Abstract: A method of making paper in which dry chemical additives are incorporated into the pulp mixture by addition of an entire bag containing the additive directly to the mixture, the improvement being that the bag is sealed with an adhesive closure, the adhesive being a hot melt consisting essentially of a water dispersable polyamide prepared from a diacid component comprising in major portion an aliphatic diacid of 6 or fewer carbon atoms and a diamine component consisting of one or more compounds of the formula :H.sub.2 N--C.sub.y H.sub.2y --(OC.sub.2 H.sub.4).sub.x --O--C.sub.y H.sub.2y --NH.sub.2where y is 2 or 3 and x is 1-50 and a wax. Such bags will not leak in shipping and handling, and yet can be added directly to paper batches at ambient temperature in the manner of the unsealable bags employed in the prior art.

Abstract: A low-cost thermal decomposition degreasing method capable of drastically reducing the time required for a degreasing process which involves heating, vaporization and thermal decomposition, while assuring the shape retention property of an injection molded product during degreasing. The degreasing process comprises: (i) a first step wherein a molded product placed under a reduced pressure less than or equal to atmospheric pressure is heated at a temperature lower than the melting point of a thermoplastic binder so that the thermoplastic binder partially evaporates by 5 wt % or more, and then the molded product is further heated at a temperature lower than higher one of the melting points of a more volatile organic compound and a thermoplastic resin whereby the thermoplastic binder further evaporates by 10 wt % or more, and wherein the final temperature is set to 200.degree. C.

Abstract: The semiaromatic polyamide of the invention comprises 40 to 90% by mol of (A) recurring units derived from terephthalic acid and an aliphatic diamine of 4 to 12 carbon atoms, 0 to 50% by mol of (B) recurring units derived from isophthalic acid and an aliphatic diamine of 4 to 12 carbon atoms, 0 to 60% by mol of (C) recurring units derived from an aliphatic dicarboxylic acid of 4 to 18 carbon atoms and an aliphatic diamine of 4 to 12 carbon atoms and 0 to 50% by mol of (D) recurring units derived from a lactam or an aminocarboxylic acid of 6 to 20 carbon atoms, and has a content of boiling water-soluble components (MO components) of not more than 0.25% by weight. The semiaromatic polyamide has a low content of the MO components, so that mold contamination hardly brought about in the molding process, and also molded articles of good heat resistance can be produced.

Abstract: A polyamide resin comprising the reaction product obtained by the reaction of an acid component comprised of a major concentration of a dimer acid and minor concentration of a monobasic acid and an amine component comprised of a major concentration of a short-chain alkylenediamine, a first minor concentration of a medium-chain alkylenediamine and second minor concentration of a polyoxyalkylene diamine having a molecular weight greater than about 500 is provided. The polyamide resin is used to form a blend of containing the polyamide in a major amount by weight and a first minor amount by weight of a polar wax and a second minor amount by weight of a polyolefin elastomer. The composition is used to reinforce a footwear upper, e.g. as a print on box toe material.

Abstract: Improved high temperature polyamides, and particularly partially aromatic polyamides, containing less than about 40 .mu.eq/g carboxylic acid endgroups, when stabilized with a copper-containing thermal stabilizer, the polyamides exhibit improved thermal oxidative stability.

Abstract: A process for the activated anionic lactam polymerization is proposed, wherein a liquid system is employed, which simultaneously contains activator and anionic catalyst for the polymerization of the lactam.

Abstract: A polyamide resin composition having good molding fluidity, heat and chemical resistance and dimensional stability is provided containing: (A) 30-90 weight percent, based on components (A) and (B), of a polyamide resin containing (i) 10-99 weight percent, based on components (i) and (ii) of an aromatic polyamide containing a carboxylic acid component derived from terephthalic acid or a mixture of terephthalic and isophthalic acid in which the isophthalic acid constitutes 40 mole percent or less of the mixture, and an aliphatic diamine component derived from a mixture of hexamethylene diamine and 2-methylpentamethylene diamine; and (ii) 1-90 weight percent, based on components (i) and (ii), of at least one polyamide selected from the group consisting of polyamides containing repeat units derived from alipathic dicarboxylic acids and alipathic diamines and polyamides containing repeat units derived from aliphatic aminocarboxylic acids; and (B) 10-70 weight percent, based on components (A) and (B), of an inorgan

Abstract: This invention relates to a novel ternary polyamide for the production of monofilaments, films and injection moulded articles.

