Wherein At Least One Of Said 1,2-epoxy Reactants Or Polymer Derived Therefrom Contains Atoms Other Than C, H, Or O Patents (Class 525/525)
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Patent number: 11339284Abstract: A resin composition for casting, containing a curable component, a first filler, and a second filler that is different from the first filler, in which a ratio of a major axis of the first filler with respect to a thickness of the first filler is 3 to 25. A molded body including an element and a sealing portion that seals the element, in which the sealing portion contains the resin composition or a cured product thereof.Type: GrantFiled: October 30, 2017Date of Patent: May 24, 2022Assignee: SHOWA DENKO MATERIALS CO., LTD.Inventors: Kasumi Nakamura, Tatsuhito Fukuhara, Yasunori Kawabata, Takahide Iwaya
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Patent number: 9028968Abstract: Coating composition comprising the reaction product of a tetra-alkoxyorthosilicate or a partially condensed oligomer thereof and an epoxy resin containing hydroxyl groups, said coating composition having a solids content of at least 70 vol % and/or a volatile organic content (VOC) not exceeding 250 g/l. This coating composition gives fast curing at ambient and sub-ambient temperatures and an extended pot life.Type: GrantFiled: August 7, 2008Date of Patent: May 12, 2015Assignee: Akzo Nobel Coatings International B.V.Inventors: Steven Alister Nixon, Susan Pritchard, Adrian Ferguson Andrews
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Patent number: 8889803Abstract: To provide an epoxy polymerizable composition which exhibits low curing shrinkage and high workability and which gives a cured article having a high refraction index and high heat resistance. The epoxy polymerizable composition contains (A2) fluorene epoxy compound having the following general formula (1) or (2), (A3) epoxy compound having a softening point of 30° C. or less, and (B1) thiol compound having two or more thiol groups in one molecule.Type: GrantFiled: January 23, 2009Date of Patent: November 18, 2014Assignee: Mitsui Chemicals, Inc.Inventors: Yasushi Takamatsu, Yugo Yamamoto, Yuichi Ito
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Patent number: 8835574Abstract: Novel adhesive compositions that can be used in the die attach process. The adhesives include a curable resin component, a curing agent, and a block copolymer additive. The block copolymer additive has a glass transition temperature of at least about 40° C. The block copolymer additive improves the affinity of the adhesive composition to a hydrophilic substrate, such as a silicon wafer, during the die pickup process. Also disclosed is an assembly which includes a hydrophilic substrate and a layer of adhesive and methods of producing the assembly.Type: GrantFiled: November 19, 2012Date of Patent: September 16, 2014Assignee: Henkel IP Holding GmbHInventors: My Nguyen, Tadashi Takano, Puwei Liu
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Patent number: 8759422Abstract: An adhesive composition comprising elastomeric polymer, epoxy resin, reactive diluent, and filler, is suitable for use within the electronics industry, and in particular for wafer back side coating adhesives. The elastomeric polymer is a mixture of a vinyl elastomer and an epoxy elastomer; the reactive diluent is a combination of two or more diluents, one of which must have carbon to carbon unsaturation, providing cross-linking within the composition after cure; and the filler is a non-conductive filler.Type: GrantFiled: March 13, 2013Date of Patent: June 24, 2014Assignee: Henkel IP & Holding GmbHInventors: Eric C. Wang, Kevin Harris Becker, Qizhuo Zhuo
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Patent number: 8722816Abstract: A solder resist having both adequate sensitivity at photo-irradiation and alkali developability, and the solder resist forming a cured product which is excellent in dimensional stability against temperature change, does not exhibit brittleness, and further, is excellent in water resistance, electrical insulation, thermal cycle test resistance (TCT resistance) and the like is provided, and further, a dry film having a solder resist layer, a cured product and a printed wiring board are provided. The solder resist comprising an acid-modified vinyl ester synthesized from an epoxy compound, a phenol compound, an unsaturated monobasic acid and a polybasic acid anhydride, wherein the epoxy compound contains a crystalline epoxy resin having a melting point of 90° C. or more, and the phenol compound contains a compound having a bisphenol S structure.Type: GrantFiled: March 4, 2008Date of Patent: May 13, 2014Assignees: Nippon Shokubai Co., Ltd., Taiyo Holdings Co., Ltd.Inventors: Nobuaki Otsuki, Manabu Akiyama, Shouji Minegishi, Masao Arima
