Two Or More 1,2-epoxy Reactants Patents (Class 528/103)
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Patent number: 5292832Abstract: Advanced epoxy cationic resins are prepared from an epoxy-based resin containing oxirane groups by converting at least some of the oxirane groups to cationic groups is improved by using as the epoxy-based resin a blend of (I) an epoxy-based resin obtained by reacting in the presence of a suitable catalyst (1) a diglycidylether of an oxyalkylated aromatic or cycloaliphatic diol, such as a condensation product of bisphenol A, ethylene oxide and epichlorohydrin, optionally (2) a diglycidylether of a dihydric phenol, for example a diglycidyl ether of bisphenol A, (3) a dihydric phenol such as bisphenol A, and optionally (4) a capping agent such as p-nonylphenol and (II) a different cationic epoxy-based resin. Such resin blends can be utilized in cathodic electrodeposition coating systems. Use of the diglycidylether of an oxyalkylated diol provides coating compositions with lower viscosity and produces deposition coatings of higher film build and better surface appearance than compositions without this component.Type: GrantFiled: January 5, 1993Date of Patent: March 8, 1994Assignee: The Dow Chemical CompanyInventor: Richard A. Hickner
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Patent number: 5288816Abstract: The present invention relates to nonlinear optical materials comprising aminoaryl hydrazones and to nonlinear optical polymeric compositions containing recurring covalently bonded moieties derived from the aminoaryl hydrazones of the invention. The polymeric compositions of the present invention have high glass transition temperatures and exhibit stable nonlinear optical activity at high temperatures over a period of time.Type: GrantFiled: August 10, 1992Date of Patent: February 22, 1994Assignee: The Dow Chemical CompanyInventors: Muthiah N. Inbasekaran, Mark D. Newsham, Michael N. Mang
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Patent number: 5280068Abstract: Curable epoxy resins are toughened with statistical monofunctional carboxyl, amine or epoxy terminated reactive polymers and have low viscosities before cure thereby making them useful in a wide range of applications. The cured epoxy resin systems which are modified by the statistical monofunctional reactive polymers have physical properties, such as adhesion and elongation, generally equal to or better than those of cured epoxy resin systems modified with statistical difunctional reactive polymers. A process of preparation for the modified epoxy resin systems of the present invention includes admixing an epoxy resin with a statistical monofunctional carboxyl, amine, or epoxy-terminated reactive polymer in the presence of a curing agent and reaction therewith to form the toughened, cured epoxy resin system.Type: GrantFiled: May 26, 1992Date of Patent: January 18, 1994Assignee: The B.F. Goodrich CompanyInventors: Alan R. Siebert, Robert J. Bertsch
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Patent number: 5278259Abstract: An epoxy resin composition comprising:(A) as a resin chief material a bisphenol A type epoxy resin having the following formula (1), ##STR1## wherein n is 0 to 10, R.sup.1 and R.sup.2 each represents a glycidyl group, and A.sup.1 to A.sup.8 each represents a hydrogen atom or a bromine atom;(B) as an epoxy resin curing agent,(b1) a bisphenol A or a brominated product thereof having formula (1) (wherein n is 0, R.sup.1 and R.sup.2 each represents a hydrogen atom, and A.sup.1 to A.sup.4 each represents a hydrogen atom or a bromine atom), or(b2) a novolac resin of a bisphenol A or a brominated product thereof that is obtained by linking two or more molecules of a bisphenol A or a brominated product thereof having formula (1) (wherein n is 0, R.sup.1 and R.sup.2 each represents a hydrogen atom, and A.sup.1 to A.sup.4 each represents a hydrogen atom or a bromine atom), through a methylene group(s) at any of A.sup.1 to A.sup.Type: GrantFiled: April 12, 1991Date of Patent: January 11, 1994Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Michio Futakuchi, Hiroyuki Nakajima, Takashi Takahama
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Patent number: 5273792Abstract: The present invention is directed to a novel epoxy polymeric composition resulting from reacting (A) at least one compound containing an average of more than one epoxide group per molecule with (B) at least one curing agent for component (A). At least a portion of the curing agent (B) is at least a first curing agent compound which contains (a) an average of more than one active amine hydrogen atom per molecule and (b) an average of at least one aromatic ring which contains at least one pendant monovalent electron withdrawing group. The present invention also includes a process for preparing the above polymeric materials. The polymeric materials of the present invention also exhibit nonlinear optical capabilities when formed into an optically transparent medium with a noncentrosymmetric alignment of molecules. The nonlinear optical materials of the present invention are useful in electrooptic devices for use in communications and data-processing.Type: GrantFiled: March 13, 1992Date of Patent: December 28, 1993Assignee: The Dow Chemical CompanyInventor: John J. Kester