Abstract: Thermoplastic molding materials containA) from 5 to 94% by weight of a partly aromatic, semicrystalline copolyamide composed essentially ofa.sub.1) from 30 to 44 mol % of units which are derived from terephthalic acid,a.sub.2) from 6 to 20 mol % of units which are derived from isophthalic acid,a.sub.3) from 43 to 49.5 mol % of units which are derived from hexamethylenediamine, anda.sub.4) from 0.5 to 7 mol % of units which are derived from aliphatic cyclic diamines of 6 to 30 carbon atoms,the molar percentages of components a.sub.1) to a.sub.4) together giving 100% andB) from 5 to 94% by weight of an ASA or ABS or SAN polymer or of a C.sub.1 -C.sub.18 -alkyl ester of (meth)acrylic acid or of a mixture thereof,C) from 1 to 30% by weight of an adhesion promoter which contains from 0.

Abstract: A composition of matter useful as a hotmelt adhesive is provided. The adhesive comprises a polyamide based on dimerized fatty acid, preferably having an amine value of less than 2, and at least one heat stabilizer for polyvinyl chloride, preferably selected from the group consisting of alkyl tin carboxylate compounds and epoxy compounds. The heat stabilizer is preferably present in an amount of 0.2% to 10.0% by weight of the composition. Also provided is a method of using the composition as a hotmelt adhesive for polyvinyl chloride.

Abstract: The invention relates to reaction products of polyetheramines with polymers containing dicarboxylic anhydride groups, which contain 20-80, preferably 40-60, mol % of bivalent structural units A and/or C and, if required, B ##STR1## in which R.sup.1 and R.sup.2, independently of one another, are hydrogen or methyl,a and b are equal to zero or one and a+b is equal to one,Y is X or NRR.sup.3,X is --OH, --O--C.sub.1-30 -alkyl, NR.sup.3 R.sup.4 or --O.sup..crclbar. N.sup..sym. R.sup.3 R.sup.4,R.sup.3 and R.sup.4, independently of one another, are hydrogen, C.sub.6 -C.sub.40 -alkyl or R,R is ##STR2## with the proviso that at least 1 mol % of the anhydride groups bonded to the polymer have reacted with a polyetheramine,Z is C.sub.2 -C.sub.4 -alkyl,n is a number from 1 to 1000,R.sup.5 is hydrogen, C.sub.1 -C.sub.30 -alkyl, C.sub.5 -C.sub.12 -cycloalkyl or C.sub.6 -C.sub.30 -aryl andR.sup.6 is hydrogen or C.sub.1 -C.sub.

Abstract: Aramids which after drawing have high tensile strengths and tensile moduli are made from units derived from selected 2,2'-disubstituted-4,4'-diaminobiphenyls, p-phenylenediamine, oxydianiline and terephthalic acid. Also disclosed is a process for drawing such aramids at least 1.5%, which results in the drawn aramid having significant crystallinity and higher tensile strength. The aramids are useful for ropes and composites.

Abstract: Partly aromatic semicrystalline thermoplastic polyamide molding compositions containA) from 40 to 100% by weight of a copolyamide composed ofa.sub.1) from 30 to 44 mol % of units which are derived from terephthalic acid,a.sub.2) from 6 to 20 mol % of units which are derived from isophthalic acid,a.sub.3) from 43 to 49.5 mol % of units which are derived from hexamethylenediamine anda.sub.4) from 0.5 to 7 mol % of units which are derived from aliphatic cyclic diamines of 6 to 30 carbon atoms,the molar percentages of components a.sub.1) to a.sub.4) together giving 100%, andB) from 0 to 50% by weight of a fibrous or particulate filler,C) from 0 to 30% by weight of an elastomeric polymer andD) from 0 to 30% by weight of conventional additives and processing assistants,the percentages by weight of components A) to D) together giving 100%.

