Abstract: Polymer modified adducts are prepared by (A) reacting (1) an epoxy resin having an average of more than one vicinal epoxide group with (2) a compound containing an average of two or more hydrogen atoms reactive with an epoxide group; and (B) partially vinylizing reacting the product from step (A); and (C) polymerizing the partially vinylized product from step (B) with (3) a polymerizable ethylenically unsaturated monomer; with the proviso that at least one of the components (1), (2) or (3) contain one or more mesogenic or rodlike moieties. These adducts are useful as epoxy resin curing agents.

Abstract: A composition comprising a 1,2-dialkylidenecyclobutane such as 1,2-dimethylenecyclobutane, a polyimide such as a bismaleimide, an epoxy resin and a curing agent for the epoxy resin can be thermally cured to a tough polymer blend having a high glass transition temperature.

Abstract: A thermosetting resinous composition contains (a) a polyfunctional oxazolidinone compound and (b) a polyamine which react with one another a polyurea polymer upon heating without emitting any emanating by-product. A novel class of polyfunctional oxazolidinone compounds and an improved method for producing the same are also disclosed.

Abstract: Low viscosity, solventless, thermosetting resin compositions of bismaleimide resin composition and epoxy resins have unique heat stability and special utility as insulation for electric conductors to be used in the 200.degree.-250.degree. C. temperature range.

Abstract: An adduct of a glycidyl ester of an alpha,alpha-branched saturated monocarboxylic acid containing a total of 5 to 18 carbon atoms and 2-isopropylimidazole can be used to cure epoxy resin compositions useful in preparing prepregs for electrical laminates.

Abstract: A thermosetting epoxy resin powder coating composition comprising:(a) an epoxy resin having at least one 1,2-epoxy group per molecule and(b) a physical blend of isocyanuric acid and 2-phenylimidazoline.

Abstract: A resin composition comprising a polymeleimide compound having two or more maleimide groups in one molecule, a phenol novolac resin of which phenolic hydroxyl groups are epoxidized and allyl-etherified and, as an optional ingredient, a curing agent, or a resin composition comprising a polymaleimide compound having two or more maleimide groups in one molecule, a phenol novolac resin of which phenolic hydroxyl groups are allyl-etherified and an epoxy resin; and a heat resistant composite material comprising cured product of said resin composition as its matrix phase and containing a fiber as its reinforcing material.

Abstract: Compositions comprising epoxy resins containing one or more rodlike mesogenic moieties per molecule are cured with polyamines containing one or more rodlike mesogenic moieties per molecule. These curable compositions can be oriented by the application of an electric field or magnetic field or drawing and/or shear flow prior to and/or during curing. The resultant cured products exhibit an improvement in one or more physical and/or mechanical and/or thermal properties as compared to a like epoxy resin system which does not contain any rodlike mesogenic moieties.

Abstract: Phenoxy resins containing rodlike mesogenic moieties are prepared from phenolic hydroxyl containing compounds which contain such moieties.

Abstract: The present invention relates to compositions which are storage stable at room temperature and containA) at least one compound having at least two cyclic isourea groups per molecule andB) at least one compound having at least two carboxyl groups per molecule,in an amount sufficient to provide a molar ratio of isourea groups to carboxyl groups of 0.5:1 to 1.5:1.

Abstract: A thermosetting resin composition contains (A) an imide compound having a maleimide group, (B) an epoxy resin, (C) a phenolic resin, and optionally, (D) an aromatic polymer/organopolysiloxane copolymer. Component (B) and/or (C) includes a compound containing a naphthalene ring having an allyl group and preferably, a compound containing a naphthalene ring and a double bond conjugated with an aromatic ring. The composition is easily workable and cures to products having improved heat resistance, low thermal expansion, and low water absorption.

Abstract: The present invention relates to nonlinear optical materials comprising aminoaryl hydrazones and to nonlinear optical polymeric compositions containing recurring covalently bonded moieties derived from the aminoaryl hydrazones of the invention. The polymeric compositions of the present invention have high glass transition temperatures and exhibit stable nonlinear optical activity at high temperatures over a period of time.

Abstract: Novel cyclic imino ether compositions containing one or more mesogenic moieties, when polymerized, result in products having improved properties.

