000Date of Patent: December 20, 2005Assignee: Bayer AktiengesellschaftInventors: Jörg Tillack, Wolfgang Puetz, Lutz Schmalstieg
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Patent number: 6962744Abstract: A bifunctional phenylene ether oligomer of the formula (1), obtained by oxidation polymerization of a bivalent phenol of the formula (2) and a monovalent phenol of the formula (3), (wherein —X— is represented by the formula (2?), and Y—O— is represented by the formula (3), R2, R3, R4, R8, R9, R10 and R11 in the formula (2?) and the formula (3?) being required not to be a hydrogen atom, and its use.Type: GrantFiled: May 24, 2004Date of Patent: November 8, 2005Assignee: Mitsubishi Gas Chemical Company, Inc.Inventors: Akikazu Amagai, Kenzi Ishii, Kiyonari Hiramatsu, Makoto Miyamoto, Daisuke Ohno, Katsutoshi Yamazaki, Yasumasa Norisue
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Patent number: 6875807Abstract: A silane-modified phenolic resin is prepared by reacting a phenolic compound (e.g., resorcinol) with an aldehyde to produce a phenolic novolak resin. The phenolic novolak resin is further reacted with at least one silane compound to produce the silane-modified phenolic resin. The reaction is typically carried out in the presence of an acid or base catalyst. The resulting resin has a lower softening point and can be used as a methylene acceptor compound in a vulcanizable rubber composition.Type: GrantFiled: May 28, 2003Date of Patent: April 5, 2005Assignee: Indspec Chemical CorporationInventors: Raj B. Durairaj, C. Michael Walkup, Mark A. Lawrence
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Patent number: 6828391Abstract: Use, as modifier resin for rubber mixtures, of novolaks ABC plastified with terpene-type olefinically unsaturated natural substances C, where the ratio of the molar amount of the phenol or phenol derivative B and the molar amount of the natural substance C in the modified novolak is from 1:6 to 6:1, process for increasing the tear propagation resistance and reducing the compression set of rubber vulcanizates by adding these modifier resins to rubber mixtures, and components molded from vulcanizates thus prepared.Type: GrantFiled: December 12, 2002Date of Patent: December 7, 2004Assignee: Solutia Germany GmbH & Co. KGInventors: Thomas Burkhart, Siegfried Wallenwein
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Patent number: 6815495Abstract: A coating solution for producing a cured coating, particularly for metallic surfaces, includes (1) a binder containing organic polymers with optional organic or inorganic addictions and (2) at least one of a melamine resin, an epoxy resin, a polyurethane resin, an alkyd resin, or mixtures thereof. The coating solution, in the liquid state, contains water. The binder contains 50-100% phenolic resin, preferably based on phenol and/or resorcinol.Type: GrantFiled: May 17, 2001Date of Patent: November 9, 2004Assignee: DaimlerChrysler AGInventors: Anita Marten, Daniela Maichel
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Patent number: 6800717Abstract: Non-gelled polymeric polyols are prepared by the acid catalyzed copolymerization of epoxy resins and water. When the starting resin is an epoxy resin derived from bisphenol-A, the resulting product has much lower levels of bisphenol-A and diglycidyl ether of bisphenol-A (DGEBA) compared to traditional epoxy resins of comparable molecular weight prepared by the advancement process. The product can be cured with OH reactive crosslinkers such as amino resins and polyisocyanates to yield thermosetting coatings with useful properties.Type: GrantFiled: January 31, 2002Date of Patent: October 5, 2004Assignee: Air Products and Chemicals, Inc.Inventors: Frederick Herbert Walker, John Bartram Dickenson
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Patent number: 6797789Abstract: This invention relates to the process of preparation and application of a plural component, fast cure phenolic/polyurea elastomer coating co-polymer system. The disclosed coating system is prepared from the reaction of an isocyanate component and an amine terminated resin blend component. Each of the two components may individually or both contain a phenolic resin based product as part of the active hydrogen donation for the reaction with the isocyanate. These phenolic/polyurea co-polymers are characterized as having significantly improved chemical resistance and lower moisture vapor transmission through the coating system over conventional polyurea elastomer coating systems, thus making the coatings suitable for highly corrosive environments.Type: GrantFiled: October 19, 2001Date of Patent: September 28, 2004Assignee: Visuron Technologies, Inc.Inventors: Thomas E. Davis, Dudley J. Primeaux, II
