Abstract: It is provided for a resin composition including (A) at least one polyamic acid having the structure represented by the following formula (1): wherein R1 is independently an alkyl group having 1 to 3 carbon atoms or a cyano group; a is independently an integer of 0 to 4; R is a tetravalent organic group; n is an integer of 1 to 4; and m is an integer of 1 to 100,000, and (E) an organic solvent.

Abstract: A polyimide film in which the dimensional change is reduced when it has undergone a step of laminating a metal on the polyimide film or a step of etching the metal layer to form wiring, and the rate of dimensional change can be stabilized across the entire width is provided. The object can be solved by a polyimide film produced by a continuous process, wherein when a coefficient of linear expansion a in a direction of the molecular orientation axis and a coefficient of linear expansion b in a direction perpendicular to the molecular orientation axis are measured in the temperature range of 100° C. to 200° C., a and b satisfy a particular relationship across the entire width, or a polyimide film produced by a continuous process, wherein when a tear propagation resistance c in the direction of the molecular orientation axis and a tear propagation resistance d in the direction perpendicular to the molecular orientation axis are measured, c and d satisfy a particular relationship across the entire width.

Abstract: A polyimide obtained by reacting a tetracarboxylic acid component with a diamine component containing a diamine compound represented by the following general formula (1): wherein, A represents a biphenylene group which may be substituted with an alkyl group having up to 4 carbon atoms.

Abstract: There is provided a fluorine-containing diamine represented by formula (1). In this formula, R1 represents a condensed polycyclic type aromatic hydrocarbon group, and at least one —C(CF3)2OH group and at least one —NH2 group are in a relation such that they are attached to adjacent carbons of carbon atoms constituting the condensed polycyclic type aromatic hydrocarbon group. Polymer compounds derived from this fluorine-containing diamine have superior low dielectric property and low water-absorbing property, and, in addition to that, shows low thermal expansion property and high glass transition temperature.

Abstract: A terminally-modified polybranched polyimide which can be efficiently complexed with an inorganic material is obtained by reacting a component (a): tetracarboxylic dianhydride; a component (b): as an amine component, a mixture of a triamine and a diamine (which may be composed of a triamine only); and a component (c): as a terminal component, a compound selected from general formulae (1-1) to (1-4). H2N—X—R1??(1-1) (In the formula, X represents a single bond or an alkylene group having 1 to 3 carbon atoms, and R1 represents a nitrogen-containing heterocyclic group). H2N—X—R1??(1-2) (In the formula, X is as defined above, and R1 represents a sulfur-containing heterocyclic group or an aryl group having a thiol or thioether group in the molecule). (In the formula, R represents a nitrogen-containing heterocyclic group). (In the formula, R represents a monovalent residue).

Abstract: The disclosed compositions and methods for producing composite materials that are suitably adapted for use in elevated temperature environments generally include the use of oxyarylbisorthodinitrile matrix resins in conjunction with aromatic amines to produce an improved phthalonitrile-based composite. Various features and specifications may be controlled, adapted or otherwise optionally modified to improve the temperature-rated performance of the disclosed composite materials. Exemplary embodiments of the present invention generally provide composite materials that offer improved strength at temperatures in excess of 600° F.

Abstract: Diamine compound containing specific triazine group, polyamic acid obtained by reacting the diamine compound and tetracarboxylic dianhydride, and liquid crystal alignment film obtained by coating and imidizing the polyamic acid. The liquid crystal alignment film has good heat-resistance, high transparency in visible light region and improved voltage holding ratio. Also, pretilt angle is easily controlled over broad range.

Abstract: A polyimide compound has a low coefficient of linear thermal expansion comparable to the coefficient of linear thermal expansion of a conductor to be covered by the polyimide. The polyimide compound is less susceptible to contraction caused by dehydration process. The compound is obtained by the reaction of a highly linear acid dianhydride with a highly linear diamine and has a high imidization rate. Having a low coefficient of linear thermal expansion comparable to the conductor to be covered by the polyimide, the polyimide compound of the present invention is less susceptible to contraction that occurs during polyimide formation. The polyimide compound is suitable for making curl-free flexible wiring boards.

