Abstract: A novel polyimide compound which has a low linear expansion coefficient and permits film formation by a spin coating method or the like, a preparation method for the polyimide compound, and an optical film and an optical waveguide produced by employing the compound. The polyimide compound has a structural unit represented by the following general formula (1): wherein X is a covalent single bond, —CH2—, —C(CF3)2— or —CR(R?)— (wherein R and R?, which may be the same or different, are each a C1 to C6 alkyl group or an aryl group); A and B, which may be the same or different, are substituents each selected from a hydroxyl group, a halogen group and a C1 to C4 alkyl group; a and b, which are the numbers of the substituents A and B, respectively, are each an integer of 0 to 2; and o, p and q are each an integer of 1 to 5.

Abstract: A polyimide film with low gloss comprising a polyimide base polymer constituting the film, and a polyimide powder distributed in the film, the polyimide film having a 60° gloss value smaller or equal to about 50. The polyimide powder used as delustrant can have an average particle size between about 0.5 ?m and about 15 ?m. Embodiments described herein also include methods of preparing the polyimide film and the delustrant.

Abstract: A method is provided for the preparation of a poly(amic acid) in which ring opening polymerization is employed to react the monomers ethylenediaminetetraacetic dianhydride and paraphenylenediamine in an aprotic solvent. The resulting poly(amic acid) composition is suitable as a biocompatible material, such as a biomedical implant, implant coating material, tissue scaffold material, controlled release drug delivery vehicle, and cellular growth substrate.

Abstract: The present invention relates to a polyimide film prepared from a tetracarboxylic acid component and a diamine component, wherein the strength of orientation anisotropy in the film length of 2000 mm is 1.2 or less and/or the strength of orientation anisotropy in the film length of 1800 mm is 1.1 or less.

Abstract: A polyamic acid that is a condensation reaction product of one or more acid anhydrides and one or more carbonate-based diamine compounds, along with a polyimide obtained by imidizing the polyamic acid, a method of manufacturing the same, and a polyimide film made therefrom.

Abstract: The present invention provides a process for measuring and controlling chemical reactions that produce thermoplastic polymers by utilizing a stoichiometry correction during a reaction cycle to produce thermoplastic resins with desired properties. The thermoplastic polymer is made from at least one first monomer having a first reactive end group and at least one second monomer having a second reactive end group by reaction of the first reactive end group with the second reactive end group and has a glass transition temperature of greater than 130° C.

Abstract: Higher diamondoid derivatives capable of taking part in polymerization reactions are disclosed as well as intermediates to these derivatives, polymers formed from these derivatives and methods for preparing the polymers.

Abstract: A liquid crystal polyimide, containing: repeating units of formula (I) and having liquid crystallinity, wherein A1 and A2 are each independently a tetravalent residue of a tetracarboxylic acid, B1 is a residue of a bis(amino) polysiloxane of formula (II), and C1 is a residue of an organic diamine, wherein R1 to R6 are each independently a lower alkyl group, x is from 0 to 10, D1 is an alkylene group, y is 0 or 1, and Z1 is selected from the group consisting of —H, —CH3, CF3, —F, —CN and —NO2. In addition, a liquid crystal resin composition and a resin film for a semiconductor element containing the liquid crystal polyimide.

Abstract: An organic liquid is applied to both sides of a self-supporting film of a polyimide precursor solution, and then the self-supporting film is heated to effect imidization, thereby providing a polyimide film with reduced surface roughness.

Abstract: The invention relates to a transparent substrate with low birefringence. The transparent substrate comprises polyimide having a repeat unit of formula (I) and has a birefringence below 0.005: wherein each A of the repeat unit, being the same or different, represents an aromatic or aliphatic group, and at least one A is an aromatic or aliphatic group containing sulfonyl functionality; each B of the repeated unit, being the same or different, represents an aromatic or cycloaliphatic group; and n is an integer greater than one.

Abstract: An intermediate transfer media, such as a belt, that includes for example, a polyamideimide, a phosphate ester and a conductive component, like carbon black.

