Abstract: An anti-reflective hardmask composition contains: (a) an arylcarbazole derivative polymer represented by the following Chemical Formula 1 or a polymer blend containing the same; and (b) an organic solvent in Chemical Formula 1, A1 and A2 are each independently a (C6-C40) aromatic aryl group and are the same as or different from each other, R is t-butyloxycarbonyl (t-BOC), ethoxyethyl, isopropyloxyethyl, or tetrahydropyranyl, X1 and X2 are each a polymerization linkage group derived from aldehyde or an aldehyde acetal monomer capable of being one-to-one polymerized with an arylcarbazole derivative and A2 in the presence of an acid catalyst, m/(m+n) is in a range of 0.05 to 0.8, and a weight average molecular weight (Mw) of an the polymer is in a range of 1,000 to 30,000.

Abstract: The present invention relates to an epoxy-resin composition as matrix component for sheet molding compounds (SMC) and/or bulk molding compounds (BMC), comprising a resin component comprising at least one epoxy resin and a hardener component comprising at least one imidazole compound and at least one latent hardener. In said epoxy-resin composition, the amount of the imidazole compounds used is in the range from 0.007 to 0.025 mol per mole of epoxy groups of the entire composition, and the total amount of primary amine groups optionally comprised does not exceed a proportion of 0.09 mol per mole of epoxy groups of the entire composition. The invention also relates to a fiber-matrix-semifinished-product composition (SMC composition or BMC composition) with, as matrix component, the epoxy-resin composition mentioned, and with, suspended therein, short reinforcement fibers with an average length of from 0.3 to 5.0 cm.

Abstract: A carbazole polymer including a repeating unit represented by Formula 1 and having excellent one electron oxidation-state stability, wherein, in Formula 1, R1-R4 each independently represents an alkyl group having 1-60 carbon atoms, a haloalkyl group having 1-60 carbon atoms, or similar, Cz represents a divalent group including a carbazole skeleton represented by Formula 2, and Ar represents a divalent aromatic ring or similar; wherein, in Formula 2, R5 represents a hydrogen atom, an alkyl group having 1-60 carbon atoms, or similar, R6-R11 each independently represents a hydrogen atom, a halogen atom, or similar, and m represents an integer 1-10.

Abstract: The present invention relates to 1,4-diketopyrrolo[3,4-c]pyrrole (DPP) derivatives of the below formula to their manufacture; to their use as organic semiconductors, e.g. in semiconductor devices, especially a sensor, a diode, a photodiode, an organic field effect transistor, a transistor for flexible displays, and/or a solar cell (photovoltaic cell); to such semiconductor devices comprising diketopyrrolopyrrol derivatives of the formula I as a semiconducting effective means, and to devices containing said semiconductor devices. The compounds of the formula I have excellent solubility in organic solvents. High efficiency of energy conversion, excellent field-effect mobility, good on/off current ratios and/or excellent stability can be observed, when said compounds are used in semiconductor devices or organic photovoltaic (PV) devices.

Abstract: Polyamines A1 of formula (I) or (II). They can be easily synthesized from readily available raw materials and have no primary amino groups or only a low content of primary amino groups and thus exhibit hardly any blushing. Their viscosity is relatively low, compared with polyamine/polyepoxide adducts of the polyamine on which polyamine A1 is based. Thus epoxy resin compositions can be formulated that are free of benzyl alcohol and free of blushing.

Abstract: Disclosed are certain polymeric compounds and their use as organic semiconductors in organic and hybrid optical, optoelectronic, and/or electronic devices such as photovoltaic cells, light emitting diodes, light emitting transistors, and field effect transistors. The disclosed compounds can provide improved device performance, for example, as measured by power conversion efficiency, fill factor, open circuit voltage, field-effect mobility, on/off current ratios, and/or air stability when used in photovoltaic cells or transistors. The disclosed compounds can have good solubility in common solvents enabling device fabrication via solution processes.

