Abstract: The present invention relates to an isocyanate-modified photosensitive polyimide. The photosensitive polyimide of the invention possesses excellent heat resistance, chemistry resistance, and flexibility, and can be used as a liquid photo resist or dry film resist, or used in a solder resist, coverlay film, or printed wiring board.

Abstract: Disclosed are a polyamic acid containing not less than 10 mol % of a repeating unit represented by the formula [1] below, and a polyimide represented by the formula [2] below which is obtained from such a polyamic acid. The polyamic acid and polyimide have high heat resistance as shown by a thermal decomposition temperature of not less than 300° C. In addition, the polyamic acid and polyimide have good workability because of their high solubility in solvents, while exhibiting good light transmission. (In the formulae, R1 and R2 independently represent a hydrogen atom or an alkyl group having 1 to 10 carbon atoms; R3 and R4 independently represent a hydrogen atom, a halogen atom, an alkyl group having 1 to 10 carbon atoms or a phenyl group, or alternatively R3 and R4 on adjacent carbon atoms may combine together to form a cycloalkyl group having 3 to 8 carbon atoms or a phenyl group; R5 represents a divalent organic group; and n represents an integer of not less than 2.

Abstract: A room temperature crosslinkable polymer system comprising an anhydride containing polymer and an oxyalkylene amine and a polymer electrolyte derived therefrom are prepared and employed as ion conducting materials for batteries such as lithium ion battery, solar cells and electrochromic devices is disclosed.

Abstract: The present invention generally relates to anaerobically curable compositions of: (a) a cyanate ester compound having the structure of formula I: R1O—C?N)m??(I) ?wherein m is from 2 to 5 and R1 is an aromatic nucleus-containing residue; (b) a (meth)acrylate monomer; and (c) an anaerobic cure inducing composition comprising peroxide and saccharin, wherein said composition is free of added metallic catalyst.

Abstract: Compositions for producing a board and a printed circuit board produced using the composition are provided. The compositions can be used for the production of a variety of printed circuit boards.

Abstract: A cyanate ester compound represented by the formula (1), wherein Ar2 represents a phenylene group, a naphthylene group or a biphenylene group, Ar1 represents a naphthylene group or a biphenylene group when Ar2 is a phenylene group, or Ar1 represents a phenylene group, a naphthylene group or a biphenylene group when Ar2 is a naphthylene group or a biphenylene group, Rx represents all substituents of Ar1, each Rx is the same or different and represents hydrogen, an alkyl group or an aryl group, Ry represents all substituents of Ar2, each Ry is the same or different and represents hydrogen, an alkyl group or an aryl group, and n is an integer of 1 to 50.

Abstract: A photoradical generator which produces no low-molecular decomposition material but a radical during a photoradical generating process, does not generate a radical during a heating process, exists in a chemically stable state in a resulting product of a radical reaction such as a cured coating layer or the like, has high heat resistance, stability and preserving ability, and is excellent in compatibility or solubility is provided. The photoradical generator is comprised of a compound (a) having a seven-membered ring imide structure-containing group represented by the following formula (1), wherein, R1 to R8 respectively represent a hydrogen atom or a substituent and may be a cyclic structure in which they are bonded to each other.

Abstract: The present invention relates to a modified colored pigment comprising a colored pigment having an attached organic group. The organic group is attached to the colored pigment via at least one carbon atom of a C—C single bond or double bond, wherein the C—C single bond or double bond is not a component of an aromatic system. The organic group further comprises at least one activating group on at least one carbon atom of the C—C single bond or double bond. A method of preparing a modified colored pigment is also disclosed, as are aqueous and non-aqueous dispersions, e.g., including ink jet inks, comprising the modified colored pigments.

Abstract: A polyimide film which, when used in FPC production, is reduced in dimensional change during the production steps. In particular, a metal-clad laminate apt to have abnormal parts such as rumples is produced from the film, and an FPC reduced in dimensional change is obtained in high yield. The polyimide film has a tan ? peak temperature within a range of 320° C. or more and lower than 380° C. in measuring a dynamic viscoelasticity, and is characterized by having a maximum sag of 13 mm or less.

Abstract: Disclosed herein is a polyimide film having an elongation from 50 to 150%, a tensile elastic modulus from 4 to 8 GPa, a tensile strength from 150 to 500 MPa, and a hygroscopicity of 5% or less. The polyimide film has high elastic modulus and tensile strength and an excellent elongation, and thus the polyimide film exhibits excellent material properties when it is used as a base film for TAB and COF, and its properties can be usefully modified using an additive to improve productivity and processibility thereof.