Abstract: Colorless, transparent copolyamides, made up of monomers based on cycloaliphatic diamines and aromatic dicarboxylic acids and a maximum of 20 mol % of further polyamide-forming aliphatic monomers, which have glass transition temperatures of at least 175.degree. C., their blends and alloys, along with the molded articles that can be produced from them and a process for their preparation are proposed.

Abstract: Shaped articles are obtained from a polymerization mixture of soluble wholly aromatic polyamides in a gel state.

Abstract: A polyamide hot melt adhesive is provided. It comprises the polyamide condensation product of substantially equivalent quantities of (a) an acid component consisting essentially of one or more polymeric fatty acids and one or more dicarboxylic acids and (b) an amine component consisting essentially of (i) two or more non-cyclic aliphatic diamines and (ii) one or more amine-terminated polyglycol diamines. The amine component is substantially free of piperazine-containing polyamines. The adhesive has an open time of at least 120 seconds. Preferred non-cyclic aliphatic diamines are ethylenediamine and 1,6-diaminohexane, preferably present in about equimolar amounts. The composition may further comprise an aromatic sulfonamide plasticizer. The adhesive is particularly useful for spraying applications.

Abstract: A low temperature process for polymerizing nylon monomers to freely flowing polymers is disclosed. The polymerization process is carried out at lower than conventional polymerization temperatures and produces a freely flowing polymer without thermal degradation.

Abstract: This invention relates to a nonwoven web comprising a water soluble polyamide and articles constructed therefrom. The water soluble polyamide may be used alone or in combination with conventional thermoplastic web forming materials such as water insoluble polyethylene, polypropylene, polyester and polyamide. The water soluble polyamide may also be combined with biodegradable or selectively dispersible material to form nonwoven webs having various combinations of properties. Such water soluble webs have utility in the manufacture of disposable absorbent articles such as disposable diapers, feminine napkins, incontinent products and cellulosic articles such as tissues and towels, as well as for water soluble heat fusible webs for the textile industry.

Abstract: A copolymerized polyamide, comprising amide bonds formed by an aliphatic diamine with 4 to 14 carbon atoms and terephthalic acid, with the existence ratios of distributed respectively adjacent amide bonds satisfying the following formulae (A) and (B), and with the half-crystallization time satisfying the following formula (C).0.9.ltoreq.[XY]obs./[XY]calcd.<1.1 (A)0.9.ltoreq.[XX]obs./[XX]calcd.<1.1 (B)wherein X stands for an amide bond formed by an aliphatic diamine with 4 to 14 carbon atoms and terephthalic acid, and Y stands for any other amide bond than X. [XY] refers to the rate at which X and Y are adjacent to each other among all the amide bonds in the polymer structure, and [XX] refers to the rate at which X and X are adjacent to each other among all the amide bonds in the polymer structure. [XY] calcd. and [XX] calcd. are respectively the values of [XY] and [XX] calculated on the assumption that X and Y amide bonds are distributed statistically at random, and [XY] obs. and [XX] obs.

Abstract: In a process for producing filler-containing thermoplastic molding compositions by mixing fillers with thermoplastics in the melt,a) the fillers are mixed in a mixing apparatus in the melt with a low molecular weight thermoplastic having a melt viscosity of at most 30 Pas (measured at 20.degree. C. above the melting point of the thermoplastic compound and at a shear gradient of 1,000 s.sup.-1),b) the product thus obtained is removed from the mixing apparatus, cooled and comminuted, andc) the comminuted product is then subjected in the solid phase to a post-condensation.

