Contains Nitrogen Atom Patents (Class 525/526)
  • Patent number: 9169417
    Abstract: A solid epoxy resin powder coating composition which includes a divinylarene dioxide resin as one component; and wherein the solid epoxy resin powder coating composition can be formed by blending or reacting various other components with the divinylarene dioxide resin. For example, other components can include other epoxy resins; phenolic resins; or monomeric and/or polymeric isocyanates. The powder coating composition or formulation may advantageously provide, for example, a Fusion Bonded Epoxy coating on a substrate.
    Type: Grant
    Filed: June 20, 2011
    Date of Patent: October 27, 2015
    Assignee: Blue Cube IP LLC
    Inventors: Maurice J. Marks, Fabio Aguirre Vargas
  • Publication number: 20150111994
    Abstract: Provided is an epoxy-amine adduct that offers high reactivity, contributes to better adhesion between a resin and a reinforcing fiber in a fiber-reinforced composite material, and can be easily blended with another component such as a resin. The epoxy-amine adduct has two or more amino groups per molecule and is obtained by a reaction of an epoxy compound (A) having two or more alicyclic epoxy groups per molecule with an amine compound (B) having two or more amino groups per molecule.
    Type: Application
    Filed: April 30, 2013
    Publication date: April 23, 2015
    Inventor: Masanori Sakane
  • Publication number: 20150051315
    Abstract: The present disclosure provides a phenolic-free composition containing a benzoxazine, epoxy resin and acid anhydride. The phenolic-free composition, upon curing, renders void free cured articles having well balanced thermal, chemical and mechanical properties. The phenolic-free composition may be used in a variety of applications, such as in coatings, structural composites and encapsulating systems for electronic and electrical components.
    Type: Application
    Filed: February 7, 2013
    Publication date: February 19, 2015
    Inventors: Dong Wang, Derek Kincaid, Wenfeng Kuang, K.P. Subrahmanian, Leo Arguelles
  • Patent number: 8927663
    Abstract: An epoxy resin hardener composition including a reaction product of (i) a compound having at least one vicinal epoxy group, and (ii) an amino alcohol; an epoxy resin composition including the epoxy resin hardener composition and a compound having at least one vicinal epoxy group; and a powder coating composition including particles of the epoxy resin hardener composition and particles of a compound having at least one vicinal epoxy group.
    Type: Grant
    Filed: March 4, 2013
    Date of Patent: January 6, 2015
    Assignee: Dow Global Technologies LLC
    Inventors: Joseph Gan, Carola Rosenthal, Matthieu M. Eckert, Bernhard Kainz, Emile C. Trottier
  • Publication number: 20150005458
    Abstract: The present invention relates to a matrix material for a carbon fiber-reinforced composite. The matrix material for the carbon fiber composite contains a matrix resin as a resin component. The matrix resin contains at least a first epoxy resin containing a polyfunctional glycidylamine-type epoxy resin having four epoxy groups in one molecule. The matrix resin may further contain at least one of a p-aminophenol-type epoxy resin having three epoxy groups in one molecule, and a tetramethylbiphenol-type solid epoxy resin having two epoxy groups in one molecule. The matrix resin has an average epoxy equivalency of 99 to 163.
    Type: Application
    Filed: June 17, 2014
    Publication date: January 1, 2015
    Inventor: Shuichiro Yoshida
  • Patent number: 8912295
    Abstract: It is an object to provide a liquid thermosetting composition that yields an epoxy resin having physical properties of the cured product such as high flexural strength along with adequate handleability as liquid, to be used in transparent sealants for optical semiconductors, such as transparent sealants for LEDs (light-emitting devices) and the like. There is provided a thermosetting composition containing an epoxy compound that a side chain between a triazinetrione ring and an epoxy group substituted on the triazinetrione ring is long (elongated).
    Type: Grant
    Filed: February 9, 2010
    Date of Patent: December 16, 2014
    Assignee: Nissan Chemical Industries, Ltd.
    Inventors: Toshiaki Takeyama, Takeo Moro
  • Patent number: 8877837
    Abstract: A process for curing epoxy resins which comprises curing epoxy resin compositions comprising a) epoxy resins and b) a compound of the general formula I in which R1 and R2 independently of one another are hydrogen, C1-C6-alkyl, C1-C4-alkoxy-C1-C4-alkyl, C5-C6-cycloalkyl, phenyl, phenyl-C1-C4-alkyl, C2-C6-alkenyl or C2-C6-alkynyl, or R1 and R2 together are a C3-C11-alkylene group; R3 and R4 independently of one another are hydrogen, C1-C6-alkyl, C1-C4-alkoxy-C1-C4-alkyl, C5-C6-cycloalkyl, phenyl, phenyl-C1-C4-alkyl, C2-C6-alkenyl or C2-C6-alkynyl, or R3 and R4 together are a C4-C6-alkylene group; by adding amino hardeners, and the curing takes place in the presence of a compound of the following formula II in which at least one of the radicals R11, R12 and R13 is a hydrocarbon group having 1 to 10 C atoms, which is substituted with a hydroxyl group and optionally remaining radicals R11 to R13 are an unsubstituted hydrocarbon group having 1 to 10 C atoms.
