From Ketone-containing Phenolic Reactant Or With Ketone-containing Reactant Patents (Class 528/125)
  • Patent number: 6891067
    Abstract: The present invention provides an optical polyimide precursor for use in making a polyimide. The precursor is defined by the following formula: wherein X is Cl, Br, oxo-halide, or fully halogenated alkyl, and A is a divalent aromatic or halogenated aromatic moiety. The present invention provides a method of preparing a diamine compound for use as an optical polyimide precursor. The method includes the steps of dissolving 2-chloro-5-nitrobenzotrifluoride and a diol in N,N-dimethylacetamide to form a solution, adding potassium carbonate, tert-butylammonium chloride and copper powder to said solution and heating the resulting mixture, removing the copper, precipitating and recrystallizing a dinitro-compound resulting from heating the mixture, and dissolving the dinitro-compound and reducing the dinitro-compound to yield a diamine compound.
    Type: Grant
    Filed: October 8, 2002
    Date of Patent: May 10, 2005
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Kyung-Hee You, Kwan-Soo Han, Tae-Hyung Rhee, Eun-Ji Kim, Jung-Hee Kim, Woo-Hyeuk Jang
  • Patent number: 6887580
    Abstract: An adhesive polyimide resin which comprises a siloxane polyimide resin obtained from (A) an aromatic tetracarboxylic dianhydride and (B) a diamine ingredient comprising (B1) a diamine having a phenolic hydroxyl group, carboxyl group, or vinyl group as a crosslinkable reactive group and (B2) a siloxanediamine and has a glass transition temperature of 50 to 250?C and a Young's modulus (storage modulus) at 250?C of 105 Pa or higher; and a laminate which comprises a substrate comprising a conductor layer and an insulating supporting layer having at least one polyimide resin layer and, disposed on a surface of the substrate, an adhesive layer comprising a layer of the adhesive polyimide resin. The adhesive polyimide resin and the laminate have satisfactory adhesion strength even after exposure to a high temperature of up to 270?C and further have excellent heat resistance in reflow ovens. They are hence suitable for use in the bonding of electronic parts.
    Type: Grant
    Filed: January 26, 2001
    Date of Patent: May 3, 2005
    Assignee: Nippon Steel Chemical Co., Ltd.
    Inventors: Kiwamu Tokuhisa, Akira Tokumitsu, Kazuaki Kaneko
  • Patent number: 6881815
    Abstract: A method for the synthesis of poly(etherimide)s comprises the reaction of 4-halotetrahydrophthalic anhydride with an activating primary amine to yield an activated 4-halotetrahydrophthalimide. Activated 4-halotetrahydrophthalimide may then be aromatized and treated with the disodium salt of a bis(phenol) to yield an activated bisimide. The activated bisimide may then be directly treated with a diamine to yield poly(etherimide)s.
    Type: Grant
    Filed: September 25, 2002
    Date of Patent: April 19, 2005
    Assignee: General Electric Company
    Inventors: Roy Ray Odle, Thomas Link Guggenheim
  • Patent number: 6878796
    Abstract: Aromatic aliphatic ether solvents, such as anisole, methylanisole, and phenetole, have been found useful in formulating coating solutions of polymeric dielectric materials and as a clean up solvent in the coating process. A process for forming a dielectric film on a substrate includes depositing a coating solution of a dielectric material in a formulation solvent onto a surface of the substrate and depositing an aromatic aliphatic ether solvent onto an edge portion of the surface of the substrate. The process is used to form films of dielectric materials including arylene ether dielectric polymers, hydridosiloxane resins, organohydridosiloxane resins, spin-on-glass materials, partially hydrolyzed and partially condensed alkoxysilane compositions which are cured to form a nanoporous dielectric silica material, and poly(perhydrido)silazanes.
    Type: Grant
    Filed: November 18, 2002
    Date of Patent: April 12, 2005
    Assignee: Honeywell International Inc.
    Inventors: Oana Leonte, Tadashi Nakano, Kelly Beres, Kreisler Lau
  • Patent number: 6861497
    Abstract: A polyimide is disclosed of the formula: CG1 and CG2 are independently electron-accepting and/or electron-donating groups; x is an integer from about 3 to about 3000; ODAH is any of a number of known dianhydride residues; ODAM is any of a number of known diamine residues; and m, n, o, and p cumulatively add to 1.0, with the sum of m and n ranging from about 0.05 to about 1.0, the sum of o and p ranging from about 0 to about 0.95, the sum of m and o being about 0.5 and the sum of n and p being about 0.5. In addition, a film structure comprising the polyimide and devices utilizing the film structure are disclosed.
