From At Least Two Dicarboxylic Acids Or Derivatives Or Mixtures Thereof And At Least Two Organic Polyamines Patents (Class 528/338)
  • Patent number: 4948868
    Abstract: A polyamide comprising from 60 to 100% by mole of divalent terephthaloylalkylenediamine constituent units (a), from 0 to 40% by mole of divalent diacyloylalkylenediamine constituent units (b) and from 0.1 to 5% by mole of trivalent diacyloylalkylenediamine units (c), said constituent units (a), (b) and (c) being arranged at random to provide a branched linear structure, said polyamide being free from a gel-forming cross-linked structure and soluble in concentrated sulfuric acid and having: an intrinsic viscosity [.eta.] of from 0.5 to 3 dl/g, as measured in concentrated sulfuric acid at a temperature of 30.degree. C., a melting point of from 280.degree. C. to 370.degree. C. and a glass transition temperature of from 100.degree. C. to 160.degree. C., as measured by means of a differential scanning calorimeter at a heating rate of 10.degree. C./min., and a crystallinity of from 10 to 30%, as measured by X-ray diffractometry.
    Type: Grant
    Filed: July 13, 1988
    Date of Patent: August 14, 1990
    Assignee: Mitsui Petrochemical Industries Ltd.
    Inventors: Tohru Taguchi, Yurimasa Zenitani, Akio Ikeda, Toshiji Nishimura
  • Patent number: 4946933
    Abstract: Novel thermoplastic adhesive components prepared from polyoxyethylene diamines, dimer acids and dicarboxylic acids having a wide range of predictable softening points depending upon the molar ratio of the components. Especially interesting products are synthesized employing JEFFAMINE.RTM. EDR-148 and JEFFAMINE.RTM. EDR-192 produced by Texaco Chemical Co. The adhesives can be used as self adhesive materials or as tackifiers for other adhesives.
    Type: Grant
    Filed: February 27, 1989
    Date of Patent: August 7, 1990
    Assignee: Texaco Chemical Company
    Inventors: George P. Speranza, Wei-Yang Su
  • Patent number: 4943625
    Abstract: An adhesive copolyamide composition having a dry powder DSC melting point of at least 100.degree. C., a glass transition temperature above 60.degree. C., a dry powder softening point of at least 100.degree. C., preferably a water content after storage in water of more than 20% by weight, and a wet softening point of less than 100.degree.. Such compositions exhibit softening points and heat resistances in excess of 100.degree. C. and can be processed and set at substantially lower temperatures. No low molecular weight additives are required nor are any solvents necessary. The compositions are comparable in their heat-resistance, softening points, and bond strength to conventional high performance hot melt adhesives.
    Type: Grant
    Filed: September 7, 1988
    Date of Patent: July 24, 1990
    Assignee: Ems-Inventa AG
    Inventors: Manfred Hewel, Annette Lavalette, Frank Annighofer
  • Patent number: 4921932
    Abstract: A copolyamide resin containing a dimerized fatty acid as a copolymer component, which has (1) at least 25 equivalent %, based on the total number of terminal groups, of hydrocarbon groups having from 6 to 22 carbon atoms at its terminals, (2) a content of a dimerized fatty acid of from 0.1 to 40% by weight based on the total amount of the resin, and (3) a melt viscosity as measured at 240.degree. C. of from 2,000 to 15,000 poise.
    Type: Grant
    Filed: August 5, 1988
    Date of Patent: May 1, 1990
    Assignee: Mitsubishi Kasei Corporation
    Inventors: Mitsuhiko Tamura, Masaaki Miyamoto, Hidemi Nakanishi, Takayoshi Tanaka
  • Patent number: 4914180
    Abstract: Polyamides having improved solubility and processing characteristics are provided having incorporated into the polymeric chain a novel aromatic diamine compound, 2-(3-aminophenyl)-2-(4-aminophenyl) hexafluoropropane (3-4'-6F Diamine). The polyamides are prepared by reacting the 3,4'-6F Diamine with an aliphatic or aromatic di-acid or acid halide. It has been found that the polyamides of this invention have improved solubility characteristics, low dielectric constants and improved thermal flow properties as a consequence of the meta/para positioning of the amino groups on the daimine, which renders these polymers more readily melt spinnable for the production of fibers. The polymers may also be compression molded and fabricated into composites at moderate temperatures and pressures.
    Type: Grant
    Filed: September 30, 1988
    Date of Patent: April 3, 1990
    Assignee: Hoechst Celanese Corporation
    Inventor: Rohitkumar H. Vora
  • Patent number: 4912196
    Abstract: Thermoplastic polyamide resins with improved low-temperature flexibility and improved bonding properties consisting essentially of polycondensates of the following components:(a) 10 to 50 mol-% of a dimer fatty acid or mixture of such acids,(b) 5 to 45 mol-% of polyoxyalkylene urea diamine,(c) 0 to 25 mol-% of an aliphatic C.sub.6 -C.sub.22 dicarboxylic acid or mixture of such acids,(d) 0 to 45 mol-% of an aliphatic, aromatic or cyclic C.sub.2 -C.sub.40 diamine or a mixture of such diamines selected from the group comprising diprimary diamines, diamines containing secondary amino groups and alkyl substituents with no more than 8 carbon atoms at the nitrogen atom, and heterocyclic diamines capable of double amide formation.Preferred resins are base-terminated resins having amine values of up to 50 and acid-terminated resins having acid values of up to 20 and a molecular weight within the range from 5000 to 20,000 and preferably from 8000 to 15,000.
