Mixed With An 1,2-epoxy-containing Chemical Treating Agent Patents (Class 525/507)
  • Patent number: 10174149
    Abstract: The present invention provides a cyanic acid ester compound having a structure represented by the following general formula (1): wherein n represents an integer of 1 or larger.
    Type: Grant
    Filed: November 24, 2015
    Date of Patent: January 8, 2019
    Assignee: MITSUBISHI GAS CHEMICAL COMPANY, INC.
    Inventors: Takashi Kobayashi, Kentaro Takano, Masayuki Katagiri, Keita Tokuzumi, Tatsuya Shima
  • Patent number: 9736926
    Abstract: The present invention provides a curable resin composition, a cured product of which has a small change in heat resistance after receiving a thermal history and a low thermal expansion property; a cured product of the curable resin composition; a printed circuit board having a small change in heat resistance; and an epoxy resin which imparts the characteristics described above. The epoxy resin is an epoxy resin which is obtained by polyglycidyl etherification of a reaction product formed from ortho-cresol, a ?-naphthol compound, and formaldehyde and which includes as a necessary component, a dimer (x2, formula (1)), a trifunctional compound (x3, formula (2)), and a tetrafunctional compound (x4, formula (3)). The total content of those components is 65% or more in terms of the area rate in GPC measurement.
    Type: Grant
    Filed: August 29, 2013
    Date of Patent: August 15, 2017
    Assignee: DIC Corporation
    Inventor: Yutaka Satou
  • Patent number: 9540538
    Abstract: The invention relates to an alkyd resin composition comprising components: (A) at least an auto-oxidisable alkyd resin component comprising unsaturated fatty acid or its derivative, selected from: (i) alpha, beta-unsaturated ester-functional alkyd resin; (ii) combination of a alpha, beta-unsaturated ester functional material and an alkyd resin; and (iii) mixture of components (i) and (ii); Wherein the alkyd has an oil length of at least 20% unsaturated fatty acids; (B) a daylight photoinitiator; (C) a metal drier; and (D) optionally a liquid medium selected from the group consisting of an organic solvent, water, non-volatile diluent and mixtures thereof; wherein if the liquid medium is present and is: a) substantially based on organic solvent and/or diluent then the VOC is <300 g/l, or b) substantially based on water then the VOC is <100 g/l.
    Type: Grant
    Filed: May 31, 2012
    Date of Patent: January 10, 2017
    Assignee: SYNRES B.V.
    Inventor: Adrianus Jozephus Henricus Lansbergen
  • Patent number: 9062380
    Abstract: The present invention provides a pore-sealing agent and a member of coating a spray deposit. The pore-sealing agent is excellent in permeability into pores (gaps) of a spray deposit and can be favorably filled thereinto and is capable of sealing pores until gaps in a spray deposit material are substantially entirely filled. The pore-sealing agent contains an epoxy group-containing component and a hardener and does not contain a polymerizable vinyl group-containing solvent. The epoxy group-containing component is a mixture containing a polyglycidyl ether compound in which the number of epoxy groups contained in one molecule is not less than three as and, an alkylenediglycidyl ether compound or a cyclic aliphatic diepoxy compound, both of which contain two epoxy groups in one molecule thereof. Excluding the hardener, the mixing ratio of the polyglycidyl ether compound to the epoxy group-containing component of the mixture is 10 to 95 wt %.
    Type: Grant
    Filed: April 12, 2007
    Date of Patent: June 23, 2015
    Assignee: NTN CORPORATION
    Inventor: Kazutoyo Murakami
  • Patent number: 9056990
    Abstract: A phosphorus-atom-containing oligomer is used as a curing agent for epoxy resin, the phosphorus-atom-containing oligomer being a mixture of a phosphorus-atom-containing compound represented by structural formula (1) below with n representing 0 and a phosphorus-atom-containing oligomer represented by structural formula (1) below with n representing 1 or more: (where R1 to R5 each independently represent a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, or the like; X represents a hydrogen atom or a structural unit represented by structural formula (x1) below: where, in structural formula (x1), R2 to R5 each independently represent a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, or the like), wherein a content of the phosphorus-atom-containing oligomer represented by general structural formula (1) with n representing 1 or more is in the range of 5 to 90% on a peak area bases in GPC measurement.
    Type: Grant
    Filed: March 13, 2012
    Date of Patent: June 16, 2015
    Assignee: DIC Corporation
    Inventors: Koji Hayashi, Yutaka Satou, Takamitsu Nakamura
  • Patent number: 9012122
    Abstract: A modified novolak phenolic resin is obtained by reacting a novolak phenolic resin containing at least 50 wt % of p-cresol with a crosslinker. This method increases the molecular weight of the existing novolak phenolic resin containing at least 50 wt % of p-cresol to such a level that the resulting modified novolak phenolic resin has heat resistance enough for the photoresist application.