    Type: Grant
    Filed: September 12, 2012
    Date of Patent: November 4, 2014
    Assignee: BASF SE
    Inventors: Miran Yu, Rainer Klopsch
  • Patent number: 8859695
    Abstract: A hem-curing epoxy resin composition, that includes an epoxy resin A having more than one epoxy group per molecule on average; a curing agent B for epoxy resins, which is activated at a temperature in a range of 100° C. to 220° C.; and an activator C for epoxy resin compositions, wherein activator C is a compound of formula (I), or is a reaction product between a compound of formula (Ia) and an isocyanate or an epoxide.
    Type: Grant
    Filed: May 29, 2013
    Date of Patent: October 14, 2014
    Assignee: Sika Technology AG
    Inventors: Karsten Frick, Ulrich Gerber, Juergen Finter, Andreas Kramer
  • Patent number: 8853734
    Abstract: Provided are: a curable epoxy resin composition including an alicyclic epoxy compound (A), a monoallyl diglycidyl isocyanurate compound (B) represented by following Formula (1) where each of R1s and R2 represents a hydrogen atom or an alkyl group having 1 to 8 carbon atoms, and a curing agent (C) or curing catalyst (D); and a cured article obtained through curing of the curable epoxy resin composition. The alicyclic epoxy compound (A) preferably has cyclohexene oxide group as the alicyclic epoxy group.
    Type: Grant
    Filed: January 21, 2011
    Date of Patent: October 7, 2014
    Assignee: Daicel Corporation
    Inventors: Hiroto Takenaka, Atsuo Tatsumi
  • Patent number: 8835574
    Abstract: Novel adhesive compositions that can be used in the die attach process. The adhesives include a curable resin component, a curing agent, and a block copolymer additive. The block copolymer additive has a glass transition temperature of at least about 40° C. The block copolymer additive improves the affinity of the adhesive composition to a hydrophilic substrate, such as a silicon wafer, during the die pickup process. Also disclosed is an assembly which includes a hydrophilic substrate and a layer of adhesive and methods of producing the assembly.
    Type: Grant
    Filed: November 19, 2012
    Date of Patent: September 16, 2014
    Assignee: Henkel IP Holding GmbH
    Inventors: My Nguyen, Tadashi Takano, Puwei Liu
  • Publication number: 20140235757
    Abstract: The present invention is an epoxy resin composition characterized by containing component A (epoxy resin containing sulfur atoms in the molecule thereof); and component B (an epoxy resin composition containing an imidazole compound represented by formula (1), and at least one of the following components: component C (an imidazole compound represented by formula (2) below) or component D (an epoxy resin composition having at least one sulfur atom in the molecule. According to the present invention, it is possible to provide an epoxy resin composition which has outstanding stability when stored at room temperature, and which can be heat-cured at a relatively low temperature and over a short time, to give a resin with a high heat resistance when cured. (In formula (1), R1 represents a straight-chain or branched-chain alkyl group having 1 to 5 carbon atoms, or a hydroxymethyl group, R2 represents a straight-chain or branched-chain alkyl group having 1 to 5 carbon atoms, or a hydrogen atom.
    Type: Application
    Filed: November 29, 2012
    Publication date: August 21, 2014
    Applicant: Mitsubishi Rayon Co., Ltd.
    Inventors: Yasuhiro Fukuhara, Hisaya Ushiyama, Manabu Kaneko
  • Publication number: 20140186593
    Abstract: Disclosed herein are a resin composition for a printed circuit board, an insulating film, a prepreg, and a printed circuit board, the resin composition including: a composite epoxy resin containing a bisphenol A type epoxy resin, a cresol novolac epoxy resin, a rubber-modified epoxy resin, a phosphorus based epoxy resin, and an alkyl sulfonated tetrazole-modified epoxy resin; and a curing agent. The insulating film and the prepreg according to the present invention may have basically low coefficient of thermal expansion, excellent heat resistance, a high glass transition temperature, and excellent adhesion force with the metal.
