Abstract: A curing agent for epoxy resins is prepared from an amine and an epoxy, as well as subsequent modification by a polyisocyanate compound, in such a manner that the curing agent is in the form of small spherical particles. The particles can be as small as 0.1 microns. This curing agent can be easily dispersed in curing agent masterbatches and curable compositions with minimal effect on their storage stability. The resulting curable compositions have a wide range of applications, including automobile and electronic adhesives.

Abstract: A curing agent for epoxy resins is prepared from an amine and an epoxy, as well as subsequent modification by a polyisocyanate compound, in such a manner that the curing agent is in the form of small spherical particles. The particles can be as small as 0.1 microns. This curing agent can be easily dispersed in curing agent masterbatches and curable compositions with minimal effect on their storage stability. The resulting curable compositions have a wide range of applications, including automobile and electronic adhesives.

Abstract: Nitrogenous multiacrylic monomers having the formula (I) are produced by reacting at least one diamine having the formula H.sub.2 N--R--NH.sub.2 with at least one polyepoxide resin and at least one (meth)acrylic epoxide. Application in the production of polymers for use in the preparation of varnishes, adhesives, films and composite materials.

Abstract: This invention relates to an adhesive composition, comprising: (A) at least one multifunctional epoxy; and (B) the composition derived from (B-1) at least one difunetional epoxy resin and (B-2) at least one compound represented by the formulaR--(G).sub.n (I)wherein in Formula (I): R is an aromatic, alicyclic or heterocyclic group; G is a functional group selected from the group consisting of COOH, OH, SH, NH.sub.2, NHR.sup.1, (NHC(.dbd.NH)).sub.m NH.sub.2, R.sup.2 COOH, R.sup.2 OH, R.sup.2 SH, R.sup.2 NH.sub.2 and R.sup.2 NHR.sup.1, wherein R.sup.1 is a hydrocarbon group, R.sup.2 is an alkylene or alkylidene group and m is a number in the range of 1 to about 4; and n is a number ranging from 3 up to the number of displaceable hydrogens on R; with the proviso that when at least one G is NH.sub.2 or R.sup.2 NH.sub.2, n is a number ranging from 2 up to the number of displaceable hydrogens on R, and when at least one G is (NHC(.dbd.NH)).sub.m NH.sub.

Abstract: A polysulfide-modified epoxy resin system in which, upon curing, the polysulfide rubber phase separates into discrete particles, typically 1 to 5 .mu.m in size, to enhance physical properties such as peel strength without any significant reduction in glass transition temperature. The phase separation is brought about by using as a modifier a liquid polysulfide containing a high proportion of polymethylene groups of 4 to 12 carbon atoms. The polysulfide may be adducted with an excess of epoxy resin prior to incorporation in the composition.

Abstract: Compositions (I), (II) and (III) comprising compounds having vinyl groups as side chains and epoxidized compositions (XI), (XII) and (XIII) thereof, which can be prepared by the various reaction combinations of (a) with (b) or (b)+(c), and or (d), where(a) is at least one compound having at least one vinyl group and one epoxy group in the molecule; (b) is at least one of a polybasic compound, an anhydride thereof, a polymer having carboxylic groups at terminals and a polymer having carboxylic groups as side chains; (c) is at least one organic compound having at least one active hydrogen atom; and (d) is at east one of an unsaturated monocarboxylic compound or an unsaturated monocarboxylic ester having a hydroxyl group.

Abstract: An epoxy resin curing composition comprising the product of the reaction of (A) a polyamine containing primary amine functionality and (B) a polyepoxide having an EEW of from 130 to 450 in a ratio of moles of polyamine per equivalents of polyepoxide sufficient to provide intermediate (C) which comprises an adduct of about two moles of polyamine and one mole polyepoxide, intermediate (C) being then reacted with an amount of a polyepoxy resin (D) sufficient to react with about 10-40% of the primary amines in intermediate (C) to provide adduct (E), and adduct (E) being end capped with a monoepoxide composition comprising an aromatic glycidyl ether or an alkyl substituted aromatic glycidyl ether, or both. The composition may be salted with a volatile acid such as acetic acid and blended with water to afford an aqueous composition containing 20 to 65% nonvolatiles.