    Type: Grant
    Filed: October 28, 2002
    Date of Patent: March 1, 2005
    Assignee: The United States of America as represented by the Secretary of the Navy
    Inventors: Geoffrey A. Lindsay, Richard A. Hollins, Peter Zaras, Andrew J. Guenthner, Andrew P. Chafin, Mathew C. Davis, Stephen Fallis
  • Patent number: 6852826
    Abstract: In a step of polymerizing polyamic acid by mixing tetracarboxylic acid dianhydride and diamine and polycondensating the tetracarboxylic acid dianhydride and diamine under the presence of a polymerization-use solvent, a tetracarboxylic acid dianhydride slurry in which a tetracarboxylic acid dianhydride is dispersed in a dispersion medium is used. According to this, it is possible to directly manufacture a polyamic acid solution having a high concentration of polyamic acid more than or equal to 10% by weight. Especially, even if a tetracarboxylic acid dianhydride having low solubility in the polymerization-use solvent, it is possible to effectively manufacture a polyamic acid solution having high solids content, by a simple process and in a short time.
    Type: Grant
    Filed: December 19, 2002
    Date of Patent: February 8, 2005
    Assignee: Kanera Corporation
    Inventors: Kan Fujihara, Kazuhiro Ono, Kiyokazu Akahori
  • Patent number: 6849706
    Abstract: Copolyetherimides comprise phthalimide structural units comprising both 3- and 4-linkages, wherein the designations 3-linkage and 4-linkage refer to the isomeric positions on the phthalimide ring in the totality of phthalimide-comprising structural units in the copolymer. The products have excellent properties, including high glass transition and heat distortion temperatures, high ductility and good melt flow properties, and low polydispersity.
    Type: Grant
    Filed: August 25, 2003
    Date of Patent: February 1, 2005
    Assignee: General Electric Company
    Inventors: Daniel Joseph Brunelle, Havva Yagci Acar, Farid Fouad Khouri, William David Richards
  • Patent number: 6835796
    Abstract: An optical film containing polyaryletherketone and a method of producing the optical film, the optical film being excellent in the heat resistance and uniformity, and the film having a negative birefringence. The optical film compensates birefringence of a liquid crystal display, thereby providing an optical element or an image display device that has desired color tones and viewing-angle characteristics. The optical film having a negative birefringence of 0.001 to 0.6 is produced by coating a solution containing polyaryletherketone on a substrate and subsequently drying the coating.
    Type: Grant
    Filed: November 1, 2002
    Date of Patent: December 28, 2004
    Assignee: Nitto Denko Corporation
    Inventors: Michie Sakamoto, Amane Mochizuki
  • Patent number: 6833426
    Abstract: A halogenated aromatic compound, a polyarylene (co)polymer obtained by the polymerization of such a halogenated aromatic compound as a monomer component, and a proton-conductive membrane made of a sulfonation product of such a (co)polymer are disclosed. The halogenated aromatic compound is represented by the following general formula (1bm): wherein As′ independently represent an electron-withdrawing group; Bs′ independently represent an electron-donating atom or divalent group; Xs′ independently represent a chlorine atom, an iodine atom, or a bromine atom; Z represents an aryl group; R1 to R19 may be the same or different and each represents a hydrogen atom, a fluorine atom, an alkyl group, or a fluoroalkyl group; and a and b each represents an integer of 1 to 20.
    Type: Grant
    Filed: January 21, 2003
    Date of Patent: December 21, 2004
    Assignee: JSR Corporation
    Inventors: Yoshitaka Yamakawa, Masayuki Takahashi, Kohei Goto
  • Publication number: 20040254327
    Abstract: The invention relates to bisphenol monomers containing one or more biaryl units and related polymers, derivatives and resins thereof and more particularly to Bisphenol monomers containing two biaryl units separated by a spacer group X, and to bisphenol monomers containing a biaryl unit and an aryl unit separated by a spacer group X, and to polymers, derivatives, resins and related products prepared therefrom.
    Type: Application
    Filed: October 24, 2003
    Publication date: December 16, 2004
    Inventors: David A. Boyles, John T. Bendler
  • Patent number: 6828353
    Abstract: Ion-Exchange polymers for a polymer electrolyte membrane include a moiety of formula (I), and/or a moiety of formula (II), and/or a moiety of formula (III) wherein at least some of the units I, II and/or III are sulphonated. The phenyl moieties in units I, II, and III are independently optionally substituted and optionally cross-linked; m, r; s, t, v, w and z independently represent zero or a positive integer, E and E′ independently represent an oxygen or a sulphur atom or a direct link, G represents an oxygen or sulphur atom, a direct link or a —O—Ph—O— moiety where Ph represents a phenyl group and Ar is selected from one of the moieties (i) to (x) as set forth herein which is bonded via one or more of its phenyl moieties to adjacent moieties.
    Type: Grant
    Filed: March 12, 2001
    Date of Patent: December 7, 2004
    Assignee: Victrex Manufacturing Limited
    Inventors: Peter Charnock, David J. Kemmish, Philip A. Staniland, Brian Wilson
  • Patent number: 6825310
    Abstract: A polymer which has a flexible structure in its main chain and thus exhibits a high toughness and can difficultly be deteriorated in its mechanical properties and thermal properties even when sulfonated, a sulfonic acid group-containing polymer obtained by the sulfonation of the polymer, and a proton-conductive membrane having an excellent mechanical strength and durability made of the sulfonic acid group-containing polymer. A novel halogenated aromatic compound represented by the following general formula (1m) is provided: wherein A independently represents an electron-withdrawing group; B independently represents an electron-donating atom or group; X represents a chlorine atom, iodine atom or bromine atom; R1 to R8 may be the same or different and each represent a hydrogen atom, fluorine atom or alkyl group; and n represents an integer of 2 or more.
