Imide-containing Reactant Patents (Class 528/322)
  • Patent number: 6492030
    Abstract: The present invention relates to a thermosetting low dielectric resin composition, a laminate for use in printed wiring, a laminate for a circuit, and the like. The present invention's thermosetting low dielectric resin composition contains a specific siloxane denatured polyimide, a compound having two or more allyl or methylallyl groups, and a compound having two or more maleimide groups. This resin composition adheres extremely well to metals with a low dielectric constant and low dielectric dissipation factor, and demonstrates very little scattering of the resin during operational processes like punching or cutting. By using laminates or laminates for circuits that employ this resin composition, electrical signals can be propagated more quickly, enabling signals to be processed at faster speeds.
    Type: Grant
    Filed: September 28, 2000
    Date of Patent: December 10, 2002
    Assignee: Tomoegawa Paper Co., Ltd.
    Inventors: Takeshi Hashimoto, Masaharu Kobayashi, Takeshi Sato, Daisuke Orino
  • Publication number: 20020183479
    Abstract: The invention relates to a semi-aromatic polyamide containing at least tetramethylene terephthalamide units and also hexamethylene terephthalamide units.
    Type: Application
    Filed: March 29, 2002
    Publication date: December 5, 2002
    Inventors: Rudy Rulkens, Robert C.B. Crombach
  • Patent number: 6489435
    Abstract: The improved polyamide production method of the present invention is characterized by including a step of accurately regulating the molar balance between a diamine component and a dicarboxylic acid component to a desired balance in a batch-wise regulation tank, thereby preparing a slurry liquid substantially free from the amidation reaction. The slurry liquid thus prepared is fed to a batch-wise or continuous polymerization reactor, where the amidation reaction is proceeded to easily produce polyamide having a desired balance of the diamine component and the dicarboxylic acid component without causing a problem such as foaming, solidification, etc.
    Type: Grant
    Filed: January 19, 2001
    Date of Patent: December 3, 2002
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Kazumi Tanaka, Hideyuki Kurose
  • Patent number: 6479620
    Abstract: A process for making nylon 6, in which caprolactam and water are reacted in a multistage reactive distillation column.
    Type: Grant
    Filed: June 1, 2001
    Date of Patent: November 12, 2002
    Assignee: E. I. du Pont de Nemours and Company
    Inventors: Stuart B. Fergusson, Ernest Keith Marchildon, Ahmet Turgut Mutel
  • Publication number: 20020161163
    Abstract: Disclosed is a member of nylon 12 having a relative viscosity of from 1.9 to 3.5 when measured in 98% sulfuric acid at a concentration of 10 g/dm3 and at 25° C. and a melt flow rate of 0.1 g/10 min. or more when measured at 235° C.
    Type: Application
    Filed: August 7, 2001
    Publication date: October 31, 2002
    Applicant: Ube Industries, Ltd.
    Inventors: Noriyuki Isobe, Tetsuji Hirano, Kouichiro Kurachi, Nobuhiro Ogawa
  • Patent number: 6472501
    Abstract: Process for making Nylon 6,6 by reacting adiponitrile, hexamethylenediamine and steam in a multistage distillation column reactor.
    Type: Grant
    Filed: June 1, 2001
    Date of Patent: October 29, 2002
    Assignee: E. I. du Pont de Nemours and Company
    Inventors: Stuart B. Fergusson, Ernest Keith Marchildon, Ahmet Turgut Mutel
  • Patent number: 6469130
    Abstract: A nonwoven web and method of preparing a novel nonwoven web of synthetic fiber are disclosed. An aqueous solution amide crosslinked synthetic precursor polymer is extruded under defined conditions through a plurality of die orifices to form a plurality of threadlines. The threadlines are attenuated with a defined primary gaseous source to form fiber under conditions of controlled macro scale turbulence and under conditions sufficient to permit the viscosity of each threadline, as it leaves a die orifice and for a distance of no more than about 8 cm, to increase incrementally with increasing distance from the die, while substantially maintaining uniformity of viscosity in the radial direction, at a rate sufficient to provide fiber having,the desired attenuation and mean fiber diameter without significant fiber breakage. The attenuated threadlines are dried with a defined secondary gaseous source. The resulting fibers are deposited randomly on a moving foraminous surface to form a substantially uniform web.
