Abstract: This invention relates to the use of an isocyanate blocked imidazole or imidazoline compound as a catalyst for effecting cure of powdered epoxy resins. The isocyanate blocked imidazole or imidazoline imparts an extended pot life to a curable epoxy powder coating composition while effecting cure at substantially lower temperatures than normally would be required and with faster cure times.

Abstract: A catalyst for forming ambient temperature stable diamino-diphenyl sulfone-epoxy composition comprises the half-salt of a strong aromatic sulfonic acid such as toluene sulfonic acid and an imidazole, preferably an alkylated imidazole such as 2-ethyl-4-methylimidazole. The composition fully cures at moderate temperature to form a humidity resistant resin having a high heat distortion temperature and can be impregnated onto reinforcing fibers such as graphite to form composites.

Abstract: The invention is directed to resins which are the reaction product of an amino or mercapto substituted azole and a polyepoxide wherein the ratio of equivalents of the azole to the polyepoxide is from about 0.5:1.0 to about 1.5:1.0, preferably from about 0.9:1.0 to about 1.1:1.0. The resins can be acid or base solulized depending on whether amino or mercapto substituted azoles were used in their preparation. The invention is also directed to storage stable compositions which cure at relatively low temperatures in short periods of time comprising specified amounts of the resin containing azole-functionality, polyepoxides, organic solvents, and optionally pigments and additives.

Abstract: Novel thermosetting compositions, including a polyimide/N-vinylpyrrolidone prepolymer, optionally comprising an unsaturated polyester, and an epoxy resin, are well adapted for the molding of a variety of useful shaped articles.

Abstract: Resin-forming polyepoxides are mixed with polyoxazolidinyl compounds or polymers containing pendant oxazolidinyl groups in which the carbon atom in the 2-position of the heterocyclic ring is substituted with saturated hydrocarbon groups, such as dialkyl, or with an alkylene group forming a saturated ring with the carbon atom in the 2-position of the oxazolidinyl ring to form, in the absence of water, a stable composition which can be stored in closed containers for months without undergoing gelation. When such compositions are spread into films and the films exposed to moisture at ambient temperature, e.g., to ambient air having a relative humidity of at least 20% and temperature of about 15.degree. to 25.degree. C., the polymer serves to react with and cure the polyepoxide.

Abstract: A composition useful for making circuit boards which is the reaction product of(a) an epoxy resin or an epoxy novolac resin and optionally, a brominated epoxy resin and(b) a bismaleimide; wherein the product of (a) and (b) is subsequently reacted with a curing agent such as a diamine of the formula H.sub.2 N--R.sup.1 --NH.sub.2 where R.sup.1 is an aromatic, aliphatic or cycloaliphatic group;The composition is used to impregnate a fibrous substrate of fiberglass, high temperature polyamides or graphite fibers which is laminated to a copper sheet; the resulting laminate is used to form a circuit boards that have good electrical and physical properties.

Abstract: A composition useful for making circuit boards which is the reaction product of(a) an epoxy resin or an epoxy novolac resin and optionally, a brominated epoxy resin and(b) a bismaleimide;wherein the product of (a) and (b) is subsequently reacted with a curing agent such as a diamine of the formula H.sub.2 N--R.sup.1 --NH.sub.2 where R.sup.1 is an aromatic, aliphatic or cycloaliphatic group.The composition is used to impregnate a fibrous substrate of fiberglass, high temperature polyamides or graphite fibers which is laminated to a copper sheet; the resulting laminate is used to form circuit boards that have good electrical and physical properties.

Abstract: Heat-curable mixtures of one or more epoxide compounds, which, on average, have more than one epoxide group in the molecule, and one or more .beta.-aminocrotonic acid derivatives, such as .beta.-aminocrotononitrile, .beta.-aminocrotonamide or .beta.-aminocrotonic acid esters, and also, if desired, a polyamine or polycarboxylic acid anhydride or a maleimide. The novel curable mixtures are distinguished by outstanding stability on storage, can be processed easily and give moulded materials with good mechanical properties.