Abstract: A thermosetting resin composition useful for slot insulation purposes is disclosed, which includes:a liquid epoxy resin;a curing agent including an acid anhydride;a maleimide resin in an amount of 3-50 parts by weight per 100 parts by weight of the liquid epoxy resin; andfinely divided wollastonite in an amount of 50-400 parts by weight per 100 parts by weight of the liquid epoxy resin.

Abstract: The present invention is directed to a novel epoxy polymeric composition resulting from reacting (A) at least one compound containing an average of more than one epoxide group per molecule with (B) at least one curing agent for component (A). At least a portion of the curing agent (B) is at least a first curing agent compound which contains (a) an average of more than one active amine hydrogen atom per molecule and (b) an average of at least one aromatic ring which contains at least one pendant monovalent electron withdrawing group. The present invention also includes a process for preparing the above polymeric materials. The polymeric materials of the present invention also exhibit nonlinear optical capabilities when formed into an optically transparent medium with a noncentrosymmetric alignment of molecules. The nonlinear optical materials of the present invention are useful in electrooptic devices for use in communications and data-processing.

Abstract: Electrodepositable coating compositions comprising an active hydrogen-containing ionic resin and a curing agent which contains blocked isocyanate groups and oxazolidone groups are disclosed. These coating compositions reduce the tendency of cured electrodeposited films to cause yellowing in subsequently applied topcoat systems. The use of these electrodepositable coating compositions in the process of electrodeposition is also disclosed.

Abstract: Advanced epoxy resin compositions are prepared by reacting epoxy resins with active hydrogen-containing compounds which contain mesogenic moieties. Curable compositions containing these advanced epoxy resin compositions are useful in adhesives, coatings, laminates castings and the like.

Abstract: A heat resistant adhesive composition comprising an admixture of a modified bismaleimide (BMI) resin, a modified polyamide-imide and a solvent. The bismaleimide is modified by barbituric acid and/or the derivatives thereof and the polyamide-imide is modified by an epoxy resin. The overall solid content of the heat resistant adhesive composition is in the range of about 15 to 50 percent by weight, wherein solid contents per overall solid content of the modified bismaleimide resin and the modified polyamide-imide are 60 to 90 percent and 10 to 40 percent, respectively.

Abstract: Curable compositions are disclosed which contain (I) an advanced resin composition prepared by reacting epoxy resins with active hydrogen-containing compounds which contain mesogenic moieties and (II) a suitable curing agent.

Abstract: Compounds containing at least one cyanate group, at least one maleimide group and at least one rodlike mesogenic moiety are prepared by reacting one or more aminophenols containing one or more rodlike mesogenic moieties with a stoichiometric quantity of a maleic anhydride per amine group of said aminophenol and then cyanating the resulting phenolic functional maleimide.

Abstract: Compounds containing at least one cyanate group, at least one maleimide group and at least one rodlike mesogenic moiety are prepared by reacting one or more aminophenols containing one or more rodlike mesogenic moieties with a stoichiometric quantity of a maleic anhydride per amine group of said aminophenol and then cyanating the resulting phenolic functional maleimide.

Abstract: A hardening agent composition for epoxy resins and a method for forming the composition is disclosed, which comprises a low-reactive hardening agent, an imidazole compound and a zeolite, wherein the imidazole compound is substituted on the imidazole nucleus by at least one of (a) and (b): (a) an alkyl group having 2 or more carbon atoms and a polar group and (b) an alkenyl group. The hardening agent composition combined with an epoxy resin to form a thermosetting epoxy resin composition, capable of hardening under heat to give a hardened product, has a remarkably elevated adhesion strength.

Abstract: A thermosetting resinous composition contains (a) a polyfunctional oxazolidinone compound and (b) a polyamine which react with one another a polyurea polymer upon heating without emitting any emanating by-product. A novel class of polyfunctional oxazolidinone compounds and an improved method for producing the same are also disclosed.

Abstract: Compositions comprising epoxy resins containing one or more rodlike mesogenic moieties per molecule are cured with polyamines containing one or more rodlike mesogenic moieties per molecule. These curable compositions can be oriented by the application of an electric field or magnetic field or drawing and/or shear flow prior to and/or during curing. The resultant cured products exhibit an improvement in one or more physical and/or mechanical and/or thermal properties as compared to a like epoxy resin system which does not contain any rodlike mesogenic moieties.

