Abstract: A method of making a solid composite containing carbon fibers embedded in a polymeric matrix, the method comprising admixing carbon fibers with a polymer precursor resin, and curing the polymer precursor resin to form a cured polymeric matrix that contains said carbon fibers embedded therein, wherein said carbon fibers have covalently bonded on their surfaces a partially cured epoxy-containing or amine-containing sizing agent, wherein at least a portion of epoxide groups or amine groups in the sizing agent are available as uncrosslinked epoxide groups or amine groups, which corresponds to a curing degree of epoxide groups or amine groups of no more than about 0.6.

Abstract: A fiber-reinforced composite material of the present invention is a fiber-reinforced composite material comprising: an epoxy resin cured product obtained by curing an epoxy resin composition and a reinforcing fiber, wherein the epoxy resin composition comprises an epoxy resin (A) and a curing agent (B); 10 to 80% by mass of the curing agent (B) is 1,2,4-cyclohexanetricarboxylic acid-1,2-anhydride; and the reinforcing fiber comprises one or more selected from the group consisting of a carbon fiber, an aramid fiber, and a boron fiber.

Abstract: The invention relates to a polyethylene composition comprising a mixture of flame retardants which are bromine-containing polymers. The polyethylene composition is useful in the manufacture of pallets. A process for making the polyethylene composition through a masterbatch route is also disclosed.

Abstract: A flame retardant polymeric foam material and its manufacturing method are provided. The flame retardant polymeric foam material comprises a polymeric foam, and an organic flame retardant coating on the surface of the polymeric foam which is obtained by spraying, coating or by impregnating after the organic flame retardant melts. The present invention selects those types of flame retardants which are very effective in improving the flame retardancy of the polymeric foams; especially those effective for extruded polystyrene foams, and provides a simple and feasible approach to obtain polymeric foams with excellent flame retardant property. The methods can effectively increase the amount of the flame retardants added without affecting foaminess of the foam products and reducing strength or insulation properties of polymeric foams. Different flame retardancy requirements can be satisfied by simply varying the amount of the flame retardants coated on the polymeric foam surface.

Abstract: An adhesive for anchoring materials in or to concrete or masonry exhibits a shorter cure time than previous adhesives and comprises an epoxy compound and a curing agent of at least one aliphatic amine and at least one tertiary amine, optionally with a reactive dilent, which possesses sufficent strength to pass ICBO Heat Creep Test at 110 degrees F. and the ICBO Damp Hole Test at 75 degrees F.

Abstract: A polymer composition comprising: at least one polycondensation polymer having a heat deflection temperature (HDT) of above 80° C. under a load of 1.82 MPa when measured according to ASTM D648 [polymer (P)]; at least one perfluoropolyether block copolymer [polymer (F)] comprising: A) one or more (per)fluoropolyoxyalkylene segment (chain Rf) comprising recurring units having at least one catenary ether bond and at least one fluorocarbon moiety, and B) one or more polyalkylene segment (chain Ra) comprising recurring units of formula: —(CR1R2—CR3R4)—; wherein R1, R2, R3, R4, equal to or different from each other, are selected from the group consisting of H, halogens; C1-C6 (hydro)carbon groups, optionally containing fluorine or other heteroatoms, to a process for its manufacture and to its use for manufacturing shaped articles, in particular by extrusion molding or injection molding techniques.

Abstract: A solder resist having both adequate sensitivity at photo-irradiation and alkali developability, and the solder resist forming a cured product which is excellent in dimensional stability against temperature change, does not exhibit brittleness, and further, is excellent in water resistance, electrical insulation, thermal cycle test resistance (TCT resistance) and the like is provided, and further, a dry film having a solder resist layer, a cured product and a printed wiring board are provided. The solder resist comprising an acid-modified vinyl ester synthesized from an epoxy compound, a phenol compound, an unsaturated monobasic acid and a polybasic acid anhydride, wherein the epoxy compound contains a crystalline epoxy resin having a melting point of 90° C. or more, and the phenol compound contains a compound having a bisphenol S structure.

