Abstract: A curable underfill composition comprising an epoxy containing a curing agent component and a latent accelerator component. The accelerator component comprises a material which produces a resin with an exotherm below 300 J/g. Further, the combination may be utilized in an unfilled state which allows the epoxy to remain very viscous and thus increases the speed of the underfill process in comparison to filled epoxy compositions and epoxy compositions containing different accelerator components.

Abstract: A one part, several-months-useful-shelf-life epoxy material suitable for potting and sealing electronic components, and which is compatible with the high, approximately 255° C. to 275° C. temperatures required for soldering modem lead-free solders comprises an intimate mixture of the following components: approximately 2 to 13 per cent by weight of diglycidyl ether bisphenol A resin; approximately 40 to 70% phenol formaldehyde resin and the following further components [(2-methylphenoxy)methyl]-oxirane or o-cresol glycidyl ether) 0.5-8% by weight; polypropyleneglycol-glycidyl ether resin (plasticizer) 2-10% by weight; cycloaliphatic polyamine (catalyst) 4-15% by weight; kaolin clay (filler) 2-20% by weight; magnesium alumino silicate (filler) 2-15% by weight; Sb2O3 (filler) 4-5% by weight, and hydrated Al2O3 (filler) 0-15% by weight.

Abstract: Nitrogen compounds represented by formula (XXIa) or (XXIb); an epoxy resin hardening accelerator and a resin composition each containing any of the compounds; and an electronic part device containing an element encapsulated with the composition. In the formulae, R1 and R2 each represents hydrogen or a C1-20 monovalent organic group; R3 and R4 each represents a C1-20 divalnt organic group; R5 represents hydrogen or a C1-6 monovalent organic group; k is an integer of 0 to 2; and p is 0 or 1.

Abstract: Curable mixtures suitable for the manufacture of moldings, coatings and foams comprises a) an epoxy resin having more than one 1,2-epoxy group per molecule, b) as curing catalyst, an imidazole compound of formula I wherein R1, R2 and R3 are each independently of the others a hydrogen atom, a halogen atom, alkyl having from 1 to 20 carbon atoms, alkoxy having from 1 to 20 carbon atoms, unsubstituted or halo-, nitro-, C1-4alkyl- or C1-4alkoxy-substituted aralkyl having from 7 to 20 carbon atoms, or unsubstituted or halo-, nitro-, C1-4alkyl- or C1-4alkoxy-substituted aryl having from 6 to 20 carbon atoms, and R4 is alkyl having from 1 to 20 carbon atoms, alkenyl having from 2 to 20 carbon atoms, alkynyl having from 2 to 20 carbon atoms, unsubstituted or halo-, nitro-, C1-4alkyl- or C1-4alkoxy-substituted aralkyl having from 7 to 20 carbon atoms or unsubstituted or halo-, nitro-, C1-4alkyl- or C1-4alkoxy-substituted aryl having from 6 to 20 carbon atoms; and c) curing agent such as dicyadiami

Abstract: A curing agent for epoxy resin which comprises at least one selected from the compound of the formula (1) and its salt, as an effective component wherein X is —(CH2)n- or —(CH2)1-Y—(CH2)m- , Y is —N(R1)—, —O— or —S—, R1 is alkyl having 1 to 8 carbon atoms or amino. n is a number of 2, 3, 5 to 11, 1 and m are each a number of 1 to 8.

Abstract: The present invention provides an aqueous solution of an epoxy resin and a solid thereof, which is obtained by the following manner that an epoxy compound or a solution of the epoxy compound in organic solvent, and an amine compound of the formula (1), an aqueous solution thereof, a solution of the amine compound in organic solvent, or a solution thereof in a mixture of water and organic solvent, are mixed together so that the epoxy compound and the amine compound are reacted or polymerized to obtain a solution of an epoxy resin, to which water is added and heated to remove the organic solvent and unreacted amine compound, and a process for preparing the same NH2N(R1)(R2)  (1) wherein R1 and R2 are the same or different and each is alkyl having 1 to 6 carbon atoms, alkylene having 2 to 11 carbon atoms or a group represented by —R3—N(R4)—R5— which are formed when both are bonded, R3 and R5 are the same or different and each is alkylene having 1 to 6 carbon atoms, and R4 is a

Abstract: A thermoplastic or thermosetting adhesive for bonding an electronic component to a substrate in which the adhesive is cured in situ from a curable composition comprises one or more poly- or mono-functional maleimide compounds, or one or more poly- or mono-functional vinyl compounds other than maleimide compounds, or a combination of maleimide and vinyl compounds, a curing initiator and optionally, one or more fillers.