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Patent number: 5266365Abstract: The present invention is directed to an epoxy-containing polymeric material having nonlinear optical properties, particularly a glycidyl amine polymer, and a process for making the nonlinear optical (NLO) epoxy-containing polymeric material including poling the polymeric material under high voltage at elevated temperature for a period of time to bring about orientation of the nonlinear optical functionalities in the polymer. The polymers have enhanced thermal stability and good NLO properties.Type: GrantFiled: February 28, 1992Date of Patent: November 30, 1993Assignee: The Dow Chemical CompanyInventors: John J. Kester, H. Craig Silvis
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Patent number: 5262456Abstract: A halogen free casting resin suitable for covering electron devices with a fire retardant material contains an acidic ester of an hydroxy-functional phosphor compound and an organic anhydride. A stable mixture can be generated from the acidic ester and the hardener component of the casting resin, and further used for the hardening of epoxides resins. The acidic ester is chemically integrated in the epoxide resin matrix in a stable mixture, thereby improving the long term fire-retardancy of the casting resin molding compound without increasing the volatility of the mixture.Type: GrantFiled: November 5, 1992Date of Patent: November 16, 1993Assignee: Siemens AktiengesellschaftInventors: Ernst Wipfelder, Winfried Plundrich
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Patent number: 5250637Abstract: An epoxy resin composition comprising an epoxy resin, a curing agent and an inorganic filler is adapted for semiconductor encapsulation. A fluorinated organic silicon compound is blended in the composition as a coupling agent whereby the composition is improved in adhesion and moisture resistance.Type: GrantFiled: November 25, 1992Date of Patent: October 5, 1993Assignee: Shin-Etsu Chemical Co., Ltd.Inventors: Toshio Shiobara, Kazutoshi Tomiyoshi, Yasuo Tarumi, Hiromasa Yamaguchi
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Patent number: 5248741Abstract: An advanced epoxy cationic resin useful as an electrodeposition coating having a charge density of from 0.2 to 0.6 milliequivalent of cationic charge per gram of resin is prepared by reacting in the presence of a suitable catalyst (A) a composition comprising (1) at least one diglycidyl ether of (a) an oxyalkylated aromatic diol or (b) an oxyalkylated cycloaliphatic diol or (c) certain oxyalkylated aliphatic diols and (2) at least one diglycidyl ether of a dihydric phenol with (B) at least one dihydric phenol and optionally (C) a monofunctional capping agent. Components (A-1) and (A-2) are employed in quantities such that from 10 to 75 weight percent of the diglycidyl ethers contained in component (A) are contributed by component (A-1), and from 25 to 90 weight percent of such glycidyl ethers are contributed by component (A-2). Components (A) and (B) are employed in such quantities that the resultant epoxy resin has an average epoxide equivalent weight of from 350 to 10,000.Type: GrantFiled: November 17, 1992Date of Patent: September 28, 1993Assignee: The Dow Chemical CompanyInventors: Kenneth W. Anderson, Richard A. Hickner
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Patent number: 5246978Abstract: The present invention relates to a polyol, polyurethane resin, rigid polyurethane foam, preparation process thereof and a preparation process of a rigid polyurethane foam composite. The polyol comprises an epoxy resin based polyol, which may be combined with a phenol resin based polyol component and/or an aromatic amine based polyol component. The polyurethane resin, foam and composite using the polyol as a raw material has resistance to dissolution in a hydrochlorofluorocarbon and a hydrofluorocarbon which are foaming agents having very low public environmental hazards and can be used as a thermal insulation material or a thermal insulation structure for refrigerators, freezers, insulation panels, ships and vehicles.Type: GrantFiled: November 8, 1990Date of Patent: September 21, 1993Assignee: Mitsui Toatsu Chemicals, Inc.Inventors: Satoshi Ozaki, Tsukuru Izukawa, Haruhiko Kawakami, Takayoshi Masuda, Toshio Nozawa
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Patent number: 5244998Abstract: Advanced resins and unadvanced epoxy resins are disclosed wherein the unadvanced compound and at least a portion of the advanced epoxy resin contains at least one --O--R.sup.1 --O-- or --(O--CH.sub.2 --CHR.sup.2).sub.n --O-- group as a bridge between two groups selected independently from the group consisting of (1) a saturated or unsaturated cycloaliphatic group, (2) an aromatic group, (3) a group represented by the formula ##STR1## or (4) a group represented by the formula ##STR2## Also disclosed are nucleophilic derivatives thereof, as well as curable compositions and coating compositions containing the advanced or unadvanced epoxy resins or nucleophilic modified advanced or unadvanced epoxy resins. These advanced resins and unadvanced epoxy resins provide coatings with good flexibility or formability as exhibited by good flexural or formable properties determined by reverse impact, T-bend and wedge-bend tests, chip resistance, and with good corrosion resistance and throwpower.Type: GrantFiled: June 17, 1992Date of Patent: September 14, 1993Assignee: The Dow Chemical CompanyInventors: Robert A. Dubois, Allyson Malzman, Pong S. Sheih, Alan R. Whetten
