Abstract: A multi-layer substrate with metal layers as a moisture diffusion barrier for reduced electrical performance degradation over time after moisture exposure and methods of design and manufacture. The method includes determining a diffusion rate of an insulator material provided between an upper metal layer and an underlying signal line. The method further includes calculating a diffusion distance between a plane opening of the upper metal layer and the underlying signal line using the diffusion rate of the insulator material.

Abstract: A multi-layer substrate with metal layers as a moisture diffusion barrier for reduced electrical performance degradation over time after moisture exposure and methods of design and manufacture. The method includes determining a diffusion rate of an insulator material provided between an upper metal layer and an underlying signal line. The method further includes calculating a diffusion distance between a plane opening of the upper metal layer and the underlying signal line using the diffusion rate of the insulator material.

Abstract: The invention relates to a yarn comprising a copolyamide in an amount of at least 90 wt % with respect to the total weight of the yarn, which copolyamide comprises a) at least 95 wt % by weight with respect to the total weight of copolyamide, monomeric units derived from hexamethylene diamine and adipic acid and b1) cyclic monomeric units derived from a diamine X, and cyclic monomeric units derived from a diacid Y, and/or b2) cyclic monomeric units derived from an amino acid Z, in which the summed amount of monomeric units derived from X,Y and Z is between 0.1 to 4.5 wt % by weight with respect to the total weight of the copolyamide and wherein the yarn has a tensile strength of at least 80 cN/tex as measured according to ASTM D885-04. The invention also relates to a process for preparing the yarn.

Abstract: This disclosure relates to a flexible metal laminate including a porous polyimide resin layer including 30 wt % to 95 wt % of a polyimide resin, and 5 wt % to 70 wt % of fluorine-containing resin particles, wherein micropores having a diameter of 0.05 ?m to 20 ?m are distributed in the porous polyimide resin layer, and a method for preparing the same.

Abstract: A transparent, amorphous polyamide molding compound contains polyamides which are formed by polycondensation of a linear aliphatic dicarboxylic acid with a cycloaliphatic diamine and also blends thereof, and also additives and/or colorants. The linear aliphatic dicarboxylic acid is selected from dicarboxylic acids with 17 to 21 C atoms and the diamine is bis(3-methyl-4-aminocyclohexyl)methane (MACM) and cross-linking additives, in the case of the additives, and photochromic colorants, in the case of the colorants, are precluded.

Abstract: Provided is a thermoplastic resin composition which is excellent in platability (appearance of plating), and keeps high reflectance even after thermal aging. A thermoplastic resin composition comprising: per (A) 100 parts by weight of a crystalline thermoplastic resin having a melting point, measured by differential scanning calorimetry (DSC) at a heating rate of 10° C./min, of 250° C. or above; (B) 10 to 80 parts by weight of a glass filler; (C) 1 to 30 parts by weight of a laser direct structuring additive having a reflectance at 450 nm of 25% or above; and (D) 20 to 150 parts by weight of titanium oxide.

Abstract: Semiaromatic, semicrystalline copolyamide molding compositions, comprising A) from 35 to 100% by weight of a copolyamide composed of a1) from 35 to 69% by weight of units which derive from hexamethylenediamine and from an aromatic dicarboxylic acid having from 8 to 16 carbon atoms, a2) from 31 to 65% by weight of units which derive from 3,3?-dimethyl-4,4?-diaminodicyclohexylmethane and from terephthalic acid, a3) from 0 to 30% by weight of units of a semicrystalline polyamide different from a1) and a2), B) from 0 to 65% by weight of further additives, where the total of the percentages by weight of A) and B) is 100%.

Abstract: The invention relates to a copolyamide comprising at least two different units corresponding to the following general formulation: A/X.T A is chosen from a unit obtained from an amino acid, a unit obtained from a lactam and a unit corresponding to the formula (Ca diamine).(Cb diacid), with a representing the number of carbon atoms of the diamine and b representing the number of carbon atoms of the diacid, a and b each being between 4 and 36, advantageously between 9 and 18, X.

Abstract: This is to provide a polyamide resin which can sufficiently ensure all of a relative viscosity ?r (high degree of polymerization), moldable temperature range estimated from a temperature difference (Td?Tm), heat resistance estimated from a melting point Tm, melt moldability estimated from a temperature difference (Tm?Tc), and low water absorbability as compared with the conventional polyoxamide resin. This is a polyamide resin comprising a dicarboxylic acid-derived unit and a diamine-derived unit being bonded, wherein the above-mentioned dicarboxylic acid contains oxalic acid (Compound A), and the above-mentioned diamine contains 1,6-hexanediamine (Compound B) and 2-methyl-1,5-pentanediamine (Compound C).