Abstract: A Pechmann dye based polymer of formula 1, below, is provided.

Abstract: Conjugated polymers and small molecules including the nonplanar aromatic 1,6-methano[10]annulene ring structure along with aromatic subunits, such as diketopyrrolopyrrole, and 2,1,3-benzothiadiazole, substituted with alkyl chains in a “Tail In,” “Tail Out,” or “No Tail” regiochemistry are disclosed.

Abstract: The present invention pertains to the field of thermosetting or thermoset polymers mainly used as materials, coatings or adhesives. The invention more specifically relates to the use of specific molecules having associative groups including a nitrogen heterocycle as a hardener or co-hardener of thermosetting polymers.

Abstract: An extended isoindigo polymer of Formula (I), below, is provided.

Abstract: Disclosed are certain polymeric compounds and their use as organic semiconductors in organic and hybrid optical, optoelectronic, and/or electronic devices such as photovoltaic cells, light emitting diodes, light emitting transistors, and field effect transistors. The disclosed compounds can provide improved device performance, for example, as measured by power conversion efficiency, fill factor, open circuit voltage, field-effect mobility, on/off current ratios, and/or air stability when used in photovoltaic cells or transistors. The disclosed compounds can have good solubility in common solvents enabling device fabrication via solution processes.

Abstract: There is provided a resist underlayer film having heat resistance that is used for a lithography process in the production of semiconductor devices, and a high refractive index film having transparency that is used for an electronic device. A polymer comprising a unit structure of Formula (1): wherein each of R1, R2, R3, and R5 may be a hydrogen atom, R4 may be phenyl group or naphthyl group. A resist underlayer film forming composition comprising the polymer, and a resist underlayer film formed from the composition. A high refractive index film forming composition comprising the polymer, and a high refractive index film formed from the composition.

Abstract: Polymers which can be used in p-type materials for organic electronic devices and photovoltaic cells. Compounds, monomers, dimers, trimers, and polymers comprising: wherein A1 and A2 each independently comprise a fused ring system comprising at least two fused rings directly covalently linked to the pyrrole rings. Good photovoltaic efficiency and lifetime can be achieved. The R group can provide solubility, environmental stability, and fine tuning of spectroscopic and/or electronic properties. Different polymer microstructures can be prepared which encourage multiple band gaps and broad and strong absorptions. The carbonyl can interact with adjacent thiophene rings to provide backbone with rigidity, induce planarity, and reduce and/or eliminate intramolecular chain twisting defects.

Abstract: There is provided a resist underlayer film having heat resistance that is used for a lithography process in the production of semiconductor devices, and a high refractive index film having transparency that is used for an electronic device. A polymer comprising a unit structure of Formula (1): wherein each of R1, R2, R3, and R5 may be a hydrogen atom, R4 may be phenyl group or naphthyl group. A resist underlayer film forming composition comprising the polymer, and a resist underlayer film formed from the composition. A high refractive index film forming composition comprising the polymer, and a high refractive index film formed from the composition.

Abstract: A porphyrin copolymer containing quinoxaline unit, preparation method and uses thereof are disclosed. The copolymer has the structural formula (I), wherein R1, R2, R3, R4 are selected from C1˜C32 alkyl groups, and n is an integer between 1 and 100. The copolymer is useful in the fields of solar battery and the like.

Abstract: A perylenetetracarboxylic acid diimide organic semiconductive material is represented by the following formula (I), which belongs to the field of photoelectric material. In formula (I), n is an integer of 1-100, R1, R2 or R3 is hydrogen, C1-C20 alkyl, C1-C20 alkoxyl, phenyl or alkoxyphenyl, R4 or R5 is C1-C20 alkyl, R6 or R7 is hydrogen, C1-C20 alkyl, C1-C20 alkoxyl or phenyl.