    Type: Grant
    Filed: July 20, 1988
    Date of Patent: March 27, 1990
    Assignee: Henkel Kommanditgeselschaft auf Aktien
    Inventors: Roberto Leoni, Werner Gruber, Angela Rossini
  • Patent number: 4908264
    Abstract: A combination of 10-80% by volume of reinforcing fibres and 20-90% by volume of thermoplastic fibres or films suitable to be formed into a composite structure, the thermoplastic fibres or films essentially consisting of an amorphous copolyamide built up of units derived from at least two different dicarboxylic acids and at least two different diamines, of which the divalent aromatic radicals are linked together by amid bonds selected from the groups P1, P2, Q1 and Q2,P1: 1,4-phenylene, 1,5-naphthylene, 2,6-naphthylene and 4,4'-diphenylene;P2: radicals of the formula: ##STR1## where X=--C(Y) (Y')--, --O--, --S--, --SO.sub.2 -- or --CO--, and Y,Y' , are the same or different and represent hydrogen or C.sub.1-4 alkyl, or together cyclohexyl;Q1: 1,3-phenylene, 1,6-naphthylene, 2,7-naphthylene and 3,4'-diphenylene;Q2: radicals of the formula: ##STR2## where X=--C(Y)(Y')--, --O--, --S--, --SO.sub.2 -- or --CO-- and Y,Y' are the same or different and represent hydrogen or C.sub.
    Type: Grant
    Filed: September 16, 1988
    Date of Patent: March 13, 1990
    Assignee: Akzo N.V.
    Inventor: Doetze J. Sikkema
  • Patent number: 4898896
    Abstract: A transparent polyamide containing terephthalic acid radicals or radicals of the mixture of terephthalic and isophthalic acids and a cycloaliphatic diamine radical and having the chain formations: ##STR1## in which: y.sub.1 +y.sub.2 is between 10 and 200 with y.sub.1 /(y.sub.1 +y.sub.2)>0.5;m, p, m' and p' are whole numbers equal to or greater than zero, such that: ##EQU1## is between 0.5 and 10, taken statistically over the marcomolecule; Z and Z' are the same or different and are either a polymethylene segment --(CH.sub.2)--.sub.
    Type: Grant
    Filed: September 26, 1988
    Date of Patent: February 6, 1990
    Assignee: Atochem
    Inventors: Philippe Maj, Philippe Blondel, Daniel Cuzin
  • Patent number: 4894433
    Abstract: The present invention comprises a water dispersible polyamide diethanolamine ester, having the following general structure: ##STR1## wherein x is an integer of 0-5; R.sup.1 is independently at each occurrence an aliphatic group of up to 40 carbon atoms or polyamide segment; R.sup.2 is independently at each occurrence ##STR2## (where B is an aliphatic group of up to 10 carbon atom) or ##STR3## where E is an aliphatic group of up to 10 carbon atoms or the residue of a cyclic carboxylic anhydride bearing at least one free carboxyl group; ##STR4## The product polyamide resin of the present invention comprises a mixture of monobasic and polybasic carboxylic acids, polyamines, DEA and cyclic carboxylic anhydrides. These resins may be used in various compositions including inks and laminates.
    Type: Grant
    Filed: February 5, 1988
    Date of Patent: January 16, 1990
    Assignee: Union Camp Corporation
    Inventors: Walter K. Bornack, Jr., Roy C. Williams, Keith R. McNally
  • Patent number: 4882414
    Abstract: Polyamide hot-melt adhesives are prepared from condensation of a mixture of polymeric fatty acids and 1,18-octadecane-dicarboxylic acid or 1,16-hexadecanedicarboxylic acid and a substantially equivalent proportion of a polyamine.
    Type: Grant
    Filed: November 29, 1984
    Date of Patent: November 21, 1989
    Assignee: Union Camp Corporation
    Inventor: Ronald J. Wroczynski
  • Patent number: 4863991
    Abstract: Polyphthalamides which, when filled, have heat deflection temperatures of at least about 240.degree. C. are prepared from compounds of terephthalic acid and isophthalic acid in a ratio of about 70:30 to about 99:1 in combination with a diamine which comprises hexamethylene diamine.
    Type: Grant
    Filed: January 11, 1988
    Date of Patent: September 5, 1989
    Assignee: Amoco Corporation
    Inventors: Wassily Poppe, Yu-Tsai Chen, Edward E. Paschke
  • Patent number: 4853460
    Abstract: Hot melt polyamide adhesive compositions are disclosed which exhibit long open assembly times. The polyamides are the condensation products of an acid component consisting essentially of a polymeric fatty acid and a dicarboxylic acid, and an amine component consisting essentially of a cyclic diamine, a non-cyclic aliphatic diamine and, optionally, additional organic diamines.