Abstract: Thermally stable bisimido polymers, devoid of diamine component and well adapted for the production of laminates, are prepared by copolymerizing (a) an N,N'-bismaleimide with (b) an acrylate comonomer, e.g., a novolak epoxy (meth)acrylate, in the presence of a catalytically effective amount of (c) an imidazole compound, and, optionally, (d) a chlorinated or brominated epoxy resin, or admixture thereof with a non-chlorinated or non-brominated epoxy resin.

Abstract: There is disclosed a method for hardening a curable one-package epoxy resin system formed of an epoxy resin and a hardener, which comprises heating the curable one-package epoxy resin system to start the reaction between the epoxy resin and the hardener, and, before the reaction ratio reaches 50%, leaving the curable one-package epoxy resin system to stand at an ambient temperature.

Abstract: Latent, heat-curable epoxy resin compositions containing metal carboxylate curing systems provide exceptional latency, particularly at elevated temperature, as well as facile curing, high T.sub.g and adhesive strength, and other attractive properties. The metal carboxylates comprise alkali metals and alkaline earth metals, aromatic and aliphatic metal carboxylates. The preferred curing systems comprise synergistic combinations of the metal carboxylates with cure modifiers.

Abstract: A curing agent for the production of low gloss powder coatings based on epoxy resins consists essentially of a mixture of the components a) 2-imidazoline derivative having a melting point of >60.degree. C. and b) cyanuric acid as well as, if desired, anticaking agents or/and stabilizers. The low gloss powder coatings produced with these curing agents have the desired low degrees of gloss and good adhesive strengths, they form smooth and uniform surfaces and show no signs of yellowing even after long stoving times.

Abstract: An epoxy resin curative composition that provides cured epoxy resins exhibiting improved properties is disclosed. The curative composition comprises a mixture of 1-isopropyl-2-aryl imidazole and 1-isopropyl-2-aryl imidazoline.

Abstract: The invention relates to a process for manufacturing fiber-reinforced boards for the electrical industry by the use of epoxy resins and latent curing agents based on imidazole/acrylic acid reaction products based on the general formula ##STR1## wherein R, R.sup.1 and R.sup.2 are, independently of one another, H or a short-chain alkyl group having from 1 to 3 carbon atoms, R.sup.3 is a group of the formula--O--(CH.sub.2)m--R.sub.4 (II)wherein m is an integer between 2 and 6, R.sup.4 is H, --OH or --O--, and n is equal to the valence of R.sup.3.

Abstract: The invention relates to new compounds of the general formulas ##STR1## where R is a divalent, optionally branched aliphatic, cyclic or alicyclic hydrocarbon group having from 2 to 10 carbon atoms; R.sup.1 and R.sup.2 are, independently of one another, hydrogen, or aliphatic or aromatic hydrocarbon groups; R.sup.3 is --COOH, --CN, --COOC.sub.2 H.sub.4 --OH, --CONH--NH.sub.2 or --COOR.sup.4 ; R.sup.4 is an aliphatic hydrocarbon group having from 1 to 4 carbon atoms; and n is 2 or 3.

Abstract: The invention relates to new compounds of the general formula ##STR1## where R is a divalent, optionally branched aliphatic, cyclic or alicyclic hydrocarbon group having from 2 to 10 carbon atoms; R.sup.1 and R.sup.2 are, independently of one another, hydrogen, or aliphatic or aromatic hydrocarbon groups; R.sup.3 is --COOH, --CN, --COOC.sub.2 H.sub.4 --OH, --CONH--NH.sub.2 or --COOR.sup.4 ; R.sup.4 is an aliphatic hydrocarbon group having from 1 to 4 carbon atoms; and n is 2 or 3.

Abstract: Compounds containing at least one alkenyl group, at least one maleimide group and at least one rodlike mesogenic moiety are prepared by reacting one or more aminophenols containing one or more rodlike mesogenic moieties with a stoichiometric quantity of a maleic anhydride per amine group of said aminophenol and then alkenylating the resulting phenolic functional maleimide.