Abstract: A thermoplastic or thermosetting adhesive for bonding an electronic component to a substrate in which the adhesive is cured in situ from a curable composition comprises one or more poly- or mono-functional maleimide compounds, or one or more poly- or mono-functional vinyl compounds other than maleimide compounds, or a combination of maleimide and vinyl compounds, a curing initiator and optionally, one or more fillers.

Abstract: A thermoplastic or thermosetting curable adhesive composition for bonding an electronic component to a substrate in which the adhesive is cured in situ comprises one or more poly- or mono-functional maleimide compounds, or one or more poly- or mono-functional vinyl compounds other than maleimide compounds, or a combination of maleimide and vinyl compounds, a curing initiator and optionally, one or more fillers.

Abstract: Curable mixtures comprising

Abstract: An epoxy resin composition comprising an epoxy resin containing 0-10% by weight of a 2-nucleus compound and 50-100% by weight of 3 to 5-nucleus compounds combined and having a dispersity (Mw/Mn) of 1.0-1.7, an inorganic filler, a curing catalyst, and optionally a phenolic resin, and having a Tg of lower than 15° C. in an uncured state is effective in forming a flexible film which is easy to work at room temperature. A laminate film includes a layer of the epoxy resin composition and a protective layer. By sealing a semiconductor chip with the film, there is obtained a semiconductor package having improved heat resistance, improved moisture resistance, low stress property.

Abstract: Curable mixtures comprising a) an epoxy resin having more than one 1,2-epoxy group per molecule and b) as curing catalyst, an imidazole compound of formula I wherein R1, R2 and R3 are each independently of the others a hydrogen atom, a halogen atom, alkyl having from 1 to 20 carbon atoms, alkoxy having from 1 to 20 carbon atoms, unsubstituted or halo-, nitro-, C1-4alkyl- or C1-4alkoxy-substituted aralkyl having from 7 to 20 carbon atoms, or unsubstituted or halo-, nitro-, C1-4alkyl- or C1-4alkoxy-substituted aryl having from 6 to 20 carbon atoms, and R4 is alkyl having from 1 to 20 carbon atoms, alkenyl having from 2 to 20 carbon atoms, alkynyl having from 2 to 20 carbon atoms, unsubstituted or halo-, nitro-, C1-4alkyl- or C1-4alkoxy-substituted aralkyl having from 7 to 20 carbon atoms or unsubstituted or halo-, nitro-, C1-4alkyl- or C1-4alkoxy-substituted aryl having from 6 to 20 carbon atoms, are suitable for the manufacture of moulding compounds and coatings, especially for the manufac

Abstract: A fluorine-containing curable composition comprises (A) a linear perfluoro compound having at least two secondary amino groups per molecule and a divalent perfluoroalkylene or divalent perfluoropolyether structure in the main chain, and (B) a crosslinkable fluorinated compound having at least three functional groups which are crosslinkable with the secondary amino groups of (A). This composition readily cures, with standing at room temperature or heating only, to a cured product having excellent solvent and chemical resistance.

Abstract: Reactive diluents comprise the amide and/or imidazoline reaction products of low molecular weight carboxylic acids, such as acetic acid, and polyalkyleneamines, such as 2-aminoethylpiperazine (AEP) and triethylenetetramine (TETA). The reactive diluents are prepared by condensation reaction of the carboxylic acid and the polyalkyleneamine at elevated temperature generating a mixture of unreacted polyalkyleneamine, amides and/or imidazolines. The reactive diluent reaction products are used to reduce the viscosity of high viscosity polyamidoamines prepared from fatty dimer acids and polyethyleneamines. Also disclosed is an epoxy composition comprising the epoxy curative composition of a polyamidoamine curing agent reduced in viscosity by the addition of the reactive diluent reaction product and an epoxy resin, such as the diglycidyl ether of bisphenol A.

Abstract: A formulation which contains:(1) the nucleophilic addition adduct of an imidazole and an unsaturated compound, which contains more than one imidazole moiety per molecule; and(2) an epoxy resin,is characterized in that fewer than 50 equivalent percent of the imidazole moieties in the adduct are neutralized with acid. The adduct may serve as a curing catalyst in high or low-temperature curing. The formulation is made and applied as a powder coating for coatings or as a matrix resin in laminates. It may be used in solvent-borne or liquid systems.

