Imide-containing Reactant Patents (Class 528/322)
  • Patent number: 7098273
    Abstract: An object of the present invention is to improve the compatibility of the resin composition comprising the PAI resin and the PAS resin so as to provide a resin composition which is excellent in flowability when molten, strength, tenacity and heat resistance. A resin composition comprising: (1) 5 to 60 parts by weight of aromatic polyamide imide resin (A) having a weight average molecular weight (Mw) of 1,000 to 100,000 and having an amino group in an amount of 0.00002 to 0.002 mol/g in a molecule, (2) 95 to 40 parts by weight of polyarylene sulfide resin (B), and (3) 0.01 to 10 parts by weight of episulfide compound (C) based on 100 parts by weight of the total of (A) and (B).
    Type: Grant
    Filed: June 21, 2004
    Date of Patent: August 29, 2006
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Toshiaki Yamada, Hajime Ban, Hiroyuki Kudo
  • Patent number: 7091305
    Abstract: Disclosed are copolymers based on aspartic acid or its precursor molecules and methods of their production. The copolymers are water-soluble over a wide range of composition and molecular weight. Their preparation involves conversion of a polysuccinimide to copolymers of defined composition, containing aspartate and succinimide residues and/or residues of asparagine. In particular, the copolymers include water-soluble terpolymers of aspartate, asparagine, and succinimide.
    Type: Grant
    Filed: October 12, 2004
    Date of Patent: August 15, 2006
    Assignee: Aquero Company
    Inventor: C. Steven Sikes
  • Patent number: 7084186
    Abstract: Crosslinkable resin compositions that are cured easily by irradiation with active energy beams and particularly cured quickly with ultraviolet ray are provided, which comprises a polymer containing a maleimido group and an ethylenically unsaturated group. The composition may be an aqueous composition. They provide cured films which are excellent in durability, free from coloring and odors, and also excellent in abrasion resistance, adhesion to substrates, surface smoothness, and chemical resistance.
    Type: Grant
    Filed: June 19, 2001
    Date of Patent: August 1, 2006
    Assignee: Toagosei Co., Ltd.
    Inventors: Eiichi Okazaki, Hideo Matsuzaki, Keiji Maeda, Kuniniko Mizotani
  • Patent number: 7053171
    Abstract: In the production method of the present invention, the polyamide is produced by the polycondensation of a diamine component and a dicarboxylic acid component comprising a straight-chain ?,?-aliphatic dicarboxylic acid and an aromatic dicarboxylic acid. The dicarboxylic acid component is first made into a suspension phase of the solid aromatic dicarboxylic acid in a molten straight-chain ?,?-aliphatic dicarboxylic acid. A part of the diamine component is added while the reaction system is in the suspension phase. Then, the reaction system is made into a homogeneous molten phase, to which the rest of the diamine component is added. Finally, the reaction system is kept at temperatures within a specific range to complete the polycondensation.
    Type: Grant
    Filed: May 20, 2004
    Date of Patent: May 30, 2006
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Ryoji Otaki, Tomomichi Kanda
  • Patent number: 7053172
    Abstract: The fuel-barrier polyamide resin of the present invention is a product of the polycondensation of a diamine component comprising 70 mol % or higher of m-xylylenediamine and a dicarboxylic acid component comprising 70 mol % or higher of a mixed dicarboxylic acid which comprises a C4 to C20 ?,?-linear aliphatic dicarboxylic acid and at least one dicarboxylic acid selected from the group consisting of isophthalic acid and naphthalenedicarboxylic acid in a molar ratio of 30:70 to 95:5. The polyamide resin is excellent in not only fuel-barrier property and heat resistance, but also moldability and recyclability, and therefore suitably used as a barrier material of fuel containers.
    Type: Grant
    Filed: May 4, 2004
    Date of Patent: May 30, 2006
    Assignee: Mitsubishi Gas Chemical Co., Inc.
    Inventors: Kazunobu Sato, Kazunobu Maruo, Jun Mitadera, Masashi Kurokawa
  • Patent number: 7049001
    Abstract: Compounds with carbodiimide units and carboxyl or carboxylate groups (compounds V), derived from a) aliphatic or araliphatic C4 to C20 polyisocyanates (component a) b) hydroxy carboxylic acids or hydroxy carboxylic salts (component b) and c) if desired, further compounds, carrying groups able to react with isocyanate groups in an addition reaction (component c) d) if desired, other isocyanates (component d), the carbodiimide units being derived essentially exclusively from the isocyanate groups of component a).