Abstract: A thermosettable (curable) epoxy resin composition including (A) a residual oligomeric product; wherein the residual oligomeric product comprises a polyfunctional aliphatic or cycloaliphatic epoxy resin which has been isolated from an epoxy resin product formed as a result of an epoxidation process comprising the reaction of (i) an aliphatic or cycloaliphatic hydroxyl-containing material with (ii) an epihalohydrin, (iii) a basic-acting substance, (iv) a non-Lewis acid catalyst, and (V) optionally one or more solvents; (B) an epoxy curing material comprising (i) an epoxy resin curing agent, (ii) an epoxy resin catalyst, or both an epoxy resin curing agent (i) and an epoxy resin catalyst (ii); and (C) optionally, an epoxy resin compound other than the aliphatic or cycloaliphatic polyfunctional epoxy resin (A). A thermoset may also be made from the above thermosettable composition.

Abstract: Provided are a resin composition for the manufacture of marble chips including a halogenated epoxy resin binder and showing high heat resistance, high chemical resistance, high impact resistance, high specific gravity and high transparency, a marble chip manufacturing method using the resin composition and an artificial marble made from marble chips.

Abstract: This invention relates to curable sealants that provide low moisture permeability and good adhesive strength after cure. The composition comprises an aromatic compound having meta-substituted reactive groups and a cationic or radical initiator.

Abstract: An epoxy resin composition including a divinylarene dioxide, for example a divinylbenzene dioxide, wherein the divinylarene dioxide has an impurity concentration of less than about 15 weight percent styrenic impurities such as ethylstyrene. Such prepared divinylarene dioxides may be used to prepare curable epoxy resin compositions or formulations, including a blend of a divinylarene dioxide and at least another epoxy resin different from the divinylarene dioxide; and a curable epoxy resin composition including (i) the blend of epoxy resins of the divinylarene dioxide and the at least one epoxy resin different from the divinylarene dioxide; (ii) at least one curing agent; and (iii) optionally, at least one catalyst. The significantly lower concentration of styrenic impurities in the divinylarene dioxides of the present invention provides an epoxy resin composition having low viscosity, better storage stability, and better thermal stability.

Abstract: Disclosed is a fiber-reinforced composite material that is high in heat resistance and strength while being low in the content of volatile matter that volatilizes during curing. Also disclosed are an epoxy resin composition for production thereof, and a prepreg produced from the epoxy resin composition. Specifically the invention provides an epoxy resin composition comprising: [A] an epoxy resin comprising two or more ring structures each consisting of four or more members, and at least one amine type or ether type glycidyl group directly connected to the ring structures, [B] a tri- or more-functional epoxy resin, and [C] a curing agent, and also provides a prepreg produced by impregnating reinforcing fiber with the epoxy resin composition and a fiber-reinforced composite material produced by curing the prepreg.

Abstract: A thermosetting resins composite, composed of: epoxy resin which can have a total polymerization with bismaleimide, occupying 1.75%-18.0% solids weight of the composite; bismaleimide compounds, occupying 0.15%-12.5% solids weight of the composite; free radical initiator, its mole fraction of which its addition accounts for reaction monomer total is 0.01%-0.15%; inhibitor, whose amount is the half to double of the initiator; styrene-maleic anhydride copolymers, occupying 17.5%-47.0% solids weight of the composite; filler, occupying 20%-60% solids weight of the composite; solvent, occupying 30%-50% solids weight of the composite; flame retardant which can be used in CCL industries.

Abstract: An optical waveguide of excellent flex resistance which is to be formed on the surface of a flexible printed circuit is obtained by using an epoxy resin composition includes (A) a liquid epoxy compound, (B) a solid epoxy compound, and (C) a cationic curing initiator, wherein as the liquid epoxy compound (A), (A1) a liquid epoxy compound represented by general formula (I) below is included: (where R1 and R2 are each independently a hydrogen atom or a methyl group; R3 to R6 are each independently a hydrogen atom, a methyl group, a chlorine atom or a bromine atom; R7 is an alkyleneoxy group or alkylene group of 1 to 15 carbons; p is 0 or 1; q is 1 to 25; r and s are 0 when p is 0, and are 1 when p is 1; and n is a positive integer which averages from 1 to 5).

Abstract: The shape memory polymers disclosed are a reaction product of at least one reagent containing two active amino-hydrogen or two active phenolic-hydrogen with at least one multifunctional cross linking reagent which contains at least three or more active amino- or phenolic-hydrogen or is a reagent containing at least three glycidyl ether moieties which is then further mixed with at least one diglycidyl ether reagent whereupon the resulting mixture is cured and has a glass transition temperature higher than 00 C. This reaction creates crosslinking between the monomers and polymers such that during polymerization they form a crosslinked thermoset network.

