Imide-containing Reactant Patents (Class 528/322)
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Patent number: 6492030Abstract: The present invention relates to a thermosetting low dielectric resin composition, a laminate for use in printed wiring, a laminate for a circuit, and the like. The present invention's thermosetting low dielectric resin composition contains a specific siloxane denatured polyimide, a compound having two or more allyl or methylallyl groups, and a compound having two or more maleimide groups. This resin composition adheres extremely well to metals with a low dielectric constant and low dielectric dissipation factor, and demonstrates very little scattering of the resin during operational processes like punching or cutting. By using laminates or laminates for circuits that employ this resin composition, electrical signals can be propagated more quickly, enabling signals to be processed at faster speeds.Type: GrantFiled: September 28, 2000Date of Patent: December 10, 2002Assignee: Tomoegawa Paper Co., Ltd.Inventors: Takeshi Hashimoto, Masaharu Kobayashi, Takeshi Sato, Daisuke Orino
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Publication number: 20020183479Abstract: The invention relates to a semi-aromatic polyamide containing at least tetramethylene terephthalamide units and also hexamethylene terephthalamide units.Type: ApplicationFiled: March 29, 2002Publication date: December 5, 2002Inventors: Rudy Rulkens, Robert C.B. Crombach
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Patent number: 6489435Abstract: The improved polyamide production method of the present invention is characterized by including a step of accurately regulating the molar balance between a diamine component and a dicarboxylic acid component to a desired balance in a batch-wise regulation tank, thereby preparing a slurry liquid substantially free from the amidation reaction. The slurry liquid thus prepared is fed to a batch-wise or continuous polymerization reactor, where the amidation reaction is proceeded to easily produce polyamide having a desired balance of the diamine component and the dicarboxylic acid component without causing a problem such as foaming, solidification, etc.Type: GrantFiled: January 19, 2001Date of Patent: December 3, 2002Assignee: Mitsubishi Gas Chemical Company, Inc.Inventors: Kazumi Tanaka, Hideyuki Kurose
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Patent number: 6479620Abstract: A process for making nylon 6, in which caprolactam and water are reacted in a multistage reactive distillation column.Type: GrantFiled: June 1, 2001Date of Patent: November 12, 2002Assignee: E. I. du Pont de Nemours and CompanyInventors: Stuart B. Fergusson, Ernest Keith Marchildon, Ahmet Turgut Mutel
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Publication number: 20020161163Abstract: Disclosed is a member of nylon 12 having a relative viscosity of from 1.9 to 3.5 when measured in 98% sulfuric acid at a concentration of 10 g/dm3 and at 25° C. and a melt flow rate of 0.1 g/10 min. or more when measured at 235° C.Type: ApplicationFiled: August 7, 2001Publication date: October 31, 2002Applicant: Ube Industries, Ltd.Inventors: Noriyuki Isobe, Tetsuji Hirano, Kouichiro Kurachi, Nobuhiro Ogawa
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Patent number: 6472501Abstract: Process for making Nylon 6,6 by reacting adiponitrile, hexamethylenediamine and steam in a multistage distillation column reactor.Type: GrantFiled: June 1, 2001Date of Patent: October 29, 2002Assignee: E. I. du Pont de Nemours and CompanyInventors: Stuart B. Fergusson, Ernest Keith Marchildon, Ahmet Turgut Mutel
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Patent number: 6469130Abstract: A nonwoven web and method of preparing a novel nonwoven web of synthetic fiber are disclosed. An aqueous solution amide crosslinked synthetic precursor polymer is extruded under defined conditions through a plurality of die orifices to form a plurality of threadlines. The threadlines are attenuated with a defined primary gaseous source to form fiber under conditions of controlled macro scale turbulence and under conditions sufficient to permit the viscosity of each threadline, as it leaves a die orifice and for a distance of no more than about 8 cm, to increase incrementally with increasing distance from the die, while substantially maintaining uniformity of viscosity in the radial direction, at a rate sufficient to provide fiber having,the desired attenuation and mean fiber diameter without significant fiber breakage. The attenuated threadlines are dried with a defined secondary gaseous source. The resulting fibers are deposited randomly on a moving foraminous surface to form a substantially uniform web.Type: GrantFiled: July 26, 2000Date of Patent: October 22, 2002Assignee: Kimberly-Clark Worldwide, Inc.Inventors: Jian Qin, Yong Li, Wendy Lynn Van Dyke, Anthony John Wisneski, Palani Raj Ramaswami Wallajapet, Hannong Rhim