Abstract: A polyamide resin composed of constitutional units derived from a diamine component 70 mol % or more of which is derived from p-xylylenediamine and constitutional unit derived from a dicarboxylic acid 70 mol % or more of which is derived from an aliphatic dicarboxylic acid having 6 to 18 carbon atoms. The polyamide resin has a number average molecular weight (Mn) of 10,000 to 50,000 and a degree of dispersion (weight average molecular weight/number average molecular weight=Mw/Mn) satisfying the following formula (1): 1.5?(Mw/Mn)?6.0, wherein Mw and Mn are determined by gel permeation chromatography (GPC).

Abstract: A polyamide block copolymer that includes a first segment including a repeating unit represented by Chemical Formula 1, a repeating unit represented by Chemical Formula 2, or a combination thereof; and a second segment including a repeating unit represented by Chemical Formula 3. The variables R1 to R15, and n1 to n8 are defined herein.

Abstract: A polyamide modified by a multi-functional compound, and a method for producing said polyamide and compositions comprising same are described. A method for the production of a polyamide comprising linear macromolecular chains and star-shaped macromolecular chains is also described. A resulting polyamide having optimal mechanical and rheological properties in order to (i) improve mould filling speed and quality, and (ii) produce moldable compositions with high filler contents is also described.

Abstract: The present invention relates to: a polyamide resin which is a copolymer of a mixture comprising (a1) one or more aliphatic diamine monomers selected from C4 to C10 aliphatic diamines, and (a2) one or more aliphatic diamine monomers selected from C11 to C18 aliphatic diamines, and a mixture comprising (b1) one or more aromatic dicarboxylic acid monomers selected from aromatic dicarboxylic acids, and (b2) one or more aliphatic dicarboxylic acid monomers selected from C4 to C14 aliphatic dicarboxylic acids, and has an amine and acid end group number greater than about 0 ?eq/g to about 150 ?eq/g; a preparation method thereof; and an article comprising the same.

Abstract: Crosslinked polyimide-poly(alkylene oxide) copolymers capable of holding large volumes of liquid while maintaining good dimensional stability. Copolymers are derived at ambient temperatures from amine endcapped amic-acid oligomers subsequently imidized in solution at increased temperatures, followed by reaction with trifunctional compounds in the presence of various additives. Films of these copolymers hold over four times their weight at room temperature of liquids such as ionic liquids (RTIL) and/or carbonate solvents. These rod-coil polyimide copolymers are used to prepare polymeric electrolytes by adding to the copolymers various amounts of compounds such as ionic liquids (RTIL), lithium trifluoromethane-sulfonimide (LiTFSi) or other lithium salts, and alumina.

Abstract: The invention concerns processes for forming a polymer comprising residues of terephthaloyl chloride, paraphenylene diamine, and a salt of formula I wherein A? is a halogen anion, HSO4?, OH?, NO3?, C2H3O2?, or H2PO4?; the process comprising the steps of: a) forming a mixture comprising salt of formula I and paraphenylene diamine in a solvent system comprising an organic solvent and an inorganic salt; and b) adding terephthaloyl chloride to the mixture and allowing the formation of the polymer.

Abstract: There is provided a production method of a crystalline polyamide resin by thermal polycondensation of a mixture including at least a diamine component, a dicarboxylic acid component and water as a starting material, wherein the diamine component includes (A) pentamethylene diamine at a ratio that is equal to or greater than 10 mol % and less than 80 mol % relative to a gross amount of the diamine component; and the dicarboxylic acid component includes (B) at least one selected from the group consisting of an aromatic dicarboxylic acid, an alicyclic dicarboxylic acid and dialkyl ester derivatives thereof at a ratio that is equal to or greater than 76 mol % and equal to or less than 100 mol % relative to a gross amount of the dicarboxylic acid component, the production method comprising: a first step that heats the above mixture, which has a water content equal to or less than 30% by weight, at a temperature equal to or higher than 200° C. under a pressure of 1.8 to 3.

Abstract: A method for producing a petroleum resin including removing a low-molecular mist by means of a filter.