Abstract: An epoxy curing agent comprising a heterocycle-containing compound having a backbone chain selected from the group consisting of polyether, polyvinyl, polyester, polyamide, polycarbonate, and novolac chains and at least two heterocyclic groups of the following general formula (1) as side chains, and a one-component (type) epoxy resin composition comprising said epoxy curing agent and a polyepoxy compound, ##STR1## wherein R.sub.1 and R.sup.2 may be the same or different and each represents hydrogen, straight-chain or branched C.sub.1 to C.sub.6 alkyl or alkenyl, or C.sub.6 to C.sub.8 aryl; or R.sub.1 and R.sup.2, taken together with the adjacent carbon atom, represents C.sub.5 to C.sub.7 cycloalkyl; R.sup.3 represents C.sub.1 to C.sub.10 alkylene. The object is to provide the one-component (type) epoxy resin composition having fast-curing feature, an improved storage stability, and an improved degree of workability.

Abstract: A resin composition, for use as a die attach adhesive, heat sink attach adhesive, encapsulant or underfill, comprises a resin system, including a mixture of an epoxy resin and a cyanate ester resin, and a polyamide catalyst. The composition is curable in one minute at 200.degree. C. and has a pot life of at least 18 hours at room temperature. The resin composition is flexible, develops high adhesion, high moisture resistance, low weight loss during curing and requires no solvents.

Abstract: A two-component system for producing two or more different curable mixtures in which the first component A is common to each mixture and comprises:1. a liquid epoxy2. an acid anhydride hardener and3. at least one fillerand the second component B is selected from two or more different components B, each of which comprises:1. an accelerator, and optionally2. a colourant, and optionally3. a non-volatile solvent/extender for the accelerator4. a flexibiliser for the epoxy-anhydride cure5. a acid anhydride hardener.

Abstract: The invention relates to a process for the preparation of pigment paste resins for cathodically depositable coating compositions, wherein diepoxide compounds which contain polyoxyalkylene structures and alkyl and/or alkylene and/or hydroxyalkyl radicals having more than 3 carbon atoms are first reacted to form epoxy resin/amine adducts and final products with oxazolidine structures are obtained by a partial or complete reaction of secondary amino groups with formaldehyde.

Abstract: An epoxy curing agent comprising a heterocycle-containing compound having a backbone clain selected from the group consisting of polyether, polyvinyl, polyester, polyamide, polycarbonate, and novolac chains and at least two heterocyclic groups of the following general formula (1) as side chains, and a one-component (type) epoxy resin composition comprising said epoxy curing agent and a polyepoxy compound, ##STR1## wherein R.sup.1 and R.sup.2 may be the same or different and each represents hydrogen, straight-chain or branched C.sub.1 to C.sub.6 alkyl or alkenyl, or C.sub.6 to C.sub.8 aryl; or R.sup.1 and R.sup.2, taken together with the adjacent carbon atom, represents C.sub.5 to C.sub.7 cycloalkyl; R.sup.3 represents C.sub.1 to C.sub.10 alkylene. The object is to provide the one-component (type) epoxy resin composition having fast-curing feature, an improved storage stability, and an improved degree of workability.

Abstract: Polymers (A) containing oxazine groups are prepared by reacting a polymer (T) containing nitrile groups with a monoaminoalcohol in the presence of a catalyst by a process in which the polymer T is reacted in the melt with the monoaminoalcohol in the presence of the catalyst and in the absence of a solvent.

Abstract: A epoxy resin composition comprising (A) an epoxy resin bearing at least one monovalent hydrocarbon group on a benzene ring, (B) a phenolic resin, (C) an inorganic filler, and (D) 2-phenyl-4,5-dihydroxymethylimidazole as a curing accelerator has a low melt viscosity, a long gel time and a high curing rate, and provides cured products having improved properties. Semiconductor devices encapsulated with cured products of the inventive composition are reliable.

Abstract: A compound containing cyclic amidine groups and uretdione groups, having the formula: ##STR1## wherein X is O or NR.sup.2, R is the hydrocarbon radical of isophorone diisocyanate: ##STR2## R.sup.1 is a substituted (cyclo)alkylene radical which is substituted with O-3 CH.sub.3 groups and has 2-14 carbon atoms @R.sup.2 and R.sup.