    Type: Grant
    Filed: October 24, 2012
    Date of Patent: April 21, 2015
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Yoshinori Hirano, Hideyoshi Yanagisawa
  • Publication number: 20140378626
    Abstract: The introduction of environmentally-friendly organic phosphorus group can not only maintain the original excellent properties of epoxy resins, but also meet the high flame-retarding requirements, and have the ability to improve the vitrification temperature (Tg), heat resistance and other characteristics of the material so that the curing system can be successfully applied to the electronic materials field which are light, thin, small and precise, the present disclosure provides a flame-retarding phosphor-containing phenol-formaldehyde novolac and the preparation method thereof, the use of the compound to react with the epoxy group of an epoxy resin to obtain an environmentally-friendly and high performing halogen-free cured flame retarding epoxy resin, and the compound can also be used for curing epoxy resins and gives a high flame-retarding effect.
    Type: Application
    Filed: June 24, 2014
    Publication date: December 25, 2014
    Inventors: Qi SHEN, Xu-Feng LI, Dong ZHAO
  • Patent number: 8883937
    Abstract: A cyclic compound represented by formula (1): wherein L, R1, R?, and m are as defined in the specification. The cyclic compound of formula (1) is highly soluble to a safety solvent, highly sensitive, and capable of forming resist patterns with good profile. Therefore, the cyclic compound is useful as a component of a radiation-sensitive composition.
    Type: Grant
    Filed: August 27, 2010
    Date of Patent: November 11, 2014
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Masatoshi Echigo, Hiromi Hayashi
  • Patent number: 8742055
    Abstract: Use a modified, amine-functionalized anion exchange resin as a catalyst to produce a bishalohydrin ether and then dehydrohalogenate the bishalohydrin ether with an aqueous inorganic hydroxide mixture to yield a liquid epoxy resin.
    Type: Grant
    Filed: December 7, 2010
    Date of Patent: June 3, 2014
    Assignee: Dow Global Technologies LLC
    Inventors: Philip J. Carlberg, H. Robert Goltz, Leming Gu, William I. Harris, David H. West, William G. Worley, Thomas C. Young
  • Patent number: 8642709
    Abstract: The subject matter of the present Application is two-component compositions whose first component is a mixture of reactive epoxy resins and optionally further formulation constituents which contains, based on the mass of all epoxy resins, a) at least 10 wt % of an epoxy group-containing reaction product of epichlorohydrin with polypropylene glycol which has an epoxy equivalent weight of at least 250 g/eq, and b) at least 10 wt % of an epoxy group-containing reaction product of epichlorohydrin with a novolac resin which has an epoxy equivalent weight of at least 175 g/eq, and whose second component contains at least one thiol group-containing hardener for epoxy resins.
    Type: Grant
    Filed: September 21, 2012
    Date of Patent: February 4, 2014
    Assignees: Henkel AG & Co. KGaA, Henkel US IP LLC
    Inventors: Pablo Walter, Mustapha Benomar, Stefen Kreiling, Angelika Troll, Rainer Schoenfeld, Timothy Walsh
  • Patent number: 8642234
    Abstract: A carboxyl group-containing photosensitive resin is obtained by reacting an ?,?-ethylenically unsaturated group-containing monocarboxylic acid (c) with a phenolic compound (a) containing the structure represented by the following general formula (I) and having at least two phenolic hydroxyl groups in its molecule, wherein part or the whole of the phenolic hydroxyl groups being modified into an oxyalkyl group, and further reacting a polybasic acid anhydride (d) with the resultant reaction product; wherein R1 represents either one of a hydrocarbon radical of 1 to 11 carbon atoms, a SO2 group, an oxygen atom and sulfur atom, R2 represents a hydrocarbon radical of 1 to 11 carbon atoms, “a” represents an integer of 0 to 3, “n” represents an integer of 1 to 2, and “m” represents an integer of 1 to 10.
    Type: Grant
    Filed: September 13, 2011
    Date of Patent: February 4, 2014
    Assignees: Taiyo Holdings Co., Ltd., Showa Denko K.K.
    Inventors: Nobuhito Ito, Masao Arima, Syouji Nishiguchi, Kouji Ogawa, Masayuki Kobayashi, Atsushi Sakamoto
  • Patent number: 8633293
    Abstract: A polymer includes a reaction product of an epoxy resin, a first crosslinking agent, and a second crosslinking agent. The first crosslinking agent is reactive with the epoxy resin and has a first molecular weight. The second crosslinking agent is reactive with the epoxy resin and has a second molecular weight of at least 2.5 times greater than the first molecular weight. The polymer has a first phase having a first glass transition temperature at which the polymer is transformable between a first shape and a second shape. The second crosslinking agent is crystallizable within the polymer and thereby has a melting temperature that is detectable within the polymer.