    Type: Grant
    Filed: January 5, 2001
    Date of Patent: May 23, 2006
    Assignee: BASF Aktiengesellschaft
    Inventors: Karl Häberle, Ulrike Licht, Sabine Kielhorn-Bayer, Christian Lach, Bernd Meyer-Roscher, Robert Shane Porzio, Christelle Staller, Peter Weyland
  • Patent number: 7034101
    Abstract: A polycarbodiimide copolymer which comprises at least one structural unit selected from rubber residues represented by the following formulae (1) and (2) in a number “m”: and a structural unit represented by the following formula (3) in a number “n”: and which comprises on both termini a terminal structural unit derived from a monoisocyanate, wherein m is an integer of 2 or more, n is an integer of 1 or more, m+n is from 3 to 1,500 and m/(m+n) is from 1/1,500 to ?. The polycarbodiimide is capable of keeping the inherent heat resistance and also showing excellent flexibility. Films and molding materials having high heat resistance and flexibility can be obtained.
    Type: Grant
    Filed: March 5, 2004
    Date of Patent: April 25, 2006
    Assignee: Nitto Denko Corporation
    Inventors: Naoki Sadayori, Yuji Hotta
  • Patent number: 7009029
    Abstract: Provided is a polyamide composition comprising 100 parts by weight of (A) a polyamide having dicarboxylic acid units containing 60 to 100 mol % of terephthalic acid units, and diamine units containing 60 to 100 mol % of 1,9-nonanediamine units and/or 2-methyl-1,8-octanediamine units, and 5 to 100 parts by weight of (B) a titanium oxide with an average particle size of 0.1 to 0.5 ?m. The polyamide composition shows excellent heat resistance enough to withstand the SMT process, and gives a molded article with excellent whiteness and surface-reflectance.
    Type: Grant
    Filed: June 19, 2003
    Date of Patent: March 7, 2006
    Assignee: Kuraray Co., Ltd.
    Inventors: Hideaki Oka, Hideharu Matsuoka, Toru Kuki
  • Patent number: 6995233
    Abstract: The invention relates to a continuous process for manufacturing polyamides. The polyamides are of the type obtained from diacids and diamines. The process comprises an operation of continuous mixing of a compound which is rich in amine end groups and a compound which is rich in acid end groups and a polycondensation operation using the mixture. The invention relates to the starting phase of such a process, during which an aqueous solution comprising a mixture of monomers in substantially stoichiometric proportions is used.
    Type: Grant
    Filed: October 3, 2001
    Date of Patent: February 7, 2006
    Assignee: Rhodianyl
    Inventors: Jean-Francois Thierry, Matthieu Helft
  • Patent number: 6989106
    Abstract: A process for the preparation of polymeric condensates, wherein the reaction mixture is fed at least once during the condensation reaction through a zone of high energy density which has an energy density of at least 105 J/m3.
    Type: Grant
    Filed: June 9, 2003
    Date of Patent: January 24, 2006
    Assignee: Bayer Aktiengesellschaft
    Inventors: Karlheinrich Meisel, Lars Obendorf, Branislav Boehmer, Bernd Thiele, Armin Spaniol, Dietmar Fuchs, Gerd-Friedrich Renner, Thomas Huebbe
  • Patent number: 6979719
    Abstract: The invention pertains to a coating composition comprising a compound comprising at least one bicyclo-orthoester group and at least one other functional group. The invention also comprises a process for curing the present coating composition. Further, a process for making a bicyclo-orthoester-functional compound from the corresponding oxetane compound is described.
    Type: Grant
    Filed: February 22, 2000
    Date of Patent: December 27, 2005
    Assignee: Akzo Nobel N.V.
    Inventors: Klaus Hobel, Huig Klinkenberg, Arie Noomen
  • Patent number: 6958381
    Abstract: A process for preparing polyamides comprises polymerizing starting monomers in the presence of from 2.3 to 10 mmol, based on 1 mol of carboxamide group of the polyamide, of a chain regulator containing a nitrile group and a functional group capable of forming a carboxamide group.
    Type: Grant
    Filed: November 22, 2001
    Date of Patent: October 25, 2005
    Assignee: BASF Aktiengesellschaft
    Inventors: Helmut Winterling, Michael Fischer
  • Patent number: 6956099
    Abstract: Copolymers having linked internal polyether blocks and internal polyamide blocks have advantageous physical properties and solvent-gelling abilities. The copolymer may be prepared from a reaction mixture that contains 1,4-cyclohexane dicarboxylic acid (CHDA) and poly(alkyleneoxy) diamine (PAODA). Optionally, the reaction mixture contains no monofunctional compound reactive with either amine or carboxylic acid groups, however some of this monofunctional compound may be present. Dimer diamine and/or dimer acid may be present in the reaction mixture. A copolymer may also be prepared from a reaction mixture containing dimer acid and at least two diamine compound(s) including PAODA and short-chain aliphatic diamine having 2-6 carbons (SDA), wherein: a) the reaction mixture comprises x grams of PAODA and y grams of SDA, and x/(x+y) is 0.8-0.98; b) the reaction mixture weighs z grams, and x/z is at least 0.