    Type: Grant
    Filed: July 26, 2000
    Date of Patent: October 22, 2002
    Assignee: Kimberly-Clark Worldwide, Inc.
    Inventors: Jian Qin, Yong Li, Wendy Lynn Van Dyke, Anthony John Wisneski, Palani Raj Ramaswami Wallajapet, Hannong Rhim
  • Patent number: 6451956
    Abstract: In a photoconductive element comprising a conductive support, e.g., an electrically conductive film, drum or belt on which a negatively chargeable photoconductive layer is formed, an electrical barrier layer is formed between the support and the photoconductive layer. The barrier layer provides a high energy barrier to the injection of positive charges but transports electrons under an applied electric field. The barrier layer of the invention transports charge by electronic rather than ionic mechanisms and, therefore, is not substantially affected by humidity changes. The barrier layer comprises a polyester-co-imide, polyesterionomer-co-imide or polyamide-co-imide having covalently bonded as repeating units in the polymer chain, aromatic tetracarboxylbisimide groups of the formula: wherein Ar1 and Ar2 represent, respectively, tetravalent and trivalent aromatic groups of 6 to 20 carbon atoms.
    Type: Grant
    Filed: June 8, 2001
    Date of Patent: September 17, 2002
    Assignee: Nex Press Solutions LLC
    Inventors: Louis J. Sorriero, Marie B. O'Regan, Michel F. Molaire
  • Patent number: 6423817
    Abstract: A process for preparing inherently light- and heat-stabilized polyamides comprises polymerizing in the presence of at least one triacetonediamine compound of the formula where R is hydrogen or hydrocarbyl having from 1 to 20 carbon atoms, preferably alkyl having from 1 to 18 carbon atoms, or benzyl.
    Type: Grant
    Filed: December 31, 1996
    Date of Patent: July 23, 2002
    Assignee: BASF Aktiengesellschaft
    Inventors: Klaus Weinerth, Karlheinz Mell, Paul Matthies, Ludwig Beer
  • Patent number: 6420045
    Abstract: The present invention relates to a multilayer structure comprising a material covered with a copolymer having polyamide blocks and hydrophilic blocks where the copolymer has a melting point of less than 135° C.
    Type: Grant
    Filed: June 23, 2000
    Date of Patent: July 16, 2002
    Assignee: Atofina
    Inventors: Heike Faulhammer, Yves Aubert, Thierry Briffaud, Hermann Josef Hilgers, Didier Roumilhac
  • Patent number: 6414105
    Abstract: An aromatic polycarbodiimide comprising a structural unit represented by the following formula (I): where R is an organic group having 3 or more carbon atoms, and n is an integer of 2 to 300, and a polycarbodiimide solution, a polycarbodiimide sheet, and an insulated coated electric wire which are prepared using the aromatic polycarbodiimide. The aromatic polycarbodiimide has high solubility in an organic solvent, satisfactory workability, and excellent heat resistance and humidity resistance. The insulated coated electric wire has excellent durability and is highly reliable under high pressure, high humidity conditions.
    Type: Grant
    Filed: March 1, 2001
    Date of Patent: July 2, 2002
    Assignee: Nitto Denko Corporation
    Inventors: Sadahito Misumi, Michie Sakamoto, Takami Hikita, Michio Satsuma, Amane Mochizuki
  • Publication number: 20020082383
    Abstract: In the production of polyamide by the melt-polymerization of the present invention, the polymerization conditions are rapidly and accurately controlled by a near-infrared spectroscopy to enable the efficient production of a desired polyamide with a good stability in its quality.