    Type: Application
    Filed: December 24, 2013
    Publication date: July 3, 2014
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Young Kwan Seo, Jin Won Lee, Sung Nam Cho, Jun Young Kim, Hyun Jung Lee
  • Patent number: 8759422
    Abstract: An adhesive composition comprising elastomeric polymer, epoxy resin, reactive diluent, and filler, is suitable for use within the electronics industry, and in particular for wafer back side coating adhesives. The elastomeric polymer is a mixture of a vinyl elastomer and an epoxy elastomer; the reactive diluent is a combination of two or more diluents, one of which must have carbon to carbon unsaturation, providing cross-linking within the composition after cure; and the filler is a non-conductive filler.
    Type: Grant
    Filed: March 13, 2013
    Date of Patent: June 24, 2014
    Assignee: Henkel IP & Holding GmbH
    Inventors: Eric C. Wang, Kevin Harris Becker, Qizhuo Zhuo
  • Patent number: 8742024
    Abstract: A mixture of superabsorbents having differing surface postcrosslinking, more particularly a mixture of differingly surface-postcrosslinked sieve cuts of a base polymer, exhibits improved absorption and retention over a unitarily surface-postcrosslinked superabsorbent.
    Type: Grant
    Filed: November 12, 2009
    Date of Patent: June 3, 2014
    Assignee: BASF SE
    Inventors: Stefan Bruhns, Thomas Daniel, Dieter Hermeling, Ulrich Riegel
  • Patent number: 8735511
    Abstract: A curing resin composition that cures in two stages: photo cure and thermal cure, hardly contaminates a liquid or liquid crystals when in contact with, and provides high adhesive strength, particularly a curing composition that photocures sufficiently even when shadowed by TFT wires, a black matrix, etc. in photocuring; and a sealant, a sealant for ODF (one-drop-fill), and an LCD containing the curing resin composition.
    Type: Grant
    Filed: April 20, 2011
    Date of Patent: May 27, 2014
    Assignee: Adeka Corporation
    Inventors: Hirokatsu Shinano, Hiroya Fukunaga, Kazuyuki Itano
  • Patent number: 8729197
    Abstract: Room temperature curing epoxy adhesives that show good adhesion to plastic substrates are described. The adhesives contain an epoxy resin component comprising a first epoxy resin and a second epoxy resin; a first amine curing agent having an equivalent weight of at least 50 grams per mole of amine equivalents; a second amine curing agent having an equivalent weight of no greater than 45 grams per mole of amine equivalents; an acetoacetoxy-functionalized compound; a metal salt catalyst; and a multifunctional acrylate.
    Type: Grant
    Filed: July 19, 2011
    Date of Patent: May 20, 2014
    Assignee: 3M Innovative Properties Company
    Inventor: Michael A. Kropp
  • Patent number: 8729196
    Abstract: This invention discloses cationic electrodeposition paint compositions which comprise specific amino group-containing modified epoxy resin, specific xylene-formaldehyde resin-modified, amino group-containing epoxy resin and blocked polyisocyanate curing agent at specific blend ratios, and which can form coating film of excellent film thickness retention, finished appearance and electrocoatability on galvanized alloy steel sheet and of good corrosion resistance, even when the amount of volatile organic compound in the cationic electrodeposition paint is reduced.
    Type: Grant
    Filed: August 27, 2008
    Date of Patent: May 20, 2014
    Assignee: Kansai Paint Co., Ltd.
    Inventors: Shigeo Nishiguchi, Akihiko Shimasaki
  • Patent number: 8729213
    Abstract: A curing agent composition including at least one benzylated polyamine compound. The benzylated polyamine compound is a reaction product of a benzaldehyde compound or benzyl halide compound and a polyamine according to the following formula: H2N—CH2-A-CH2-NH2 where A is a phenylene group or a cyclohexylene group. A method for making the curing agent composition and an amine-epoxy composition are also disclosed.
    Type: Grant
    Filed: September 23, 2011
    Date of Patent: May 20, 2014
    Assignee: Air Products and Chemicals, Inc.
    Inventors: Williams Rene Edouard Raymond, Gamini Ananda Vedage
  • Patent number: 8722816
    Abstract: A solder resist having both adequate sensitivity at photo-irradiation and alkali developability, and the solder resist forming a cured product which is excellent in dimensional stability against temperature change, does not exhibit brittleness, and further, is excellent in water resistance, electrical insulation, thermal cycle test resistance (TCT resistance) and the like is provided, and further, a dry film having a solder resist layer, a cured product and a printed wiring board are provided. The solder resist comprising an acid-modified vinyl ester synthesized from an epoxy compound, a phenol compound, an unsaturated monobasic acid and a polybasic acid anhydride, wherein the epoxy compound contains a crystalline epoxy resin having a melting point of 90° C. or more, and the phenol compound contains a compound having a bisphenol S structure.
    Type: Grant
    Filed: March 4, 2008
    Date of Patent: May 13, 2014
    Assignees: Nippon Shokubai Co., Ltd., Taiyo Holdings Co., Ltd.
