Abstract: The present invention is directed to the use polycyclic diamines. These diamines, when polymerized with dianhydrides, and optionally other non-polycyclic diamines are used to form new polyamic acids. The polyamic acids can be imidized to form a new class of useful polyimide resins and polyimide films, particularly in electronics type applications.

Abstract: Semiaromatic semicrystalline thermoplastic polyamide molding compositions, comprising A) from 40 to 100% by weight of a copolyamide composed of a1) from 30 to 44 mol % of units which derive from terephthalic acid a2) from 6 to 20 mol % of units which derive from isophthalic acid a3) from 42 to 49.5 mol % of units which derive from hexamethylenediamine a4) from 0.5 to 8 mol % of units which derive from aromatic diamines having from 6 to 30 carbon atoms, where the molar percentages of components a1) to a4) together give 100%, and B) from 0 to 50% by weight of a fibrous or particulate filler C) from 0 to 30% by weight of an elastomeric polymer D) from 0 to 30% by weight of other additives and processing aids, where the percentages by weight of components A) to D) together give 100%.

Abstract: The present disclosure describes comprises a polyimide composition comprising at least one diamine monomer and at least two dianhydride monomer types, at least two diamine monomer types and at least one dianhydride monomer at least two diamine monomer types and at least two dianhydride monomer types. In one embodiment, the diamine monomers are 2,2-bis[4-(4aminophenoxy)phenyl]-hexafluoropropane (BDAF) or 4,4?-diaminobenzanilide (DABA) or combinations of the foregoing and the dianhydride monomers are 4,4?-(hexafluoroisopropylidene)di-phthalicanhydride (6-FDA) and 3,3?,4,4?-biphenyltetracarboxylic acid dianhydride (s-BDPA) or combinations of the foregoing. The polyimide compositions described herein have controllable and variable properties, such as but not limited to CTE, allowing the use of the polyimide compositions in a wide variety of applications.

Abstract: Disclosed is a hydroxy polyamide represented by the following general formula (1) and having a 5-amino isophthalic acid derivative structure in the main chain structure. (1) (In the formula, m and n represent integers, X represents at least one tetravalent organic group, Y represents at least one divalent organic group having a 5-amino isophthalic acid derivative structure, and Z represents at least one divalent organic group).

Abstract: A method for forming a polyimide composite article utilizes a polyimide resin system including at least a first prepolymer component and a second prepolymer component. A preform structure is tackified with the first prepolymer component. Using resin infusion or resin transfer molding techniques, the tackified preform structure is contacted with the second prepolymer component. The polyimide resin system is cured under suitable cure conditions so that the first and second prepolymer components mix and react to produce the polyimide composite structure.

Abstract: New photosensitive PBO precursor polymers which contain diazoquinone moieties attached to its backbone and in which all amino end groups are converted into amide groups. The photosensitive formulation based on the disclosed PBO precursor polymers have good imaging and mechanical properties as well as superior shelf life stability. Photosensitive polybenzoxazole precursor polymers having (sulfon)amide end groups (with or without attached diazoquinone groups) can be formulated into photosensitive compositions with diazoquinone photoactive compounds which lack benzylic hydrogens on the backbone to yield compositions producing films significantly lighter in color after curing.

Abstract: The invention relates to new thermoplastically processible transparent polyamide molding materials based on copolyamides containing diamines and dicarboxylic acids with aromatic cores which exhibit a high index of refraction nD20 over 1.59 and a low density under 1.3 g/cm3. At the same time, a low birefringence, high hardness, and scratchresistance are achieved. The polyamide molding materials are fabricated by means of conventional pressure reactors (autoclaves) according to a modified technique. The granulate that is produced from the inventive molding materials is reshaped by thermoplastic processes like injection molding, particularly in multichamber cavity tools. The invention also relates to the utilization of the inventive molding materials for producing optical lenses.