    Type: Application
    Filed: December 18, 2001
    Publication date: June 27, 2002
    Inventors: Hideyuki Kurose, Kazumi Tanaka
  • Patent number: 6407197
    Abstract: Aqueous dispersion of a polymer, which polymer has been obtained by subjecting a starting polymer which contains maleic anhydride monomer units and vinyl aromatic monomer units to an imidization reaction, the starting polymer containing 7-50 mole % maleic anhydride monomer units and the imidization reaction having been carried out in such a way that at most 75% of the maleic anhydride monomer units has been imidized.
    Type: Grant
    Filed: September 1, 2000
    Date of Patent: June 18, 2002
    Assignee: DSM N.V.
    Inventors: Hendrik J. Van Den Berg, Mathijs H. G. Maassen, Laurentius W. Steenbakkers
  • Patent number: 6403757
    Abstract: A reaction between epoxy-terminated polyamide and an acid anhydride compound can yield a modified polyamide resin, into resin skeleton of which carboxy groups to react with epoxy resin are introduced. An adhesive agent having excellent heat-resistance can be provided by the use of a composition of this modified polyamide resin and epoxy resin. Furthermore, an adhesive tape for a semiconductor device having excellent properties can be produced by laminating the adhesive agent and the protective layer on one surface of an organic insulated film.
    Type: Grant
    Filed: January 7, 2000
    Date of Patent: June 11, 2002
    Assignee: Kanegafuchi Kagaku Kogyo Kabushiki Kaisah
    Inventors: Katsunori Yabuta, Kiyokazu Akahori, Yasushi Nishikawa
  • Patent number: 6399737
    Abstract: A composition comprises a thermoplastic resin and an electromagnetic shielding agent that contains a synergistic combination of metal-coated fibers and metal fibers. The composition provides effective EMI-shielding at low levels of the electromagnetic shielding agent. Also described are methods of preparing the composition, as well as pellets and articles comprising the composition and its reaction products.
    Type: Grant
    Filed: September 21, 2001
    Date of Patent: June 4, 2002
    Assignee: General Electric Company
    Inventor: Mark D. Elkovitch
  • Patent number: 6395868
    Abstract: Polyacetylene compounds and process for the preparation thereof from a chiral dihydroxy amide are described. The compounds preferably have diacyl groups attached to the amide. The compounds are useful for making films which are electrically conductive, near infrared absorbing, polarizing, and have the characteristic optical and other properties of polyacetylenes.
    Type: Grant
    Filed: August 23, 2000
    Date of Patent: May 28, 2002
    Assignee: Board of Trustees of Michigan State University
    Inventors: Rawle I. Hollingsworth, Guijun Wang
  • Patent number: 6395869
    Abstract: A high molecular weight polyester-amide block copolymer is produced by reacting a mixture of lower molecular weight polyester and polyamide in the melt with a carbonyl bislactam, especially carbonyl biscaprolactam. The higher molecular weight block copolymer may be obtained in as short a time as 2 minutes, whereas, at least about 10 minutes is required in a conventional process, under comparable conditions, using a bislactam.
    Type: Grant
    Filed: January 31, 2001
    Date of Patent: May 28, 2002
    Assignee: DSM N.V.
    Inventors: Jacobus A. Loontjens, Bartholomeus J. M. Plum
  • Patent number: 6392007
    Abstract: At least two different liquid streams are sub-divided into a dense plurality of individually separated parallel pixels oriented in respective misregistered arrays. Therefore, an individual pixel of one of the liquid stream arrays will be surrounded by pixels of the other liquid stream array. These individual pixel arrays are then bought into contact with one another to form a multi-pixel liquid stream comprised of the misregistered pixel arrays of the two different liquid streams. The “pixelated” liquid stream—that is, the liquid stream containing in cross-section the misregistered pixel arrays of the two different liquid streams—may then be further processed. For example, the pixelated liquid stream may be subjected to further mixing by being directed along a tortuous flow path.