Abstract: A semiconductor composition for producing a semiconducting layer with consistently high mobility is disclosed. The semiconductor composition includes a diketopyrrolopyrrole-thiophene copolymer and a non-aromatic halogenated hydrocarbon solvent. The copolymer has a structure disclosed within. Preferably, the non-aromatic halogenated hydrocarbon solvent contains at least 2 carbon atoms and at least 3 halogen atoms.

Abstract: A copolymer containing fluorenylporphyrin-anthracene is disclosed, which comprises a polymer represented by formula (1), in which R1, R2, R3 and R4, which may be identical or different, are C1-C16 alkyl, and n is an integer of 1 to 100. A preparation method of the copolymer containing fluorenylporphyrin-anthracene and the application thereof in manufacture of solar cell devices, organic field-effect transistors, organic electroluminescent devices, organic optical storage device, organic nonlinear materials or organic laser devices are also disclosed.

Abstract: A copolymer containing fluorenylporphyrin-benzene is disclosed, which comprises a copolymer represented by formula (1), in which R1, R2, R3 and R4, which may be identical or different, are C1-C16 alkyl, and n is an integer of 1 to 100. The preparation method of said copolymer containing fluorenylporphyrin-benzene and the use thereof in manufacture of solar batteries components, organic field effect transistors, organic electroluminescent components, organic optical storage components, organic non-linear materials or organic laser components are also disclosed.

Abstract: A porphyrin copolymer containing thienothiadiazole units, preparation method and uses thereof are disclosed. The copolymer has the structural formula (I), wherein: R1, R2, R3, R4 are same or different and each represents a C1-C32 alkyl; n is an integer of 1-100. The copolymer comprises fluorene units, thienothiadiazole units and porphyrin units, which enhance the density of electron cloud in copolymer skeleton, make the band-gap of the copolymer become narrow, thereby broaden the spectral response range of the copolymer, and improve the photoelectric transformation efficiency.

Abstract: The present invention is directed to a method for preparing a cyclic guanidine comprising reacting (i) a cyanamide, (ii) a polyamine, and (iii) a weak acid. The present invention is also directed to a coating composition comprising the cyclic guanidine.

Abstract: Copper plating baths containing a leveling agent that is a reaction product of a certain imidazole with a certain epoxide-containing compound that deposit copper on the surface of a conductive layer are provided. Such plating baths deposit a copper layer that is substantially planar on a substrate surface across a range of electrolyte concentrations. Methods of depositing copper layers using such copper plating baths are also disclosed.

Abstract: Copper plating baths containing a leveling agent that is a reaction product of a certain imidazole with a certain epoxide-containing compound that deposit copper on the surface of a conductive layer are provided. Such plating baths deposit a copper layer that is substantially planar on a substrate surface across a range of electrolyte concentrations. Methods of depositing copper layers using such copper plating baths are also disclosed.

Abstract: Copper plating baths containing a leveling agent that is a reaction product of a certain benzimidazole with a certain epoxide-containing compound that deposit copper on the surface of a conductive layer are provided. Such plating baths deposit a copper layer that is substantially planar on a substrate surface across a range of electrolyte concentrations. Methods of depositing copper layers using such copper plating baths are also disclosed.

Abstract: The use of 1,3-substituted imidazolium salts of the formula I in which R1 and R3 independently of one another are an organic radical having 1 to 20 C atoms, R2, R4, and R5 independently of one another are an H atom or an organic radical having 1 to 20 C atoms, it also being possible for R4 and R5 together to form an aliphatic or aromatic ring, and X is a dicyanamide anion as latent catalysts for curing compositions comprising epoxy compounds.

Abstract: A coating composition is provided for use in laminate substrates useful in packaging of liquids and solids where the coating provides and increased resistance to the permeability of gases such as oxygen and carbon dioxide. In one embodiment the coating composition is a dispersion or a solution that comprises at least one hydroxyl functional polyetheramine, phosphoric acid and a defoamer. The backbone of the polyetheramine has diglycidyl ether linkages that comprise about 5 to about 70 mole percent resorcinol diglycidyl ether. The coating composition can be applied to substrates by coating applications such as spraying, rolling reverse and direct, rolling direct and reverse gravure, kiss coat, flow coating, brushing, dipping and curtain-wall coating, for example.