Abstract: Mixtures hardenable under the influence of air moisture are provided. They comprise at least one organic polyisocyanate or an polyepoxide and as a moisture activated hardener an N,N'-substituted imidazolidine derivative or an N,N'-substituted hexahydropyrimidine derivative, which show at no nitrogen atom a --CO--NH-- grouping and which are present in sufficient amount to provide for cross-linking. The mixtures for example provide lacquers and adhesives having various touch dry times.

Abstract: A composition useful for making circuit boards which is the reaction product of(a) an epoxy resin or an epoxy novolac resin and optionally, a brominated epoxy resin and(b) a bismaleimide;wherein the product of (a) and (b) is subsequently reacting with a curing agent such as a diamine of the formula H.sub.2 N--R.sup.1 --NH.sub.2 where R.sup.1 is an aromatic, aliphatic or cycloaliphatic group.The composition is used to impregnate a fibrous substrate of fiberglass, high temperature polyamides or graphite fibers which is laminated to a copper sheet; the resulting laminate is used to form a circuit boards that have good electrical and physical properties.

Abstract: A prepolymer is comprised of the reaction product of at least one aliphatic bismaleimide, at least one aromatic amine and at least one aromatic bismaleimide in combination with an aromatic and/or a cycloaliphatic epoxy resin providing at least two functional epoxy groups to provide a low temperature curable composition. The cured products are strongly adherent to a variety of substrates.

Abstract: A thermosetting resin composition suitable for use as a molding material comprising (a) a reaction product mixture obtained by preferably reacting 1 mole of a dicarboxylic acid anhydride having ethylenic carbon-carbon double bond such as maleic anhydride with 2-20 moles of a diamine such as 4,4'-diaminodiphenylmethane in a molten state and (b) an epoxy compound having more than one 1,2-epoxy group on the average gives a cured product excellent in heat resistance, etc., when cured with heating at a temperature of 150.degree. to 200.degree. C.

Abstract: A prepolymer comprised of the reaction product of at least one aliphatic bismaleimide, at least one aromatic amine and at least one aromatic bismaleimide is combined with at least one cycloaliphatic epoxy resin having a melting point less than about 120.degree. F. and at least two functional epoxy groups to provide a low temperature curable composition. The cured products are strongly adherent to a variety of substrates.

Abstract: The invention entitled "Polymers containing polyalkylpiperidines and use thereof as stabilizers" provides a class of polymers in which groups containing sterically hindered polyalkylpiperidines are linked in the main chain of the polymers via bridging members containing 2-hydroxy-1,3-trimethylene groups.The polymers show superior stabilizing effects for various synthetic polymers such as polyolefins against degradation thereof induced by light and/or heat. The polymers have advantages, as compared with known stabilizer compounds, that they hardly volatile upon processing with heating or during storage of articles containing thereof, and that they are resistant to extraction with solvents from articles containing thereof.

Abstract: Hardeners for polyepoxides containing more than one, 1,2-epoxide group per molecule comprising a cyanoethylated polyamide amine containing free secondary or primary or secondary and primary amino groups, said cyanoethylated poly-amide amine is a reaction product of polyadded units of(A) 1 mole of a polyamine corresponding to the formula: ##STR1## in which p=0, n=2 or 3, m=0 to 6 and X=NH.sub.2, or p=1, n=2 or 3, m=0 and X=H,(B) from 0.5 to 2.3 moles of a saturated lactam, and(C) from 0.4 to 2.8 moles of acrylonitrile, methacrylonitrile or mixtures thereof.The hardener may be additionally modified with from 0.01 to 1.8 moles of a 1,2-alkylene oxide containing from 2 to 4 carbon atoms or with from 0.001 to 0.3 moles of a carboxylic acid or with the 1,2-alkylene oxide and the carboxylic acid in the quantities indicated, based in each case on 1 mole of the polyamine.