Abstract: A process for producing stable dispersions of epoxy resins is presented in which an epoxy resin is mixed with water in the presence of a reactive surfactant to form a predispersed resin. To this predispersed resin, a micronized dicyandiamide based curing agent is added to form a predispersed resinous mass. The mass is stirred for a time and at a temperature sufficient to convert the predispersed resinous mass to a stable epoxy resin dispersion where the water is the continuous phase and the resin is the dispersed phase. The dispersion is useful as a one-pack epoxy resin system in applications such as binders for non-wovens, papers, textiles, composites, and laminates and in many coating applications.

Abstract: A curing composition and a method for impregnating wood using the curing composition, which comprises a reaction product represented by formula (1) obtained by reacting an alkylene oxide adduct of a hydrocarbon polyol and (meth)acrylic acid: ##STR1## wherein R.sup.10 represents a residual group of a hydrocarbon polyol having from 3 to 15 carbon atoms and (c1+d1) hydroxyl groups; R.sup.11 represents an alkylene group having from 2 to 4 carbon atoms; R.sup.12 represents an alkylene group having from 2 to 4 carbon atoms; R.sup.13 represents a hydrogen atom or a methyl group; a1 represents a number of from 0 to 10; b1 represents a number of from 0 to 10; c1 represents a number of not less than 1.5; and d1 represents a number of not less than 0.5; provided that (a1+b1) is not less than 1.

Abstract: An epoxy resin composition comprising an epoxy resin component containing at least 5% by weight of an epoxy resin of Formula [I], an epoxy hardener, and an inorganic filler as essential constituents: ##STR1## [wherein R and R.sup.1 denote alkyl of C.sub.2 to C.sub.6, and n is an integer repetition unit from 0 to 10.]. The epoxy resin composition, when used as a molding material, is low in water absorption rate and flexural modulus (low stress).

Abstract: A curing agent for epoxy resins is prepared from an amine and an epoxy, as well as subsequent modification by a polyisocyanate compound, in such a manner that the curing agent is in the form of small spherical particles. The particles can be as small as 0.1 microns. This curing agent can be easily dispersed in curing agent masterbatches and curable compositions with minimal effect on their storage stability. The resulting curable compositions have a wide range of applications, including automobile and electronic adhesives.

Abstract: A curing agent for aqueous epoxy resin emulsions comprising 10-80% by weight of at least one emulsifier, 1-80% by weight of at least one coemulsifier, and 5-80% by weight of at least one bis(diamine)-diepoxide adduct. Optionally, the curing agent contains 0-80% by weight of a diamine or a mixture of two or more diamines.

Abstract: The improved coating of the present invention provides a protective coating for pipe, tubular shapes, other metal members, and metal structures. The protective coating comprises a polymer concrete, which is preferably a mixture of an organic resin, a filler material and a chemical activator. The organic resin is preferably a mixture of thermosetting polymer resins, such as bisphenol A based epoxy, bisphenol A based epoxy blended with polyglycol di-epoxide, and polyglycol di-epoxide. The filler material may be calcium carbonate, silica flour, zeosphere, talc, or kaolin, and preferably is of up to 200 mesh in size. The chemical activator preferably is an amine, such as aminoethylpiperazine or tetraethylene pentamine.

Abstract: Aqueous primer compositions containing substantially no volatile organic solvents, suitable for promoting the bonding of a metal adherend to a second adherend, are prepared by dispersing one or more solid epoxy resins and a solid curing agent into water such that the particle sizes of the solids are less than 30 .mu.m. The primer compositions are environmentally superior to solvent based primers without loss of physical properties, are storage stable, and exhibit excellent solvent resistance.