    Type: Grant
    Filed: March 26, 2002
    Date of Patent: November 30, 2004
    Assignee: JSR Corporation
    Inventors: Kohei Goto, Masayuki Takahashi, Yoshitaka Yamakawa, Makoto Higami
  • Publication number: 20040236062
    Abstract: The present invention is directed to sulfonimide-containing polymers, specifically sulfonimide-containing poly(arylene ether)s and sulfonimide-containing poly(arylene ether sulfone)s, and processes for making the sulfonimide-containing poly(arylene ether)s and sulfonimide-containing poly(arylene ether sulfone)s, for use conductive membranes and fuel cells.
    Type: Application
    Filed: April 28, 2004
    Publication date: November 25, 2004
    Inventor: Michael A. Hofmann
  • Patent number: 6818735
    Abstract: A lithium battery employs for a battery separator and a battery insulating packing and the like a battery polymeric material comprising repeating units wherein p-phenylene is combined with one type of group selected from the group composed of oxygen, a methylene group, an isopropylidene group, a carbonyl group, a carbonyldioxy group, a carboxylic acid anhydride group, an amide group, an ureylene group and a sulfonyl group, or a polymeric material comprising at least two types of repeating units wherein p-phenylene is combined with one type of group selected from the group composed of oxygen, a methylene group, an isopropylidene group, a carbonyl group, a carbonyldioxy group, a carboxylic acid anhydride group, an amide group, an ureylene group, a sulfonyl group, sulfur and a carbonyloxy group.
    Type: Grant
    Filed: August 23, 2001
    Date of Patent: November 16, 2004
    Assignee: Sanyo Electric Co., Ltd.
    Inventors: Seiji Yoshimura, Hiroshi Nakajima, Maruo Kamino, Nobuhiro Nishiguchi, Masahiro Imanishi
  • Patent number: 6808818
    Abstract: A fusible polyimide showing a fusion endothermic peak in a differential scanning calorimeter has a recurring unit of the following formula (1): in which Ar1 is a mixture of residues of tetracarboxylic dianhydrides composed of 12-25 mol. & of a residue of pyromellitic dianhydride, 5-15 mol. % of a residue of 3,3′4,4′-benzophenonetetracarboxylic dianhydride, and a remaining mol. % of a residue of 3,3′,4,4′-biphenyltetracarboxylic dianhydride, and Ar2 is an aromatic diamine residue composed of 1,3-bis(4-aminophenoxy)benzene.
    Type: Grant
    Filed: October 11, 2002
    Date of Patent: October 26, 2004
    Assignee: Ube Industries, Ltd.
    Inventors: Hideki Ozawa, Shigeru Yamamoto
  • Publication number: 20040210007
    Abstract: Provided is an aromatic polymer phosphonic acid derivative in which a phosphonic acid derivative group is directly bound to aromatic ring. Said aromatic polymer phosphonic acid derivative can be produced by brominating a specific aromatic polymer compound with a brominating agent, then acting thereon trialkyl phosphite in the presence of a nickel halide catalyst to give a phosphonic acid di-ester, and further, by hydrolyzing the di-ester. The aromatic polymer phosphonic acid derivative is excellent in radical resistance and used for a solid polymer type fuel cell.
    Type: Application
    Filed: May 13, 2004
    Publication date: October 21, 2004
    Applicant: SUMITOMO CHEMICAL COMPANY, LIMITED
    Inventors: Shigeru Sasaki, Arihiro Yashiro, Yasuaki Hidaka
  • Patent number: 6794480
    Abstract: A monomer containing an electron-withdrawing group and an electron-donative group which can be easily controlled in the upper limit of the amount of a sulfonic acid, which impairs the mechanical properties of a copolymer, and can provide a sulfonated polymer that forms a proton-conductive membrane having a high proton conductivity over a wide temperature range, an excellent mechanical strength and an excellent proton conductivity and showing inhibited swelling in hot water and an aqueous solution of methanol, and a copolymer obtained from the monomer. A monomer containing an electron-withdrawing group and an electron-donative group represented by the following general formula (1): wherein Y represents a iodine atom, chlorine atom or bromine atom; X represents an electron-withdrawing group; B represents an electron-donative group; and Z represents an aryl group having a specific structure or a monovalent condensed ring hydrocarbon group such as naphthyl group.
    Type: Grant
    Filed: March 26, 2002
    Date of Patent: September 21, 2004
    Assignee: JSR Corporation
    Inventors: Kohei Goto, Masayuki Takahashi, Yoshitaka Yamakawa, Makoto Higami
  • Patent number: 6793987
    Abstract: An aromatic polyamide photoalignment material prepared by a reaction from a diamine compound with a side branch and a photosensitive dicarboxylic acid. Furthermore, liquid crystal display devices using such photoalignment materials in an alignment film on at least one substrate.