    Type: Grant
    Filed: December 30, 1999
    Date of Patent: May 21, 2002
    Assignee: BASF Corporation
    Inventors: Karl H. Buchanan, Wendel L. Burton, Charles F. Helms, Jr., John A. Hodan, Gary W. Shore
  • Patent number: 6384181
    Abstract: A method of producing a polyamide resin by reacting with at least one diamine compounds at least one linear polyester resin consisting of at least one dicarboxylic acid component and at least one diol component and having an intrinsic viscosity of not less than 0.2 dl/g, so that the at least one diol component of the linear polyester resin is substituted by the diamine compound, resulting in the polyamide resin as a reaction product, wherein the improvement comprises: at least one of a carboxylic acid-activator and an inorganic salt being present in a reaction system of the linear polyester resin and the diamine compound.
    Type: Grant
    Filed: June 28, 2000
    Date of Patent: May 7, 2002
    Assignee: M & S Research and Development Co., Ltd.
    Inventor: Seiko Nakano
  • Patent number: 6372880
    Abstract: A copolymer having a weight-average molecular weight of 1,000 to 100,000 which comprises, as repeating structure units, both of a succinimide unit represented by the structural formula (1) and a hydroxycarboxylic acid unit represented by the structural formula (2) wherein R is a methyl group or a hydrogen atom, and a process for preparing a copolymer which comprises a polymerization step of heating a mixture of aspartic acid and a cyclic ester compound.
    Type: Grant
    Filed: December 23, 1998
    Date of Patent: April 16, 2002
    Assignee: Mitsui Chemicals, Inc.
    Inventors: Hosei Shinoda, Yukiko Asou, Hiroaki Tamatani
  • Publication number: 20020042497
    Abstract: In the process of the present invention, a recovered polyamide is used as a part of the raw materials for producing polyamide. By carrying out the polycondensation under a condition such that the recovered polyamide is dissolved in the reaction system during the polycondensation, the properties of the polyamide being produced are not deteriorated as compared with those of polyamide which is produced without using the recovered polyamide. By changing the addition amount of the recovered polyamide, the crystallization speed of the resultant polyamide is controlled or increased as compared when produced without using the recovered polyamide.
    Type: Application
    Filed: September 28, 2001
    Publication date: April 11, 2002
    Inventors: Takatoshi Shida, Kazumi Tanaka
  • Patent number: 6355750
    Abstract: A thermoplastic or thermosetting adhesive for bonding an electronic component to a substrate in which the adhesive is cured in situ from a curable composition comprises one or more poly- or mono-functional maleimide compounds, or one or more poly- or mono-functional vinyl compounds other than maleimide compounds, or a combination of maleimide and vinyl compounds, a curing initiator and optionally, one or more fillers.
    Type: Grant
    Filed: April 14, 2000
    Date of Patent: March 12, 2002
    Assignee: National Starch and Chemical Investment Holding Corporation
    Inventor: Donald E. Herr
  • Patent number: 6355737
    Abstract: The process for producing polymer blends by reacting at least one aminonitrile with water in the presence of thermoplastic polymers and optionally further polyamide-forming monomers comprises the following steps: (1) reacting at least one aminonitrile with water at a temperature from 90 to 400° C. and a pressure from 0.1 to 35×106 Pa to obtain a reaction mixture, (2) further reacting the reaction mixture at a temperature from 150 to 400° C.
    Type: Grant
    Filed: August 16, 2000
    Date of Patent: March 12, 2002
    Assignee: BASF Aktiengesellschaft
    Inventors: Ralf Mohrschladt, Martin Weber, Volker Hildebrandt
  • Patent number: 6355357
    Abstract: A flexible printed board, in which a polyimide resulting from the imidation of a polyamic acid obtained by the addition polymerization of diamines and acid dianhydrides is formed as an insulating layer on a metal foil, is characterized in that the diamines include specific imidazolyl-diaminoazines represented by the formula 1; (where A is an imidazolyl group; R1 is an alkylene group; m is 0 or 1; R2 is an alkyl group; n is 0, 1, or 2; R3 and R4 are alkylene groups; p and q are each 0 or 1; and B is an azine residue, diazine residue, or triazine residue).