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Patent number: 5241016Abstract: The invention is an epoxy resin adhesive composition. The composition comprises:A. An epoxy resin component; andB. A curative component comprising:a curing amount of a polyamine curing agent and 2 to 30 phr. of an adhesion enhancer of comprising a partially hindered polyetherpolyamine.The fast curing adhesive offers high lap shear strength and relatively high peel strength.Type: GrantFiled: May 29, 1992Date of Patent: August 31, 1993Assignee: Texaco Chemical CompanyInventors: Harold G. Waddill, Robert A. Grigsby, Jr., Michael Cuscurida, Robert L. Zimmerman
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Patent number: 5235008Abstract: Polymer modified adducts are prepared by (A) reacting (1) an epoxy resin having an average of more than one vicinal epoxide group with (2) a compound containing an average of two or more hydrogen atoms reactive with an epoxide group; and (B) partially vinylizing reacting the product from step (A); and (C) polymerizing the partially vinylized product from step (B) with (3) a polymerizable ethylenically unsaturated monomer; with the proviso that at least one of the components (1), (2) or (3) contain one or more rodlike mesogenic moieties. These adducts are useful as epoxy resin curing agents.Type: GrantFiled: August 3, 1990Date of Patent: August 10, 1993Assignee: The Dow Chemical CompanyInventors: Robert E. Hefner, Jr., Jimmy D. Earls
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Patent number: 5227436Abstract: Epoxy-containing compounds are prepared by dehydrohalogenating the reaction product of an epihalohydrin with the reaction product of a compound containing an average of more than one aromatic hydroxyl group per molecule with an alkylene oxide wherein the ratio of moles of epihalohydrin to hydroxyl groups is at least about 1.2:1. When these epoxy containing compounds are formulated into coatings, the resultant products have improved chemical resistance to acids.Type: GrantFiled: July 2, 1992Date of Patent: July 13, 1993Assignee: The Dow Chemical CompanyInventors: Michael B. Cavitt, Dennis L. Steele, David J. Duncan
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Patent number: 5227453Abstract: High solids coating compositions are made from organic solvent solutions of the reaction product of a diglycidyl ether of a dihydric phenol, vernonia oil and a dihydric phenol.Type: GrantFiled: February 10, 1992Date of Patent: July 13, 1993Assignee: Hi-Tek Polymers, Inc.Inventors: Jim D. Elmore, William J. DeGooyer, Mary B. Tipton, John H. Kaiser
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Patent number: 5227452Abstract: Compositions comprising epoxy resins containing one or more rodlike mesogenic moieties per molecule are cured with polyamines containing one or more rodlike mesogenic moieties per molecule. These curable compositions can be oriented by the application of an electric field or magnetic field or drawing and/or shear flow prior to and/or during curing. The resultant cured products exhibit an improvement in one or more physical and/or mechanical and/or thermal properties as compared to a like epoxy resin system which does not contain any rodlike mesogenic moieties.Type: GrantFiled: June 29, 1992Date of Patent: July 13, 1993Assignee: The Dow Chemical CompanyInventors: Jimmy D. Earls, Robert E. Hefner, Jr., Paul M. Puckett
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Patent number: 5225455Abstract: This application discloses flooring compositions containing a hardener component, a resin component and an aggregate component; the compositions additionally contain either a monoepoxide or an alcohol or aromatic hydrocarbon.Type: GrantFiled: December 19, 1990Date of Patent: July 6, 1993Assignee: Stonhard, Inc.Inventors: Frank C. Sessa, Carolyn E. Massey
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Patent number: 5221700Abstract: Pigment dispersion resins for use in cathodic electrocoat paint systems are the reaction products of (A) the reaction product of an aromatic diglycidyl ether and a bis-aryl alcohol or aromatic diol; (B) a primary amine which includes a diamine, an amino alcohol, an aminopolyalkoxy alcohol, a fatty amine, or any mixture thereof; and (C) a monoepoxide. In one embodiment, the fatty amine is provided in an effective amount to eliminate the necessity of the inclusion of the monoepoxide.Type: GrantFiled: May 27, 1992Date of Patent: June 22, 1993Assignee: BASF CorporationInventors: John A. Gilbert, Gunther Ott, David J. Santure