Abstract: The invention relates to a continuous process for manufacturing polyamides. The polyamides are of the type obtained from diacids and diamines. The process comprises an operation of continuous mixing of a compound which is rich in amine end groups and a compound which is rich in acid end groups and a polycondensation operation using the mixture. The invention relates to the starting phase of such a process, during which an aqueous solution comprising a mixture of monomers in substantially stoichiometric proportions is used.

Abstract: Transparent polyamide molding materials are provided which are characterized in that they have a melting enthalpy between 0 and 12 J/g and the polyamides are constituted of 100 mole-% of a diamine mixture having 10-70 mole-% of PACM [bis-(4-amino-cyclohexyl)-methane] with less than 50 wt.

Abstract: The present invention relates to novel aspartates, their method of production and the use of these aspartates as reactive components for polyisocyanates in two-component polyurethane coating compositions and for preparing polyurethane prepolymers. The aspartates are prepared by first reacting a di- or polyamine with an unsaturated ester and then reacting the resultant product with a maleimide.

Abstract: This invention is a series of rod-coil block polyimide copolymers that are easy to fabricate into mechanically resilient films with acceptable ionic or protonic conductivity at a variety of temperatures. The copolymers consist of short-rigid polyimide rod segments alternating with polyether coil segments. The rods and coil segments can be linear, branched or mixtures of linear and branched segments. The highly incompatible rods and coil segments phase separate, providing nanoscale channels for ion conduction. The polyimide segments provide dimensional and mechanical stability and can be functionalized in a number of ways to provide specialized functions for a given application. These rod-coil black polyimide copolymers are particularly useful in the preparation of ion conductive membranes for use in the manufacture of fuel cells and lithium based polymer batteries.

Abstract: This invention is a series of mechanically resilient polymeric films, comprising rod-coil block polyimide copolymers, which are doped with a lithium compound providing lithium ion conductivity, that are easy to fabricate into mechanically resilient films with acceptable ionic or protonic conductivity at a variety of temperatures. The copolymers consists of short-rigid polyimide rod segments alternating with polyether coil segments. The rods and coil segments can be linear, branched or mixtures of linear and branched segments. The highly incompatible rods and coil segments phase separate, providing nanoscale channels for ion conduction. The polyimide segments provide dimensional and mechanical stability and can be functionalized in a number of ways to provide specialized functions for a given application. These rod-coil black polyimide copolymers are particularly useful in the preparation of ion conductive membranes for use in the manufacture of fuel cells and lithium based polymer batteries.

Abstract: Polyimides displaying low color in thin films, atomic oxygen resistance, vacuum ultraviolet radiation resistance, solubility in organic solvents in the imide form, high glass transition (Tg) temperatures, and high thermal stability are provided. The poly(amide acid)s, copoly(amide acid)s, polyimides and copolyimides are prepared by the reaction of stoichiometric ratios of an aromatic dianhydride with diamines which contain phenylphosphine oxide groups in polar aprotic solvents.

Abstract: A process for the preparation of novel polyamides, the use of such polyamides for the production of fibers, sheets and moldings, and fibers, sheets and moldings obtainable from such polyamides, are provided.

Abstract: Polyhydroxyamides are polymerized to form highly-crosslinked, temperature-stable polymers. The polyhydroxyamides include as their central, parent structure a benzenetricarboxylic acid to which side chains containing a terminal reactive group are attached by an amide bond. By way of this reactive group, highly crosslinked polymers can be formed. In addition, the polyhydroxyamide can be added as an additive to polymers in order to bring about three-dimensional crosslinking.

Abstract: The invention relates to a semi-aromatic polyamide containing at least tetramethylene terephthalamide units and also hexamethylene terephthalamide units. The copolyamide has a melting point higher than approximately 290° C., a high crystallinity and a good stability. Preferably the copolyamide according to the invention contains approximately 30-75 mol % hexamethylene terephthalamide units and also approximately 0.01-20 mol % other units. The invention also relates to a process for the preparation of a semi-aromatic copolyamide containing at least tetramethylene terephthalamide units and hexamethylene terephthalamide units, characterized in that, successively, a first polymerization is effected in the melt phase, followed by an post-polymerization of the low molar mass polymer thus obtained in the solid phase; and to compositions and products that contain said copolyamide.