Abstract: Heat-resistant polyimide copolymers having the following four components: pyromellitic dianhydride (PMDA), 1,4-diaminodiphenyl ether (DADE), biphenyltetracarboxylic dianhydride (BPDA), and 2,4-diaminotoluene (DAT) are provided. In an embodiment the molar ratio of (BPDA):(DADE):(PMDA):(DAT) is 2:2:m:m, in which m is an integer of 3, 4 or 5.

Abstract: A polyamic acid composition including a polyamic acid, the polyamic acid having an imidization ratio of from about 5.0% to about 25.0%, and being obtained by reacting a diamine compound, a tetracarboxylic dianhydride and an acid monoanhydride at an amount ratio that satisfies the following formula (1): 0.970<Y/X<0.998 and Formula (2): 0.00<Z/2(X?Y)<0.50. In Formula (1) and Formula (2), X represents a content (mol) of the diamine compound, Y represents a content (mol) of the tetracarboxylic dianhydride, and Z represents a content of the acid monoanhydride (mol).

Abstract: The present invention relates to a polyimide film which is obtained by the reaction of a tetracarboxylic acid component and a diamine component and has an orientation anisotropy, in which the variations in the orientation angle in the width direction are within ±10°.

Abstract: To provide a process for producing BPDA whereby high productivity is attained while high purity is maintained. A process for producing biphenyltetracarboxylic acid dianhydride, which comprises heating biphenyltetracarboxylic acid to produce biphenyltetracarboxylic acid dianhydride, characterized in that the heating is carried out at a pressure of from 1×102 Pa to 1.1×105 Pa to a maximum temperature in a range of from 210° C. to 250° C. in such a manner that the temperature rising rate is higher than 50° C./hr for a period of at least ¼ of the time for the temperature rise from 60° C. to 210° C., and the temperature is maintained to be from 150° C. to 250° C. for from 0.5 to 10 hours.

Abstract: The present invention provides a process for preparing a solvent-soluble polyimide copolymer synthesized from a 6,6-imide segment having an imide oligomer with PMDA at both ends produced by adding 4 molar equivalents of pyromellitic dianhydride (PMDA) and 2 molar equivalents of diaminotoluene (DAT) to an imide oligomer produced by heating 1 molar equivalent of biphenyltetracarboxylic dianhydride (BPDA) and 2 molar equivalents of diaminodiphenyl ether (DADE) at 160-200° C. in the presence of a catalyst in an organic polar solvent.

Abstract: Disclosed is a photosensitive ink which can form a coated film that is excellent in insulation properties, heat resistance, low warping, low elasticity and adhesion with the substrate, when used as an ink for screen printing, and with which clogging of the screen, bleeding, blur, chipping and the like are unlikely to occur even when the screen printing is repeatedly carried out, so that which has an excellent ease of handling in printing. The ink composition comprises 100 parts by weight of an organic solvent-soluble polyimide block copolymer(s), and 1 to 100 parts by weight of a photoacid generator(s). The polyimide block copolymer(s) and the photoacid generator(s) are dissolved in an organic solvent. The polyimide block copolymer(s) contain(s) in its molecular skeleton a diamine having a siloxane bond, and an aromatic diamine having a hydroxyl group(s) and/or carboxyl group(s) at ortho-position with respect to an amino group.

Abstract: A nanoweb that contains a plurality of nanofibers wherein the nanofibers contain a fully aromatic polyimide that is characterized by having a crystallinity index (CI) and a degree of imidization (DOI). The product of the DOI and the CI is between 0.08 and 0.25 or above a lower limit to obtain a desired tensile strength and/or toughness. The nanoweb may for example have a tensile strength per unit basis weight of greater than 15 kg/cm2 per gram per square meter unit of basis weight.