Abstract: An adhesive formulation comprising i) an adduct of an epoxy resin and an elastomer, ii) a phenoxy resin; a core/shell polymer; iv) a curing agent which provides a structural adhesive with improved low temperature impact strength particularly useful for bonding metal especially in the automotive industry.

Abstract: An oligomeric halogenated chain extender composition comprising the reaction product of: (a) an excess of a halogenated phenolic compound; and (b) a halogenated epoxy resin; in the presence of (c) a solvent; and a halogenated epoxy resin composition comprising the reaction product of the oligomeric halogenated chain extender composition with an epoxy resin.

Abstract: An epoxy sealer/healer formulation for sealing and strengthening cracked concrete. This sealer/healer has reduced fuming and exhibits a lower exotherm.

Abstract: A one-component heat curable epoxide composition which have an excellent storage stability and can be cured in a short period of time at a relatively low temperature, and in particular, have a property of generating outgas in a smaller amount, and providing cured product with an excellent heat resistance, is provided. The composition comprises 100 parts by weight of (A) an epoxide having more than one epoxy group on average in the molecule, and 1 to 40 parts by weight of (B) a curing compound which is prepared by reacting with heating (a) aminoalkylimidazole of the general formula: (b) an amine having two nitrogen atoms with one or two active hydrogen atoms and having at least one cyclic structure group in the molecule therein, (c) urea, and (d) a diepoxide having two epoxy groups on average in the molecule.

Abstract: An epoxy resin composition can be used for forming a film having excellent water-repellency on a substrate surface. The epoxy resin composition contains (a) an epoxy resin having at least two alicyclic epoxy groups, at least one perfluoroalkyl group having 6 to 12 carbon atoms, and at least one alkylsiloxane group and (b) a cationic polymerization catalyst. The alicyclic epoxy groups and the perfluoroalkyl group are present in branched chains of the epoxy resin, and the alkylsiloxane group is present in the main chain of the epoxy resin.

Abstract: An oligomeric halogenated chain extender composition comprising the reaction product of: (a) an excess of a halogenated phenolic compound; and (b) a halogenated epoxy resin; in the presence of (c) a solvent; and a halogenated epoxy resin composition comprising the reaction product of the oligomeric halogenated chain extender composition with an epoxy resin.

Abstract: An oligomeric halogenated chain extender composition comprising the reaction product of: (a) an excess of a halogenated phenolic compound; and (b) a halogenated epoxy resin; in the presence of (c) a solvent; and a halogenated epoxy resin composition comprising the reaction product of the oligomeric halogenated chain extender composition with an epoxy resin.

Abstract: An electro-optic (EO) polymer that has a tunable index of refraction and are synthesized by the copolymerization a bisphenol monomer including a chromophoric structure and two diepoxy monomers. One diepoxy monomer includes at least one fluorine atom, and the second diepoxy monomer includes no fluorine atoms. The EO films are prepared by applying an electric field across the film as the film is heated to its glass transition temperature. The electric field is removed after cooling the film. The index of refraction of these nonlinear optical polymer materials is tuned between about 1.58 to about 1.66 (measured with light having a wavelength of about 1.3 microns).

Abstract: An epoxy resin composition can be used for forming a film having excellent water-repellency on a substrate surface. The epoxy resin composition contains (a) an epoxy resin having at least two alicyclic epoxy groups, at least one perfluoroalkyl group having 6 to 12 carbon atoms, and at least one alkylsiloxane group and (b) a cationic polymerization catalyst. The alicyclic epoxy groups and the perfluoroalkyl group are present in branched chains of the epoxy resin, and the alkylsiloxane group is present in the main chain of the epoxy resin.

Abstract: A composition that is a reaction product of two or three moieties. The first moiety (A) is a nonpolymeric, multi-functional moiety or combination of mono- or multifunctional moieties that adsorbs onto a cementitious particle. The second required moiety (C) is a linear or branched water soluble, nonionic polymer that is capable of providing dispersing capability. A third moiety (B), if present, is a nonpolymeric moiety disposed between the first and second moiety, to connect the first and second moieties.