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Patent number: 6794481Abstract: A bifunctional phenylene ether oligomer of the formula (1), obtained by oxidation polymerization of abivalent phenol of the formula (2) and a monovalent phenol of the formula (3), H&Brketopenst;O—Y&Brketclosest;a&Parenopenst;O—X—O&Parenclosest;&Brketopenst;Y—O&Brketclosest;bH (1) HO—X—OH (2) Y—OH (3) wherein —X— is represented by the formula (2′), and Y—O— is represented by the formula (3), R2, R3, R4, R8, R9, R10 and R11 in the formula (2′) and the formula (3′) being required not to be a hydrogen atom, and its use.Type: GrantFiled: June 27, 2002Date of Patent: September 21, 2004Assignee: Mitsubishi Gas Chemical Company, Inc.Inventors: Akikazu Amagai, Kenzi Ishii, Kiyonari Hiramatsu, Makoto Miyamoto, Daisuke Ohno, Katsutoshi Yamazaki, Yasumasa Norisue
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Patent number: 6794479Abstract: A moisture-curable epoxy resin composition comprises a polyepoxide and a 2-alkyl-3-methyl or ethyl-oxazolidine wherein the 2-alkyl group the alkyl group is attached to the oxazolidine ring via a secondary or tertiary carbon atom.Type: GrantFiled: August 23, 2002Date of Patent: September 21, 2004Assignee: The Yokohama Rubber CO, LTDInventors: Hiroyuki Okuhira, Kazunori Ishikawa
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Patent number: 6784275Abstract: Disclosed is an active energy ray-curable polyimide resin composition which comprises a polymerizable polyimide resin (I) having an isocyanurate ring, an alicyclic structure, an imide ring and a (meth)acryloyl group and being capable of patterning with a dilute alkali aqueous solution.Type: GrantFiled: June 27, 2002Date of Patent: August 31, 2004Assignee: Dainippon Ink and Chemicals, Inc.Inventors: Eiju Ichinose, Yohzoh Yamashina, Hidenobu Ishikawa
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Patent number: 6784260Abstract: A powder coating composition comprises at least one thermosetting resin such as epoxy resins, carboxy- or hydroxy-functional polyesters; hydroxy-, carboxyl- or glycidyl-functional acrylic resins; and/or hydroxy- or carboxyl-functional fluoropolymers, fluorochloropolymers or fluoroacrylic polymers blended with a at least one poly(phenylene ether) and at least one curing agent for the thermosetting resin.Type: GrantFiled: January 31, 2003Date of Patent: August 31, 2004Assignee: General Electric CompanyInventors: Gary William Yeager, Michael Teruki Takemori
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Patent number: 6750274Abstract: A curable coating composition is disclosed comprising a resinous binder comprising (a) a reaction product of an epoxy-containing polymer with a compound containing phosphorus acid groups, the reaction product having reactive functional groups, and (b) a curing agent having functional groups reactive with the functional groups of (a). An electroconductive pigment is dispersed in (a) such that the weight ratio of the electroconductive pigment to (a) plus (b) is within the range of 0.5 to 9.0:1. When the curable coating composition is deposited and cured on a metal substrate, the cured coating is weldable.Type: GrantFiled: May 16, 2001Date of Patent: June 15, 2004Assignee: PPG Industries Ohio. Inc.Inventors: Ralph C. Gray, Ellor James Van Buskirk, Michael J. Pawlik, Richard M. Nugent, Jr., Dennis W. Jones, Kathleen M. Coldren, Steven D. Perrine, James E. Jones
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Patent number: 6727325Abstract: The present invention has an object to provide curatives for epoxy resins and curing accelerators for epoxy resins, which both have improved subliming and decomposing properties and which, when mixed with an epoxy resin, enable the mixture to be greatly improved in thermal stability that is extremely important for the control of a curing reaction and to have a prolonged pot life (stability as a one-pack mixture comprising the epoxy resin, curative, etc.) and improved curability at low temperatures.Type: GrantFiled: June 23, 1999Date of Patent: April 27, 2004Assignee: Nippon Soda Co. Ltd.Inventors: Hiroshi Suzuki, Satoru Abe, Izuo Aoki