Abstract: Disclosed is a laminate structure including a substrate, a wettability changing layer, and an electrical conductor layer, wherein the wettability changing layer and the electrical conductor layer are laminated on the substrate in order, wherein the wettability changing layer contains a polyimide, wherein the polyimide is obtainable by dehydrating and ring-opening a polyamic acid, wherein the polyamic acid is obtainable by ring-opening and addition-polymerizing a diamine and a tetracarboxylic acid dianhydride, wherein the diamine includes a compound represented by a general formula of: or a compound represented by a general formula of: wherein each of R1 and R2 in formula (1) is defined in the specification, and wherein R1 in formula (2) is defined in the specification.

Abstract: The present invention relates to an aqueous alkali-developable photosensitive polyimide precursor resin composition that is appropriate for highly heat-resistant transparent protection layers and insulation layers for liquid crystal display devices.

Abstract: Polyimide-based polymers and copolymers thereof are provided. Further provided is a positive type photoresist composition comprising at least one of the polyimide-based polymers and copolymers thereof as a binder resin. The photoresist composition exhibits high resolution, high sensitivity, excellent film characteristics and improved mechanical properties, which are required for the formation of semiconductor buffer coatings.

Abstract: The present invention provides a method for producing a high-quality nonconductive or semi-conductive seamless (jointless) tubular polyimide film in a simple, efficient, and economical manner, and the like. More specifically, the invention relates to an electrically non-conductive or electrically semi-conductive seamless tubular polyimide film comprising polyimide having at least two aromatic tetracarboxylic acid derivatives comprising 15 to 55 mol % of asymmetric aromatic tetracarboxylic acid component and 85 to 45 mol % of symmetric aromatic tetracarboxylic acid component and at least one aromatic diamine component, in which, as required, a specific amount of carbon black is dispersed, and relates to a method for producing the same.

Abstract: A carbon black-dispersed polyamic acid solution composition that utilizes carbon black excelling in safety and environmental adaptability and excels in the dispersion stability and fluidity of carbon black dispersed in polyamic acid solution, and that realizes high solid content and high carbon black content. An intermediate transfer belt of polyimide, which produces a transfer image of high quality in a color image-forming apparatus, produced from the polyamic acid solution composition. In particular, a carbon black-dispersed polyamic acid solution composition containing a polyamic acid solution obtained by reaction of approximately equimolar amounts of biphenyltetracarboxylic acid dianhydride and an aromatic diamine, and containing a carbon black of 2 to 6% volatile content produced by oil furnace process, wherein the solid content of the solution composition is 23 wt. % or more and wherein the carbon black content of the solid is in the range of 20 to 30 wt. %.

Abstract: Disclosed are a method for forming an organic layer pattern which is characterized by forming a thin layer by coating a coating solution including a polyimide-based polymer having a heteroaromatic pendant group including a heteroatom in its polyimide major chain, a photoinitiator and a crosslinking agent on a substrate and drying the substrate, and exposing and developing the thin layer, an organic layer pattern prepared by the method, and an organic memory device comprising the pattern. According to example embodiments, a high-resolution micropattern may be formed without undergoing any expensive process, e.g., photoresist, leading to simplification of the preparation process and cost reduction.

Abstract: A cross-linked metal-containing polyamic acid includes a metal and a cross-linked polyamic acid which is a condensation product of an acid anhydride represented by Formula 1 and a diamine compound: where the group comprises a C5-C20 carbocycle having a cross-linkable functional group or a C4-C20 heterocycle having a cross-linkable functional group. A cross-linked metal-containing polyimide, a method of manufacturing the cross-linked metal-containing polyimide, a polyimide film including the cross-linked metal-containing polyimide, and a method of making the polyimide film are disclosed.

Abstract: A thermosetting solution composition composed of a biphenyltetracarboxylic acid compound containing a partial lower aliphatic alkyl ester of 2,3,3?,4?-biphenyltetracarboxylic acid and/or a partial lower aliphatic alkyl ester of 2,2?,3,3?-biphenyltetracarboxylic acid, an aromatic diamine compound in a molar amount larger than a molar amount of the biphenyltetracarboxylic acid compound, a partial lower aliphatic alkyl ester of 4-(2-phenylethynyl)phthalic acid compound in a molar amount as much as 1.8-2.2 times a molar amount corresponding to a difference between the molar amount of the aromatic diamine compound and the molar amount of the biphenyltetracarboxylic acid compound, and an organic solvent composed of a lower aliphatic alcohol is of value for manufacture of a prepreg.