Abstract: A process for making a polyamide polymer, said process comprising heating, in one or more ionic liquid(s), one or more polyamide precursor(s) selected from: (i) one or more free dicarboxylic acid(s) or ester(s) thereof, with one or more diamine(s); or (ii) one or more salt(s) of a dicarboxylic acid with a diamine; or (iii) one or more lactam(s); or (iv) mixtures of any of the foregoing precursors (i) to (iii).

Abstract: The process for preparing a polyamide based on dicarboxylic acids and diamines has the following stages: 1) providing an aqueous monomer mixture of dicarboxylic acids and diamines, the molar ratio of dicarboxylic acids to diamines being adjusted such that a molar deficiency of dicarboxylic acids or diamines of from 1 to 10 mol % is present at the outlet of stage 3), based on the other component in each case, 2) transferring the aqueous mixture from stage 1) to a continuous evaporator reactor in which diamines and dicarboxylic acids are reacted at a temperature in the range from 100 to 370° C. and a pressure in the range from 1 to 50 bar, 3) transferring the mixture from stage 2) to a separator which is operated at a temperature in the range from 100 to 370° C.

Abstract: The invention relates to a copolyamide comprising at least two different units corresponding to the following general formulation: A/X.T A is chosen from a unit obtained from an amino acid, a unit obtained from a lactam and a unit corresponding to the formula (Ca diamine).(Cb diacid), with a representing the number of carbon atoms of the diamine and b representing the number of carbon atoms of the diacid, a and b each being between 4 and 36, advantageously between 9 and 18, X.

Abstract: The present invention relates to components of mobile electronic devices made of an amorphous polyamide composition characterized by excellent mechanical properties, low moisture uptake, low distortion and very good aesthetical properties. The amorphous polyamide has recurring units derived from the polycondensation of a mixture of monomers of aromatic dicarboxylic acid(s), cycloaliphatic diamine(s) with 6 to 12 carbon atoms, and a third monomer with 10 to 16 carbon atoms.

Abstract: A liquid crystal alignment agent is provided that includes a polymer including polyamic acid including a repeating unit represented by the following Chemical Formula 1, polyimide including a repeating unit represented by the following Chemical Formula 2, or a combination thereof. In Chemical Formulae 1 and 2, each X1, X2, Y1 and Y2 is the same as in the detailed description.

Abstract: An object of the present invention is to provide a copolymer polyamide which has excellent strength, high-temperature strength, low water absorbance, low blocking properties, releasability and plasticizing time stability, and a copolymer polyamide composition which has excellent vibration fatigue characteristics, surface appearance and continuous productivity. A copolymer polyamide of the present invention is obtained by polymerizing (a) at least one alicyclic dicarboxylic acid, (b) one diamine having 8 or more carbon atoms, and (c) at least one copolymer component selected from the group consisting of the following (c-1) to (c-3): a (c-1) dicarboxylic acid other than the alicyclic dicarboxylic acid; a (c-2) diamine having fewer carbon atoms than the (b) diamine; and a (c-3) lactam and/or aminocarboxylic acid, and the copolymer polyamide satisfies specific conditions.

Abstract: A polyamide resin is a polymer comprising (A) aliphatic diamine; and (B) dicarboxylic acid, wherein the (A) aliphatic diamine includes (a1) a first aliphatic diamine monomer including a C4, C6, C8 or C10 aliphatic diamine or a combination thereof, and (a2) a second aliphatic diamine monomer including a C12, C14, C16 or C18 aliphatic diamine or a combination thereof. The polymer can have good melt processability, low absorbency, and/or excellent brightness.

Abstract: The invention relates to a copolyamide comprising units resulting from the polycondensation reaction of the following precursors: terephthalic acid (a), an aliphatic diamine (b) comprising x carbon atoms, x being an integer between 6 and 22, and an aminocarboxylic acid and/or a lactam (c) comprising a main chain and at least one linear or branched alkyl branching, the total number of carbon atoms of the aminocarboxylic acid and/or of the lactam (c) being between 12 and 36. The invention also relates to the process for preparing said copolyamide and to a composition comprising such a copolyamide.

Abstract: A polyimide and a polyimide film obtained by reacting: an aromatic diamine, and 3,3?,4,4?-biphenyltetracarboxylic acid dianhydride, pyromellitic acid dianhydride, p-phenylenediamine and 4,4?-diaminodiphenyl ether, the amount of the component (I) being 0.1 to 10.0 mol % and the amount of the components (II) being 99.9 to 90.0 mol % based on the total amount of the component (I) and the components (II) (in Formula (1), R1, R2, R3 and R4 are each independently selected from the group consisting of a hydrogen atom, a halogen atom, a nitrogen-containing group, a linear or branched alkyl group with 1 to 12 carbon atoms, a linear or branched alkenyl group with 2 to 12 carbon atoms, a linear or branched alkoxy group with 1 to 12 carbon atoms, a hydroxyl group, a nitrile group, a nitro group, a carboxyl group, a carbamoyl group and an aromatic group with 6 to 12 carbon atoms).