Abstract: An epoxy resin system comprising a) at least one nitrogen containing epoxy compound having at least two epoxy groups, b) at least one phosphorus compound with at least one epoxy group, c) at least one metallic complex compound as curing agent and d) optionally filler and additive substances free of halogenated compounds and having a low degree of inflammability.

Abstract: Polyol/epoxy adducts obtained by reaction of(A) an aliphatic polyol having an average molecular weight (Mw) of 200 to 2000 and(B) an epoxy compound having at least two epoxy groups per molecule and an epoxy equivalent weight of 100 to 2000,the equivalent ratio of the OH groups to the epoxy groups being 1:3.51 to 1:10, preferably 1:4 to 1:9, particularly preferably 1:45 to 1:8, and the epoxy equivalent weight of the adduct being between 150 g/eq and at least 800 g/eq, preferably between 250 g/eq and 1000 g/eq which adducts serve as nonionic emulsifiers in water-dilutable epoxy liquid resins.

Abstract: There is disclosed a solid composition of polyglycidyl compounds having a molecular weight of less than 1500, which composition consists of one or more than one solid polyglycidyl compound and altogether not less than 5% by weight of one or of a mixture of more than one polyglycidyl compound, which compound or mixture is normally in liquid form, said amount being based on the total amount of all polyglycidyl compounds in the composition, which composition contains the said solid polyglycidyl compounds or at least part of the said solid polyglycidyl compounds in form of one or a mixture of more than one solid mixed phase, which solid mixed phase or mixture of more than one solid mixed phase essentially comprises the total amount of the polyglycidyl compounds which are normally in liquid form as additional component or components.

Abstract: The present invention discloses oriented optical epoxy compositions comprising a reaction product of arylhydrazones with a monomer copolymerizable therewith and to oriented crosslinked polymeric composition comprising the reaction product of an epoxy arylhydrazone or the epoxy composition of the invention with a curing agent. The present invention also discloses processes for making the said compositions.

Abstract: Modified unsaturated linear polymers have at least a first residue, a second residue and an acid residue. The first, second and acid residues correspond to a first, second and acid monomers used to prepare the polymers. The first monomer may be a diacid, anhydride, diacid ester or mixture thereof. The second monomer may be a diol or glycol. The acid monomer may be an aromatic dicarboxylic acid, different than the first monomer. The first residue is present in a concentration not less than about 7.5 mole % and the acid residue is present in a concentration ranging between 2.5 mole % and 12.5 mole %, based on the total mole monomer ratio of the polymer. The polymers have a glass transition temperature ranging from about 54.degree. C. to about 64.degree. C.

Abstract: Epoxy resin compositions which contain (1) an epoxy resin which has two or more epoxy groups in its molecule, (2) a polythiol compound which has two or more thiol groups in its molecule and (3) an accelerator which is (i) a solid dispersion-type amine adduct latent curing accelerator or (ii) the product of a reaction between a compound which contains one or more isocyanate groups in its molecule and a compound which has at least one primary and/or secondary amino group in its molecule, exhibit excellent curability at relatively low heating temperatures as well as a long working life.

Abstract: Graft copolymers containing:(1) a phenolic resin; and(2) a poly(alkylene oxide) chain pendant to the phenolic resin,selected such that the graft copolymer has a solubility of no more than about 10 g/L in water, are taught. The graft copolymers are useful in coatings compositions with a curing agent, a solvent, and optionally an epoxy resin. The curable compositions have improved flexibility and/or solvent resistance. They are particularly useful in can coatings.

Abstract: This invention relates to improved polyepoxide resins having enhanced physical and elastic properties. The polyepoxide resins comprise a polyepoxide resin based on a polyglycidyl ether of a phenolic-type compound and an amine curing agent. The improvement in the polyepoxide resin formulation comprises incorporating an aliphatic, aliphatic ether or ester component having monofunctional reactivity with an amine hydrogen, an amine curative having from 3 to 10, and preferably 3 to 5 epoxide reactive hydrogen atoms into the epoxy resin, and a diglycidyl ether of a polyalkyleneoxide. The presence of the monofunctional and aliphatic amine reactive component along with the diglycidyl ether of a polyalkyleneoxide results in an epoxy resin having enhanced properties.