    Type: Grant
    Filed: November 30, 2010
    Date of Patent: January 21, 2014
    Assignee: GM Global Technology Operations LLC
    Inventor: Ingrid A. Rousseau
  • Publication number: 20140008108
    Abstract: A phosphorus-atom-containing oligomer is used as a curing agent for epoxy resin, the phosphorus-atom-containing oligomer being a mixture of a phosphorus-atom-containing compound represented by structural formula (1) below with n representing 0 and a phosphorus-atom-containing oligomer represented by structural formula (1) below with n representing 1 or more: (where R1 to R5 each independently represent a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, or the like; X represents a hydrogen atom or a structural unit represented by structural formula (x1) below: where, in structural formula (x1), R2 to R5 each independently represent a hydrogen atom, an alkyl group having 1 to 4 carbon atoms, or the like), wherein a content of the phosphorus-atom-containing oligomer represented by general structural formula (1) with n representing 1 or more is in the range of 5 to 90% on a peak area basis in GPC measurement.
    Type: Application
    Filed: March 13, 2012
    Publication date: January 9, 2014
    Applicant: DIC CORPORATION
    Inventors: Koji Hayashi, Yutaka Satou, Takamitsu Nakamura
  • Patent number: 8586699
    Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.
    Type: Grant
    Filed: February 15, 2012
    Date of Patent: November 19, 2013
    Assignee: Dow Global Technologies LLC
    Inventor: Joesph Gan
  • Patent number: 8563661
    Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.
    Type: Grant
    Filed: January 9, 2013
    Date of Patent: October 22, 2013
    Assignee: Dow Global Technologies LLC
    Inventor: Joseph Gan
  • Patent number: 8557930
    Abstract: The invention relates to a modified hydrocarbylphenol-aldehyde resin prepared by reacting a hydrocarbylphenol-aldehyde resin with a primary or secondary amine and further with an epoxide. The invention also provides a process for preparing a modified, hydrocarbylphenol-aldehyde resin and a rubber composition containing such resin.
    Type: Grant
    Filed: September 5, 2012
    Date of Patent: October 15, 2013
    Assignee: SI Group, Inc.
    Inventors: Timothy E. Banach, L. Scott Howard, Todd Scott Makenzie, Ronald K. Smith
  • Patent number: 8461286
    Abstract: A process for the production of liquid epoxy resins, including: contacting a polyhydric phenol and an epihalohydrin in the presence of an ionic catalyst to form a halohydrin intermediate reaction product; concurrently: reacting a portion of the halohydrin intermediate reaction product with an alkali hydroxide to form a solid salt suspended in a liquid mixture including a dehydrohalogenated product and unreacted halohydrin intermediate, wherein the alkali hydroxide is used at less than a stoichiometric amount; and removing water and epihalohydrin as a vapor from the reacting mixture; separating the solid salt from the liquid mixture; reacting at least a portion of the unreacted halohydrin intermediate with an alkali hydroxide in the presence of water to form an organic mixture including an epoxy resin and unreacted epihalohydrin and an aqueous solution including a salt; separating the aqueous mixture from the organic mixture; and separating the unreacted epihalohydrin from the liquid epoxy resin.
    Type: Grant
    Filed: March 24, 2009
    Date of Patent: June 11, 2013
    Assignee: Dow Global Technologies LLC
    Inventors: Thomas C. Young, Clinton J. Boriack, Elwin G. Collier, Robert M. Drake, Joachim Drewing, Edward J. Kronenberger, Shuji Maeda, Paulo Alfonso Dos Santos Pereira, Andreas Tigges, Roland Werner, Mark S. Burkinshaw
  • Patent number: 8445590
    Abstract: A composite prepared using a thermosettable epoxy resin composition having, as components: (1) an epoxy resin; (2) an epoxidized cycloaliphatic dicyclopentadiene phenolic resin; (3) an optional epoxidized bisphenol-A novolac resin; (4) an optional oligomeric butadiene; (5) an optional organic solvent; and (6) an alkylphenol novolac resin, the alkylphenol novolac resin serving as a curing agent. The composite so prepared may have good physical properties and superior a electrical properties as compared to conventional composites, such as laminates. The prepregs used to make the laminates may have a better surface appearance as well.
    Type: Grant
    Filed: April 9, 2012
    Date of Patent: May 21, 2013
    Assignee: Momentive Specialty Chemicals Inc.
    Inventor: Charles David Shirrell
  • Patent number: 8440781
    Abstract: The object of the present invention is to provide an epoxy resin composition capable of realizing low dielectric constant and low dielectric dissipation factor, which is suited for use as a latest current high-frequency type electronic component-related material, without deteriorating heat resistance during the curing reaction. A phenol resin, which has the respective structural units of a phenolic hydroxyl group-containing aromatic hydrocarbon group (P) derived from phenols, an alkoxy group-containing condensed polycyclic aromatic hydrocarbon group (B) derived from methoxynaphthalene and a divalent hydrocarbon group (X) such as methylene and also has a structure represented by -P-B-X- wherein P, B and X are structural sites of these groups in a molecular structure, is used as a curing agent for the epoxy resin, or a phenol resin as an epoxy resin material.
    Type: Grant
    Filed: December 9, 2009
    Date of Patent: May 14, 2013
    Assignee: Dainippon Ink and Chemicals, Inc.