    Type: Grant
    Filed: December 8, 1999
    Date of Patent: March 12, 2002
    Assignee: Sony Chemicals Corp.
    Inventors: Satoshi Takahashi, Hidetsugu Namiki
  • Patent number: 6353085
    Abstract: In a process for producing polyamides by polymerization of lactams in the presence of metal oxides as heterogeneous catalysts, the metal oxides are used in a form which permits mechanical removal from the reaction mixture and are removed from the reaction mixture in the course of or on completion of the polymerization.
    Type: Grant
    Filed: August 16, 2000
    Date of Patent: March 5, 2002
    Assignee: BASF Aktiengesellschaft
    Inventors: Ralf Mohrschladt, Volker Hildebrandt, Gunter Pipper, Eberhard Fuchs
  • Publication number: 20020022712
    Abstract: The invention relates to a randomly branched polyamide comprising at least units derived from:
    Type: Application
    Filed: June 18, 2001
    Publication date: February 21, 2002
    Inventors: Atze J. Nijenhuis, Rene Aberson, Boudewijn J.R. Scholtens
  • Patent number: 6348563
    Abstract: The present invention provides a p-hydroxybenzoic ester represented by the formula (1) wherein R1 represents a C6-C10 straight-chain or branched-chain alkyl group, A1 represents a C2-C4 alkylene group and n in an integer of 1 to 8, a plasticizer for at least one polyamide resin selected from nylon 11 and nylon 12 which comprises the ester, a polyamide resin composition comprising the ester and at least one polyamide resin selected from nylon 11 and nylon 12, and a polyamide resin molded article comprising the ester and having excellent high-temperature volatilization resistance and low-temperature impact resistance.
    Type: Grant
    Filed: August 27, 1999
    Date of Patent: February 19, 2002
    Assignee: New Japan Chemical Co., Ltd.
    Inventors: Hideo Fukuda, Yoshifumi Fujitani, Ryuichi Kohzu
  • Patent number: 6348562
    Abstract: A process of increasing the melt processing of synthetic polyamides, in particular pigmented and/or filled synthetic polyamide, by adding thereto an additive having the formula (I) wherein R1 represents a methyl group as such or in the form of a stabilizer masterbatch composition. The invention also relates to modified synthetic polyamides obtainable by this process having improved properties due to the stabilization effect of the compound of the above formula (I).
    Type: Grant
    Filed: January 13, 1999
    Date of Patent: February 19, 2002
    Assignee: Clariant Finance (BVI) Limited
    Inventors: Bansi Lal Kaul, Jan Malik, Mohamed Sidqi
  • Patent number: 6346598
    Abstract: A thermosetting low-dielectric resin composition which has a low dielectric constant and a low dielectric tangent for use in a printed circuit board and which has excellent adhesion to a metal and scatters almost no resin when used for forming a prepreg by punching or cutting, the composition comprising a component (a): siloxane-modified polyimide, component (b): a compound containing 2 methylallyl groups and having the following formula (1) or a compound containing 3 allyl groups or 3 methylallyl groups and having the following formula (1A), and component (c): a compound containing at least 2 maleimide groups, wherein R is a hydrogen atom or methyl group.
    Type: Grant
    Filed: November 3, 1999
    Date of Patent: February 12, 2002
    Assignee: Tomoegawa Paper Co., Ltd.
    Inventors: Takeshi Hashimoto, Masaharu Kobayashi, Takeshi Sato, Daisuke Orino
  • Publication number: 20020013444
    Abstract: A curable composition is placed on a candle, and then the composition is exposed to curing conditions such as ultraviolet light, to thereby cure the coating composition and provide a candle having a cured coating. The curable composition may be the reaction product of TMPTA (trimethylolpropanetriacrylate), itself the reaction product of trimethylolpropane and acrylic acid) and oleyl amine (an unsaturated primary amine having eighteen carbons). The candle may be made of wax or a gelled solvent, i.e., a mixture of gellant and solvent, particularly a hydrocarbon or other low polarity solvent. The undiluted coating may be applied by spraying on the oily surface of the candle. Ultraviolet cure of the coating occurs in 1-2 seconds.