Abstract: There is disclosed the reaction product of an epoxy resin and a metal complex which is a reaction product of tungsten carbonyl and/or molybdenum carbonyl with pyrrolidine.

Abstract: An improvement for producing a coating from a powder lacquers composition comprising at least one 1,2-epoxide compound having at least one 1,2-epoxide group in the molecule which compound has a lower melting point greater than 40.degree. C.

Abstract: A curing agent for a polyepoxide has the formula: ##STR1## wherein R.sub.1 is a divalent aryl radical such as phenylene and wherein R.sub.2 is a tetravalent aryl radical such as a tetravalent benzene radical. An epoxide is cured by admixture with the curing agent. The cured epoxy product retains the usual properties of cured epoxides and, in addition, has a high char residue after burning, on the order of 45% by weight. The high char residue is of value in preventing release to the atmosphere of carbon fibers from carbon fiber-epoxy resin composites in the event of burning of the composite.

Abstract: A method of producing furan-epoxy powder-like binder comprising reacting the product of the polycondensation of epichlorohydrin with diphenylpropane (100 weight parts) with a ketone containing a furfurylidene group (33-200 weight parts) and a nitrogen-containing compound (8-100 weight parts). As examples of the ketone containing a furfurylidene group monofurfurylideneacetone, difurfurylideneacetone, difurfurylidenecyclohexanone, a mixture of monofurfurylideneacetone with difurfurylideneacetone in a ratio (weight parts from 1:1 to 1.4:1; 1,9-di-(.alpha.-furyl)nonanetetracene-1,3,6,8-one-5 or 1,5 -di-(.alpha.-furyl)-2,4-dimethylpentadiene-1, 4-one-3 may be mentioned. Triethanolamine, 3-methyl-5-furylpyrazoline, trifurylimidazoline, hexamethylenediamine, and low molecular polyamides with molecular weight of 2000-10000 or polyethylenepolyamine with molecular weight of 1000 are used as a nitrogen-containing compound. The reaction is performed at 130.degree.-200.degree. C.

Abstract: A process for the preparation of pyrrolidone-5-carboxylic acid/metal salt/amine complexes by reacting 1 mol of a L-glutamic acid lower alkyl ester/metal salt complex with 1 mol of an aliphatic, cycloaliphatic or aromatic-aliphatic damine or 2 mols of an aliphatic or cycloaliphatic monoamine in a polar solvent, with the elimination of 2 mols of alcohol.The complex compounds prepared according to the invention are valuable curing agents for epoxide resins.

Abstract: Novel carboxylic acid metal salt/amine complexes of the formula(A.sup..crclbar.).sub.2 Me.sup.2+ .multidot.NH.sub.2 --R.sub.1 --NH.sub.2in which A is the anion of cyanoacetic acid, pyrrolidonecarboxylic acid, maleimidylcarboxylic acid, succinylimidylcarboxylic acid, benzenesulphonic acid or toluenesulphonic acid or of a methanephosphonic acid monoester or benzenephosphonic acid monoester, Me.sup.2+ is a divalent metal cation and R.sub.1 is a long-chain polyoxyalkylene radical, are obtained by reacting 1 mol of a carboxylic acid metal salt of the formula(A.sup..crclbar.).sub.2 Me.sup.2+with 1 mol of a diamine of the formulaH.sub.2 N--R.sub.1 --NH.sub.2in a polar organic solvent and in the temperature range of 25.degree. to 200.degree. C. to give the complex compounds of the formula.The novel complex compounds are valuable curing agents for epoxide resins and in mixtures with epoxide resins have an advantageous storage stability.

