Abstract: Disclosed herein is a curing catalyst comprising at least one compound which is a substituted or unsubstituted aromatic or heteroaromatic compound and having any one of groups (I) --O--R.sub.1, (II) --O--CY--R.sub.1, or (III) --O--CY--X--R.sub.1, the groups being directly bonded to the armoatic or heteroaromatic ring, in a number of 1 to 10 wherein R.sub.1 may be the same or different and is a substituted or unsubstituted hydrocarbon group having 1 to 20 carbon atoms, X is O or NH and Y is O or S. Furthermore, an epoxy resin composition comprising the curing catalyst is disclosed.

Abstract: A coating powder based on an epoxy resin is applied to a substrate and fused and cured thereon. Curing is effected by exposing the coating powder at the point of application to a fluid curative or cure catalyst, e.g., by exposing the fusing coating powder to an ammonia-containing atmosphere.

Abstract: Cold curing epoxy resin compositions contain an epoxy functional component having an average epoxide functionality greater than 1; a hydroxy functional component; a pigment, a filler or a mixture thereof; and an SbF.sub.5 -alcohol complex curing agent in an amount effective to cure the epoxide composition. The cure rate of the compositions can be controlled by manipulating the pH and concentration of the filler and/or the pigment, making the use of amine rate controlling agents unnecessary. The compositions may be used, for example, as pavement marking compositions.

Abstract: A class of compounds which inhibits the reaction of a polyepoxide with a curing agent at low temperatures including an epoxy resin composition containinga) a polyepoxide;b) an amine or amide curing agent for the polyepoxide;c) at least about 15 meq (per equivalent of polyepoxide) of a catalyst for the reaction of the polyepoxide with the curing agent; andd) a cure inhibitor selected such that:(1) at about 171.degree. C. the composition has a gel time that is at least about 50 percent longer than a similar composition without the inhibitor, and(2) at about 175.degree. C. and higher the composition cures in no more than about 50 minutessuch that the composition cures rapidly with high cross-link density because it has a high catalyst loading, while the inhibitor lengthens the gel time to permit laminating and other processing.

Abstract: Described is a method of reducing resin bleed of a cyanate ester-containing die attach adhesive produced by curing a liquid resin system that contains cyanate ester monomer or mixtures that include cyanate ester monomer by adding an additive comprising at least one alkylene aromatic compound and curing the liquid resin system with the alkylene aromatic compound . Also disclosed is a die attach adhesive that comprises a resin system with an alkylene aromatic compound.

Abstract: A room-temperature curable composition useful for encapsulating transmission signal devices, comprising:(1) a hydroxy-functional compound having a molecular weight of greater than 500 and a hydroxy functionality of 2 or more;(2) an epoxy-functional compound having an epoxy functionality of 2 or more; and(3) a curative catalyst, in an amount effective to crosslink the epoxy and hydroxy components of the respective epoxy-functional and hydroxy-functional compounds. The composition is useful for encapsulating segments of signal transmission devices such as splices, pressure blocks and end blocks.

Abstract: The present invention provides a curable epoxy resin composition, which includes an epoxy resin; from 10 to 60 percent by weight of the epoxy resin of an amine curing agent; from 0.1 to 5 percent by weight of the epoxy resin of an imidazole accelerator; and from 0.01 to 5 percent by mole of the epoxy resin of chromium acetylacetonate (Cr(acac).sub.3). The resultant cured epoxy resin prepared from the epoxy resin composition of the present invention demonstrates improved fracture toughness. Also, the interlaminar fracture energy of the resultant graphite/epoxy laminate prepared from the cured epoxy resin of the present invention is greater than that of the conventional graphite/epoxy laminate.

Abstract: A curable, structural epoxy adhesive composition comprising two parts is provided. The first part comprises an amine curing agent and a catalyst; the second part comprises an epoxy resin having an average epoxide functionality of greater than one.

Abstract: The invention relates to a substantially solventless curable resin composition, in particular for the fabrication of prepregs, which contains more than 45% by weight of substances which are solid at ambient temperature at least or at lower temperature, and which, in addition to comprising customary modifiers, comprises solid epoxy resins or a mixture of liquid and solid epoxy resins, at least one initiator which is sensitive to UV radiation for the polymerisation of the epoxy resins and has the formula I ##STR1## wherein a and b are each independently of the other 1 or 2, R.sup.1 ist a .pi.-arene, R.sup.2 is a .pi.-arene, an indenyl anion or a cyclopentadienyl anion, [X].sup..crclbar. is an anion [LQ.sub.m ].sup..crclbar.

