Abstract: The method of the present invention includes grafting a glycidyl alkylene trialkoxy silane to a novolac phenolic resin in an organic solvent to form a modified novolac phenolic resin; mixing a tetralkoxy silane, an acid and water with the resulting organic solution containing the modified novolac phenolic resin, wherein hydrolysis and condensation reactions are carried out to form a —Si—O—Si— bonding; adding a curing agent for novolac phenolic resin to the resulting reaction mixture; evaporating the organic solvent and acid from the resulting mixture and heating the resulting mixture to form a novolac phenolic resin/silica hybrid organic-inorganic nanocomposite.

Abstract: One of major objects of the invention is to provide an epoxy resin composition and a semiconductor device exhibiting good soldering resistance when being formed on a non-copper frame. Thus, this invention provides an epoxy resin composition for encapsulating a semiconductor comprising (A) an epoxy resin, (B) a phenolic resin, (C) a hardening accelerator, (D) an inorganic filler and (E) a triazole compound, preferably an epoxy resin composition for encapsulating a semiconductor wherein the triazole compound is a compound represented by general formula (1): wherein R1 represents hydrogen atom, or mercapto group, amino group, hydroxyl group or a hydrocarbon chain with 1 to 8 carbon atoms containing one or more of the functional groups as an end group.

Abstract: A method of making an encapsulant composition. The method includes: providing a first quantity of resin material of epoxy or cyanate ester resins; adding to the first quantity of resin material a second quantity of flexibilizing agent; adding to the first quantity of resin material a third quantity of filler material; blending the resin material. After adding the flexibilizing agent, adding the filler material, and blending the resin material, applying the composition to a gap between a substrate and a semiconductor chip. After applying the composition to the gap, pregelling the composition. After pregelling the composition, substantially curing the composition.

Abstract: The present invention provides a novel epoxy compound, which can be converted into a cured epoxy resin product having liquid crystal properties by curing with a curing agent. Since the cured epoxy resin product of the present invention exhibits good heat conductivity, it is also useful as an insulating material requiring high heat releasability such as a printed circuit substrate and the like.

Abstract: A method for producing an epoxy resin composition for semiconductor encapsulation, which does not cause void generation and the like and is excellent in reliability. A method for producing an epoxy resin composition for semiconductor encapsulation, which contains the following components (A) to (C): (A) an epoxy resin, (B) a phenol resin, and (C) a hardening accelerator, which comprises mixing the whole or a part of the components excluding the component (A) among the components containing the components (A) to (C) in advance under a reduced pressure of from 1.333 to 66.65 kPa and under a heating condition of from 100 to 230° C., and then mixing the component (A) and remaining components with the resulting mixture.

Abstract: A process for production a high purity epoxy compound with total chlorine content of 500 ppm or less is characterized in that alkali metal hydroxide is added to a bifunctional epoxy compound represented by the general formula (I), in which content of the component with n=0 is not less than 70% and less than 100%, and that reaction is caused to take place at a temperature of 95-150° C.

Abstract: An epoxy resin composition for semiconductor encapsulation capable of giving semiconductor devices of high reliability that do not cause short circuits even in pitch reduction in the interconnection electrode distance or the conductor wire distance therein as well as a semiconductor device using the same. The epoxy resin composition for semiconductor encapsulation, which comprises the following components (A) to (C): (A) an epoxy resin, (B) a phenolic resin, and (C) an inorganic filler for preventing semiconductors from short-circuiting in a step of semiconductor encapsulation.

Abstract: This invention relates to epoxy resins containing indole as structural unit, indole resins and resin compositions containing said epoxy resins and indole resins useful for applications such as laminating, molding, casting and adhesion on account of their excellent fire retardance, adhesiveness, moisture resistance and heat resistance. The indole resins of this invention and the epoxy resins obtained therefrom are represented by the following general formulas I and II wherein R1 is H, alkyl or the like, X is a crosslinking group represented by —C(R2R3)— or C(R4R5)—Ar—C(R4R5)— (wherein R2-R5 are H, alkyl or the like and Ar is a benzene or biphenyl ring), G is glycidyl group and n is an integer of 1-20.

Abstract: A phosphoric ester demulsifier composition prepared by reacting one or more alkylphenol-formaldehyde resin alkoxylates or one or more polyalkylene glycols, or a mixture thereof, with about 0.001 to about 1.0 molar equivalents of one or more phosphorous compounds selected from phosphorous oxychloride, phosphorous pentoxide and phosphoric acid and a method of using the demulsifier composition to resolve water-in-oil emulsions.