Abstract: The present invention is directed to the use polycyclic diamines. These diamines, when polymerized with dianhydrides, and optionally other non-polycyclic diamines are used to form new polyamic acids. The polyamic acids can be imidized to form a new class of useful polyimide resins and polyimide films, particularly in electronics type applications.

Abstract: The present invention relates to novel imide oligomer compositions, polyimides formed therefrom, and methods for making and using the same. In particular, the invention relates to novel polyimide oligomers comprising 3,3?,4,4?-benzophenone tetracarboxylic dianhydride (BTDA), 2-(3,4-dicarboxy phenyl)-1-phenylacetylene anhydride (PE), and a mixture of 1,3-diaminobenzene and 4,4?-(1,3-phenylenediisopropylidene) bisaniline. The polyimide oligomers demonstrate low melt viscosity (these resins are melt processable) while retaining exceptional thermo-oxidative stability, high glass transition temperature, and good mechanical properties in the cured state.

Abstract: The present invention provides a cleaning substrate of a substrate processing equipment, which comprises a cleaning layer comprising a heat resistant resin with a storage modulus (1 Hz) at 20° C. up to 150° C. being 5×107 Pa to 1×109 Pa on at least one face of the substrate; and a polyimide resin suitable as the heat resistant resin for the cleaning layer and usable under circumstances possibly involving the generation of serious disadvantages due to silicone contamination, such as for HDD application and some semiconductor applications.

Abstract: Disclosed is a polyimide film prepared from an aromatic tetracarboxylic acid component consisting essentially of 3,3?,4,4?-biphenyltetracarboxylic dianhydride and an aromatic diamine component consisting essentially of not less than 65 mol phenylenediamine % but less than 97 mol % of p-phenylenediamine and not less than 3 mol % but less than 35 mol % of 2,4-toluenediamine.

Abstract: A polyamide having a structure represented by the chemical formula (1): wherein m and n represent an integer satisfying m?1, n?1, 2?(m+n)?150, 0.3?m/(m+n)?0.9, R1 and R2 represent at least one monovalent organic group containing a photopolymerizable unsaturated bond, X1 represents at least one tetravalent aromatic group, X2 represents at least one trivalent aromatic group, Y1 and Y2 represent at least one divalent organic group, and Z represents at least one monovalent organic group selected from mono-substituted amino and imido groups.

Abstract: A polyimide film with advantageous handleability, flexibility, dimensional stability and heat resistance is provided. The polyimide film is characterized by block-copolymerizing an aromatic diamine component comprising 10˜25 mol % of paraphenylenediamine (a1) and 75˜90 mol % of 4,4?-diaminodiphenyl ether (a2) with an aromatic tetracarboxylic acid component consisting of 75˜99.9 mol % of pyromellitic acid dianhydride (b1) and 0.1˜25 mol % of 3,3?,4,4?-biphenyl tetracarboxylic acid dianhydride (b2). The Young's modulus, linear expansion coefficient, water absorption rate and glass transition temperature of such polyimide films can be controlled within very useful ranges.

Abstract: A fluorine-containing diamine represented by the formula (1), [Chemical Formula 29] is provided. Furthermore, a fluorine-containing polymer is provided by using this fluorine-containing amine as a monomer. The fluorine-containing polymer can exhibit superior characteristics such as low dielectric property and high transparency, while maintaining high fluorine content and retaining adhesive property.

Abstract: A fully imidized, solvent-free polyimide foam having excellent mechanical, acoustic, thermal, and flame resistant properties is produced. A first solution is provided, which includes one or more aromatic dianhydrides or derivatives of aromatic dianhydrides, and may include one or more aromatic diamines, dissolved in one or more polar solvents, along with an effective amount of one or more blowing agents. This first solution may also advantageously include effective amounts respectively of one or mores catalysts, one or more surfactants, and one or more fire retardants. A second solution is also provided which includes one or more isocyanates. The first and second solutions are rapidly and thoroughly mixed to produce an admixture, which is allowed to foam—in an open container, or in a closed mold—under ambient conditions to completion produce a foamed product. This foamed product is then cured by high frequency electromagnetic radiation, thermal energy, or a combination thereof.