Abstract: A latent epoxy resin curing agent is provided which can be manufactured without using an amphiphilic polymer compound requiring a painful trial and error selection process, exhibits excellent solvent resistance and low-temperature fast-curing ability, and contains an imidazole-based compound as a main component. In the latent epoxy resin curing agent containing the imidazole-based compound as a main component, the adduct particles of the epoxy-based compound and the imidazole-based compound are coated with an ethyl cellulose film, and the surface thereof is crosslinked with a polyfunctional isocyanate compound. The epoxy-based compound, the imidazole-based compound, and ethyl cellulose are dissolved in a predetermined saturated hydrocarbon-based solvent under stirring and heating. Then, the epoxy-based compound and the imidazole-based compound are subjected to adduct reaction to obtain a slurry of the adduct.

Abstract: The use of 1,3-substituted imidazolium salts of the formula I in which R1 and R3 independently of one another are an organic radical having 1 to 20 C atoms, R2, R4, and R5 independently of one another are an H atom or an organic radical having 1 to 20 C atoms, it also being possible for R4 and R5 together to form an aliphatic or aromatic ring, and X is a thiocyanate anion as latent catalysts for curing compositions comprising epoxy compounds.

Abstract: The invention provides an active energy ray curable liquid composition containing a compound having a bonding group represented by a general formula (I), and a liquid cartridge. ([A] in the formula (I) is a cyclic group represented by a general formula (II), [Y] in the formula (II) is a cyclic linking group having a carbonyl group and a site containing an unsaturated carbon bond adjacent to the carbonyl group, and E in the formula (I) is a bonding group having at least one amide bond and at least one of divalent organic groups which may be substituted.

Abstract: A polymer of Formula (I) wherein R1, R2, Ar1, Ar2, and n are as described herein. The polymer may be used in a semiconducting layer of an electronic device.

Abstract: The present invention is directed to a method for preparing a cyclic guanidine comprising reacting (i) a guanidinium, (ii) a polyamine, and (iii) a weak acid. The present invention is also directed to a coating composition comprising the cyclic guanidine.

Abstract: A latent epoxy resin curing agent is provided which exhibits excellent solvent resistance and low-temperature fast-curing ability, and contains an imidazole-based compound as a main component. In the latent epoxy resin curing agent containing the imidazole-based compound as a main component, adduct particles formed through adduct reaction of an epoxy-based compound with the particulate imidazole-based compound are coated with an ethyl cellulose film. Furthermore, the surfaces of the adduct particles may be crosslinked with a polyfunctional isocyanate compound. A mixture of the epoxy-based compound, the particulate imidazole-based compound, and ethyl cellulose in a predetermined saturated hydrocarbon-based solvent is heated under stirring. Then, the epoxy-based compound and the particulate imidazole-based compound are subjected to adduct reaction to give a slurry of the adduct. After the slurry is cooled, the latent epoxy resin curing agent is filtrated.

Abstract: A modified bismaleimide resin of Formula (I) or (II) is provided. In Formula (I) or (II), Q is —CH2—, —C(CH3)2—, —O—, —S—, —SO2— or null, R is —(CH2)2—, —(CH2)6—, —(CH2)8—, —(CH2)12—, —CH2—C(CH3)2—CH2—CH(CH3)—CH2—CH2—, 10<n<500, and x+y=n. The invention also provides a method for preparing a modified bismaleimide resin and a composition including the modified bismaleimide resin.