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Patent number: 6451956Abstract: In a photoconductive element comprising a conductive support, e.g., an electrically conductive film, drum or belt on which a negatively chargeable photoconductive layer is formed, an electrical barrier layer is formed between the support and the photoconductive layer. The barrier layer provides a high energy barrier to the injection of positive charges but transports electrons under an applied electric field. The barrier layer of the invention transports charge by electronic rather than ionic mechanisms and, therefore, is not substantially affected by humidity changes. The barrier layer comprises a polyester-co-imide, polyesterionomer-co-imide or polyamide-co-imide having covalently bonded as repeating units in the polymer chain, aromatic tetracarboxylbisimide groups of the formula: wherein Ar1 and Ar2 represent, respectively, tetravalent and trivalent aromatic groups of 6 to 20 carbon atoms.Type: GrantFiled: June 8, 2001Date of Patent: September 17, 2002Assignee: Nex Press Solutions LLCInventors: Louis J. Sorriero, Marie B. O'Regan, Michel F. Molaire
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Patent number: 6423817Abstract: A process for preparing inherently light- and heat-stabilized polyamides comprises polymerizing in the presence of at least one triacetonediamine compound of the formula where R is hydrogen or hydrocarbyl having from 1 to 20 carbon atoms, preferably alkyl having from 1 to 18 carbon atoms, or benzyl.Type: GrantFiled: December 31, 1996Date of Patent: July 23, 2002Assignee: BASF AktiengesellschaftInventors: Klaus Weinerth, Karlheinz Mell, Paul Matthies, Ludwig Beer
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Patent number: 6420045Abstract: The present invention relates to a multilayer structure comprising a material covered with a copolymer having polyamide blocks and hydrophilic blocks where the copolymer has a melting point of less than 135° C.Type: GrantFiled: June 23, 2000Date of Patent: July 16, 2002Assignee: AtofinaInventors: Heike Faulhammer, Yves Aubert, Thierry Briffaud, Hermann Josef Hilgers, Didier Roumilhac
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Patent number: 6414105Abstract: An aromatic polycarbodiimide comprising a structural unit represented by the following formula (I): where R is an organic group having 3 or more carbon atoms, and n is an integer of 2 to 300, and a polycarbodiimide solution, a polycarbodiimide sheet, and an insulated coated electric wire which are prepared using the aromatic polycarbodiimide. The aromatic polycarbodiimide has high solubility in an organic solvent, satisfactory workability, and excellent heat resistance and humidity resistance. The insulated coated electric wire has excellent durability and is highly reliable under high pressure, high humidity conditions.Type: GrantFiled: March 1, 2001Date of Patent: July 2, 2002Assignee: Nitto Denko CorporationInventors: Sadahito Misumi, Michie Sakamoto, Takami Hikita, Michio Satsuma, Amane Mochizuki
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Publication number: 20020082383Abstract: In the production of polyamide by the melt-polymerization of the present invention, the polymerization conditions are rapidly and accurately controlled by a near-infrared spectroscopy to enable the efficient production of a desired polyamide with a good stability in its quality.Type: ApplicationFiled: December 18, 2001Publication date: June 27, 2002Inventors: Hideyuki Kurose, Kazumi Tanaka
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Patent number: 6407197Abstract: Aqueous dispersion of a polymer, which polymer has been obtained by subjecting a starting polymer which contains maleic anhydride monomer units and vinyl aromatic monomer units to an imidization reaction, the starting polymer containing 7-50 mole % maleic anhydride monomer units and the imidization reaction having been carried out in such a way that at most 75% of the maleic anhydride monomer units has been imidized.Type: GrantFiled: September 1, 2000Date of Patent: June 18, 2002Assignee: DSM N.V.Inventors: Hendrik J. Van Den Berg, Mathijs H. G. Maassen, Laurentius W. Steenbakkers
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Patent number: 6403757Abstract: A reaction between epoxy-terminated polyamide and an acid anhydride compound can yield a modified polyamide resin, into resin skeleton of which carboxy groups to react with epoxy resin are introduced. An adhesive agent having excellent heat-resistance can be provided by the use of a composition of this modified polyamide resin and epoxy resin. Furthermore, an adhesive tape for a semiconductor device having excellent properties can be produced by laminating the adhesive agent and the protective layer on one surface of an organic insulated film.Type: GrantFiled: January 7, 2000Date of Patent: June 11, 2002Assignee: Kanegafuchi Kagaku Kogyo Kabushiki KaisahInventors: Katsunori Yabuta, Kiyokazu Akahori, Yasushi Nishikawa