Abstract: A method for the preparation of a diaminobisimide compound of the formula (I) substantially free of oligomers: ##STR1## wherein Ar.sup.1 is an optionally substituted aromatic residue which provides for good conjugation between the nitrogen containing groups; andAr is an optionally substituted aromatic residue characterized in that at least two molar proportions of an aromatic diamine of the formula (II)H.sub.2 N--Ar.sup.1 --NH.sub.2 (II)wherein Ar.sup.1 is as defined above,are heated with one molar proportion of an aromatic tetracarboxylic acid of the formula (III) or the corresponding dianhydride,(HOOC).sub.2 Ar(COOH).sub.2 (III)wherein Ar is as defined above,optionally in the presence of a polar solvent and optionally including 0.1 to 2 molar proportions of a tertiary amine.The compounds of formula (I) are useful curing agents in epoxy resin formulations.

Abstract: A cross-linked pipelining network polymer composition for the in situ rehabilitation of pipes is formed. The polymer composition comprises at least one liquid epoxy resin and an effective amount of a liquid curing agent blend comprising an aliphatic polyamine, an aliphatic imidazoline, and an aliphatic amidoamine. The polymer composition may further comprise a pigment, a diluent and/or a viscosity controlling agent.

Abstract: This invention relates to flexible epoxy resins characterized by a low ionic contamination, total chlorine content less than 0.1%. The epoxy resins are liquids at room temperature, have Tg values when cured of less than or equal to 150.degree. C., have neat resin viscosities of 25,000 cps or less at 25.degree. C., and have a structural composition comprising an oligomeric backbone of alkylene repeat units, terminated with an aromatic moiety bearing one or more epoxy functionalities. The flexible epoxy resins are used in adhesives for microelectronic applications.

Abstract: Liquid reactive thermosetting compositions comprising:A) At least one polyepoxide or a mixture of one or more polyepoxides with at least one monoepoxide, of an aliphatic, cycloaliphatic or mixed nature;B) at least one anhydride of a di- or polycarboxylic acid of an aliphatic, cycloaliphatic or mixed nature;C) at least one catalyst capable of promoting the rapid polymerization of the mixture A+B under microwave irradiation and having general formula (I):N.tbd.C--CH.sub.2 --CH(Z)--(O).sub.r --Y.sup.+ NR.sub.1 R.sub.2 R.sub.3 X.sup.-.

Abstract: Disclosed is a thermosetting resin composition comprising cyanate resin, a compound containing at least one or more than one of a phenolic hydroxyl radical and an epoxy resin, wherein said resin has excellent adhesive and heat resistant properties while at the same time possessing a low hardening contraction rate and contributing to higher dimensional stability, and method of making the same.

Abstract: A curing agent for a composition useful for the production of matt epoxy resin and hybrid powder coatings, comprising a mixture ofa) salts of phthalic acid, isophthalic acid and terephthalic acid with the following amines ##STR1## in which R.sub.1, R.sub.2 and R.sub.3 are identical or different aliphatic, cycloaliphatic, araliphatic or aromatic hydrocarbon radicals having 1-20 carbon atoms and in which one or more CH.sub.2 groups in the carbon chain may be replaced by 0 atoms, by NR.sub.4 groups where R.sub.4 =C.sub.1-6 -alkyl, CH--OH groups, and/or one or more terminal methyl groups may be replaced by dialkyl-substituted amino groups having 1 to 6 carbon atoms, and R.sub.1 and R.sub.2 may form a joint ring in which one CH.sub.2 group may be replaced by an O atom or by an NR.sub.4 group, and R.sub.1 =R.sub.2 =R.sub.3 --CH.sub.2 --CH.sub.2 -- attached via a common nitrogen atom, and n=3-11, and 0.5-2 mol of amine A)-C) per mole of acid, andb) pyromellitic acid and/or trimellitic acid, 0.

Abstract: The improved coating of the present invention provides a protective coating for pipe, tubular shapes, other metal members, and metal structures. The protective coating comprises a polymer concrete, which is preferably a mixture of an organic resin, a filler material and a chemical activator. The organic resin is preferably a mixture of thermosetting polymer resins, such as bisphenol A based epoxy, bisphenol A based epoxy blended with polyglycol di-epoxide, and polyglycol di-epoxide. The filler material may be calcium carbonate, silica flour, zeosphere, talc, or kaolin, and preferably is of up to 200 mesh in size. The chemical activator preferably is an amine, such as aminoethylpiperazine or tetraethylene pentamine.