Abstract: A polymer has a structure represented by: wherein each R is independently selected from hydrogen, an optionally substituted hydrocarbon, and a hetero-containing group, each M is conjugated moiety selected from: and substituted derivatives and combinations thereof, a represents a number that is at least 1; b represents a number from 1 to 20; n represents a number from 2 to 500 a represents a number that is at least 1, b represents a number from 0 to 20, n represents a number from 2 to 5000, each X is independently selected from S, Se, 0, and NR?, where each R? is independently selected from hydrogen, an optionally substituted hydrocarbon, and a hetero-containing group, each Z is independently one of an optionally substituted hydrocarbon, a hetero-containing group, and a halogen, d represents a number which is at least 1, and e represents a number from zero to 2.

Abstract: A thin film transistor device includes a semiconductor layer. The semiconductor layer includes a compound comprising a chemical structure represented by: wherein each R is independently selected from hydrogen, an optionally substituted hydrocarbon, and a hetero-containing group, each Ar is independently selected from optionally substituted aryl and heteroaryl groups, each M is an optional, conjugated moiety, a represents a number that is at least 1, b represents a number from 0 to 20, and n represents a number that is at least 1.

Abstract: Acyl-ethyleneurea terminated compounds based on the reaction of ethyleneurea with dibasic acids or methyl esters of dibasic acids or cyclic anhydrides are useful as modifying agents, cure accelerators and blocking agents with tertiary amine catalysts for epoxy resins. As epoxy modifiers, they react with epoxy resins at 120 degrees C. without a catalyst to produce modified epoxies having increased viscosity and increased reactivity and solvent power. When combined with a suitable tertiary amine catalyst, they are useful as cure accelerators at a low cure temperature of about 80 degrees C. When combined with a tertiary amine, they form complexes which provide superior latency of the epoxy-hardener mixture at 20 degrees C. Heat-curable epoxy-based compositions treated with the materials of the invention and processes whereby the various novel compositions of the invention are made, are also described.

Abstract: An epoxy resin composition comprises (a) an epoxy resin, (b) an anionic polymerization initiator and (c) from 1 to 30 parts by weight per 100 parts by weight of epoxy resin (a) of an aromatic ring-containing proton donor of a polyhydric alcohol and/or a polymercaptan.

Abstract: An epoxy resin composition comprises (a) an epoxy resin, (b) an anionic polymerization initiator and (c) from 1 to 30 parts by weight per 100 parts by weight of epoxy resin (a) of an aromatic ring-containing proton donor of a polyhydric alcohol and/or a polymercaptan.

Abstract: A curing agent for epoxy agent having N-phenyl-p-phenylenediamine(4-aminodiphenylamine). An epoxy resin combination having a main agent and a curing agent. The main agent has an epoxy resin. The curing agent has a N-phenyl-p-phenylenediamine(4-aminodiphenylamine).

Abstract: The present invention provides a cyclic olefin addition copolymer which has a reactive silyl group having a specific structure, excels in optical transparency, heat resistance, and adhesion, and is capable of producing a crosslinked product having improved dimensional stability, solvent resistance, and chemical resistance. The present invention also provides a process for producing the cyclic olefin addition copolymer, a crosslinking composition, a crosslinked product and a process for producing the same, and an optically transparent material (transparent resin film) comprising the cyclic olefin addition copolymer. The optically transparent material excels in optical transparency and heat resistance, exhibits improved dimensional stability, adhesion, solvent resistance, and chemical resistance, and is capable of improving fragility and preventing occurrence of cracks in the film.

Abstract: Hardeners are provided for curing epoxies at lower temperatures than currently available hardeners while retaining superior mechanical and thermal properties. A first component is selected from imidazole, dicyandiamide, or a mixture of polyamines and tertiary amines. A poiyol mixture is then selected. The first component is combined with the polyol mixture to form a hardener. The hardener is combined with epoxy resin and is cured. A method for selecting a hardener to yield an epoxy-hardener system with good properties after curing at a specified temperature and time includes selecting components for the hardener so the glass transition temperature of the cured epoxy-hardener system is not significantly lower than 45° C. above the cure temperature. The method includes steps for adjusting and controlling the ultimate glass transition temperature to maximize the mechanical properties of the epoxy-hardener system. The method regularly produces hardened epoxy systems having about 90% or more epoxy groups reactect.

