Abstract: Provided herein are water-soluble prodrugs. The prodrugs of the invention comprise a water-soluble polymer having three or more arms, at least three of which are covalently attached to an active agent, e.g., a small molecule. The conjugates of the invention provide an optimal balance of polymer size and structure for achieving improved drug loading, since the conjugates of the invention possess three or more active agents releasably attached to a multi-armed water soluble polymer. The prodrugs of the invention are therapeutically effective, and exhibit improved properties in-vivo when compared to unmodified parent drug.

Abstract: Disclosed herein is a composition comprising a crosslinked organic polymer; wherein the composition has a coefficient of friction that is in a range of ±30% of a coefficient of friction for a composition comprising the same organic polymer that is not crosslinked; and wherein the composition has a lower K factor than a K factor of the composition comprising the same organic polymer that is not crosslinked; the coefficient of friction and the K factor being measured in a thrust washer apparatus as per ASTM D-3702, where the counter stationary surface in the thrust washer apparatus comprises carbon steel having a Rockwell C hardness of 18 to 22 and a 12 to 16 micro-inch surface finish.

Abstract: It is provided for a resin composition including (A) at least one polyamic acid having the structure represented by the following formula (1): wherein R1 is independently an alkyl group having 1 to 3 carbon atoms or a cyano group; a is independently an integer of 0 to 4; R is a tetravalent organic group; n is an integer of 1 to 4; and m is an integer of 1 to 100,000, and (E) an organic solvent.

Abstract: The present invention provides a non-halogen polyamide-imide resin soluble in an amide solvent at a concentration of 10%, the resulting varnish, when stored at 5° C. for 1 month, exhibiting a solution viscosity change ((solution viscosity after 1 month?initial solution viscosity)/initial solution viscosity), expressed as an absolute value, of not greater than 3.0, and the resin having a moisture absorption (25° C., 90% RH, 24 hours) of not greater than 2.0%; a flexible metal-clad laminates using such a resin; and a flexible printed wiring board prepared from such a flexible metal-clad laminate by circuit formation. The flexible metal-clad laminate of the invention does not curl under any conditions, including humid conditions, and exhibits excellent dimensional stability since the heat resistant resin used as an insulation material has low moisture absorption and low thermal expansion coefficient and there is less internal stress in the flexible metal-clad laminate.

Abstract: The invention aims to provide a resin primer which can stick an insulator layer to a conductor foil whereof the surface is not much roughened with sufficient adhesive force, a conductor foil with resin, a laminated sheet and a method of manufacturing same. The resin primer of the invention comprises a resin having film-forming ability and a breaking energy of 0.15 J or more. The conductor foil with resin of the invention comprises a resin layer comprising a conductor foil and the aforesaid resin primer. Further, the laminated sheet of the invention comprises the conductor foil, an insulating layer disposed facing the conductor foil, and a resin layer comprising the aforesaid resin primer disposed between the conductor foil and insulating layer so that it is in contact therewith. This laminated sheet can be manufactured by heating and pressurizing a laminate comprising the aforesaid conductor foil with resin, and a prepreg laminated on this resin layer.

Abstract: Polyether polymers, such as polyetherimides, are prepared by the reaction of a dihydroxy-substituted aromatic hydrocarbon alkali metal salt, such as bisphenol A disodium salt, with a bis(N-(chlorophthalimido))aromatic compound, such as 1,3- and/or 1,4-bis(N-(4-chlorophthalimido))benzene, in a solvent such as o-dichlorobenzene and in the presence of a phase transfer catalyst such as a hexaalkylguanidinium chloride. Several embodiments may be employed to improve the method. They comprise employing substantially dry reagents, employing a high solids level in solvent, beginning with an excess of bis(N-(chlorophthalimido))-aromatic compound and incrementally adding alkali metal salt, employing alkali metal salt of small particle size, and using reagents of high purity.