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Patent number: 5218061Abstract: The present invention relates to a novel polyfunctional epoxy resin having two phenolic glycidyl ether groups, one or more of alcoholic glycidyl ether groups and one or more of alcoholic hydroxyl groups in one molecules. The present invention further provides an epoxy resin composition comprising the epoxy resin. The cured product obtained from the epoxy resin composition according to the present invention is excellent in heat resistance, toughness, adhesion property and water proofness, and it is extremely useful for a wide range of application uses such as molding materials, casting materials, laminate materials, coating materials, adhesives and photoresists.Type: GrantFiled: September 10, 1991Date of Patent: June 8, 1993Assignee: Nippon Kayaku Kabushiki KaishaInventors: Yoshitaka Kajiwara, Shoushi Takahashi, Kenichi Mizoguchi, Sumio Saito
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Patent number: 5213897Abstract: Curable compositions which are precursors for cured or partially cured light stabilized epoxy resins which are the product of the reaction of some or all of the epoxy groups of an epoxy resin with an N-(2,2,6,6-tetraalkyl-4-piperidinyl)amic acid hydrazide as well as the cured or partially cured reaction products thereof together with processes for their use and articles of manufacture produced thereby are disclosed.Type: GrantFiled: April 3, 1991Date of Patent: May 25, 1993Assignee: Elf Atochem North America, Inc.Inventors: Arthur L. Baron, Ronald E. MacLeay, Jennifer P. Kmiec
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Patent number: 5201248Abstract: A one-pack type liquid epoxy resin composition for balancing rotators comprises an epoxy resin, a curing agent, a curing accelerator, an inorganic filler, and a thixotropic agent as main components, wherein said curing agent is dicyandiamide or a dibasic acid dihydrazide and said curing accelerator is a tertiary amino group-containing compound obtained by reacting a polyfunctional epoxy compound, a compound having a tertiary amino group and at least one active hydrogen in the molecule, and a carboxylic acid anhydride. Further, a method for balancing a rotator comprises correcting unbalance of the rotator caused at rotation by applying a balancing material consisting of the above epoxy resin composition to the rotator by an automatic unbalance-correcting apparatus.Type: GrantFiled: December 3, 1991Date of Patent: April 13, 1993Assignees: Sumitomo Bakelite Company Limited, Asmo Co., Ltd.Inventors: Hiromitu Ibe, Takazou Fujimoto
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Patent number: 5198065Abstract: The present invention relates to a creosote resistant epoxy adhesive system comprising(A) a low viscosity primer comprising(a) a resin component comprising diglycidyl ether of Bisphenol A, diglycidyl ether of butanediol, and epoxy silane; and(b) a hardener component comprising an aliphatic amine; and(B) an adhesive component comprising(a) a resin component comprising diglycidyl ether of Bisphenol A, a diluent, a filler, and epoxy silane; and(b) a hardener component comprising a combination of (i) an aliphatic or aromatic amine and (ii) a polyamide or an adducted amine with diglycidyl ether of Bisphenol, and a fillerand wherein a flexibilizer is present in either component (a) or component (b) of said adhesive component.Type: GrantFiled: February 25, 1991Date of Patent: March 30, 1993Assignee: Ciba-Geigy CorporationInventor: Rajan Eadara
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Patent number: 5191033Abstract: The invention is an epoxy resin composition. Diol initiators are reacted with alkylene oxide and 1 to 5 wt % epoxy resin. The epoxy resin is added internally, along the length of the diol chain to yield a modified polyol of molecular weight 2000 to 5000. The modified polyol is subjected to reductive amination to yield a polyamine. This polyamine is mixed with an epoxy base resin and cured to product epoxy resins demonstrating improved strength and adhesion.Type: GrantFiled: May 11, 1992Date of Patent: March 2, 1993Assignee: Texaco Chemical CompanyInventors: Michael Cuscurida, George P. Speranza, Kathy B. Sellstrom
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Patent number: 5162439Abstract: In an adhesive for printed circuit boards, whose main components are an epoxy resin and a polymer rubber, the improvement wherein the polymer rubber is a hydrogenated conjugated diene polymer rubber having not more than 100 ppm of metal content, not more than 100 ppm of ion content as determined by ion chromatography, and an iodine value of not more than 120.Type: GrantFiled: November 17, 1989Date of Patent: November 10, 1992Assignee: Nippon Zeon Co., Ltd.Inventor: Suguru Tsuji
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Patent number: 5162438Abstract: In an adhesive for printed circuit boards, whose main components are an epoxy resin and a polymer rubber, the improvement wherein the polymer rubber is a hydrogenated conjugated diene polymer rubber having not more than 100 ppm of metal content, not more than 100 ppm of ion content as determined by ion chromatography, and an iodine value of not more than 120, the ratio by weight of the hydrogenated conjugated diene polymer rubber to the epoxy resin in the adhesive being 35-75 weight % to 65-25 weight %.Type: GrantFiled: August 27, 1991Date of Patent: November 10, 1992Assignee: Nippon Zeon Co., Ltd.Inventor: Suguru Tsuji