    Type: Application
    Filed: June 4, 2001
    Publication date: January 31, 2002
    Inventors: Raymond H. Jones, Charles D. Moses, Ronald L. Gordon
  • Publication number: 20020012862
    Abstract: In a photoconductive element comprising a conductive support, e.g., an electrically conductive film, drum or belt on which a negatively chargeable photoconductive layer is formed, an electrical barrier layer is formed between the support and the photoconductive layer. The barrier layer provides a high energy barrier to the injection of positive charges but transports electrons under an applied electric field. The barrier layer of the invention transports charge by electronic rather than ionic mechanisms and, therefore, is not substantially affected by humidity changes.
    Type: Application
    Filed: June 8, 2001
    Publication date: January 31, 2002
    Applicant: NexPress Solutions, LLC
    Inventors: Louis J. Sorriero, Marie B. O'Regan, Michel F. Molaire
  • Publication number: 20020010306
    Abstract: Disclosed is a member of nylon 12 having a relative viscosity of from 1.9 to 3.5 when measured in 98% sulfuric acid at a concentration of 10 g/dm3 and at 25° C. and a melt flow rate of 0.1 g/10 min. or more when measured at 235° C.
    Type: Application
    Filed: August 7, 2001
    Publication date: January 24, 2002
    Applicant: Ube Industries, Ltd.
    Inventors: Noriyuki Isobe, Tetsuji Hirano, Kouichiro Kurachi, Nobuhiro Ogawa
  • Patent number: 6340739
    Abstract: A polyamide having repeating units represented by formula (1), wherein R1 represents a divalent hydrocarbon residue optionally having in the structure a heteroatom having no active hydrogen. The polyamide has a high refractive index, is biodegradable, and is useful as a material for fibers and plastics.
    Type: Grant
    Filed: October 20, 2000
    Date of Patent: January 22, 2002
    Assignees: Cosmo Research Institute, Cosmo Oil Co., Ltd.
    Inventors: Kiyotaka Shigehara, Yoshihiro Katayama, Seiji Nishikawa, Yasushi Hotta
  • Publication number: 20020007041
    Abstract: Polyamides including functional groups and methods of preparing such polyamides. The polyamides are useful, for example, to prepare filaments.
    Type: Application
    Filed: January 9, 2001
    Publication date: January 17, 2002
    Inventor: George E. Zahr
  • Publication number: 20020007042
    Abstract: A thermoplastic or thermosetting adhesive for bonding an electronic component to a substrate in which the adhesive is cured in situ from a curable composition comprises one or more poly- or mono-functional maleimide compounds, or one or more poly- or mono-functional vinyl compounds other than maleimide compounds, or a combination of maleimide and vinyl compounds, a curing initiator and optionally, one or more fillers.
    Type: Application
    Filed: February 1, 2001
    Publication date: January 17, 2002
    Inventors: Donald E. Herr, Rose Ann Schultz
  • Publication number: 20020007040
    Abstract: A process for increasing the relative viscosity (RV) of a reactant polyamide and to products produced by the process. The process includes contacting the reactant polyamide and a chain extender compound, forming the product, and quenching the product when its RV is near its maximum calculated RV value.
    Type: Application
    Filed: January 10, 2001
    Publication date: January 17, 2002
    Inventor: George E Zahr
  • Patent number: 6337384
    Abstract: A method of making a thermally-removable epoxy by mixing a bis(maleimide) compound to a monomeric furan compound containing an oxirane group to form a di-epoxy mixture and then adding a curing agent at temperatures from approximately room temperature to less than approximately 90° C. to form a thermally-removable epoxy. The thermally-removable epoxy can be easily removed within approximately an hour by heating to temperatures greater than approximately 90° C. in a polar solvent. The epoxy material can be used in protecting electronic components that may require subsequent removal of the solid material for component repair, modification or quality control.