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Publication number: 20040076911Abstract: The invention is a photoswitchable benzocyclobutene-based polymer that while remaining aqueous developable, avoids the problem of significant moisture uptake. The oligomer or polymer comprises a polymeric backbone, benzocyclobutene reactive groups, and photoswitchable pendant groups. The pendant groups are bonded to the polymeric backbone and are characterized by the presence of a moiety that converts to carboxylic acid upon exposure to activating wavelengths of radiation a carboxylic acid. When the oligomer or polymer is subsequently heated to cause cure of the oligomer or polymer, carbon dioxide is emitted and the group forms a substantially non-polar moiety. The invention is also a method of making such a polymer and a method of forming a patterned film using such a polymer.Type: ApplicationFiled: October 18, 2002Publication date: April 22, 2004Inventors: Ying Hung So, Keith J. Watson, Scott J. Bis
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Patent number: 6723765Abstract: Autodeposition compositions for polymeric coatings of reduced gloss are prepared using resins having at least one hydroxy group and at least one epoxy group per molecule, a low temperature crosslinker and a high temperature crosslinker. The low temperature crosslinker forms a reactive prepolymer that may be subsequently mixed or emulsified with a high temperature crosslinker to form an autodeposition composition. Alternatively, a hybrid crosslinking agent may be utilized which contains both free isocyanate groups reactive at a relatively low temperature with the resin and at least one functional group capable of reacting with the resin only at a relatively elevated temperature. When deposited and cured, the resulting coating has a matte finish that is resistant to surface defects.Type: GrantFiled: January 10, 2003Date of Patent: April 20, 2004Assignee: Henkel CorporationInventor: Brian D. Bammel
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Patent number: 6723763Abstract: The present invention provides a new class of materials effective as accelerators for curing anaerobic adhesives. The addition of these materials into anaerobic adhesives as a replacement for conventional curatives, such as APH and/or toluidines, surprisingly provides at higher cure speeds and comparable physical properties for the reaction products formed therefrom.Type: GrantFiled: March 15, 2002Date of Patent: April 20, 2004Assignee: Henkel Loctite CorporationInventors: Qinyan Zhu, Shabbir Attarwala
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Patent number: 6713571Abstract: A process for producing an epoxy resin composition for photosemiconductor element encapsulation which, even when a filler or the like is not contained therein, can have a viscosity necessary for molding and hence be satisfactorily molded to give a cured resin less apt to have defects such as burrs or bubbles. The process, which is for producing an epoxy resin composition for photosemiconductor element encapsulation comprising an epoxy resin, a hardener and a hardening accelerator as constituent ingredients, comprises: a first step of melt-mixing the ingredients together; and a second step of regulating viscosity of the molten mixture obtained in the first step at a given temperature.Type: GrantFiled: December 13, 2001Date of Patent: March 30, 2004Assignee: Nitto Denki CorporationInventor: Katsumi Shimada
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Patent number: 6667078Abstract: An epoxy resin composition having a viscosity of from 50 to 400 P at 25° C. is disclosed. The composition provides by casting a resin plate, particularly a transparent resin plate for a liquid crystal display, which has satisfactory thickness precision.Type: GrantFiled: April 10, 2002Date of Patent: December 23, 2003Assignee: Nitto Denko CorporationInventors: Katsumi Shimada, Yutaka Aoki