Abstract: A method of assembling a structure comprises applying an epoxy composition to at least one of a first member and a second member, sandwiching the epoxy composition between the first and second members, and bonding the two members wherein the adhesive bond is a thermally cured mass. The epoxy composition contains an epoxy resin, a phenolic or amine compound as a chain extender, a basic catalyst and a polymeric toughener. The composition can be formulated in two parts wherein part A contains the catalyst and part B has the epoxy resin.

Abstract: The present invention provides a process for eliminating contaminants from epihalohydrin-derived epoxy resins. Another embodiment of the present invention is an epoxy product formed using said process. Yet another embodiment of the present invention is an epoxy derived in part from epihalohydrin wherein said epoxy is has a hydrolyzable halogen content of less than 10 ppm and an epoxide equivalent weight within 2 percent of the theoretical epoxide equivalent weight.

Abstract: The terminal glydidyl groups of a diglycidyl ether of a hydroxyaliphatic bisphenol is optionally reacted with (meth)acrylic acid to obtain a vinyl ester. The internal hydroxyaliphatic groups are reacted with (meth)acrylic acid or cyanoacrylic acid to prepare a diglycidyl and/or (meth)acrylate-terminated (meth)acrylate or urethane acrylate.

Abstract: A perfluoro group-containing compound are represented by the following formula (I): —Rf— is a perfluoro group; and —A represents —OH or a group: or —CyF2y+1 or —CzF2z−1 and a perfluoro group-containing polymerizable compound represented by the following formula (II): R1—O—CH2—CH(OH)—CH2—O—Rf—B  (II) In Formula (II), —Rf— is a perfluoro group; —B is —OH or —O—CH2—CH(OH)—CH2—O—R2, or —CyF2y+1 or —CzF2z−1; and R1 and R2 each is a dehydroxyl residue of a (meth)acryloyl group-containing compound or a vinyl group-containing compound. The hardened polymer from the compound has water-repellency, oil-repellency and adhering ability.

Abstract: A multilayer printed circuit board having resinous insulating layers and conductor layers alternately superposed on a circuit board with ample adhesive strength, a method for the production thereof, and a curable resin composition useful for the formation of resinous insulating layers are disclosed. The manufacture of the multilayer printed circuit board is accomplished by applying the curable resin composition to the surface of conductor layer of the circuit board, thermally curing the applied layer thereby forming resinous insulating layer, then boring a through-hole in the circuit board, treating the resinous insulating layer with a coarsening agent thereby imparting undulating coarsened surface thereto, subsequently coating the surface of resinous insulating layer and the inner surface of the through-hole with a conductor layer as by electroless plating, and thereafter forming a prescribed circuit pattern in the conductor layer.

Abstract: A composition that is a reaction product of two or three moieties. The first moiety (A) is a nonpolymeric, functional moiety that can adsorb onto a particle. The second required moiety (C) is a linear or branched water soluble, nonionic polymer that is capable of providing dispersing capability. A third moiety (B), if present, is a nonpolymeric moiety disposed between the first and second moiety, to connect the first and second moieties.

Abstract: A two-part composition useful as an adhesive comprises an epoxy resin, a chain extender selected from an amine or a phenolic compound, a base catalyst and a polymeric toughener wherein Part A contains the catalyst and Part B with the epoxy resin.

Abstract: A fluorine-containing epoxy resin composition comprising a fluorine-containing aromatic epoxy resin having in one molecule at least one perfluoroalkyl group having 6 to 12 carbon atoms and preferably at least two epoxy groups, a cationic polymerization catalyst, and optionally a compatibilizing agent having an epoxy group and a fluoromethyl group is coated on discharge openings of an ink jet recording head, followed by exposure to activation energy rays in a given pattern form to form cured coatings with a desired pattern so that the discharge openings can be endowed with ink repellency.

Abstract: An inter-laminar adhesive composition containing: (A) a liquid epoxy resin; (B) a polyfunctional epoxy resin having a softening point higher than a lamination temperature of the adhesive and with two or more epoxy groups within the molecule; and (C) a latent epoxy curing agent initiating a reaction at a temperature higher than the lamination temperature; wherein the adhesive composition optionally contains a liquid resin other than component (A) and/or an organic solvent and wherein the liquid resin including component (A), the organic solvent or both constitute from 10 to 55% by weight of the composition, and the use of this interlaminar adhesive composition to prepare a multilayer printed wiring board, and the process for preparing the multilayer printed wiring board are provided.