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Patent number: 5147905Abstract: Advanced resins and unadvanced epoxy resins are disclosed wherein the unadvanced compound and at least a portion of the advanced epoxy resin contains at least one --O--R.sup.1 --O-- or --(O--CH.sub.2 --CHR.sup.2).sub.n --O-- group as a bridge between two groups selected independently from the group consisting of (1) a saturated or unsaturated cycloaliphatic group, (2) an aromatic group, (3) a group represented by the formula ##STR1## or (4) a group represented by the formula ##STR2## Also disclosed are nucleophilic derivatives thereof, as well as curable compositions and coating compositions containing the advanced or unadvanced epoxy resins or nucleophilic modified advanced or unadvanced epoxy resins. These advanced resins and unadvanced epoxy resins provide coatings with good flexibility or formability as exhibited by good flexural or formable properties determined by reverse impact, T-bend and wedge-bend tests, chip resistance, and with good corrosion resistance and throwpower.Type: GrantFiled: May 1, 1991Date of Patent: September 15, 1992Assignee: The Dow Chemical CompanyInventors: Robert A. Dubois, Duane S. Treybig, Allyson Malzman, Pong S. Sheih, Alan R. Whetten
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Patent number: 5145919Abstract: Epoxy-containing compounds are prepared by dehydrohalogenating the reaction product of an epihalohydrin with the reaction product of a compound containing an average of more than one aromatic hydroxyl group per molecule with an alkylene oxide wherein the ratio of moles of epihalohydrin to hydroxyl groups is at least about 1.2:1. When these epoxy containing compounds are formulated into coatings, the resultant products have improved chemical resistance to acids.Type: GrantFiled: October 8, 1991Date of Patent: September 8, 1992Assignee: The Dow Chemical CompanyInventors: Michael B. Cavitt, Dennis L. Steele, David J. Duncan
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Patent number: 5143999Abstract: Hardenable mixtures of materials, comprising(a) an epoxide resin,(b) a dithiol of the formula I or II ##STR1## in which the R.sub.1 s independently of one another are hydrogen or methyl, x is an integer from 2 to 50 and y is an integer from 1 to 30, and(c) a polyamine having at least two primary amino groups,give, after hardening, flexible and tough-lasting products. They are suitable, if appropriate in combination with further additives, for example for the production of sealing compositions, injection compositions, adhesives, moulding resins, matrix resins, casting resins or coating compositions.Type: GrantFiled: November 22, 1989Date of Patent: September 1, 1992Assignee: Ciba-Geigy CorporationInventors: Frans Setiabudi, Jean-Pierre Wolf
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Patent number: 5140069Abstract: Curable compositions containingA) an epoxy resin having on average more than one epoxy group per molecule,B) a carboxylic anhydride curing agent for component A) andC) about 5 to 40% by weight, relative to the amount of the components A), B) and C), of a liquid mixture of C1) a polyalkylene glycol based on polypropylene glycol or polybutylene glycol having two to about six hydroxyl, carboxyl, carboxylic anhydride or glycidyl end groups and of C2) an elastomeric copolymer based on butadiene, a polar, ethylenically unsaturated comonomer and, if appropriate, further ethylenically unsaturated comonomers having carboxylic acid, hydroxyl, mercapto or glycidyl ether end groups are described. Components C1) and C2) can also occur together in a segmented copolymer.Type: GrantFiled: February 16, 1990Date of Patent: August 18, 1992Assignee: Ciba-Geigy CorporationInventors: Rolf Mulhaupt, Werner Rufenacht
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Patent number: 5140068Abstract: Curable epoxy resins are toughened with statistical monofunctional carboxyl, amine or epoxy terminated reactive polymers and have low viscosities before cure thereby making them useful in a wide range of applications. The cured epoxy resin systems which are modified by the statistical monofunctional reactive polymers have physical properties, such as adhesion and elongation, generally equal to or better than those of cured epoxy resin systems modified with statistical difunctional reactive polymers. A process of preparation for the modified epoxy resin systems of the present invention includes admixing an epoxy resin with a statistical monofunctional carboxyl, amine, or epoxy-terminated reactive polymer in the presence of a curing agent and reaction therewith to form the toughened, cured epoxy resin system.Type: GrantFiled: March 22, 1991Date of Patent: August 18, 1992Assignee: The B. F. Goodrich CompanyInventors: Alan R. Siebert, Robert J. Bertsch
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Patent number: 5140091Abstract: Disclosed are a composition comprising polyether compounds, obtained by addition copolymerization of a mixture of 4-vinylcyclohexene-1-oxide and a compound having at least two epoxy groups with a compound having at least one active hydrogen atom, and a composition comprising epoxy compounds obtained by epoxidation of the composition of the polyether compounds. The invention also relates to processes for production thereof.The disclosed composition comprising epoxy compounds has a higher softening temperature compared that produced by polymerization of only 4-vinylcyclohexene-1-oxide with a compound having at least one active hydrogen atom.Type: GrantFiled: December 20, 1990Date of Patent: August 18, 1992Assignee: Daicel Chemical Industries Ltd.Inventors: Katsuhisa Sakai, Hiroyuki Oshima
