Abstract: The invention is directed to method for making a polyimide by converting the dianhydride to the ester acid and reacting the ester acid with a diamine. The invention allows for the controlled addition of aliphatic diamines resulting in control of the polyimide properties such as the glass transition temperature, solubility, and melt processability.

Abstract: A polyimide film is manufactured from a random copolymeric, block copolymeric or interpenetrating polymer network-type polyamic acid prepared from pyromellitic dianhydride in combination with 22 to 78 mol % of 4,4′-oxydianiline and 22 to 78 mol % of 3,4′-oxydianiline, based on the overall diamine. The polyimide film, when used as a metal interconnect board substrate in flexible circuits, chip scale packages (CSP), ball grid arrays (BGA) or tape-automated bonding (TAB) tape by providing metal interconnects on the surface thereof, achieves a good balance between a high elastic modulus, a low thermal expansion coefficient, alkali etchability and film formability.

Abstract: In a method of producing a low dielectric constant polymer, a thermosetting monomer is provided, wherein the thermosetting monomer has a cage compound or aryl core structure, and a plurality of arms that are covalently bound to the cage compound or core structure. In a subsequent step, the thermosetting monomer is incorporated into a polymer to form the low dielectric constant polymer, wherein the incorporation into the polymer comprises a chemical reaction of a triple bond that is located in at least one of the arms. Contemplated cage compounds and core structures include adamantane, diamantane, silicon, a phenyl group and a sexiphenylene group, while preferred arms include an arylene, a branched arylene, and an arylene ether. The thermosetting monomers may advantageously be employed to produce low-k dielectric material in electronic devices, and the dielectric constant of the polymer can be controlled by varying the overall length of the arms.

Abstract: A process for production of polyimide powder, which comprises reacting a biphenyltetracarboxylic dianhydride and an aromatic diamine in an amide-based solvent optionally containing a water-soluble ketone, in the presence of an imidazole at 1-100 equivalent percent based on the carboxylic acid content of the polyimide precursor, separating and collecting the produced polyimide precursor powder from a water-soluble ketone solvent containing 3-30 wt % of an amide-based solvent, and heating the polyimide precursor powder to an imidation rate of 90% or greater, as well as polyimide powder obtained thereby, molded bodies of the polyimide powder, and a process for production of the molded bodies.

Abstract: The object of the present invention is to provide a method capable of producing polyimide resins having excellent heat resistance, which can utilize inexpensive monomers and does not use solvents. The method comprises mixing, in the absence of a solvent, a diamine and at least one tetracarboxylic acid component selected from the group consisting of a tetracarboxylic acid, a tetracarboxylic acid monoanhydride and a tetracarboxylic acid dianhydride capable of forming two imide rings upon cyclization, and then heat-treating the mixture.

Abstract: A process for production of polyimide powder, which comprises reacting an aromatic diamine with a partial ester of a biphenyltetracarboxylic dianhydride, which is a partial ester of a biphenyltetracarboxylic dianhydride with a primary alcohol of 1-5 carbon atoms of which at least 30 mole percent is a 2,3,3′,4′-biphenyltetracarboxylic acid component, in the presence of the primary alcohol, separating out and collecting the resulting solid polyimide precursor and heating for dehydrating ring closure, polyimide powder obtained thereby, molded bodies of the polyimide powder, and a process for production of the molded bodies.

Abstract: This invention provides crosslinkable-group-containing polyimides of various known thermoplastic polyimide backbone structures, which are provided with far better heat resistance, chemical resistance and mechanical properties than known polyimides of the structures without impairing excellent moldability or formability, superb sliding property, low water absorption property, outstanding electrical properties, high thermal oxidation stability and high radiation resistance, all of which are inherent to the structures.

Abstract: Aromatic aliphatic ether solvents, such as anisole, methylanisole, and phenetole, have been found useful in formulating coating solutions of polymeric dielectric materials and as a clean up solvent in the coating process. A process for forming a dielectric film on a substrate includes depositing a coating solution of a dielectric material in a formulation solvent onto a surface of the substrate and depositing an aromatic aliphatic ether solvent onto an edge portion of the surface of the substrate. The process is used to form films of dielectric materials including arylene ether dielectric polymers, hydridosiloxane resins, organohydridosiloxane resins, spin-on-glass materials, partially hydrolyzed and partially condensed alkoxysilane compositions which are cured to form a nanoporous dielectric silica material, and poly(perhydrido)silazanes.