Abstract: The present invention provides an endless belt superior in peelability even under a low temperature and low humidity environment. An endless belt includes: a first region and a second region, which contain a polyimide-based resin, a contact angle to water of an outer peripheral surface of each of the first region and the second region differing from each other, and a ratio of a sum total of an area of the first region and a sum total of an area of the second region being in the range of about 80:20, to about 20:80.

Abstract: Multi-armed, monofunctional, and hydrolytically stable polymers are described having the structure wherein Z is a moiety that can be activated for attachment to biologically active molecules such as proteins and wherein P and Q represent linkage fragments that join polymer arms polya and polyb, respectively, to central carbon atom, C, by hydrolytically stable linkages in the absence of aromatic rings in the linkage fragments. R typically is hydrogen or methyl, but can be a linkage fragment that includes another polymer arm. A specific example is an mPEG disubstituted lysine having the structure where mPEGa and mPEGb have the structure CH3O—(CH2CH2O)nCH2CH2— wherein n may be the same or different for polya- and polyb- and can be from 1 to about 1,150 to provide molecular weights of from about 100 to 100,000.

Abstract: Disclosed is a fluorine-containing polymerizable monomer represented by the formula [1] below. (In the formula [1], a represents an integer of 1-4.) By having a plurality of polymerizable amines in a molecule while containing a hexafluoroisopropyl group, this fluorine-containing polymerizable monomer exhibiting water repellancy, oil repellency, low water absorbency, heat resistance, weather resistance, corrosion resistance, transparency, photosensitivity, low refractive index, low dielectric properties, and the like, and thus can be applied to the field of advanced polymer materials.

Abstract: The invention relates to hydroxyl-functional binder components ABC containing a linear or branched main chain having a polymethylene structure —(CH2)n— or a polyester structure or a structure derived from the fatty acid esters of glycerin or other polyvalent alcohols. The invention is characterized in that said components have grafted cyclic imide structures on the main chain, wherein the imide-nitrogen atom is substituted by a hydroxyalkyl group or a hydroxyalkyl-aryl group. The invention also relates to method for the production of said components by reacting oleofinically unsaturated acid anhydrides B and hydroxyamines C and to the utilization of the inventive components for the formulation of binders.

Abstract: The present invention relates to a resin for optical semiconductor element encapsulation containing a polyimide which is obtained by an imidation of a polyimide precursor obtained by a polycondensation of an aliphatic acid dianhydride with an aliphatic or aromatic diamine compound; and an optical semiconductor device containing the resin and an optical semiconductor element encapsulated with the resin. The resin for optical semiconductor element encapsulation according to the present invention exhibits excellent advantages that it has a high light-transmitting property, is excellent in heat resistance, and shows an excellent light resistance even against short-wavelength light.

Abstract: This disclosure provides a method device and a method of forming the medical device. The medical device comprises a coating comprising a polymer. The polymer comprises at least two different blocks, at least one L1 block with the formula and at least one L2 block with the formula Medical devices comprising these polymers, mixtures of these polymers with therapeutic agents, and methods of making these polymers and mixtures are within the scope of this disclosure.

Abstract: The present invention is directed to hydrolytically stabilized maleimide-functionalized water soluble polymers and to methods for making and utilizing such polymers and their precursors.

Abstract: Provided herein is a coating comprising a polymer.

Abstract: A process for preparing a polyamide by reacting a mixture which comprises a monomer which has a nitrile group and has at least one other functional group capable of forming a carboxamide group, and comprises water, in the presence of titanium dioxide as catalyst, which comprises using titanium dioxide whose BET surface area, determined to the German standard DIN 66 131 volumetrically by the multipoint method, is in the range from 5 to 35 m2/g.

Abstract: A modified polyimide resin favorably employable for manufacturing an insulation film of an electric-electronic device is composed of recurring units (I) derived from a biphenyltetracarboxylic acid compound, a diamine compound, and a monoamine compound having at least one hydroxyl group and recurring units (II) derived from diisocyanate and polybutadiene having hydroxyl group at each terminal, which optionally contains further recurring units (III) derived from diisocyanate and a compound having hydroxyl group at each terminal and further having a reactive substituent.

Abstract: According to an aspect of the invention, medical devices are provided which include (a) a substrate and (b) a coating that includes an antifouling copolymer, an adhesive copolymer, or both. Antifouling copolymers for use in conjunction with the present invention contain (i) at least one antifouling polymer block having multiple pendant alkoxy functional groups along the polymer backbone and (ii) at least one additional polymer block. Adhesive copolymers for use in conjunction with the present invention contain (i) at least one adhesive polymer block having multiple pendant ring-hydroxyl-substituted aromatic groups along the polymer backbone and (ii) at least one additional polymer block.