    Type: Grant
    Filed: March 20, 2003
    Date of Patent: October 18, 2005
    Assignee: Arizona Chemical Company
    Inventor: Mark S. Pavlin
  • Patent number: 6956100
    Abstract: An object of the present invention is to provide a polyamide resin composition from which the solvent is easily removed during film formation and which gives a film or adhesive layer reduced in residual solvent content. It is suitable for use especially as vanish. The composition and vanish are characterized by comprising as essential ingredients a phenolic hydroxyl group-having aromatic polyamide resin and a cycloalkanone as a solvent and preferably further containing a curable resin.
    Type: Grant
    Filed: October 18, 2001
    Date of Patent: October 18, 2005
    Assignee: Nippon Kayaku Kabushiki Kaisha
    Inventors: Masahiro Imaizumi, Toyofumi Asano, Masaki Shinmoto
  • Patent number: 6953832
    Abstract: Dental material containing an amide of the general formula BXn in which B stands for a hydrocarbon radical with 1 to 5 carbon atoms, which can contain one or more of the groups O, S, NH, CO—NH, O—CO—NH and/or NH—CO—NH, and which is substituted n times with the group X, X stands for the group which is bound via the nitrogen atom or via C-2 to the radical B, the bond site not connected to B carrying a radical R2, R1 being hydrogen, an alkyl group with 1 to 20 carbon atoms or a phenyl radical, two or more radicals X being able to share a radical R1 and R1 also being able to be a constituent of the radical B, R2 being hydrogen, an alkyl group with 1 to 20 carbon atoms or a phenyl radical, and n being a number from 2 to 5.
    Type: Grant
    Filed: January 14, 2002
    Date of Patent: October 11, 2005
    Assignee: Ivoclar Vivadent AG
    Inventors: Norbert Moszner, Frank Zeuner, Volker Rheinberger, Jörg Angermann, Thomas Völkel
  • Patent number: 6949296
    Abstract: The substrates of the present invention comprise a polyimide base polymer derived at least in part from non-rigid rod monomers together with optionally rigid rod monomers where the substrates are cured under low tension. The resulting polyimide materials have been found to provide advantageous properties (e.g. balanced molecular orientation, good dimensional stability, and flatness) particularly useful for electronics type applications.
    Type: Grant
    Filed: April 4, 2003
    Date of Patent: September 27, 2005
    Assignee: E. I. du Pont de Nemours and Company
    Inventors: Meredith L. Dunbar, James R. Edman
  • Patent number: 6930165
    Abstract: The invention concerns polyamides modified by a multifunctional compound. Finished articles formed from said polyamides or from compositions based on said polyamides exhibit excellent mechanical properties, and a very good surface appearance. The modified polyamide is obtained by mixing in melted form a polyamide and a polyamide macromolecular compound comprising star-shaped or H-shaped macromolecular chains.
    Type: Grant
    Filed: June 15, 2001
    Date of Patent: August 16, 2005
    Assignee: Rhodia Engineering Plastics S.r.l.
    Inventors: Nicolangelo Peduto, Franco Speroni, Haichun Zhang
  • Patent number: 6916901
    Abstract: The present invention provides a method for the production of polyamide 6 by the hydrolytic polymerization of ?-caprolactam, in which, in the first step, caprolactam ring opening occurs under the action of water and, in the following steps, polycondensation is performed at low temperatures under anhydrous conditions.
    Type: Grant
    Filed: November 7, 2002
    Date of Patent: July 12, 2005
    Assignee: Bayer Aktiengesellschaft
    Inventors: Sven Gestermann, Ralph Ulrich
  • Patent number: 6911519
    Abstract: A series of low melting and low viscosity phenylethynyl end-capped polyimides (PETIs) possessed of long term thermal and mechanical stability useful as films, melt coatings, adhesives, matrix and RTM resins and particular as coatings for optical fibers and phenylethynyl end-capped bismides blended with PETIs are disclosed. Processes for their production including: 1) modification of PETI-5 oligomer by molecular weight adjustments by blending with reactive low melting phenylethynyl end-capped imide monomers, 2) modification of the PETI-5 backbone structure with other diamine components, and 3) modification of the PETI-5 backbone with bulky fluorinated groups are also disclosed.
    Type: Grant
    Filed: March 25, 2003
    Date of Patent: June 28, 2005
    Assignee: University of Connecticut
    Inventors: Daniel A. Scola, Christopher D. Simone
  • Patent number: 6908983
    Abstract: The present invention contemplates a process for forming polyaminoamide polymers formed by the reaction of a dibasic acid/ester with excess amounts of an amine; the intermediate polymer resulting therefrom; a process for synthesizing effective, high solids resins resulting from the reaction of intermediate polymers with an epihalohydrin; and the resultant high, solids resin. These resins may be used as wet strength resins in the papermaking industry.