Abstract: A novel dielectric composition is provided that is useful in the manufacture of integrated circuit devices and integrated circuit packaging devices. The dielectric composition is prepared by imidizing and curing an oligomeric precursor compound comprised of a central polybenzoxazole, polybenzothiazole, polyamic acid or polyamic acid ester segment end-capped at each terminus with an aryl-substituted acetylene moiety such as an ortho-bis(arylethynyl)aryl group, e.g., 3,4-bis(phenylethynyl)phenyl. Integrated circuit devices, integrated circuit packaging devices, and methods of synthesis and manufacture are provided as well.

Abstract: The invention relates to a method for producing polycarbonate having a high purity and an extremely high transmittance especially at short wavelengths. The inventive polycarbonate is produced on the basis of 1,1-bis-(4-hydroxyphenyl)-3,3,5-trimethylcyclohexanone and 4,4-(meta-phenylendiisopropyl)-diphenol. The invention also relates to the polycarbonate obtained, to its use in the production of optical memories and to optical memories produced according to the invention.

Abstract: The present invention relates to a novel polyimide of the general formula (1) and a process for the preparation thereof.

Abstract: A method for the synthesis of high molecular weight poly(imide)s comprising coupling poly(imide) precursors having complementary functional groups and a weight average molecular weight of less than about 50,000 Daltons to form high molecular weight poly (imides)s having a weight average molecular weight greater than 50,000 Daltons.

Abstract: The present invention provides a polymer in which coumarin, a photo-reactive molecule, is grafted onto a polyimide for preparing liquid crystal alignment layer which has a superior alignment property and an excellent thermal stability in photo-alignment, a process for preparing the said grafted polymer, a process for preparing liquid crystal alignment layer by employing the said grafted polymer, and a liquid crystal alignment layer prepared by the process. The polymer of the invention is prepared by mixing a coumarin compound with a polyimide, dissolving the mixture in an organic solvent, adding a catalyst, and stirring under an environment of N2 gas. The polymer of the invention is superior in terms of the thermal stability, which makes possible its universal application for the development of a novel liquid crystal display(LCD).

Abstract: Methods of manufacturing a sealing or an anti-extrusion component for use in a downhole tools is described. The method includes formation of the component from a composition that contains a polyetherketoneketone or a derivative of a polyetherketoneketone. The resultant component is adapted for use in a downhole tool. The invention is also a sealing or an anti-extrusion component for use in a downhole tool. The component contains a composition, which itself is composed of a polyetherketoneketone or a derivative of a polyetherketoneketone, and the component is adapted for use in a downhole tool.

Abstract: This invention provides cycloaliphatic polyimide having the following formula (I): wherein 1 and n are integers from 4 to 7; m is an integer from 0 to 2; p is an integer from 1 to 8; polycyclic aliphatic compound R reprents C1-8 cycloalkyl, cycloalkenyl, cycloalkynyl, norbornenyl, decalinyl, adamantanyl, or cubanyl. That cycloaliphatic polyimide can be a through transparent film, their thermal stability is over 430° C. and dielectric constant is about 2.7.

Abstract: A new method for the synthesis of poly(etherimide)s comprises transimidation of bis(imide) (IV) in the presence of a substituted phthalic anhydride or 4-substituted tetrahydrophthalic anhydride to yield dianhydride (V) which may then be reacted with a diamine to produce poly(etherimide)s. By-product substituted N-alkylphthalimide or 4-substituted N-alkyltetrahydrophthalic anhydride may be recycled or converted to 4-substituted N-alkylphthalimide for use in the formation bisimide (IV), obviating the need for a nitration step.