Abstract: The present invention provides an optical film exhibiting wavelength dispersion such that a retardation value is smaller on the shorter wavelength side, and capable of being also formed comparatively thinly. The optical film of the present invention is an optical film including a polyimide-based polymer represented by the following general formula (I). In the formula (I), m is 40% by mol or more and 100% by mol or less. R1 and R2 each independently denote a substituent having a carbon-carbon double bond or a triple bond. A, A?, B, B?, E, G, and H each denote a substituent, and small letters corresponding to these alphabets denote substitution number thereof. X and Y each independently denote bond part such as a covalent bond. The substituents having a carbon-carbon double bond or a triple bond represented by R1 and R2 are a substituted or unsubstituted aryl group, a substituted or unsubstituted vinyl group, and a substituted or unsubstituted ethynyl group.

Abstract: A curable polyimide resin composition containing a polyimide resin obtainable from by a reaction of a reaction mixture containing a diisocyanate compound, a carbonate group-containing diol compound and an imide compound having two terminal hydroxyhydrocarbyl groups gives a cured insulation film having improved characteristics.

Abstract: The present invention provides novel hybrid polymer useful for alignment layers for inducing alignment of a liquid crystal medium. Hybrid polymers of this invention are prepared from at least one component selected from the group consisting of monomer, oligomer and polymer within the class of polyimides, poly(amic acids) and esters thereof and at least one component selected from the group consisting of addition monomer and functionalized addition polymer wherein the two components are covalently bonded to form a copolymer. The invention further describes liquid crystal optical elements such as all liquid crystal display products or modes, liquid crystal devices and liquid crystal optical films comprising the novel hybrid polymer alignment layers.

Abstract: The present invention is directed to a non-gelled, curable composition including at least one compound having a plurality of imide functional groups. The compound in particular contains a reaction product of a) at least one hydroxyalkylamino functional succinimide; b) at least one polyisocyanate; and optionally c) at least one capping agent. The composition is suitable for use in coatings and castings.

Abstract: An object of the present invention is to provide a polyimide precursor composition that can be cured at low temperatures (250° C. or lower), while having a low viscosity even at a high concentration, and a method of producing the same. Another object of the present invention is to provide a polyimide coating film obtained from the polyimide precursor composition and having good physical properties, and a method of producing the same. Furthermore, another object of the present invention is to provide a photosensitive resin composition containing the polyimide precursor composition, and a method of producing the same. These objects can be achieved by the polyimide precursor composition containing an imidized tetracarboxylic acid having a specific structure and a diamine having a specific structure.

Abstract: The invention pertains to an epoxy-modified photosensitive polyimide, which possesses excellent heat resistance, chemistry resistance, and flexibility, and can be used in a liquid photo resist or dry film resist, or used in a solder resist, coverlay film, or printed circuit board.

Abstract: A polymer compound is provided which is excellent in heat resistance and insulating property, and a photosensitive resin composition is provided which includes the polymer compound, and may form a cured pattern or a cured film excellent in pattern forming property, resolution, heat resistance and insulating property. Also, a method for forming a cured pattern excellent in pattern forming property, resolution, heat resistance and insulating property using the photosensitive resin composition, and an electronic device having high reliance for a semiconductor device or for a display device are provided. The photosensitive resin composition includes a polymer compound obtained by reacting a monomer represented by Formula (1) and a monomer represented by Formula (2), and a photosensitizing agent.

Abstract: The present invention provides a compound having a formula: where R1 is selected from the group consisting of alkyl, CH2(OC2H4)OCH3, and —(OC2H4)OCH3; n is 0-4; Olig is an oligomer having a formula: -L-O-PAGR.R2]q where L is a optional linker moiety selected from the group consisting of —CH2O—, —CH2OX—, —OX—, —C(O)—, —C(O)X, —NH—, —NHC(O)—, —XNHC(O)—, —NHC(O)X—, —C(O)NH—, —C(O)NHX—, and where X is alky1-6 or is not present, Y is N or O or is not present, and R3 is alkyl1-6; PAG is a linear or branched polyalkylene glycol moiety; R2 is an alkyl1-22 capping moiety if X is present or alkyl2-22 if X is not present; and q is a number from 1 to the maximum number of branches on PAG; and m is 1-5.