    Inventors: Nobuaki Otsuki, Manabu Akiyama, Shouji Minegishi, Masao Arima
  • Patent number: 8710158
    Abstract: The present invention has a purpose of providing an epoxy composition for encapsulating an optical semiconductor element which composition provides a cured product having a low gas permeability and excellent curability in a form of a thin film together with good light transmission and crack resistance. The present invention provides a composition comprising (A) a silicone-modified epoxy compound represented by the formula (1), (B) a curing agent and (C) a polyhydric alcohol. The present invention further provides a composition comprising a composition prepared by reacting (A) the silicone-modified epoxy compound, (B) the curing agent and (C) the polyhydric alcohol and (D) a curing catalyst, and a cured product thereof.
    Type: Grant
    Filed: April 6, 2011
    Date of Patent: April 29, 2014
    Assignee: Shin-Etsu Chemical Co., Ltd.
    Inventors: Manabu Ueno, Miyuki Wakao, Tsutomu Kashiwagi
  • Patent number: 8686069
    Abstract: The solvent resistance of epoxy resins toughened with polyethersulfone is improved by using low molecular weight polyethersulfone. The resulting thermoplastic toughened epoxy resins are useful for making prepreg for aerospace applications.
    Type: Grant
    Filed: October 12, 2010
    Date of Patent: April 1, 2014
    Assignee: Hexcel Corporation
    Inventor: Yen-Seine Wang
  • Patent number: 8679632
    Abstract: A powdered epoxy coating composition for coating a substrate. The coating composition comprises: (a) from about 50 wt % to about 90 wt % of at least one epoxy resin; (b) from about 1 wt % to about 30 wt % of at least one catechol novolak-type adhesion promoter; and (c) from about 0.1 wt % to about 5 wt % of magnesium oxide. The coating may also include from about 10 wt % to about 48 wt % of an inorganic filler. The coating composition provides improved adhesion at high temperature operating conditions and improved resistance to damage by cathodic disbondment for pipe, rebar, and other substrates.
    Type: Grant
    Filed: February 12, 2010
    Date of Patent: March 25, 2014
    Assignee: 3M Innovative Properties Company
    Inventor: Mark A. Smith
  • Patent number: 8673108
    Abstract: This invention relates to compositions useful as adhesives and more particularly to the preparation of epoxy-based adhesive composition with improved impact resistance and good adhesion to oily metal substrates.
    Type: Grant
    Filed: February 2, 2009
    Date of Patent: March 18, 2014
    Assignee: Henkel AG & Co. KGaA
    Inventors: Jeng-Li Liang, Rajat K. Agarawal, Gregory A. Ferguson, Olaf Lammerschop, Frank Dittrich, Rainer Schoenfeld
  • Publication number: 20140039136
    Abstract: Embodiments of the present disclosure include a thermoset cross-linked network and a method of producing the thermoset cross-linked network from a reaction product of a curable epoxy system in a liquid phase and cross-linked reactive polymer microparticles in a solid phase. For the various embodiments, the cross-linked reactive polymer microparticles have a cross-link density and reactive groups that covalently react with the curable epoxy system to provide the thermoset cross-linked network in a single contiguous phase having a topological heterogeneity.
    Type: Application
    Filed: April 16, 2012
    Publication date: February 6, 2014
    Applicant: DOW GLOBAL TECHNOLOGIES LLC
    Inventors: Tamara Dikic, Tom Verbrugge, Matteo Traina, Jocelyne Galy, Jean-Francois Gerard, Ludo Aerts
  • Patent number: 8637614
    Abstract: Epoxy reactive liquid modifiers include acrylate functionalized compounds, acrylamide functionalized compounds, oxalic amide functionalized compounds, actoacetoxy functionalized urethanes and acetoacetoxy functionalized polyalkenes. The reactive liquid modifiers are incorporated into epoxy resin compositions comprising a curable epoxy resin, an amine curing agent, and the reactive liquid modifier, wherein the reactive liquid modifier is polymerized to form at least one of an interpenetrating polymer network and a semi-interpenetrating polymer network with the curable epoxy resin.
    Type: Grant
    Filed: July 22, 2009
    Date of Patent: January 28, 2014
    Assignee: 3M Innovative Properties Company
    Inventors: Ilya Gorodisher, Alphonsus V. Pocius, Babu N. Gaddam, Richard G. Hansen
  • Patent number: 8604102
    Abstract: The disclosure provides a thermosetting composition, including: (a) about 1-35 wt % of an oligomer, wherein the oligomer is obtained by reacting a liquid epoxy resin with an aromatic primary amine having four active hydrogen atoms, and the liquid epoxy resin and the primary amine have an equivalent mole ratio of 1:0.15-1:2.50; (b) about 5-10 wt % of a long chain resin; (c) about 50-80 wt % of an epoxy resin having at least two functional groups; and (d) about 5-15 wt % of a plasticizer.