Abstract: Disclosed are a polyamic acid having repeating units represented by the formula (1): 1

Abstract: Solvent-based processes for producing latent curing catalysts without causing an extreme exotherm. The process of the present invention includes combining an amine compound curing agent with a solvent, heating the mixture, adding an epoxy/solvent mixture via slow addition, removing the solvent and then heating the remaining composition. Following the heating, a phenolic resin is added to produce the final catalyst. The final catalyst comprises an amine compound, an epoxy, phenolic resin and a solvent. Catalysts having differing properties may be produced by varying the elements of the catalyst.

Abstract: Novel polyimide copolymer, which is a copolymer of isopropylidene-bis-(4-phenyleneoxy-4-phthalic acid)dianhydride and 6-amino-2-(p-aminophenyl)benzimidazole or a copolymer of two kinds of tetracarboxylic acid dianhydrides consisting of isopropylidene-bis-(4-phenyleneoxy-4-phthalic acid)dianhydride and 3,3′,4,4′-benxophenonetetracarboxylic acid dianhydride and 6-amino-2-(p-aminophenyl)benzimidazole, can form a metal laminate by direct lamination with metallic foils. The metal laminate can fully satisfy the peel strength.

Abstract: A polyimide precursor having a repeating unit represented by the following general formula (1), wherein R1 contains a bivalent organic group constituting a diamine having a hexafluoropropylidene group in its molecule represented by the following general formula (2), and the reduced viscosity is from 0.05 to 5.0 dl/g (in N-methylpyrrolidone at a temperature of 30° C., concentration: 0.5 g/dl), and a polyimide obtained by imidizing said precursor: (wherein R1 is a bivalent organic group constituting a diamine, A is a hydrogen atom, a linear alkyl group including a methyl group, or a trifluoromethyl group, and n is the number of a substituent on an aromatic ring and an integer of from 1 to 4).

Abstract: The present invention provides an optical polyimide compound defined by the following formula in an optical high polymer material: wherein X is Cl, Br, oxo-halide, or fully halogenated alkyl; A is a divalent aromatic or halogenated aromatic moiety; and Z is a tetravalent moiety which may be a partly or fully fluorinated aromatic ring, a partly or fully chlorinated aromatic ring, a partly or fully fluorinated cycloaliphatic group, a partly or fully chlorinated aliphatic group, or combinations thereof connected via hetero atoms.

Abstract: The polyamic acid of the invention can be obtained by the reaction of an acid anhydride component comprising pyromellitic anhydride and 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane with 2,2′-di-substituted-4,4′-diaminobiphenyls as a first aromatic diamine and any aromatic diamine component, as a second aromatic diamine, of 2,2-bis(4-aminophenoxyphenyl)propanes, 1,1-bis(4-(4-aminophenoxy)-3-t-butyl-6-methylphenyl)butane, 2,2-bis(3-amino-4-methylphenyl)hexafluoropropane and &agr;,&agr;′-bis(4-aminophenyl)diisopropylbenzenes in an organic solvent. The polyimide resin of the invention can be obtained by heating such a polyamic acid solution. In the production of a circuit board, by using a photosensitive polyamic acid having a sensitizer incorporated in such a polyamic acid solution, a patterned polyimide resin layer can be provided as an insulation layer on a metal foil.

Abstract: Random, melt-processible copolyimides are disclosed herein. These copolyimides are semicrystalline and exhibit recoverable (semi)crystallinity from their melts. Associated processes, which entail either solution polymerization or melt polymerization, for producing and fabricating these copolyimides into useful articles having a predetermined shape are also disclosed.

Abstract: Random, melt-processible copolyimides are disclosed herein. These copolyimides are semicrystalline and exhibit recoverable (semi)crystallinity from their melts. Associated processes, which entail either solution polymerization or melt polymerization, for producing and fabricating these copolyimides into useful articles having a predetermined shape are also disclosed.

Abstract: An electronically active film comprising a compound of the formula: 1

Abstract: Random, melt-processible copolyimides are disclosed herein. These copolyimides are semicrystalline and exhibit recoverable (semi)crystallinity from their melts. Associated processes, which entail either solution polymerization or melt polymerization, for producing and fabricating these copolyimides into useful articles having a predetermined shape are also disclosed.