Abstract: A composition for use in making an encapsulant usable in the encapsulation of a semiconductor chip assembled to a substrate with C4 solder interconnections therebetween, which in turn may form part of an electronic package. The composition comprises a resin, a flexibilizing agent and a filler material.

Abstract: A liquid epoxy resin composition comprising a liquid epoxy resin, an aromatic amine curing agent having a phenolic hydroxyl group in a skeleton, an inorganic filler, and a cure accelerator is useful for semiconductor encapsulation. The composition is adherent to the surface of silicon chips, does not deteriorate under hot humid conditions, and is fully resistant to thermal shocks.

Abstract: This invention relates to thermosetting resin compositions useful for mounting onto a circuit board semiconductor devices, such as CSPs, BGAs, LGAs and the like, each of which having a semiconductor chip, such as LSI, on a carrier substrate. The compositions of this invention are reworkable when subjected to appropriate conditions.

Abstract: A latent fluxing agent comprising a material which liberates phenol or a carboxylic acid containing compound when heated above 140° C. The latent fluxing agent may be incorporated into a thermoset resin, which includes an epoxy resin. The uncured epoxy resin, which includes the epoxy resin, the latent fluxing agent and an epoxy curing agent are useful as an underfill composition in a method for applying a chip die, having one or more solder balls, to a substrate. The method is used to produce an integrated circuit chip that includes a chip die having electrical contacts arranged in a predetermined pattern and capable of providing electrical engagement with a carrier substrate.

Abstract: The present invention provides an adhesive tape or sheet for application to skin, which is made of an adhesive composition containing an acrylic copolymer having a specific composition and a specific carboxylic acid ester, wherein the acrylic copolymer has a gel fraction adjusted to a specific range. The adhesive tape or sheet for skin of the present invention can be used for first aid adhesive plasters, surgical tapes, large adhesive plasters with a pad, dressing materials and the like.

Abstract: The invention provides new compositions of matter that are capable of forming cross-linked polymeric materials upon reaction with various known epoxy-containing compositions. Thus, the compositions of this invention are useful in the manufacturing of prepregs and laminates for PWB applications among many other uses. Preferred compositions of this invention include substituted hydroxyarylphosphine oxide mixtures, the glycidyl ether derivatives, or the epoxy resin oligomer adducts derived therefrom. The materials provide for laminates that have higher glass transition temperatures, improved thermal stability, and that are free of halogen.

Abstract: A carboxyl group-containing photosensitive resin is obtained by reacting an unsaturated group-containing monocarboxylic acid (d) with a reaction product (c) of a phenolic novolak resin (a) and an alkylene oxide (b) and further reacting a polybasic acid anhydride (f) with the resultant reaction product (e). A photocurable and thermosetting composition comprising (A) the carboxyl group-containing photosensitive resin mentioned above, (C) a photopolymerization initiator, and (D) an epoxy resin, or further comprising (B) a photosensitive (meth)acrylate compound, preferably further comprising (E) an organic solvent and/or (F) a curing catalyst is useful as an ultraviolet-curable type printing ink, various resists and interlaminar insulating materials to be used in the manufacture of printed circuit boards, or the like.

Abstract: A resin composition comprising the associated product of a polyimide resin having acid anhydride groups in the skeleton with an epoxy resin-curing catalyst, an epoxy resin, and optionally, an epoxy resin-curing agent has excellent adhesion, heat resistance, shelf stability and solvent resistance. An adhesive film comprising the resin composition is useful as an adhesive or sealant for printed circuit boards and semiconductor packages.

Abstract: The present invention discloses an active-hydrogen-containing phosphorus compound for cross-linking a resin and for imparting flame-retardancy to the cured resin, and in particular to a cured frame-retardant epoxy resin prepared by reacting the hardener with a di- or poly-functional epoxy resin via an addition reaction between the active hydrogen and the epoxide group. The present invention also discloses an epoxy resin made from the active-hydrogen-containing phosphorus compound and epihalohydrin.

Abstract: A process for preparing an epoxy resin involves the reaction of a polyhydric phenol with an epihalohydrin in a water-soluble solvent in the presence of an alkali reactive catalyst wherein a continuous distillation of the reaction product is conducted to (1) isolate a first recovered fraction containing unreacted epihalohydnn, water-soluble solvent and at most 0.01 part by weight of the by-product glycidol per one part by weight of unreacted epihalohydrin; (2) isolate a second recovered fraction containing unreacted epihalohydrin, the by-product glycidol and at most 0.01 part by weight of water-soluble organic solvent per one part by weight of unreacted epihalohydrin; (3) recover the epihalohydrin from the second recovered fraction by washing with water to remove the water-soluble organic solvent and glycidol; and (4) reuse the first recovered fraction and the recovered epihalohydrin from the second recovered fraction as a raw material of the reaction.