Abstract: A process for the production of non-thermoplastic polyimide film whose precursor solution has high storage stability and which exhibits high adhesiveness even without expensive surface treatment, more specifically, a process fro the production of non-thermoplastic polyimide film made of a non-thermoplastic polyimide containing a block resulting from a thermoplastic polyimide which comprises (A) the step of forming a prepolymer having amino or an acid anhydride group at the end in an organic polar solvent (B) the step of synthesizing a polyimide precursor solution by using the obtained prepolymer, an acid anhydride, and a diamine in such a way as to become substantially equimolar over the whole step, and (C) the step of casting a film-forming dope containing the polyimide precursor solution and subjecting the resultant dope to chemical and/or thermal imidization, wherein the diamine and acid anhydride used in the step (A) are selected so that the reaction of both with each other in equimolar amounts can give a

Abstract: The present invention relates to a composition that can be used to manufacture an impermeable, sealing, tight envelope, to a process for manufacturing an impermeable envelope, and to a tank. The composition of the invention comprises in % by weight relative to the total weight of the composition: from 70 to 90% of a monomer (I); from 0.1 to 1% of an activator (II), in which R is chosen from the group comprising CnH2n+2, n being an integer chosen from 1 to 10; —OH; —OCn H2n+2, n being an integer chosen from 1 to 10; and —NHR? where R? is either CnH2n+2, n being an integer chosen from 1 to 10, or an amine functional group; from 2 to 6% of a catalyst (III), in which X is chosen from the group comprising MgBr, MgI, Li and Na; and from 10 to 20% of an additive (IV), with: This composition can be used, for example, to manufacture elements that are impermeable to fluids, for example impermeable envelopes, for example that can be used in the manufacture of type IV tanks or hydraulic accumulators.

Abstract: The invention relates to a method for the polymerization of one or more methacrylate and/or methacrylic monomers, for the synthesis of methacrylate or methacrylic polymers or of exclusively methacrylic and/or methacrylate copolymers, comprising a step of bringing said monomer(s) into contact with one at least of the compounds of formula (I) and (II) below: in which: R1 and R2 may represent a phenyl group, R3 and R4 may together form an ?N-phenyl group, Z represents a group of formula —CR8R9R10, in which R8 and R9 may represent methyl groups and R10 may represent a —COO-phenyl group.

Abstract: The invention is based on the discovery that certain well-defined compounds derived from pentacyclopentadecane dimethanol are useful components in adhesive formulations. In particular, the invention compounds described herein provide high Tg values and low shrinkage. Compounds of the invention are useful as adhesives for use in the semiconductor packaging industry.

Abstract: A polymer compound comprising a repeating unit of the following formula (1) and which is useful as a light emitting material or charge transporting material and excellent in heat resistance, fluorescent intensity and the like: (wherein, ring A and ring B represent each independently an aromatic hydrocarbon ring optionally having a substituent, at least one of ring A and ring B is an aromatic hydrocarbon ring composed of a plurality of condensed benzene rings, Rw and Rx represent each independently a hydrogen atom, alkyl group, alkoxy group or the like, and Rw and Rx may mutually bond to form a ring).

Abstract: The present invention provides a process for producing a comb polymer comprising the steps of: a) providing: (i) (w+z) molar equivalents of a monomer; (ii) one molar equivalent of an initiator compound of formula (IX), wherein B3 represents a halogen, B2 represents H or a halogen, Y1 represents a group capable of attaching the residue of an antibody or fragment thereof or capable of being converted into such a group, L represents a linker group, y is 1, 2 or 3, w is at least 1 and z is 0 or greater; (iii) a catalyst capable of catalysing the polymerisation of a plurality of the monomers to produce the comb polymer; and b) causing the catalyst to catalyse, in combination with the initiator, the polymerisation of a plurality of the monomers (i) to produce the comb polymer.

Abstract: A proton conducting membrane includes a polyimide. The polyimide includes at least one sulfonate group and is terminated by (arylethynyl)isoindoline-1,3-dione moieties. The ethynyl unsaturation allows for the thermal or catalytic cross-linking of the membrane.

Abstract: Certain poly(oxyalkylene) colorants are disclosed along with method of preparation thereof. A method of using these colorants as fluorescent security taggants is also disclosed.