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Patent number: 6399737Abstract: A composition comprises a thermoplastic resin and an electromagnetic shielding agent that contains a synergistic combination of metal-coated fibers and metal fibers. The composition provides effective EMI-shielding at low levels of the electromagnetic shielding agent. Also described are methods of preparing the composition, as well as pellets and articles comprising the composition and its reaction products.Type: GrantFiled: September 21, 2001Date of Patent: June 4, 2002Assignee: General Electric CompanyInventor: Mark D. Elkovitch
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Patent number: 6395868Abstract: Polyacetylene compounds and process for the preparation thereof from a chiral dihydroxy amide are described. The compounds preferably have diacyl groups attached to the amide. The compounds are useful for making films which are electrically conductive, near infrared absorbing, polarizing, and have the characteristic optical and other properties of polyacetylenes.Type: GrantFiled: August 23, 2000Date of Patent: May 28, 2002Assignee: Board of Trustees of Michigan State UniversityInventors: Rawle I. Hollingsworth, Guijun Wang
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Patent number: 6395869Abstract: A high molecular weight polyester-amide block copolymer is produced by reacting a mixture of lower molecular weight polyester and polyamide in the melt with a carbonyl bislactam, especially carbonyl biscaprolactam. The higher molecular weight block copolymer may be obtained in as short a time as 2 minutes, whereas, at least about 10 minutes is required in a conventional process, under comparable conditions, using a bislactam.Type: GrantFiled: January 31, 2001Date of Patent: May 28, 2002Assignee: DSM N.V.Inventors: Jacobus A. Loontjens, Bartholomeus J. M. Plum
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Patent number: 6392007Abstract: At least two different liquid streams are sub-divided into a dense plurality of individually separated parallel pixels oriented in respective misregistered arrays. Therefore, an individual pixel of one of the liquid stream arrays will be surrounded by pixels of the other liquid stream array. These individual pixel arrays are then bought into contact with one another to form a multi-pixel liquid stream comprised of the misregistered pixel arrays of the two different liquid streams. The “pixelated” liquid stream—that is, the liquid stream containing in cross-section the misregistered pixel arrays of the two different liquid streams—may then be further processed. For example, the pixelated liquid stream may be subjected to further mixing by being directed along a tortuous flow path.Type: GrantFiled: December 30, 1999Date of Patent: May 21, 2002Assignee: BASF CorporationInventors: Karl H. Buchanan, Wendel L. Burton, Charles F. Helms, Jr., John A. Hodan, Gary W. Shore
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Patent number: 6384181Abstract: A method of producing a polyamide resin by reacting with at least one diamine compounds at least one linear polyester resin consisting of at least one dicarboxylic acid component and at least one diol component and having an intrinsic viscosity of not less than 0.2 dl/g, so that the at least one diol component of the linear polyester resin is substituted by the diamine compound, resulting in the polyamide resin as a reaction product, wherein the improvement comprises: at least one of a carboxylic acid-activator and an inorganic salt being present in a reaction system of the linear polyester resin and the diamine compound.Type: GrantFiled: June 28, 2000Date of Patent: May 7, 2002Assignee: M & S Research and Development Co., Ltd.Inventor: Seiko Nakano
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Patent number: 6372880Abstract: A copolymer having a weight-average molecular weight of 1,000 to 100,000 which comprises, as repeating structure units, both of a succinimide unit represented by the structural formula (1) and a hydroxycarboxylic acid unit represented by the structural formula (2) wherein R is a methyl group or a hydrogen atom, and a process for preparing a copolymer which comprises a polymerization step of heating a mixture of aspartic acid and a cyclic ester compound.Type: GrantFiled: December 23, 1998Date of Patent: April 16, 2002Assignee: Mitsui Chemicals, Inc.Inventors: Hosei Shinoda, Yukiko Asou, Hiroaki Tamatani