    Type: Grant
    Filed: April 1, 2003
    Date of Patent: June 21, 2005
    Assignee: Hercules Corporation
    Inventor: William W. Maslanka
  • Patent number: 6906165
    Abstract: The invention concerns copolyamides obtained by using multifunctional monomers. It consists in using a multifunctional monomer comprising at least three reactive functions and at least another multifunctional monomer, in amounts such that the terminal group concentrations are balanced. The copolyamides are particularly high viscosity copolyamides. The invention also concerns compositions based on said copolyamides.
    Type: Grant
    Filed: August 7, 2001
    Date of Patent: June 14, 2005
    Assignee: Rhodia Engineering Palstics S.R.L.
    Inventors: Giuseppe Di Silvestro, Franco Speroni, Cuiming Yuan, Haichun Zhang
  • Patent number: 6903181
    Abstract: Disclosed are methods of synthesis of polysuccinimide, copolymers and derivatives thereof: also disclosed are methods of forming derivatives by ring-opening initiation reactions.
    Type: Grant
    Filed: November 3, 2003
    Date of Patent: June 7, 2005
    Assignee: Folia, Inc
    Inventors: Graham Swift, George H. Redlich
  • Patent number: 6887967
    Abstract: A thermosetting polyimide resin composition is provided which comprises a polyimide resin and an epoxy resin, which has excellent heat resistance, low dielectric constant and low dielectric loss tangent and also yields a cured article having good mechanical properties such as tensile strength and tensile elongation. Also, a process for producing a polyimide resin used in the polyimide resin composition is provided. The thermosetting polyimide resin composition comprises a polyimide resin (X), which has a carboxyl group and a linear hydrocarbon structure having a number-average molecular weight of 300 to 6,000, and an epoxy resin (Y).
    Type: Grant
    Filed: January 23, 2003
    Date of Patent: May 3, 2005
    Assignee: Dainippon Ink and Chemicals, Inc.
    Inventors: Eiju Ichinose, Yohzoh Yamashina, Hidenobu Ishikawa
  • Patent number: 6887971
    Abstract: Disclosed are methods of synthesis of polysuccinimide and a copoly(succinimide-aspartate) using a supercritical fluid.
    Type: Grant
    Filed: November 3, 2003
    Date of Patent: May 3, 2005
    Assignee: Folia, Inc.
    Inventors: Graham Swift, Kenneth Michael Doll, Randal Lee Shogren, Ronald Alan Holser, Julious L. Willett
  • Patent number: 6884865
    Abstract: The invention concerns copolyamides obtained by using multifunctional monomers. It consists in using at least one multifunctional monomer comprising at least three reactive functions and at least another multifunctional monomer, in amounts such that the terminal group concentrations are balanced. The copolyamides are more particularly high viscosity copolyamides. The invention also concerns compositions based on said copolyamides.
    Type: Grant
    Filed: August 7, 2001
    Date of Patent: April 26, 2005
    Assignee: Rhodia Engineering Plastics S.R.L.
    Inventors: Giuseppe Di Silvestro, Franco Speroni, Cuiming Yuan, Haichun Zhang
  • Patent number: 6881477
    Abstract: A method is disclosed for producing a polyamide molding compound which includes the following method steps: addition and dissolving of m-xylylene diamine and dicarboxylic acids, which include adipic acid and aromatic dicarboxylic acids, with water and additives in a dissolving chamber and production of a mixture, the sum of the aromatic dicarboxylic acids added being 2 mol-percent to 15 mol-percent (in relation to the addition of dicarboxylic acids); transfer of the mixture into a reaction vessel and polycondensation of the mixture in this reaction vessel; granulation of the polycondensate; drying of the granulate. This method is distinguished in that the polycondensation is performed at a pressure of at most 10 bar and a temperature of 255° C. to 270° C., the pressure being built up while heating the reaction vessel to 255° C. to 270° C. and—immediately after the mixture has reached the maximum temperature—being reduced to atmospheric conditions while maintaining a temperature of 255° C. to 270° C.
    Type: Grant
    Filed: November 15, 2002
    Date of Patent: April 19, 2005
    Assignee: EMS-Chemie AG
    Inventors: Ulrich Presenz, Rosmarie Hartmann, Hans Rudolf Luck, Stephan Schmid
  • Patent number: 6878797
    Abstract: A process for producing alkali metal polymaleimide salts by alkaline hydrolysis of maleimide polymers prepared by polymerization of maleimide monomers in the presence of a metal oxide and alcohol initiator or a base. In particular, the process produces alkali metal polymaleimide salts with particular ratios of C—N and C—C connected maleimide-derived monomer units which are dependent on the particular initiator used to synthesize the maleimide polymer. The alkali metal polymaleimide salts, which have chelating and anti-scaling properties, are useful as chelating agents and detergent builders and as such are suitable biodegradable replacements for synthetic polymers and sodium polyaspartate.