Abstract: A polyimide optical compensation film is provided. The polyimide optical compensation film has the formula: wherein when A is cycloaliphatic, B is aromatic or cycloaliphatic, when A is aromatic, B is cycloaliphatic, and n is an integer greater than 1. The optical compensation film has in-plane retardation (R0) and thickness direction retardation (Rth).

Abstract: A novel polyimide copolymer, which is a copolymer comprising two kinds of tetracarboxylic acid dianhydrides consisting of (A) isopropylidene-bis(4-phenyleneoxy-4-phthalic acid) dianhydride and (B) 3,3?,4,4?-biphenyltetracarboxylic acid dianhydride, and one kind of a diamine consisting of (C) 6-amino-2-(p-aminophenyl)benzimidazole, or two or three kinds of diamines consisting of component (C) and (D) at least one kind of diamines consisting of bis(4-amino-phenyl)ether (D1) and phenylenediamine (D2), and a metal laminate manufactured by laminating said polyimide copolymer to a metallic foil. The metal laminate comprising the novel polyimide copolymer as a layer on the metallic foil has a low curling susceptibility to cause curling, twisting, warping, etc.

Abstract: A polyamic ester (PAE) film, which shows an electro-optic (EO) and nonlinear optical (NLO) properties without a poling process, is prepared. The chromophore in the film seems to be slightly oriented normally to the film surface (transverse magnetic field (TM) direction even though the polymer solution is spin-coated. This is due to the nano-configuration structure of PAE controlled by introducing a designed chemical structure into the monomeric repeating unit of PAE. Manufacturing the relating devices can be simplified by using the self-poled polymer film as a polymer waveguide. Additionally, the EO property of the film is thermodynamically stable.

Abstract: The benefits of liquid crystal polymers and polyetherimides are combined in an all-aromatic thermoplastic liquid crystalline polyetherimide. Because of the unique molecular structure, all-aromatic thermotropic liquid crystal polymers exhibit outstanding processing properties, excellent barrier properties, low solubilities and low coefficients of thermal expansion in the processing direction. These characteristics are combined with the strength, thermal, and radiation stability of polyetherimides.

Abstract: To provide a liquid crystal aligning agent useful to obtain a liquid crystal alignment film which exhibits a high voltage retention characteristic even under high temperature conditions and which has a low accumulation charge, and a liquid crystal display device which is less susceptible to lowering of contrast or to image persistence.

Abstract: The present invention relates to novel therapeutic and diagnostic dendrimers. In particular, the present invention is directed to dendrimer based multifunctional compositions and systems for use in disease diagnosis and therapy (e.g., cancer diagnosis and therapy). The compositions and systems comprise one or more components for targeting, imaging, sensing, and/or providing a therapeutic or diagnostic material and monitoring the response to therapy of a cell or tissue (e.g., a tumor).

Abstract: Provided are an ester group-containing poly(imide-azomethine)copolymer having low linear thermal expansion coefficient; a production method thereof; an ester group-containing poly(amide acid-azomethine)copolymer to serve as the precursor of the poly(imide-azomethine)copolymer; a positive photosensitive composition including the poly(amide acid-azomethine)copolymer and a photosensitizer; a method for forming a fine pattern of an ester group-containing poly(imide-azomethine)copolymer from the composition; and a method for forming a fine pattern of an ester group-containing poly(imide-azomethine)copolymer by etching a photosensitizer-free, ester group-containing poly(imide-azomethine)copolymer in an alkaline solution.

Abstract: The objective of the present invention is to provide a polyimide film with decreased water absorption. A polyimide film, which is made of diamine and tetracarboxylic dianhydride, characterized in that tetracarboxylic dianhydride, which constitutes polyimide, contains tetracarboxylic dianhydride.

Abstract: A method of preparing a poly(amic acid) includes a step of reacting an aromatic diacid anhydride or alicyclic diacid anhydride, an aliphatic diamine or alicyclic diamine, and an acid having a pKa of 3 to 5. A method of preparing a polyimide by imidating the resulting poly(amic acid) is also disclosed.

Abstract: Photoreactive dendrimers comprising a core portion, branching units and terminal groups, wherein at least one terminal group and/or branching unit is a photoreactive group and wherein the photo reactive groups include preferably cinnamates, coumarins, benzylidenephthalimidines, benzylideneacetophenones, diphenylacetylenes stilbazoles, uracyl, quinolinone, maleinimides, or cinnamylidene acetic acid derivatives and are able to undergo photocyclization, in particular [2+2]-photocyclization.