    Type: Grant
    Filed: May 23, 2011
    Date of Patent: December 10, 2013
    Assignee: Industrial Technology Research Institute
    Inventors: Tien-Shou Shieh, Pei-Ching Liu
  • Publication number: 20130310485
    Abstract: Embodiments of the present disclosure include an epoxy-adduct hardening agent formed as a reaction product of a first adduct formed as a reaction product of a first epoxy resin and a polyether monoamine and second adduct formed as a reaction product of an ethyleneamine and a glycidyl ether. Embodiments include a curable composition having an epoxy resin and the epoxy-adduct hardening agent.
    Type: Application
    Filed: October 17, 2011
    Publication date: November 21, 2013
    Applicant: DOW GLOBAL TECHNOLOGIES LLC
    Inventors: Markus Schrötz, Christina Fritsche, Marcus Pfarherr, Juergen Gaebel
  • Patent number: 8586653
    Abstract: A process for curing an epoxy resin composition containing an epoxy resin and a compound of the general formula I: where R1 and R2 independently are hydrogen, C1-C6-alkyl, C1-C4-alkoxy-C1-C4-alkyl, C5-C6-cycloalkyl, phenyl, phenyl-C1-C4-alkyl, C2-C6-alkenyl or C2-C6-alkynyl, or R1 and R2 together are a C3-C11-alkylene group; and where R3 and R4 independently are hydrogen, C1-C6-alkyl, C1-C4-alkoxy-C1-C4-alkyl, C5-C6-cycloalkyl, phenyl, phenyl-C1-C4-alkyl, C2-C6-alkenyl or C2-C6-alkynyl, or R3 and R4 together are a C4-C6-alkylene group. The process includes adding amino hardeners, where 0.1% to 50% by weight of the amino hardeners are aliphatic, cycloaliphatic or aromatic amine compounds having 1 to 4 primary amino groups and optionally further functional groups, selected from secondary amino groups, tertiary amino groups, and hydroxyl groups.
    Type: Grant
    Filed: September 13, 2012
    Date of Patent: November 19, 2013
    Assignee: BASF SE
    Inventors: Rainer Klopsch, Miran Yu
  • Publication number: 20130295381
    Abstract: A curing agent for epoxy resins that is comprised of the reaction product of an amine, an epoxy resin, and an elastomer-epoxy adduct; compositions containing the curing agent and an epoxy resin; the compositions are useful in electronic displays, circuit boards, semi conductor devices, flip chips and other applications.
    Type: Application
    Filed: July 5, 2013
    Publication date: November 7, 2013
    Inventors: Yurong Ying, John J. McNamara, Jing Liang, Rong-Chang Liang
  • Patent number: 8536284
    Abstract: The present invention provides N,N?-dimethyl secondary diamine polymers including methylamine-terminated poly-(N-methylazetidine) and methylamine-terminated poly-(N-methylazacycloheptane). Amine compositions and amine-epoxy compositions comprising N,N?-dimethyl secondary diamine polymers are also disclosed.
    Type: Grant
    Filed: January 19, 2010
    Date of Patent: September 17, 2013
    Assignee: Air Products & Chemicals, Inc.
    Inventors: Frederick Herbert Walker, Michael Ian Cook, Gamini Ananda Vedage, Robert Marjo Theodoor Rasing, Vipul P. Dholakia
  • Patent number: 8524660
    Abstract: The invention relates to novel polyalkylene glycol compounds and methods of using them. In particular, compounds comprising a novel polyethylene glycol conjugate are used alone, or in combination with antiviral agents to treat a viral infection, such as chronic hepatitis C.
    Type: Grant
    Filed: September 12, 2011
    Date of Patent: September 3, 2013
    Assignee: Biogen Idec MA Inc.
    Inventors: KoChung Lin, R. Blake Pepinsky, Ling Ling Chen, Donna M. Hess, Edward Y. Lin, Russell C. Petter, Darren P. Baker
  • Patent number: 8524808
    Abstract: The invention is a radiation curable coating composition containing epoxyacrylate formed by ring opening reaction between (meth)acrylic acid and a self-dispersing epoxy resin in an aqueous system.
    Type: Grant
    Filed: November 12, 2005
    Date of Patent: September 3, 2013
    Assignee: IGM Group B.V.
    Inventors: Rainer Hoefer, Laurence Druene, Jean-Marc Ballin, Morgan Garinet
  • Patent number: 8518208
    Abstract: Thermosetting adhesive compositions formed from an epoxy resin containing nano-sized core-shell particles, one or more thermoplastic toughening agent containing an amine-terminated polyethersulfone, and at least one multi-functional epoxy resin, together with at least one amine curing agent to allow full cure of the adhesive composition up to 400° F. are provided herein. Such compositions are useful for forming adhesive films that can bond composite/metal/honeycomb structures for aerospace including bonding of aircraft leading or trailing edges, acoustic nacelle structures, horizontal and vertical tail, and various other structures, as well as for other high performance industrial applications.
