Abstract: A terminally-modified polybranched polyimide which can be efficiently complexed with an inorganic material is obtained by reacting a component (a): tetracarboxylic dianhydride; a component (b): as an amine component, a mixture of a triamine and a diamine (which may be composed of a triamine only); and a component (c): as a terminal component, a compound selected from general formulae (1-1) to (1-4). H2N—X—R1??(1-1) (In the formula, X represents a single bond or an alkylene group having 1 to 3 carbon atoms, and R1 represents a nitrogen-containing heterocyclic group). H2N—X—R1??(1-2) (In the formula, X is as defined above, and R1 represents a sulfur-containing heterocyclic group or an aryl group having a thiol or thioether group in the molecule.) (In the formula, R represents a nitrogen-containing heterocyclic group.) (In the formula, R represents a monovalent residue.

Abstract: It is an object of the present invention to provide a siloxane-modified hyperbranched polyimide which has more excellent electric properties (low dielectric property), gas permeability, mechanical properties (low modulus), surface properties (adhesiveness) and the like while maintaining thermal stability, mechanical strength, chemical resistance and processability and the like intrinsic to polyimide and which may be variously functionalized and can be utilized advantageously in industrial applications. A siloxane structure represented by the following structural formula (1) is introduced into a three-dimensional structured hyperbranched polyimide molecule. (wherein R1 represents a hydrocarbon group having from 1 to 6 carbon atoms, and n indicates an integer of from 1 to 50).

Abstract: A process for producing a filmy graphite includes the steps of forming a polyimide film having a birefringence of 0.12 or more and heat-treating the polyimide film at 2,400° C. or higher.

Abstract: This invention provides a procedure for growing oligomers via a stepwise process. The oligomers can include porphyrins, which have been previously shown to be attractive candidates for molecular-based information storage. The stepwise synthesis procedure requires no protecting groups, thus eliminating protection/deprotection reactions that add complexity to the process.

Abstract: It is a main object of the present invention to provide a polyimide precursor and a polyimide precursor resin composition, which precursor being easy to synthesize, available at low cost, excellent in storage and capable of giving polyimide that is low in impurities after imidization, irrespective of the chemical structure of the finally-obtained polyimide.

Abstract: Disclosed is a 5-alkyl-1,2,3,4-benzene tetracarboxylic-1:2,3:4-dianhydride which is represented by the general formula (1) and has excellent solubility with respect to various organic solvents. Depending on the diamine that is used, a polyimide with excellent heat resistance or a polyimide with good workability at a low melting point can be provided, and in addition, a polyimide that exhibits excellent characteristics for electronic materials or the like can be provided. (In the formula, R1 represents an alkyl group with carbon number 1-10.

Abstract: The present invention provides a useful and novel alicyclic polyesterimide. An alicyclic polyesterimide produced by imidation of an alicyclic polyesterimide precursor is found to be a useful material in industrial fields, the alicyclic polyesterimide precursor being obtained by reacting an alicyclic tetracarboxylic anhydride having an ester group or a class of tetracarboxylic acid thereof as a starting material with an amine.

Abstract: A resin solution composition comprising (A) a polyamic acid resin, (B) an alkoxysilyl-containing polyamic acid resin, and (C) an organic solvent cures into a product that has good substrate adhesion and heat resistance and is effective in forming a protective film on a semiconductor device prior to encapsulation with epoxy resin molding material (molding compound) in that it overcomes the chip cracking and thermal deterioration problems of semiconductor packages by thermal stress.

Abstract: The present invention provides a polyimide film having a good transparency and also an excellent thermal resistance so that it is useful in a transparent conductive film, TFT substrate, a flexible printing circuit substrate, and the like.

Abstract: A method for forming a polyimide composite article utilizes a polyimide resin system including at least a first prepolymer component and a second prepolymer component. A preform structure is tackified with the first prepolymer component. Using resin infusion or resin transfer molding techniques, the tackified preform structure is contacted with the second prepolymer component. The polyimide resin system is cured under suitable cure conditions so that the first and second prepolymer components mix and react to produce the polyimide composite structure.

Abstract: Diamine compounds, which in particular are useful as precursors for the production of liquid crystal alignment layers, are represented by the general formula I: wherein A1 represents an organic group of 1 to 40 carbon atoms; A2 represents a hydrogen atom or an organic group of 1 to 40 carbon atoms.