Abstract: A process for synthesizing formulations for polyimides suitable for use in high-temperature composites in which all reactions other than chain-extension have already taken place prior to making a composite is described, wherein the resulting oligomers comprise a backbone and at least one difunctional endcap. The resulting resin systems have only the single step of endcap-to-endcap reactions during composite processing. Prior to the initiation temperature of these endcap-to-endcap reactions, the resins are stable affording the composite manufacturer a very large processing window.

Abstract: The present invention is related to a polyimide, which has high ionic conductivity and good structural stability, does not decompose even under low humidity, and is inexpensive, and a polymer electrolyte and a fuel cell using the same.

Abstract: The present invention provides a polyimide film and its usage. The polyimide film according to the present invention does not cause dimensional change due to thermal stress. The present invention particularly relates to a polyimide film and its usage, which polyimide film has a characteristic of suppressing thermal deformation of the material in lamination of a polyimide film and a metal layer by a laminate method. The polyimide film according to the present invention has the following characteristics: (1) an inflexion point of storage modulus ranges from 270° C. to 340° C.; (2) tan ?, which is a value obtained by dividing a loss elastic modulus by a storage modulus, has a peak-top in a range of 320° C. to 410° C.; (3) a storage modulus at 380° C. ranges from 0.4 GPa to 2.0 GPa; and (4) a storage modulus ?1 at the inflexion point (GPa) and a storage modulus ?2 at 380° C. (GPa) satisfy: 85?{(?1??2)/?1}×100?65.

Abstract: A thermoplastic polyimide composition, comprising a silane-modified polyimide (A); and a polar solvent (B), wherein the silane-modified polyimide (A) is obtained by reacting a polyimide (a) and an epoxy-containing silane (b). The polyimide (a) contains repeating units represented by the general formulae I and II, wherein the molar fraction of the repeating unit of formula II is at least 10%, X represents a quadrivalent aromatic group, Ar1 represents a bivalent aromatic group, and Ar2 represents a bivalent aromatic group containing an OH or COOH group.

Abstract: A novel polyimide copolymer, which is a copolymer comprising two kinds of tetracarboxylic acid dianhydrides consisting of (A) isopropylidene-bis(4-phenyleneoxy-4-phthalic acid) dianhydride and (B) 3,3?,4,4?-biphenyltetracarboxylic acid dianhydride, and one kind of a diamine consisting of (C) 6-amino-2-(p-aminophenyl)benzimidazole, or two or three kinds of diamines consisting of component (C) and (D) at least one kind of diamines consisting of bis(4-amino-phenyl)ether (D1) and phenylenediamine (D2), and a metal laminate manufactured by laminating said polyimide copolymer to a metallic foil. The metal laminate comprising the novel polyimide copolymer as a layer on the metallic foil has a low curling susceptibility to cause curling, twisting, warping, etc.

Abstract: The present invention provides a polyimide having the formula (II) formed by reacting a dianhydride with the diamine having the formula (I). The polyimide provided by the present invention serves as a material for preparing the liquid crystal aligning film, wherein the liquid crystal aligning film could achieve the pre-tilt angle of 88-90° by containing only less than 5% of the diamine having the formula (I), which could highly lower down the manufacturing cost.

Abstract: A class of soluble poly(aryletherimides) (PAEIs) having flexible backbones, useful in the manufacture of polymeric optical films are disclosed. The poly(aryletherimides) are dissolved in organic solvents, such as ketones and ketone solvent mixtures and coated on variety of substrates such as triacetyl cellulose (TAC), to form clear thin-layer films which display negative birefringence. The thin films can serve as compensation layers in liquid crystal displays (LCDs), and can be combined with other types of optical films, such as polarizers, brightness enhancement films, or other compensation films, to from multi-layered films that are especially useful in the manufacture of LCDs.

Abstract: Degradable polyimides are prepared in high yield by polymerizing a monomer containing at least two anhydride groups, and a monomer containing at least two primary amine groups and at least one acidic group, in bulk or in a solvent. The polyimides are very strong in terms of their mechanical properties, yet degradable under standard physiological conditions.