Abstract: The present invention concerns hydroxyaliphatic functional diglycidyl ethers of bisphenols (epoxy resins); curable (thermosettable) mixtures of at least one hydroxyaliphatic functional epoxy resin and at least one curing agent and/or catalyst therefor, as well as cured (thermoset) compositions prepared therefrom; and derivatives prepared therefrom. The bisphenol precursor to the diglycidyl ether contains a hydroxyaliphatic group linkage between the two aromatic rings of the bisphenol.

Abstract: A resin composition comprising a fluorine-containing aliphatic epoxy resin having in one molecule at least one perfluoroalkyl group having 6 to 12 carbon atoms and at lest two epoxy groups, a cationic polymerization catalyst, and optionally a compatibilizing agent having an epoxy group and a fluoromethyl group is applied to a discharge opening surface of an ink jet recording head, followed by irradiation with an activation energy ray in a given pattern to form a cured film in a desired pattern, so that the discharge opening surface is endowed with ink repellency.

Abstract: In order to realize the objectives stated above, the thermosetting resin composition for carbon fiber reinforced composite materials of the present invention chiefly comprises the following components.

Abstract: Melt processible thermoplastic compositions and method for making them are described, these compositions comprising a thermoplastic polymer resin matrix selected from the group consisting of thermoplastic polyurethanes, polyvinyl chlorides, styrenics, engineering thermoplastics, and polyolefins, at least about 25 percent (by weight based on the total composition) of an elastomeric impact modifier dispersed as discrete particles in the thermoplastic matrix (a); and at least about 10 percent (by weight based on the total composition) of at least one homogeneous linear or substantially linear ethylene polymer dispersed as discrete particles in at least the impact modifier (b), the ethylene polymer having a molecular weight distribution less than 3.5 and a density of at least 0.04 g/cm.sup.3 higher than the density of the impact modifier component (b), wherein the elastic modulus of the thermoplastic component (a) is at least 200 times greater than the elastic modulus of the impact modifier component (b).

Abstract: An epoxy curing agent comprising a heterocycle-containing compound having a backbone chain selected from the group consisting of polyether, polyvinyl, polyester, polyamide, polycarbonate, and novolac chains and at least two heterocyclic groups of the following general formula (1) as side chains, and a one-component (type) epoxy resin composition comprising said epoxy curing agent and a polyepoxy compound, ##STR1## wherein R.sub.1 and R.sup.2 may be the same or different and each represents hydrogen, straight-chain or branched C.sub.1 to C.sub.6 alkyl or alkenyl, or C.sub.6 to C.sub.8 aryl; or R.sub.1 and R.sup.2, taken together with the adjacent carbon atom, represents C.sub.5 to C.sub.7 cycloalkyl; R.sup.3 represents C.sub.1 to C.sub.10 alkylene. The object is to provide the one-component (type) epoxy resin composition having fast-curing feature, an improved storage stability, and an improved degree of workability.

Abstract: A substantially ester-free, acid-functional thiol-functional resin is prepared via the reaction of an epoxy compound with a thiolacetic acid in the presence of an amine catalyst and heat to form a thioacetate derivative which is hydrolyzed to yield an ester-free, .beta.-hydroxy thiol-functional resin. The .beta.-hydroxy thiol-functional resin can then be reacted with a material capable of insert a group conferring aqueous-base developability such as a cyclic anhydride.

Abstract: A copper clad laminate is disclosed as being obtained by thermoforming a prepreg and a copper foil. As disclosed, the pre-preg (uncured) includes a substrate impregnated with an epoxy resin, an aryl ester compound and a curing agent. The copper-clad laminate has a low dielectric constant and a low dielectric loss tangent. It is suitable for a multilayer printed wiring board for high speed operation, especially at high-frequency region.

Abstract: There is provided an adhesive composition for use in a flexible printed circuit board, comprising:(a) an epoxy resin having substantially at least two epoxy groups per molecule;(b) at least one selected from carboxyl group-containing nitrile rubber and carboxyl group-containing hydrogenated nitrile rubber; and(c) a curing agent which comprises aromatic amine having substantially at least two primary amino groups per molecule (c1) and dicyandiamide (c2), the molar ratio of the aromatic amine (c1) to the dicyandiamide (c2) being 35/65.ltoreq.(c1)/(c2).ltoreq.99/1.