Abstract: The present invention provides a cyclic olefin addition copolymer which has a reactive silyl group having a specific structure, excels in optical transparency, heat resistance, and adhesion, and is capable of producing a crosslinked product having improved dimensional stability, solvent resistance, and chemical resistance. The present invention also provides a process for producing the cyclic olefin addition copolymer, a crosslinking composition, a crosslinked product and a process for producing the same, and an optically transparent material (transparent resin film) comprising the cyclic olefin addition copolymer. The optically transparent material excels in optical transparency and heat resistance, exhibits improved dimensional stability, adhesion, solvent resistance, and chemical resistance, and is capable of improving fragility and preventing occurrence of cracks in the film.

Abstract: A halogen-free, phosphorus-free poly-cyclic compound is used a flame retardant. This compound has amide and hydroxy groups, and thus it is able to react with an epoxy resin to form a reactive type flame-retardant advanced epoxy resin. The advanced epoxy resin together with an inorganic additive are mixed with an epoxy resin to form a halogen-free, phosphorus-free flame-retardant epoxy composition, which can be used in the manufacture of a printed circuit board and as an encapsulation material for a semi-conductor device.

Abstract: A resin composition comprising the associated product of a polyimide resin having acid anhydride groups in the skeleton with an epoxy resin-curing catalyst, an epoxy resin, and optionally, an epoxy resin-curing agent has excellent adhesion, heat resistance, shelf stability and solvent resistance. An adhesive film comprising the resin composition is useful as an adhesive or sealant for printed circuit boards and semiconductor packages.

Abstract: A moisture-curable epoxy resin composition comprises a polyepoxide and a 2-alkyl-3-methyl or ethyl-oxazolidine wherein the 2-alkyl group the alkyl group is attached to the oxazolidine ring via a secondary or tertiary carbon atom.

Abstract: The present invention has an object to provide curatives for epoxy resins and curing accelerators for epoxy resins, which both have improved subliming and decomposing properties and which, when mixed with an epoxy resin, enable the mixture to be greatly improved in thermal stability that is extremely important for the control of a curing reaction and to have a prolonged pot life (stability as a one-pack mixture comprising the epoxy resin, curative, etc.) and improved curability at low temperatures.

Abstract: Adhesion promoting compounds or resins containing a thiazole functionality (including benzothiazole) and a polymerizable functionality (Z) give improved adhesive strength to metal substrates. A representative structure is the following, in which R1 and R2 together can form a cyclic or aromatic structure, or are linear or branched organic moieties.

Abstract: A primer for flame sprayed polyolefin comprises an epoxy resin, preferably of low molecular weight and/or low viscosity; and an amine hardener, part of which becomes highly reactive on exposure to open flame, providing near instant cure of the composition under flame spray conditions. The invention is unique that it provides strong adhesion to steel, even where the surface preparation is less than ideal, as well as to concrete and other substrates. The primer eliminates the need to preheat the substrate. The primer has strong adhesion to the topcoat polyolefinic material, especially to a functionalized topcoat. The composition withstands open flame and does not char under polyolefin flame spray conditions, nor does it run or sag, and it is not prone to failure as it cools after the application of the polyolefin.

Abstract: A solventless non-filler underfill material for COF mounting comprising an organic material, which is used to fill the gap between an FPC having a polyimide film substrate and a copper circuit layer having a thickness of 9 &mgr;m or smaller and an IC chip mounted on the FPC, exhibits such adhesion as to destroy a silicon wafer in a polyimide film/silicon wafer adhesion test, and provides a cured film having a tensile modulus of 150 kg/mm2 or less.

Abstract: A coating, sealant or adhesive composition curable at ambient temperatures of 40° C. or below comprises an epoxy resin and an amine-functional curing agent. The curing agent comprises a material containing at least two, and preferably at least three, heterocyclic secondary amine group.