Abstract: Disclosed herein is an LC aligning agent using diamine having dendron side chains. In detail, the present invention relates to a composition for an LC alignment film which employs diamine having dendron side chains to produce polyamic acid, followed by imidization. When the LC alignment film is applied to a liquid crystal display device, high heat resistance, high penetration in a visible ray range, excellent alignment, and a high voltage holding ratio are assured. Even though it contains a small amount of functional diamine, a high pretilt angle can be assured. Thus, the pretilt angle is easily controlled and a vertical aligning force is improved.

Abstract: A process for producing 2,3,3?,4?-biphenyltetracarboxylic dianhydride (a-BPDA), comprising dehydrating 2,3,3?,4?-biphenyltetracarboxylic acid in an inert gas atmosphere under heating at 180 to 195° C. is disclosed. This process produces high-purity a-BPDA which is suitable for production of a polyimide.

Abstract: A liquid crystal display includes; a first and a second display panel facing each other, an alignment layer formed on at least one of the first and the second display panels and including a polyamic acid moieties and a polyimide moieties which form a block copolymer, and a liquid crystal layer interposed between the first display panel and the second display panel.

Abstract: The present invention provides a photosensitive resin which is rich in heat resistance and flexibility. The present invention relates to the unsaturated group-containing polyimide resin obtained through a reaction between a polyimide resin, which is obtained by polyimidization of a polyamide acid obtained through a reaction between a diamino-6-hydroxypyrimidine (diamine component (A)) and an aromatic tetrabasic acid dianhydride (C), and an unsaturated group-containing compound, preferably a compound having a reactive group such as an acid anhydride group or isocyanate group and an unsaturated group; relates to a photosensitive resin composition containing such resin, a crosslinking agent and photopolymerization initiator; and relates to a cured product of such a resin composition.

Abstract: Perfluorinated polyimides (and co-polyimide) compositions, particularly films are disclosed, comprising at least 50 mole percent of a polymeric repeat unit derived from contacting 3,3?,4,4?-biphenyltetracarboxylic dianhydride (BDPA) and 2,2?-bis(trifluoromethyl) benzidine (TFMB) monomers. The perfluorinated polyimide (and co-polyimide) films of the invention have an in-plane coefficient of thermal expansion (CTE) between ?5 and +20 ppm/° C. and a average light transmittance percent of from about 65.0 to about 99.0 (on a 75-micron thick film basis). The films of the present invention were converted to a polyimide using a chemical conversion method instead of typically employed thermal conversion step thus yielding these desirable properties. The films of the present invention can be an excellent substrate in an optical display device and can be used to replace rigid glass substrates. Finally, the polyimide films of the invention can also be used to manufacture flexible display devices (e.g.

Abstract: The invention provides an inkjet ink including a compound (A) obtained by polymerizing an acid anhydride group-containing compound (a1), an amino-containing compound (a2), and a hydroxy compound (a3), and provides a method for manufacturing this inkjet ink.

Abstract: The invention provides a polyamide resin having a structure represented by the formula (1), wherein about 0.1 mol % to about 30 mol % of the total amount of Y in the formula (1) has a structure represented by the formula (2), further a positive-working photosensitive resin composition comprising a diazoquinone compound, a method for producing a pattern-formed resin film using the composition, a semiconductor device and a display device using the composition, and a method for producing the semiconductor device and the display device: wherein, X is an organic group of 2 to 4 valences; Y is an organic group of 2 to 6 valences; R1 is a hydroxyl group or —O—R3 wherein m is an integer of 0 to 2; R2 is a hydroxyl group, a carboxyl group, —O—R3 or —COO—R3 wherein n is an integer of 0 to 4; R3 is an organic group having 1 to 15 carbon atoms; wherein, each of R4 and R5 is a divalent organic group; each of R6 and R7 is a monovalent organic group; n is an integer of 0 to 20.

Abstract: The polyimides of the present invention are derived from aliphatic diamines and show advantageous arc tracking performance (i.e., low arc tracking). These polyimides can be cured at low temperatures making them suitable as coverlay compositions in electronic circuitry. In addition, these polyimides are soluble and excellent in heat resistance and adhesion properties, showing a low dielectric constant even at 10 GHz or more.