Abstract: Nitrocellulose-compatible laminating ink resin is prepared by reacting together reactants including polymerized fatty acid, co-diacid, monoacid, secondary diamine and C6 diamine, or reactive equivalents thereof. The resin may be used in printing compositions, and particularly printing compositions that also contains nitrocellulose, and that is useful in laminating printing onto plastic film.

Abstract: Hot melt adhesives are prepared using thermoplastic polyamides derived from polymerized fatty acid components. The adhesives are particularly useful for bonding nonpolar substrates such as poly-&agr;-olefins.

Abstract: Poly-o-hydroxyamides are cyclicized to obtain polybenzoxazoles. The poly-o-hydroxyamides provide effective filling of trenches. In particular, the poly-o-hydroxyamides can fill trenches having a width of less than 100 nm and an aspect ratio of more than 4. Further, the polybenzoxazoles of the invention are very suitable for the damascene process. A dielectric can be made from the polybenzoxazole. In turn, semiconductor devices can include the dieletric. Processes for making the poly-o-hydroxyamides, polybenzoxazoles, and semiconductor devices are included.

Abstract: In the production of polyamide by the melt-polymerization of the present invention, the polymerization conditions are rapidly and accurately controlled by a near-infrared spectroscopy to enable the efficient production of a desired polyamide with a good stability in its quality.

Abstract: A new paradigm of disease centers around the metabolic pathways of S-adenosyl-L-methionine (SAM), the intermediates of these pathways and other metabolic pathways influenced by the SAM pathways. Methods are provided to analyze and modulate SAM pathways associated with a disease or condition. Such methods permit identification and utilization of diagnostic and therapeutic protocols and agents for such disease states and conditions.

Abstract: Copolyamides, consisting of polycondensation products of the following components: caprolactam 10 to 45 mol-%, laurolactam 30 to 55 mol-%, at least 2 dicarboxylic acids 20 to 50 mol-% of the following compounds, aliphatic &agr;,&ohgr;-dicarboxylic acids with 6 up to 14 C atoms inclusively, terephthalic acid, isophthalic acid and 2,6-naphthalene dicarboxylic acid, wherein the content of aromatic dicarboxylic acids is lower than 10 mol-%, with reference to the allover amount of the above-mentioned components, which add up to 100 mol-%, a diamine mixture in an amount that is equimolar to that of the dicarboxylic acids, chosen from the group of the following substances, hexamethylene diamine, piperazine and/or 2-methyl-1,5-diaminopentane, wherein the molar content of hexa-methylene diamine is between 75 and 95 mol-% with reference to the diamine mixture. The copolyamides according to the invention are used for the production of mono- and multifilaments, fibers, films and nets.

Abstract: The instant invention provides an aromatic polyamide composition for molding which is of superior rigidity, strength, toughness, dimensional stability, resistance to chemicals, external surface appearance and sliding characteristics in high-humidity, high-temperature environments, which has a low coefficient of linear expansion and which is of low warpage.

Abstract: An electrically insulating crosslinked thin-film-forming organic resin composition comprising (A) an electrically insulating organic resin having silicon atom-bonded hydrogen atoms or silicon atom-bonded alkenyl groups and (B) a solvent, and a method for forming a crosslinked thin film therefrom.

Abstract: The invention relates to a polyamide composition for the production of electrical and electronic components that are suitable for the conditions of the surface mounting technology. In particular, the composition exhibits a high resistance to blistering during the reflow soldering process. The composition according to the invention comprises (a) a polyamide having a melting point higher than 280° C., (b) a polymer having a melting point lower than 230° C., (c) a halogen-containing compound, (d) optionally a synergist for the flame-retardant properties (e) reinforcing material (f) optionally other additives. A particularly good resistance to blistering is achieved if (f) contains at least a compound with acid imide groups.