Abstract: A CIS solar cell having flexibility and high conversion efficiency may be produced, using, as a substrate, a polyimide film which is prepared from an aromatic tetracarboxylic acid component comprising 3,3?,4,4?-biphenyltetracarboxylic dianhydride as the main component and an aromatic diamine component comprising p-phenylenediamine as the main component, and has a maximum dimensional change in the temperature-increasing step of from 25° C. to 500° C. within a range of from +0.6% to +0.9%, excluding +0.6%, based on the dimension at 25° C. before heat treatment.

Abstract: A polyimide film having improved adhesiveness is produced by flow-casting a solution of a polyamic acid, which is prepared by reacting a tetracarboxylic acid component and a diamine component, on a support, and drying the solution to form a self-supporting film; applying a solution containing a surface treatment agent to one side or both sides of the self-supporting film, wherein the solvent of the surface treatment agent solution is a water-soluble liquid and has a surface tension of 32 mN/m or less at 20° C. and a boiling point of 125° C. or higher; and heating the self-supporting film to provide a polyimide film.

Abstract: A method for producing a polyimide film comprises the steps of: preparing a polar organic solvent solution of a polyimide precursor obtained by mixing a tetracarboxylic acid dianhydride compound and a diamine compound; adding a dehydrating agent and an imidization catalyst to the polar organic solvent solution so as to prepare a resin solution composition; and drying the resin solution composition by heating so as to imidize the resin solution composition after flowing the resin solution composition onto a support in a casting manner, wherein diethyl pyridine is used as the imidization catalyst. According to the production method, it is possible to obtain a polyimide film which is highly productive and is excellent in the film quality such as the mechanical property, the adhesive strength, and the like.

Abstract: Disclosed is a liquid crystal display element which is composed of a pair of substrates (1) at least one of which is transparent. The liquid crystal display element comprises, between the pair of substrates, a transparent electrode (2), an aligning agent (3) that contains at least reactive monomers and/or oligomers (5), and a liquid crystal layer. The liquid crystal display element is characterized in that an alignment layer is obtained by polymerizing the reactive monomers or oligomers contained in the aligning agent, and the liquid crystal layer is composed of a liquid crystal composition that contains a compound (4) having at least one benzene ring in each molecule, said benzene ring containing at least one fluorine atom and being disubstituted by halogen atoms.

Abstract: A polyimide silicone having in the molecule a phenolic hydroxy group in which a part or all of hydrogen atoms are substituted with an acid labile group is provided. The polyimide silicone comprises the unit represented by the formula (1): wherein X is a tetravalent group at least a part of which is a tetravalent organic group represented by the formula (2): wherein R1 is a monovalent hydrocarbon group, R2 is a trivalent group, and n is an integer of 1 to 120 on average; and Y is a divalent organic group at least a part of which is a divalent organic group having a phenolic hydroxy group in which a part or all of hydrogen atoms are substituted with an acid labile group represented by the formula (3): wherein R3 and R4 are a hydrogen atom or an alkyl group, and R5 is an alkyl group, an aryl group, or an aralkyl group.

Abstract: Polyimide-based polymers and copolymers thereof are provided. Further provided is a positive type photoresist composition comprising at least one of the polyimide-based polymers and copolymers thereof as a binder resin. The photoresist composition exhibits high resolution, high sensitivity, excellent film characteristics and improved mechanical properties, which are required for the formation of semiconductor buffer coatings.

Abstract: Disclosed herein are polymer compounds and a method for preparing thereof. More specifically, provided are polymer compounds with well-connected, narrow size distribution free-volume element and a method for preparing the polymer compounds by thermal rearrangement for aromatic polyimides containing ortho-positioned functional groups in the solid state.