    Type: Grant
    Filed: April 19, 2002
    Date of Patent: April 12, 2005
    Assignees: Board of Trustees of Michigan State University, Applied CarboChemicals
    Inventors: Kris A. Berglund, Parminder Agarwal, Qiuyue Yu, Adam Harant
  • Patent number: 6878798
    Abstract: A process for preparing a polymer, which comprises a) reacting a mixture (I) containing 6-aminocapronitrile and water in the presence of a catalyst to obtain a mixture (II) containing caprolactam, ammonia, water, high boilers and low boilers, then b) removing ammonia from mixture (II) to obtain a mixture (III) containing caprolactam, water, high boilers and low boilers, then c) removing all or some of the water from mixture (III) to obtain a mixture (IV) containing caprolactam, high boilers and low boilers and then d) feeding mixture (IV) to a polymerization reaction, and also the polymer obtainable by this process, the use of the polymer for producing fibers, sheetlike structures and moldings, and also fibers, sheetlike structures and moldings obtainable using such a polymer.
    Type: Grant
    Filed: April 30, 2001
    Date of Patent: April 12, 2005
    Assignee: BASF Aktiengesellschaft
    Inventors: Frank Ohlbach, Helmut Winterling, Andreas Ansmann, Rolf-Hartmuth Fischer, Johann-Peter Melder, Stefan Maixner, Peter Bassler, Hermann Luyken
  • Patent number: 6875838
    Abstract: Disclosed is a process for reducing low molecular weight impurities, namely caprolactam and its oligomers, from Nylon-6 pre-polymer during the preparation of Nylon-6 polymer.
    Type: Grant
    Filed: April 28, 2003
    Date of Patent: April 5, 2005
    Assignee: Invista North Americal S.a.r.l.
    Inventors: Albert W. Alsop, Carl E. Camp, John M. Iwasyk, Dilip Rajagopalan
  • Patent number: 6872800
    Abstract: The invention relates to hyperbranched copolyamides (HBPAs), to their production and to their use as additives, in particular as melt viscosity modifiers in thermoplastic polymer compositions. This copolyamide is obtained by a reaction between a monomer (I): A—R—Bf with A and B=polymerization functions of a 1st and 2nd type, respectively, which are capable of reacting with each other, R=hydrocarbon-based species and f=total number of B per monomer (preferably 2?f?10); and a monomer (II) A?—R?—B? or the corresponding lactams, with A?, B? and R? having the same definition as that given above for A, B and R, respectively. This HBPA has a I/II molar ratio such that 0.125?I/II?2. One of the species R or R? of (I) or (II) is aliphatic, cycloaliphatic or arylaliphatic. For example: A=NH2 and B=COOH or A=COOH and B=NH2 with F=2. A?=NH2 and B?=COOH or A?=COOH and B?=NH2. A—R—B2, e.g.: 5-aminoisophthalic acid or 3,5-diaminobenzoic acid and A?—R?—B?=?-caprolactam.
    Type: Grant
    Filed: May 5, 2000
    Date of Patent: March 29, 2005
    Inventors: Franck Bouquerel, Jean-Francois Sassi
  • Patent number: 6864349
    Abstract: Polymerized fatty acid-based polyamides may be combined with low polarity and high polarity co-solvents to produce homogeneous water-in-oil emulsions. These emulsions have the appearance of white or translucent creams, with stiffnessranging from soft and greasy, to hard and able to support weight. These emulsions are stable in the presence or absence of surfactant, and are formed easily by mixing components with heat and then cooling. These emulsions are useful in applications favoring an oil base, such as skin creams and cosmetics with emulsions of low stiffness, and car polish with emulsions of greater stiffness.
    Type: Grant
    Filed: December 13, 2002
    Date of Patent: March 8, 2005
    Assignee: Arizona Chemical Company
    Inventors: Mark S. Pavlin, Richard A. O'Brien
  • Patent number: 6864350
    Abstract: PEG and related polymer derivatives having weak, hydrolytically unstable linkages near the reactive end of the polymer are provided for conjugation to drugs, including proteins, enzymes, small molecules, and others. These derivatives provide a sufficient circulation period for a drug-PEG conjugate and then for hydrolytic breakdown of the conjugate and release of the bound molecule. In some cases, drugs that previously had reduced activity when permanently coupled to PEG can have therapeutically suitable activity when coupled to a degradable PEG in accordance with the invention. The PEG of the invention can be used to impart water solubility, size, slow rate of kidney clearance, and reduced immunogenicity to the conjugate. Controlled hydrolytic release of the bound molecule in the aqueous environment can then enhance the drug delivery system.
    Type: Grant
    Filed: December 12, 2002
    Date of Patent: March 8, 2005
    Assignee: Nektar Therapeutics AL, Corporation
    Inventor: J. Milton Harris
  • Patent number: 6864348
    Abstract: Polyetherpolyamide elastomer showing a low water absorption, a high stress relaxation, and a high elastic recovery percentage of elongation is obtainable by polymerizing an aminocarboxylic acid compound and/or a lactam compound, a triblock polyetherdiamine compound having the following formula, and a dicarboxylic acid compound: [x is a value of 1 to 20, y is a value of 4 to 50, z is a value of 1 to 20].