Abstract: The invention relates to a granule and granulate and to a process for the preparation of polyamide granules at least comprising

Abstract: Compositions comprising: (a) from about 51% to about 99.9% by weight of a polyamide resin component; and (b) from about 0. 1% to about 49% by weight of a wax component, wherein the polyamide resin component comprises a reaction product obtained by reaction of a dimerized fatty acid reactant, a carboxylic acid reactant and a diamine reactant, are disclosed for use in thermographic printing. The polyamide resin/wax component compositions disclosed herein exhibit decreased bloom and enhanced scratch/scuff resistance.

Abstract: A process for making partially aromatic polyamides is provided in which an aromatic dicarboxylic acid component, at least 20-100% by weight of the dicarboxylic acid in the acid component is in the form of an alkylated ester, and a diamine component, comprising a diamine having from 6-12 carbon atoms, are admixed in the presence of water and with heating to form polyamide having from 1-100% on a molar basis of N-alkylated amide and amine groups. The polyamides are particularly useful in the manufacture of products intended for use at elevated temperatures or products in which retention of properties at elevated temperatures is required, including articles using injection molding technology, parts for automotive end-uses and electronics. The polyamides can also be formed into films and fibers for use in associated products.

Abstract: The polyamic acid of the invention can be obtained by the reaction of an acid anhydride component comprising pyromellitic anhydride and 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane with 2,2′-di-substituted-4,4′-diaminobiphenyls as a first aromatic diamine and any aromatic diamine component, as a second aromatic diamine, of 2,2-bis(4-aminophenoxyphenyl)propanes, 1,1-bis(4-(4-aminophenoxy)-3-t-butyl-6-methylphenyl)butane, 2,2-bis(3-amino-4-methylphenyl)hexafluoropropane and &agr;,&agr;′-bis(4-aminophenyl)diisopropylbenzenes in an organic solvent. The polyimide resin of the invention can be obtained by heating such a polyamic acid solution. In the production of a circuit board, by using a photosensitive polyamic acid having a sensitizer incorporated in such a polyamic acid solution, a patterned polyimide resin layer can be provided as an insulation layer on a metal foil.

Abstract: The synthesis of dimethyl-1,5-naphthalenedicarboxylate and polymers and articles formed therefrom is disclosed, as well as applications for dimethyl-1,5-naphthalenedicarboxylate, its corresponding acid 1,5-NDA, and various synthesis intermediates.

Abstract: Disclosed in the present invention is a process for modifying a polyamide polymer comprising contacting a reactive modifier with diamine/diacid salt and/or an amino-acid of a hydrolyzed lactam or lactam to form a modified polyamide. A second embodiment of the present invention is a process for modifying a polyamide polymer comprising contacting a reactive modifier with diamine then contacting the resulting modified diamine with diacid and/or lactam to form a modified polyamide.

Abstract: The invention relates to the use of polyamide moulding compounds, their alloys or blends, which contain at least one homopolyamide, which has been obtained from long-chained aliphatic monomer blocks with cycloaliphatic monomer blocks, in order to manufacture moulded members for optical or electro-optical applications.

Abstract: This invention relates to high temperature, semi-crystalline, semi-aromatic nylon copolymers with improved shrinkage and blistering resistance, made from terephthalic acid (TA), hexamethylene diamine (HMD) and another aliphatic dicarboxylic acid as monomers. These polymers display superior % TD (Transverse Direction) annealing shrinkage, superior resistance to blistering when formulated with flame retardant additives and reinforcement under infrared (IR) reflow soldering conditions for electronic conectors, as well as a very good balance of mechanical performance as high temperature nylons.

Abstract: A method for binding ceramic materials in aqueous media is disclosed. The method utilizes water-soluble cross-linked polyamides prepared by condensation polymerization for binding various classes of ceramic materials.