Abstract: Cross-linked epoxy resins having nonlinear optical properties may be used in nonlinear optical media. These cross-linked epoxy resins may have the following structure: ##STR1## Z.sup.1 and Z.sup.2 being NLO-chromophores.

Abstract: Adducts containing terminating nitro (nitroso) groups and one or more mesogenic moieties are prepared by reacting (A) at least one compound containing an average of more than one vicinal epoxide group per molecule with (B) at least one compound containing one or more nitro (nitroso) groups and an average of one reactive hydrogen atom per molecule; with the proviso that at least one member of components (A) and (B) contains a mesogenic moiety. Reduction of these adducts provides amines which are useful as curing agents for epoxy resins.

Abstract: A resin composition for toners, composed essentially of a suspension polymerizate of:(a) 5 to 40% by weight per total polymer of a polyester comprising at least one aromatic diol component an at least one aliphatic diol component, and having a weight average molecular weight of 3,000 to 30,000, an acid value of 0.5 to 10 mgKOH/g, and an OH value of 10 to 60 mgKOH/g;(b) 60 to 95% by weight per total polymer of a vinyl monomer; and(c) 0.1 to 1.0% by weight per total polymer of a divinyl monomer,wherein said suspension polymerizate hasa glass transition temperature of 40.degree. to 70.degree. C.,an acid value of 0.1 to 10 mgKOH/g, anda softening temperature of 100.degree. to 160.degree. C.

Abstract: An advanced thermosetting epoxy powder composition comprising from about 95 epoxide equivalent percent to about 99 epoxide equivalent percent of a diglycidyl ether of an aromatic bisphenol, from about 1 to about 5 epoxide equivalent percent of at least one trifunctional polyglycidyl ether of an aliphatic polyol, a curing agent selected from the group consisting of dihydric bisphenol such as bisphenol-A and mixtures of bisphenol-A and bisphenol A endcapped diglycidyl ether of bisphenol A, and a curing accelerator selected from the group consisting of imidazoles and imidazole adducts with polyglycidyl ether of aliphatic polyol.

Abstract: Electrical laminates can be prepared from an epoxy resin composition which comprises:(A) at least one epoxy resin having an average of more than one epoxy group per molecule;(B) an oligomer having a terminal phenolic hydroxyl group, which oligomer results from the reaction of a glycidyl ether of a halogenated phenolic compound and a halogenated phenolic compound; and(C) at least one catalyst for catalyzing a reaction between Component (A) and Component (B).

Abstract: A thermally curable mixture contains 10-70% by weight of reactive compounds, 0.05-2% by weight of at least one basic catalyst, and at least one solvent. The reactive compounds are consisting essentially of a first reactive compound and a second reactive compound at a molar ratio between 1:1 and 1:10. The first reactive compound is a formamide selected from the group consisting of hydroxyformamides, di-formamides and polyformamides, and the second reactive compound is at least one compound having an epoxy equivalent between 100 and 800 g KOH per mole epoxy group, selected from a group of aromatic di-glycidylethers and aromatic poly-glycidylethers. The basic catalyst is at least one chemical agent selected from the group consisting of tertiary ammonium salts, tertiary aromatic amines, and tertiary heterocyclic amines. The solvent is at least one chemical compound selected from the group consisting of aliphatic alcohols, ether alcohols, diether, and tertiary amides.

Abstract: An improved liquid matrix system for producing fibre-reinforced plastic components is disclosed. The system comprises (i) a liquid diglycidyl ether of a halogenated bisphenol or a mixture of liquid polyglycidyl ether bisphenols at least one of which being a polyglycidyl ether halogenated bisphenol; and (ii) a curing agent that is a sterically hindered aromatic diamine containing two primary amino groups attached to the carbon atoms in the aromatic nucleus, said carbon atoms not adjacent to each other, and at least one C.sub.1 to C.sub.6 linear or branched alkyl or thioalkyl substituent; the improvement comprising adding to said system a curing accelerator composition containing a mixture of a boron halide and an imidazole unsubstituted or substituted with at least one C.sub.1 to C.sub.6 linear or branched alkyl or C.sub.6 to C.sub.10 aryl.