    Type: Grant
    Filed: August 26, 2010
    Date of Patent: August 27, 2013
    Assignee: Cytec Technology Corp.
    Inventor: Dalip Kohli
  • Publication number: 20130217805
    Abstract: An epoxy resin composition containing an epoxy resin [A1], epoxy resin [B1], epoxy resin [C1] and curing agent [D] wherein [A1] is a bisphenol-type epoxy resin with a softening point of 90° C. or more, [B1] is a tri- or higher functional amine-type epoxy resin, [C1] is a bisphenol F-type epoxy resin with a number average molecular weight of 450 or less, and the epoxy resins [A1] to [C1] satisfy the following contents per 100 parts by mass of total epoxy resin content: [A1] 20 to 50 parts by mass, [B1] 30 to 50 parts by mass and [C1] 10 to 40 parts. The present invention provides low-viscosity epoxy resin compositions that are excellent in impregnating reinforcing fibers and capable of producing cured resins with excellent modulus and toughness, as well as prepregs and fiber-reinforced composite materials based on those epoxy resin compositions.
    Type: Application
    Filed: September 26, 2011
    Publication date: August 22, 2013
    Applicant: TORAY INDUSTRIES, INC.
    Inventors: Mami Hayashi, Takayuki Fujiwara, Jun Misumi, Kenichi Yoshioka
  • Patent number: 8450433
    Abstract: Provided are a resin composition for the manufacture of marble chips including a halogenated epoxy resin binder and showing high heat resistance, high chemical resistance, high impact resistance, high specific gravity and high transparency, a marble chip manufacturing method using the resin composition and an artificial marble made from marble chips.
    Type: Grant
    Filed: August 13, 2010
    Date of Patent: May 28, 2013
    Inventor: Young-Min Kim
  • Publication number: 20130079436
    Abstract: A process for curing an epoxy resin composition containing an epoxy resin and a compound of the general formula I: where R1 and R2 independently are hydrogen, C1-C6-alkyl, C1-C4-alkoxy-C1-C4-alkyl, C5-C6-cycloalkyl, phenyl, phenyl-C1-C4-alkyl, C2-C6-alkenyl or C2-C6-alkynyl, or R1 and R2 together are a C3-C11-alkylene group; and where R3 and R4 independently are hydrogen, C1-C6-alkyl, C1-C4-alkoxy-C1-C4-alkyl, C5-C6-cycloalkyl, phenyl, phenyl-C1-C4-alkyl, C2-C6-alkenyl or C2-C6-alkynyl, or R3 and R4 together are a C4-C6-alkylene group. The process includes adding amino hardeners, where 0.1% to 50% by weight of the amino hardeners are aliphatic, cycloaliphatic or aromatic amine compounds having 1 to 4 primary amino groups and optionally further functional groups, selected from secondary amino groups, tertiary amino groups, and hydroxyl groups.
    Type: Application
    Filed: September 13, 2012
    Publication date: March 28, 2013
    Applicant: BASF SE
    Inventors: Rainer KLOPSCH, Miran YU
  • Patent number: 8389652
    Abstract: An epoxy resin hardener composition including a reaction product of (i) a compound having at least one vicinal epoxy group, and (ii) an amino alcohol; an epoxy resin composition including the epoxy resin hardener composition and a compound having at least one vicinal epoxy group; and a powder coating composition including particles of the epoxy resin hardener composition and particles of a compound having at least one vicinal epoxy group.
    Type: Grant
    Filed: January 6, 2009
    Date of Patent: March 5, 2013
    Assignee: Dow Global Technologies LLC
    Inventors: Joseph Gan, Matthieu M. Eckert, Carola Rosenthal, Bernhard Kainz, Emile C. Trottier
  • Patent number: 8372922
    Abstract: An one-part epoxy resin composition for the use of bonding of a coil which is preferable for impregnation of a motor and a generator for an automobile, especially of a drive motor-generator set for a hybrid car, which has superior storage stability and a cured resin of the composition has excellent adhesion properties, thermal stability, and reliability, are provided. The one-part epoxy resin composition of the present invention comprises (A) a bisphenol A type and/or F type epoxy resin which is in liquid form at room temperature, (B) methylnadic anhydride as a cycloaliphatic anhydride which is in liquid form at room temperature, and (C) a nitrogen-containing latent hardening accelerator.