    Type: Grant
    Filed: September 6, 2001
    Date of Patent: September 21, 2004
    Assignee: LG.Philips LCD Co., Ltd.
    Inventors: Hyun Ho Shin, Mi Sook Nam, Su Hyun Park, Moonhor Ree, Seung Woo Lee
  • Patent number: 6790934
    Abstract: Aromatic polyethers are prepared by displacement polymerization reaction in the presence of a water-immiscible solvent with boiling point at atmospheric pressure of greater than 110° C. and a density ratio to water of greater than 1.1:1 at 20-25° C. The polyethers are purified by processes comprising aqueous extraction, or filtration, or a combination thereof.
    Type: Grant
    Filed: December 21, 2001
    Date of Patent: September 14, 2004
    Assignee: General Electric Company
    Inventors: Norman Enoch Johnson, Raul Eduardo Ayala, Thomas Joseph Fyvie, Amy Rene Freshour, David Winfield Woodruff, Peter David Phelps, Ganesh Kailasam, Paul Edward Howson, Elliott West Shanklin, Lioba Maria Kloppenburg, David Bruce Hall, Pradeep Jeevaji Nadkarni, Daniel Joseph Brunelle
  • Patent number: 6790930
    Abstract: The present invention provides a method for easily producing a high-molecular weight polyimide resin at high yield by drying and heating a mixture mixed by material monomers of polyimide.
    Type: Grant
    Filed: April 4, 2002
    Date of Patent: September 14, 2004
    Assignee: Kaneka Corporation
    Inventors: Takeshi Kikuchi, Hiroyuki Tsuji, Koji Okada, Hiroyuki Furutani, Koichiro Tanaka, Shoji Hara, Hitoshi Nojiri
  • Patent number: 6784276
    Abstract: This invention is a highly concentrated stable solution of polyimide precursors (monomers) having a solids content ranging from about 80 to 98 percent by weight in lower aliphatic alcohols i.e. methyl and/or ethyl alcohol. The concentrated polyimide precursor solution comprises effective amounts of at least one aromatic diamine, at least one aromatic dianhydride or a lower molecular weight alkyl ester of said dianhydride, and a monofunctional endcap including monoamines, monoanhydrides and the lower alkyl esters of said monoanhydrides. These concentrated polyimide precursor solutions are particularly useful for the preparation of fibrous prepregs and composites for use in structural materials for military and civil applications.
    Type: Grant
    Filed: July 25, 2002
    Date of Patent: August 31, 2004
    Assignee: The United States of America as represented by the United States National Aeronautics and Space Administration
    Inventor: Chun-Hua Chuang
  • Patent number: 6780960
    Abstract: A method of making a solution of a polyimide from a diamine monomer and a dianhydride monomer is disclosed. A solution or slurry of one of the monomers in a solvent that boils at a temperature between about 80° C. and about 160° C. is prepared. The solution or slurry is heated to a temperature between about 80° C. and about 160° C. and the other monomer is slowly added to the solution or slurry. Polyamic acid that is formed quickly imidizes to form the polyimide.
    Type: Grant
    Filed: July 22, 2002
    Date of Patent: August 24, 2004
    Assignee: Sumitomo Bakelite Company Limited
    Inventors: Michael C. Hausladen, Jin-O Choi
  • Patent number: 6777525
    Abstract: Polyimides having a desired combination of high thermo-oxidative stability, low moisture absorption and excellent chemical and corrosion resistance are prepared by reacting a mixture of compounds including (a) 3,3′,4,4′-benzophenonetetracarboxylic dianhydride (BTDA), (b) 3,4′-oxydianiline (3,4′-ODA), and (c) 5-norbornene-2,3-dicarboxylic anhydride (NA) in a high boiling, aprotic solvent to give 5 to 35% by weight of polyamic acid solution. The ratio of (a), (b), and (c) is selected to afford a family of polyimides having different molecular weights and properties. The mixture first forms a polyamic acid precursor. Upon heating at or above 300° C., the polyamic acids form polyimides, which are particularly suitable for use as a high temperature coating, adhesive, thin film, or composite matrix resin.
    Type: Grant
    Filed: April 1, 2002
    Date of Patent: August 17, 2004
    Assignee: The United States of America as represented by the Administrator of the National Aeronautics and Space Administration
    Inventor: Ruth H. Pater
  • Publication number: 20040158024
    Abstract: The present invention is directed to low dielectric polymers and to methods of producing these low dielectric constant polymers, dielectric materials and layers, and electronic components. In one aspect of the present invention, an isomeric mixture of thermosetting monomers, wherein the monomers have a core structure and a plurality of arms, is provided, and the isomeric mixture of thermosetting monomers is polymerized, wherein polymerization comprises a reaction of an ethynyl group that is located in at least one arm of a monomer.