    Type: Grant
    Filed: January 18, 2000
    Date of Patent: January 8, 2002
    Assignee: Sandia Corporation
    Inventors: Douglas A. Loy, David R. Wheeler, Edward M. Russick, James R. McElhanon, Randall S. Saunders
  • Publication number: 20020002267
    Abstract: A process for making a polyamide substrate characterized by enhanced breaking strength and fade resistance is disclosed. The process features the steps of treating a polyamide substrate, preferably a nylon 6 substrate having a hindered amine light stabilizer chemically bound thereto, with an effective amount of an ultraviolet inhibitor, an antioxidant and optionally, a dye, in the presence of a swelling agent for the polyamide that is also a solvent for the ultraviolet inhibitor and the antioxidant to impart high breaking strength to the substrate. A life preserver or other type of buoyancy device may be made from the process. A polyamide fabric comprising a dye, an ultraviolet inhibitor and an antioxidant also is disclosed. When a polyamide fiber of the present invention is exposed to sunlight, the useful life of the fiber is greatly increased compared to untreated polyamide fiber.
    Type: Application
    Filed: May 23, 2001
    Publication date: January 3, 2002
    Applicant: AlliedSignal
    Inventor: Donald Ray Long
  • Patent number: 6329494
    Abstract: A 6,6′-dialkyl-3,3′4,4′-biphenyltetracarboxylic dianhydride is prepared by brominating a 4-alkylphthalic anhydride at its 5-position, and coupling the bromination product in the presence of a nickel catalyst; A photosensitive resin composition containing a polyimide precursor having repetitive units of general formula (7) is applied onto a substrate, exposed to i-line, developed and heated to form a polyimide relief pattern wherein Y is a divalent organic group, R7 and R8 are OH or a monovalent organic group, R9 and R10 are a monovalent hydrocarbon group, R11, R12 and R13 are a monovalent hydrocarbon group, a and b are an integer of 0 to 2, c is an integer of 0 to 4, and m is an integer of 0 to 3.
    Type: Grant
    Filed: November 1, 1999
    Date of Patent: December 11, 2001
    Assignees: Hitachi Chemical DuPont MicroSystems Ltd., Hitachi Chemical DuPont MicroSystems L.L.C.
    Inventors: Noriyoshi Arai, Makoto Kaji, Akihiro Sasaki, Toshiki Hagiwara
  • Patent number: 6326457
    Abstract: A process for continuous extraction of polyamide particles using a recirculating extractant in a vertical extraction column that is divided into two zones comprises treating the polyamide with an aqueous extractant comprising from 40 to 95% by weight of &egr;-caprolactam in a first zone at from 100 to 140° C., and then effecting an aftertreatment with water in a second zone. The caprolactam can then be extracted in a conventional manner. The process provides for economical production of polyamide having a low dimer content.
    Type: Grant
    Filed: May 11, 2000
    Date of Patent: December 4, 2001
    Assignee: BASF Aktiengesellschaft
    Inventors: Jörg Erbes, Alfons Ludwig, Gunter Pipper
  • Patent number: 6327521
    Abstract: A method for controlling the properties of the product polymer of a polymerization process to improve the process productivity and product quality in both batch and continuous production of polyamides.
    Type: Grant
    Filed: May 28, 1998
    Date of Patent: December 4, 2001
    Assignee: E.I. du Pont de Nemours and Company
    Inventor: James Merrill Prober
  • Patent number: 6320017
    Abstract: The present invention relates to new polyamide oligomers. These oligomers can be conjugated to lipids, nucleic acids, peptides, proteins, etc. The oligomer-lipid conjugates can be used to form liposomes, virusomes, micelles, etc., optionally containing drugs or biological agents. The polyamide oligomers are heterobifunctional allowing the attachment of other suitable ligand compounds (e.g., a targeting moiety). In addition, methods of use for the liposomes, virusomes, micelles, etc., are provided.
    Type: Grant
    Filed: December 22, 1998
    Date of Patent: November 20, 2001
    Assignee: INEX Pharmaceuticals Corp.