Abstract: Polymers of naphthalene tetracarboxylic diimide dimmers are provided. The polymers are of the Formula I wherein the A units are selected from and Formula IX The polymers are suitable for use in the active layer of an imaging member and exhibit properties of both a binder and an electron-transporting material.

Abstract: The present invention is directed to maleamic acid derivatives of water soluble polymers, to chemically stable water-soluble polymer succinamic acid-active agent conjugates, and to methods for reproducibly preparing, characterizing and using such polymer reagents and their conjugates.

Abstract: The present invention provides a film comprising component A and component B, wherein the component A is at least one compound selected from a group consisting of aromatic polyamides, aromatic polyimides, and aromatic polyamideimides, and component B is a liquid crystal polymer showing optical anisotropy in molten state, and methods for preparing films.

Abstract: Disclosed are a copolymer of a perfluoropolyether derivative and a photosensitive polymer, a composition for forming banks comprising the copolymer, and a method for forming banks using the composition. Also disclosed is an organic thin film transistor including the composition and an electronic device including the organic thin film transistor. The use of the copolymer may enable the formation of banks by a solution coating process. Because an organic thin film transistor including banks formed by the method may be fabricated without any degradation in the characteristics of the organic thin film transistor, improved electronic properties may be exhibited.

Abstract: The present invention relates to interlayer dielectric materials and pre-applied die attach adhesives, more specifically pre-applied die attach adhesives (such as wafer and other substrate-applied die attach adhesives), methods of applying the interlayer dielectric materials onto substrates to prepare low K dielectric semiconductor chips, methods of applying the pre-applied die attach adhesives onto wafer and other substrate surfaces, and assemblies prepared therewith for connecting microelectronic circuitry.

Abstract: An encapsulant fluid is provided comprising a mixture of a diene-containing compound and a dienophilic compound. At least one of the diene-containing and the dienophilic compounds is protected so that the compounds do not substantially react with each other at room temperature. The diene-containing and the dienophilic compounds undergo a reversible Diels-Alder polymerization reaction at a polymerization temperature above room temperature to form a solid debondable polymeric encapsulant. Also provided are methods for forming slider assemblies and methods for patterning a slider surface using the encapsulant.

Abstract: The present invention relates to novel polyaspartimides, their method of production and the use of these polyaspartimides as reactive components for polyisocyanates in two-component polyurethane coating compositions. The polyaspartimides are prepared by reacting a polyether amine with a maleimide.

Abstract: A water-soluble polyimide precursor, which can be suitably applied for aromatic polyimides and exhibits a low reduction in heat resistance and mechanical properties, an aqueous solution of the polyimide precursor and a polyimide obtained from the precursor. A heat-resistant fiber impregnated material and an impregnated sheet-like material are prepared by using the precursor and a laminate is prepared by employing the precursor.

Abstract: The present invention is directed to a non-gelled, curable composition including at least one compound having a plurality of imide functional groups. The compound in particular contains a reaction product of at least one secondary monoamine and at least one maleimide, and is suitable for use in coatings and castings.

Abstract: The present invention generally relates to curable compositions free of metallic catalysts. The inventive compositions are capable of curing when applied to a metal substrate. The inventive compositions provide improved thermal performance and enhanced cure strength on oily metal surfaces.

Abstract: In the present invention, a masterbatch is produced by melt-mixing a metal compound (B) with a reactive thermoplastic resin (C). The oxidizable polyamide (A) is produced by polycondensing a diamine component containing m-xylylenediamine in an amount of 70 mol % or higher with a dicarboxylic acid component containing adipic acid in an amount of 50 mol % or higher. The metal compound (B) contains at least one metal selected from the group consisting of transition metals in group VIII of the periodic table, manganese, copper and zinc. The reactive thermoplastic resin (C) has an internal bond and/or a reactive functional group which are reactive with an amide bond and/or a reactive functional group of the oxidizable polyamide (A). The masterbatch exhibits a stable moldability. The masterbatch is melt-mixed with an oxidizable polyamide (A) and formed into a molded article which exhibits an excellent oxygen-absorbing ability irrespective of the preservation conditions of the masterbatch.

Abstract: The invention is based on the discovery that a remarkable improvement in the performance of maleimide thermosets can be achieved through the incorporation of imide-extended mono-, bis-, or polymaleimide compounds. These imide-extended maleimide compounds are readily prepared by the condensation of appropriate anhydrides with appropriate diamines to give amine terminated compounds. These compounds are then condensed with excess maleic anhydride to yield imide-extended maleimide compounds.