Abstract: The invention relates to new imidazolyl derivatives, their use as curing agents in epoxy-resin compositions, and curable epoxy-resin compositions containing them and composed of an epoxy resin and compounds of the general formula ##STR1## where R is the group of the alcohol component used to produce the glycidyl ethers, R.sup.1 and R.sup.2 are, independently of each other, hydrogen, --CH.sub.3 or --C.sub.2 H.sub.5, n is 2 or 3, R.sup.3 is COOH, --CH, --COHN--N.sub.H2, --COOCH.sub.2 --CH.sub.2 --OH or COOR.sup.4, R.sup.4 being an aliphatic hydrocarbon group having from 1 to 4 carbon atoms, and m is equal to the valence of R.

Abstract: Imidazoline compounds of formula ##STR1## where n denotes 2 or 3, is suitable as cure accelerator in curable epoxide resin compositions comprising a latent curing agent.

Abstract: A modified epoxy resin composition for use in making a printed circuit board comprising: (1) a modified epoxy resin obtained by reacting (a) a low molecular weight epoxy resin having at least two epoxy groups which has the following formula, ##STR1## (b) an N-heterocyclic fatty amino chain-extending agent at least two active hydrogen atoms and represented by the formulas, ##STR2## and (c) at least one catalyst for catalyzing the reaction between components (a) and (b).

Abstract: Novel mesogenic amine curing agent for reactive monomers, such as epoxy resins and diisocyanates, comprises a mesogenic moiety, a primary amine, and a flexible alkyl spacer connected between the mesogenic moiety and the primary amine and wherein the alkyl spacer is a saturated, linear alkyl group having from about one to about twenty carbon atoms. Novel mesogenic amine has the formula: ##STR1## where M is --O--, ##STR2## or --CH.sub.2 --, where R is --NO.sub.2 or --CN, andwhere x is 1 to 20.Novel mesogenic amine has a labile group subject to cross-linking and the formula: ##STR3## where K is ##STR4## where L is ##STR5## where M is --o--, ##STR6## or --CH.sub.2 --, where Z is cinnamate, an alkene having from one to ten carbons, an isocyanate, an alkoxy, or an alcohol having from one to ten carbons,where T is a cyano, a nitro or an alkyl group having from about one to ten carbons, andwhere X is 1 to 20.

Abstract: Solid, fusible bismaleimide resins formed from a mixture of a bismaleimide and an aminophenol still contain from 70 to 90 mol % of unconverted bismaleimide and from 30 to 60 mol % of unconverted aminophenol.

Abstract: The present invention describes the use of 1,3-dialkylimidazole-2-thiones as a catalyst for epoxy/anhydride reactions (and other reactions) and a method of making these catalysts. Epoxy/anhydride coatings containing these improved catalysts offer the following advantages: improved appearance (especially since even weeks after application the coatings still have a "wet" look); better pot-life; improved resistance to alkaline substances which will improve durability; improved solubility; and coatings which have a reduced volatile organic content (VOC).

Abstract: Disclosed is an epoxy resin curative exhibiting extended pot life, lower reactivity and lower viscosity at ambient temperatures and increased reactivity at moderately elevated temperatures which comprises from 1 to 10 parts by weight of the ortho, meta or para form of 1-isopropyl-2-tolylimidazole per 100 parts by weight epoxy resin. The latent reactive properties make the curative potentially useful in a variety of applications.

Abstract: A fiber reinforced resin matrix composite material repair system is provided, which critically employs a resin comprising a catalyst of the formula I: ##STR1## with a multifunctional epoxy resin, the resin system being sealed in a water-proofed environment prior to being coated onto a fiber reinforcement. The coated fiber reinforcement is applied over the damaged area, the damaged portion having been removed, and the surrounding surface smoothed. An adhesive is applied to the remaining surface, prior to application of the patch. The resulting patch, which may further include thermoplastic toughening agents and an enhancer, can be directly cured at temperatures below 212.degree. F. to give physical properties similar to the original material.

Abstract: A polymaleimide/epoxy blend is cured with cyanamide to provide interlocked one-phase networks with superior thermal properties.