Abstract: Disclosed is a liquid crystal alignment agent that includes a polymer including polyamic acid including a repeating unit represented by the following Chemical Formula 1, polyimide including a repeating unit represented by the following Chemical Formula 2, or a combination thereof. In Chemical Formulae 1 and 2, X1, X2, Y1 and Y2 are the same as defined in the detailed description.

Abstract: Exemplary embodiments provide an intermediate transfer belt, materials and processes for producing an intermediate transfer belt, and an image transfer apparatus used in electrophotographic printing devices, wherein the intermediate transfer belt can comprise a thermosetting polyimide comprising the reaction product of a polyamic acid and a hydroxyl-terminated polybutadiene.

Abstract: A polyimide film, which is produced by the reaction of a tetracarboxylic acid component comprising 3,3?,4,4?-biphenyltetracarboxylic dianhydride as the main component and a diamine component comprising p-phenylenediamine as the main component, is heated at a temperature of from 460° C. to 550° C., and then water or an alkaline aqueous solution is sprayed on a surface of the polyimide film for surface treatment, thereby improving adhesiveness, while maintaining the excellent properties inherent in the polyimide film.

Abstract: A curable polyimide resin composition containing a polyimide resin obtainable from by a reaction of a reaction mixture containing a diisocyanate compound, a carbonate group-containing diol compound and an imide compound having two terminal hydroxyhydrocarbyl groups gives a cured insulation film having improved characteristics.

Abstract: The object of the present invention is to provide a thermosetting resin composition which can provide a cured material which is excellent in heat resistance, electrical properties, and flexibility, and has storage stability before curing, and in order to achieve the object, the present invention provide a thermosetting resin composition containing a polyurethane resin (A) which has the structure represented by the following general formula (1) and/or the general formula (2), and an epoxy resin (B). (In the chemical formulae, X represents a residue in which two phenolic hydroxyl groups are excluded from a phenol compound having two or more phenolic hydroxyl groups in the molecule.

Abstract: The present invention discloses a method of producing a modified polyimide comprising a polycarbonate, which modified polyimide has excellent electric properties and adhesion as well as excellent heat resistance, flexibility, bending property, low warping, chemical resistance and storage stability; and the modified polyimide. Also disclosed are a composition comprising the modified polyimide and used thereof.

Abstract: A metal-coated polyimide film is excellent in long-term adhesion reliability, exhibits various dimensional stabilities, and is particularly suitable for FPC, COF and TAB applications. The metal-coated polyimide film comprises a non-thermoplastic polyimide film; and a metal layer being directly formed on one surface or both surfaces of the non-thermoplastic polyimide film without using an adhesive, wherein the non-thermoplastic polyimide film contains a non-thermoplastic polyimide resin having a thermoplastic polyimide block component.

Abstract: The present invention features compositions in which nano-carriers are synthesized with polymers that respond to lower pH and/or ROS by being degraded. The compositions may be utilized to selectively deliver payloads within patients by responding to lower pH and/or ROS at localities within the patient. The present invention also features methods of synthesizing nano-carriers that are degraded by lower pH and/or ROS.

Abstract: The invention relates to a novel moisture activated solvent-free latent curing adhesive or sealant mixture comprising (1) a selected poly(alkylene oxide)imine, and (2) a selected amine reactive moiety.

Abstract: An approach is presented for designing a polymeric layer for nanometer scale thermo-mechanical storage devices. Cross-linked polyimide oligomers are used as the recording layers in atomic force data storage device, giving significantly improved performance when compared to previously reported cross-linked and linear polymers. The cross-linking of the polyimide oligomers may be tuned to match thermal and force parameters required in read-write-erase cycles. Additionally, the cross-linked polyimide oligomers are suitable for use in nano-scale imaging.