Abstract: In a photoconductive element comprising a conductive support, e.g., an electrically conductive film, drum or belt on which a negatively chargeable photoconductive layer is formed, an electrical barrier layer is formed between the support and the photoconductive layer. The barrier layer provides a high energy barrier to the injection of positive charges but transports electrons under an applied electric field. The barrier layer of the invention transports charge by electronic rather than ionic mechanisms and, therefore, is not substantially affected by humidity changes. The barrier layer comprises a polyester-co-imide, polyesterionomer-co-imide or polyamide-co-imide having covalently bonded as repeating units in the polymer chain, aromatic tetracarboxylbisimide groups of the formula: wherein Ar1 and Ar2 represent, respectively, tetravalent and trivalent aromatic groups of 6 to 20 carbon atoms.

Abstract: A method of making a solution of a polyimide from a diamine monomer and a dianhydride monomer is disclosed. A solution or slurry of one of the monomers in a solvent that boils at a temperature between about 80° C. and about 160° C. is prepared. The solution or slurry is heated to a temperature between about 80° C. and about 160° C. and the other monomer is slowly added to the solution or slurry. Polyamic acid that is formed quickly imidizes to form the polyimide.

Abstract: The object of the present invention is to provide a method capable of producing polyimide resins having excellent heat resistance, which can utilize inexpensive monomers and does not use solvents. The method comprises mixing, in the absence of a solvent, a diamine and at least one tetracarboxylic acid component selected from the group consisting of a tetracarboxylic acid, a tetracarboxylic acid monoanhydride and a tetracarboxylic acid dianhydride capable of forming two imide rings upon cyclization, and then heat-treating the mixture.

Abstract: Polymer electrolytes and process for their preparation

Abstract: An acid dianhydride, together with a diamine, is heated in an organic polar solvent in the presence of &ggr;-caprolactone or &bgr;-butyrolactone as an acid catalyst to prepare a polyimide having an average molecular weight of 10,000 to 300,000. This production process can realize the production of a polyimide which is soluble in a solvent and has high processability and stability.

Abstract: A low dielectric constant material has a polymeric network that is fabricated from a first and a second component. The first component comprises a polymeric strand, and the second component comprises a molecule having a central portion with at least three arms extending from the central portion, wherein each of the arms includes a backbone with a reactive group. The first component and the second component form the polymeric network in a reaction that involves at least one of the reactive groups when the first and second components are thermally activated. Contemplated low dielectric constant materials are advantageously employed in the fabrication of electronic devices, and particularly contemplated devices include integrated circuits.

Abstract: The present invention refers to an optical film comprising one or more polyarylates having at least some units represented by the general structure: 1

Abstract: A thermally cured polyimide is provided, and in particular a crosslinked polyimide, comprising a fluorenyl diamine and comprising an aromatic ring having at least one C1-C10 branched or unbranched alkyl substituent, where the alkyl substituent includes a benzylic hydrogen. The present invention provides a crosslinked polyimide made by a process comprising the step of crosslinking a polyimide comprising diamines comprising pendent fluorenyl groups and comprising aromatic rings having at least one C1-C10 branched or unbranched alkyl substituent, the alkyl substituent including a benzylic hydrogen, by raising the temperature of said polyimide above its glass transition temperature.

Abstract: Aromatic aliphatic ether solvents, such as anisole, methylanisole, and phenetole, have been found useful in formulating coating solutions of polymeric dielectric materials and as a clean up solvent in the coating process. A process for forming a dielectric film on a substrate includes depositing a coating solution of a dielectric material in a formulation solvent onto a surface of the substrate and depositing an aromatic aliphatic ether solvent onto an edge portion of the surface of the substrate. The process is used to form films of dielectric materials including arylene ether dielectric polymers, hydridosiloxane resins, organohydridosiloxane resins, spin-on-glass materials, partially hydrolyzed and partially condensed alkoxysilane compositions which are cured to form a nanoporous dielectric silica material, and poly(perhydrido)silazanes.