Abstract: Compounds containing at least one cyanate group, at least one maleimide group and at least one mesogenic or rodlike moiety are prepared by reacting one or more aminophenols containing one or more mesogenic or rodlike moieties with a stoichimetric quantity of a maleic anhydride per amine group of said aminophenol and then cyanating the resulting phenolic functional maleimide.

Abstract: Novel thermosetting compositions, well adapted for the production, e.g., of molded and laminated shaped articles, are comprised of a copolymerizate of (a) at least one N,N'-bisimide, (b) at least one diprimary diamine, and (c) at least one epoxy resin.

Abstract: Epoxy resins are modified by reaction with an acidified polytertiary amine-containing compound. These modified epoxy resins when cured result in products having improved properties.

Abstract: Novel thermally stable imido polymers, whether in prepolymeric or cured state, well adapted for the production of prepregs and other useful shaped articles, include the copolymerizates of:(a) at least one maleic N,N'-bisimide;(b) at least one hindered diprimary diamine of the 4,4'-diamino-3,3',5,5'-tetraalkyldiphenylmethane or 1,3-or 1,4-diaminotrialkylbenzene type;(c) optionally, at least one comonomer other than a bisimide and containing one or more polymerizable carbon-carbon double bonds;(d) optionally, an imidazole compound; and(e) at least one chlorinated or brominated epoxy resin, N,N'-alkylenebistetrahalophthalimide and/or a compound containing two phenyl radicals bonded directly together via a single valence bond, a divalent radical or a bridging atom, in which each phenyl radical is substituted by a (meth)allyloxy radical and by at least two chlorine or bromine atoms.

Abstract: Novel thermostable imido copolymers, well adapted for the production of prepregs useful in the fabrication of multilayer circuits, are prepared by copolymerizing (a) at least one N,N'-bis-maleimide with (b) at least one sterically hindered diprimary diamine, (c) optionally, at least one ethylenically unsaturated non-halogenated comonomer other than a bis-imide (a), (d) optionally, a free radical polymerization initiator, (e) at least one comonomer including a chlorinated or brominated epoxy resin, an N,N'-alkylene-bis-tetrahalogenophthalimide, a compound containing two phenyl radicals directly joined va a single valence bond, a divalent radical or a bridging atom, wherein such compound each phenyl radical is substituted by a (meth)allyloxy radical and by at least two chlorine or bromine atoms, and/or a non-halogenated epoxy resin, and (f) at least one alkenylphenol.

Abstract: Two part epoxy resin system comprising a main component comprising a bisphenol type epoxy resin having not more than 0.08% by weight of a content of a saponifiable chlorine-containing group and a curing component comprising a modified aromatic polyamine and a liquid imidazole, which has a long pot-life at room temperature and is curable even at an intermediate temperature such as about 50.degree. to 60.degree. C., and is useful as a paint composition, an adhesive, a lining material, a molding material and a floor covering material.

Abstract: A non-elastomeric epoxy having a mol wt less than about 10,000 and curing agent therefor ("epoxy-curing-agent"), both of which (epoxy/epoxy-curing-agent) are liquid while at curing temperatures, provide a continuous liquid phase in which a polyimide (PI) generally, and a bisimide (BI) in particular, may be homogeneously dispersed to form a fluidized dispersion. In one embodiment, the less viscous epoxy/epoxy-curing-agent is the dispersive medium (continuous phase) and the PI the dispersed or discontinuous phase. In the more preferred embodiment, the epoxy/epoxy-curing-agent and PI are miscible, forming a single liquid phase in which the PI is homogeneously dispersed. In each embodiment, the epoxy is essentially unreactive with the PI. Upon curing the epoxy in a first stage, to form a polymeric epoxy matrix (also referred to as "cured epoxy resin" herein) at a temperature below 150.degree. C.

Abstract: A modified epoxy resin composition for use in making a printed circuit board comprising: (1) a modified epoxy resin obtained by reacting (a) a low molecular weight epoxy resin having at least two epoxy groups which have the following formula, ##STR1## (b) a mono-nucleus chain extending agent containing N-heterocyclic fatty groups and at least two active hydrogen atoms and represented by the formulas, ##STR2## and (c) at least one catalyst for catalyzing the reaction between components (a) and (b).