    Inventors: Ichirou Ogura, Yoshiyuki Takahashi, Yutaka Sato
  • Patent number: 8440771
    Abstract: Phosphorus-containing compounds useful for flame retardant epoxy resins are disclosed. The flame retardant epoxy resins may be used to make electrical laminates. This invention is particularly useful in end use applications in which a low bromine or low halogen content is required or desired.
    Type: Grant
    Filed: January 20, 2012
    Date of Patent: May 14, 2013
    Assignee: Dow Global Technologies LLC
    Inventor: Joseph Gan
  • Patent number: 8420749
    Abstract: The object of the present invention is to provide an epoxy resin composition capable of realizing low dielectric constant and low dielectric dissipation factor, which is suited for use as a latest current high-frequency type electronic component-related material, without deteriorating heat resistance during the curing reaction. A phenol resin, which has the respective structural units of a phenolic hydroxyl group-containing aromatic hydrocarbon group (P) derived from phenols, an alkoxy group-containing condensed polycyclic aromatic hydrocarbon group (B) derived from methoxynaphthalene and a divalent hydrocarbon group (X) such as methylene and also has a structure represented by —P—B—X— wherein P, B and X are structural sites of these groups in a molecular structure, is used as a curing agent for the epoxy resin, or a phenol resin as an epoxy resin material.
    Type: Grant
    Filed: March 1, 2006
    Date of Patent: April 16, 2013
    Assignee: Dainippon Ink and Chemicals, Inc.
    Inventors: Ichirou Ogura, Yoshiyuki Takahashi, Yutaka Sato
  • Patent number: 8420871
    Abstract: Process for producing a chlorohydrin by reaction between a multihydroxylated-aliphatic hydrocarbon, an ester of a multihydroxylated-aliphatic hydrocarbon, or a mixture thereof, and a chlorinating agent, according to which the multihydroxylated-aliphatic hydrocarbon, the ester of a multihydroxylated-aliphatic hydrocarbon, or the mixture thereof used contains at least one solid or dissolved metal salt, the process comprising a separation operation to remove at least part of the metal salt.
    Type: Grant
    Filed: September 21, 2011
    Date of Patent: April 16, 2013
    Assignee: Solvay (Societe Anonyme)
    Inventors: Patrick Gilbeau, Ivan De Andolenko, Philippe Krafft, Freddy Gielen
  • Publication number: 20130056151
    Abstract: The present invention relates to heat-curable compositions containing a mixture of reactive epoxy resins that contains, based on the mass of all epoxy resins, a) at least 10 wt % of an epoxy group-containing reaction product of epichlorohydrin with polypropylene glycol which has an epoxy equivalent weight of at least 250 g/eq, and b) at least 10 wt % of an epoxy group-containing reaction product of epichlorohydrin with a novolac resin which has an epoxy equivalent weight of at least 175 g/eq, and at least one latent hardener.
    Type: Application
    Filed: November 5, 2012
    Publication date: March 7, 2013
    Applicant: Henkel AG & Co. KGaA
    Inventor: Henkel AG & Co. KGaA
  • Publication number: 20130012668
    Abstract: The present invention provides novel phosphinated compounds of monofunctional, bifunctional, multifunctional phenols represented by the following formulae and their derivatives, and preparation methods thereof:
    Type: Application
    Filed: July 5, 2012
    Publication date: January 10, 2013
    Applicant: NATIONAL CHUNG HSING UNIVERSITY
    Inventors: CHING-HSUAN LIN, YU-WEI TIAN
  • Patent number: 8263714
    Abstract: An epoxy resin composition including an epoxy resin and a curing agent as essential components, in which the curing agent comprises a phenol resin which has each structural moiety of a phenolic hydroxyl group-containing aromatic hydrocarbon group (P), an alkoxy group-containing aromatic hydrocarbon group (B) and a divalent aralkyl group (X), and also has, in a molecular structure, a structure in which the phenolic hydroxyl group-containing aromatic hydrocarbon group (P) and the alkoxy group-containing aromatic hydrocarbon group (B) are bonded with the other phenolic hydroxyl group-containing aromatic hydrocarbon group (P) or alkoxy group-containing aromatic hydrocarbon group (B) via the divalent aralkyl group (X).
    Type: Grant
    Filed: June 10, 2011
    Date of Patent: September 11, 2012
    Assignee: Dainippon Ink and Chemicals, Inc.
    Inventors: Ichiro Ogura, Yoshiyuki Takahashi, Kazuo Arita, Kunihiro Morinaga, Yutaka Satou
  • Patent number: 8198381
    Abstract: Disclosed is a phenol aralkyl epoxy resin having a structure wherein at least a phenol or a naphthol is bound by using an aralkyl group as a linking group and a structure represented by formula (1) below, while satisfying the condition 1 below. This epoxy resin is excellent in workability during production of a composition and is easy to control quality. Condition 1: The following relation (?) is satisfied with A being the hydroxyl equivalent (as measured in accordance with JIS K 0070) of a phenol-modified epoxy resin obtained by adding an equivalent molar amount of phenol relative to the epoxy equivalent of the epoxy resin, and B being the epoxy equivalent of the epoxy resin. 50?1000×(A?B)/B?250 (?).