Abstract: A dielectric film is obtained by heat curing a thermally curable fluorinated o-aminophenol polymer or oligomer based on an o-aminophenol compound and an aromatic dicarboxylic acid compound, at least one of which is mono- or poly-fluorinated, and having thermosetting groups at both ends that undergo cross-linking reaction upon thermal treatment. The dielectric film is employed in multilayer circuit boards.

Abstract: The present invention is directed to new polycyclicaromatic-ethynyl terminated materials that possesses excellent mechanical and chemical properties for high-performance composite application that can be cured at lower temperatures than phenyl-ethynyl terminated imide materials.

Abstract: An element of a gigahertz electronic device is provided comprising a polyimide selected to have an imide equivalent weight of 375 or greater. The polyimide preferably has a dielectric loss at 12.8 GHz of 0.009 or less and a Tg of 260° C. or greater. Such elements include circuit substrates and antennas.

Abstract: A hyperbranched polyetherketone and a heat-resistant blend of polyvinylchloride with the same. The polyetherketone is synthesized by self-polycondensation of 3,5-bis[4-[(2,3,4,5,6-pentafluorophenyl)carbonyl]phenoxy]-4-hydroxybenzophenone or 3,5-difluoro-4-hydroxybenzophenone, and then substituting 50 to 80 mole % of fluorine atoms present in the side chains and ends of the PEK molecule by polar groups. In addition, a blend of polyvinylchloride can be manufactured using the hyperbranched polyetherketone by a melt blending technique applicable for industrial purpose at a temperature of 180 to 120° C., and thus the blend of polyvinylchloride with the polyetherketone can be applied to high temperature end-use products such as hot water pipes.

Abstract: A process for production of polyimide powder, which comprises reacting an aromatic diamine with a partial ester of a biphenyltetracarboxylic dianhydride, which is a partial ester of a biphenyltetracarboxylic dianhydride with a primary alcohol of 1-5 carbon atoms of which at least 30 mole percent is a 2,3,3′,4′-biphenyltetracarboxylic acid component, in the presence of the primary alcohol, separating out and collecting the resulting solid polyimide precursor and heating for dehydrating ring closure, polyimide powder obtained thereby, molded bodies of the polyimide powder, and a process for production of the molded bodies.

Abstract: A process for production of polyimide powder, which comprises reacting a biphenyltetracarboxlic dianhydride and an aromatic diamine in an amide-based solvent optionally containing a water-soluble ketone, in the presence of an imidazole at 1-100 equivalent percent based on the carboxylic acid content of the polyimide precursor, separating and collecting the produced polyimide precursor powder from a water-soluble ketone solvent containing 3-30 wt % of an amide-based solvent, and heating the polyimide precursor powder to an imidation rate of 90% or greater, as well as polyimide powder obtained thereby, molded bodies of the polyimide powder, and a process for production of the molded bodies.

Abstract: A lithium battery employs for a battery separator and a battery insulating packing and the like a battery polymeric material comprising repeating units wherein p-phenylene is combined with one type of group selected from the group composed of oxygen, a methylene group, an isopropylidene group, a carbonyl group, a carbonyldioxy group, a carboxylic acid anhydride group, an amide group, an ureylene group and a sulfonyl group, or a polymeric material comprising at least two types of repeating units wherein p-phenylene is combined with one type of group selected from the group composed of oxygen, a methylene group, an isopropylidene group, a carbonyl group, a carbonyldioxy group, a carboxylic acid anhydride group, an amide group, an ureylene group, a sulfonyl group, sulfur and a carbonyloxy group.

Abstract: This invention relates generally to poly(aryl ether ketones) bearing alkylated side chains. It relates particularly to soluble, thermally stable, low dielectric poly(aryl ether ketones) with alkylated side chains and especially to films and coatings thereof. These poly(aryl ether ketones) have the following structural formula: wherein Y is selected from the group consisting of CF3 and CH3; and wherein R is CnH(2n+1) and n=11-18.