    Type: Application
    Filed: March 11, 2004
    Publication date: August 12, 2004
    Inventors: Kreisler Lau, Feng Quan Liu, Paul Apen, Boris Korolev, Emma Brouk, Ruslan Zherebin, David Nalewajek, Roger Leung
  • Patent number: 6770335
    Abstract: Polyamideimide photoalignment materials having a photosensitive diamine derivative compound with side branches, and liquid crystal display devices using such a photoalignment material, beneficially as an alignment film. A liquid crystal display device includes a first substrate with such a photoalignment material.
    Type: Grant
    Filed: September 6, 2001
    Date of Patent: August 3, 2004
    Assignee: LG.Philips LCD Co., Ltd.
    Inventors: Hyun Ho Shin, Mi Sook Nam, Su Hyun Park, Moonhor Ree, Seung Woo Lee
  • Patent number: 6770733
    Abstract: A film-formable polyimide copolymer, which comprises two kinds of tetracarboxylic acid dianhydride consisting of (A) pyromellitic acid dianhydride and (B) 3,3′,4,4′-benzophenonetetracarboxylic acid dianhydride, and (C) 6-amino-2-(p-aminophenyl)benzimidazole has a heat-resistant dimensional stability without any deterioration of mechanical properties inherent in the polyimide resin when used as a film.
    Type: Grant
    Filed: January 3, 2003
    Date of Patent: August 3, 2004
    Assignee: Nippon Mektron, Limited
    Inventors: Min Zuo, Jenq-Tain Lin
  • Publication number: 20040122204
    Abstract: Processes for preparing polymers of the formula 1
    Type: Application
    Filed: December 17, 2002
    Publication date: June 24, 2004
    Applicant: Xerox Corporation.
    Inventor: Timothy P. Bender
  • Patent number: 6750317
    Abstract: Polyhydroxyamides are polymerized to form highly-crosslinked, temperature-stable polymers. The polyhydroxyamides include as their central, parent structure a benzenetricarboxylic acid to which side chains containing a terminal reactive group are attached by an amide bond. By way of this reactive group, highly crosslinked polymers can be formed. In addition, the polyhydroxyamide can be added as an additive to polymers in order to bring about three-dimensional crosslinking.
    Type: Grant
    Filed: May 31, 2002
    Date of Patent: June 15, 2004
    Assignee: Infineon Technologies AG
    Inventors: Marcus Halik, Holger Hösch, Sezi Recai, Andreas Walter
  • Patent number: 6740371
    Abstract: An alkyldiamine having excellent polymerization reactivity, a polyimide comprising it as a constituting element, and a liquid crystal alignment film excellent in uniformity of liquid crystal alignment, are presented. Namely, the present invention relates to a diaminobenzene derivative represented by the following general formula (1) and to a polyimide obtained by reacting a diamine containing at least 1 mol % of the diaminobenzene derivative represented by the general formula (1), with at least one compound selected from a tetracarboxylic. dianhydride and its derivatives, to obtain a polyimide. precursor having a reduced viscosity of from 0.05 to 5.0 dl/g (in N-methylpyrrolidone at a temperature of 30° C., concentration: 0.5 g/dl) and ring-closing it, and having a repeating unit represented by the general formula (2). Further, the present invention relates to a liquid crystal alignment film containing at least 1 mol % of the above repeating unit.
    Type: Grant
    Filed: December 26, 2001
    Date of Patent: May 25, 2004
    Assignee: Nissan Chemical Industries, Ltd.
    Inventors: Kazuyoshi Hosaka, Hideyuki Nawata, Takayasu Nihira, Hideyuki Isogai, Hideyuki Endou, Hiroyoshi Fukuro
  • Patent number: 6737503
    Abstract: The aromatic diamine compound of the present invention is represented by the following formula (1), and from the aromatic diamine compound a polyimide having a repeating unit represented by the following formula (4), which has low-temperature adherability, can be obtained. In the formulas (1) and (4), n is an integer of 3 to 7, each R is independently an atom or a group selected from the group consisting of a hydrogen atom, a halogen atom and a hydrocarbon group, the same or different two hetero atoms selected from nitrogen atoms and oxygen atoms bonded to each benzene ring are at the ortho- or meta-positions to each other on at least one benzene ring, and when n is 3, the hetero atoms are at the ortho- or meta-positions to each other on all the benzene rings. In the formula (4), Y is a tetravalent organic group.
    Type: Grant
    Filed: September 3, 2002
    Date of Patent: May 18, 2004
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Yoichi Kodama, Minehiro Mori, Naoshi Nagai, Masaru Kawaguchi
  • Patent number: 6737502
    Abstract: A solvent-free, catalyst-free and contamination-free method of synthesis of polyimides is disclosed. The method includes polymerizing a diamine with 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane dianhydride (6FDA) at a pressure of 0.1-760 mm Hg, preferably a reduced pressure at about 36 mm Hg, and a temperature of 90-400° C., preferably 10-240° C.