    Type: Grant
    Filed: November 27, 2002
    Date of Patent: March 8, 2005
    Assignee: UBE Industries, Ltd.
    Inventors: Hiroshi Okushita, Tadao Muramatsu, Teruaki Fujii
  • Patent number: 6864354
    Abstract: The invention relates to modified polyamides, and more particularly to polyamides containing units of the type obtained by reacting a diacid with a diamine, modified with a multifunctional compound. The finished articles shaped from these polyamides or from compositions based on these polyamides have excellent mechanical properties and also a very good surface aspect. The modified polyamide according to the invention is obtained by melt-blending polyamides of different natures, in the presence of a multifunctional compound.
    Type: Grant
    Filed: June 15, 2001
    Date of Patent: March 8, 2005
    Assignee: Rhodia Engineering Plastics S.r.l.
    Inventors: Nicolangelo Peduto, Franco Speroni, Haichun Zhang
  • Patent number: 6858700
    Abstract: Higher diamondoid derivatives capable of taking part in polymerization reactions are disclosed as well as intermediates to these derivatives, polymers formed from these derivatives and methods for preparing the polymers.
    Type: Grant
    Filed: January 16, 2002
    Date of Patent: February 22, 2005
    Assignee: Chervon U.S.A. Inc.
    Inventors: Jeremy E. Dahl, Robert M. Carlson, Shenggao Liu
  • Patent number: 6846550
    Abstract: An adhesive film for underfill which relaxes the stress formed in the wiring circuit substrate, semiconductor element and electrode parts for connection. The adhesive film is a quickly hardening type, and forms a highly heat resistant sealing resin layer quickly between the wiring circuit substrate and semiconductor element of a semiconductor device.
    Type: Grant
    Filed: November 12, 2003
    Date of Patent: January 25, 2005
    Assignee: Nitto Denko Corporation
    Inventors: Akiko Matsumura, Kazuki Uwada, Naoki Sadayori, Yuji Hotta
  • Patent number: 6846901
    Abstract: The invention relates to a liquid initiator to be used in anionic lactam polymerization. Said liquid initiator contains a reaction product of carbodiimide with a protic compound and a base in an aprotic solvation agent.
    Type: Grant
    Filed: November 28, 2000
    Date of Patent: January 25, 2005
    Assignee: EMS-Chemie AG
    Inventors: Eduard Schmid, Ivano Laudonia
  • Patent number: 6846868
    Abstract: A polyamide composition comprising 100 parts by weight of (A) a semiaromatic polyamide having dicarboxylic acid units mainly composed of aromatic dicarboxylic acid units and diamine units mainly composed of aliphatic diamine units having 4 to 14 carbon atoms and containing not more than 15 ?eq/g of terminal amino groups; and 0.01 to 5 parts by weight of (B) a copper compound.
    Type: Grant
    Filed: June 5, 2002
    Date of Patent: January 25, 2005
    Assignee: Kuraray Co., Ltd.
    Inventors: Hideaki Oka, Tetsuya Hara, Shigeru Sasaki
  • Patent number: 6841651
    Abstract: The polyamide resin of the present invention is produced by polycondensation of a diamine component comprising 70 mol % or more of m-xylylenediamine and a dicarboxylic acid component comprising 70 mol % or more of a C4-C20 ?, ?-straight-chain aliphatic dicarboxylic acid in the presence of at least one phosphorus compound selected from the group consisting of phosphinic acid compounds and phosphonous acid compounds and in the presence of an alkali metal compound of a weak acid. The weak acid has a dissociation constant lower than a first dissociation constant of a dicarboxylic acid mainly constituting the polyamide resin. The polyamide resin satisfies the following requirements (A), (B) and (C): 14000?a?40000??(A) b?1.000??(B) 0.9930?b?1.1a2×10?11+3.2a×10?7?0.9980??(C) wherein a and b are as defined in the disclosure.
    Type: Grant
    Filed: April 8, 2003
    Date of Patent: January 11, 2005
    Assignee: Mitsubishi Gas Chemical Company, Inc.
    Inventors: Kazunobu Maruo, Tomomichi Kanda, Koji Yamamoto
  • Patent number: 6835800
    Abstract: A method for preparing a nylon 6 copolymer containing dimeric acid comonomers. The method includes reacting 80.0˜99.9 mol % of caprolactam, 0.1˜3.0 mol % of dimeric acid and 0.1˜3.0 mol % of 2-methyl-1,5-pentadiamine in a polymerization reaction. Moreover, the invention provides a method for preparing a nylon 66 copolymer containing dimeric acid comonomers, which comprising reacting 60.0˜90 mol % of hexadiacid and hexadiamine, 0.1˜3.0 mol % of dimeric acid and 0.1-3.0 mol % of 2-methyl-1,5-pentadiamine in a polymerization reaction. The reaction temperature for both of the methods are at 200˜280° C.