    Type: Grant
    Filed: March 24, 1988
    Date of Patent: August 1, 1989
    Assignee: Union Camp Corporation
    Inventor: Nancy W. Harman
  • Patent number: 4847356
    Abstract: Transparent copolyamides with very good processibility, very good mechanical properties, excellent transparency and hydrolysis stability in boiling water, and alloyability with other polyamides, are obtained through polycondensation of alkyl derivatives of dicycane and additional polyamide-forming components, together with isophthalic acid and an .omega.-aminocarboxylic acid or its lactam with more than 8 C-atoms, or salts thereof, or a stoichiometric mixture of an aliphatic dicarboxylic acid and an aliphatic diamine.The copolyamides of the invention are excellently suitable for the production of molded articles, thanks to their low processing viscosity.
    Type: Grant
    Filed: September 1, 1987
    Date of Patent: July 11, 1989
    Assignee: EMS-Inventa AG
    Inventors: Manfred Hoppe, Hans D. Torre
  • Patent number: 4831108
    Abstract: A process for preparing condensation polymers comprises forming a dispersion of a reaction mixture in a continuous vapor phase, maintaining the dispersion while passing it through a reaction zone, heating the dispersion in the reaction zone to polymerize reactants in the reaction mixture and form a polycondensate.
    Type: Grant
    Filed: May 7, 1987
    Date of Patent: May 16, 1989
    Assignee: Amoco Corporation
    Inventors: Joel A. Richardson, Wassily Poppe, Benjamin A. Bolton, Edward E. Paschke
  • Patent number: 4826951
    Abstract: Homogeneous copolyamides having high melting points and good flexibility, well adapted for the production of textile materials and plastic shaped articles, are prepared by prepolymerizing lower dicarboxylic acid(s) with an excess of hexamethylenediamine in the presence of a catalytically effective amount of a strong inorganic or organic oxyacid, or alkali or alkaline earth metal salt thereof, and thence polycondensing the resulting prepolymer with a fatty acid dimer.
    Type: Grant
    Filed: July 8, 1987
    Date of Patent: May 2, 1989
    Assignee: Rhone-Poulenc Chimie
    Inventors: Jean Coquard, Jean Goletto
  • Patent number: 4816549
    Abstract: Polyamide resins are produced by reacting diamines, polymeric fatty acids, and monoamines. The monoamine component serves as a chain stopper and renders the polyamide resin product soluble in toluene. The resulting resins are especially useful as binder components in printing inks, and are distinguished by their ready solubility in toluene alone.
    Type: Grant
    Filed: January 11, 1988
    Date of Patent: March 28, 1989
    Assignee: Union Camp Corporation
    Inventor: Daniel T. Rumack
  • Patent number: 4810772
    Abstract: Thermoplastic polyamide mixtures of polyamides based on dimerized fatty acids in which at least one polyamide contains as an incorporated unit (a) a C.sub.2 -C.sub.10 aliphatic diamine capable of diamide formation, which is N-substituted with C.sub.10 -C.sub.25 -alkyl, and (b) a C.sub.2 -C.sub.40 -diamine capable of diamide formation comprising a diprimary amine, a heterocyclic amine, or a diomine containing one or two secondary amino groups and which is N-C.sub.1 -C.sub.8 -alkyl-substituted on at least one side.
    Type: Grant
    Filed: April 1, 1987
    Date of Patent: March 7, 1989
    Assignee: Henkel Kommanditgesellschaft auf Aktien
    Inventors: Roberto Leoni, Werner Gruber, Juergen Wichelhaus
  • Patent number: 4794159
    Abstract: A heat-resistant polyamide having a repeating unit represented by the formula (I):--X--NH--Y--NH--(I)wherein X represents the structure (A): ##STR1## or the structure (A) and the structure (B) --C.sub.m H.sub.2m -- wherein R represents hydrogen, methyl, or ethyl and m is an integer of 2 to 8; and Y represents the structure (C) ##STR2## and the structure (D) --CO--C.sub.n H.sub.2n --CO-- wherein n is 2 to 6, provided that Y may be the structure (C) when X is the structures (A) and (B), said polyamide having an inherent viscosity (.eta..sub.inh) of at least 0.25 dl/g as determined at a temperature of 30.degree. C. in a solution of 0.5 g of the polyamide in 100 ml of dimethylacetamide.
    Type: Grant
    Filed: April 22, 1987
    Date of Patent: December 27, 1988
    Assignees: Nippon Steel Corporation, Nippon Steel Chemical Co., Ltd.