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Patent number: 8710158Abstract: The present invention has a purpose of providing an epoxy composition for encapsulating an optical semiconductor element which composition provides a cured product having a low gas permeability and excellent curability in a form of a thin film together with good light transmission and crack resistance. The present invention provides a composition comprising (A) a silicone-modified epoxy compound represented by the formula (1), (B) a curing agent and (C) a polyhydric alcohol. The present invention further provides a composition comprising a composition prepared by reacting (A) the silicone-modified epoxy compound, (B) the curing agent and (C) the polyhydric alcohol and (D) a curing catalyst, and a cured product thereof.Type: GrantFiled: April 6, 2011Date of Patent: April 29, 2014Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Manabu Ueno, Miyuki Wakao, Tsutomu Kashiwagi
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Patent number: 8673108Abstract: This invention relates to compositions useful as adhesives and more particularly to the preparation of epoxy-based adhesive composition with improved impact resistance and good adhesion to oily metal substrates.Type: GrantFiled: February 2, 2009Date of Patent: March 18, 2014Assignee: Henkel AG & Co. KGaAInventors: Jeng-Li Liang, Rajat K. Agarawal, Gregory A. Ferguson, Olaf Lammerschop, Frank Dittrich, Rainer Schoenfeld
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Patent number: 8663803Abstract: A varnish composition includes composition (A): an epoxy resin, composition (B): a hardener, composition (C): an accelerator, composition (D): phosphor-containing flame retardant, and composition (E): fillers, wherein composition (A) includes composition (A-1): phosphor-containing epoxy resin, phosphor-containing and silicon-containing epoxy resin, or a mixture thereof; composition (A-2): dicyclopentadiene epoxy resin; and composition (A-3): oxazolidone epoxy resin.Type: GrantFiled: November 29, 2010Date of Patent: March 4, 2014Assignee: ITEQ CorporationInventors: Li-Chun Chen, Chun-Chieh Huang
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Patent number: 8657413Abstract: A die attach composition is used for bonding a silicon chip on a flat substrate. The die attach composition includes a cross-linkable epoxy resin having a rigid backbone, an epoxy siloxane resin, a fumed silica filler, an amine curing agent, and a silane coupling agent. The die attach composition is particularly useful in bonding silicon heater chips on flat ceramic substrate in forming an inkjet printhead assembly. The die attach composition allows accurate placement of silicon heater chips on flat ceramic substrate and exhibits good ink resistance.Type: GrantFiled: January 18, 2011Date of Patent: February 25, 2014Assignee: Funai Electric Co., Ltd.Inventors: David Graham, Jeanne Marie Saldanha Singh, Richard D. Wells, Joel Provence
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Patent number: 8617705Abstract: There is disclosed an adhesive composition containing: (A) 100 parts by mass of a phenoxy resin; (B) 5 to 200 parts by mass of an epoxy resin; (C) 1 to 20 parts by mass of an alkoxysilane-partial hydrolytic condensate which is a partial hydrolytic condensate of alkoxysilane including one kind or two or more kinds of alkoxysilane represented by the following general formulae (1) and (2) Si(OR3)4??(1) R1Si(OR3)3??(2), wherein the weight average molecular weight is 300 or more and 30,000 or less and an amount of residual alkoxy is 2 wt % or more and 50 wt % or less; (D) a curing catalyst for an epoxy resin; (E) an inorganic filler; and (F) a polar solvent having a boiling point of 80° C. to 180° C. and a surface tension of 20 to 30 dyne/cm at 25° C. There can be a sheet for forming a semiconductor wafer-protective film and an adhesive composition capable of forming a protective film excellent in evenness, cutting characteristics and adhesiveness.Type: GrantFiled: February 23, 2011Date of Patent: December 31, 2013Assignee: Shin-Etsu Chemical Co., Ltd.Inventor: Nobuhiro Ichiroku
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Patent number: 8524808Abstract: The invention is a radiation curable coating composition containing epoxyacrylate formed by ring opening reaction between (meth)acrylic acid and a self-dispersing epoxy resin in an aqueous system.Type: GrantFiled: November 12, 2005Date of Patent: September 3, 2013Assignee: IGM Group B.V.Inventors: Rainer Hoefer, Laurence Druene, Jean-Marc Ballin, Morgan Garinet
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Patent number: 8524660Abstract: The invention relates to novel polyalkylene glycol compounds and methods of using them. In particular, compounds comprising a novel polyethylene glycol conjugate are used alone, or in combination with antiviral agents to treat a viral infection, such as chronic hepatitis C.Type: GrantFiled: September 12, 2011Date of Patent: September 3, 2013Assignee: Biogen Idec MA Inc.Inventors: KoChung Lin, R. Blake Pepinsky, Ling Ling Chen, Donna M. Hess, Edward Y. Lin, Russell C. Petter, Darren P. Baker