Abstract: An advanced addition product containing 1,2-epoxide groups is prepared from the reaction of a hydantoin compound of the formula ##STR1## wherein R.sub.1 is hydrogen, alkyl containing 1 to 8 carbon atoms or cycloalkyl containing 5 to 6 carbon atoms; and R.sub.2 is alkyl containing 5 to 8 carbon atoms or cycloalkyl containing 5 to 6 carbon atoms; with less than 1.0 equivalents of NH groups per epoxide group the hydantoin compound, of a binuclear bis-hydantoin of the formula ##STR2## wherein R.sub.3 and R.sub.4 are selected from the group consisting of hydrogen or alkyl of 1 to 4 carbon atoms; or together R.sub.3 and R.sub.4 form tetramethylene or pentamethylene; and A is selected from the group consisting of alkylene, alkylidine or alkylidene substituted by one or more halogen atoms.

Abstract: An advanced addition product containing 1,2-epoxide groups is prepared from the reaction of a hydantoin diglycidyl compound of the formula ##STR1## wherein R.sub.1 is hydrogen, alkyl containing 1 to 8 carbon atoms or cycloalkyl containing 5 to 6 carbon atoms; and R.sub.2 is alkyl containing 5 to 8 carbon atoms or cycloalkyl containing 5 to 6 carbon atoms, with less than 1 equivalent of NH groups per epoxide group of the diglycidyl compound of a binuclear bishydrantoin compound of the formula ##STR2## wherein R.sub.3 and R.sub.4 are selected from the group consisting of hydrogen or alkyl of 1 to 4 carbon atoms; or together R.sub.1 and R.sub.2 form tetramethylene or pentamethylene, and A is a member selected from the group consisting of alkylene, alkylidene or alkylidene substituted by one or more halogen atoms.Such adducts exhibit superior melt-flow characteristics and, when formulated into a thermosettable coating composition, exhibit excellent weathering and over-cure properties.

Abstract: An imidazole-isocyanuric acid adduct having the following general formula is disclosed: ##STR1## wherein R.sub.1 is a member selected from the group consisting of a hydrogen atom, a .beta.-cyanoethyl group and a .beta.-[3,5-diamino-S-triazinyl-(1)]-ethyl group, R.sub.2 stands for a monovalent hydrocarbon group having up to 17 carbon atoms, R.sub.3 is a member selected from the group consisting of a hydrogen atom and an alkyl group having up to 4 carbon atoms, with the proviso that when R.sub.1 is a hydrogen atom, R.sub.2 is a methyl or phenyl group and R.sub.3 is a hydrogen atom and when R.sub.1 is a .beta.-cyanoethyl group, R.sub.2 is a phenyl group and R.sub.3 is a hydrogen atom, and n is a number of from 0 to 2.This adduct has peculiar characteristics not possessed by ordinary salts. Namely, the adduct is stable in water, and it decomposes in a solvent or under heating. The adduct is valuable as a curing agent for epoxy resins, and it can be utilized for purification of imidazoles.

Abstract: An epoxy resin curing agent comprising a compound represented by the formula (I): ##STR1## wherein k, m and n, which may be the same or different, each is an integer of 1 to 6, and l is an integer of 0 to 6, and/or a modified product thereof, a curable epoxy resin composition comprising an epoxy resin and the epoxy resin curing agent represented by the formula (I), and a cured product obtained from the epoxy resin composition.

Abstract: Urethanes of hydroxybenzotriazoles and hydroxybenzophenones which can be chemically modified upon heating have been found useful in imparting weather resistance to plastic substrates when applied as part of a UV curable resin which can be subsequently heated after cure. UV curable resins containing such urethanes and the use of such resins to treat thermoplastic substrates are also described.

Abstract: The invention relates to organic polymers which can be crosslinked under the action of light and which are suitable for carrying out photomechanical processes. These polymers are photochemically considerably more sensitive than known comparable polymers and their sensitivity can additionally also be further increased by means of a combination with sensitizers. The molecular weight is at least 1,000. The polymers contain, as light-sensitive groups, groups of the formula I ##STR1## wherein R and R.sub.1 independently of one another denote alkyl groups with at most 4 C atoms, or R and R.sub.1 conjointly denote the remaining part of a 5-membered to 6-membered carbocyclic ring.