Abstract: A method of encapsulating a semiconductor comprising encapsulating a semiconductor in a curable epoxy resin composition comprising a liquid epoxy resin, an inorganic filler, an onium salt compound and an internal releasing agent, and substantially not containing a hardener, and then molding the above composition.

Abstract: Curable mixtures comprising(a) an epoxy compound having on average more than one epoxy group per molecule,(b) a metal complex salt of formula IM(L).sub.a X'.sub.b X".sub.c .cndot.dY (I),whereinM is a cation of a transition metal,L is a Lewis base,a is a number from 2 to 6,X' is an anion of an acid radical,X" is an cation of an acid radical differing from X'b is 0 or a number which, together with the number c, which is greater than 0, corresponds to the valency of the cation of the transition metal,Y is a solvent molecule, andd is 0 or a number from 0 to 5, and,as optional component(c) a hardener for epoxy resins,are distinguished by good solubility of the metal salt in the epoxy resin and achieve uniform crosslinking during the curing of the epoxy resin.

Abstract: The invention relates to mixtures containing:a) a cationically polymerizable compound andb) a compound of the formula I[R.sup.1 (Fe.sup.II R.sup.2).sub.a ].sub.q.sup..sym.an anX.sup..crclbar.q (I)in which a is 1 or 2, n is 1 or 2, R.sup.1 is a substituted or unsubstituted .pi.-arene, R.sup.2 is a substituted or unsubstituted .pi.-arene or cyclopentadienyl anion or indenyl anion, q is an integer from 1 to 3 and X is FSO.sub.3.sup.- or a q-valent anion of an organic sulfonic acid or of a carboxylic acid; R.sup.1 can also be a polymeric, aromatic ligand. The invention also relates to the novel compounds of the formula I. The curable mixtures can be processed in particular for the production of coatings having a good resistance to heat.

Abstract: Neutral metal complex salts with additional ligands acting as bases and a process for their preparation and their use as latent polymerization catalysts for the production of pre-cured products which can be further cured without another curing catalyst.

Abstract: An epoxy-resin composition containing, as essential components, (1) an epoxy resin having two or more epoxy groups in one molecule, (2) a solid-dispersing, amine adduct-type latent hardener, and (3) a titanium and/or zirconium alkoxide(s).

Abstract: A thermally-curable aromatic amine-epoxy composition comprises(a) at least one polyepoxy compound;(b) a curing amount of at least one aromatic polyamine compound; and(c) a catalytically effective amount of at least one cure accelerator compound which is a .pi.-electron acceptor, and which lowers the cure exotherm peak temperature (as measured by differential scanning calorimetry (DSC) at 10.degree. C. per minute) of the composition by at least about 8 percent relative to the corresponding composition without the cure accelerator. Such accelerator compounds moderate and/or accelerate the thermal curing of aromatic amine-epoxy resins, enabling cure to occur at lower temperatures and/or in shorter time periods than those required for the unaccelerated composition.

Abstract: Polyglycidyl epoxy resins are modified to have a blocked isocyanate moiety bound to the resin backbone through an oxazolidone ring by reacting the epoxy resin with an asymmetrically blocked diisocyanate. Further reaction with a cationic active hydrogen compound gives a modified epoxy resin having a cationic group in addition to the blocked isocyanate moieties. The modified epoxy resins are incorporated into cathodic electrodeposition paint as a crosslinker or cationic binder resin or pigment dispersing agent.

Abstract: A polymerizable mixture comprising 100 parts by weight of at least one epoxy compound and 0.01 to 50 parts by weight of a metal complex compound of the formulaML.sub.x B.sub.y or M[SR].sub.x B.sub.z,wherein M is a metal ion of a metal of main groups II and III and sub-groups thereof of the Periodic Table, L is a chelate forming ligand selected from the group consisting of dioximes, .alpha.- and .beta.-hydroxycarbonyl compounds or enolizable 1,3-diketones, SR is an acid ion of an inorganic acid, B is a Lewis base, x is an integer from 1 to 8, y is an integer from 1 to 5 and z is an integer from 7 or 8 with the proviso that B is not a polyvalent phenolic compound and a process for the polymerization thereof.