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Patent number: 8518208Abstract: Thermosetting adhesive compositions formed from an epoxy resin containing nano-sized core-shell particles, one or more thermoplastic toughening agent containing an amine-terminated polyethersulfone, and at least one multi-functional epoxy resin, together with at least one amine curing agent to allow full cure of the adhesive composition up to 400° F. are provided herein. Such compositions are useful for forming adhesive films that can bond composite/metal/honeycomb structures for aerospace including bonding of aircraft leading or trailing edges, acoustic nacelle structures, horizontal and vertical tail, and various other structures, as well as for other high performance industrial applications.Type: GrantFiled: August 26, 2010Date of Patent: August 27, 2013Assignee: Cytec Technology Corp.Inventor: Dalip Kohli
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Patent number: 8431224Abstract: Disclosed is a halogen-free resin composition for printed wiring board production, which is remarkably reduced in quality deterioration due to moisture absorption of a semi-cured resin film (layer). Also disclosed is a copper film with resin or the like. The resin composition is characterized by containing a component A (one or more resins selected from the group consisting of bisphenol-A epoxy resins, bisphenol-F epoxy resins and bisphenol-AD epoxy resins, which have an epoxy equivalent of not more than 200, while being in a liquid state at 25 DEG C.), a component B (a linear polymer having a crosslinkable functional group), a component C (a crosslinking agent), a component D (an imidazole-based epoxy resin curing agent) and a component E (a phosphorus-containing epoxy resin). The resin composition is also characterized by containing 0.5-3.0% by weight of phosphorus atoms per 100% by weight of the resin composition. In the copper foil with resin, a resin layer is formed by using the resin composition.Type: GrantFiled: March 21, 2008Date of Patent: April 30, 2013Assignee: Mitsui Mining & Smelting Co., Ltd.Inventors: Tetsuro Sato, Toshifumi Matsushima
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Epoxy resin hardener compositions and epoxy resin compositions containing such hardener compositions
Patent number: 8389652Abstract: An epoxy resin hardener composition including a reaction product of (i) a compound having at least one vicinal epoxy group, and (ii) an amino alcohol; an epoxy resin composition including the epoxy resin hardener composition and a compound having at least one vicinal epoxy group; and a powder coating composition including particles of the epoxy resin hardener composition and particles of a compound having at least one vicinal epoxy group.Type: GrantFiled: January 6, 2009Date of Patent: March 5, 2013Assignee: Dow Global Technologies LLCInventors: Joseph Gan, Matthieu M. Eckert, Carola Rosenthal, Bernhard Kainz, Emile C. Trottier -
Patent number: 8338536Abstract: Novel adhesive compositions that can be used in the die attach process. The adhesives include a curable resin component, a curing agent, and a block copolymer additive. The block copolymer additive has a glass transition temperature of at least about 40° C. The block copolymer additive improves the affinity of the adhesive composition to a hydrophilic substrate, such as a silicon wafer, during the die pickup process. Also disclosed is an assembly which includes a hydrophilic substrate and a layer of adhesive and methods of producing the assembly.Type: GrantFiled: September 17, 2010Date of Patent: December 25, 2012Assignee: Henkel CorporationInventors: My Nguyen, Tadashi Takano, Puwei Liu
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Patent number: 8263216Abstract: Disclosed is a fiber-reinforced composite material that is high in heat resistance and strength while being low in the content of volatile matter that volatilizes during curing. Also disclosed are an epoxy resin composition for production thereof, and a prepreg produced from the epoxy resin composition. Specifically the invention provides an epoxy resin composition comprising: [A] an epoxy resin comprising two or more ring structures each consisting of four or more members, and at least one amine type or ether type glycidyl group directly connected to the ring structures, [B] a tri- or more-functional epoxy resin, and [C] a curing agent, and also provides a prepreg produced by impregnating reinforcing fiber with the epoxy resin composition and a fiber-reinforced composite material produced by curing the prepreg.Type: GrantFiled: January 13, 2010Date of Patent: September 11, 2012Assignee: Toray Industries, Inc.Inventors: Atsuhito Arai, Hiroaki Sakata, Kenichi Yoshioka, Hiroshi Taiko, Jiro Nakatani, Kotaro Ono, Michiya Ishikawa
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Patent number: 8236157Abstract: A pigment dispersing resin is disclosed along with pigment dispersion, electrodepositable coating compositions using the pigment dispersing resin, and methods for applying the electrodepositable coating composition. The pigment dispersing resin consists essentially of the carboxylic acid salt of an aminated bisphenol epoxy resin and an alkoxylated styrenated phenol. Pigment dispersions made from the dispersing resin are especially useful for forming low or no volatile organic content electrocoating baths.Type: GrantFiled: December 12, 2008Date of Patent: August 7, 2012Assignee: E I du Pont de Nemours and CompanyInventor: Taddesse Gebregiorgis