Abstract: A substrate for liquid crystal display device comprising a layer having irregular differences in level and a smoothing layer provided directly on the layer having irregular differences in level, wherein the thickness of the smoothing layer is greater than the irregular differences in level, and the in-plane retardation of the layer inclined of 40° with the retardation axis as the axis of rotation is 5 to 150 nm, which enables to reduce the number of steps in manufacturing, is provided by the present invention.

Abstract: The invention relates to personal care, home care and fabric care compositions based on hyperbranched condensation polymers having in the polymer backbone at least one unit comprising an amide bond attached to a trismethylene-aminomethane group and to novel hyperbranched condensation polymers.

Abstract: There is provided a polyimide precursor which can alter the hydrophilicity/hydrophobicity of the surface of a cured film formed readily even by a low level of ultraviolet ray irradiation; and a polyimide produced from the polyimide precursor. The polyimide precursor having a structure represented by the following formula (1): (where A represents a tetravalent organic group; B represents a bivalent organic group having a thiol ester bond in its main chain; R1 and R2 independently represent a hydrogen atom or a univalent organic group; and n represents a natural number).

Abstract: A block copolymer of a polyimide and a polyamic acid is disclosed. Further disclosed are a method for producing the block copolymer and a positive type photosensitive composition comprising the block copolymer. The solubility of the photosensitive composition in an alkaline aqueous solution is controlled to achieve high resolution of a pattern. Further disclosed are a protective film of a semiconductor device and an ITO insulating film of an organic light emitting diode (OLED), which are formed using the block copolymer. The protective film and the ITO insulating film are very stable over time.

Abstract: To provide polyamic acids and polyimides, which have high light transmittance and heat resistance such that their thermal decomposition temperatures are at least 300° C. and which are excellent in their solubility in solvents and have their processability improved. A polyamic acid comprising repeating units represented by the following formula (1), characterized in that at least 10 mol % of A has a structure represented by the formula (2), or a polyimide obtainable by cyclodehydration of such a polyamic acid.

Abstract: A thiol-ene polymeric material is disclosed. The material is produced by the photopolymerization of reactants having thiol and olefin moieties. The material can incorporate encapsulated components, including cells. Additionally, the material can be derivatized by reacting the polymeric material with components such as proteins.

Abstract: New polyaspartimide compositions and methods of forming and using those compositions arc provided. The compositions are formed by reacting a bismaleimide and diamine in a solvent-free environment. The resulting polyaspartimide comprising recurring monomers of The compositions have properties desirable for use as shape memory polymers as well as in composite products that are useful for building components present in airplanes.

Abstract: Hyaluronic acid-retaining biopolymer is provided which exhibits low levels of protein adsorption and surface friction. The biopolymer is useful for incorporation in products, such as contact lenses, used in biological environments.

Abstract: The invention concerns novel biodegradable polyaminoacid materials, useful in particular for vectoring active principles(s). The invention also concerns novel pharmaceutical, cosmetic dietetic or phytosanitary compositions based on said polyaminoacids. The invention aims at providing a novel polymer raw material, capable of being used for vectoring active principles and enabling optimal fulfillment of all specified requirements: biocompatibility, biodegradability, easy and inexpensive transformation into particles vectoring active principles, said particles being themselves capable of forming colloidal suspensions, of being easily associated with numerous active principles, and of releasing said active principles in vivo.

Abstract: A polyimide resin is produced by the reaction of a compound selected from 1,2,4,5-cyclohexanetetracarboxylic acid, dianhydride thereof and reactive derivatives thereof and a compound selected from diamines and diisocyanates each containing at least one phenylene group and at least one isopropylidene group. The polyimide resin is colorless and exhibits a high heat resistance, a high transparency and a low water absorption.