Abstract: Cycloaliphatic compounds I which have side chains containing epoxide groups are prepared by heterogeneously catalyzed hydrogenation of a compound II which comprises at least one carbocyclic aromatic group and at least one side chain containing at least one epoxide group over a ruthenium catalyst, wherein the ruthenium catalyst is obtainable by

Abstract: The present invention is directed to saturants for fibrous webs that will confer upon those webs the ability to be heat sealed to many materials without compromising the drapability of the fibrous webs. The present invention is further directed to fibrous webs saturated with the saturant of the present invention and methods for saturating such webs. The invention is further directed to packages or containers comprising the saturated webs and methods of manufacturing such packages. The invention is further directed to temperature sensitive adhesive coatings that can be used with the saturated webs and a method for applying the coating.

Abstract: Phenol/aldehyde resins particularly phenol/formaldehyde resins are manufactured by replacing a proportion of the phenol content by a mixture of at least two different natural materials having a phenolic content. The resulting resins which can be used in bonding composite materials are at least as effective as the resin using only phenol and more satisfactory environmentally.

Abstract: A conductive resin composition includes between 40 and 140 parts by weight of reactive epoxy resin, between 15 and 40 parts by weight of a reactive monofunctional glycidyl material, a cure accelerant, and 40 to 200 parts by weight of a conductive particulate material. The conductive resin composition forms a defect-free conductive coating on a substrate after mixing a one part epoxy resin composition under vacuum at a temperature insufficient to induce thermal cure. Adding a liquid epoxy resin to the one part epoxy resin composition to form a mixture combining 40 to 200 parts by weight of conductive particulate with the mixture and dispersing the combined conductive particulate and the mixture under vacuum until a homogeneous conductive resin paste results where the dispersing time for the combined conductive particulate and the mixture under vacuum is greater than or equal to the period of time of vacuum mixing the liquid one part epoxy composition.

Abstract: Heat curable compositions comprising: (A) at least one compound which is capable of undergoing cationic polymerization; (B) at least one quaternary ammonium salt of an aromatic-N-heterocyclic cation and of a non-nucleophilic anion; (C) at least one 1,1,2,2-substituted-1,2-ethane-diol and/or a derivative thereof, and (D) optionally further additives; and wherein said component (C) is a compound of formula (I), wherein each of R1, R2, and R3 independently of the other is unsubstituted phenyl or has one of the meanings of R4; R4 is substituted phenyl optionally substituted &agr;-naphthyl or &bgr;-naphthyl, or an optionally substituted aromatic heterocyclic ring system or each of R1 and R2 and/or R3 and R4 independently of the other form a residue of formula (II), wherein each of R5 and R6 independently of the other is hydrogen or (C1-C4)alkyl; R7 is —(CH2)n— or —S— or —O—; and n is 0, 1, 2, or 3.

Abstract: A process for manufacturing an &agr;-halohydrin intermediate and an epoxy resin prepared therefrom including epoxidizing an &agr;-halohydrin intermediate produced from an in situ halide substitution-deesterification of an &agr;-hydroxy ester derivative which has been obtained by the coupling reaction of a phenol or a mixture of phenols and a glycidyl ester optionally in the presence of a catalyst.

Abstract: An epoxy resin composition is disclosed as containing, as essential components, an epoxy resin, an aryl ester compound obtained from a polyhydric phenol representedd by a formula (4) with a carbonyl compound represented by a general formula (2) and a cure accelerator. When cured, the resulting product has low dielectric constant and a low dielectric loss tangent. A copper-clad laminate formed using the described composition has a low dielectric constant and a low dielectric loss tangent. The copper-clad laminate exhibits excellent adhesiveness characteristics and is suitable for use in multilayer printed wiring boards in high speed operations, particularly in the high frequency region.

Abstract: The present invention relates to resins obtained by reacting a compound of formula 1 with an aldehyde and alkoxylating, in any order: wherein X is —OH, Y is ortho-, meta- or para- to X and is a radical of formula 4, wherein R5 is a C1-C30-alkyl, C2-C30-alkenyl, C6-C18-aryl, or C7-C30-alkylaryl. The resin has a molecular mass from 250 to 100,000 and is useful in methods of breaking oil-water emulsions.