Abstract: A process for the copolymerization of (1) a carboxylic acid comprising terephthalic acid and mixtures thereof with isophthalic acid with (2) a mixture of hexamethylene diamine and 2-methyl pentamethylene diamine. The pressure in the polymerization process is maintained at at least about 2.15 MPa for a period of at least about 40 minutes so that the resultant copolyamide, when annealed, has less than 1% by weight based on the total weight of the copolyamide of fractions having melting points greater than 320.degree. C. Use of lower pressures and times tends to result in formation of a high melting fraction.

Abstract: Thermoplastic molding materials containA) from 5 to 95% by weight of a semicrystalline, partly aromatic copolyamide composed ofa.sub.1) from 30 to 44 mol % of units which are derived from terephthalic acid,a.sub.2) from 6 to 20 mol % of units which are derived from isophthalic acid,a.sub.3) from 43 to 49.5 mol % of units which are derived from hexamethylenediamine anda.sub.4) from 0.5 to 7 mol % of units which are derived from aliphatic cyclic diamines of 6 to 30 carbon atoms,the molar percentages of the components a.sub.1) to a.sub.4) summing to 100%,B) from 5 to 95% by weight of a copolymer of vinylaromatic compounds with .alpha.,.beta.-unsaturated dicarboxylic anhydrides and .alpha.,.beta.-unsaturated dicarboximides,C) from 0 to 90% by weight of an SAN, ABS or ASA polymer or of a polymer of a C.sub.1 -C.sub.

Abstract: By the use of a binder comprising (a) 40 to 70 wt % of a water-soluble amide material and/or water-soluble amine material and (b) 25 to 60 wt % of a polyamide resin component substantially composed of a polyamide resin material having 10 carbon atoms or more on average between amido groups, a molded article is produced by metal powder injection molding.From such a molded article, the water-soluble amide material and/or water-soluble amine material is eluted by a water-based solvent and then, the polyamide resin component is removed by heating.

Abstract: The invention relates to a barrier layer resisting the transmission of oxygen for multi-layer barrier film characterized in that it is made of a transparent copolyamide comprising three components. The first component is hexamethylenediamine and adipic acid. The second component is hexamethylenediamine and azelaic acid, hexamethylenediamine and sebacic acid, and mixtures thereof. The third component is hexamethylene-diamine and isophthalic acid, hexamethylenediamine and terephthalic acid, and mixtures thereof. The total of all components is 100 mol %, and the ratio of the barrier effects in the barrier layer with respect to carbon dioxide and oxygen is at least 3:1.

Abstract: Hot melt adhesive compositions containing amine and acid terminated polyamide resins, optionally curable when combined with epoxy resins, wherein the amine component of the polyamide resin contains (i) 1,2-diaminopropane, (ii) a piperazine-containing diamine, and optionally, (iii) polyetherdiamines; the polyamide resins may be acid or amine terminated, and are characterized by having an acid plus amine number of up to 40, preferably up to 30, and more preferably up to 20; the adhesive compositions are useful in a number of applications and have good strength while exhibiting flexibility and low tackiness.

Abstract: The invention relates to a process for the production of high molecular weight polyamide 6 (polycaprolactam).

Abstract: Copolyamide barrier layers which are durable hot-water stable and transparent. The copolyamide is amorphous and partially aromatic, and comprises(a) 50 molar parts of substituted or unsubstituted aromatic dicarboxylic acids which are replaced by up to 60% by weight of at least one additional dicarboxylic acid selected from the group consisting of cycloaliphatic dicarboxylic acids having 8 to 24 carbon atoms, araliphatic dicarboxylic acids having 8 to 18 carbon atoms, and mixtures thereof, and (b) 50 molar parts of hexamethylene diamine, which is replaced by up to 60% by weight of at least one additional diamine, selected from the group consisting of substituted or unsubstituted aliphatic diamines having 4 to 20 carbon atoms, substituted cycloaliphatic diamines having 6 to 24 carbon atoms, araliphatic diamines having 8 to 18 carbon atoms, and mixtures thereof,the acid groups and amino groups being present substantially in equimolar proportions.