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Publication number: 20020042497Abstract: In the process of the present invention, a recovered polyamide is used as a part of the raw materials for producing polyamide. By carrying out the polycondensation under a condition such that the recovered polyamide is dissolved in the reaction system during the polycondensation, the properties of the polyamide being produced are not deteriorated as compared with those of polyamide which is produced without using the recovered polyamide. By changing the addition amount of the recovered polyamide, the crystallization speed of the resultant polyamide is controlled or increased as compared when produced without using the recovered polyamide.Type: ApplicationFiled: September 28, 2001Publication date: April 11, 2002Inventors: Takatoshi Shida, Kazumi Tanaka
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Patent number: 6355750Abstract: A thermoplastic or thermosetting adhesive for bonding an electronic component to a substrate in which the adhesive is cured in situ from a curable composition comprises one or more poly- or mono-functional maleimide compounds, or one or more poly- or mono-functional vinyl compounds other than maleimide compounds, or a combination of maleimide and vinyl compounds, a curing initiator and optionally, one or more fillers.Type: GrantFiled: April 14, 2000Date of Patent: March 12, 2002Assignee: National Starch and Chemical Investment Holding CorporationInventor: Donald E. Herr
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Patent number: 6355737Abstract: The process for producing polymer blends by reacting at least one aminonitrile with water in the presence of thermoplastic polymers and optionally further polyamide-forming monomers comprises the following steps: (1) reacting at least one aminonitrile with water at a temperature from 90 to 400° C. and a pressure from 0.1 to 35×106 Pa to obtain a reaction mixture, (2) further reacting the reaction mixture at a temperature from 150 to 400° C.Type: GrantFiled: August 16, 2000Date of Patent: March 12, 2002Assignee: BASF AktiengesellschaftInventors: Ralf Mohrschladt, Martin Weber, Volker Hildebrandt
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Patent number: 6355357Abstract: A flexible printed board, in which a polyimide resulting from the imidation of a polyamic acid obtained by the addition polymerization of diamines and acid dianhydrides is formed as an insulating layer on a metal foil, is characterized in that the diamines include specific imidazolyl-diaminoazines represented by the formula 1; (where A is an imidazolyl group; R1 is an alkylene group; m is 0 or 1; R2 is an alkyl group; n is 0, 1, or 2; R3 and R4 are alkylene groups; p and q are each 0 or 1; and B is an azine residue, diazine residue, or triazine residue).Type: GrantFiled: December 8, 1999Date of Patent: March 12, 2002Assignee: Sony Chemicals Corp.Inventors: Satoshi Takahashi, Hidetsugu Namiki
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Patent number: 6353085Abstract: In a process for producing polyamides by polymerization of lactams in the presence of metal oxides as heterogeneous catalysts, the metal oxides are used in a form which permits mechanical removal from the reaction mixture and are removed from the reaction mixture in the course of or on completion of the polymerization.Type: GrantFiled: August 16, 2000Date of Patent: March 5, 2002Assignee: BASF AktiengesellschaftInventors: Ralf Mohrschladt, Volker Hildebrandt, Gunter Pipper, Eberhard Fuchs
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Publication number: 20020022712Abstract: The invention relates to a randomly branched polyamide comprising at least units derived from:Type: ApplicationFiled: June 18, 2001Publication date: February 21, 2002Inventors: Atze J. Nijenhuis, Rene Aberson, Boudewijn J.R. Scholtens
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Patent number: 6348563Abstract: The present invention provides a p-hydroxybenzoic ester represented by the formula (1) wherein R1 represents a C6-C10 straight-chain or branched-chain alkyl group, A1 represents a C2-C4 alkylene group and n in an integer of 1 to 8, a plasticizer for at least one polyamide resin selected from nylon 11 and nylon 12 which comprises the ester, a polyamide resin composition comprising the ester and at least one polyamide resin selected from nylon 11 and nylon 12, and a polyamide resin molded article comprising the ester and having excellent high-temperature volatilization resistance and low-temperature impact resistance.Type: GrantFiled: August 27, 1999Date of Patent: February 19, 2002Assignee: New Japan Chemical Co., Ltd.Inventors: Hideo Fukuda, Yoshifumi Fujitani, Ryuichi Kohzu