    Type: Grant
    Filed: June 6, 2002
    Date of Patent: May 18, 2004
    Assignee: Chung-Shan Institute of Science & Technology
    Inventor: Shean-Jeng Jong
  • Patent number: 6734276
    Abstract: The invention is a polyimide, random copolymer having repeating units of the formula (1): wherein R1 and R2 each represent a divalent group selected from and R1 and R2 may be the same or different; and x=0.60 to 0.80, y+z=0.40 to 0.20, and x+y+z=1.00, and a linear expansion coefficient at 100 to 200° C. is in the range of from 10 to 20 ppm/K. This is a useful polyimide that can be a polyimide circuit substrate material capable of keeping flat, neither shrinking nor expanding in its laminate.
    Type: Grant
    Filed: April 11, 2002
    Date of Patent: May 11, 2004
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Wataru Yamashita, Katsuji Watanabe, Takahisa Oguchi
  • Patent number: 6716956
    Abstract: Disclosed is a process for preparing a polymer of the formula wherein x is an integer of 0 or 1, A is one of several specific groups, such as B is one of several specified groups, such as or mixtures thereof, and n is an integer representing the number of repeating monomer units, said process comprising (A) providing a reaction mixture which comprises (i) a solvent, (ii) a compound of the formula (iii) a compound of the formula (iv) a compound of the formula wherein a is an integer of from 1 to 5, R′ is a hydrogen atom, an alkyl group, an aryl group, an arylalkyl group, an alkylaryl group, an alkoxy group, an aryloxy group, an arylalkyloxy group, an alkylaryloxy group, a polyalkyleneoxy group, or a mixture thereof, and (v) a carbonate base; and (B) heating the reaction mixture and removing generated water from the reaction mixture, thereby effecting a polymerization reaction.
    Type: Grant
    Filed: January 9, 2002
    Date of Patent: April 6, 2004
    Assignee: Xerox Corporation
    Inventors: Timothy P. Bender, Christine J. DeVisser, Richard A. Burt, Paul F. Smith, Marko D. Saban
  • Patent number: 6713590
    Abstract: A low dielectric constant material has a polymeric network that is fabricated from a first and a second component. The first component comprises a polymeric strand, and the second component comprises a molecule having a central portion with at least three arms extending from the central portion, wherein each of the arms includes a backbone with a reactive group. The first component and the second component form the polymeric network in a reaction that involves at least one of the reactive groups when the first and second components are thermally activated. Contemplated low dielectric constant materials are advantageously employed in the fabrication of electronic devices, and particularly contemplated devices include integrated circuits.
    Type: Grant
    Filed: December 3, 2001
    Date of Patent: March 30, 2004
    Assignee: Honeywell International Inc.
    Inventors: Kreisler S. Lau, Feng Quan Liu, Boris Korolev, Emma Brouk, Ruslan Zherebin, David Nalewajek
  • Patent number: 6713597
    Abstract: A process for the preparation of a reactive friable polyimide powder comprises dissolving an aromatic dianhydride and an organic diamine in a high-boiling, aprotic organic solvent to form a reaction solution; heating the reaction solution under imidization conditions to form an insoluble reactive polyimide and to effect substantially complete distillation of the water of reaction out of the reaction solution; and separating the insoluble reactive polyimide from the reaction solution to form a reactive friable polyimide powder.
    Type: Grant
    Filed: March 19, 2002
    Date of Patent: March 30, 2004
    Assignee: General Electric Company
    Inventor: Martin John Lindway
  • Patent number: 6710160
    Abstract: Disclosed are a polyamic acid having repeating units represented by the formula (1): wherein the norbornane skeleton of comprises four components of and their contents satisfy the following: 1%≦2,5-[diexo]≦90%, 1%≦2,5-[exo,endo]≦90%, 1%≦2,6-[diexo]≦90%, 1% ≦2,6-[exo,endo]≦90%, provided that (2,5-[diexo])+(2,5-[exo,endo])+(2,6-[diexo])+(2,6-[exo,endo])=100%, R represents from 4 to 27 carbon atoms, and represents a tetravalent group selected from the group consisting of an aliphatic group, a monocyclic aliphatic group, a condensed polycyclic aliphatic group, a monocyclic aromatic group, a condensed polycyclic aromatic group, and a non-condensed polycyclic aliphatic or aromatic group which is composed of cycloaliphatic or aromatic groups mutually bonded to each other either directly or via a crosslinking member; and a polyimide
    Type: Grant
    Filed: March 20, 2002
    Date of Patent: March 23, 2004
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Wataru Yamashita, Katsuji Watanabe, Hideaki Oikawa, Hisato Ito
  • Patent number: 6693162
    Abstract: The present invention provides a polyimide resin, a resin composition, an adhesive solution, a film-state joining component, and an adhesive laminate film soluble in a solvent having excellent heat resistance and adhesion, capable of bonding and curing at relatively low temperatures.