Abstract: A process for producing an aromatic polyamide film, which comprises the steps of: (a) forming a thin layer of an optically isotropic dope in which an aromatic polyamide is dissolved in a polar amide, (b) immersing the thin layer dope of aromatic polyamide in a polar solvent, other than said polar amide, kept at a temperature not higher than -20.degree. C. to prepare a film, and (c) drying the film. The aromatic polyamide film thus obtained is excellent in transparency. Said process requires neither a step of dissolving an aromatic polyamide in conc. sulfuric acid nor an acid-resistant equipment, and hence, is inexpensive.

Abstract: A process for preparing condensation polymers comprises forming a dispersion of a reaction mixture in a continuous vapor phase, maintaining the dispersion while passing it through a reaction zone, heating the dispersion in the reaction zone to polymerize reactants in the reaction mixture and form a polycondensate.

Abstract: Aramid polymers with small amounts of alkyl- and/or alkoxy-substitution on their aromatic diamine and/or aromatic diacid monomeric units are disclosed. Such aramid polymers show improved properties compared to similar aramids without the substitution. The aramids described herein are useful for films or fibers, for example, as employed in the manufacture of packaging, ropes, filter bags, or composites. The invention also includes a process for making such polymers, involving subjecting fibers or films made from such aramid polymers to heat treatment under tension.

Abstract: A process for the preparation of a copolyamide involving copolymerization of (1) a carboxylic acid of terephthalic acid or a terephthalic acid/isophthalic acid mixture with (2) a mixture of hexamethylene diamine and 2-methyl pentamethylene diamine. The combined amount of isophthalic acid and 2-methyl pentamethylene diamine is controlled so that the resultant copolyamide exhibits few, if any, high melting fractions.

Abstract: A process for the manufacture of a partially aromatic polyamide is disclosed. The process comprises the polymerization stages of, in sequence, feeding to a reactor a slurry of at least one aromatic dicarboxylic acid and at least one aliphatic diamine, then with the incremental addition of water and in the presence of 0.05 to 2% by weight of a monocarboxylic acid, heating the slurry to a temperature of at least 270.degree. C. while maintaining a pressure of at least 1.2 MPa. The preferred dicarboxylic acid is 2,6 naphthalene dicarboxylic acid. The polyamides may be used in the manufacture of products using melt processing techniques.

Abstract: Aramids which after drawing have high tensile strengths and tensile moduli are made from units derived from selected 2,2'-disubstituted-4,4'-diaminobiphenyls, p-phenylenediamine, oxydianiline and terephthalic acid. Also disclosed is a process for drawing such aramids at least 1.5%, which results in the drawn aramid having significant crystallinity and higher tensile strength. The aramids are useful for ropes and composites.

Abstract: A polyamide resin useful in the preparation of hot-melt inks for ink-jet printing is prepared by the condensation polymerization reaction of a monoamine, a diacid and a third reactant selected from diamines, aminoalcohols and blends thereof. Preferably, the diacid, monoamine and third reactant are reacted together in mole ratios of 2:2:1. The polyamides afford the ink compositions with a low viscosity at the elevated operating temperatures of an ink-jet printer, yet are solid at room temperature and contribute good adhesion to the printed substrate.

Abstract: Sheath-core polyamide filaments are disclosed which are resistant to staining by coffee and acid dyes common in food and beverages. The sheath component is comprised of a partially aromatic or high carbon polyamide. The core component may be nylon 66, nylon 6 or copolymers thereof. Textile articles made from these sheath-core filaments are also disclosed.

Abstract: Semi-crystalline, semi-aromatic copolyamides derived from terephthalic acid and mixtures comprising an alkylpentamethylene diamine and hexamethylenediamine by a process including thermal polycondensation in a closed system of the autoclave type.