Abstract: A method for the production and use of a catalytically-acting liquid system is offered, which has no or only a small proportion of free lactam, and which is of low viscosity and good storage stability and which directly initiates the anionic lactam polymerization.

Abstract: An improved method for manufacturing poly(hexamethylene adipamide), i.e. nylon 6,6, by reacting monomethyl adipate with hexamethylenediamine in an approximately equimolar ratio in the presence of water at a temperature of 100 to 165.degree. C. while simultaneous distilling off of a stoichiometric amount of methanol. The resulting aqueous intermediate product is then heated to 200 to 260.degree. C. while distilling off substantially all water at a pressure of 150 to 250 psig (1.03 .times.10.sup.6 to 1.72 .times.10.sup.6 Pa) followed by reducing the pressure to atmospheric pressure and increasing the temperature to 270 to 280.degree. C. to polycondense the distillate residue. Such a process is useful in producing high purity commercial grade poly(hexamethylene adipamide) that advantageously avoids problems caused by N-methylation of the polyamide.

Abstract: A polyamide composition which is amorphous and transparent, which has reduced flammability, and which has reduced migration of flame-retardant additive so that it is film-free, includes at least one polyamide which contains cycloaliphatic monomer units and which is amorphous and transparent; and a flame-retardant additive which is present in an amount effective to reduced flammability of the polyamide composition, which is dissolved in the at least one polyamide, and which is at least one alkyl phosphonic acid compound having a general formula: ##STR1## wherein R and R' each represent, independent of each other, an alkyl group having from 1 to 4 carbon atoms, and x=0 or 1. An article molded from this composition is transparent, has reduced flammability, and has reduced migration of flame-retardant additive so that it is film-free.

Abstract: This invention relates to high temperature, semi-crystalline, semi-aromatic nylon terpolymers with improved shrinkage resistance, made from terephthalic acid (TA), hexamethylene diamine (HMD) and/or 2-methyl pentamethylene diamine (2-MPMD) and another aliphatic dicarboxylic acid as monomers. These polymers display superior % TD (Transverse Direction) annealing shrinkage, as well as very good balance of mechanical performance as high temperature nylons.

Abstract: In a process for the preparation of poly-o-hydroxyamides and poly-o-mercaptoamides, a bis-o-aminophenol or a bis-o-aminothiophenol is reacted with a dicarboxylic acid derivative of the following structure: ##STR1## with D=O, S, or NH and where R* is the parent body of the dicarboxylic acid and at least one of the groups R.sup.1 and R.sup.2 is CN or NO.sub.2.

Abstract: It has been found that fibers which incorporate very good mechanical properties as well as very good adhesive properties can be made from an optically anisotropic spinning solution containing a mixture of a paraphenylene groups-containing, wholly aromatic polyamide component and another polyamide component if for the para-aromatic polyamide component full or partial use is made of copolymer in which 2,6-naphthylene units are present in addition to the paraphenylene units and the other polyamide component is an aliphatic polyamide. Preferably, the weight ratio of the para-aromatic polyamide component to the aliphatic polyamide component is 95:5 to 85:15. The aromatic copolyamide containing paraphenylene and 2,6-naphthylene is preferably obtained by polymerising paraphenylene diamine (PPD) and a stoichiometric amount of a mixture composed of terephthalic acid dichloride (TDC) and 2,6-naphthylene carboxylic acid dichloride (NDC) in a molar ratio TDC:NDC of 99:1 to 80:20.

Abstract: Polyamides are built up from, as fundamental building blocks (a), lactams or aminocarboxylic acids or mixtures of these,as fundamental building blocks (b), from 1 to 50 .mu.mol of at least tribasic amines or carboxylic acids per gram of polyamide,as fundamental building blocks (c), dibasic carboxylic acids or amines andas fundamental building blocks (d), monobasic carboxylic acids or amines,where (c) and (d) are carboxylic acids if (b) are amines, and (c) and (d) are amines if (b) are carboxylic acids,the equivalents ratio of the functional groups of (b) to the functional groups of (c) and (d) together is from 60:40 to 40:60 andthe equivalents ratio of the functional groups of (c) to the functional groups of (d) is from 15:85 to 60:40.