Abstract: Epoxy resins containing more than one vicinal epoxide group per molecule and at least one thiadiazole, oxadiazole or both thiadiazole and oxadiazole moiety per molecule are disclosed, as well as curable and cured compositions thereof. Certain of these epoxy resins possess enantiotropic liquid crystallinity. These enantiotropic epoxy resins are useful in preparing copolymers with high glass transition temperatures and liquid crystalline morphology, which can result in enhanced unidirectional mechanical properties. These epoxy resins are useful in coating, casting, encapsulation, electronic or structural laminate or composite, filament winding or molding applications.

Abstract: A phenolic compound is provided which can be described by the formula ##STR1## in which Ar is a C.sub.6-20 aromatic moiety, L is a cyclohexanenorbornane linking moiety, L' is a divalent cycloaliphatic moiety, and each of m and n is a number within the range of 0 to about 10. Such phenols include the product of the addition reaction of phenol with a cyclohexenenorbornene compound such as 5-(3-cyclohexen-1-yl)bicyclo[2.2.1]hept-2-ene.

Abstract: The invention provides epoxy resin compounds for manufacturing prepregs and composite materials, which can be obtained inexpensively and have good processibility, and provide--without having to add flameproofing agents--virtually inflammable molded materials with a high glass transition temperature. The epoxy resin compounds contain the following constituents:(A) an aromatic and/or heterocyclic polyepoxide resin that is free of phosphorous, optionally in a mixture with an aliphatic epoxy resin;(B) an epoxy-group-containing phosphorous compound and(C) an aromatic polyamine as a curing agent.

Abstract: An epoxy resin composition useful in an electrical laminate, which composition comprises:(A) an epoxy resin prepared by reacting (A-1) an epoxy resin having an average of more than one, but less than three epoxy groups per molecule and (A-2) a phenolic compound having an average of more than one, but less than three hydroxyl groups per molecule at a ratio to provide an epoxy to phenolic equivalent ratio of 1:x;(B) y equivalent of a phenolic compound having an average of more than one, but less than three hydroxyl groups per molecule; and(C) at least one catalyst for catalyzing a reaction of Component (A) and Component (B);wherein x and y satisfy the following equations:x.gtoreq.0.01y.gtoreq.0.010.02.ltoreq.x+y<1.00.The disclosed epoxy resin composition, exhibits low viscosity when dissolved in an organic solvent and good heat resistance when cured.

Abstract: Epoxy interpenetrating polymer networks having chemical bonds between the interpenetrating networks are prepared from a first and a second polymer network, at least one of which contains an EPRXE resin; a resin having two epoxide functionalities represented by E and a reactive pendant nonepoxide functionality X. The two resin networks are sequentially crosslinked followed by activation of the pendant functionality of the EPRXE resin to form internetwork chemical bonds between the two resin networks affording an epoxy resin with both increased strength and toughness. The invention is also directed to the process of making interpenetrating polymer networks.

Abstract: An advanced epoxy cationic resin useful as an electrodeposition coating and having a charge density of from 0.2 to 0.6 milliequivalent of cationic charge per gram of resin is prepared by reacting in the presence of a suitable catalyst (A) a composition comprising (1) at least one diglycidyl ether of (a) an oxyalkylated aromatic diol or (b) an oxyalkylated cycloaliphatic diol or (c) certain oxyalkylated aliphatic diols and (2) at least one diglycidyl ether of a dihydric phenol with (B) at least one dihydric phenol and optionally (C) a monofunctional capping agent.Components (A-1) and (A-2) are employed in quantities such that from 10 to 75 weight percent of the diglycidyl ethers contained in component (A) are contributed by component (A-1), and from 25 to 90 weight percent of such glycidyl ethers are contributed by component (A-2). Components (A) and (B) are employed in such quantities that the resultant epoxy resin has an average epoxide equivalent weight of from 350 to 10,000.