Abstract: Polymers of glucaric or xylaric acid with diprimary amines containing at least one heteroatom in the main chain form films when cast from aqueous solution and show adhesive properties. Unexpectedly, analogous polymers prepared using galactaric acid, an isomer of glucaric acid, do not form satisfactory films when cast from aqueous solution and exhibit poor or no adhesive properties. Copoly(aldaramides) comprising galactaric acid residues and either glucaric acid or xylaric acid residues, when prepared by reacting an equivalent weight of an activated galactarate with a product formed by reaction of two equivalents of a diprimary heterohydrocarbylenediamine with one equivalent of either an activated xylarate or glucarate also afford film-forming polymers which exhibit adhesive properties.

Abstract: Polyamides and polyamide fibers having a major proportion of hexamethyleneadipamide units and minor proportions of at least two other amide units, one of those other amide units being those of 2-methylpentamethylenediamine are disclosed.

Abstract: Process for the synthesis of polyamides by polycondensation in a closed reactor of one or a number of dicarboxylic acids with a diamine compound containing not less than 60 mol % of-m-xylyenediamine, in which all the amount of diamine compound stoichiometrically necessary for the polycondensation reaction is quickly brought into contact with the molten acid, the temperature of the reaction mixture is raised to a value greater than the melting point of the polyamide produced, the pressure is only allowed to rise to a value sufficient to prevent solidification of the reaction mixture and a substantial loss of diamine compound and, at the end of the reaction, the pressure of the reaction mixture is reduced and the polyamide formed is recovered.

Abstract: A structural panel for a vehicle or building contains a substrate and a layer of flame resistant polybenzazole polymer. If the substrate is heat resistant, the panel can serve as a fire barrier. If the substrate is not heat resistant, the polybenzazole layer can still serve to delay ignition and contain any volatile gases and molten polymer that forms when the panel is subjected to heat.

Abstract: An amine terminated random copolymer containing ethylene oxy/propylene oxy segments may be reacted with hexamethylene diamine and adipic acid monomers to make improved poly(etheramide) segmented block copolymers. Ordinarily, poly(propylene glycol) diamines tend to phase separate under these conditions and polyamide-6,6 could not be so modified. The resultant poly(etheramide) segmented block copolymer has improved impact performance, reduced modulus and lower glass transition as contrasted with the non-modified polyamide-6,6.

Abstract: A thermosetting composition comprising the combination of an unsaturated polyester resin and a polyamino compound having a plurality of secondary or primary amino moieties.

Abstract: A partially crystalline copolyamide formed from an aromatic carboxylic acid that is terephthalic acid or a mixture of terephthalic acid and isophthalic acid containing less than 40% of isophthalic acid, and an aliphatic diamine that is a mixture of hexamethylene diamine and 2-methyl pentamethylene diamine. The aliphatic diamine is at least 40%, molar basis, of hexamethylene diamine and the amount of isophthalic acid plus 2-methyl pentamethylene diamine is in the range of 15-35%, molar basis, of the total amount of aromatic carboxylic acid and aliphatic diamine. The copolyamides have a melting point of 280.degree.-330.degree. C. The copolyamide preferably has a heat of fusion of greater than 17 J/g. The copolyamide may be moulded into articles, spun into fibres or formed into films, and used in a wide variety of end-uses especially where high temperature properties are required.

Abstract: Disclosed are polyamides which are the reaction product of (A) an acid component of which 15-99 wt. % comprises one or more saturated or unsaturated dibasic C.sub.28 -C.sub.44 carboxylic acid, 1-50 wt. % comprises one or more saturated or unsaturated monobasic C.sub.14 -C.sub.22 carboxylic acid, another 1-50 wt. % comprises one or more saturated or unsaturated C.sub.2 -C.sub.22 carboxylic acids, and optionally polybasic C.sub.2 -C.sub.14 and tribasic C.sub.42 -C.sub.66 carboxylic acids, and (B) an amine component of which 10-90 wt. % comprises diethylene triamine and/or one or more C.sub.2 -C.sub.6 alkylene diamines, and 10-90 wt. % comprises a poly(oxyalkylene) diamine whose molecular weight is 500-2000. The polyamides are solid at room temperature and fluid at elevated temperature so as to be capable of application as a protective coating to a substrate such as metal.