Abstract: A method for producing a polyimide film comprises the steps of: preparing a polar organic solvent solution of a polyimide precursor obtained by mixing a tetracarboxylic acid dianhydride compound and a diamine compound; adding a dehydrating agent and an imidization catalyst to the polar organic solvent solution so as to prepare a resin solution composition; and drying the resin solution composition by heating so as to imidize the resin solution composition after flowing the resin solution composition onto a support in a casting manner, wherein diethyl pyridine is used as the imidization catalyst. According to the production method, it is possible to obtain a polyimide film which is highly productive and is excellent in the film quality such as the mechanical property, the adhesive strength, and the like.

Abstract: An aromatic ring-containing polymer, an underlayer composition including the same, and associated methods, the aromatic ring-containing polymer including a group represented by one of the following Chemical Formulae 1-1, 1-2, 2-1, and 2-2:

Abstract: 2,3,3?,4?-biphenyltetracarboxylic acid is heat-dehydrated in a molten state at a temperature not lower than 200° C. in a flow of an inert gas in a reactor 10 having at least one reaction vessel 11 by stirring the molten material to produce 2,3,3?,4?-biphenyltetracarboxylic dianhydride. Thus obtained 2,3,3?,4?-biphenyltetracarboxylic dianhydride in the molten state is subsequently cooled and solidified in an inert gas or dry air, or cooled and solidified in the ambient air at a temperature of 40° C. or lower or 100° C. or higher.

Abstract: A tailorable polyimide prepolymer blend comprising an end group component, a dianhydride component, and a diamine component. The dianhydride component includes at least 3,4,3?,4?-benzophenonetetracarboxylic dianhydride (BTDA), derivatives thereof, or combinations thereof, and 3,4,3?,4?-biphenyltetracarboxylic dianhydride (BPDA), derivatives thereof, or combinations thereof. The diamine component includes at least 1,3-phenylenediamine (mPDA), derivatives thereof, or combinations thereof; 1,4-phenylenediamine (pPDA), derivatives thereof, or combinations thereof; bis amino phenoxy benzene (APB), derivatives thereof, and combinations thereof; and optionally, 4,4?-(1,3-phenylene-bis(1-methylethylidene)bisaniline (Bis-M), derivatives thereof, and combinations thereof. A cured polyimide matrix has a glass transition temperature of at least about 450° F. (232° C.).

Abstract: A method for using citraconic anhydride and itaconic anhydride as addition cure end caps in reactions for forming polyamic acid oligomers and polyimide oligomers, is provided. Prepregs and high temperature adhesives made from the resulting oligomers, as well as, high temperature, low void volume composites made from the prepregs, are also provided.

Abstract: Diamine compounds, which in particular are useful as precursors for the production of liquid crystal alignment layers, are represented by the general formula I: wherein A1 represents an organic group of 1 to 40 carbon atoms; A2 represents a hydrogen atom or an organic group of 1 to 40 carbon atoms.

Abstract: A resin composite copper foil comprising a copper foil and a resin layer containing a block copolymer polyimide and a maleimide compound, the resin layer being formed on one surface of the copper foil, a production process thereof, a copper-clad laminate using the resin composite copper foil, a production process of a printed wiring board using the copper-clad laminate, and a printed wiring board obtained by the above process.

Abstract: Disclosed is a polyimide film, which is very transparent and very resistant to heat and thus undergoes little dimensional change under thermal stress, and is suitable for use in transparent conductive films, TFT substrates, flexible printed circuit boards and so on.

Abstract: The present invention provides a method for preparing relatively insoluble bisimides under conditions which afford high imidization reaction rates and which permit the monitoring and adjustment of reactant stoichiometry at any stage of the reaction. The bisimides provided by the present invention are prepared either by reaction of a diamine such as 4,4?-diaminodiphenylsulfone (DDS) with an anhydride, for example 3-chlorophthalic anhydride (3-ClPA) in the presence of a solvent at a pressure greater than one atmosphere and at a temperature above the normal boiling point of the solvent, or by reaction of a monoamine with a dianhydride under the same conditions. In one embodiment, the relatively insoluble product bisimides provided by the present invention have a solubility in ortho-dichlorobenzene of less than about 10 percent by weight at a temperature of about 180° C.

Abstract: The benefits of liquid crystal polymers and polyetherimides are combined in an all-aromatic thermoplastic liquid crystalline polyetherimide. Because of the unique molecular structure, all-aromatic thermotropic liquid crystal polymers exhibit outstanding processing properties, excellent barrier properties, low solubilities and low coefficients of thermal expansion in the processing direction. These characteristics are combined with the strength, thermal, and radiation stability of polyetherimides.