Abstract: A phosphorus-containing polymer having phenolic units and an epoxy rein composition are provided. The epoxy resin composition suitably comprises an epoxy resin and a hardener, wherein the epoxy resin may be obtained by reacting the polymer with epihalohydrin, and the polymer may further act as the hardener.

Abstract: The invention is a high molecular weight polyether polyol prepared by the reaction of one or more compounds having one or more active hydrogen compounds with one or more alkylene oxides in the presence of a catalyst comprising calcium having counterions of carbonate and a C6-10 alkanoate in a solvent or dispersant which does not contain active hydrogen atoms. The polyether polyol prepared preferably has an equivalent weight of from about 10,000 to about 30,000, a polydispersity of 1.3 or less and a residual catalyst level of from more than 0 to about 2000 parts per million (ppm). In another embodiment the invention is a process for preparing such high molecular weight polyether polyols. The process comprises first, contacting one or more compounds having one or more active hydrogen atoms with one or more alkylene oxides in the presence of a catalyst. The catalyst comprises calcium having counterions of carbonate and a C6-10 alkanoate in a solvent, wherein the solvent does not contain active hydrogen atoms.

Abstract: The preparation of allylated poly(vinyl chloride) by utilizing an allyltrialkylsilane in the presence of Friedel-Crafts acids is disclosed. The pendant allyl groups can be further reacted through various functionalization reactions to contain end groups such as epoxy and hydroxyl. Alternatively, an unsaturated group can be added to poly(vinyl chloride) utilizing a diene also in the presence of a Friedel-Crafts acid. These pendant groups can also be reacted to contain functional end groups such as hydroxyl and epoxy. In yet a further embodiment, the functionalized end groups such as pendant—OH groups of both the allylated and diene grafted poly(vinyl chloride) are further reacted with other monomers or polymer chains which thus results in a poly(vinyl chloride) chain having pendant monomers or polymers. These compositions are useful as compatibilizers for poly(vinyl chloride) and various other resins.

Abstract: Disclosed are epoxy resins prepared by reacting p-hydroxystyrene and epichlorohydrin in the presence of one or more alkali agents. Also disclosed are epoxy resins prepared from reacting a p-hydroxystyrene polymer and one or more di-hydric phenol agents with epichlorohydrin in the presence of alkali. These epoxide resins have a low melt viscosity and when cured exhibit glass transition temperatures above 300° C.

Abstract: The present invention provides: an aqueous primer coating composition of which the deterioration of the water resistance is prevented with the high adhesion maintained, and which is excellent in the gasohol resistance and the pigment dispersion stability; and a thing coated with this aqueous primer coating composition. The aqueous primer coating composition according to the present invention, comprises acid anhydride-modified poly(olefin chloride) emulsion resin (A), aqueous alkyd resin (B) and aqueous novolac-type epoxy resin (C), wherein the contents of the (A), (B), and (C) are (A) 20 to 60 weight %, (B) 10 to 60 weight %, and (C) 10 to 60 weight % in terms of solid content weight % to the total resin solid content in the composition. The coated thing, according to the present invention, is coated with the present invention aqueous primer coating composition.

Abstract: An aryl ester compound composed of a polyhydric phenol in which at least one OH group has been esterified with an organic acid or its derivatives having 1 to 20 carbon atoms, said polyhydric phenol being the condensation product of a phenolic compound represented by the general formula: 1

Abstract: The invention is related to an ovenable food tray (1) and its manufacturing method. The paperboard or cardboard tray is provided with at least one layer of polymeric coating (3, 4) which, according to the invention, is lying at least on the side of the tray coming into contact with the food and contains a polymerized crosslink structure which consists of an inorganic, chain or crosslinked polymeric backbone which contains alternating silicon and oxygen atoms and which comprises side chains and/or crosslinks formed by organic groups or chains. The tray (1) is manufactured by spreading, on the board (2), a mixture which contains reactive ingredients and which is polymerized to form a grease-tight, glassy coating (3, 4) that withstands heat, on at least one and preferably both sides of the paperboard, and by forming the tray from the thus obtained, coated paperboard. The polymerized ingredients can be organosilanes with which crosslinking organic compounds, such as epoxides, can be reacted.