Abstract: The improved coating of the present invention provides a protective coating for pipe, tubular shapes, other metal members, and metal structures. The protective coating comprises a polymer concrete, which is preferably a mixture of an organic resin, a filler material and a chemical activator. The organic resin is preferably a mixture of thermosetting polymer resins, such as bisphenol A based epoxy, bisphenol A based epoxy blended with polyglycol di-epoxide, and polyglycol di-epoxide. The filler material may be calcium carbonate, silica flour, zeosphere, talc, or kaolin, and preferably is of up to 200 mesh in size. The chemical activator preferably is an amine, such as aminoethylpiperazine or tetraethylene pentamine.

Abstract: The improved coating of the present invention provides a protective coating for pipe, tubular shapes, other metal members, and metal structures. The protective coating comprises a polymer concrete, which is preferably a mixture of an organic resin, a filler material and a chemical activator. The organic resin is preferably a mixture of thermosetting polymer resins, such as bisphenol A based epoxy, bisphenol A based epoxy blended with polyglycol di-epoxide, and polyglycol di-epoxide. The filler material may be calcium carbonate, silica flour, zeosphere, talc, or kaolin, and preferably is of up to 200 mesh in size. The chemical activator preferably is an amine, such as aminoethylpiperazine or tetraethylene pentamine.

Abstract: Novel aminoplast anchored UV stabilizers are provided. Compared to unanchored stabilizers, the anchored stabilizers disclosed herein have increased compatibility with coating resins and have reduced volatility due to higher molecular weights resulting from anchoring. A process for preparing the anchored stabilizers by the reaction of unanchored stabilizers with alkoxymethylated aminoplasts in a sulfuric acid medium is also provided. The unanchored stabilizers include 2-(2-hydroxyaryl)benzotriazoles, 2-hydroxybenzophenones, 2-(2-hydroxyaryl)-4,6-diaryl-1,3,5-triazines, salicylic acid derivatives, 2-hydroxyoxanilides, and blocked derivatives thereof as well as mixtures of two or more stabilizers. The aminoplasts include alkoxymethylated derivatives of glycolurils, melamines, and benzoguanamines.

Abstract: A curing agent for epoxy resins is prepared from an amine and an epoxy, as well as subsequent modification by a polyisocyanate compound, in such a manner that the curing agent is in the form of small spherical particles. The particles can be as small as 0.1 microns. This curing agent can be easily dispersed in curing agent masterbatches and curable compositions with minimal effect on their storage stability. The resulting curable compositions have a wide range of applications, including automobile and electronic adhesives.

Abstract: A curing agent for epoxy resins is prepared from an amine and an epoxy, as well as subsequent modification by a polyisocyanate compound, in such a manner that the curing agent is in the form of small spherical particles. The particles can be as small as 0.1 microns. This curing agent can be easily dispersed in curing agent masterbatches and curable compositions with minimal effect on their storage stability. The resulting curable compositions have a wide range of applications, including automobile and electronic adhesives.

Abstract: A curing agent for epoxy resins is prepared from an amine and an epoxy, as well as subsequent modification by a polyisocyanate compound, in such a manner that the curing agent is in the form of small spherical particles. The particles can be as small as 0.1 microns. This curing agent can be easily dispersed in curing agent masterbatches and curable compositions with minimal effect on their storage stability. The resulting curable compositions have a wide range of applications, including automobile and electronic adhesives.

Abstract: Hardenable or polymerizable epoxy resin-based composition, characterized in that its hardener system comprises a combination in synergic quantities of:(i) at least one imidazole which, alone, can cause the polymerization of the epoxy resin only at a temperature above about 75.degree. C.,(ii) at least one polyamine compound which, alone, leads to the polymerization of the epoxy resin at a temperature lower than about 75.degree. C. Such a resin is particularly suitable for the manufacture of composite structures, applicable in particular in ship- or boatbuilding.

Abstract: The invention relates to new salts of pyromellitic acid, to a process for their preparation and to their use for the production of matt epoxide and hybrid powder coatings.

Abstract: A curing agent for epoxy resins is prepared from an amine and an epoxy, as well as subsequent modification by a polyisocyanate compound, in such a manner that the curing agent is in the form of small spherical particles. The particles can be as small as 0.1 microns. This curing agent can be easily dispersed in curing agent masterbatches and curable compositions with minimal effect on their storage stability. The resulting curable compositions have a wide range of applications, including automobile and electronic adhesives.