    Type: Grant
    Filed: October 16, 2006
    Date of Patent: June 12, 2012
    Assignee: Nippon Kayaku Kabushiki Kaisha
    Inventors: Masataka Nakanishi, Katsuhiko Oshimi, Kazuyuki Ohhashi, Toru Kurihashi
  • Patent number: 8193297
    Abstract: The use of 1,3-substituted imidazolium salts of the formula I in which R1 and R3 independently of one another are an organic radical having 1 to 20 C atoms, R2, R4, and R5 independently of one another are an H atom or an organic radical having 1 to 20 C atoms, it also being possible for R4 and R5 together to form an aliphatic or aromatic ring, and X is a thiocyanate anion as latent catalysts for curing compositions comprising epoxy compounds.
    Type: Grant
    Filed: June 6, 2008
    Date of Patent: June 5, 2012
    Assignee: BASF SE
    Inventors: Lars Wittenbecher, Matthias Maase, Georg Degen, Michael Henningsen, Manfred Doering, Ulrich Arnold
  • Patent number: 8173745
    Abstract: A composite prepared using a thermosettable epoxy resin composition having, as components: (1) an epoxy resin; (2) an epoxidized cycloaliphatic dicyclopentadiene phenolic resin; (3) an optional epoxidized bisphenol-A novolac resin; (4) an optional oligomeric butadiene; (5) an optional organic solvent; and (6) an alkylphenol novolac resin, the alkylphenol novolac resin serving as a curing agent. The composite so prepared may have good physical properties and superior a electrical properties as compared to conventional composites, such as laminates. The prepregs used to make the laminates may have a better surface appearance as well.
    Type: Grant
    Filed: December 16, 2009
    Date of Patent: May 8, 2012
    Assignee: Momentive Specialty Chemicals Inc.
    Inventor: Charles David Shirrell
  • Patent number: 8173823
    Abstract: Process for preparing an epoxide, wherein halogenated ketones are formed as by-products and there is at least one treatment intended to remove at least part of the halogenated ketones formed.
    Type: Grant
    Filed: May 19, 2006
    Date of Patent: May 8, 2012
    Assignee: Solvay (Société Anonyme)
    Inventor: Patrick Gilbeau
  • Patent number: 8124716
    Abstract: Phosphorus-containing compounds are disclosed which are obtainable by reacting: (A) at least one organophosphorus compound having a group selected from the group H—P?O; the group P—H and the group P—OH; and (B) at least one compound having the following Formula (I): [R?(Y)m?]m(X—O—R?)n??Formula (I) wherein R? is an organic group; Y is a functional group selected from the group consisting of hydroxy, carboxylic acid, and amine; X is a hydrocarbylene group; R? is hydrogen or a hydrocarbyl group having from 1 to 8 carbon atoms, R is alkyl or aryl group having from 1 to 12 carbon atoms; m?, m and n are, independently, numbers equal to or greater than 1. These compounds are useful for making flame retardant epoxy and polyurethane resins and ignition resistant thermoplastic resins, each of which is useful for a variety of end uses requiring flame retardancy or ignition resistance. Flame retardant epoxy resins may be used to make electrical laminates.
    Type: Grant
    Filed: November 4, 2010
    Date of Patent: February 28, 2012
    Assignee: Dow Global Technologies LLC
    Inventor: Joseph Gan
  • Publication number: 20120040291
    Abstract: There is provided a compositions of resist underlayer films for EUV lithography that is used in a production process of devices employing EUV lithography, that reduces adverse effects caused by EUV, and that has a beneficial effect on the formation of a favorable resist pattern; and a method for forming resist patterns using the composition of resist underlayer films for EUV lithography. A composition for forming a resist underlayer film for an EUV lithography process used in production of a semiconductor device, comprising a novolac resin containing a halogen atom. The novolac resin may include a cross-linkable group composed of an epoxy group, a hydroxy group, or a combination thereof. The halogen atom may be a bromine atom or an iodine atom. The novolac resin may be a reaction product of a novolac resin or an epoxidized novolac resin and a halogenated benzoic acid; or a reaction product of a glycidyloxy novolac resin and diiodosalicylic acid.
    Type: Application
    Filed: April 15, 2010
    Publication date: February 16, 2012
    Applicant: NISSAN CHEMICAL INDUSTRIES, LTD.
    Inventors: Rikimaru Sakamoto, Takafumi Endo, Bangching Ho
  • Patent number: 8084553
    Abstract: The invention provides an improvement to the useable lifetimes of phenolic-epoxy, phenolic-benzoxazine, phenolic-epoxy-benzoxazine mixtures and other phenolic mixtures through the use of protected phenolics, where a phenolic compound, polymer, or resin is released on demand by the addition of a deblocking agent.