Abstract: Epoxy resin compositions comprising an epoxy resin which is liquid at room temperature and has on average more than one epoxy group per molecule and a quaternary perhydroazepinium salt or a quaternary octahydroazocinium salt as advancement catalyst, when advanced with compounds having two phenolic hydroxyl groups, give excellent products having low viscosity and good viscosity stability, which products can be used, for example, for surface protection, preferably as binder for coatings and paints.

Abstract: Solutions of accelerator systems comprising a binary system comprisinga) 10 to 90% by weight of a salt of formula I[Me].sub.m.sup.x.sym. [R].sub.n.sup.y.crclbar. (I),wherein x and y are the respective number of charges and m and n are each a number 1, 2, 3 or 4, Me is a metal atom and R is the radical of an alcohol, phenol or thiophenol or of a carboxylic acid or thiocarboxylic acid, or10 to 90% by weight of a salt of formula II[Me.sub.1 ].sub.m.sup.x.sym. [A].sub.n.sup.y.crclbar. (II),with an organic complex former containing one or more hetero atoms having free electron pairs,wherein Me.sub.1 is a metal atom or a group of the formula N(R.sub.1).sub.4, S(R.sub.1).sub.3 or P(R.sub.1).sub.4 wherein each R.sub.1 independently of the others is hydrogen, an unsubstituted or substituted C.sub.1 -C.sub.6 alkyl or aryl radical, A is any anion and x, y, m and n are as defined above, andb) 90 to 10% by weight of an organic solvent containing at least one --OH, --OR.sub.1, --COOH, --COOR.sub.1, --COR.sub.1 or --CON(R.

Abstract: An epoxy resin system comprising a) at least one nitrogen containing epoxy compound having at least two epoxy groups, b) at least one phosphorus compound with at least one epoxy group, c) at least one metallic complex compound as curing agent and d) optionally filler and additive substances free of halogenated compounds and having a low degree of inflammability.

Abstract: A catalyst: mixture for ring-opening polymerization of heterocyclic monomers and polymers includes a catalyst composed of a cobalt carbonyl complex; and a cocatalyst composed of at least one Si-H-containing compound. A curable composition, which may be a two-part kit, is also disclosed and includes the catalyst; the cocatalyst; and at least one polymerizable compound which is a monomer or polymer containing a heterocyclic ring. A method of producing a polymeric product by ring-opening polymerization of heterocyclic monomers and polymers is also disclosed which includes the steps of preparing a mixture including a catalyst composed of a cobalt carbonyl complex, a cocatalyst composed of at least one Si-H-containing compound, and at least one polymerizable compound which is a monomer or polymer containing a heterocyclic ring; and reacting the mixture, preferably at about room temperature, to promote ring-opening polymerization of the at least one polymerizable compound to produce the polymeric product.

Abstract: Oil-soluble, phenolic resin-modified natural resinic acid esters, which are able to form self-gelling mineral oil solutions and in the form of gel varnishes can advantageously be used as binder resins in printing inks for offset printing and letterpress printing, and also processes for their preparation from natural resins, phenols, aldehydes, condensation catalyst, esterifying agents and modifiers by reaction of the components at temperatures in the range from 80.degree. to 300.degree. C., individual components preferably being initially introduced and the other components being metered in, the combined use of a magnesium compound as condensation catalyst and the continuous removal of the water of reaction during the condensation reaction by azeotropic distillation with co-use of an inert organic solvent as distillative entraining agent being necessary and decisive for the self-gelling property of the process product.

Abstract: A polymerizable mixture comprising 100 parts by weight of at least one epoxy compound and 0.01 to 50 parts by weight of a metal complex compound of the formulaML.sub.x B.sub.y or M[SR].sub.x B.sub.z,wherein M is a metal ion of a metal of main groups II and III and sub-groups thereof of the Periodic Table, L is a chelate forming ligand selected from the group consisting of dioximes, .alpha.- and .beta.-hydroxycarbonyl compounds or enolizable 1,3-diketones, SR is an acid ion of an inorganic acid, B is a Lewis base, x is an integer from 1 to 8, y is an integer from 1 to 5 and z is an integer from 7 or 8 with the proviso that B is not a polyvalent phenolic compound and a process for the polymerization thereof.