Abstract: The invention relates to a semi-aromatic polyamide, and a polyamide composition comprising the semi-aromatic polyamide, comprising a diamine component (a) comprising, based on the total number of moles of the diamine component (a): between 5 and 30 mole % of at least one C2-C5 diamine, between 5 and 30 mole % of at least one C7+ diamine, and between 45 and 90 mole % of a C6 diamine; and a dicaboxylic acid component (b) comprising, based on the total number of moles of the dicaboxylic acid component (b): at least 50 mole % of terephthalic acid and at most 50 mole % of another dicarboxylic acid.

Abstract: A polyamide resin comprising a dicarboxylic acid constitutional unit comprising an adipic acid unit and a diamine constitutional unit comprising a pentamethylenediamine unit and a hexamethylenediamine unit wherein a weight ratio of the pentamethylenediamine unit to the hexamethylenediamine unit being in the range of 95:5 to 60:40; a vibration-welded molded product having an excellent vibration welding strength, a hinged molded product and a binding band having an excellent low-temperature toughness, and a filament having an excellent transparency which are obtained from the polyamide resin; and a hinged molded product comprising a polyamide resin constituted of an adipic acid unit and a pentamethylenediamine unit.

Abstract: The invention relates to the use of a molding composition which comprises at least 50% by weight of a copolyamide, which is composed of the following monomer combination: a) from 65 to 99 mol % of a substantially equimolar mixture composed of an unbranched aliphatic diamine having from 6 to 18 carbon atoms and of an unbranched aliphatic dicarboxylic acid having from 6 to 18 carbon atoms, ?where the mixture composed of diamine and dicarboxylic acid comprises an average of from 8 to 12 carbon atoms, b) from 1 to 35 mol % of a substantially equimolar mixture composed of a cycloaliphatic diamine having from 8 to 20 carbon atoms and of a dicarboxylic acid having from 6 to 18 carbon atoms, for production of a printable or printed item, such as a ski topcoat.

Abstract: Polyamide having a melting point between 330° C. and 370° C., said polyamide comprising: a diamine component (a) comprising between 0 and 55 mole %, based on the total number of moles of the diamine component (a), of at least one aliphatic diamine having more than 6 carbon atoms, and between 45 and 100 mole %, based on the total number of moles of the diamine component (a), of at least one aliphatic diamine having at most 6 carbon atoms, and a dicarboxylic acid component (b) comprising more than 50 mole %, based on the total number of moles of the dicarboxylic acid component (b), of terephthalic acid, with the exception of a certain specific polyamide (P*).

Abstract: Polyamide terpolymer compositions, which contain biobased monomers and are suitable for making shaped articles, are disclosed. Comprised of three monomeric species polymerized randomly, including hexamethylene diamine, adipic acid and a bio-based monomer, the compositions are easier to process and have better dye uniformity than polyamides formed from melt-blended biobased components, and are comparable in dyeability, color fastnessand appearance retention performance to non-biobased polyamide copolymers.

Abstract: The present invention relates to a method for preparing wholly aromatic polyimide resin with improved heat-resistance. In particular, the present invention provides a method for preparing polyimide resin having enhanced heat-resistance and superior mechanical properties, especially elongation rate and tensile strength at high temperature through liquid polymerization of two kinds of aromatic tetracarboxylic dianhydrides and aromatic diamine whose mixed ratio is properly regulated. Since the polyimide prepared according to the method of the present invention exhibits high heat-resistance and improved ensile strength and elongation rate at high temperature while maintaining intrinsic properties of polyimide, it can be used as a core heat-resistant material of semiconductor and aerospace fields where higher heat-resistance and mechanical properties are required.

Abstract: The invention is directed to a transparent mold made of a polyamide molding material containing at least one polyamide formed from at least one diamine selected from the group of hexamethylene diamine (HMDA), bis-(4-amino-3-methylcyclohexyl)methane (MACM) and/or bis-(4-amino-cyclohexyl)methane (PACM) as well as from at least one dicarboxylic acid selected from the group of isophthalic acid (IPS), terephthalic acid (TPS) and/or dodecanedioic acid (DDS) or from the aforementioned diamines and dicarboxylic acids in combination with lactams and/or ?-/?-amino acids.