Abstract: A 6,6′-dialkyl-3,3′,4,4′-biphenyltetracarboxylic dianhydride is prepared by brominating a 4-alkylphthalic anhydride at its 5-position, and coupling the bromination product in the presence of a nickel catalyst; A photosensitive resin composition containing a polyimide precursor having repetitive units of general formula (7) is applied onto a substrate, exposed to 1-line, developed and heated to form a polyimide relief pattern.

Abstract: A composition of and method for making high performance imide resins that are processable by resin transfer molding (RTM) and resin infusion (RI) techniques were developed. Materials with a combination of properties, making them particularly useful for the fabrication of composite parts via RTM and/or RI processes, were prepared, characterized and fabricated into moldings and carbon fiber reinforced composites and their mechanical properties were determined. These materials are particularly useful for the fabrication of structural composite components for aerospace applications. The method for making high performance resins for RTM and RI processes is a multi-faceted approach. It involves the preparation of a mixture of products from a combination of aromatic diamines and aromatic dianhydrides at relatively low calculated molecular weights (i.e. high stoichiometric offsets) and endcapping with latent reactive groups.

Abstract: A flexible printed board, in which a polyimide resulting from the imidation of a polyamic acid obtained by the addition polymerization of diamines and acid dianhydrides is formed as an insulating layer on a metal foil, is characterized in that the diamines include specific imidazolyl-diaminoazines represented by the formula 1; (where A is an imidazolyl group; R1 is an alkylene group; m is 0 or 1; R2 is an alkyl group; n is 0, 1, or 2; R3 and R4 are alkylene groups; p and q are each 0 or 1; and B is an azine residue, diazine residue, or triazine residue).

Abstract: A polyimide film having sufficiently excellent characteristics such as a sufficiently high elastic modulus, a low water absorption, a small coefficient of moisture-absorption expansion, a small coefficient of linear expansion and a high dimensional stability; and various electric/electronic equipment bases with the use of the polyimide film. A polyimide film having a tensile elastic modulus of 700 kg/mm2 or less and a coefficient of moisture-absorption expansion of 20 ppm or less and containing a specific repeating unit as an essential repeating unit is synthesized. Then various electric/electronic equipment bases such as a laminate for flexible print connection boards are produced by using the polyimide film.

Abstract: Phenylethynyl containing reactive additives were prepared from aromatic diamines containing phenylethynyl groups and various ratios of phthalic anhydride and 4-phenylethynylphthalic anhydride in glacial acetic acid to form the imide in one step or in N-methyl-2-pyrrolidinone to form the amide acid intermediate. The reactive additives were mixed in various amounts (10% to 90%) with oligomers containing either terminal or pendent phenylethynyl groups (or both) to reduce the melt viscosity and thereby enhance processability. Upon thermal cure, the additives react and become chemically incorporated into the matrix and effect an increase in crosslink density relative to that of the host resin. This resultant increase in crosslink density has advantageous consequences on the cured resin properties such as higher glass transition temperature and higher modulus as compared to that of the host resin.

Abstract: Novel polyimides substituted by a substituent having an alkyl or fluoroalkyl group and having reduced water absorption; a process for producing these novel polyimides; and novel acid dianhydrides to be used in the production thereof. A polyimide containing a structure represented by the following general formula (I): wherein X1 represents a tetravalent organic group having a substituent —R1AR2 (wherein A represents a divalent linkage group; R1 represents a single bond or a C1-3 alkylene group; and R2 represents a C1-25 alkyl group or a fluoroalkyl group); and Y represents a divalent organic group.

Abstract: A primary object of the invention is to provide a production technology for functional polyamic acid microfine particles and functional polyimide microfine particles by which the particle shape, size and size distribution can be freely controlled. The invention is concerned with a process for synthesizing polyamic acid particles having functional groups at least on the surface from a tetracarboxylic anhydride and a diamine compound characterized by its comprising (a) a first step which comprises providing a tetracarboxylic anhydride and a diamine compound at least one of which has functional groups and preparing a first solution containing the tetracarboxylic anhydride and a second solution containing the diamine compound and (b) a second step which comprises mixing the first and second solutions under ultrasonic agitation to thereby precipitate polyamic acid microfine particles from the mixed solution.