Abstract: The invention is a high molecular weight polyether polyol prepared by the reaction of one or more compounds having one or more active hydrogen compounds with one or more alkylene oxides in the presence of a catalyst comprising calcium having counterions of carbonate and a C6-10 alkanoate in a solvent or dispersant which does not contain active hydrogen atoms. The polyether polyol prepared preferably has an equivalent weight of from about 1000 to about 20,000, a polydispersity of about 1.3 or less and a residual catalyst level of from about 0 to about 2000 parts per million (ppm).

Abstract: Disclosed are epoxides prepared by reacting a p-hydroxystyrene polymer and epichlorohydrin in the presence of one or more alkali agents. Also disclosed are epoxy agents prepared from reacting a p-hydroxystyrene polymer and one or more di-hydric phenol agents with epichlorohydrin in the presence of alkali. These new epoxide resins have a low melt viscosity and when cured exhibit glass transition temperatures above 300° C.

Abstract: A two-part adhesive is provided wherein the first part comprises a stable aqueous alkaline monohydroxylic phenolic resole resin solution containing a methylene donor such as oxazolidine or a methylolurea and the second part comprises a stable resorcinolic resin precondensate having a shortage of formaldehyde and optionally containing a catalyst such as an ester functional compound for the resole resin. The resin in each part exhibits viscosity stability of an unmodified resin until mixed with the other part wherein the methylene donor, of the first part catalyzes the resorcinolic resin of the second part and the catalyst, when used, of the second part catalyzes the monohydroxylic phenolic resole resin of the first part. The adhesive finds utility in the production of structural lignocellulosic panels.

Abstract: Melt processible thermoplastic compositions and method for making them are described, these compositions comprising a thermoplastic polymer resin matrix selected from the group consisting of thermoplastic polyurethanes, polyvinyl chlorides, styrenics, engineering thermoplastics, and polyolefins, at least about 25 percent (by weight based on the total composition) of an elastomeric impact modifier dispersed as discrete particles in the thermoplastic matrix (a); and at least about 10 percent (by weight based on the total composition) of at least one homogeneous linear or substantially linear ethylene polymer dispersed as discrete particles in at least the impact modifier (b), the ethylene polymer having a molecular weight distribution less than 3.5 and a density of at least 0.04 g/cm.sup.3 higher than the density of the impact modifier component (b), wherein the elastic modulus of the thermoplastic component (a) is at least 200 times greater than the elastic modulus of the impact modifier component (b).

Abstract: Providing a modified epoxy resin which is suitable for utilized as a coating for repairing, a process for the preparation thereof, and a composition. It is a modified epoxy resin obtained by reacting at least one epoxy resin (a) having at least one or more epoxy groups in a molecule with at least one kind of aliphatic monocarboxylic acid (b) having carbon atoms of 10 to 30 in a molecule in proportion of 20 to 80% by equivalent with respect to the epoxy groups in said epoxy resin, a process for the preparation of said resin by the use of a phosphorus-based catalyst, and a composition comprising said resin and a solvent.

Abstract: Free-flowing compression molding compositions made up of from about 40 to about 80 wt. % of organic filler, from about 20 to about 60 wt. % of an organic reactive resin, and optionally further auxiliary substances and additives. The reactive resin contains an epoxide which may be liquid, a latent catalyst and a powdered polyisocyanate which is solid at room temperature.

Abstract: This invention relates to a process for preparing a high purity epoxy resin comprising reacting an aromatic compound containing hyroxyl or amino group with an excess amount of an epihalohydrin in the presence of hydroxides of alkali metal or alkali earth metal in one or more low-boiling aprotic cosolvents under normal or reduced pressure with dewatering to obtain a high purity epoxy resin with low level of hydrolyzable halides.

Abstract: A two-component system for forming a sealing composition for bonding to unsanded, polymer-coated fiberglass surfaces. The system includes a resin component containing a major amount of epoxy resin, glycidoxy silane (0-2.5 wt. %) and hydrophilic-modified polyolefin fiber (0.5-10 wt. %), and a curing agent component having a major amount of amine curing agent and which may also contain amino silane (0-5 wt. %). The resin component may also contain alpha-phase alumina (20-80 wt. %), ceramic fiber (2-25 wt. %), and mica (2-20 wt. %). In another formulation, the resin component contains glycidoxy silane (0-2.5 wt. %), hydrophilic-modified polyolefin fiber (0.5-10 wt. %), ceramic fiber (2-25 wt. %), anti-foam material (0.2-1.0 wt. %), and epoxy novolac resin to 100 wt. %. The curing agent component contains amino silane (0-5 wt. %) and amine curing agent to 100 wt. %.