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Patent number: 8217099Abstract: A thermosetting resins composite, composed of: epoxy resin which can have a total polymerization with bismaleimide, occupying 1.75%-18.0% solids weight of the composite; bismaleimide compounds, occupying 0.15%-12.5% solids weight of the composite; free radical initiator, its mole fraction of which its addition accounts for reaction monomer total is 0.01%-0.15%; inhibitor, whose amount is the half to double of the initiator; styrene-maleic anhydride copolymers, occupying 17.5%-47.0% solids weight of the composite; filler, occupying 20%-60% solids weight of the composite; solvent, occupying 30%-50% solids weight of the composite; flame retardant which can be used in CCL industries.Type: GrantFiled: May 22, 2008Date of Patent: July 10, 2012Assignees: ITEQ (Dongguan) Corporation, ITEQ CorporationInventors: Yufang He, Lijun Su
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Patent number: 8198347Abstract: A high thermal-conductive, halogen-free and flame-retardant resin composition used as a dielectric layer of a printed circuit board comprises 5% to 70% of phosphorus-containing epoxy resin, at most 50% of multifunctional or bifunctional epoxy resin, 1% to 20% of curing agent, 0.01% to 10% of accelerant, at most 20% of inorganic powder, 5% to 85% of high thermal conductivity powder and 0.Type: GrantFiled: November 3, 2009Date of Patent: June 12, 2012Assignee: Nan Ya Plastics CorporationInventors: Dein-Run Fung, Te-Chao Liao, Hao-Sheng Chen
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Publication number: 20120071585Abstract: Provided is an epoxy resin composition having superior flame resistance without containing a halogen-based flame retardant, red phosphorous or phosphate ester, and a prepreg and a fiber-reinforced composite material that use the epoxy resin composition. The epoxy resin composition has as essential components thereof (A) a phosphorous-containing epoxy resin composed of a compound (a) represented by the following formula (a), (C) a novolak-type epoxy resin, and (D) an epoxy resin curing agent. A prepreg containing the epoxy resin composition and a fiber-reinforced composite material obtained by curing the prepreg are also provided.Type: ApplicationFiled: June 1, 2010Publication date: March 22, 2012Applicant: Mitsubishi Rayon Co., Ltd.Inventors: Atsushi Nohara, Manabu Kaneko, Masao Tomioka
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Patent number: 8114519Abstract: Derivatized solid epoxy resins of the formula (I), which are outstandingly suitable as impact modifiers; and compositions which include such derivatized solid epoxy resins and are outstandingly suitable as one-component heat-curable adhesives, and as structural foams which have a high impact resistance and high mechanical stability.Type: GrantFiled: October 24, 2007Date of Patent: February 14, 2012Assignee: Sika Technology AGInventors: Andreas Kramer, Juergen Finter
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Patent number: 8110633Abstract: A seal for a valve for use in a pharmaceutical dispensing device, which seal is formed from a blend comprising: a thermoplastic elastomer including a propylene component with isotactic crystallinity; and a polymer selected from one or more of polypropylene, polyethylene and copolymers thereof.Type: GrantFiled: September 4, 2007Date of Patent: February 7, 2012Assignee: Consort Medical PLCInventor: Daljit Ohbi
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Patent number: 8101689Abstract: The shape memory polymers disclosed are a reaction product of at least one reagent containing two active amino-hydrogen or two active phenolic-hydrogen with at least one multifunctional cross linking reagent which contains at least three or more active amino- or phenolic-hydrogen or is a reagent containing at least three glycidyl ether moieties which is then further mixed with at least one diglycidyl ether reagent whereupon the resulting mixture is cured and has a glass transition temperature higher than 00 C. This reaction creates crosslinking between the monomers and polymers such that during polymerization they form a crosslinked thermoset network.Type: GrantFiled: December 15, 2006Date of Patent: January 24, 2012Assignee: Cornerstone Research Group, Inc.Inventors: Tat Hung Tong, Benjamin J. Vining, Richard D. Hreha, Thomas J. Barnell
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Patent number: 8097333Abstract: Pre-impregnated composite material (prepreg) is provided that can be cured to form composite parts that have high levels of damage tolerance. The matrix resin includes a thermoplastic particle component that is a blend of particles that have a melting point above the curing temperature and particles that have a melting point at or below the curing temperature.Type: GrantFiled: March 7, 2011Date of Patent: January 17, 2012Assignees: Hexcel Corporation, Hexcel Composites, Ltd.Inventors: David Tilbrook, Dana Blair, Maureen Boyle, Paul Mackenzie