    Type: Grant
    Filed: January 10, 2008
    Date of Patent: December 27, 2011
    Assignee: Trillion Science, Inc.
    Inventors: Rong-Chang Liang, John J. McNamara, Yurong Ying, Chung-Jen Hou
  • Publication number: 20110313109
    Abstract: The invention relates to a modified hydrocarbylphenol-aldehyde resin prepared by reacting a hydrocarbylphenol-aldehyde resin with a primary or secondary amine and further with an epoxide. The invention also provides a process for preparing a modified, hydrocarbylphenol-aldehyde resin and a rubber composition containing such resin.
    Type: Application
    Filed: September 1, 2011
    Publication date: December 22, 2011
    Applicant: SI GROUP, INC.
    Inventors: Timothy E. BANACH, L. Scott HOWARD, Todd Scott MAKENZIE, Ronald K. SMITH
  • Patent number: 8039560
    Abstract: The present invention provides a brominated epoxy resin, which has a molecular segment of low polarity in the polymer chain, while the molecular segment of low polarity is attributed to the symmetric or saturated cyclic alphatic molecular structure with low “molecular dipole moment” characteristics; making a printed circuit board for high frequency signal transformation applications needs a proper copper clad laminate which processes the properties of a low dielectric constant and of a low dissipation factor; a copper clad laminate can meet above requirements by using the inventive resin as a laminate binder. The inventive resin is prepared by the following steps: 1. Reacting a 2,6-disubstituted mono-phenol compound (A) with an aldehyde or a cyclic diene compound (B), so as to obtain a bisphenol compound (C) having a high symmetry or saturated aliphatic heterocyclic structure; 2.
    Type: Grant
    Filed: April 1, 2010
    Date of Patent: October 18, 2011
    Assignee: Nan Ya Plastics Corporation
    Inventors: Ming Jen Tzou, Chi Cheng Chen, Chih Hong Chen
  • Patent number: 8030418
    Abstract: The invention relates to a modified hydrocarbylphenol-aldehyde resin prepared by reacting a hydrocarbylphenol-aldehyde resin with a primary or secondary amine and further with an epoxide. The invention also provides a process for preparing a modified, hydrocarbylphenol-aldehyde resin and a rubber composition containing such resin.
    Type: Grant
    Filed: September 4, 2007
    Date of Patent: October 4, 2011
    Assignee: SI Group, Inc.
    Inventors: Timothy E. Banach, L. Scott Howard, Todd Scott Makenzie, Ronald K. Smith
  • Publication number: 20110144272
    Abstract: A composite prepared using a thermosettable epoxy resin composition having, as components: (1) an epoxy resin; (2) an epoxidized cycloaliphatic dicyclopentadiene phenolic resin; (3) an optional epoxidized bisphenol-A novolac resin; (4) an optional oligomeric butadiene; (5) an optional organic solvent; and (6) an alkylphenol novolac resin, the alkylphenol novolac resin serving as a curing agent. The composite so prepared may have good physical properties and superior a electrical properties as compared to conventional composites, such as laminates. The prepregs used to make the laminates may have a better surface appearance as well.
    Type: Application
    Filed: December 16, 2009
    Publication date: June 16, 2011
    Inventor: Charles David Shirrell
  • Patent number: 7887716
    Abstract: This invention relates to cationically curable sealants that provide low moisture permeability and good adhesive strength after cure. The composition consists essentially of an electrophoretic device containing an oxetane compound and a photoinitiating system comprising and photoinitiator and optionally a photosensitizer.
    Type: Grant
    Filed: July 25, 2008
    Date of Patent: February 15, 2011
    Assignee: Henkel AG & Co. KGaA
    Inventors: Shengqian Kong, Stijn Gillissen
  • Publication number: 20100298505
    Abstract: The invention relates to a liquid resin composition intended for manufacturing abrasives that comprises at least one novolac resin having a glass transition temperature less than or equal to 60° C., at least one reactive diluent and optionally at least one crosslinking agent. Application of the resin composition for producing abrasive articles, especially bonded abrasives and coated abrasives. It also relates to the abrasive articles comprising abrasive grains connected by such a liquid resin composition.
    Type: Application
    Filed: October 1, 2008
    Publication date: November 25, 2010
    Applicants: SAINT-GOBAIN ABRASIVES, INC., SAINT-GOBAIN ABRSIFS TECH. ET SERVICES, S.A.S.
    Inventors: Alix Arnaud, Philippe Espiard, Sandrine Pozzolo
  • Publication number: 20100240811
    Abstract: The present invention discloses a thermosetting resin composition including: a bi-functional or multi-functional epoxy resin, a SMA uses as a curing agent, an allyl phenol such as diallyl bisphenol A used as a co-curing agent and a toughening agent a low-bromine or high-bromine BPA epoxy resin or tetrabromobispheno A (TBBPA or TBBA) uses as a flame retardant agent, and an appropriate solvent. After the resin composition of the invention is cured, the resin composition has lower dielectric property and better thermal reliability and tenacity. A copper clad laminate made of an enhanced material such as glass fiber has lower dielectric constant (Dk) and loss tangent (Df), high Tg, high thermal decomposition temperature (Td), better tenacity and PCB manufacturability, and thus very suitable to be used as a copper clad laminate and a prepreg for manufacturing PCBs or applied as a molding resin material for contraction, automobile and air navigation.