    Type: Grant
    Filed: October 9, 2001
    Date of Patent: February 17, 2004
    Assignee: Kaneka Japan Corporation
    Inventors: Hiroyuki Tsuji, Hiroyuki Furutani, Koichiro Tanaka, Takeshi Kikuchi
  • Patent number: 6680363
    Abstract: An acid dianhydride, together with a diamine, is heated in an organic polar solvent in the presence of &ggr;-caprolactone or &bgr;-butyrolactone as an acid catalyst to prepare a polyimide having an average molecular weight of 10,000 to 300,000. This production process can realize the production of a polyimide which is soluble in a solvent and has high processability and stability.
    Type: Grant
    Filed: January 23, 2002
    Date of Patent: January 20, 2004
    Assignee: Hitachi Cable, Ltd.
    Inventors: Katsumoto Hosokawa, Yuuki Honda, Seiji Kamimura, Yoshiyuki Ando, Kenji Asano
  • Patent number: 6653433
    Abstract: A polyimide film that exhibits improved peel strength when clad with a metal layer is prepared by reacting a polyamic acid polymer and an esterified polyamic acid oligomer. The esterified oligomer has from two to twenty repeating units and at least two crosslinkable groups selected from the group consisting of carbonyl, cyano, hydroxy, alkyne, maleimide, norbornene and sulfonyl groups. The polyamic acid is dissolved in a solvent to form a polyamic acid solution, which has a minimum gel-film forming temperature, or a minimum green film forming temperature, associated therewith. The esterified polyamic acid oligomer has an imidization temperature, which is higher than the minimum gel-film forming temperature, or the minimum green film forming temperature, of the polyamic acid solution.
    Type: Grant
    Filed: May 4, 2001
    Date of Patent: November 25, 2003
    Assignee: E. I. du Pont de Nemours and Company
    Inventors: James Richard Edman, Meredith Lynn White
  • Patent number: 6649697
    Abstract: A hyperbranched polyetherketone and a heat-resistant blend of polyvinylchloride with the same. The polyethereketone is synthesized by self-polycondensation of 3,5-bis[4-[(2,3,4,5,6-pentafluorophenyl)carbonyl]phenoxy]-4-hydroxbenzophenone or 3,5-difluoro-4-hydroxybenzophenone, and then substituting 50 to 80 mole % of fluorine atoms present in the side chains and ends of the PEK molecule by polar groups. In addition, a blend of polyvinylchloride can be manufactured using the hyperbranched polyetherketone by a melt blending technique applicable for industrial purpose at a temperature of 180 to 120° C., and thus the blend of polyvinylchloride with the polyetherekentone can be applied to high temperature end-use products such as hot water pipes.
    Type: Grant
    Filed: January 9, 2002
    Date of Patent: November 18, 2003
    Assignee: Polyplus Co., Ltd.
    Inventors: Seung-yeop Kwak, Dae-up Ahn
  • Patent number: 6642348
    Abstract: The present invention provides PMR-type polyimides that exhibit lower melt viscosities than PMR-type polyimides of the prior art. These PMR-type polyimides are created by incorporating flexible linkages, such as kinked structures and twisted or non-coplanar moietes into the backbone structure of the PMR. Specifically, the present invention provides for the production of PMR-type polyimides having 2,2′-disubstituted biaryls in the polymer backbone.
    Type: Grant
    Filed: March 2, 2001
    Date of Patent: November 4, 2003
    Assignee: The University of Akron
    Inventors: Ronald Eby, Michael Meador, Christopher Gariepy
  • Patent number: 6639042
    Abstract: New hyperbranched polymers having repeating units of the formula The polymer is prepared by the polymerization of the AB2 monomer N-{3,5-bis(4-hydroxybenzoyl)benzene}-4-fluoroisophthalimide.
    Type: Grant
    Filed: February 27, 2002
    Date of Patent: October 28, 2003
    Assignee: The United States of America as represented by the Secretary of the Air Force
    Inventors: Jong-Beom Baek, Loon-Seng Tan
  • Patent number: 6632847
    Abstract: Polymer composition, membrane comprising the same, process for production thereof and use thereof The composition described comprises 30 to 99.5% by weight of a sulfonated aromatic polyether ketone which has an ion-exchange capacity of from 1.3 to 4.0 meq (—SO3H)/g of polymer, and from 0.5 to 70% by weight of a polybenzimidazole. This composition can, as can a sulfonated polyether ketone of PEK type, be processed to give membranes, preferably used in fuel cells.
    Type: Grant
    Filed: October 22, 2001
    Date of Patent: October 14, 2003
    Assignee: Celanese Ventures GmbH
    Inventors: Thomas Soczka-Guth, Georg Frank, Jochen Baurmeister, Jürgen Pawlik, Rüdiger Knauf
  • Patent number: 6632886
    Abstract: The present invention refers to an optical film comprising one or more polyarylates having at least some units represented by the general structure: wherein A represents one or more different bisphenolfluorene radicals having the general formula (I):  wherein R1 and R2 independently represent an alkyl group, a halogen, an alkoxy group, an acyl group, a phenyl group or a nitrile group, with the proviso that R1 and R2 are not both an alkyl group; R3, R4, R5 and R6 represent a hydrogen atom, an alkyl group, a halogen, an alkoxy group, an acyl group, a phenyl group, a nitro group, or a nitrile group; B represents one or more different dicarboxy radicals having the formula:  wherein X is a divalent hydrocarbon group having from 1 to 20 carbon atoms, and n is the number of the repeating units which build up the polymer and is a positive integer higher than 20.