Abstract: A curable system such as a curable adhesive type system having a relatively long pot life is disclosed. The curable system of the present invention comprises polymer containing material including at least one curable epoxy resin, at least one imidazole type catalytic curing agent for the resin and a solvent for the epoxy resin capable of suppressing or inhibiting the catalytic reaction between the resin and curing agent at least at about room temperature, the solvent being selected from methanol, ethanol and mixtures thereof.

Abstract: Diepoxides which may be photopolymerized in the presence or absence of a photosensitizer contain a group having conjugated unsaturation attached to a nitrogen heterocycle, such as a hydantoin or barbituric acid residue, forming part of an advanced diepoxide. The resultant photopolymer may be crosslinked by heating in the presence of a curing agent for epoxide resins.The diepoxides are of use in the production of printing plates and printed circuits, especially multilayer printed circuits.

Abstract: A powder coating composition which comprises a mixture of in a given proportion(A) a polyester resin which contains hydroxyl groups as functional group and contains at least 80 mol.% of an aromatic polycarboxylic acid component in the polycarboxylic acid component of said polyester resin, said polyester resin having a softening point of 50.degree.-180.degree. C,(b) a polyacyl-(N-lactam) compound or a polyacyl-(N-imide) compound having a softening point above 40.degree. and(C) a said epoxy resin.The powder coating composition has a very good storage stability, free flowability at room temperature and exhibits good melt flow characteristics when heated above 130.degree. C for baking. Coating films prepared from this powder coating composition are excellent in the mechanical resistance, corrosion resistance, solvent resistance and luster.

Abstract: The adhesion properties of amine-cured epoxy resins are unexpectedly enhanced by addition of certain amino terminated polyether succinimide additives. The adhesively superior epoxy resin composition comprises a vicinal polyepoxide, a curing amount of an amine curing agent, and an effective amount of a polyether succinimide having terminal amino groups and a molecular weight of from about 4000 to about 4500.

Abstract: Water-dispersible resins formed from polyglycidyl ethers of polyphenols and N-heterocyclic compounds and containing cationic salt groups are disclosed. The resins can be dispersed or dissolved in water, and can be applied to a wide variety of different substrates by electrodeposition, depositing on the cathode to provide superior corrosion-resistant coatings.

Abstract: A curable resin composition comprising(a) a cyanate ester component selected from the group consisting of polyfunctional aromatic cyanate ester monomers having at least 2 cyanate groups bonded to their aromatic ring, prepolymers of the cyanate esters and prepolymers of the cyanate ester monomers and amines, and(b) a bismaleimide component selected from the group consisting of bismaleimides, bismaleimide prepolymers and prepolymers of the bismaleimides and amines;The weight ratio of the component (a) to (b) being 1:99 to 99:1.

Abstract: A heat-resistant thermosetting resin composition is obtained by reaction with each other of an N,N'-bis-imide of unsaturated dicarboxylic acid (A), a cyanuric or isocyanuric acid or derivatives thereof (B), and at least one compound (C) selected from the group consisting of tetracarboxylic acid diimide, hydantoin and derivatives thereof, and barbituric acid and derivatives thereof. This resin composition has excellent heat-resistance and workability, and is employed for the use of a molding, laminated sheet, adhesive, etc.

Abstract: The disclosed curing agents or initiators have the formula ML.sub.n (O-SO.sub.2 -R.sub.f).sub.m wherein L is an imidazole, M is a metal, n is a coordination number of M, R.sub.f is a fluorinated alkyl group, and m is the valence of M. These curing agents are useful in latent curable epoxy systems. Upon heating to the cure temperature (e.g. 100.degree. - 250.degree. C.), such systems cure efficiently and with a low exotherm.