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Patent number: 5135994Abstract: The cure of an epoxy resin containing a hardener such as a polycarboxylic acid anhydride can be catalyzed with a catalyst comprising a rare earth carboxylate dissolved in a solvent which is at least dispersible in and reactive with the epoxy resin.Type: GrantFiled: August 15, 1990Date of Patent: August 4, 1992Assignee: Rhone-Poulenc Inc.Inventor: Taki J. Anagnostou
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Patent number: 5132374Abstract: Adducts of the formula I ##STR1## are described in which R.sup.1 is an e-valent aliphatic radical after the removal of the functional groups, X is --O--or --NH--, R.sup.2 is a d+l-valent carbocyclic-aromatic radical, R.sup.3 is hydrogen or methyl, R.sup.4 is an aliphatic, aromatic, or araliphatic c+l-valent radical, Y is --O--, --S--or --NR.sup.5 --, R.sup.5 is hydrogen or ##STR2## b is an integer from 2 to 15, b is an integer from 1 to 25, c is 1, 2 or 3, d is 1, 2 or 3 and e is 2, 3 or 4.The adducts can be combined with latent curing agents and, if appropriate, other epoxy resins to give adhesives having good stability on storage and high flexibility.Type: GrantFiled: March 28, 1991Date of Patent: July 21, 1992Assignee: Ciba-Geigy CorporationInventors: Franz-Josef Reischmann, Madan M. Bagga
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Patent number: 5128425Abstract: An epoxy resin composition for use in carbon fiber reinforced plastics which comprises the following components (A), (B), (C), and (D):(A) an epoxy resin of the bisphenol A diglycidyl ether type;(B) at least one compound selected from the group consisting of dicyandiamide, 2,6-xylenylbiguanide, o-tolylbiguanide, diphenylguanidine, adipyldihydrazide, azelayldihydrazide, and isophthalic acid dihydrazide;(C) a compound represented by general formula (I) ##STR1## wherein X.sub.1 and X.sub.Type: GrantFiled: June 19, 1990Date of Patent: July 7, 1992Assignee: Mitsubishi Rayon Co., Ltd.Inventors: Yoshinobu Shiraishi, Hisashi Tada
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Patent number: 5122586Abstract: Disclosed are a composition comprising polyether compounds, obtained by addition copolymerization of a mixture of 4-vinylcyclohexene-1-oxide and a compound having at least two epoxy groups with a compound having at least one active hydrogen atom, and a composition comprising epoxy compounds obtained by epoxidation of the composition of the polyether compounds. The invention also relates to processes for production thereof.The disclosed composition comprising epoxy compounds has a higher softening temperature compared that produced by polymerization of only 4-vinylcyclohexene-1-oxide with a compound having at least one active hydrogen atom.Type: GrantFiled: March 3, 1989Date of Patent: June 16, 1992Assignee: Daicel Chemical Industries, Ltd.Inventors: Katsuhisa Sakai, Hiroyuki Oshima
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Patent number: 5112934Abstract: The present invention is directed to an epoxy-containing polymeric material having nonlinear optical properties, particularly a glycidyl amine polymer, and a process for making the nonlinear optical (NLO) epoxy-containing polymeric material including poling the polymeric material under high voltage at elevated temperature for a period of time to bring about orientation of the nonlinear optical functionalities in the polymer. The polymers have enhanced thermal stability and good NLO properties.Type: GrantFiled: November 27, 1989Date of Patent: May 12, 1992Assignee: The Dow Chemical CompanyInventors: John J. Kester, H. Craig Silvis
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Patent number: 5095050Abstract: Compositions are prepared by the reaction of (A) an advanced composition resulting from reacting (1) at least one of (a) at least one epoxidized triglyceride of a fatty acid, or (b) at least one epoxidized fatty acid having an average of more than one unsaturated group per molecule or (c) at least one diepoxyalkane, or (d) any combination of any two or more of (a), (b) or (c), or (e) a combination of any one or more of (a), (b) or (c) and (f) a diglycidyl ether of a dihydric phenol; with (2) a dihydric phenol; (B) optionally a monohydric phenol; (C) a phosphorus-containing compound; and (D) optionally a base. These compositions can be cured with curing agents which react with aliphatic hydroxyl groups.Type: GrantFiled: November 21, 1990Date of Patent: March 10, 1992Assignee: The Dow Chemical CompanyInventors: Duane S. Treybig, David S. Wang, Pong S. Sheih, Loan A. Ho
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Patent number: 5086094Abstract: Nonaqueous organic solvent solutions of phosphate esters of epoxy resins. Coating compositions containing these compositions have improved thermal properties as compared to like compositions which are dispersed in water.Type: GrantFiled: May 29, 1990Date of Patent: February 4, 1992Assignee: The Dow Chemical CompanyInventor: John L. Massingill, Jr.