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Patent number: 8088490Abstract: A halogen-free varnish includes (A) resin, (B) curing agent, (C) flame inhibitor (flame-retarding agent), (D) accelerator and (E) additives. Resin of (A) has novolac epoxy resin, DOPO-CNE and DOPO-HQ-CNE. Curing agent of (B) includes Benzoxazine resin and phenol novolac resin. Glass fabric cloth is dipped into the halogen-free varnish so as to form a prepreg with better thermal stability, anti-flammability, low absorbent ability and higher curing rate. Furthermore, the prepreg has more toughness.Type: GrantFiled: October 25, 2009Date of Patent: January 3, 2012Assignee: Iteq CorporationInventor: Li-Chun Chen
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Patent number: 8084130Abstract: The present invention provides an epoxy resin molding material for sealing that is excellent in fluidability and solder reflow resistance without lowering the curability thereof, and an electronic component device provided with an element sealed with the material. The epoxy resin molding material for sealing, comprising (A) an epoxy resin, (B) a curing agent, (C) a curing accelerating agent, (D) an inorganic filler, and (E) an alkoxysilane polymer, wherein the alkoxysilane polymer (E) is a polymer obtained by polymerizing an alkoxysilyl group moiety of a specific alkoxysilane compound.Type: GrantFiled: September 25, 2007Date of Patent: December 27, 2011Assignee: Hitachi Chemical Co., Ltd.Inventors: Mitsuyoshi Hamada, Akira Nagai, Hiroaki Ikeba, Ken Nanaumi, Kouhei Yasuzawa
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Patent number: 8071217Abstract: Discussed are heat-curable epoxy resin compositions containing at least one epoxy resin A with, on average, more than one epoxide group per molecule, at least one curing agent B for epoxy resins, which is activated by an increased temperature, at least one terminally blocked polyurethane prepolymer of formula (I) and at least one epoxide-terminated polyurethane prepolymer of formula (II). The epoxy resin compositions are particularly suitable for use as one-component, heat-curable adhesives and are characterized by excellent mechanical properties, high glass transition temperatures and high impact resistance.Type: GrantFiled: October 24, 2007Date of Patent: December 6, 2011Assignee: Sika Technology AGInventors: Andreas Kramer, Juergen Finter, Urs Rheinegger, Jan Olaf Schulenburg
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Patent number: 8062750Abstract: An epoxy resin composition for a prepreg used in manufacturing a printed wiring board, particularly a multilayered printed wiring board, is provided. The composition features: (A) a multifunctional epoxy resin having on average 2.8 or more epoxy groups per molecule; (B) a reaction product of a phosphorous compound, a bifunctional epoxy resin, and an optional multifunctional epoxy resin, provided in an amount of 20% to 55% by mass, based on the total amount of epoxy resin, including (A) and (B); (C) a curing agent of dicyandiamide and/or a multifunctional phenolic compound; and (D) an inorganic filler blend containing an inorganic filler with a thermal decomposition temperature of 400° C. or above. The composition does not generate toxic substances when combusted and has excellent ignition resistance, solder heat resistance after moisture absorption, and high temperature rigidity.Type: GrantFiled: November 30, 2004Date of Patent: November 22, 2011Assignee: Matsushita Electric Works, Ltd.Inventors: Hidetsugu Motobe, Yoshihiko Nakamura, Takeshi Koizumi, Ryuji Takahashi
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Patent number: 8062468Abstract: The invention relates to compositions containing at least one solid epoxide resin A, at least one polymer B of formula (1), at least one thixotropic agent C made from a urea derivative and at least one curing agent for epoxide resins D activated by high temperatures. The compositions are particularly suitable for use as adhesives. Low-temperature impact-resistant adhesives can be produced for use in particular as structural adhesives.Type: GrantFiled: July 5, 2006Date of Patent: November 22, 2011Assignee: Sika Technology AGInventors: Jürgen Finter, Andreas Kramer, Jan Olaf Schulenburg, Urs Rheinegger
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Patent number: 8057902Abstract: A novel phosphorous-containing epoxy resin having a naphthalene skeleton is suitable as an insulating material, such as a copper-clad laminate used in an electronic circuit board, and a sealing material, molding material, casting material, adhesive or film material used in an electric component. Furthermore, this epoxy resin is suitable as a material for an electrically insulating coating.Type: GrantFiled: March 4, 2008Date of Patent: November 15, 2011Assignee: Nippon Steel Chemicals Co., Ltd.Inventors: Naoki Yokoyama, Kazuo Ishihara, Tetsuya Nakanishi