    Inventor: Steven Michial Ansell
  • Patent number: 6316587
    Abstract: The present invention provides a polyamide composition comprising: a polyamide containing an alkylene oxide group; and a metal salt. The polyamide composition of the present invention has long lasting antistatic properties and a lower surface resistivity than the polyamide alone.
    Type: Grant
    Filed: October 29, 1999
    Date of Patent: November 13, 2001
    Assignee: Industrial Technology Research Institute
    Inventors: Yuung-Ching Sheen, Jen-Lien Lin, Jiang-Jen Lin, Meng-Yao Yang
  • Publication number: 20010039326
    Abstract: An aromatic polycarbodiimide comprising a structural unit represented by the following formula (I): 1
    Type: Application
    Filed: March 1, 2001
    Publication date: November 8, 2001
    Inventors: Sadahito Misumi, Michie Sakamoto, Takami Hikita, Michio Satsuma, Amane Mochizuki
  • Patent number: 6313258
    Abstract: An aromatic polycarbodiimide having a specified structural unit is disclosed. The aromatic polycarbodiimide can give films, moldings, adhesives and the like each having excellent characteristics such as high heat resistance, high dimensional stability, high moisture resistance or the like, and therefore is suitable for use as a heat resistant covering material in, for example, production of electronic parts.
    Type: Grant
    Filed: July 14, 2000
    Date of Patent: November 6, 2001
    Assignee: Nitto Denko Corporation
    Inventors: Michie Sakamoto, Amane Mochizuki, Michiharu Yamamoto
  • Patent number: 6313248
    Abstract: Thermosetting polymers with high temperature capability and superior oxidative stability for composite and adhesive applications are disclosed. These polymers are ideally suited for adhesives and RTM, resin film infusion, and prepreg methods to make polymer matrix, fiber reinforced composite parts.
    Type: Grant
    Filed: November 13, 1996
    Date of Patent: November 6, 2001
    Assignee: Cytec Technology Corp.
    Inventors: Jack Douglas Boyd, Albert Kuo
  • Publication number: 20010037011
    Abstract: A process for forming an amide bond comprising reacting a carboxylic acid with an amine carboxylate salt, in the presence of an inorganic base.
    Type: Application
    Filed: March 8, 2001
    Publication date: November 1, 2001
    Inventor: Armin Rossler
  • Publication number: 20010037010
    Abstract: The invention relates to carbodiimide-based block copolymers, a method of preparing them and also their use as hydrolysis stabilizers in ester-group-containing polymers.
    Type: Application
    Filed: March 20, 2001
    Publication date: November 1, 2001
    Inventors: Heiko Tebbe, Ludger Heiliger, Volker Muller
  • Publication number: 20010031852
    Abstract: The synthesis of dimethyl-1,5-naphthalenedicarboxylate and polymers and articles formed therefrom is disclosed, as well as applications for dimethyl-1,5-naphthalenedicarboxylate, its corresponding acid 1,5-NDA, and various synthesis intermediates.
    Type: Application
    Filed: January 12, 2001
    Publication date: October 18, 2001
    Inventors: John A. Macek, Bruce I. Rosen, Juergen K. Holzhauer, John S. Bramlet, Larry D. Lillwitz, David J. Schneider, Lawrence L. Lang, Edward E. Paschke, John M. Weis, Yenamandra Viswanath, Stefanos L. Sakellarides
  • Patent number: 6300463
    Abstract: Thermoplastic elastomeric polymers which contain polyether blocks having tetramethylene ether repeat units, and polyamide blocks, have improved elastomeric properties such as higher unload power and lower tensile set, when the polyether blocks also contain 2-alkyltetramethylene ether repeat units. The polymers are useful as molding resins and for fibers.
    Type: Grant
    Filed: January 4, 2000
    Date of Patent: October 9, 2001
    Assignee: E. I. du Pont de Nemours and Company
    Inventors: Garret Daniel Figuly, Marc Bruce Goldfinger