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Patent number: 6348562Abstract: A process of increasing the melt processing of synthetic polyamides, in particular pigmented and/or filled synthetic polyamide, by adding thereto an additive having the formula (I) wherein R1 represents a methyl group as such or in the form of a stabilizer masterbatch composition. The invention also relates to modified synthetic polyamides obtainable by this process having improved properties due to the stabilization effect of the compound of the above formula (I).Type: GrantFiled: January 13, 1999Date of Patent: February 19, 2002Assignee: Clariant Finance (BVI) LimitedInventors: Bansi Lal Kaul, Jan Malik, Mohamed Sidqi
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Patent number: 6346598Abstract: A thermosetting low-dielectric resin composition which has a low dielectric constant and a low dielectric tangent for use in a printed circuit board and which has excellent adhesion to a metal and scatters almost no resin when used for forming a prepreg by punching or cutting, the composition comprising a component (a): siloxane-modified polyimide, component (b): a compound containing 2 methylallyl groups and having the following formula (1) or a compound containing 3 allyl groups or 3 methylallyl groups and having the following formula (1A), and component (c): a compound containing at least 2 maleimide groups, wherein R is a hydrogen atom or methyl group.Type: GrantFiled: November 3, 1999Date of Patent: February 12, 2002Assignee: Tomoegawa Paper Co., Ltd.Inventors: Takeshi Hashimoto, Masaharu Kobayashi, Takeshi Sato, Daisuke Orino
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Publication number: 20020013444Abstract: A curable composition is placed on a candle, and then the composition is exposed to curing conditions such as ultraviolet light, to thereby cure the coating composition and provide a candle having a cured coating. The curable composition may be the reaction product of TMPTA (trimethylolpropanetriacrylate), itself the reaction product of trimethylolpropane and acrylic acid) and oleyl amine (an unsaturated primary amine having eighteen carbons). The candle may be made of wax or a gelled solvent, i.e., a mixture of gellant and solvent, particularly a hydrocarbon or other low polarity solvent. The undiluted coating may be applied by spraying on the oily surface of the candle. Ultraviolet cure of the coating occurs in 1-2 seconds.Type: ApplicationFiled: June 4, 2001Publication date: January 31, 2002Inventors: Raymond H. Jones, Charles D. Moses, Ronald L. Gordon
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Publication number: 20020012862Abstract: In a photoconductive element comprising a conductive support, e.g., an electrically conductive film, drum or belt on which a negatively chargeable photoconductive layer is formed, an electrical barrier layer is formed between the support and the photoconductive layer. The barrier layer provides a high energy barrier to the injection of positive charges but transports electrons under an applied electric field. The barrier layer of the invention transports charge by electronic rather than ionic mechanisms and, therefore, is not substantially affected by humidity changes.Type: ApplicationFiled: June 8, 2001Publication date: January 31, 2002Applicant: NexPress Solutions, LLCInventors: Louis J. Sorriero, Marie B. O'Regan, Michel F. Molaire
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Publication number: 20020010306Abstract: Disclosed is a member of nylon 12 having a relative viscosity of from 1.9 to 3.5 when measured in 98% sulfuric acid at a concentration of 10 g/dm3 and at 25° C. and a melt flow rate of 0.1 g/10 min. or more when measured at 235° C.Type: ApplicationFiled: August 7, 2001Publication date: January 24, 2002Applicant: Ube Industries, Ltd.Inventors: Noriyuki Isobe, Tetsuji Hirano, Kouichiro Kurachi, Nobuhiro Ogawa
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Patent number: 6340739Abstract: A polyamide having repeating units represented by formula (1), wherein R1 represents a divalent hydrocarbon residue optionally having in the structure a heteroatom having no active hydrogen. The polyamide has a high refractive index, is biodegradable, and is useful as a material for fibers and plastics.Type: GrantFiled: October 20, 2000Date of Patent: January 22, 2002Assignees: Cosmo Research Institute, Cosmo Oil Co., Ltd.Inventors: Kiyotaka Shigehara, Yoshihiro Katayama, Seiji Nishikawa, Yasushi Hotta
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Publication number: 20020007041Abstract: Polyamides including functional groups and methods of preparing such polyamides. The polyamides are useful, for example, to prepare filaments.Type: ApplicationFiled: January 9, 2001Publication date: January 17, 2002Inventor: George E. Zahr
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Publication number: 20020007042Abstract: A thermoplastic or thermosetting adhesive for bonding an electronic component to a substrate in which the adhesive is cured in situ from a curable composition comprises one or more poly- or mono-functional maleimide compounds, or one or more poly- or mono-functional vinyl compounds other than maleimide compounds, or a combination of maleimide and vinyl compounds, a curing initiator and optionally, one or more fillers.Type: ApplicationFiled: February 1, 2001Publication date: January 17, 2002Inventors: Donald E. Herr, Rose Ann Schultz