    Type: Grant
    Filed: December 23, 2002
    Date of Patent: December 28, 2004
    Assignee: Industrial Technology Research Institute
    Inventors: Tun-Fun Way, Cheng Yeh, Hsiang-In Tang, Lien-Tai Chen
  • Patent number: 6835799
    Abstract: The invention relates to a randomly branched polyamide comprising at least units derived from: 1. AB monomers, 2. at least one compound I, being a carboxylic acid (Av) having a functionality v≧2 or an amine (Bw) having a functionality w≧2, 3. at least one compound II, being a carboxylic acid (Av) having a functionality v≧3 or an amine (Bw) having a functionality w≧3, compound II being a carboxylic acid if compound I is an amine or compound II being an amine if compound I is a carboxylic acid and the amounts of all units derived from carboxylic acids and amines in the polyamide satisfying conditions as mentioned in claim 1. The composition of the randomly branched polyamide is such that it cannot form a crosslinked polyamide (and thus no gels, either), in particular during the prepolymerization, the polymerization, the post-condensation, the processing and the storage of the randomly branched polyamide, and this at a variety of ambient factors, for instance at elevated temperature and pressure.
    Type: Grant
    Filed: June 18, 2001
    Date of Patent: December 28, 2004
    Assignee: DSM IP Assets B. V.
    Inventors: Atze J. Nijenhuis, René Aberson, Boudewijn J. R. Scholtens
  • Patent number: 6833429
    Abstract: A reinforced polyamide molding composition is disclosed. Characterized in that its viscosity at a shear velocity of 10 s−1 is greater than 1000 Pas and a shear velocity of 1000 s−1 is less than 300 Pas, at processing temperatures of 40 to 80° C. above its melting point, the composition is particularly suitable for thermoforming applications.
    Type: Grant
    Filed: April 1, 2002
    Date of Patent: December 21, 2004
    Assignee: Bayer Aktiengesellschaft
    Inventors: Dirk Pophusen, Detlev Joachimi, Jürgen Röhner
  • Patent number: 6831148
    Abstract: A photoactive polymer from the class of polyimides, polyamide acids and esters thereof comprises as a side-chain a photocrosslinkable group of the general formula (I) wherein the broken line indicates the point of linkage to the polyimide main chain and wherein: B is a straight-chain or branched alkyl residue which is optionally substituted, wherein one or more non-adjacent CH2 groups may independently be replaced by a group Q; D represents an oxygen atom or —NR1— wherein R1 represents a hydrogen atom or lower alkyl; and S3 represents a spacer unit. The polymers may be used as orientation layers for liquid crystals and in the construction of unstructured and structured optical elements and multi-layer systems.
    Type: Grant
    Filed: July 16, 2002
    Date of Patent: December 14, 2004
    Assignee: Rolic AG
    Inventors: Richard Buchecker, Guy Marck, Olivier Muller
  • Patent number: 6828413
    Abstract: The invention relates to a process for the preparation of a polyamide comprising at least a step in which a composition that comprises at least (a) a primary aminocarbonamide and (b) an aminocarboxylic acid and/or a lactam is polymerised, said composition comprising at least (a) 10-90 wt. % primary aminocarbonamide; (b) 10-90 wt. % aminocarboxylic acid and/or lactam; (c) 0-4 wt. % water; the amounts being relative to the sum of the compounds (a+b+c). Preferably the sum of the compounds (a+b+c) is at least 75 wt. % of the total composition, more preferably 85 wt. %, most preferably 90 wt. %. The polyamide obtained with the process has a &eegr;rel of more than 2.2. The process is eminently suitable for the preparation of polyamide-6 (polycapronamide) from a composition comprising 6-aminocapronamide, 6-aminocaproic acid and/or &egr;-caprolactam. This composition is preferably obtained via the reductive amination of a 5-formylyalerate ester, preferably 5-formylmethylvalerate in water.
    Type: Grant
    Filed: June 24, 2002
    Date of Patent: December 7, 2004
    Assignee: OSM IP Asseta, B.V.
    Inventors: Cornelis E. Koning, Rudy Rulkens, Nicolaas F. Haasen, Albert A. Van Geenen
  • Patent number: 6828408
    Abstract: An aromatic polyimide ester having a small coefficient of linear expansion, small water absorbing property, and excellent heat resistance. The aromatic polyimide ester comprising: a repeating unit represented by a following formula (I), a repeating unit represented by a following formula (II), (n represents 0 or 1) a repeating unit represented by a following formula (III), and a repeating unit represented by a following formula (IV), (-A- represents —O— or —CO—, and is located in para-position or meta position to imido group, and X represents direct coupling, —O—, —S—, or —SO2—) and the repeating units are mutually bonded with each other through ester-bonds.