Abstract: Disclosed is a polymeric composite material in which metal sulfide microparticles having optical characteristics are uniformly dispersed and suspended in a high polymer material at high concentration. The polymeric composite material comprises metal sulfide microparticles formed by a reaction of a functional group in a matrix forming material having the functional group, the metal sulfide microparticles being dispersed in a matrix. It is desirable that the matrix includes a compound having the structure represented by formulae (1) to (5).

Abstract: A process is provided for preparing a dispersion of a polyamide in water, said process comprising:forming a solution of a polyamide having an acid value of greater than about 2 in an organic solvent to form a solution of said polyamide in said solvent, said polyamide and said solvent being at a temperature below the softening point of said polyamide during said dissolving, said solution further comprising a surfactant, wherein at least a portion of the acid value of said polyamide is neutralized,adding sufficient water to said solution with mixing to form an oil-in-water dispersion, the temperature of said solution and said water being below the softening point of said polyamide during said adding, andremoving at least a major amount of said organic solvent from said oil-in-water dispersion. The resulting dispersion is useful in preparing a coating of the polyamide, which coating is useful as an adhesive.

Abstract: A method for binding ceramic materials in aqueous media is disclosed. The method utilizes water-soluble polyamides prepared by condensation polymerization for binding various classes of ceramic materials.

Abstract: A process for the preparation of polyester-imide resin of the formula ##STR1## wherein n represents the number of segments present and is a number of from about 10 to about 10,000; R' is alkyl or alkylene; and R is independently an oxyalkylene or a polyoxyalkylene by the reaction of trimellitic acid, or a trimellitic anhydride, a glycol and a diamine of the formula ##STR2## wherein R represents a hydrogen or alkyl group; and n represents the number of monomer segments, and is a number of from about 1 to about 10, and which reaction is accomplished by heating the aforementioned components.

Abstract: A method for binding ceramic materials in aqueous media is disclose. The method utilizes water-soluble polyamides prepared by condensation polymerization for binding various classes of ceramic materials.

Abstract: A process for producing composite materials which can be thermally postformed, with a matrix of polylactam produced by means of activated anionic polymerization is offered.

Abstract: A water solvent extraction degreasing method capable of reducing degreasing time without consideration of abrupt decomposition/vaporization and swelling caused by heat. An organic binder is removed from a molded product that is produced by a powder material mixed with the organic binder and this organic binder contains at least one water-soluble organic compound and at least one water-insoluble thermoplastic resin. The degreasing step of this method includes a water solvent extraction step for extracting the water-soluble organic compound from the organic binder contained in the molded product, using water as a solvent.

Abstract: This invention relates to a nonwoven web and fibers comprising a water soluble polyamide and articles constructed therefrom. The water soluble polyamide may be used alone or in combination with conventional thermoplastic web and fiber forming materials such as water insoluble polyethylene, polypropylene, polyester and polyamide. The water soluble polyamide may also be combined with biodegradable or selectively dispersible material to form nonwoven webs and fibers having various combinations of properties. Such water soluble webs and fibers have utility in the manufacture of disposable absorbent articles such as disposable diapers, feminine napkins, incontinent products and cellulosic articles such as tissues and towels, as well as for water soluble heat fusible webs for the textile industry.

Abstract: This invention relates to a nonwoven web comprising a water soluble polyamide and articles constructed therefrom. The water soluble polyamide may be used alone or in combination with conventional thermoplastic web forming materials such as water insoluble polyethylene, polypropylene, polyester and polyamide. The water soluble polyamide may also be combined with biodegradable or selectively dispersible material to form nonwoven webs having various combinations of properties. Such water soluble webs have utility in the manufacture of disposable absorbent articles such as disposable diapers, feminine napkins, incontinent products and cellulosic articles such as tissues and towels, as well as for water soluble heat fusible webs for the textile industry.