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Patent number: 8039533Abstract: Disclosed are a synthetic resin composition for use as building materials such as window frames, as well as a product manufactured using the same. More particularly, the synthetic resin composition comprises a tetrapolymer of acrylic rubber-styrene monomer-butadiene rubber-vinyl cyanide monomer and a styrene-vinyl cyanide copolymer having a high molecular weight and a high degree of dispersion. Unlike products manufactured using prior polyvinyl chloride (PVC), building material such as window frames manufactured using the synthetic resin composition are recyclable, and thus can contribute to a reduction in the generation of hormone-disrupting chemical dioxin, which is released in the burning thereof. Also, the resin composition can be manufactured into products having excellent properties of weather resistance and colorability without using environmental pollutants such as cadmium stearate or lead stearate, which are used as thermal stabilizers.Type: GrantFiled: October 13, 2010Date of Patent: October 18, 2011Assignee: Korea Kumho Petrochemical Co., Ltd.Inventors: Jang Hyun Choi, Joo Yub Ho, Seung Kyu Lee, Yun Hwan Kim
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Patent number: 8017671Abstract: The present invention discloses a thermosetting resin for expediting a thermosetting process. The thermosetting resin is composed of 100 parts of primary resin formed by mixing a brominized epoxy resin, a tetrafunctional epoxy resin and an epoxy resin with a high bromine content, and other materials including 35 parts of phenolic resin curing agent, 30 parts of tetrabromobisphenol A curing agent, 0.1 part of 2-ethyl-4-methylimidazole, 0.8 part Lewis acid, and 50˜70 parts of solvent, calculated based on every 100 parts of the primary resin by weight. The invention can expedite a thermosetting process and enhance the Tg of prepregs and clad laminates.Type: GrantFiled: June 12, 2009Date of Patent: September 13, 2011Assignees: ITEQ (WUXI) Electronic Technologies Co., Ltd., ITEQ CorporationInventors: Yanhua Yuan, Meixin Ding
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Patent number: 8017733Abstract: The invention relates to novel polyalkylene glycol compounds and methods of using them. In particular, compounds comprising a novel polyethylene glycol conjugate are used alone, or in combination with antiviral agents to treat a viral infection, such as chronic hepatitis C.Type: GrantFiled: July 16, 2004Date of Patent: September 13, 2011Assignee: Biogen Idec MA Inc.Inventors: KoChung Lin, R. Blake Pepinsky, Ling Ling Chen, Donna M. Hess, Edward Y. Lin, Russell C. Petter, Darren P. Baker
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Patent number: 8003013Abstract: A waterborne thermoset cured anticorrosion formulation includes a water dispersed or emulsified phosphonated or water dispersed or emulsified sulfonated epoxy resin that is cured with a phenoxy resin having a polyhydroxyl ether backbone and terminal alpha glycol moieties. Water is present as a predominant volatile in which the epoxy resin and phenoxy resin are present in a weight ratio of epoxy resin to phenoxy resin of between 0.1 and 3:1. An aqueous curative is provided to induce cure between the epoxy resin and phenoxy resin, A corrosion inhibiting metal salt is also present having a salt anion of phosphate, biphosphate or tetraborate and a metal cation with the proviso that the metal cation formulation as a whole is devoid of chromium, lead, cobalt, and cadmium. Ideal curatives include aqueous aminoplast crosslinkers, aqueous unblocked isocyanates, aqueous blocked isocyanates, and a mixture thereof.Type: GrantFiled: September 18, 2008Date of Patent: August 23, 2011Assignee: Martinrea Industries, Inc.Inventors: Ronald J. Lewarchik, Scott Rier
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Patent number: 8003216Abstract: A heat-conductive dielectric polymer material having an inter-penetrating-network (IPN) structure includes a polymer component, a curing agent, and a heat-conductive filler uniformly dispersed in the polymer component. The polymer component includes a thermoplastic plastic and a thermosetting epoxy resin. The curing agent is used to cure the thermosetting epoxy resin at a curing temperature. The heat conductivity of the heat-conductive dielectric polymer material is larger than 0.5 W/mK. A heat dissipation substrate including the heat-conductive dielectric polymer material in the present invention has a thickness of less than 0.5 mm and bears a voltage of over 1000 volts.Type: GrantFiled: January 30, 2007Date of Patent: August 23, 2011Assignee: Polytronics Technology CorporationInventors: David Shau Chew Wang, En Tien Yang, Jyh Ming Yu, Fu Hua Chu