Abstract: A polyimide resin which is soluble in an organic solvent and which has a low coefficient of water absorption, thermosetting properties, high heat resistance and excellent adhesive properties, a method for manufacturing the same, an adhesive and a film each containing the subject polyimide resin and a metal-clad laminate including an adhesive layer composed of the subject polyimide resin are provided. The polyimide resin is a polyimide resin containing a repeating unit represented by the following formula (1) and a repeating unit represented by the following formula (2), with a proportion of a group presented by the following formula (3) being 50% by mole or more of the whole of X.

Abstract: Disclosed is a polyesterimide having a repeating unit expressed by the formula below, and also provides the manufacturing methods thereof: wherein R represents a phenyl group, R1 represents an alkyl group with 1 to 6 carbon atoms or alkoxy group with 1 to 6 carbon atoms, n each independently takes a value of 0 to 4, a each independently takes a value of 0 to 4, and m represents an integer of 2 to 4, where not all n's are 0 at the same time and 0?n+a?4 is satisfied by each phenylene group, and X is a divalent aromatic group and/or aliphatic group.

Abstract: The invention pertains to an epoxy-modified photosensitive polyimide, which possesses excellent heat resistance, chemistry resistance, and flexibility, and can be used in a liquid photo resist or dry film resist, or used in a solder resist, coverlay film, or printed circuit board.

Abstract: Disclosed is a photosensitive resin composition capable of displaying satisfactory patterning performance against an alkaline developer and yielding a cured film of a sufficiently low coefficient of linear thermal expansion. The photosensitive resin composition contains a photopolymerization initiator and a polyimide precursor obtained by the reaction of an ester-containing diamine such as 4-aminophenyl 4?-aminobenzoate, a biphenyl-based diamine such as 4,4?-diamino-2,2?-dimethylbiphenyl, and an unsaturated group-containing diamine such as 4,4?-diamino-2,2?-divinylbiphenyl with an acid anhydride such as pyromellitic dianhydride. The content of the structural unit derived from the unsaturated group-containing diamine in the polyimide precursor is 5-60 mol %.

Abstract: In a method for preparing a polyimide resin by reacting diamine and dianhydride, the polyimide resin is polymerized under the presence of a solvent having a boiling point ranging from 130° C. to 180° C. so as to be curable at a low temperature ranging from 150° C. to 250° C. Because the polyimide is curable even at a low temperature, when the polyimide resin is used as an electronic material, damage to equipment due to an otherwise high temperature process can be minimized, and in addition, the polyimide resin can be extensively used as an electronic material such as for a plastic substrate, or the like.

Abstract: The present invention provides a method for producing a high-quality nonconductive or semi-conductive seamless (jointless) tubular polyimide film in a simple, efficient, and economical manner, and the like. More specifically, the invention relates to an electrically non-conductive or electrically semi-conductive seamless tubular polyimide film comprising polyimide having at least two aromatic tetracarboxylic acid derivatives comprising 15 to 55 mol % of asymmetric aromatic tetracarboxylic acid component and 85 to 45 mol % of symmetric aromatic tetracarboxylic acid component and at least one aromatic diamine component, in which, as required, a specific amount of carbon black is dispersed, and relates to a method for producing the same.

Abstract: This invention relates to the composition and a solvent-free process for preparing novel imide oligomers and polymers specifically formulated with effective amounts of a dianhydride such as 2,3,3?,4-biphenyltetra carboxylic dianydride (a-BPDA), at least one aromatic diamine and an endcapped of 4-phenylethynylphthalic anhydride (PEPA) or nadic anhydride to produce imide oligomers that possess a low-melt viscosity of 1-60 poise at 260-280° C. When the imide oligomer melt is cured at about 371° C. in a press or autoclave under 100-500 psi, the melt resulted in a thermoset polyimide having a glass transition temperature (Tg) equal to and above 310° C. A novel feature of this process is that the monomers; namely the dianhydrides, diamines and the endcaps, are melt processable to form imide oligomers at temperatures ranging between 232-280° C. (450-535° F.) without any solvent.