Abstract: An anti-bacterial polymer of the present invention consists of a vapor deposition-polymerization reaction product of a diaminobenzoic acid monomer or halogen atom-containing diamine monomer and a monomer reactive with these monomers. The anti-bacterial polymer can be prepared by a method, which comprises the step of subjecting a gas obtained by evaporating a diaminobenzoic acid monomer or halogen atom-containing diamine monomer and a gas obtained by evaporating a monomer reactive with these monomers to vapor deposition-polymerization, in a vacuum, to thus form an anti-bacterial polymer. The method permits the formation of a film having a desired thickness even on the surface having a complicated shape such as the surface of, for instance, a heat exchanger.

Abstract: Such a composition for forming an insulating layer improved in insulating property is to be obtained. A composition for forming an insulating layer of an electronic device is provided, and the composition contains at least one polymer selected from a polyamic acid and a derivative of a polyamic acid, and a compound having a functional group capable of reacting with a carboxyl group contained in a constitutional unit of the polymer.

Abstract: A material for dielectric films is a polymerizable composition containing an organic solvent, and an adamantanepolycarboxylic acid derivative represented by following Formula (1): wherein X is hydrogen atom, a hydrocarbon group or R4; R1, R2, R3 and R4 and are each independently a protected or unprotected carboxyl group, etc.; and Y1, Y2, Y3 and Y4 are each independently a single bond or a bivalent aromatic cyclic group; and an aromatic polyamine derivative represented by following Formula (2): wherein Ring Z is a monocyclic or polycyclic aromatic ring; and R5, R6, R7 and R8 are each a substituent bound to Ring Z and are each independently a protected or unprotected amino group, etc., dissolved in the organic solvent.

Abstract: The present invention deals with a process for treating a polyimide comprising exposing said polyimide to a compound selected from the group consisting of dendrimers, hyperbranched polymers and mixtures thereof. The polyimide may be in the form of a membrane and the membrane, after treatment according to the process of the invention, may be suitable for use in a membrane-based separation technique, for example gas separation, filtration, microfiltration, ultrafiltration, reverse osmosis or pervaporation. The membrane may for example be suitable for separation of gas and hydrocarbon mixtures including mixtures of H2/N2, H2/CO2, He/N2, CO2/CH4, and C2–C4 hydrocarbon mixtures.

Abstract: A diamine compound represented by the formula (1): wherein R1 is a trivalent organic group, each of X1 and X2 is a bivalent organic group, X3 is an alkyl or fluoroalkyl group having from 1 to 22 carbon atoms, or a cyclic substituent selected from aromatic rings, aliphatic rings, heterocyclic rings and their substituted groups, and n is an integer of from 2 to 5. And, a polyimide precursor and a polyimide synthesized by using the diamine compound; and a treating agent for liquid crystal alignment containing the polyimide precursor and/or the polyimide.

Abstract: A soluble polyimide for a photosensitive polyimide precursor and a photosensitive polyimide precursor composition including the soluble polyimide, wherein the soluble polyimide contains hydroxyl and acetyl moieties and at least one reactive end-cap group at one or both ends of the polymer chain. The photosensitive polyimide precursor composition comprises the soluble polyimide, a polyamic acid containing at least one reactive end-cap group at one or both ends of the polymer chain, a photo acid generator (PAG) and optionally a dissolution inhibitor. Since the polyimide film of the present invention exhibits excellent thermal, electric and mechanical properties, it can be used as insulating films or protective films for various electronic devices. A pattern with a high resolution may be formed even on the polyamide film having a thickness of above 10 ?m.

Abstract: In one aspect the present invention provides a storage medium for data, the storage medium comprising: a) a substrate, a physical portion of which comprises at least one polyimide, and b) at least one data layer on the substrate. The substrate comprising a polyimide exhibits low axial displacement and beneficial damping characteristics.

Abstract: A method for preparation of a sulfonic and or sulfonic acid salt containing polyimide resins comprising melt reaction of a polyimide resin with an organic compound, wherein the organic compound contains at least one aliphatic primary amine functionality and at least one other functionality selected from the group consisting of sulfonic acids, sulfonic acid salts or mixtures thereof.