Abstract: An epoxy resin composition for insulating a coil which comprises at least one polyfunctional epoxy resin, at least one latent curing catalyst, at least one filler and at least one surfactant, wherein the ceiling is set to the acid anhydride content in the composition at 10% by weight based on the weight of the epoxy resin; and a coil molded out of said resin composition.

Abstract: Ultra high molecular weight epoxy resins are produced in a short time by polymerizing a difunctional epoxy resin having two epoxy group per molecule and a dihydric phenol by heating the difunctional epoxy resin and the dihydric phenol which are present in quantities which provide a ratio of phenolic hydroxyl groups to epoxy groups of from 1:0.9 to 1:1.1, in an amide solvent, in the presence of a polymerization catalyst, and the ultra high molecular weight epoxy resins are linearly polymerized so highly as to have the capability of being formed into films having high strength.

Abstract: Described is a rapidly curing adhesive formulation and a method of reducing the curing time of an adhesive formulation containing cyanate ester.

Abstract: Compounds of the formula I are described[R.sup.1 (Fe.sup.II R.sup.2 .sub.a ].sub.q.sup.+an anX.sup.-q (I)in which a is 1 or 2, n is 1 or 2, R.sup.1 is a substituted or unsubstituted .pi.-arene, R.sup.2 is a substituted or unsubstituted .pi.-arene or cyclopentadienyl anion or indenyl anion, q is an integer from 1 to 3, and X is FSO.sup.-.sub.3 or a q-valent anion of an organic sulfonic acid or of a carbocyclic acid; R.sup.1 can also be a polymeric, aromatic ligand. The invetion particularly relates to the compounds of the formula I wherein a is 1 and q is 1 and X.sup.

Abstract: A process for the production of a material having an increased molecular weight relative to the diepoxide starting material the material being either a hydroxy-terminated or an epoxy-terminated material comprisinga) reacting a diepoxide with a dihydroxy compound, in the presence, as catalyst, of a triflate salt of a metal of Group IIA, IIB, IIIA, IIIB, or VIIIA of the Periodic Table of Elements (according to the IUPAC 1970 convention);b) de-activating the triflate salt catalyst; andc) optionally advancing the material produced in step b), with an aromatic diol or phenol.

Abstract: The reaction between epoxy compounds and active hydrogen-containing compounds or anhydrides is catalyzed with a phosphine or phosphonium compound containing at least three C.sub.1 to C.sub.4 alkyl phenyl groups attached to the phosphorous atom per molecule.

Abstract: The present invention provides a cationically polymerizable organic material composition comprising a composition which contains a cationic polymerization catalyst(s) and a cationically polymerizable organic material(s) as essencial ingredients, and one or more onium salts having a nucleophilic pair anion represented by halogenide, alkyl sulfate or p-toluenesulfonate ions, or one or more iron aromatic compound salts represented by the following formula (I): ##STR1## The composition of the present invention is a cationically polymerizable organic material composition capable of being cured by irradiation of a radiation or by heat, and it also has excellent storage stability at room temperature in the dark and a long pot life.

Abstract: An improved flame retardant epoxy molding compound comprises an epoxy, a hardener preferably of the novolac or anhydride type, a catalyst, a mold release agent, preferably a filler, preferably a colorant, preferably a coupling agent, an organic compound containing a higher percent of halogen (which can be part of the resin or the hardener), preferably the polyglycidyl ether of the bromophenol-formaldehyde novolac type, preferably containing at least about 1.0% of bromine by weight of the molding compound, a lower percent of sodium, preferably in the range of 0.03-0.06% by weight of the antimony pentoxide, a lower percent of antimony pentoxide, preferably in the range of .ltoreq. about 0.8% by weight of the molding compound, and an amount of bismuth trioxide .ltoreq. about 4.0% by weight of the molding compound.

Abstract: A blocked isocyanate group-containing electrocoating composition comprising at least one dialkyltin aromatic carboxylate and at least one bismuth or zirconium compound as a combined curing catalyst. This electrocoating composition gives an electrocoating film superior in corrosion resistance and low-temperature curability and has good bath stability over an extended period.

Abstract: The reaction between epoxy compounds and active hydrogen-containing compounds or anhydrides is catalyzed with a phosphine or phosphonium compound containing at least three C.sub.1 to C.sub.4 alkyl phenyl groups attached to the phosphorous atom per molecule.