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Patent number: 5084546Abstract: Thermosetting epoxy resin compositions having improved flame retardancy having combined therewith an effective amount of a dihydroxymethyl phosphine oxide having the general formula ##STR1## wherein R represents an alkyl group having from 1 to about 8 carbon atoms or --R'OH where R' represents an alkylene group having from 2 to about 8 carbon atoms, are disclosed.Type: GrantFiled: December 12, 1990Date of Patent: January 28, 1992Assignee: American Cyanamid CompanyInventors: Robert G. Fischer, Jr., Chester J. Calbick
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Patent number: 5077376Abstract: A latent hardener material for epoxy resins comprising a combination ofHardener (A) which is a reaction product of phthalic anhydride and diethylenetriamine, andHardener (B) which is a reaction product of a polyfunctional epoxy compound, an imidazole compound and a carboxylic acid anhydride.A combination of latent hardeners (A) and (B) can achieve cure of an epoxy resin composition in 15 minutes at 76.degree. C. A one part epoxy resin composition comprising an epoxy resin in admixture with a combination of hardeners (A) and (B) has a good shelf life.Type: GrantFiled: May 21, 1990Date of Patent: December 31, 1991Assignee: Loctite (Ireland) Ltd.Inventor: John Dooley
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Patent number: 5066735Abstract: Electrical laminates are prepared from prepreg materials prepared by impregnating a substrate with a laminating varnish comprising a solvent solution of a curable composition comprising (A) a mixture of at least one epoxy resin having an average of more than 1 but not more than 2 vicinal epoxy groups per molecule and at least one epoxy resin having an average of more than 2 vicinal epoxy groups per molecules; (B) a mixture of at least one phenolic hydroxyl-containing compound having an average of more than 1 but not more than 2 phenolic hydroxyl groups per molecule and at least one phenolic hydroxyl-containing compound having an average of more than 2 phenolic hydroxyl groups per molecule; and (C) at least one catalyst for effecting the reaction between (A) and (B).Type: GrantFiled: April 12, 1990Date of Patent: November 19, 1991Assignee: The Dow Chemical CompanyInventors: Louis L. Walker, Paul A. Larson
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Patent number: 5061779Abstract: A liquid epoxy composition containing a diglycidyl ether of a dihydric phenol and/or a diglycidyl ether of a tetrabrominated dihydric phenol, an epoxy with a functionality from 2.2 to 4, cycloaliphatic diamine curing agent, and thixotropic agent; and use thereof to fill drilled through-holes in circuit boards and cards and as isolation border around the edges of a board or card.Type: GrantFiled: March 14, 1989Date of Patent: October 29, 1991Assignee: International Business Machines CorporationInventor: David W. Wang
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Patent number: 5057551Abstract: Adhesives containing some bifunctional and some at least trifunctional epoxide compounds, photoinitiators, and acrylates of methacrylates corresponding to general formulaCH.sub.2 =C(R.sup.1)-CO-(OC.sub.m H.sub.2m).sub.n -OR.sup.2in which R.sup.1 is hydrogen or methyl and R.sup.2 is a hydrocarbon radical containing a cationically cleavable oxacycloalkyl or oxacycloalkenyl group, continue to harden in darkness after their hardening has been photoinitiated, and thus can produce strong bonds between opaque substrates, when the substrates are coated with the adhesives, the adhesive coatings are exposed to light to initiate the hardening, and the coated substrates are pressed together within a short interval before the hardening of the photoinitiated adhesives advances to the gel point.Type: GrantFiled: March 2, 1989Date of Patent: October 15, 1991Assignee: Henkel Kommanditgesellschaft auf AktienInventors: Rene-Andres A. Gonzalez, Heinz-Christian Nicolaisen, Lothar Kammer
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Patent number: 5053476Abstract: An epoxy resin composition suitable for use as a casting resin for the potting of an ignition coil is disclosed which comprises:(A) a mixture containing(a.sub.1) a liquid, Bisphenol-type epoxy resin, and(a.sub.2) an inorganic filler,(a.sub.3) a polyether polyol; and(B) a liquid curing agent including(b.sub.1) an acid anhydride, and(b.sub.2) an imidazole compound.Type: GrantFiled: June 23, 1989Date of Patent: October 1, 1991Assignee: Somar CorporationInventors: Ichiro Akutagawa, Kunimitsu Matsuzaki, Toshio Matsuo, Toru Shirose