Abstract: A novel polyimide which retains the characteristics of polyimides, that is, excellent heat resistance, electrical insulation and chemical resistance, of which dielectric constant is lower than those of the known polyimides, as well as a composition containing the same and a process for producing the same, is disclosed. The polyimide of the present invention is a cross-linked polyimide having a dielectric constant of not more than 2.7, which was produced by polycondensing (a) tetramine(s), (a) tetracarboxylic dianhydride(s) and (an) aromatic diamine(s) in the presence of a catalyst.

Abstract: A film is disclosed, containing 40-100 weight percent polyimide. The polyimide is derived from a dianhydride component and a diamine component. The dianhydride component is at least 3,3?,4,4?-biphenyl tetracarboxylic dianhydride (BPDA), and optionally is also pyromellitic dianhydride (PMDA) in a mole ratio of 50-100:50-0 (BPDA:PMDA). The diamine component comprises 1,5-naphthalenediamine (1,5-ND) and 1,4-diaminobenzene (PPD) and/or meta phenylene diamine (MPD) in a mole ratio of 15-95:85-5 (1,5-ND:PPD+MPD). The films have exceptional high temperature storage modulus (elastic modulus) and exceptionally low high temperature creep (eplast).

Abstract: The present invention provides polyimide applied to the buffer coating of semiconductors and a photosensitive resin composition including the same. The polyimide is a polyimide polymer represented by Chemical Formula 1 below. Further, the present invention provides a photosensitive resin composition, including 1) BDA-series soluble polyimide having an i-ray permeability of 70% or more; 2) a polyamic acid having elongation of 40% or more; 3) a novolak resin, and 4) diazonaphthoquinone-series photosensitive substance and having a high resolution, high sensitivity, an excellent film characteristic, and mechanical physical properties which are the requirements of semiconductor buffer coating.

Abstract: New compositions and methods of using those compositions as bonding compositions are provided. The compositions are preferably thermoplastic and comprise imides, amideimides, and/or amideimide-siloxanes (either in polymeric or oligomeric form) dispersed or dissolved in a solvent system, and can be used to bond an active wafer to a carrier wafer or substrate to assist in protecting the active wafer and its active sites during subsequent processing and handling. The compositions form bonding layers that are chemically and thermally resistant, but that can also be softened to allow the wafers to slide apart at the appropriate stage in the fabrication process.

Abstract: The invention relates to a method for manufacturing an inkjet ink including a polyamic acid (A), including a step of at least reacting one or more compounds selected from the group of a monoamine (a3) and a compound having one acid anhydride group (a4) with a compound having two or more acid anhydride groups (a1) and a diamine (a2).

Abstract: The invention provides a carbon nanotube compound and method for producing the same. The method of the invention comprises the following steps. Firstly, Aniline-trimer and DMAc(dimethyl acetamide) solution are mixed to form a first solution. Secondly, Dianhydride and DMAc solution are mixed to form a second solution. The first solution and the second are mixed to form a third solution. Additionally, carboxyl-multiwall carbon nanotubes (c-MWNT), Diaminodiphenylether and DMAc solution are mixed to form a fourth solution. The third solution and the fourth are mixed to form a polyamic acid/CNT solution. Some polyamic acid/CNT solution is spread on a substrate and processed by a thermal treatment, and a carbon nanotube compound is eventually produced.

Abstract: Disclosed is a polyimide film prepared from an aromatic tetracarboxylic acid component and an aromatic diamine component, which has a dimensional change from 25° C. to 500° C. within a range of from ?0.3% to +0.6% based on the initial dimension at 25° C. The polyimide film may be used as a substrate for a CIS solar cell.

Abstract: 3,4-Dicarboxy-1,2,3,4-tetrahydro-6-t-butyl-1-naphthalene-succinic dianhydride is provided. The tetracarboxylic dianhydride is represented by Formula 1, which is described in the specification. Further provided is a liquid crystal aligning agent comprising a polyimide prepared using the tetracarboxylic dianhydride and a solvent. Further provided is a liquid crystal alignment layer formed using the liquid crystal aligning agent. The liquid crystal alignment layer exhibits excellent electro-optical properties and good processability in terms of printability.