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Publication number: 20020007040Abstract: A process for increasing the relative viscosity (RV) of a reactant polyamide and to products produced by the process. The process includes contacting the reactant polyamide and a chain extender compound, forming the product, and quenching the product when its RV is near its maximum calculated RV value.Type: ApplicationFiled: January 10, 2001Publication date: January 17, 2002Inventor: George E Zahr
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Patent number: 6337384Abstract: A method of making a thermally-removable epoxy by mixing a bis(maleimide) compound to a monomeric furan compound containing an oxirane group to form a di-epoxy mixture and then adding a curing agent at temperatures from approximately room temperature to less than approximately 90° C. to form a thermally-removable epoxy. The thermally-removable epoxy can be easily removed within approximately an hour by heating to temperatures greater than approximately 90° C. in a polar solvent. The epoxy material can be used in protecting electronic components that may require subsequent removal of the solid material for component repair, modification or quality control.Type: GrantFiled: January 18, 2000Date of Patent: January 8, 2002Assignee: Sandia CorporationInventors: Douglas A. Loy, David R. Wheeler, Edward M. Russick, James R. McElhanon, Randall S. Saunders
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Publication number: 20020002267Abstract: A process for making a polyamide substrate characterized by enhanced breaking strength and fade resistance is disclosed. The process features the steps of treating a polyamide substrate, preferably a nylon 6 substrate having a hindered amine light stabilizer chemically bound thereto, with an effective amount of an ultraviolet inhibitor, an antioxidant and optionally, a dye, in the presence of a swelling agent for the polyamide that is also a solvent for the ultraviolet inhibitor and the antioxidant to impart high breaking strength to the substrate. A life preserver or other type of buoyancy device may be made from the process. A polyamide fabric comprising a dye, an ultraviolet inhibitor and an antioxidant also is disclosed. When a polyamide fiber of the present invention is exposed to sunlight, the useful life of the fiber is greatly increased compared to untreated polyamide fiber.Type: ApplicationFiled: May 23, 2001Publication date: January 3, 2002Applicant: AlliedSignalInventor: Donald Ray Long
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Patent number: 6329494Abstract: A 6,6′-dialkyl-3,3′4,4′-biphenyltetracarboxylic dianhydride is prepared by brominating a 4-alkylphthalic anhydride at its 5-position, and coupling the bromination product in the presence of a nickel catalyst; A photosensitive resin composition containing a polyimide precursor having repetitive units of general formula (7) is applied onto a substrate, exposed to i-line, developed and heated to form a polyimide relief pattern wherein Y is a divalent organic group, R7 and R8 are OH or a monovalent organic group, R9 and R10 are a monovalent hydrocarbon group, R11, R12 and R13 are a monovalent hydrocarbon group, a and b are an integer of 0 to 2, c is an integer of 0 to 4, and m is an integer of 0 to 3.Type: GrantFiled: November 1, 1999Date of Patent: December 11, 2001Assignees: Hitachi Chemical DuPont MicroSystems Ltd., Hitachi Chemical DuPont MicroSystems L.L.C.Inventors: Noriyoshi Arai, Makoto Kaji, Akihiro Sasaki, Toshiki Hagiwara
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Patent number: 6326457Abstract: A process for continuous extraction of polyamide particles using a recirculating extractant in a vertical extraction column that is divided into two zones comprises treating the polyamide with an aqueous extractant comprising from 40 to 95% by weight of &egr;-caprolactam in a first zone at from 100 to 140° C., and then effecting an aftertreatment with water in a second zone. The caprolactam can then be extracted in a conventional manner. The process provides for economical production of polyamide having a low dimer content.Type: GrantFiled: May 11, 2000Date of Patent: December 4, 2001Assignee: BASF AktiengesellschaftInventors: Jörg Erbes, Alfons Ludwig, Gunter Pipper
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Patent number: 6327521Abstract: A method for controlling the properties of the product polymer of a polymerization process to improve the process productivity and product quality in both batch and continuous production of polyamides.Type: GrantFiled: May 28, 1998Date of Patent: December 4, 2001Assignee: E.I. du Pont de Nemours and CompanyInventor: James Merrill Prober