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Patent number: 5053475Abstract: An epoxy resin composition characterized by comprising, as essential components,(A) a bifunctional epoxy resin,(B) a trifunctional epoxy resin,(C) a phenol compound represented by the following formula ##STR1## (X.sub.1 to X.sub.8 each represent Br, Cl or H and at least four of X.sub.1 to X.sub.8 each represent Br or Cl; R.sub.1 and R.sub.2 each represent H or CH.sub.3), and(D) 4,4'-diaminodiphenyl sulfone or 3,3'-diaminodiphenyl sulfone.Type: GrantFiled: June 22, 1990Date of Patent: October 1, 1991Assignee: Mitsubishi Rayon Co., Ltd.Inventors: Hisashi Tada, Akira Agata, Masahiro Saruta, Takashi Murata, Takatoshi Kubo
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Patent number: 5047441Abstract: Polyurethane systems are disclosed utilizing polyvinyl acetate/allyl alcohol random copolymers to produce rigid polyurethane foams and a process for producing the same. The resulting foams exhibit improved K-factors, utilized reduced amounts of fluorocarbons as blowing agents, and maintained insulating properties when formulated with increased amounts of water.Type: GrantFiled: August 10, 1989Date of Patent: September 10, 1991Assignee: BASF CorporationInventors: Eric J. Lind, Manfred L. Genz, Michele L. Lee, Thomas B. Lee
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Patent number: 5034434Abstract: Non-gelled amine-epoxide reaction products are obtained by co-reacting a secondary amine, a polyoxyalkylene polyamine, a polyepoxide and a monoepoxide. The products are cross-linkable and are useful in aqueous coating compositions, particularly when applied to a substrate by cathodic electrodeposition.Type: GrantFiled: October 18, 1989Date of Patent: July 23, 1991Assignee: Imperial Chemical Industries PLCInventors: Michael Beresford, Richard P. Redman
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Patent number: 5034493Abstract: Disclosed is a curing agent composition for epoxy resin, prepared by mixing together the following components (i), (ii) and (iii) and heating the mixture for modification:(i) at least one organic carboxylic acid zinc salt,(ii) at least one acid anhydride, and(iii) either (a) at least one phenol compound or (b) at least one glycidyl ester or glycidyl ether compound.Type: GrantFiled: December 13, 1989Date of Patent: July 23, 1991Assignee: New Japan Chemical Co., Ltd.Inventors: Shoji Tani, Masahiko Yamanaka, Tomio Nobe, Shigeo Takatsuji
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Patent number: 5034494Abstract: Two part epoxy resin system comprising a main component comprising a bisphenol type epoxy resin having not more than 0.08% by weight of a content of a saponifiable chlorine-containing group and a curing component comprising a modified aromatic polyamine and a liquid imidazole, which has a long pot-life at room temperature and is curable even at an intermediate temperature such as about 50.degree. to 60.degree. C., and is useful as a paint composition, an adhesive, a lining material, a molding material and a floor covering material.Type: GrantFiled: November 16, 1989Date of Patent: July 23, 1991Assignee: Sunstar Giken Kabushiki KaishaInventors: Takao Nakajima, Masaaki Murase, Nobuo Agari
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Patent number: 5032629Abstract: Novel hardening agents for epoxy compounds which are produced by reaction of polyalkylene, polyether amines having a mean molecular weight of 148 to 5,000 with di and/or polyepoxy compounds to a preliminary product, the ratio of the hydrogen atoms possibly remaining after reaction with monoepoxy compounds and bound to nitrogen and which are capable of reaction with epoxide groups, to epoxide groups of diepoxy compounds or polyepoxy compounds in the range of 1:1.4 to 6, and reaction of this preliminary product with a primary or secondary amine, the employed amine or amine mixture being used in an amount such that the ratio of epoxide groups capable of reaction to hydrogen atoms attached to nitrogen is 1:2 to 10.Type: GrantFiled: February 28, 1990Date of Patent: July 16, 1991Assignee: Rutgerswerke AGInventors: Achim Hansen, Alfred Mathes, Jurgen Zehrfeld