Abstract: It relates to a highly heat resistant thermosetting polyimide resin composition that is cured at a temperature of 150° C. or less, and provides a cured product that generates a less amount of decomposed gas even under heating to 250° C., and has flexibility and adhesiveness. A two-component thermosetting polyimide resin composition containing a liquid A containing a polyimide (a) having a main chain constituted by a repeating unit having a polyoxyalkylenediamine structure with amino groups on both ends thereof, and a liquid B containing a bismaleimide compound, and a cured product of a thermosetting polyimide resin composition obtained by mixing these two liquids and curing the mixture under heating.

Abstract: PEG and related polymer derivatives having weak, hydrolytically unstable linkages near the reactive end of the polymer are provided for conjugation to drugs, including proteins, enzymes, small molecules, and others. These derivatives provide a sufficient circulation period for a drug-PEG conjugate, followed by hydrolytic breakdown of the conjugate and release of the bound molecule. In some cases, drugs that demonstrate reduced activity when permanently coupled to PEG maintain a therapeutically suitable activity when coupled to a degradable PEG in accordance with the invention. The PEG derivatives of the invention can be used to impart improved water solubility, increased size, a slower rate of kidney clearance, and reduced immunogenicity to a conjugate formed by attachment thereto. Controlled hydrolytic release of the bound molecule into an aqueous environment can then enhance the drug's delivery profile by providing a delivery system which employs such polymers and utilizes the teachings provided herein.

Abstract: A liquid crystal thermoset (LCT) monomer or oligomer having both ends capped with maleimide having at least one methyl group, represented by Formula 1: wherein R1 and R2 are each independently CH3 or H, and at least one of R1 and R2 is a methyl group, and Ar1 is a divalent organic group containing one or more structural units selected from the group consisting of ester, amide, ester amide, ester imide and ether imide units, and Ar1 has a molecular weight not greater than 5,000.

Abstract: The present invention relates to modified comb copolymers comprising special structural units, which are produced by converting SMA resins and optionally special copolymers with an AB block copolymer structure with a mixture of at least one polyalkylene oxide monoamine and at least one amino alcohol, with a mixture of at least one polyalkylene oxide monoamine and at least one N,N-disubstituted diamine or a mixture of at least one polyalkylene oxide monoamine, at least one N,N-disubstituted diamine and at least one polymer selected from the group comprising monohydroxy-terminated polyalkylene oxides, monohydroxy-terminated polyesters and monohydroxy-terminated block copolymers comprising polyalkylene oxide and polyester blocks, and their monohydroxy-terminated side chains are converted to phosphoric acid ester groups or their N,N-disubstituted amino-terminated side chains are converted to quaternary ammonium salts, and their use as wetting and dispersing agents.

Abstract: The invention provides hyper-branched polymer manufactured by adding a bismaleimide and a barbituric acid into a Brönsted base solution and reacting the mixture at 20 to 100° C. The formation may further include maleimide monomer and/or multi-maleimide monomer to modify the hyper-branched polymer properties. In addition, the barbituric acid is added to the reaction in a batch not initially charged with other reactants in a one-pot.

Abstract: A compound, oligomer, or polymer having a functional group of formula (I) wherein R is a group having 1 to 12 carbons and optionally including one or more heteroatoms selected from oxygen, nitrogen, and sulfur is useful in curable compositions having active hydrogen functional groups reactive with group (I). The functional groups of formula (I) and active hydrogen functional groups may be part of the same material or different materials. In some embodiments a filler is surface modified to have a functional group of formula (I). Also disclosed is a method of making a material having a functional group of formula (I).

Abstract: [Object] To provide a flexible metal-clad laminate having excellent heat resistance, flexibility and low thermal expansion together with sufficient colorless transparency and a flexible printed circuit board using the same. [Constitution] A colorless and transparent flexible metal-clad laminate where metal foil is directly laminated or is laminated via an adhesive layer on at least one side of the polyamideimide resin layer in which cyclohexane tricarboxylic acid anhydride is a main monomer, characterized in that said polyamideimide resin has an inherent viscosity of 0.8 dl/g or more and 2.5 dl/g or less.