Abstract: A liquid crystal alignment agent includes a first polymer including polyamic acid including a repeating unit represented by the following Chemical Formula 1, polyimide including a repeating unit represented by the following Chemical Formula 2, or a combination thereof. A liquid crystal alignment film manufactured using the liquid crystal alignment agent, and a liquid crystal display including the liquid crystal alignment film are also provided.

Abstract: A curing agent for epoxy resin, and a coating composition using the curing agent curing agent that delivers excellent recoatability and overcoatability after a long time exposure. (A) An epoxy curing agent that is derived by adduction between amide-type reactants from polyamine compounds comprising from 25-75 mol % of a polyoxyalkylene-polyamine and carboxylic acids or a mixture thereof and glycidyl ether compound; (B) An epoxy curing agent of the mixture of (B1) amide-type reactants prepared through polyoxyalkylene-polyamine and carboxylic acids or a mixture thereof, and (B2) a reactant is derived by adduction between other aliphatic polyamines or a mixture thereof and glycidyl ether compound. Coating composition comprising the epoxy curing agent of the above described A or B.

Abstract: To provide a polyamide resin excellent in lasting thermal stability and having a high biomass ratio. A polyamide resin comprising adipic acid units, pentamethylenediamine units and 6-aminocaproic acid units as constituents, wherein the weight ratio of the sum of the adipic acid units and the pentamethylenediamine units to the 6-aminocaproic acid units is 97:3 to 75:25. The pentamethylenediamine is preferably one produced from lysine using lysine decarboxylase, lysine decarboxylase-producing cells or a treated product of the cells.

Abstract: A metal-coated polyimide film is excellent in long-term adhesion reliability, exhibits various dimensional stabilities, and is particularly suitable for FPC, COF and TAB applications. The metal-coated polyimide film comprises a non-thermoplastic polyimide film; and a metal layer being directly formed on one surface or both surfaces of the non-thermoplastic polyimide film without using an adhesive, wherein the non-thermoplastic polyimide film contains a non-thermoplastic polyimide resin having a thermoplastic polyimide block component.

Abstract: The present invention provides energetically and economically efficient methods for separating polyamide polymer(s) from commingled materials. The methods generally involve precipitating a polyamide polymer dissolved in a solvent (e.g., formic acid) using dimethyl ether (DME) as an antisolvent. The methods comprise dissolving the polyamide polymer in a solvent that (i) selectively dissolves the polyamide polymer relative to the other materials and (ii) has a higher solubility for DME relative to the polyamide polymer; and then contacting the mixture of the solvent with the dissolved polyamide polymer with DME, thereby precipitating the polyamide polymer.

Abstract: The invention relates to a plastic container or conduit for a cooling system, a heating system, an air intake system, an exhaust system, a pressure system or a fuel system, consisting of or comprising a part or a layer made of a thermoplastic polymer composition comprising a semi-crystalline semi-aromatic polyamide having a glass transition temperature (Tg) of at least 115° C.

Abstract: The invention relates to a polyamide molding material or copolyamide molding material and the use of such a polyamide molding material or copolyamide molding material for producing steam-sterilizable transparent moldings and extrudates. This polyamide molding material is characterized in that it comprises at least one copolyamide formed from 35-42 mol % of bis(4-amino-3-methylcyclohexyl)methane (MACM), 35-42 mol % of isophthalic acid (IPS) and 16-30 mol % of laurolactam (LC12). MACM may be replaced up to 50% by bis(4-aminocyclohexyl)-methane (PACM) and IPA up to 50% by terephthalic acid (TPA). The polyamide molding material may also be a blend of copolyamides or a blend of copolyamides with polyamide 12. The relative viscosity (RV) of the polyamide molding material or copolyamide molding material is in any case adjusted to a value which is greater than 1.45.

Abstract: A method for forming a polyimide composite article utilizes a polyimide resin system including at least a first prepolymer component and a second prepolymer component. A preform structure is tackified with the first prepolymer component. Using resin infusion or resin transfer molding techniques, the tackified preform structure is contacted with the second prepolymer component. The polyimide resin system is cured under suitable cure conditions so that the first and second prepolymer components mix and react to produce the polyimide composite structure.