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Patent number: 6653371Abstract: This invention relates to curable epoxy-based compositions for use in the field of microelectronics, such as those having an epoxy compound which has two or more epoxy groups per molecule, a polythiol compound which has two or more thiol groups per molecule, a latent hardener, and at least one solid organic acid which is substantially insoluble in a mixture of the foregoing components at room temperature. The solid organic acid may be selected from the group consisting of: aliphatic, cycloaliphatic and aromatic carboxylic acids and derivatives thereof, aliphatic, cycloaliphatic, and aromatic quinones and derivatives thereof, phenols and derivatives thereof and enolisable aliphatic, cycloaliphatic and aromatic compounds and derivatives thereof. The solid organic acid should have a pKa of less than or equal to about 12.0, desirably less than or equal to about 10, and often less than or equal to 9.0, such as less than or equal to about 7.5.Type: GrantFiled: July 13, 2000Date of Patent: November 25, 2003Inventors: Barry E. Burns, Harry Woolfson, Paul Malone, Jonathan Wigham
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Patent number: 6638882Abstract: The present invention relates to methods of preparing improved fiber glass compositions using an improved resin binder. The resin binder comprises an aqueous solution of a resole resin, a catalyst comprising an ammonia salt of an aryl sulfonic acid, and optional binder modifiers. It has been found that the use of ammonium aryl sulfonate salts in resin binder compositions, as in the present invention, provides an enhanced cure rate and also enables manufacture of a fiber glass composition exhibiting enhanced uncured storage properties, increased thermal stability, and reduced corrosiveness to metals.Type: GrantFiled: October 9, 1998Date of Patent: October 28, 2003Assignee: Knauf Fiber Glass GmbHInventors: Clarence H. Helbing, Brian Lee Swift
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Patent number: 6576718Abstract: Powder coating compositions comprising at least one thermosetting resin and at least one poly(phenylene ether) are disclosed.Type: GrantFiled: October 4, 2000Date of Patent: June 10, 2003Assignee: General Electric CompanyInventors: Gary William Yeager, Michael Teruki Takemori
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Patent number: 6566422Abstract: A connecting material for bonding and connecting elements each having electrodes thereon in a correspondingly confronting relation to each other, while attaining electroconductive connection between the corresponding electrodes, which material has a high heat resistance and can avoid occurrence of faulty electrical conductance even in the case of bonding elements having a large number of electrodes arranged, thus, at a considerably small interval under such a condition that the bonded assembly is exposed to a service environment of high temperature or of high temeperature and high humidity, wherein the connecting material contains a thermosetting resin and an inorganic filler and has, after having been cured, characteristic features of a modulus of elasticity of 1-12 GPa, a glass transition temperature Tg of 120-200° C., a coefficient of linear expansion (&agr;1) of 50 ppm/° C. or less at temperatures below the Tg and a coefficient of linear expansion (&agr;2) of 110 ppm/° C.Type: GrantFiled: September 15, 2000Date of Patent: May 20, 2003Assignee: Sony Chemicals CorporationInventors: Hidekazu Yagi, Motohide Takeichi, Junji Shinozaki
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Patent number: 6548608Abstract: A polymer composition comprises at least one thermoplastic polymer selected from the group formed by polyetherimides and polysulphones, at least one epoxy resin modified by at least one aromatic polyamine, and at least one other thermoplastic selected from the group consisting of a polyphenylene ether, a polyphenylene sulfide and an aromatic polyether. The epoxy resin is formed from at least one polyepoxide containing at least 2 epoxy groups in its molecule and the aromatic polyamine contains at least two primary amine groups in its molecule and preferably at least one alkyl substituent containing 1 to 12 carbon atoms located alpha to one of the amino groups. The molar ratio of the polyamine to the epoxy is such that, each amino group corresponds to 1.6 to 2.6 epoxy groups.Type: GrantFiled: April 20, 2001Date of Patent: April 15, 2003Assignee: Institut Francais du PetroleInventors: Yves Camberlin, Jacky Grenier, Jacques Vallet, Anthony Bonnet, Jean-Pierre Pascault, Mohamed Taha