Abstract: Antireflective coatings and related polymers are disclosed.

Abstract: An optical film of the present invention comprises a polyimide-based polymer represented by the following general formula (V). The optical film of the present invention exhibits an optical property such that wavelength dispersion of retardation scarcely changes ranging from the short wavelength side to the long wavelength side. Typically, the optical film of the present invention may be used as a retardation film of a liquid crystal display device.

Abstract: A bismaleamic acid obtained by reacting a bifunctional phenylene ether oligomer diamine, obtained by introducing aromatic amino groups into both terminals of a specific bifunctional phenylene ether oligomer, with maleic anhydride, a bismaleimide obtained from the bismaleamic acid as a raw material, which bismaleimide has high heat resistance, low dielectric characteristics and excellent solvent solubility and exhibits only a small change in dielectric characteristics even in high humidity, a curable resin composition containing the above bismaleimide and a cured product obtained by curing the curable resin composition.

Abstract: A thermosetting polyimide resin composition which, when used in an adhesive layer of a metal-clad laminate, is able to be manufactured by only the solvent removal without requiring an imidation step reaching 300° C. or higher and is thermosetting, a cured material of which is excellent in adhesive properties, low in coefficient of water absorption and satisfactory in heat resistance is provided. A thermosetting polyimide resin composition including a polyimide resin having a repeating unit or units having a specified structure and a compound having two or more polymerizable double bonds in one molecule thereof; a film containing the subject thermosetting polyimide resin composition and a metal-clad laminate including an adhesive layer composed of the subject thermosetting polyimide resin composition.

Abstract: The invention relates to a composition containing a particulate solid, a plastic material and a compound. The invention further relates to novel compounds, and the use of the coupling agents.

Abstract: An organic liquid is applied to both sides of a self-supporting film of a polyimide precursor solution, and then the self-supporting film is heated to effect imidization, thereby providing a polyimide film with reduced surface roughness.

Abstract: The present invention discloses an antireflective coating composition for applying between a substrate surface and a positive photoresist composition. The antireflective coating composition is developable in an aqueous alkaline developer. The antireflective coating composition comprises a polymer, which comprises at least one monomer unit containing one or more moieties selected from the group consisting of a lactone, maleimide, and an N-alkyl maleimide; and at least one monomer unit containing one or more absorbing moieties. The polymer does not comprise an acid labile group. The present invention also discloses a method of forming and transferring a relief image by using the inventive antireflective coating composition in photolithography.

Abstract: A polyamic acid comprising at least 10 mol % repeating units represented by the formula [1] or [2]; and a polyimide represented by the formula [3] or [4] which is obtained from the polyamic acid. A polyimide film having high heat resistance and satisfactory in light-transmitting properties and tensile strength is obtained from the polyamic acid. (In the formulae, R1 and R2 each independently represents hydrogen or C1-10 alkyl; R3 and R4 each independently represents hydrogen, halogeno, C1-10alkyl, or phenyl or the R3 and R4 on adjoining carbon atoms are bonded to each other to form C3-8 cycloalkyl or phenyl; R5 represents a divalent organic group; and n is an integer of 2 or larger.

Abstract: The invention provides a connecting structure for a flip-chip semiconductor package in which cracking and delamination are inhibited or reduced to improve reliability, and in which the potential range of designs is expanded for the inner circuitry of circuit boards and the inductance is reduced. The invention is a connecting structure for a flip-chip semiconductor package, including: a circuit board having a core layer and at least one build-up layer; a semiconductor element connected via metal bumps to the circuit board; and a sealing resin composition with which gaps between the semiconductor element and circuit board are filled, wherein a cured product of the sealing resin composition has a glass transition temperature between 60° C. and 150° C. and a coefficient of linear expansion from room temperature to the glass transition temperature being between 15 ppm/° C. and 35 ppm/° C., a cured product of the build-up layer has a the glass transition temperature of at least 170° C.