Abstract: An epoxy curing agent comprising a heterocycle-containing compound having a backbone clain selected from the group consisting of polyether, polyvinyl, polyester, polyamide, polycarbonate, and novolac chains and at least two heterocyclic groups of the following general formula (1) as side chains, and a one-component (type) epoxy resin composition comprising said epoxy curing agent and a polyepoxy compound, ##STR1## wherein R.sup.1 and R.sup.2 may be the same or different and each represents hydrogen, straight-chain or branched C.sub.1 to C.sub.6 alkyl or alkenyl, or C.sub.6 to C.sub.8 aryl; or R.sup.1 and R.sup.2, taken together with the adjacent carbon atom, represents C.sub.5 to C.sub.7 cycloalkyl; R.sup.3 represents C.sub.1 to C.sub.10 alkylene. The object is to provide the one-component (type) epoxy resin composition having fast-curing feature, an improved storage stability, and an improved degree of workability.

Abstract: An adhesive for a flexible printed circuit board and the method of preparing the same where the adhesive displays excellent migration inhibition, moisture adsorption resistance, and superior peeling strength, heat resistance, solvent resistance, chemical resistance, flexibility, and electrical properties. The adhesive is prepared by pre-polymerizing an epoxy resin, a COOH-containing rubber, a filler, and a primary catalyst in a solvent using a tertiary amine as a primary catalyst to form a prepolymer, followed by curing the prepolymer using a curing agent and a curing catalyst. The adhesive is coated on a plastic film, dried and laminated with a copper foil and then cured at an elevated temperature to form a substrate.

Abstract: Epoxy resins containing rodlike mesogenic moieties are prepared from phenolic hydroxyl containing compounds which contain such moieties.

Abstract: An advanced epoxy cationic resin useful as a cathodic electrodeposition coating is prepared by reacting in the presence of a suitable catalyst (A) a composition comprising (1) at least one diglycidyl ether of (a) an oxyalkylated aromatic diol or (b) an oxyalkylated cycloaliphatic diol or (c) certain oxyalkylated aliphatic diols and (2) at least one diglycidyl ether of a dihydric phenol with (B) at least one dihydric phenol and optionally (C) a monofunctional capping agent. Components (A-1) and (A-2) are employed in quantities such that from 10 to 75 weight percent of the diglycidyl ethers contained in component (A) are contributed by component (A-1), and from 25 to 90 weight percent of such glycidyl ethers are contributed by component (A-2). The terminal oxirane groups in the thus formed advanced epoxy resin are converted to cationic groups by reacting the resin with a nucleophilic compound and adding an organic acid and water at at least one point in the reaction.

Abstract: A resinous material for the manufacture of printed circuit boards is obtained by (a) treating a mixture of bromine- and nonbromine-containing epoxy resins with a secondary diamine such as 5,5-dimethyl hydantion or barbituric acid in the presence of a tertiary amine catalyst to form a modified epoxy resin; (b) heating the modified epoxy resin and a polyisocyanate in the presence of an encyclization catalyst; and (c) dissolving the resulting product in a solvent with a curing agent to form a B-stage prepreg varnish.

Abstract: A curing agent for epoxy resins having improved solubility characteristics has the formula ##STR1## where R is --CH.sub.2 C.sub.6 H.sub.4 X or --CH.sub.2 CH.sub.2 C.sub.6 H.sub.4 X,and X is either --H, --CH.sub.3, --OCH.sub.3, --OH, or --NY,and where Y is --H or CH.sub.3.Such substituted cyanoguanidines are soluble in various solvents and do not require the use of undesirable solvents necessary with cyanoguanidine (dicyanodiamide) itself.

Abstract: Disclosed herein is a flame-retardant resin composition comprising 100 parts by weight of a styrene based polymer, 10 to 40 parts by weight of a brominated bisphenol epoxy resin or a resin in which at least one of the epoxy terminals of the brominated bisphenol epoxy resin is blocked with a brominated phenol, 1 to 10 parts by weight of antimony trioxide, and 0.3 to 5 parts by weight of a methacrylate polymer with a methacrylate unit content of not less than 25 wt %.

Abstract: Thermoplastic resins are prepared by reacting polyglycidyl esters containing one or more mesogenic moieties with compounds having an average of more than one active hydrogen atom per molecule. These resins exhibit ordering of the molecular chains in the melt phase and are susceptible to orientation during processing which can result in enhanced unidirectional mechanical properties. These resins are useful in coatings, laminates, castings and the like.