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Patent number: 7985477Abstract: A cationically polymerizable composite coating composition comprising: a) a condensation product of at least one hydrolyzable silane having a fluorine-containing group, b) at least one cationically polymerizable organic resin, and c) a cationic initiator, provides, upon curing, substrates with an alkali-resistant, liquid-repellent coating. The composite coating composition may be used in pattern forming methods.Type: GrantFiled: December 8, 2005Date of Patent: July 26, 2011Assignees: Leibniz- Institut Fuer Neue Materialien Gemeinnuetzige GmbH, Canon Kabushiki KaishaInventors: Helmut Schmidt, Carsten Becker-Willinger, Pamela Kalmes, Etsuko Hino, Norio Ohkuma
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Patent number: 7972686Abstract: A composite material comprising at least one polymeric resin and optionally at least one fibrous reinforcement, where the polymeric resin comprises; at least one difunctional epoxy resin; and at least one epoxy resin with a functionality greater than two having at least one meta-substituted phenyl ring in its backbone.Type: GrantFiled: October 2, 2007Date of Patent: July 5, 2011Assignees: Hexcel Composites, Ltd., Hexcel CorporationInventors: David Tilbrook, Dana Blair, Maureen Boyle, Paul Mackenzie
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Patent number: 7838579Abstract: Disclosed are a synthetic resin composition for use as building materials such as window frames, as well as a product manufactured using the same. More particularly, the synthetic resin composition comprises a tetrapolymer of acrylic rubber-styrene monomer-butadiene rubber-vinyl cyanide monomer and a styrene-vinyl cyanide copolymer having a high molecular weight and a high degree of dispersion. Unlike products manufactured using prior polyvinyl chloride (PVC), building material such as window frames manufactured using the synthetic resin composition are recyclable, and thus can contribute to a reduction in the generation of hormone-disrupting chemical dioxin, which is released in the burning thereof. Also, the resin composition can be manufactured into products having excellent properties of weather resistance and colorability without using environmental pollutants such as cadmium stearate or lead stearate, which are used as thermal stabilizers.Type: GrantFiled: May 12, 2006Date of Patent: November 23, 2010Assignee: Korea Kumho Petrochemical Co., Ltd.Inventors: Jang Hyun Choi, Joo Yub Ho, Seung Kyu Lee, Yun Hwan Kim
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Patent number: 7829639Abstract: A composition for conductive materials comprises a compound represented by the following general formula (A1): wherein: R1 is the same or different and each independently represents a C2-C8 straight-chain alkyl group; R2 is the same or different and each independently represents a hydrogen atom, a methyl group or an ethyl group; Y represents a group containing at least one substituted or unsubstituted aromatic hydrocarbon ring, or substituted or unsubstituted heterocyle; and X1 is the same or different and each represents a substituent represented by the following general formula (A2): wherein n1 is an integer of from 2 to 8.Type: GrantFiled: September 2, 2005Date of Patent: November 9, 2010Assignee: Seiko Epson CorporationInventors: Koichi Terao, Yuji Shinohara, Takashi Shinohara
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Patent number: 7820772Abstract: An amine hardener for epoxy resins which comprises an amine adduct (A) and a low-molecular amine compound (B) as major components, wherein the molecular weight distribution of the amine adduct (A), which is defined by the ratio of the weight-average molecular weight to the number-average molecular weight, is 3 or lower and the low-molecular amine compound (B) is contained in an amount of 0.001 to 1 part by mass per 100 parts by mass of the amine adduct (A).Type: GrantFiled: March 30, 2005Date of Patent: October 26, 2010Assignee: Asahi Kasei Chemicals CorporationInventors: Taketoshi Usui, Kazuhiko Yamamoto, Hisanao Yamamoto, Kazuhiro Daikai
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Patent number: 7786224Abstract: A liquid epoxy resin composition of an epoxy resin, a curing agent, and a curing accelerator, where the epoxy resin is an alicyclic epoxy compound present in an amount from 100 to 30% by weight. The alicyclic epoxy compound is preferably produced by using a percarboxylic acid having a water content of 2% by weight. The curing agent is preferably a liquid acid anhydride.Type: GrantFiled: July 1, 2004Date of Patent: August 31, 2010Assignee: Daicel Chemical Industries, LtdInventor: Hideyuki Takai
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Patent number: 7763354Abstract: A waterborne coating composition comprising at least one base neutralized active hydrogen containing film-forming resin and a water dispersible carbodiimide crosslinker capable of reacting with the film-forming resin to form a crosslinked film.Type: GrantFiled: September 17, 2002Date of Patent: July 27, 2010Assignee: PPG Industries Ohio, Inc.Inventors: Lori S. Rardon, Stephen J. Thomas, Kaliappa G. Ragunathan, Edouard Kaczynski