Abstract: Glycidyl amines containing mesogenic moieties result in improved properties when cured. These amines are useful in coatings, adhesives, encapsulants, moldings, laminates, and the like.

Abstract: A multilayer printed circuit board comprising a plurality of alternately laminated layers of insulating layers and circuit conductor layers having a signal transmission delay time of 6.0 ns/m or less, excellent in heat resistance, adhesive, fire retardance, etc. can be produced by forming insulating layers using a fluorine-containing thermosetting resin composition.

Abstract: An epoxy resin composition for forming prepregs is disclosed which includes an epoxy resin having at least two epoxy groups, a latent curing agent for the epoxy resin in an amount of 0.5-3.0 equivalents per equivalent of the epoxy groups of the epoxy resin, and a reactive, viscosity-increasing agent in an amount of 0.2-3.0 parts by weight per 100 parts by weight of the epoxy resin. The epoxy resin composition has an initial viscosity n.sub.I(50) at 50.degree. C. of 1,000-200,000 cP and an initial viscosity n.sub.I(23) at 23.degree. C. of at least 10,000 cP.

Abstract: A series of oligomeric adducts of diols and diepoxides are disclosed which are precursors of amine resins for use in electrodeposition coatings. The adducts are epoxide-alcohol addition products of a polyaromatic and/or a mono-aromatic diol and a polyaromatic bis-glycidyl ether, and/or a monoaromatic bis-glycidyl ether and/or an alkoxy arylene bis-glycidyl ether, thioether or amine. The coatings which include amine resin, cross linking agent, grind resin and pigment exhibit excellent corrosion resistance.

Abstract: Polymer modified adducts are prepared by (A) reacting (1) an epoxy resin having an average of more than one vicinal epoxide group with (2) a compound containing an average of two or more hydrogen atoms reactive with an epoxide group; and (B) partially vinylizing reacting the product from step (A); and (C) polymerizing the partially vinylized product from step (B) with (3) a polymerizable ethylenically unsaturated monomer; with the proviso that at least one of the components (1), (2) or (3) contain one or more mesogenic or rodlike moieties. These adducts are useful as epoxy resin curing agents.

Abstract: An improved flame retardant epoxy molding compound comprises an epoxy, a hardener preferably of the novolac or anhydride type, a catalyst, a mold release agent, preferably a filler, preferably a colorant, preferably a coupling agent, an organic compound containing a higher percent of halogen (which can be part of the resin or the hardener), preferably the polyglycidyl ether of the bromophenol-formaldehyde novolac type, preferably containing at least about 1.0% of bromine by weight of the molding compound, a lower percent of sodium, preferably in the range of 0.03-0.06% by weight of the antimony pentoxide, a lower percent of antimony pentoxide, preferably in the range of .ltoreq. about 0.8% by weight of the molding compound, and an amount of bismuth trioxide .ltoreq. about 4.0% by weight of the molding compound.

Abstract: An aqueous resin dispersion containing as an aqueous resin component a polyurethane-modified epoxy-polyamine resin comprising a reaction product of an epoxy group-containing polyurethane compound obtained by the reaction of a polyhydroxy compound having a number average molecular weight of 50 to 8,000, a polyisocyanate compound, and a compound containing one hydroxyl group and at least one alicyclic epoxy group in a molecule; a bisphenol compound; a bisphenol diglycidyl ether compound; and an active hydrogen-containing amine compound. Said aqueous resin dispersion has excellent corrosion resistance and is suited especially for cathode electro-deposition coating.