Abstract: The present invention relates to an adhesive film with which a flexible metal-clad laminate is obtained with suppressed dimensional changes occurred when produced by a laminating method; and a flexible metal-clad laminate comprising the adhesive film and a metal foil bonded thereto. The adhesive film comprises a polyimide film and, formed on at least one side thereof, an adhesive layer comprising a thermoplastic polyimide and has coefficients of linear expansion satisfying the relationship 1.0>(coefficient of linear expansion in the MD direction)/(coefficient of linear expansion in the TD direction)>0.1. This adhesive film may be one produced continuously and further satisfying the relationship 1.70>(elastic modulus in the MD direction)/(elastic modulus in the TD direction)>1.05 when the adhesive film has an MD modulus of 5 GPa or higher throughout the whole width thereof. That adhesive film may be one produced continuously and further satisfying the relationship 2.

Abstract: A polyimide material comprises a polyimide. The polyimide has repeating units of formula (I). The polyimide material further comprises a coupling agent-containing filler. A method for preparing a polyimide material comprises allowing a mixture comprising an aromatic tetracarboxylic dianhydride, an aromatic diamine, and a coupling agent-containing filler to react to produce a polyamic acid. The method further comprises contacting the polyamic acid with an aliphatic dicarboxylic acid of formula (II) to produce an intermediate, and imidizing the intermediate to produce the polyimide material. A polyimide comprises repeating units of formula (I).

Abstract: A novel polyimide compound which has a low linear expansion coefficient and permits film formation by a spin coating method or the like, a preparation method for the polyimide compound, and an optical film and an optical waveguide produced by employing the compound. The polyimide compound has a structural unit represented by the following general formula (1): wherein X is a covalent single bond, —CH2—, —C(CF3)2— or —CR(R?)— (wherein R and R?, which may be the same or different, are each a C1 to C6 alkyl group or an aryl group); A and B, which may be the same or different, are substituents each selected from a hydroxyl group, a halogen group and a C1 to C4 alkyl group; a and b, which are the numbers of the substituents A and B, respectively, are each an integer of 0 to 2; and o, p and q are each an integer of 1 to 5.

Abstract: A novel polyimide compound which has a lower linear expansion coefficient and permits film formation by a spin coating method or the like, a preparation method for the polyimide compound, and an optical film and an optical waveguide produced by employing the compound. The polyimide compound has a structural unit represented by the following general formula (1): wherein X and Y are each a covalent single bond, —CO—, —O—, —CH2—, —C(CF3)2— or —CR(R?)— (wherein R and R?, which may be the same or different, are each a linear or branched C1 to C4 alkyl group); A and B are each a halogen group; a and b, which are the numbers of the groups A and B, respectively, are each 0 or an integer of 1 or 2; and R1, R2, R3 and R4, which may be the same or different, are each a hydrogen atom or a linear C1 to C4 alkyl group.

Abstract: A thermosetting solution composition composed of a biphenyltetracarboxylic acid compound containing a partial lower aliphatic alkyl ester of 2,3,3?,4?-biphenyltetracarboxylic acid and/or a partial lower aliphatic alkyl ester of 2,2?,3,3?-biphenyltetracarboxylic acid, an aromatic diamine compound in a molar amount larger than a molar amount of the biphenyltetracarboxylic acid compound, a partial lower aliphatic alkyl ester of 4-(2-phenylethynyl)phthalic acid compound in a molar amount as much as 1.8-2.2 times a molar amount corresponding to a difference between the molar amount of the aromatic diamine compound and the molar amount of the biphenyltetracarboxylic acid compound, and an organic solvent composed of a lower aliphatic alcohol is of value for manufacture of a prepreg.

Abstract: To provide a process for producing BPDA whereby high productivity is attained while high purity is maintained. A process for producing biphenyltetracarboxylic acid dianhydride, which comprises heating biphenyltetracarboxylic acid to produce biphenyltetracarboxylic acid dianhydride, characterized in that the heating is carried out at a pressure of from 1×102 Pa to 1.1×105 Pa to a maximum temperature in a range of from 210° C. to 250° C. in such a manner that the temperature rising rate is higher than 50° C./hr for a period of at least ¼ of the time for the temperature rise from 60° C. to 210° C., and the temperature is maintained to be from 150° C. to 250° C. for from 0.5 to 10 hours.