    Inventors: Takero Teramoto, Kazuaki Harada, Hiroharu Inoue
  • Patent number: 4794158
    Abstract: Disclosed herein is a transparent copolyamide which comprises constitutional units derived from a diamine component comprising (a) bis(3-methyl-4-aminocyclohexyl)methane and (b) hexamethylenediamine and a dicarboxylic acid component comprising (c) isophthalic acid and (d) terephthalic acid, the molar ratio of said components simultaneously satisfying the following two formulas:(a):(b)=3:97 to 18:82(c):(d)=60:40 to 90:10and relative viscosity of said copolyamide being 1.9 to 2.5 as measured at 25.degree. C. and a concentration of 1 g/dl in 98% concentrated sulfuric acid.The transparent copolyamide according to the present invention shows a sufficient resistance to alcohols, a sufficient resistance to boiling water and high moldability, therefore, is useful as the material for molded articles such as parts in automobiles, electronic and electric appliances and machines.
    Type: Grant
    Filed: December 8, 1987
    Date of Patent: December 27, 1988
    Assignee: Mitsubishi Kasei Corporation
    Inventors: Masayoshi Hasuo, Hiroshi Urabe, Michio Kawai, Tatsuya Ohsako
  • Patent number: 4791169
    Abstract: Polyamides containing carboxyl groups which, after neutralization with a base, are dilutable with water and which are the products of condensing (1) an amine mixture comprising trifunctional and difunctional amines with (2) an excess of an acid mixture consisting of isophthalic acid and a dimerzied fatty acid and/or a C.sub.6 -C.sub.12 aliphatic dicarboxylic acid.
    Type: Grant
    Filed: November 19, 1986
    Date of Patent: December 13, 1988
    Assignee: Schering AG
    Inventors: Manfred Drawert, Horst Krase
  • Patent number: 4742110
    Abstract: A polyamide composition comprising a polycondensate of 60 to 100 mole % of terephthalic acid component units and 40 to 0 mole % of units of an aromatic carboxylic acid other than terephthalic acid with an aliphatic alkylene-diamine having 6 to 18 carbon atoms and having a gel proportion of 6 to 90% as measured at 50.degree. C. in concentrated sulfuric acid.
    Type: Grant
    Filed: October 7, 1986
    Date of Patent: May 3, 1988
    Assignee: Mitsui Petrochemical Industries, Ltd.
    Inventors: Takeshi Sakashita, Yurimasa Zenitani, Akio Ikeda, Kenichi Nishiwaki
  • Patent number: 4740582
    Abstract: Novel, homogeneous and flexible block copolyetheramides, having a melting point of at least 150.degree. C., a glass transition temperature not exceeding -5.degree. C. and a melt viscosity of at least 100 poises, are preferably prepared by prepolymerizing a mixture of a salt of a short-chain aliphatic dicarboxylic acid and a short-chain aliphatic diamine with a fatty acid(s) dimer or amino derivative thereof, and then polycondensing the prepolymer in the presence of a strong organic or inorganic oxyacid, with a polyoxyalkylenediamine or a polyoxyalkylenedicarboxylic acid having a number-average molecular weight ranging from 300 to 1200.
    Type: Grant
    Filed: March 28, 1986
    Date of Patent: April 26, 1988
    Assignee: Rhone-Poulenc Specialites Chimiques
    Inventors: Jean Coquard, Jean Goletto
  • Patent number: 4731421
    Abstract: Transparent copolyamides with very good processibility, very good mechanical properties, excellent transparency and hydrolysis stability in boiling water, and alloyability with other polyamides, are obtained through polycondensation of alkyl derivatives of dicycane and additional polyamide-forming components, together with isophthalic acid and an .omega.-aminocarboxylic acid or its lactam with more than 8 C-atoms, or salts thereof, or a stoichiometric mixture of an aliphatic dicarboxylic acid and an aliphatic diamine.The copolyamides of the invention are excellently suitable for the production of molded articles, thanks to their low processing viscosity.
    Type: Grant
    Filed: January 7, 1986
    Date of Patent: March 15, 1988
    Assignee: Ems-Inventa AG
    Inventors: Manfred Hoppe, Hans D. Torre
  • Patent number: 4719284
    Abstract: Process for the preparation of polyamides from 1,4-diaminobutane and adipic acid, wherein a 40 to 70% strength aqueous solution of the monomers is heated at 280.degree.-320.degree. C., preferably 290.degree.-310.degree. C., for a period of 5 to 30 minutes under a pressure of less than 8 bar, to give a precondensate having a relative viscosity of 1.05 to 2.0, and solid phase after-condensation at 180.degree.-260.degree. C.
    Type: Grant
    Filed: July 16, 1986
    Date of Patent: January 12, 1988
    Assignee: Bayer Aktiengesellschaft
    Inventors: Werner Nielinger, Hermann Brinkmeyer, Rudolf Binsack, Ludwig Bottenbruch, Heinz-Josef Fullmann
  • Patent number: 4673773
    Abstract: In a multilayer printed circuit board comprising an insulating substrate and a plurality of circuit elements provided thereon in layers, each of which is composed of a circuit pattern and an insulating resin layer provided over the circuit pattern, the circuit patterns arranged adjacently to each other being portionwise connected electrically through via at least one hole, the improvement in which said insulating resin layer comprises a photoset resin of an aromatic polyamide having at least 10 molar % of a constitutional unit of the formula (Ia): ##STR1## wherein each of R.sup.1 and R.sup.2 independently is a hydrogen atom or a residue of a reactive organic compound, Ar.sup.1 is a divalent aromatic residue, and Ar.sup.2 is a divalent aromatic residue possessing a photosensitive group.