    Type: Grant
    Filed: September 11, 2007
    Date of Patent: February 12, 2013
    Assignee: Somar Corporation
    Inventors: Tetsushi Takata, Takayuki Kawano
  • Publication number: 20130005855
    Abstract: Disclosed is a carbon-fiber-reinforced composite material that is suitable for use as a construction material and exhibits high mechanical strength in harsh usage environments such as low-temperature environments and high-temperature moisture-absorbing environments. Also disclosed are an epoxy resin composition for producing the aforementioned carbon-fiber-rein-forced composite material and a prepreg obtained through the use of said epoxy resin composition. Said epoxy resin composition comprises at least the following constituents, by mass with respect to the total mass of the composition: (A) between 20% and 80% of an epoxy resin having the structure represented by formula (1); and (B) between 10% and 50% of an epoxy resin that has at least two ring structures with four or more members each and also has one amine glycidyl or ether glycidyl directly connected to a ring structure.
    Type: Application
    Filed: December 24, 2010
    Publication date: January 3, 2013
    Inventors: Atsuhito Arai, Hiroaki Sakata, Hiroshi Taiko, Michiya Ishikawa, Hidetoshi Kato, Jiro Nakatani
  • Patent number: 8338536
    Abstract: Novel adhesive compositions that can be used in the die attach process. The adhesives include a curable resin component, a curing agent, and a block copolymer additive. The block copolymer additive has a glass transition temperature of at least about 40° C. The block copolymer additive improves the affinity of the adhesive composition to a hydrophilic substrate, such as a silicon wafer, during the die pickup process. Also disclosed is an assembly which includes a hydrophilic substrate and a layer of adhesive and methods of producing the assembly.
    Type: Grant
    Filed: September 17, 2010
    Date of Patent: December 25, 2012
    Assignee: Henkel Corporation
    Inventors: My Nguyen, Tadashi Takano, Puwei Liu
  • Patent number: 8309665
    Abstract: A multi-component curable composition which is reactive upon admixing of the components and wherein the composition comprises: A. a first component which comprises: (i) a first amine functional adduct which comprises the reaction product of a stoichiometric excess of a diamine and a compound having an epoxide group and an alpha, beta unsaturated carbonyl group; B. a second component which comprises: (i) at least one compound having an average of more than 2.0 groups per molecule which are reactive with amines.
    Type: Grant
    Filed: January 23, 2012
    Date of Patent: November 13, 2012
    Assignee: The Sherwin-Williams Company
    Inventor: David M. Parish
  • Patent number: 8309666
    Abstract: A multi-component curable composition which is reactive upon admixing of the components and wherein the composition comprises a first component which comprises a first amine functional adduct and a second amine functional adduct; and a second component which comprises at least one compound having an average of more than 2.0 groups per molecule which are reactive with amines.
    Type: Grant
    Filed: January 23, 2012
    Date of Patent: November 13, 2012
    Assignee: The Sherwin-Williams Company
    Inventor: David M. Parish
  • Patent number: 8293132
    Abstract: The invention relates to a curing agent for epoxy resins, comprising a phenalkamine blended with a salted polyamine or a salted polyamine-epoxy adduct to form a curing agent for an epoxy resin, wherein at least one-third of the primary amine groups of the salted polyamine or the salted polyamine-epoxy adduct are blocked.
    Type: Grant
    Filed: December 10, 2008
    Date of Patent: October 23, 2012
    Assignee: Cognis IP Management GmbH
    Inventors: Setsuo Sato, Shailesh C Shah, Ramiro Carielo Bueno, Robert M Moon, Arnaldo Ferreira
  • Publication number: 20120245306
    Abstract: A polyamine adduct including the reaction product of (a) a divinylarene dioxide, and (b) an excess of a polyamine to provide an adducted polyamine composition; a process for making the adduct; a curable epoxy resin composition including (i) the adduct derived from divinylbenzene such as divinylbenzene dioxide (DVBDO), (ii) at least one epoxy resin, and (iii) optionally, a co-curing agent and/or a catalyst; and a cured product made from said curable epoxy resin composition. The cured product made from the curable epoxy resin composition is thermally stable and offers improved properties such as a low viscosity and a high heat resistance.
    Type: Application
    Filed: December 1, 2010
    Publication date: September 27, 2012
    Inventor: Maurice J. Marks
  • Publication number: 20120238711
    Abstract: An epoxy resin composition including a divinylarene dioxide, for example a divinylbenzene dioxide, wherein the divinylarene dioxide has an impurity concentration of less than about 15 weight percent styrenic impurities such as ethylstyrene. Such prepared divinylarene dioxides may be used to prepare curable epoxy resin compositions or formulations, including a blend of a divinylarene dioxide and at least another epoxy resin different from the divinylarene dioxide; and a curable epoxy resin composition including (i) the blend of epoxy resins of the divinylarene dioxide and the at least one epoxy resin different from the divinylarene dioxide; (ii) at least one curing agent; and (iii) optionally, at least one catalyst. The significantly lower concentration of styrenic impurities in the divinylarene dioxides of the present invention provides an epoxy resin composition having low viscosity, better storage stability, and better thermal stability.