Abstract: The present invention relates to a hardener for polyfunctional epoxy resins comprising the adduct obtained from the reaction of (1) a diaminodiphenyl sulfone of the formula ##STR1## wherein R.sub.1, R.sub.2, R.sub.3 and R.sub.4 are independently hydrogen, C.sub.1 -C.sub.4 alkyl or halogen and (2) a cycloaliphatic diepoxide at a ratio of aminohydrogen equivalent of said sulfone to said epoxy equivalent of said diepoxide from 2.5:1 to 75:1.

Abstract: Acid functional compounds which are the reaction products of monoepoxides, phosphorus-containing acids and cyclic anhydrides are disclosed. The reaction products promote adhesion and prevent yellowing when added to curable film-forming compositions.

Abstract: Curable compositions which are precursors for cured or partially cured light stabilized epoxy resins which are the product of the reaction of some or all of the epoxy groups of an epoxy resin with an N-(2,2,6,6-tetraalkyl-4-piperidinyl)amic acid hydrazide as well as the cured or partially cured reaction products thereof together with processes for their use and articles of manufacture produced thereby are disclosed.

Abstract: A thermosetting resin composition comprising (A) a naphthalene ring-bearing epoxy resin, (B) a dicyclopentadiene-modified phenolic resin, and (C) an inorganic filler is suitable for encapsulating semiconductor devices since the composition cures into a product having a low coefficient of expansion, good adhesion and low moisture absorption.

Abstract: A plural liquid pack type heat curable resin compound useful for producing a shaped resin article having an enhanced resistance to heat and chemicals, and excellent mechanical and electrical properties, comprises a first individual liquid component (A) comprising a polyisocyanate compound (a) and a second individual liquid component (B) comprising a glycidyl acrylate compound (b) having ##STR1## groups in which R' and R" respectively and independently represent a --H or --CH.sub.3, a cyclization catalyst (c) and optionally at least one of polyol compounds (e) and polyepoxy compounds (f), the first and/or second individual liquid components (A) and/or (B) comprising a radical curing catalyst (d).

Abstract: Polyester resins are prepared by reacting a lower alkyl ester of an aromatic dicarboxylic acid with an aliphatic diol to form an aromatic polyester, and which includes (i) subjecting to transesterification reaction conditions in the presence of a titanium compound catalyst a transesterification reaction system having the lower alkyl ester of the aromatic dicarboxylic acid, the aliphatic and between 0.02 to 5.0 mole percent, based on the amount of the lower alkyl ester of the aromatic dicarboxylic acid, of an aromatic sulfonic acid compound represented by the following general formula (I):OH--R--O--Ar--SO.sub.3 M (I)wherein Ar is a p-substituted benzene group or a 2,6-substituted naphthalene group, R is a divalent group selected from among --CH.sub.2 CH(CH.sub.3)--, --CH(CH.sub.3)CH.sub.2 --, --CH.sub.2 CH(CH.sub.3)-- and --CH.sub.2 CH.sub.2 OCH.sub.2 CH.sub.2 --, and M is an alkali metal selected from the group consisting of lithium, sodium and potassium.

Abstract: Compositions comprising epoxy resins containing one or more rodlike mesogenic moieties per molecule are cured with polyamines containing one or more rodlike mesogenic moieties per molecule. These curable compositions can be oriented by the application of an electric field or magnetic field or drawing and/or shear flow prior to and/or during curing. The resultant cured products exhibit an improvement in one or more physical and/or mechanical and/or thermal properties as compared to a like epoxy resin system which does not contain any rodlike mesogenic moieties.

Abstract: There is disclosed a solid composition of polyglycidyl compounds having a molecular weight of less than 1500, which composition consists of one or more than one solid polyglycidyl compound and altogether not less than 5% by weight of one or of a mixture of more than one polyglycidyl compound, which compound or mixture is normally in liquid form, said amount being based on the total amount of all polyglycidyl compounds in the composition, which composition contains the said solid polyglycidyl compounds or at least part of the said solid polyglycidyl compounds in form of one or a mixture of more than one solid mixed phase, which solid mixed phase or mixture of more than one solid mixed phase essentially comprises the total amount of the polyglycidyl compounds which are normally in liquid form as additional component or components.