    Type: Grant
    Filed: February 26, 1985
    Date of Patent: June 16, 1987
    Assignee: Ube Industries, Ltd.
    Inventors: Tsunetomo Nakano, Hiroshi Yasuno, Kazuaki Nishio
  • Patent number: 4661194
    Abstract: Polyamide adhesives for bonding fabrics which allow for a lower bonding temperature than had been possible with similar previously available polyamide fabric bonding resins. The polyamide adhesives of the present invention are particularly suitable for use as fusible interliners for fabrics which demonstrate excellent retention of adhesive properties even after repeated cleaning by laundering and/or dry cleaning. The polyamide adhesive is an amidification product of(a) caprolactam,(b) a diamine component which is 50-75 eq. % hexamethylene diamine, and 25-50 eq. % piperazine, or 2-methyl pentamethylene diamine, and(c) a mixture of a polymeric fat acid and an aliphatic straight chain co-dicarboxylic acid having 6-12 carbon atoms.
    Type: Grant
    Filed: November 19, 1985
    Date of Patent: April 28, 1987
    Assignee: Henkel Corporation
    Inventor: Roger A. Lovald
  • Patent number: 4621134
    Abstract: Aromatic polythioetheramide polymers having a repeating unit represented by the formulae as shown below and a process for the production thereof are described. These polymers have excellent moldability, flame retardance, heat resistance, and chemical resistance, and are suitable for use as engineering plastics: ##STR1## wherein all the symbols are the same as defined in the specification and claims.
    Type: Grant
    Filed: April 8, 1985
    Date of Patent: November 4, 1986
    Assignee: Mitsubishi Petrochemical Co., Ltd.
    Inventors: Mitsutoshi Aritomi, Makoto Terauchi
  • Patent number: 4617342
    Abstract: A crystalline polyamide which has improved tensile strength and which has a heat deflection temperature in excess of 240.degree. C. when filled is formed from dicarboxylic acid compounds comprising compounds of terephthalic acid and isophthalic acid in a molar ratio of at least 80:20 to about 99:1 and diamines comprising hexamethylene diamine and trimethylhexamethylene diamine in a molar ratio of about 98:2 to about 60:40.
    Type: Grant
    Filed: May 16, 1985
    Date of Patent: October 14, 1986
    Assignee: Amoco Corporation
    Inventors: Wassily Poppe, Yu-Tsai Chen, Edward E. Paschke
  • Patent number: 4603193
    Abstract: A process for the manufacture of polyamides, polyamide-imides and polyimides which process comprises preparing a salt of an aliphatic or aromatic diamine or a mixture of these and di, tri or tetracarboxylic acid or mixture of these or their corresponding anhydride by reacting both feedstocks at a temperature of about 300.degree. to 500.degree. F. in a solvent medium provided the water content of the resulting solution is below 25% water by weight the resulting salt solution is subjected to a pressure of about 1500-3000 psig and is then passed through a preheat zone where the temperature is increased to about 625.degree. F., the total residence time is kept at about 25 to about 50 seconds. The reactants are flashed through a control valve or nozzle to give an aerosol mist at a pressure of about 0-400 psig, the polymerization is further carried out in a flash reactor with a high heat flux and with wall temperatures of about 600.degree. F. to about 1000.degree. F. and melt temperatures of about 500.degree. F.
    Type: Grant
    Filed: February 23, 1984
    Date of Patent: July 29, 1986
    Assignee: Amoco Corporation
    Inventors: Joel A. Richardson, Wassily Poppe, Benjamin A. Bolton, Edward E. Paschke
  • Patent number: 4595745
    Abstract: An organic solvent-soluble photosensitive polyamide resin usable for producing photoset resin product having excellent heat resistance and electrical and mechanical properties, comprising a polycondensation product of an aromatic dicarboxylic acid component with an aromatic diamine component consisting of 10 to 100 molar % of a photosensitive diamine compound of the formula (I) and 10 to 90 molar % of a non-photosensitive diamine compound of the formula (II),H.sub.2 N--R.sub.1 --NH.sub.2 (I)H.sub.2 N--R.sub.2 --NH.sub.2 (II)wherein R.sub.1 represents an aromatic divalent residue having a photosensitive radical and R.sub.2 represents an armoatic divalent residue having no photosensitive radical.
    Type: Grant
    Filed: June 21, 1984
    Date of Patent: June 17, 1986
    Assignee: UBE Industries, Ltd.