Abstract: Low viscosity, solventless, thermosetting resin compositions of bismaleimide resin composition and epoxy resins have unique heat stability and special utility as insulation for electric conductors to be used in the 200.degree.-250.degree. C. temperature range.

Abstract: The improved coating of the present invention provides a protective coating for pipe, tubular shapes, other metal members, and metal structures. The protective coating comprises a polymer concrete, which is preferably a mixture of an organic resin, a filler material and a chemical activator. The organic resin is preferably a mixture of thermosetting polymer resins, such as bisphenol A based epoxy, bisphenol A based epoxy blended with polyglycol di-epoxide, and polyglycol di-epoxide. The filler material may be calcium carbonate, silica flour, zeosphere, talc, or kaolin, and preferably is of up to 200 mesh in size. The chemical activator preferably is an amine, such as aminoethylpiperazine or tetraethylene pentamine.

Abstract: Polyglycidyl epoxy resins are modified to have a blocked isocyanate moiety bound to the resin backbone through an oxazolidone ring by reacting the epoxy resin with an asymmetrically blocked diisocyanate. Further reaction with a cationic active hydrogen compound gives a modified epoxy resin having a cationic group in addition to the blocked isocyanate moieties. The modified epoxy resins are incorporated into cathodic electrodeposition paint as a crosslinker or cationic binder resin or pigment dispersing agent.

Abstract: The present invention discloses oriented optical epoxy compositions comprising a reaction product of arylhydrazones with a monomer copolymerizable therewith and to oriented crosslinked polymeric composition comprising the reaction product of an epoxy arylhydrazone or the epoxy composition of the invention with a curing agent. The present invention also discloses processes for making the said compositions.

Abstract: Novel polycyanate and polycyanamide compositions containing one or more rodlike mesogenic moieties, when cured, result in products having improved properties.

Abstract: Novel polycyanate and polycyanamide compositions containing one or more rodlike mesogenic moieties, when cured, result in products having improved properties.

Abstract: Adducts containing terminating nitro (nitroso) groups and one or more mesogenic moieties are prepared by reacting (A) at least one compound containing an average of more than one vicinal epoxide group per molecule with (B) at least one compound containing one or more nitro (nitroso) groups and an average of one reactive hydrogen atom per molecule; with the proviso that at least one member of components (A) and (B) contains a mesogenic moiety. Reduction of these adducts provides amines which are useful as curing agents for epoxy resins.

Abstract: Curable compositions based on epoxy resins or a mixture of epoxy resins and polyisocyanates and containing at least one compound of formula I: ##STR1## wherein R.sub.1, R.sub.2, R.sub.3, R.sub.4, R.sub.5, R.sub.6, R.sub.7, R.sub.8 and R.sub.9 are each independently of one another hydrogen, alkyl, aryl, arylalkyl or halogen, and R.sub.2 together with R.sub.3 and R.sub.5 together with R.sub.6 and R.sub.8 together with R.sub.9 may each also represent a fused benzene ring.The compositions have high reactivity and at the same time good storage stability.

Abstract: Novel polycyanate compositions containing one or more mesogenic moieties as lateral substituents are disclosed which provide improved processability relative to polycyanates containing one or more mesogenic moieties in the main chain of the molecule. Molecular level ordering of the resulting thermosets is maintained much similar to that found thermosets of polycyanates which have one or more mesogenic moieties in the main chain.

Abstract: A multilayer printed circuit board comprising a plurality of alternately laminated layers of insulating layers and circuit conductor layers having a signal transmission delay time of 6.0 ns/m or less, excellent in heat resistance, adhesive, fire retardance, etc. can be produced by forming insulating layers using a fluorine-containing thermosetting resin composition.

Abstract: A modified epoxy resin composition for use in making a printed circuit board comprising: (1) a modified epoxy resin obtained by reacting (a) a low molecular weight epoxy resin having at least two epoxy groups which .[.have.]. .Iadd.has .Iaddend.the following formula, ##STR1## (b) .[.a mono-nucleus chain tending agent containing N-heterocyclic fatty groups and.]. .Iadd.an N-heterocyclic fatty amino chain-extended agent .Iaddend.at least two active hydrogen atoms and represented by the formulas, and (c) at least one catalyst for catalyzing the reaction between components (a) and (b).