Abstract: The object of the present invention is to provide an adhesion film for semiconductor that is capable of bonding a semiconductor chip to a lead frame tightly at an adhesion temperature lower than that of the adhesion film of a traditional polyimide resin without generation of voids and that can also be used for protection of lead frame-exposed area, a thermoplastic resin composition for semiconductor for use in the adhesive agent layer therein, and a lead frame having the adhesive film and a semiconductor device; and, to achieve the object, the present invention provides a thermoplastic resin composition for semiconductor, comprising a thermoplastic resin obtained in reaction of an amine component containing an aromatic diamine mixture (A) containing 1,3-bis(3-aminophenoxy)benzene, 3-(3?-(3?-aminophenoxy)phenyl)amino-1-(3?-(3?-aminophenoxy)phenoxy)benzene and 3,3?-bis(3?-aminophenoxy)diphenylether, and an acid component (C), an adhesion film for semiconductor using the same, a lead frame having the adhesion fi

Abstract: To provide a process for producing BPDA whereby high productivity is attained while high purity is maintained. A process for producing biphenyltetracarboxylic acid dianhydride, which comprises heating biphenyltetracarboxylic acid to produce biphenyltetracarboxylic acid dianhydride, characterized in that the heating is carried out at a pressure of from 1×102 Pa to 1.1×105 Pa to a maximum temperature in a range of from 210° C. to 250° C. in such a manner that the temperature rising rate is higher than 50° C./hr for a period of at least ¼ of the time for the temperature rise from 60° C. to 210° C., and the temperature is maintained to be from 150° C. to 250° C. for from 0.5 to 10 hours.

Abstract: A single-stage melt polymerization process is demonstrated for production of a polybenzimidazole which comprises the following steps. First, a high intensity reactor having a means for controlling agitation and rate of, atmosphere, and temperature is provided. Second, the high intensity reactor is degassed and filled with nitrogen. Third, a tetraminobiphenyl (TAB), compound A and an isophthalic acid (IPA), compound B are provided. Fourth, the high intensity reactor is charged with compounds A and B. Fifth, compound A and compound B are reacted under high intensity agitation in an absence of catalyst, to temperature of between 340° C. to 430° C. to produce a polybenzimidazole having an IV of at least 0.45 and a plugging value of greater than or equal to 1.0 g/cm2.

Abstract: A process for synthesizing formulations for polyimides suitable for use in high-temperature composites in which all reactions other than chain-extension have already taken place prior to making a composite is described, wherein the resulting oligomers comprise a backbone and at least one difunctional endcap. The resulting resin systems have only the single step of endcap-to-endcap reactions during composite processing. Prior to the initiation temperature of these endcap-to-endcap reactions, the resins are stable affording the composite manufacturer a very large processing window.

Abstract: Diamine compounds, which in particular are useful as precursors for the production of liquid crystal alignment layers, are represented by the general formula I: wherein A1 represents an organic group of 1 to 40 carbon atoms; A2 represents a hydrogen atom or an organic group of 1 to 40 carbon atoms.

Abstract: A negative birefringence film prepared from a poly(aryletherimide) which is the reaction product of a dianhydride and a diamine, where the dianhydride is 4,4?-[4,4?-(p-phenyleneoxy)isopropylidene]bis(phthalic anhydride) (BisADA), bis(3,4-dicarboxyphenyl)ether dianhydride (ODPA), 4,4?-bis(3,4-dicarboxyphenoxy)biphenyl dianhydride (BPEDA), 1,4-bis(3,4-dicarboxyphenyloxy)phenyl dianhydride (BPQDA), 3,3?,4,4?-tetracarboxylicbiphenyl dianhydride (BPDA), or 2,2-bis(3,4-dicarboxyphenyl)-1,1,1,3,3,3-hexafluoropropane dianhydride (6FDA), alone or a mixture with one or more of: 3,3?,4,4?-tetracarboxylicbiphenyl dianhydride (BPDA), 2,2-bis(3,4-dicarboxyphenyl)-1,1,1,3,3,3-hexafluoropropane dianhydride (6FDA); and where the diamine is 1,4-bis(2-trifluoromethyl-4-aminophenoxy)-2,5-di(t-butyl)benzene (BTBDA), 3,3?-dimethyl-4,4?-diamino biphenyl (OTOL), or mixtures thereof and wherein when a mixture of dianhydrides is present, they are present in a molar amount of between 99 to 1 (99:1) and 1 to 99 (1:99), and the film has

Abstract: The invention describes a process for preparing pulverulent polyimide-polyimide block copolymers. The result polyimide-polyimide block copolymers and compounds produced using them can be compressed into moldings by the direct forming method or by the hot compression molding method. Polymeric moldings can be produced therefrom by customary mechanical and thermal machining and forming methods.