    Type: Application
    Filed: March 18, 2009
    Publication date: September 23, 2010
    Inventors: Yufang HE, Lunqiang ZHANG
  • Publication number: 20090275708
    Abstract: Even when a terminal epoxy resin is contained as the epoxy component of a thermosetting epoxy resin composition containing an aluminum chelate/silanol curing catalyst system, the epoxy resin composition can be configured to cure rapidly at low temperatures without termination of polymerization. The thermosetting epoxy resin composition of the present invention includes an aluminum chelate/silanol curing catalyst system, an epoxy resin, and an anion-trapping agent. The anion-trapping agent is preferably an aromatic phenol derivative or an acid anhydride. Examples include bisphenol S, bisphenol A, bisphenol F, and 4,4?-dihydroxyphenol ether, and acetic anhydride, propionic anhydride, maleic anhydride and phthalic anhydride. The aluminum chelate/silanol curing catalyst system is composed of an aluminum chelator and a silane-coupling agent.
    Type: Application
    Filed: July 10, 2006
    Publication date: November 5, 2009
    Applicant: SONY CHEMICAL & INFORMATION DEVICE CORPORATION
    Inventor: Kazunobu Kamiya
  • Patent number: 7560501
    Abstract: An encapsulant composition. The encapsulant composition includes a resin material consisting of epoxy or cyanate ester resins, from about 1.0% by weight to about 5% by weight of the composition of a flexibilizing agent including a flexibilizer containing functional groups capable of reaction with the epoxy or cyanate ester resin during thermally induced curing, a filler material including substantially spherical or spheroidal particles such that each particle has a diameter less than about 41 microns, and a thermoplastic other than the flexibilizer. The thermoplastic is separated from the cured epoxy or cyanate ester resin. The thermoplastic includes a poly(arylene)ether. The flexibilizer includes bis(2,3-epoxy-2-methylpropyl)ether.
    Type: Grant
    Filed: May 29, 2008
    Date of Patent: July 14, 2009
    Assignee: International Business Machines Corporation
    Inventor: Konstantinos I. Papathomas
  • Patent number: 7544727
    Abstract: An encapsulating epoxy resin molding material comprising (A) an epoxy resin, (B) a curing agent, and (C) a silane coupling agent having a secondary amino group or (D) a phosphate, and semiconductor devices encapsulated therein. The encapsulating epoxy resin molding material for thin semiconductor devices according to this invention is excellent in fluidity, and the semiconductor device encapsulated therein, which is a semiconductor device having a semiconductor chip arranged on a thin, multi-pin, long wire, narrow-pad-pitch, or on a mounted substrate such as organic substrate or organic film, is free of molding defects such as wire sweep, voids etc. as shown in the Examples, and thus its industrial value is significant.
    Type: Grant
    Filed: October 28, 2005
    Date of Patent: June 9, 2009
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Ryoichi Ikezawa, Masanobu Fujii, Shinsuke Hagiwara
  • Patent number: 7504471
    Abstract: The present invention discloses a sulfur-containing phenolic resin which comprises an organic group represented by the following formula (1): —R1—S—R2—S—R1—??(1) wherein R1 represents a hydrocarbon group having 2 to 6 carbon atoms, R2 represents a hydrocarbon group having 1 to 10 carbon atoms, between a phenolic carbon and a phenolic carbon, phenol derivatives represented by the following formula (5): wherein R5 represents a C2-3 alkylene group, R6 represents a C1-10 alkylene group, G represents H, a C1-10 alkyl group, etc., and an epoxy resin composition containing (A) a curing agent of the above-mentioned formula (5) and (B) an epoxy resin as essential components.
    Type: Grant
    Filed: October 11, 2002
    Date of Patent: March 17, 2009
    Assignee: Hitachi Chemical Co., Ltd.
    Inventors: Haruaki Sue, Takashi Kumaki, Hideyasu Tsuiki, Hiroshi Matsutani, Toshihiko Takasaki, Iwao Fukuchi
  • Publication number: 20090054585
    Abstract: The object of the present invention is to provide an epoxy resin composition capable of realizing low dielectric constant and low dielectric dissipation factor, which is suited for use as a latest current high-frequency type electronic component-related material, without deteriorating heat resistance during the curing reaction. A phenol resin, which has the respective structural units of a phenolic hydroxyl group-containing aromatic hydrocarbon group (P) derived from phenols, an alkoxy group-containing condensed polycyclic aromatic hydrocarbon group (B) derived from methoxynaphthalene and a divalent hydrocarbon group (X) such as methylene and also has a structure represented by —P—B—X— wherein P, B and X are structural sites of these groups in a molecular structure, is used as a curing agent for the epoxy resin, or a phenol resin as an epoxy resin material.