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Patent number: 6320017Abstract: The present invention relates to new polyamide oligomers. These oligomers can be conjugated to lipids, nucleic acids, peptides, proteins, etc. The oligomer-lipid conjugates can be used to form liposomes, virusomes, micelles, etc., optionally containing drugs or biological agents. The polyamide oligomers are heterobifunctional allowing the attachment of other suitable ligand compounds (e.g., a targeting moiety). In addition, methods of use for the liposomes, virusomes, micelles, etc., are provided.Type: GrantFiled: December 22, 1998Date of Patent: November 20, 2001Assignee: INEX Pharmaceuticals Corp.Inventor: Steven Michial Ansell
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Patent number: 6316587Abstract: The present invention provides a polyamide composition comprising: a polyamide containing an alkylene oxide group; and a metal salt. The polyamide composition of the present invention has long lasting antistatic properties and a lower surface resistivity than the polyamide alone.Type: GrantFiled: October 29, 1999Date of Patent: November 13, 2001Assignee: Industrial Technology Research InstituteInventors: Yuung-Ching Sheen, Jen-Lien Lin, Jiang-Jen Lin, Meng-Yao Yang
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Publication number: 20010039326Abstract: An aromatic polycarbodiimide comprising a structural unit represented by the following formula (I): 1Type: ApplicationFiled: March 1, 2001Publication date: November 8, 2001Inventors: Sadahito Misumi, Michie Sakamoto, Takami Hikita, Michio Satsuma, Amane Mochizuki
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Patent number: 6313258Abstract: An aromatic polycarbodiimide having a specified structural unit is disclosed. The aromatic polycarbodiimide can give films, moldings, adhesives and the like each having excellent characteristics such as high heat resistance, high dimensional stability, high moisture resistance or the like, and therefore is suitable for use as a heat resistant covering material in, for example, production of electronic parts.Type: GrantFiled: July 14, 2000Date of Patent: November 6, 2001Assignee: Nitto Denko CorporationInventors: Michie Sakamoto, Amane Mochizuki, Michiharu Yamamoto
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Patent number: 6313248Abstract: Thermosetting polymers with high temperature capability and superior oxidative stability for composite and adhesive applications are disclosed. These polymers are ideally suited for adhesives and RTM, resin film infusion, and prepreg methods to make polymer matrix, fiber reinforced composite parts.Type: GrantFiled: November 13, 1996Date of Patent: November 6, 2001Assignee: Cytec Technology Corp.Inventors: Jack Douglas Boyd, Albert Kuo
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Publication number: 20010037011Abstract: A process for forming an amide bond comprising reacting a carboxylic acid with an amine carboxylate salt, in the presence of an inorganic base.Type: ApplicationFiled: March 8, 2001Publication date: November 1, 2001Inventor: Armin Rossler
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Publication number: 20010037010Abstract: The invention relates to carbodiimide-based block copolymers, a method of preparing them and also their use as hydrolysis stabilizers in ester-group-containing polymers.Type: ApplicationFiled: March 20, 2001Publication date: November 1, 2001Inventors: Heiko Tebbe, Ludger Heiliger, Volker Muller
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Publication number: 20010031852Abstract: The synthesis of dimethyl-1,5-naphthalenedicarboxylate and polymers and articles formed therefrom is disclosed, as well as applications for dimethyl-1,5-naphthalenedicarboxylate, its corresponding acid 1,5-NDA, and various synthesis intermediates.Type: ApplicationFiled: January 12, 2001Publication date: October 18, 2001Inventors: John A. Macek, Bruce I. Rosen, Juergen K. Holzhauer, John S. Bramlet, Larry D. Lillwitz, David J. Schneider, Lawrence L. Lang, Edward E. Paschke, John M. Weis, Yenamandra Viswanath, Stefanos L. Sakellarides
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Patent number: 6300463Abstract: Thermoplastic elastomeric polymers which contain polyether blocks having tetramethylene ether repeat units, and polyamide blocks, have improved elastomeric properties such as higher unload power and lower tensile set, when the polyether blocks also contain 2-alkyltetramethylene ether repeat units. The polymers are useful as molding resins and for fibers.Type: GrantFiled: January 4, 2000Date of Patent: October 9, 2001Assignee: E. I. du Pont de Nemours and CompanyInventors: Garret Daniel Figuly, Marc Bruce Goldfinger