    Type: Application
    Filed: December 2, 2010
    Publication date: September 20, 2012
    Inventor: Maurice J. Marks
  • Publication number: 20120238710
    Abstract: Embodiments include an amine adduct obtainable by reacting an amine compound having at least two amino groups and a monoalkylpolyalkylene glycidyl ether having the formula (C2H3O)—CH2—O—(CH2—(CHR1)—O)n, —R2, wherein n is 1 to 50, each R1 is independently H or CH3, and R2 is an alkyl group. Embodiments include a curable composition including a resin component and a hardener component that includes the amine adduct.
    Type: Application
    Filed: November 12, 2010
    Publication date: September 20, 2012
    Inventors: Markus Schroetz, Marcus Hummel, Ludwig Huelskaemper
  • Patent number: 8263216
    Abstract: Disclosed is a fiber-reinforced composite material that is high in heat resistance and strength while being low in the content of volatile matter that volatilizes during curing. Also disclosed are an epoxy resin composition for production thereof, and a prepreg produced from the epoxy resin composition. Specifically the invention provides an epoxy resin composition comprising: [A] an epoxy resin comprising two or more ring structures each consisting of four or more members, and at least one amine type or ether type glycidyl group directly connected to the ring structures, [B] a tri- or more-functional epoxy resin, and [C] a curing agent, and also provides a prepreg produced by impregnating reinforcing fiber with the epoxy resin composition and a fiber-reinforced composite material produced by curing the prepreg.
    Type: Grant
    Filed: January 13, 2010
    Date of Patent: September 11, 2012
    Assignee: Toray Industries, Inc.
    Inventors: Atsuhito Arai, Hiroaki Sakata, Kenichi Yoshioka, Hiroshi Taiko, Jiro Nakatani, Kotaro Ono, Michiya Ishikawa
  • Publication number: 20120208967
    Abstract: A method of obtaining hybrid polyhydroxyurethane compositions cross-linked at ambient temperatures. The method comprises: (a) reacting epoxidized unsaturated fatty acid triglycerides with carbon dioxide in the presence of a catalyst to obtain carbonated-epoxidized unsaturated fatty acid triglycerides, wherein conversion of oxyrane groups to 2-oxo-1,3-dioxolane groups (cyclic carbonate groups) for said carbonated-epoxidized unsaturated fatty acid triglycerides ranges from 35% to 85%; (b) mixing and reacting the carbonated-epoxidized unsaturated fatty acid triglycerides with a compound having amine functionality comprising at least one primary amine group realized at stoichiometric or within nearly balanced stoichiometry; (c) mixing and reacting the product of step (b) with a compound having amine functionality comprising at least two primary amine groups realized at excess of an amine-functional compound; (d) subsequently mixing the product of step (c) with a compound having amino-reactive groups.
    Type: Application
    Filed: February 15, 2011
    Publication date: August 16, 2012
    Applicants: POLYMATE, LTD., NANOTECH INDUSTRIES INC.
    Inventors: Olga Birukov, Oleg Figovsky, Alexander Leykin, Raisa Potashnikov, Leonid Shapovalov
  • Patent number: 8236157
    Abstract: A pigment dispersing resin is disclosed along with pigment dispersion, electrodepositable coating compositions using the pigment dispersing resin, and methods for applying the electrodepositable coating composition. The pigment dispersing resin consists essentially of the carboxylic acid salt of an aminated bisphenol epoxy resin and an alkoxylated styrenated phenol. Pigment dispersions made from the dispersing resin are especially useful for forming low or no volatile organic content electrocoating baths.
    Type: Grant
    Filed: December 12, 2008
    Date of Patent: August 7, 2012
    Assignee: E I du Pont de Nemours and Company
    Inventor: Taddesse Gebregiorgis
  • Patent number: 8206808
    Abstract: A prepreg composite material that includes a fiber layer and a resin comprising a thermoset resin component, a curing agent and a fibrous micropulp. The micropulp component is an aramid fiber having a volume average length of from 0.01 to 100 micrometers. The prepreg is useful in composite panel construction for minimizing fluid permeation into the cured structure. This prepreg is particularly suitable for making honeycomb sandwich panels. Film adhesives, liquid and paste resins containing aramid fiber micropulp are also disclosed.
    Type: Grant
    Filed: June 2, 2011
    Date of Patent: June 26, 2012
    Assignee: E. I. du Pont de Nemours and Company
    Inventors: Subhotosh Khan, Halvar Young Loken