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Patent number: 6541577Abstract: The instant invention provides carbamate functional polymers and/or oligomers and coating compositions containing such which have improved levels of nonvolatile solids yet demonstrate good sprayability and etch resistance. The carbamate functional polymers and/or oligomers of the invention comprise the polymerization reaction product of (a) a polymer or oligomer comprising a plurality of functional.Type: GrantFiled: December 6, 2000Date of Patent: April 1, 2003Assignee: BASF CorporationInventors: Walter H Ohrbom, John W. Rehfuss
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Patent number: 6531567Abstract: The invention relates to Mannich bases prepared using alkyldipropylenetriamines and to addition compounds (adducts) of alkyldipropylenetriamines with acrylonitrile and ethylene oxide or propylene oxide, and to products obtained therefrom by the further addition of epoxy compounds having on average at least one epoxy group per molecule, and to the use of such products as hardeners for curable epoxy resin systems.Type: GrantFiled: March 23, 2001Date of Patent: March 11, 2003Assignee: Vantico GmbH & Co.Inventors: Wolfgang Scherzer, Jörg Volle
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Patent number: 6525112Abstract: Autodeposition compositions for polymeric coatings of reduced gloss are prepared using resins having at least one hydroxy group and at least one epoxy group per molecule, a low temperature crosslinker and a high temperature crosslinker. The low temperature crosslinker forms a reactive prepolymer that may be subsequently mixed or emulsified with a high temperature crosslinker to form an autodeposition composition. Alternatively, a hybrid crosslinking agent may be utilized which contains both free isocyanate groups reactive at a relatively low temperature with the resin and at least one functional group capable of reacting with the resin only at a relatively elevated temperature. When deposited and cured, the resulting coating has a matte finish that is resistant to surface defects.Type: GrantFiled: August 31, 2001Date of Patent: February 25, 2003Assignee: Henkel CorporationInventor: Brian D. Bammel
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Patent number: 6478998Abstract: Hybrid resins formed of an acylated phenol-formaldehyde (PF) resin and a polymeric phenyl isocyanate (pMDI) resin have extended shelf stability, yet cure at a rate faster than any of its components when used in conventional flakeboard, strandboard or other board making processes.Type: GrantFiled: September 13, 2000Date of Patent: November 12, 2002Assignee: Borden Chemical, Inc.Inventors: Todd R. Miller, Lewis D. Creel, William D. Detlefsen
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Patent number: 6455631Abstract: The present invention relates to aqueous polyurethane dispersions wherein the polyurethanes contain terminal hydrazide groups and correspond to the formula wherein the terminal, modified hydrazide groups are present in an amount of 1 to 25% by weight [calculated as C(O)—NH—NH—C(O), MW 84], based on the weight of the polyurethanes, and wherein X represents OR′ or NHR′, R represents the residue obtained by removing the isocyanate groups from an NCO prepolymer, R′ represents a group which is inert to Isocyanate groups under the conditions used to form the polyurethane of in formula I, R″ represents a divalent, linear or branched aliphatic group containing 2 to 10 carbon atoms, provided that there are at least two carbons between the oxygen atoms, wherein the aliphatic group may optionally be substituted by heteroatoms to form ether or ester groups, m is 0 or 1 and n is 2 to 4.Type: GrantFiled: December 1, 2000Date of Patent: September 24, 2002Assignees: Bayer Corporation, Bayer AktiengesellschaftInventors: Harald Blum, Lyubov K. Gindin, Karen M. Henderson, Patricia B. Jacobs, Sze-Ming Lee, Brian Long, Robert A. Sylvester, Douglas A. Wicks