Abstract: The present document describes the use of an inhibitor for cationic polymerization as an additive to a thermocurable composition based on at least one cationically polymerizable organic material and an initiator for cationic polymerization in the form of an onium compound or a compound of the formula (I)[M.sup.+n (L).sub.x ].sup.n+ nX.sup.- (I),in which n is 2 or 3, M is a metal cation selected from the group comprising Zn.sup.2+, Mg.sup.2+, Fe.sup.2+, Co.sup.2+, Ni.sup.2+, Cr.sup.2+, Ru.sup.2+, Mn.sup.2+, Sn.sup.2+, VO.sup.2+, Fe.sup.3+, Al.sup.3+ and Co.sup.3+, X.sup.- is an anion selected from the group comprising PF.sub.6.sup.-, AsF.sub.6.sup.-, SbF.sub.6.sup.-, BiF.sub.6.sup.-, derivatives of these anions in which at least one fluorine atom has been replaced by a hydroxyl group, and CF.sub.3 SO.sub.3.sup.-, or in which up to 50% of the anions X.sup.-, based on the total amount of anions, may be any desired anions, L is water or an organic .sigma.

Abstract: As a curing catalyst of epoxy resins, superacid salts of an N,N'-di- or N,N',N'-trisubstitued urea, the urea component of which is produced by reacting an organic isocyanate and a primary or secondary amine, at least one of which is monofunctional, are soluble in conventional organic solvents compatible with epoxy resins and catalyze the cationic polymerization reaction of epoxy resins at room temperature.

Abstract: Electrical insulation materials containing a synergistic mixture of either a metal acetylacetonate and a dicyclopentadienyl metal compound, a chromium salt and a dicyclopentadienyl compound, or a chromium salt and a metal acetylacetonate have unexpectedly high levels of corona resistance. The insulation materials preferably are prepared by dissolving the synergistic mixture in an organic resin such as an epoxy resin and then curing the resin.

Abstract: Aqueous-based crosslinkable coating composition comprising an aqueous dispersion of at least one polymer having epoxy-reactive functional groups, at least one polyepoxide compound, and at least one metal chelate complex epoxy-cure catalyst.

Abstract: A two-part, thermally curable epoxy composition comprising an epoxy resin; a curing agent prepared from a substituted pentafluoroantimonic acid and a substituted benzene having an amino substituent and an electron-withdrawing substituent on the benzene ring; a polyol; and a toughening agent. The compositions exhibit desirable green strength and pot life.

Abstract: As a curing catalyst of epoxy resins, superacid salts of an N,N'-di- or N,N',N'-trisubstituted urea, the urea component of which is produced by reacting an organic isocyanate and a primary or secondary amine, at least one of which is monofunctional, are soluble in conventional organic solvents, compatible with epoxy resins and catalyze the cationic polymerization reaction of epoxy resins at room temperature.

Abstract: A process for the preparation of epoxy resins having a specific reproducible content of .alpha.-glycol groups, which process comprises adding at least 0.0085 mol of glycidol or glycidol precursor compound per hydroxy-equivalent of a phenolic compound A which contains 2, 3 or 4 phenolic hydroxyl groups during the reaction of said phenolic compound A with an epihalohydrin which is unsubstituted or substituted in 2- or 3-position by C.sub.1 -C.sub.4 alkyl. The products may be used for surface protection.

Abstract: The present invention relates to an improved heat curable epoxy resin adhesive in which a metal oxide, for example zinc oxide, and a polyhydroxyaryl compound, for example gallic acid, are used in combination with an epoxy resin, for example a heat curable liquid epoxy resin adhesive, to give an adhesive composition having significantly improved binding strength and resistance to weathering. The epoxy resin adhesive composition of the invention has been found to be particularly advantageous in the bonding of metal surfaces providing higher bond strength over a prolonged period and improved resistance to the deterioration of bond strength in the presence of water or high humidity.

Abstract: The invention relates to organotin compositions, to a process for their production, and to their use in catalyzing the crosslinking reactions of cationic paint binders crosslinkable by transesterification and/or transurethanization and/or by the reaction of terminal double bonds. The organotin compositions are prepared by dispersion of dibutyltin oxide in a dispersion medium comprising at least one substituted oxazolidine compound and, if appropriate, specially chosen water-tolerant organic solvents. Cationic paints, especially cathodically depositable electrocoating paints, catalyzed by the organotin compositions have very good sedimentation stability in dilute paint batches and show no surface defects in the stoved paint films.