    Inventors: Tsunetomo Nakano, Hiroshi Yasuno, Kazuaki Nishio
  • Patent number: 4569987
    Abstract: There is disclosed a group of poly(ester-amide) compositions which possess unexpectedly good low temperature adhesive properties with respect to vinyl based substrates. These poly(ester-amide) compositions are the reaction product of a polymeric fatty acid, with an organic diamine, dicarboxylic acid and an alkanolamine having the general formula: ##STR1## wherein R.sub.2 represents alkylene of 2 to 8 carbons, and R.sub.1 is selected from the group consisting of hydrogen and a monovalent moiety of the formula:R.sub.3 --CH.sub.2 --CH.sub.2 -- (II)wherein R.sub.3 is selected from hydroxyl and amino groups.The term "alkylene of 2 to 8 carbons" as used throughout the specification and claims means a divalent moiety of the formula:--CH.sub.2 --CH.sub.2).sub.n CH.sub.2 -- (III)wherein n is an integer of from 0 to 6. N-(2-hydroxyethyl)-piperazine is a preferred compound of the alkanolamine group.
    Type: Grant
    Filed: September 4, 1984
    Date of Patent: February 11, 1986
    Assignee: Union Camp Corporation
    Inventors: Charles R. Frihart, Richard L. Veazey
  • Patent number: 4568580
    Abstract: The invention relates to laminated films and articles of manufacture based on such films and having improved resistance to heat treatment, wherein said films comprise a heat sealing layer of copolyamide obtained by random copolymerization of precursor monomers of at least two different polyamides. Said laminated films, or the articles of manufacture formed therefrom, such as bags or preformed containers, are useful for packaging applications, particularly in connection with food products.
    Type: Grant
    Filed: September 19, 1983
    Date of Patent: February 4, 1986
    Assignee: W. R. Grace & Co., Cryovac Div.
    Inventors: Ezio Ghirardello, Cesare Quacquarella, Paolo Colombo, Francesco Pezzana
  • Patent number: 4539393
    Abstract: A process for producing an aromatic polyamide film, which comprises drawing an undrawn aromatic polyamide film biaxially at a draw ratio of at least 1.5 in a solvent mixture consisting of (a) 5% to 75% by weight of a good solvent of the aromatic polyamide and (b) 25% to 95% by weight of a non-solvent of the aromatic polyamide, and heat treating the drawn film, which contains at least 1% by weight, based on the weight of the film, of a good solvent of said aromatic polyamide, at a temperature of not lower than 150.degree. C.An m-phenyleneisophthalamide polymer film having extremely excellent dimensional stability under moist conditions, which film has a density d of from 1.35 to 1.41 g/cm.sup.3 and principal refractive indices n.sub..alpha., n.sub..beta. and n.sub..gamma. (n.sub..alpha. >n.sub..beta. >n.sub..gamma.
    Type: Grant
    Filed: April 5, 1983
    Date of Patent: September 3, 1985
    Assignee: Teijin Limited
    Inventors: Yorikazu Tamura, Jiro Sadanobu, Tsutomu Nakamura
  • Patent number: 4536564
    Abstract: The invention includes novel dicarboxylic acids derived from alkylene or arylene diaminetetraacetec acid corresponding to the formula ##STR1## These dicarboxylic acids derived from alkylene or arylene diaminetetraacetic acid are useful in the preparation of polyamides.Another aspect of the invention is a polymer prepared from between about 1 and 100 mole percent of the diamine salt of the compound represented by formula (I) ##STR2## These polymers are useful in preparing molded articles.
    Type: Grant
    Filed: December 9, 1983
    Date of Patent: August 20, 1985
    Assignee: The Dow Chemical Company
    Inventor: Edmund P. Woo
  • Patent number: 4515939
    Abstract: There is disclosed a group of poly(ester-amide) compositions which possess unexpectedly good low temperature adhesive properties with respect to vinyl based substrates. These poly(ester-amide) compositions are the reaction product of a polymeric fatty acid, with an organic diamine, dicarboxylic acid and an alkanolamine having the general formula: ##STR1## wherein R.sub.2 represents alkylene of 2 to 8 carbons, and R.sub.1 is selected from the group consisting of hydrogen and a monovalent moiety of the formula:R.sub.3 --CH.sub.2 --CH.sub.2 -- (II)wherein R.sub.3 is selected from hydroxyl and amino groups.The term "alkylene of 2 to 8 carbons" as used throughout the specification and claims means a divalent moiety of the formula:--CH.sub.2 --CH.sub.2).sub.n CH.sub.2 -- (III)wherein n is an integer of from 0 to 6. N-(2-hydroxyethyl)piperazine is a preferred compound of the alkanolamine group.
    Type: Grant
    Filed: May 31, 1983
    Date of Patent: May 7, 1985
    Assignee: Union Camp Corporation
    Inventors: Charles R. Frihart, Richard L. Veazey
  • Patent number: 4505978
    Abstract: Self bondable polyamides are prepared by reacting an aromatic diisocyanate or diamine with a mixture of terephthalic acids and one or two aliphatic dibasic acid having at least 6 carbon atoms and a monocarboxylic acid. These self bondable amides can also be used as topcoats for wires having basecoats of another polymer, e.g., a polyester, polyester-imide, or polyamide-imide.
    Type: Grant
    Filed: September 28, 1982
    Date of Patent: March 19, 1985
    Assignee: Schenectady Chemicals, Inc.