    Type: Grant
    Filed: April 10, 2001
    Date of Patent: October 14, 2003
    Assignee: Ferrania, S.p.A.
    Inventors: Simone Angiolini, Mauro Avidano, Paolo Salvarani, Roberto Bracco
  • Publication number: 20030176621
    Abstract: Disclosed is a process for preparing a polymer of the formula 1
    Type: Application
    Filed: January 9, 2002
    Publication date: September 18, 2003
    Applicant: Xerox Corporation
    Inventors: Timothy P. Bender, Christine J. DeVisser, Richard A. Burt, Paul F. Smith, Marko D. Saban
  • Patent number: 6600006
    Abstract: A polyamic ester prepared by partially substituting hydrogen atoms of carboxylic groups of a polyamic acid with acid labile groups, the polyamic ester comprising one or more repeating units represented by Formula 1, and each of at least one terminal of the polyamic ester molecule terminates with the same or different reactive end-capping monomer: wherein in Formula 1, R1 and R2 are independently a hydrogen atom, or an acid labile group; X is a tetravalent, an aromatic or an aliphatic organic group; Y is a divalent, an aromatic or an aliphatic organic group; and m is an integer equal to or greater than 1.
    Type: Grant
    Filed: December 31, 2001
    Date of Patent: July 29, 2003
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Myung Sup Jung, Sung Kyung Jung, Yong Young Park, Bong Seok Moon, Bong Kyu Kim
  • Publication number: 20030125503
    Abstract: An optical film containing polyaryletherketone and a method of producing the optical film, the optical film being excellent in the heat resistance and uniformity, and the film having a negative birefringence. The optical film compensates birefringence of a liquid crystal display, thereby providing an optical element or an image display device that has desired color tones and viewing-angle characteristics. The optical film having a negative birefringence of 0.001 to 0.6 is produced by coating a solution containing polyaryletherketone on a substrate and subsequently drying the coating.
    Type: Application
    Filed: November 1, 2002
    Publication date: July 3, 2003
    Inventors: Michie Sakamoto, Amane Mochizuki
  • Patent number: 6586561
    Abstract: Sulfonated polyimide polymers incorporating bulky monomers are disclosed. The polymers have a liquid crystalline structure and exhibit high conductivity, high water uptake and water stability over a range of relative humidities and temperatures. The polymers are particularly adapted for use as a polymer electrolyte membrane in fuel cells.
    Type: Grant
    Filed: February 18, 2000
    Date of Patent: July 1, 2003
    Assignee: Case Western Reserve University
    Inventors: Morton H. Litt, Robert F. Savinell, Jesse S. Wainright, Yue Zhang
  • Patent number: 6586555
    Abstract: This invention provides processes of the preparation of polyamides, polyimides, and polyamideimides, which are easy to purify after reactions, from polycarboxylic acids and polyamines in high yield without side reactions such as a change of color to black by direct polycondensation reaction with heat, especially processes of preparing aromatic polyamides (aramids), aromatic polyimides, and aromatic polyamideimides, which are difficult to synthesize in direct polycondensation reaction. Polyamides, polymides, and polyamideimides are prepared in high yield by the polycondensation of aromatic dicarboxylic acids, aromatic tetracarboxylic acids or aromatic tricarboxylic acids and aromatic diamines, using arylboric acids such as 3,4,5-trifluorophenylboric acids as polycondensation catalysts, in a mixed solvent of pentamethylbenzene and N-methylpyrrolidinone or a mixed solvent of m-terphenyl and N-butylpyrrolidinone.
    Type: Grant
    Filed: September 12, 2001
    Date of Patent: July 1, 2003
    Assignee: Japan Science and Technology Corporation
    Inventors: Kazuaki Ishihara, Hisashi Yamamoto
  • Publication number: 20030105269
    Abstract: The present invention is envisioned to improve sliding characteristics of polyether aromatic ketone resins and to provide their molded articles which are themselves resistant to damage and abrasion, cause no such damage or abrasion to their partner parts and can be easily molded. Thus, the present invention pertains to a polyether aromatic ketone resin composition comprising a polyether aromatic ketone resin and a high-hardness filler having a Mohs hardness of 6 or higher, the content of said filler being 1 to 100 parts by weight per 100 parts by weight of said ketone resin, and furthermore to a film or sheet made of the resin composition. The high-hardness filler having a Mohs hardness of 6 or higher is preferably particulate or spherical in particle shape. Also, the maximal particle size of said high-hardness filler is preferably not larger than 100 &mgr;m.
    Type: Application
    Filed: October 4, 2002
    Publication date: June 5, 2003
    Inventor: Arihiro Kanada