    Type: Grant
    Filed: September 5, 2002
    Date of Patent: December 7, 2004
    Assignee: Sumitomo Chemical Company, Limited
    Inventors: Satoshi Okamoto, Manabu Hirakawa
  • Patent number: 6828412
    Abstract: A polymer comprising: a polymeric backbone comprising at least one unit having the structure (I), wherein R-R4 comprise groups selected from the group consisting of H, C1-C12 alkyl, C6-C18 aryl, C7-C18 aralkyl, C6-C18 cycloalkyl or any of the group consisting of C1-C12 alkyl, C6-C18 aryl, C7-C18 aralkyl, C6-C18 cycloalkyl substituted, within the carbon chain or appended thereto, with one or more heteroatoms; R and R2 or R and R4 or R and R1 or R2 and R3 may be joined so that with the carbon atom(s) to which they are attached they together form a saturated, partially unsaturated or unsaturated ring system respectively, may have a pendent group which may incorporate a linker unit, (for example a peptide linkage) or a unit having the structure (I); A comprises a proton donating moiety selected from the group consisting of formula (1).
    Type: Grant
    Filed: July 19, 2002
    Date of Patent: December 7, 2004
    Assignee: School of Pharmacy, University of London
    Inventors: Stephen James Brocchini, Marie-Claude Dubois Clochard
  • Patent number: 6825313
    Abstract: Disclosed are copolymers based on aspartic acid or its precursor molecules and methods of their production. The copolymers are water-soluble over a wide range of composition and molecular weight. Their preparation involves conversion of a polysuccinimide to copolymers of defined composition, containing aspartate and succinimide residues and/or residues of asparagine. In particular, the copolymers include water-soluble terpolymers of aspartate, asparagine, and succinimide.
    Type: Grant
    Filed: May 7, 2003
    Date of Patent: November 30, 2004
    Assignee: Aquero Company
    Inventor: C. Steven Sikes
  • Patent number: 6825315
    Abstract: A method of making a thermally-removable adhesive is provided where a bismaleimide compound, a monomeric furan compound, containing an oxirane group an amine curative are mixed together at an elevated temperature of greater than approximately 90° C. to form a homogeneous solution, which, when cooled to less than approximately 70° C., simultaneously initiates a Diels-Alder reaction between the furan and the bismaleimide and a epoxy curing reaction between the amine curative and the oxirane group to form a thermally-removable adhesive. Subsequent heating to a temperature greater than approximately 100° C. causes the adhesive to melt and allows separation of adhered pieces.
    Type: Grant
    Filed: December 21, 2001
    Date of Patent: November 30, 2004
    Assignee: Sandia Corporation
    Inventor: James H. Aubert
  • Patent number: 6815527
    Abstract: The continuous process for preparing a polyamide by reacting at least one aminonitrile with water comprises: (1) reacting at least one aminonitrile with water in the presence of an organic liquid diluent at from 90 to 400° C. and from 0.1 to 35×106 Pa in a flow tube containing a Brönsted acid catalyst selected from a beta-zeolite catalyst, a sheet-silicate catalyst or a titanium dioxide catalyst comprising from 70 to 100% by weight of anatase and from 0 to 30% by weight of rutile and in which up to 40% by weight of the titanium dioxide may be replaced by tungsten oxide, to obtain a reaction mixture, (2) further reacting the reaction mixture at from 150 to 400° C.
    Type: Grant
    Filed: January 10, 2003
    Date of Patent: November 9, 2004
    Assignee: BASF Aktiengesellschaft
    Inventors: Peter Bassler, Helmut Winterling, Rolf-Hartmuth Fischer, Wolfgang Loth
  • Patent number: 6812324
    Abstract: A method for preparing nylon 6 copolymer containing 5-sulfoisophthalate salts comonomer. The method includes the steps of reacting 5-sulfoisophthalate salts ester with aliphatic diamine in a molar ratio of 2˜20 at 160˜200° C., followed by completely removing the unreacted aliphatic diamine, to obtain the intermediate compound with terminal amine, 5-sulfobenzenediamide compound (formula III). Next, caprolactam and aliphatic diacid (formula IV) are reacted at 200˜260° C. to form an oligomer with a low molecular weight. 5-Sulfobenzenediamide (formula III) and catalyst are then added into the oligomer obtained in previous step to cause a polymerization reaction at 200˜280° C. to obtain nylon 6 copolymer containing 5-sulfoisophthalate salt comonomer. The molar ratio of E/C is 0.005˜0.150 and the molar ratio of D/E is 1.05-1.00. Compounds present in the water extract are greatly reduced.
    Type: Grant
    Filed: December 23, 2002
    Date of Patent: November 2, 2004
    Assignee: Industrial Technology Research Institute
    Inventors: Tun-Fun Way, Cheng Yeh, Lien-Tai Chen, Chia-Hung Chen