Abstract: A colorless and transparent, amorphously processable polyamide molding composition which has a good resistance to stress cracking and good impact strength and is resistant to alcohols, esters, ketones, fuels and boiling water, comprising the reaction product ofI. a linear aliphatic dicarboxylic acid;II.a) 35-60 mol % of trans,trans-bis(4-aminocyclohexyl)-methane; andII.b) 65-40 mol % of other aliphatic, cycloaliphatic, araliphatic or aromatic diaminesas starting components, the molar ratio of components I and II varying in the range from 0.95 to 1.05:1, preferably 0.98 to 1.02:1.The polyamide molding composition is particularly suitable for use for spectacle frames, apparatus inspection windows and covers and lamp covers.

Abstract: An aromatic copolyamide which is soluble in organic copolyamide solvents and contains recurring structural units of formulae I, II and III ##STR1## in which at least some of the radicals R.sup.1 are a group of formula --OC--R.sup.2 --CO--, in which R.sup.2 is a divalent aromatic radical having valence bonds in the para-position or in a comparable coaxial of parallel position to one another, and in which the remaining radicals are as defined.

Abstract: Aramids, which in the drawn state have high tensile strengths tensile elongations, and tensile moduli, are made from units derived from selected 2,2'-disubstituted-4,4'-bibenzoic acids, 3,4'-oxydibenzoic acid or 3,4'-dicarboxybenzophenone, p-phenylenediamine, and optionally terephthalic acid. The aramids are useful for ropes and composites.

Abstract: Aramids having repeat units derived from p-phenylenediamine, 4,4'-bis(3-aminophenoxy)biphenyl and terephthalic acid. These aramids have good strength properties, particularly after drawing, and good high temperature properties. The aramids are useful for fibers and films.

Abstract: Molding materials are composed ofA) from 40 to 100% by weight of a copolyamide based ona.sub.1) from 1 to 20 mol%, based on the copoly- amide, of at least one monomer that contains at least one olefinic double bond (monomers a.sub.1) from the group of the.alpha..sub.1) olefinically unsaturated lactams,.alpha..sub.2) olefinically unsaturated aminocarboxylic acids,.alpha..sub.3) olefinically unsaturated dicarboxylic acids,.alpha..sub.4) olefinically unsaturated diamines, anda2) from 80 to 99 mol%, based on the copolyamide, of at least one monomer that contains no olefinic double bonds (monomers a2) from the group of the.beta..sub.1) lactams.beta..sub.2) aminocarboxylic acids,.beta..sub.3) dicarboxylic acids,.beta..sub.4) diamines, andB) from 0 to 35% by weight of an impact modifying rubber,C) from 0 to 50% by weight of a filler and/or reinforcing agent,D) from 0 to 20% by weight of a flame retardant, andE) from 0 to 10% by weight of further additives and processing aids.

Abstract: Water soluble polyamides may be produced by reacting two different dicarboxylic acids with at least one low molecular weight poly(alkylene glycol) diamine and at least one relatively high molecular weight polyoxyalkylene diamine. One dicarboxylic acid may be of low molecular weight, such as adipic acid and the other of relatively high molecular weight such as C.sub.36 dimer acid. In one embodiment, some dimer acid proportion is preferred. The poly(alkylene glycol) diamine may include triethylene glycol diamine and tetraethylene glycol diamine. The polyoxyalkylene diamine should have at least some ethylene oxide residue therein; for example it may be a polyoxyethylene/polyoxypropylene diamine. The resulting polyamides have a desirable combination of properties, including high strength with water solubility, the latter making the materials easier to work with and very useful.