Abstract: Modified resole and novolac type phenolic resins which are toughened by poly(alkylene oxide) are disclosed. The modified resole type phenolic resin is prepared by the following steps: mixing a poly(alkylene oxide) having a weight average molecular weight of 100,000.about.8,000,000 and phenol in a weight ratio of poly(alkylene oxide): phenol=1.5:1.about.1:1 at an elevated temperature to form a glutinous mixture; mixing the glutinous mixture with an acid catalyst to obtain a viscous mixture having a relatively low viscosity compared to the glutinous mixture; and mixing the viscose mixture with a resole type phenolic resin. The modified novolac type phenolic resin is prepared by directly mixing the glutinous mixture with a liquid novolac type phenolic resin. The amount of the poly(alkylene oxide) mixed is 2.about.10 wt % based on the phenolic resin.

Abstract: An epoxy sealer/healer formulation for sealing and strengthening cracked concrete comprising an epoxy resin, an amine and a dialkylene triamine-alkylene oxide adduct, where the formulation provides a modulus and/or compressive strength at least that of uncracked concrete and effective for penetrating a concrete crack at a rate of at least 10 mm/min for a crack 0.5 mm wide when applied by gravity feed. The epoxy sealer/healer preferably has a viscosity of less than 100 centipoise and a tack-free time of less than 12 hours. The epoxy sealer/healer is advantageous in being able to bond to moist concrete surfaces. A method of using the epoxy sealer/healer for sealing and restoring the strength of cracked concrete is also set forth.

Abstract: The present invention relates to polyglycidyl ether compounds containing at least three mono- or divalent radicals A of the general formula wherein R.sub.

Abstract: The present invention relates to a storage-stable, phosphorus-modified epoxy resin having an epoxide value of 0.05 to 0.6 mol/100 g and comprising 5 to 25% by weight of an ester-anhydride formed from a phosphonic acid diester, phosphinic acid ester or mixture of these esters and phosphorus pentoxide, and to a process for its preparation by reaction of 95 to 75 parts by weight of an epoxy resin (A) having an epoxide value of 0.1 to 0.8 mol/100 g and 5 to 25 parts by weight of the ester-anhydride in the presence or absence of a solvent at -20 to 150.degree. C.

Abstract: This invention relates to coating compositions including one or more resins having amino-reactive groups; one or more polyamine curing agents; and one or more aminourethanes. The aminourethanes can be reaction products of (i) oligomeric or polymeric compounds which contain at least one, preferably two or more terminal 2-oxo-1,3-dioxolane groups (cyclic carbonate groups), and (ii) amines containing at least one primary, preferably two or more primary and, if desired, also secondary and tertiary amino groups. The ratios of equivalents of C1):C2) typically is from 1:1 to 1:10, preferably from 1:1.05 to 1:5 and particularly preferably from 1:1.1 to 1:2, and the end product preferably contains one or more free primary amino groups. The composition further may contain, if desired, pigments, fillers, one or more organic solvents, water and conventional additives.

Abstract: The invention relates to a flame-resistant epoxy resin mixture comprising epoxy resins, phosphorus-containing compounds and a curing agent, wherein the epoxy resin mixture comprises phosphorus-containing structural units of the formula I ##STR1## in which R1 is an alkyl or aryl group having from 1 to 10 carbon atoms, R2 is hydrogen or an alkyl group having from 1 to 4 carbon atoms and R is an alkylene, cycloalkylene or arylene group having from 2 to 20 carbon atoms.

Abstract: Epoxy resin mixtures to produce prepregs and composites contain the following components:a phosphorus-modified epoxy resin with an epoxy value of 0.02 to 1 mol/100 g, made up of structural units derived from(a) polyepoxy compounds with at least two epoxy groups per molecule and(b) phosphinic acid anhydrides, phosphonic acid anhydrides or phosphonic acid half-esters;dicyandiamide and/or an aminobenzoic acid derivative as the hardener;an amino hardening accelerator.

Abstract: For better flame-retardant finishing and better workability of an epoxy-anhydride reaction resin system, it is proposed to supplement the reaction resin system with phosphonic semi-ester as additional reactive constituents. These are produced by conversion of phosphonic acid anhydride with single-valent or multi-valent alcohols. As a result of the selection of the alcohol constituent, property features of the molding material modified therewith that are already advantageous can be designationally set without thereby negatively influencing the hardening characteristic. Even with slight parts of phosphonic acid semi-ester, shaped members manufactured therefrom exhibit an adequate flame-retardant behavior given an otherwise unmodified property profile.