Abstract: Facially amphiphilic polymers and articles made therefrom having biocidal surfaces are disclosed. The polymers can inhibit the growth of microorganisms in contact with the surface or in areas adjacent to said biocidal surface. There is also disclosed a method to identify and optimize the facial amphiphilicity of polyamide, polyester, polyurea, polyurethane, polycarbonate and polyphenylene polymers. Utility as a contact disinfectant is disclosed.

Abstract: A method for improving the cohesive strength at elevated temperature of a die attach adhesive formulation of a liquid curable resin, initiator, and filler, comprises adding to the adhesive formulation an aromatic bismaleimide resin powder that does not dissolve in the curable resin.

Abstract: A cathodic electrodeposition coating composition which produces substantially pinhole-free coatings on galvanized surfaces, said composition comprising 0.2 to 8% by weight, based on the weight of resin solids in the composition, of at least one 5- or 6-membered cyclic imide having a (cyclo)alkyl or (cyclo)alkenyl residue comprising 4 to 12 carbon atoms on the imide nitrogen.

Abstract: A photosensitive resin composition of the present invention contains a (A) soluble polyimide and a (b) (meth)acrylic compound, the (A) soluble polyimide being soluble in an organic solvent and being synthesized by using an acid dianhydride component and at least one of a diamine component containing a siloxane structure or an aromatic ring structure, and a diamine component having, in its structure, a hydroxyl group a carboxyl group or a carbonyl group, and the (B) (meth)acrylic compound having at least one carbon-carbon double bond, and preferably contains at least one of a (C) photo reaction initiator and a (D) fire retardant. With this arrangement, the photosensitive resin composition of the present invention is capable of having excellent properties. Especially, the photosensitive resin composition of the present invention is so excellently useful that it can be used for electronic parts and the like.

Abstract: In the production method of polyamide of the present invention, the mole balance at a set point during melt polymerization is estimated from a pre-established equation for calculating the mole balance during melt polymerization from a melt viscosity. On the basis of the estimated mole balance, the subsequent conditions of melt polymerization of a batch and the polymerization conditions of the next and subsequent batches are determined. In addition, the mole balance, molecular weight and relative viscosity of melt-polymerized polyamide are estimated from pre-established equations each for respectively calculating the mole balance, molecular weight and relative viscosity at the end point of melt polymerization from the melt viscosity. The conditions for solid phase-polymerizing the melt-polymerized polyamide are determined on the basis of estimated values.

Abstract: Bidentate ligand of formula (I), R1R2M1-R-M2R3R4 wherein M1 and M2 each indenpendently represent P, As or Sb; R1, R2, R3 and R4 each independently represent the same or a different optionally substituted organic group and at least one of R1, R2, R3 and R4 contains a tertiary carbon atom through which the group is linked to M1 or M2; and R represents a bridging group based on a trimethylene group connecting M1 and M2 of which the middle carbon atom is double bonded to a non-metal element chosen from group 14, 15 or 16 of the periodic table of elements. Catalyst comprising this bidentate ligand and carbonylation process n which this catalyst is used.

Abstract: A vertical alignment polyimide for LCD has the following structure: wherein R1 and R2 are same or different tetravalent aromatic residues or alkyl residues; n is an integer, and 24?n?6; a:b=1:9 to 9:1, preferably from 4:1 to 1:1; and a+b=p+q. The polyimide has an inherent viscosity of 0.04–5 dl/g.

Abstract: The present invention relates to quaternized polyamidoamines which have at least one structural unit of the formula VII in which R1, R2, R4 are straight-chain or branched organic radicals optionally containing heteroatoms; R5 is hydrogen or alkyl, R7 is hydrogen or alkyl or two radicals R7 together form a radical having a meaning given for R4, b is an integer from 0 to 50, and c is an integer from 1 to 50. The invention also relates to the preparation of the quaternary polyamidoamines, to compositions which comprise these compounds, and to the use thereof for cosmetic and pharmaceutical purposes, and in the fields of crop protection and textile dyeing. The present invention also relates to the use of quaternized polyamidoamines of the ionene type as biostatic or biocide and thus also biocidal compositions based on quaternized polyamidoamines.

Abstract: The present invention relates to a polyamideimide resin solution preparable by reacting (a) aromatic polycarboxylic acids and/or their anhydrides with (b) aromatic imide- and amide-forming components in cresol at temperatures above 170° C., to the use of this polyamideimide solution for the preparation of wire enamels, to the wire enamels in question, and to the enamelled wires coated therewith.