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Patent number: 7754322Abstract: Pre-impregnated composite material (prepreg) is provided that can be cured to form composite parts that have high levels of damage tolerance. The matrix resin includes a thermoplastic particle component that is a blend of particles that have a melting point above the curing temperature and particles that have a melting point at or below the curing temperature.Type: GrantFiled: April 17, 2007Date of Patent: July 13, 2010Assignees: Hexcel Corporation, Hexcel Composites Ltd.Inventors: David Tilbrook, Dana Blair, Maureen Boyle, Paul Mackenzie
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Patent number: 7722949Abstract: An adhesive composition comprising: 100 parts by weight of (A) a phenoxy resin having, per molecule, at least one alkoxy silane residue represented by the following formula (I) wherein R1 may be the same with or different from each other and is a substituted or unsubstituted C1-4 alkyl group, and R2 is a substituted or unsubstituted C1-9 monovalent group comprising a moiety selected from the group consisting of amino, cyanato, glycidoxy and thiol groups; 5 to 200 parts by weight of (B) an epoxy resin; a catalytic amount of (C) catalyst for curing the epoxy resin; and (D) an inorganic filler in an amount of from 33 to 300 parts by weight per total 100 parts by weight of the components (A), (B) and (C).Type: GrantFiled: June 4, 2007Date of Patent: May 25, 2010Assignee: Shin-Etsu Chemical Co., Ltd.Inventor: Nobuhiro Ichiroku
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Patent number: 7666509Abstract: A resin composition excellent in heat resistance after moisture absorption, lead-free solder reflow properties, dimensional stability and electrical characteristics for high-multilayer and high-frequency-capable printed wiring boards, which composition comprises a bisphenol A type epoxy resin (a) having at least two epoxy groups per molecule and a secondary hydroxyl group amount of 0.4 meq/g or less, a novolak type epoxy resin (b) at least two epoxy groups per molecule, a cyanate ester resin (c) having at least two cyanate groups per molecule and spherical silica having an average particle diameter of 4 ?m or less, wherein the equivalent ratio of cyanate groups/epoxy groups in the resin composition is in the range of 0.7 to 1.45, and a prepreg and a metal-foil-clad laminate each of which comprises the resin composition.Type: GrantFiled: February 23, 2007Date of Patent: February 23, 2010Assignee: Mitsubishi Gas Chemical Company, Inc.Inventors: Kenichi Mori, Takaki Tsuchida
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Patent number: 7569166Abstract: It is the object of the present invention to provide a binder resin for coating paste, comprising a polyvinyl acetal type resin, having an excellent dispersibility of inorganic powder such as conductive powder, ceramic powder and glass powder and being capable of exerting an extremely excellent coating property, particularly a printing property, when dispersing the inorganic powder to form paste, conductive paste, ceramic paste and glass paste. in the formulas, R1 represents a straight chain or branched alkyl group having 1 to 20 carbon atoms, and R2 represents hydrogen, a straight chain, branched or cyclic alkyl group having 1 to 20 carbon atoms, or an aryl group; and n represents an integer of 1 to 8; and further in the modified polyvinyl acetal resin, a content of the structural unit represented by the general formula (3) is 1 to 20 mol % and a content of the structural unit represented by the general formula (4) is 30 to 78 mol %.Type: GrantFiled: June 28, 2004Date of Patent: August 4, 2009Assignee: Sekisui Chemical Co., Ltd.Inventors: Motokuni Ichitani, Daizo Ii, Yukio Ochitani, Hideyuki Takahashi, Katsuaki Sakashita
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Patent number: 7569163Abstract: Polythioether amine resin compounds and compositions comprising the same are disclosed.Type: GrantFiled: March 16, 2007Date of Patent: August 4, 2009Assignee: PRC DeSoto International, Inc.Inventors: Guangliang Tang, Jak H. Aklian, Suresh G. Sawant
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Patent number: 7566758Abstract: An embodiment of the invention relates to a novel epoxy resin composition. The epoxy resin composition comprises (i) a first epoxy resin having in the molecule thereof at least one water-repellency-imparting group and two or more cyclic aliphatic epoxy groups, and having a number average molecular weight ranging from 8,000 to 22,000 and a polydispersity ranging from 3.5 to 5.0, (ii) a second epoxy resin having in the molecule thereof at least one water-repellency-imparting group and two or more cyclic aliphatic epoxy groups, having a number average molecular weight ranging from 2,500 to 8,000 and a polydispersity ranging from 1.5 to 3.0, and (iii) a cationic polymerization catalyst.Type: GrantFiled: December 1, 2005Date of Patent: July 28, 2009Assignee: Canon Kabushiki KaishaInventors: Akihiko Shimomura, Hiromichi Noguchi, Isao Imamura