    Inventor: Scott D. Smith
  • Patent number: 4501685
    Abstract: A catalyst system and process for the selective hydrogenation of aliphatic unsaturation in copolymers containing aromatic groups for example styrene-butadiene copolyers, the catalyst system comprising palladium supported on non-porous carbon black poisoned by a Lewis base containing nitrogen, phosphorus or sulphur moiety.
    Type: Grant
    Filed: September 8, 1983
    Date of Patent: February 26, 1985
    Assignee: Johnson Matthey Public Limited Company
    Inventors: Alasdair I. Thomson, Frank King
  • Patent number: 4495328
    Abstract: Crystalline copolyamides from terephthalic acid and mixtures of hexamethylenediamine and trimethylhexamethylenediamine and filled molding compositions prepared therefrom are disclosed. The injection moldable crystalline copolyamides in molded form are useful in engineering resin applications such as the hood of an automobile, a shroud for a lawn mower, chain saw guard, etc.
    Type: Grant
    Filed: April 19, 1984
    Date of Patent: January 22, 1985
    Assignee: Standard Oil Company (Indiana)
    Inventors: Wassily Poppe, Yu-Tsai Chen, Larry W. Autry
  • Patent number: 4476280
    Abstract: Novel crystalline copolymers having heat deflection temperatures in excess of 305.degree. C. and prepared from hexamethylene diamine, trimethylhexamethylene diamine and either mixtures of terephthalic acid and adipic acid or mixtures of terephthalic acid, isophthalic acid and adipic acid. The high heat deflection of these polyamides enables them to be used in applications such as a hood for an automobile, a shroud for a lawn mower, chain saw guards and in electrical connection applications.
    Type: Grant
    Filed: February 16, 1983
    Date of Patent: October 9, 1984
    Assignee: Standard Oil Company
    Inventors: Wassily Poppe, Yu-Tsai Chen
  • Patent number: 4471088
    Abstract: A copolyamide comprised of undecamethylenehexahydroterephthalamide units and hexamethylenehexahydroterephthalamide units having a trans isomer ratio of hexahydroterephthalic acid residues of 57 to 83 percent is provided. The copolyamide is suitable for injection and extrusion molding. The copolyamide is prepared by a process comprising heating an equimolar salt of undecamethylenediamine and hexahydroterephthalic acid and an equimolar salt of hexamethylenediamine and hexahydroterephthalic acid at a maximum temperature of about 280 to 360.degree. C. to stably melt-polymerize the copolyamide. A copolyamide molding composition comprised of the copolyamide and an inorganic reinforcing agent can be formed into various molded articles having excellent properties.
    Type: Grant
    Filed: June 28, 1982
    Date of Patent: September 11, 1984
    Assignee: Toray Industries, Inc.
    Inventors: Kazumasa Chiba, Nobuo Kato, Kazuhiko Kobayashi
  • Patent number: 4429110
    Abstract: New transparent polyamides consisting of recurring structural elements of formula I or II ##STR1## in which the carbonyl groups are linked to the benzene ring in 1,3- and/or 1,4-position are described. The novel polyamides are suitable for the manufacture of transparent shaped articles, and are distinguished by good thermoplastic processing characteristics, low water absorption, high stability to hydrolysis and good dimensional stability under the action of moisture.
    Type: Grant
    Filed: June 10, 1982
    Date of Patent: January 31, 1984
    Assignee: Ciba-Geigy Corporation
    Inventor: Josef Pfeifer
  • Patent number: 4396758
    Abstract: Fibrides of synthetic heterochain polymers are produced by a non-equilibrium polycondensation of an aqueous alkaline solution of bifunctional compounds supplied into the reaction zone as a continuous stream oriented in the horizontal plane of the reaction zone to be acylated with diacylchlorides of dicarboxylic acids in the state of a superheated vapor with a carrier supplied into the reaction zone in the vertical plane, the contacting of the reagents being effected in a cross-current stream under shear stress conditions.
    Type: Grant
    Filed: December 29, 1980
    Date of Patent: August 2, 1983
    Inventors: Vladimir A. Nikiforov, Savely A. Zhizhilev, Alexandr G. Mukhometzyanov, Lev B. Sokolov, Nison I. Gelperin, Tatyana I. Nikitina, Viktor I. Rabinovich
  • Patent number: 4385170
    Abstract: A melt-processable copolyamide prepared from diamines and dicarboxylic acids by a melt-polymerization process, wherein said copolyamide contains from about 1 to 20 mol % of an aromatic amide unit having the formula ##STR1## wherein X and Y are aromatic units with extended bonds, such as 1,4-phenylene group. This copolyamide provides fiber with higher stiffness.
    Type: Grant
    Filed: May 29, 1981
    Date of Patent: May 24, 1983
    Assignee: Unitika Ltd.