    Type: Application
    Filed: March 1, 2006
    Publication date: February 26, 2009
    Applicant: DAINIPPON INK AND CHEMICALS, INC.
    Inventors: Ichirou Ogura, Yoshiyuki Takahashi, Yutaka Sato
  • Publication number: 20080145667
    Abstract: An epoxy adhesive composition of an epoxy resin and an amine hardener includes a synergistic accelerator of an effective amount of short chain polyol and an effective amount of a dihydric phenol having between about 6 and about 24 carbon atoms. Surfaces of adherends are joined with the dried residue of the epoxy adhesive composition by applying the epoxy resin composition to one or both surfaces, joining the surfaces, and applying pressure, optionally with heating. The joined adherends having the dried epoxy resin composition is another disclosed embodiment.
    Type: Application
    Filed: December 15, 2006
    Publication date: June 19, 2008
    Inventor: Michael J. Barker
  • Patent number: 7384682
    Abstract: An encapsulant composition and an electronic package. The composition includes a resin, a flexibilizing agent, and a filler material. The electronic package includes a substrate, a semiconductor chip, and a material. The semiconductor chip is mounted on an upper surface of the substrate and electrically coupled to the substrate. The material is positioned on the upper surface of the substrate and against an edge surface of the semiconductor chip. The edge surface of the semiconductor chip is substantially perpendicular to a bottom surface of the semiconductor chip. The material is the encapsulant composition.
    Type: Grant
    Filed: September 26, 2007
    Date of Patent: June 10, 2008
    Assignee: International Business Machines Corporation
    Inventor: Konstantinos I. Papathomas
  • Patent number: 7365135
    Abstract: The method of the present invention includes grafting a glycidyl alkylene trialkoxy silane to a novolac phenolic resin in an organic solvent to form a modified novolac phenolic resin; mixing a tetralkoxy silane, an acid and water with the resulting organic solution containing the modified novolac phenolic resin, wherein hydrolysis and condensation reactions are carried out to form a —Si—O—Si— bonding; adding a curing agent for novolac phenolic resin to the resulting reaction mixture; evaporating the organic solvent and acid from the resulting mixture and heating the resulting mixture to form a novolac phenolic resin/silica hybrid organic-inorganic nanocomposite.
    Type: Grant
    Filed: June 14, 2004
    Date of Patent: April 29, 2008
    Assignee: Chung-Shan Institute of Science & Technology
    Inventors: Jeng-Cheng Yang, Chen-Chi Martin Ma, Hon-Bin Chen, Chin-Yih Chen
  • Patent number: 7354978
    Abstract: One of major objects of the invention is to provide an epoxy resin composition and a semiconductor device exhibiting good soldering resistance when being formed on a non-copper frame. Thus, this invention provides an epoxy resin composition for encapsulating a semiconductor comprising (A) an epoxy resin, (B) a phenolic resin, (C) a hardening accelerator, (D) an inorganic filler and (E) a triazole compound, preferably an epoxy resin composition for encapsulating a semiconductor wherein the triazole compound is a compound represented by general formula (1): wherein R1 represents hydrogen atom, or mercapto group, amino group, hydroxyl group or a hydrocarbon chain with 1 to 8 carbon atoms containing one or more of the functional groups as an end group.
    Type: Grant
    Filed: October 19, 2004
    Date of Patent: April 8, 2008
    Assignee: Sumitomo Bakelite Co.
    Inventor: Yoshinori Nishitani
  • Patent number: 7321005
    Abstract: A method of making an encapsulant composition. The method includes: providing a first quantity of resin material of epoxy or cyanate ester resins; adding to the first quantity of resin material a second quantity of flexibilizing agent; adding to the first quantity of resin material a third quantity of filler material; blending the resin material. After adding the flexibilizing agent, adding the filler material, and blending the resin material, applying the composition to a gap between a substrate and a semiconductor chip. After applying the composition to the gap, pregelling the composition. After pregelling the composition, substantially curing the composition.
    Type: Grant
    Filed: March 19, 2007
    Date of Patent: January 22, 2008
    Assignee: International Business Machines Corporation
    Inventor: Konstantinos I. Papathomas
  • Patent number: 7279574
    Abstract: The present invention provides a novel epoxy compound, which can be converted into a cured epoxy resin product having liquid crystal properties by curing with a curing agent. Since the cured epoxy resin product of the present invention exhibits good heat conductivity, it is also useful as an insulating material requiring high heat releasability such as a printed circuit substrate and the like.
    Type: Grant
    Filed: June 18, 2004
    Date of Patent: October 9, 2007
    Assignees: Sumitomo Chemical Company, Limited, Hitachi, Ltd.
    Inventors: Shinya Tanaka, Yoshitaka Takezawa, Hiroyuki Takahashi