Abstract: A polyamide molding composition is described, comprising at least one transparent polyesteramide in a proportion by weight of from 70 to 99.99% by weight; at least one further polymer in a proportion by weight of from 0 to 30% by weight; at least one photochromic dye in a proportion by weight of from 0.01 to 2% by weight; and also optionally further dyes and/or additives. The invention further encompasses articles manufactured therefrom, e.g. foils, for the coating of photochromic ophthalmic lenses, or the like.

Abstract: The invention relates to a polyamide comprising at least two units having the following general formula: X.Y where: X is an alkylaromatic diamine and Y is an aliphatic carboxylic diacid selected from dodecanedioic (C12) acid, tetradecanedioic (C14) acid, hexadecanedioic (C16) acid, characterized in that the carboxylic diacid comprises organic carbon from a renewable source determined according to standard ASTM D6866 The invention also relates to a composition comprising this polyamide and the use of said polyamide and of such a composition.

Abstract: The present invention is directed to the effective dispersion of carbon nanotubes (CNTs) into polymer matrices. The nanocomposites are prepared using polymer matrices and exhibit a unique combination of properties, most notably, high retention of optical transparency in the visible range (i.e., 400-800 nm), electrical conductivity, and high thermal stability. By appropriate selection of the matrix resin, additional properties such as vacuum ultraviolet radiation resistance, atomic oxygen resistance, high glass transition (Tg) temperatures, and excellent toughness can be attained. The resulting nanocomposites can be used to fabricate or formulate a variety of articles such as coatings on a variety of substrates, films, foams, fibers, threads, adhesives and fiber coated prepreg. The properties of the nanocomposites can be adjusted by selection of the polymer matrix and CNT to fabricate articles that possess high optical transparency and antistatic behavior.

Abstract: Disclosed is a polyimide film for insulating material prepared by reacting an acid anhydride and diamine compounds comprising p-phenylenediamine. The polyimide film has excellent electric properties such as a coefficient of thermal expansion, an elongation, a intensity, a dielectric strength and a bulk resistance, and suitable for use in a TAB tape employing a polyimide film, and a flexible printed wiring board.

Abstract: Relates to the use of a thermoplastic polymer molding compound for producing metallically coated light-reflecting components based on thermoplastics, which are suitable for operating temperatures of at least 200° C. The polymer molding compound used according to the present invention is characterized in that it comprises polyamides which are selected from a group which comprises homopolyamides, copolyamides, and mixtures (blends) made of homopolyamides and copolyamides and mixtures made of homopolyamides or copolyamides, these polyamides being selected from a group which comprises amorphous and transparent polyamides, and these polyamides having a glass transition temperature (Tg) of at least 205° C. Light-reflecting components produced according to the use according to the present invention are suitable for operating temperatures of at least 200° C. and comprise reflectors for traveling lights of vehicles, for signal and lighting devices, and reflectors for solar collectors.

Abstract: A non-thermoplastic polyimide film exhibits high adherability without expensive surface treatment and is made from a precursor solution having high storage stability. The non-thermoplastic polyimide film comprises a non-thermoplastic polyimide resin having a block component derived from a thermoplastic polyimide. Preferably, the block component of the thermoplastic polyimide is present in an amount of 20 to 60 mol % of the entire polyimide so that the precursor solution thereof exhibits high storage stability and that the film can exhibit high adherability, in particular, high adherability to polyimide adhesives.

Abstract: The invention relates to a copolyamide containing at least two patterns (monomers) and of the following general formula A/(Cz diamine)·(Cw diacid) in which: z is the number of carbon atoms of the diamine and w is the number of carbon atoms of the diacid; and A is selected from a pattern obtained from an amino acid and a pattern of the general formula (Cx diamine)·(Cy diacid)y, wherein x is the number of carbon atoms of the diamine and y is the number of carbon atoms of the diacid, the amino acid, each diamine and each diacid being obtained from a renewable raw material according to ASTM D6866 standard. The invention also relates to a composition containing the copolyamide and to the use of this copolyamide and of such a composition, essentially for producing thermofusable glues, in any form thereof.

Abstract: The present invention is directed to the use polycyclic diamines. These diamines, when polymerized with dianhydrides, and optionally other non-polycyclic diamines are used to form new polyamic acids. The polyamic acids can be imidized to form a new class of useful polyimide resins and polyimide films, particularly in electronics type applications.

Abstract: Modified polyamides having enhanced flowability/mechanical properties are prepared by polymerization of diacid and diamine monomers in the presence of multifunctional and monofunctional compounds capable of forming an amide function by reaction with either an aminated functional group or an acid functional group and are formulated into useful molding compositions.