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Publication number: 20020120070Abstract: The present invention relates to organic anti-reflective coating polymers and preparation methods therefor. Anti-reflective coatings are used in a semiconductor device during photolithography processes to prevent the reflection of light from lower layers of the device, or resulting from changes in the thickness of the photoresist layer, and to eliminate the standing wave effect when ArF light is used. The present invention also relates to anti-reflective compositions and coatings containing these organic anti-reflective coating polymers, alone or in combination with certain light-absorbing compounds, and preparation methods therefor.Type: ApplicationFiled: December 11, 2001Publication date: August 29, 2002Applicant: Hyundai Electronics Industries Co., Ltd.Inventors: Sung-Eun Hong, Min-Ho Jung, Hyeong-Soo Kim, Ki-Ho Baik
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Patent number: 6437058Abstract: A polymer in the form of a novolac resin is provided wherein the novolac resin has a weight average molecular weight of 1,000-30,000, some of the hydrogen atoms of hydroxyl groups are replaced by 1,2-naphthoquinonediazidosulfonyl ester groups, and some of the hydrogen atoms of the remaining hydroxyl groups are replaced by substituted acetal groups and/or crosslinked within a molecule or between molecules with crosslinking groups having C—O—C linkages. The polymer is formulated into a positive resist composition having improved uniformity, sensitivity, resolution and pattern profile as well as improved heat resistance, film retention, substrate adhesion and storage stability.Type: GrantFiled: February 7, 2001Date of Patent: August 20, 2002Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Tomoyoshi Furihata, Hideto Kato, Yoshinori Hirano
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Publication number: 20020103292Abstract: The present invention relates to aqueous polyurethane dispersions wherein the polyurethanes contain terminal hydrazide groups and correspond to the formula 1Type: ApplicationFiled: December 1, 2000Publication date: August 1, 2002Inventors: Harald Blum, Lyubov K. Gindin, Karen M. Henderson, Patricia B. Jacobs, Sze-Ming Lee, Brian Long, Robert A. Sylvester, Douglas A. Wicks
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Patent number: 6420496Abstract: A curing agent for epoxy resins is prepared by (1) reacting a phenol and an aldehyde in the presence of a basic catalyst to form a first reaction product, (2) reacting the first reaction product with a polyamine or a polyamine-epoxy adduct to form a second reaction product containing unreacted primary amine groups, and (3) reacting the second reaction product with a proton donor compound having a pKa value of 11 or less to form the curing agent.Type: GrantFiled: October 8, 1999Date of Patent: July 16, 2002Assignee: Cognis CorporationInventors: Robert M. Moon, Shailesh Shah, Anbazhagan Natesh, Gaetano D. DeAngelis, Joseph L. Mulvey, Ronald T. Cash, Jr.
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Patent number: 6407183Abstract: An epoxy resin composition having a viscosity of from 50 to 400 P at 25° C. is disclosed. The composition provides by casting a resin plate, particularly a transparent resin plate for a liquid crystal display, which has satisfactory thickness precision.Type: GrantFiled: August 15, 2000Date of Patent: June 18, 2002Assignee: Nitto Denko CorporationInventors: Katsumi Shimada, Yutaka Aoki
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Patent number: 6395845Abstract: The present invention relates to thermoset epoxy resin waterproofing membranes for structures such as roofs comprising: (a) one or more epoxy resin(s) having an average of at least 1.5 epoxy groups per molecule; (b) a liquid amine terminated polyamide prepared by reacting at least one C18-50 dicarboxylic acid and an aminoalkylpiperazine in a ratio of moles of aminoalkylpiperazine to equivalents of carboxyl group in the acid of greater than 0.75:1; (c) one or more optional polyamine(s); (d) one or more optional filler(s); and (e) one or more optional modifying resin(s) wherein the tensile modulus of the thermoset epoxy waterproofing membranes is less than 200,000 psi and the tensile elongation of the thermoset epoxy waterproofing membranes is greater than 20%.Type: GrantFiled: December 15, 1998Date of Patent: May 28, 2002Assignee: Resolution Performance Products LLCInventors: Daniel James Weinmann, Steven Lee Stewart