Abstract: Latent, heat-curable epoxy resin compositions containing metal carboxylate curing systems provide exceptional latency, particularly at elevated temperature, as well as facile curing, high T.sub.g and adhesive strength, and other attractive properties. The metal carboxylates comprise alkali metals and alkaline earth metals, aromatic and aliphatic metal carboxylates. The preferred curing systems comprise synergistic combinations of the metal carboxylates with cure modifiers.

Abstract: The reaction between epoxy compounds and active hydrogen-containing compounds or anhydrides is catalyzed with a phosphine or phosphonium compound containing at least three C.sub.1 to C.sub.4 alkyl phenyl groups attached to the phosphorus atom per molecule.

Abstract: Initiator compositions for materials which can be polymerized cationically are described, these containingi) an anhydride of a polycarboxylic acid, a polyisocyanate, a cyclic carbonate, a lactone or a mixture of such compounds, and dissolved thereinii) at least one compound of the formula I[M.sup.+n (L).sub.x ].sup.n+ nX.sup.- (I)in which n is 2 or 3, M is a metal cation selected from the group consisting of Zn.sup.2+, Mg.sup.2+, Fe.sup.2+, Co.sup.2+, Ni.sup.2+, Cr.sup.2+, Ru.sup.2+, Mn.sup.2+, Sn.sup.2+, VO.sup.2+, Fe.sup.3+, Al.sup.3+ and Co.sup.3+, X.sup.- is an anion which is selected from the group consisting of AsF.sub.6.sup.-, SbF.sub.6.sup.-, BiF.sub.6.sup.- and derivatives derived from these anions in which a fluorine atom is replaced by hydroxyl groups, or in which up to 50% of the anions X.sup.-, based on the total amount of anions, can also be any desired anions, L is water or an organic .sigma.

Abstract: The products resulting from contacting an organic phosphine or arsine with an inorganic acid having a weak nucleophilic anion provide for relatively stable compositions when admixed with a compound containing an average of more than one vicinal epoxide group per molecule and which optionally contains a compound containing an average of more than one phenolic hydroxyl group per molecule.

Abstract: Thermosettable polyol resins for coating compositions are prepared by reacting a polyglycidyl ester of an aliphatic polycarboxylic acid and a di- to hexa-hydric aliphatic alcohol with an adduct of a di- to hexa-hydric aliphatic alcohol and a glycidyl ester of a branched aliphatic monocarboxylic acid with 5 to 15 C-atoms, said adduct having an epoxy group content of less than 0.2 meq/g.

Abstract: The cure of an epoxy resin containing a hardener such as a polycarboxylic acid anhydride can be catalyzed with a catalyst comprising a rare earth carboxylate dissolved in a solvent which is at least dispersible in and reactive with the epoxy resin.

Abstract: A process for the production of cationic paint binders which are particularly suitable for formulating pigment pastes for cathodically depositable electrocoating paints is described. The paint binders produced according to the invention are modified epoxy resin-amine adducts which contain organically-chemically bonded titanium. The cured paint films provide excellent corrosion protection on non-pretreated sheet steel even in the absence of lead-containing compounds and/or lead pigments.

Abstract: Initiator compositions for materials which can be polymerized cationically are described, these containingi) an anhydride of a polycarboxylic acid, a polyisocyanate, a cyclic carbonate, a lactone or a mixture of such compounds, and dissolved thereinii) at least one compoumd of the formula I[M.sup.+n (L).sub.x ].sup.n+ nX.sup.- (I)in which n is 2 or 3, M is a metal cation selected from the group consisting of Zn.sup.2+, Mg.sup.2+, Fe.sup.2+, Co.sup.2+, Ni.sup.2+, Cr.sup.2+, Ru.sup.2+, Mn.sup.2+, Sn.sup.2+, VO.sup.2+, Fe.sup.3+, Al.sup.3+ and Co.sup.3+, X.sup.- is an anion which is selected from the group consisting of AsF.sub.6.sup.-, SbF.sub.6.sup.-, BiF.sub.6.sup.- and derivatives derived from these anions in which a fluorine atom is replaced by hydroxyl groups, or in which up to 50% of the anions X.sup.-, based on the total amount of anions, can also be any desired anions, L is water or an organic .sigma.