Abstract: A polyimide resin which is soluble in an organic solvent and which has a low coefficient of water absorption, thermosetting properties, high heat resistance and excellent adhesive properties, a method for manufacturing the same, an adhesive and a film each containing the subject polyimide resin and a metal-clad laminate including an adhesive layer composed of the subject polyimide resin are provided. The polyimide resin is a polyimide resin containing a repeating unit represented by the following formula (1) and a repeating unit represented by the following formula (2), with a proportion of a group presented by the following formula (3) being 50% by mole or more of the whole of X.

Abstract: A blue-light-emitting element includes a polyimide containing a repeating unit represented by formula (1): (wherein X represents a divalent alicyclic hydrocarbon group having 6 to 24 carbon atoms). Since the polyimide has a high glass transition temperature and toughness and exhibits a stable luminous efficiency; the blue-light-emitting element is suitable for an organic EL display.

Abstract: An object of the present invention is to provide a resin composition having increased heat resistance (high crystallinity) and transparency without impairing rigidity which a polylactic acid resin inherently has, a molded article composed of the resin composition and a novel polylactic acid compound used in the resin composition. A polylactic acid resin composition of the present invention contains a linear polylactic acid compound (A) having a moiety represented by the formula (1): —X1—R1—X2— and having a weight average molecular weight (Mw) of 5,000 to 500,000. In addition, in the formula (1), X1 and X2 each independently represent an oxygen atom, a sulfur atom or an NH group, R1 represents a divalent group containing at least one aromatic group or aliphatic group, and the hydrocarbon group may contain an oxygen atom, a nitrogen atom or a sulfur atom.

Abstract: A polyimide film made of a multicomponent polyimide comprising two or more different polyimide components including (A) a polyimide component A being raw materials of a polyimide A and/or a polyimidation product of the raw materials and (B) a polyimide component B being raw materials of a polyimide B and/or a polyimidation product of the raw materials. The polyimide components A and B are different, for example, such that the absolute difference between solubility parameter SPA of the polyimide A and solubility parameter SPB of the polyimide B, |SPB?SPA|, is 0.5 MPa1/2 or more. The polyimide film has markedly modified surface properties as compared with a polyimide film in which all the same raw materials as used in the film of the invention are randomly bonded to one another.

Abstract: Polymers of naphthalene tetracarboxylic diimide dimmers are provided. The polymers are of the Formula I wherein the A units are selected from and Formula IX The polymers are suitable for use in the active layer of an imaging member and exhibit properties of both a binder and an electron-transporting material.

Abstract: A liquid crystal thermoset (LCT) monomer or oligomer having both ends capped with maleimide having at least one methyl group, represented by Formula 1: wherein R1 and R2 are each independently CH3 or H, and at least one of R1 and R2 is a methyl group, and Ar1 is a divalent organic group containing one or more structural units selected from the group consisting of ester, amide, ester amide, ester imide and ether imide units, and Ar1 has a molecular weight not greater than 5,000.

Abstract: This abstract discusses membranes needed to separate fluids for the production of oxygen-enriched air, nitrogen-enriched-air, for the separation of carbon dioxide from hydrocarbons, and the separation of hydrogen from various petrochemical and oil refining streams. Membranes are needed that provide a resistance to interaction with process components or contaminants, provide the mechanical strength required to withstand high membrane differential pressures and high process temperatures, and exhibit sufficient maximum strain such that membranes are not brittle and can easily be formed into desirable membrane forms. Membranes of polyimide polymers, particularly polyimide polymers sold under the trade name P-84, are annealed in a controlled annealing step to improve the mechanical properties of the polymers used to make separation membranes.

Abstract: A conducting polymer including a conducting linker to connect a probe to the polymer, the linker including an unsaturated organic chain.

Abstract: A method for the preparation of alkoxyamine-functionalised PEG molecules is provided.

Abstract: The present invention relates to an isocyanate-modified photosensitive polyimide. The photosensitive polyimide of the invention possesses excellent heat resistance, chemistry resistance, and flexibility, and can be used as a liquid photo resist or dry film resist, or used in a solder resist, coverlay film, or printed wiring board.