Abstract: A non-thermoplastic polyimide film exhibits high adherability without expensive surface treatment and is made from a precursor solution having high storage stability. The non-thermoplastic polyimide film comprises a non-thermoplastic polyimide resin having a block component derived from a thermoplastic polyimide. Preferably, the block component of the thermoplastic polyimide is present in an amount of 20 to 60 mol % of the entire polyimide so that the precursor solution thereof exhibits high storage stability and that the film can exhibit high adherability, in particular, high adherability to polyimide adhesives.

Abstract: A thermosetting solution composition composed of a biphenyltetracarboxylic acid compound containing a partial lower aliphatic alkyl ester of 2,3,3?,4?-biphenyltetracarboxylic acid and/or a partial lower aliphatic alkyl ester of 2,2?,3,3?-biphenyltetracarboxylic acid, an aromatic diamine compound in a molar amount larger than a molar amount of the biphenyltetracarboxylic acid compound, a partial lower aliphatic alkyl ester of 4-(2-phenylethynyl)phthalic acid compound in a molar amount as much as 1.8-2.2 times a molar amount corresponding to a difference between the molar amount of the aromatic diamine compound and the molar amount of the biphenyltetracarboxylic acid compound, and an organic solvent composed of a lower aliphatic alcohol is of value for manufacture of a prepreg.

Abstract: A liquid crystal alignment solution is provided. The liquid crystal alignment solution includes at least one polymer selected from the group consisting of a polyamide acid-polyamide acid polymer represented by formula (A), a polyimide-polyamide acid polymer represented by formula (B) and a polyimide-polyimide polymer represented by formula (C), in which T1 and T2 are each independently a tetravalent organic group; m<n; p<q; r<s; and at least one of D1 and D2 is selected from the group consisting of formulae (1) to (15).

Abstract: The present invention relates to polyimide-titania hybrid thin film, which possesses relatively good surface planarization, excellent thermal properties (400<Td<550° C.), tunable refractive index (1.571<n<1.993), and highly optical transparency in the visible range. The present invention also relates to a method for preparing the polyimide-titania hybrid materials, which comprises producing a polyimide containing pendent and/or terminal carboxylic acid, coordinating the carboxylic acid with titanium of titanium alkoxide and sol-gel reacting of titanium alkoxide, to enhance the interaction between polyimide and titania and produce the polyimide-titania hybrid materials without macrophase separation. The present polyimide-titania hybrid materials are useful to produce the thin film having the above features.

Abstract: A polyamic acid composition including a polyamic acid, the polyamic acid having an imidization ratio of from about 5.0% to about 25.0%, and being obtained by reacting a diamine compound, a tetracarboxylic dianhydride and an acid monoanhydride at an amount ratio that satisfies the following formula (1): 0.970<Y/X<0.998 and Formula (2): 0.00<Z/2(X?Y)<0.50. In Formula (1) and Formula (2), X represents a content (mol) of the diamine compound, Y represents a content (mol) of the tetracarboxylic dianhydride, and Z represents a content of the acid monoanhydride (mol).

Abstract: An insulating varnish for forming an insulating covering on a conductor includes a polyimide resin including a repeat unit represented by a general formula (1): where X1 includes a tetravalent aromatic group including an aromatic ether structure represented by a formula (3): and Y1 includes a bivalent aromatic group including an aromatic ether structure, and a repeat unit represented by a general formula (2): where X2 includes a tetravalent alicyclic group and Y2 includes a bivalent alicyclic group including an alicyclic structure.

Abstract: The present invention provides a useful and novel alicyclic polyesterimide. An alicyclic polyesterimide produced by imidation of an alicyclic polyesterimide precursor is found to be a useful material in industrial fields, the alicyclic polyesterimide precursor being obtained by reacting an alicyclic tetracarboxylic anhydride having an ester group or a class of tetracarboxylic acid thereof as a starting material with an amine.

Abstract: The present invention provides a non-halogen polyamide-imide resin soluble in an amide solvent at a concentration of 10%, the resulting varnish, when stored at 5° C. for 1 month, exhibiting a solution viscosity change ((solution viscosity after 1 month?initial solution viscosity)/initial solution viscosity), expressed as an absolute value, of not greater than 3.0, and the resin having a moisture absorption (25° C., 90% RH, 24 hours) of not greater than 2.0%; a flexible metal-clad laminates using such a resin; and a flexible printed wiring board prepared from such a flexible metal-clad laminate by circuit formation. The flexible metal-clad laminate of the invention does not curl under any conditions, including humid conditions, and exhibits excellent dimensional stability since the heat resistant resin used as an insulation material has low moisture absorption and low thermal expansion coefficient and there is less internal stress in the flexible metal-clad laminate.