    Inventors: Matsuo Hirami, Kazushige Kudo, Tsutomu Sugie, Toshihide Hibino, Ryoichi Tsurutani, Shigemitsu Murase
  • Patent number: 4384112
    Abstract: Novel polyamides and copolyamides prepared from 2,2'4,4'6,6'-hexamethyl 3,3'-diaminobiphenyl (3,3'-M.sub.2 DAM) and aliphatic or aromatic diacids. 3,3'-M.sub.2 DAM and a mixture of other aliphatic or aromatic diamines may also be suitably used to react with the diacids. These novel polyamides and copolyamides are useful in preparing molded articles, fibers, films, laminates and coatings.
    Type: Grant
    Filed: September 28, 1981
    Date of Patent: May 17, 1983
    Assignee: Standard Oil Company (Indiana)
    Inventors: Edward E. Paschke, J. A. Donohue
  • Patent number: 4382138
    Abstract: Novel copolyamides and polyamides and molding compositions are prepared from 4,4'-diamino-2,2', 6,6'-tetramethylbiphenyl and aliphatic or aromatic diacids, dianhydride and mixtures of diamines. The polyamides and copolyamides are useful as engineering plastics.
    Type: Grant
    Filed: September 28, 1981
    Date of Patent: May 3, 1983
    Assignee: Standard Oil Company (Indiana)
    Inventors: Edward E. Paschke, J. A. Donohue
  • Patent number: 4377683
    Abstract: Transparent copolyamides are obtained by reacting a mixture (A) of isophoronediamine and isophthalic acid, terephthalic acid or a mixture of isophthalic acid and terephthalic acid with a mixture (B) of a diamine ##STR1## and terephthalic acid or a mixture of terephthalic acid and isophthalic acid or with a mixture (C) of a diamine ##STR2## and terephthalic acid or isophthalic acid or mixtures thereof, R', R" and R.sub.1 to R.sub.6 being as defined in the patent claim.The reaction can also be carried out with an excess of diamine and with addition of H.sub.3 PO.sub.2 or salts thereof or white phosphorus.The novel copolyamides are distinguished by good thermoplastic processability, low water absorption and good resistance to hydrolysis, and are useful for the production of transparent mouldings.
    Type: Grant
    Filed: June 12, 1981
    Date of Patent: March 22, 1983
    Assignee: Ciba-Geigy Corporation
    Inventors: Josef Pfeifer, Dieter Reinehr
  • Patent number: 4373088
    Abstract: Transparent polyamides have repeating structural units of the formula--HN--R--NH--OC--R'--CO--wherein R' is the hydrocarbon radical of terephthalic acid or isophthalic acid and R comprises 60-95 mole percent of a divalent hydrocarbon radical including 5-methylnonamethylene, 2,4-dimethyloctamethylene and 2,4,6-trimethylheptamethylene and 40-5 mole percent of a cyclic divalent hydrocarbon radical of the formula ##STR1## The polyamides so prepared can be used for building components and for fibers and sheets.
    Type: Grant
    Filed: May 9, 1980
    Date of Patent: February 8, 1983
    Inventors: Josef Disteldorf, Werner Hubel, Siegfried Brandt, Hans-Jurgen Haage
  • Patent number: 4369305
    Abstract: Novel tetrapolymers are described consisting of equimolar amounts of (1) isophthalic and terephthalic acids, and (2) hexamethylene diamine and PACM in specific amounts, which produce transparent molded articles.
    Type: Grant
    Filed: April 20, 1981
    Date of Patent: January 18, 1983
    Assignee: E. I. Du Pont de Nemours and Company
    Inventor: Rolando U. Pagilagan
  • Patent number: 4341670
    Abstract: By the incorporation of small amounts of specific polyamides into polyalkenes, such as polypropylene and polyethylene, it is possible to significantly improve the dyeing properties, including color intensity, color homogeneity and color fastness, of the polyalkene. Polyamides useful for this purpose are derived from mixed dicarboxylic acids, diamine and triamine containing two primary and one tertiary amine groups.
    Type: Grant
    Filed: April 17, 1980
    Date of Patent: July 27, 1982
    Assignee: Emery Industries, Inc.
    Inventors: Adrien G. Hinze, Robert P. Roggeveen, Abraham J. Meulenberg
  • Patent number: 4297478
    Abstract: A process is disclosed for the discontinuous production of a polyamide having the generic formula: ##STR1## and an inherent viscosity of at least 3, wherein 50 to 100% of the radicals R are p-phenylene radicals and 0 to 50% are n-butylene radicals. Terephthaloyl chloride, and optionally adipoyl chloride, are reacted in stoichiometric amounts with a solution of paraphenylenediamine and/or of 4,4'-diaminoadipanilide in a mixture of N-methylpyrrolidone-2 and calcium chloride which is homogeneous and substantially anhydrous, with a molar ratio of CaCl.sub.2 / unit: ##STR2## of at least 0.7, and under conditions such that the final composition contains 5 to 16% by weight of polymer, relative to the N-methylpyrrolidone-2. The polymer obtained can be converted into films, fibers and high-performance yarns for reinforcing composite materials or articles made of rubber.
    Type: Grant
    Filed: April 18, 1978
    Date of Patent: October 27, 1981
    Assignee: Rhone-Poulenc-Textile
    Inventors: Vincent Rochina, Jean Sacco