Abstract: A curable resin composition containing: a curable resin; and a curing agent containing an imide oligomer, the imide oligomer containing an aliphatic diamine residue- and/or aliphatic triamine residue-containing imide oligomer that has, in a main chain, an imide skeleton and a substituted or unsubstituted aliphatic diamine residue having a carbon number of 4 or greater and/or a substituted or unsubstituted aliphatic triamine residue having a carbon number of 4 or greater, has a crosslinkable functional group at an end, and has a molecular weight of 5,000 or less. The curable resin composition is excellent in flexibility and processability before curing and excellent in adhesiveness, heat resistance, and dielectric characteristics after curing. An adhesive, an adhesive film, a circuit board, an interlayer insulating material, and a printed wiring board each produced using the curable resin composition are also provided.

Abstract: Disclosed is a novel diamine compound in which an imide ring is directly bonded to a (hetero)aryl ring in a molecule, and a polyimide film prepared by polymerizing the novel diamine compound exhibits improved thermal properties and storage stability.

Abstract: A glycidyl amine epoxy resin(s) and a process for production of glycidyl amine epoxy resin(s) are disclosed. The glycidyl amine epoxy resin(s) is/are free from Bisphenol A (BPA) and Bisphenol F (BPF) and are based on AMES negative amine precursors.

Abstract: A curing composition is useful for a multi-component epoxy resin compound and includes at least one first polyamine, at least one second polyamine, and at least one polyphenol from the group of bisphenols and novolac resins as an accelerator. Upon contact with atmospheric oxygen, the curing composition discolors within a few days and therefore leakages can be visually identified.

Abstract: The present invention relates to a low-alkylphenol composition comprising a) at least one epoxy resin, b) at least one amine having at least two secondary amino groups that are both part of an organic ring system, and c) at least one salt of a strong Brønsted acid with a counterion selected from metal ions, metal-containing ions, phosphonium ions and ammonium ions, to processes for production thereof and to the use thereof.

Abstract: A crosslinking composition includes a compound having at least two functional groups that are each independently represented by Chemical Structure (I): X is an oxygen, sulfur, or nitrogen; R1 is an alkyl group, an aryl group, or an alkylaryl group; R2, R3, and R4 are each independently an alkyl group, an aryl group, an alkylaryl group, or a hydrogen; R5 is an alkyl group, an aryl group, an alkylaryl group, or a hydrogen; z is 0 when X is oxygen or sulfur and z is 1 when X is nitrogen; and when a double bond is formed between a carbon atom bonded to R3 and an adjacent nitrogen, m is 0, and when a single bond is formed between the carbon atom bonded to R3 and the adjacent nitrogen, m is 1.

Abstract: A thermoplastic polymer-based composite material and a preparation method thereof are provided. The thermoplastic polymer-based composite material is obtained by impregnating a reinforcing material with a mixture or an oligomer of an epoxy resin, a bisphenol A/F, and a catalyst and then performing an in-situ polymerization. The thermoplastic polymer-based composite material is less expensive to produce, has an optimal impregnation effect, excellent secondary processing performance, high heat resistance, desirable mechanical properties and excellent overall performance.

Abstract: The present invention provides an epoxy resin composition that serves to produce a cured epoxy resin that simultaneously realizes a high heat resistance, a high elastic modulus, and a low color and to produce a molded article having a good appearance without suffering the formation of white spots on the surface thereof when used as matrix resin in a fiber reinforced composite material. The epoxy resin composition includes an epoxy resin as component [A] and an imidazole compound as component [B] and meets certain conditions (a) to (d).

Abstract: Products of glycidyl ether of a mono or polyhydric phenol as well as methods to manufacture the same. In some instances, the product of glycidyl ether of a mono or polyhydric phenol has an epoxy equivalent weight (“EEW”) and a hydroxyl value (“HV”), wherein the epoxy equivalent weight multiplied by the hydroxyl value (EEWxHV) is a value from 1 to 10. A process for producing the product of glycidyl ether of a mono or polyhydric phenol typically includes reacting an epihalohydrin with a mono or polyhydric phenol in the presence of a catalyst to produce a halohydrin ether; and dehalogenating the halohydrin ether to form the product of glycidyl ether of a mono or polyhydric phenol.

Abstract: Provided are an amine compound represented by the following formula (1), which has a low active hydrogen equivalent weight and thus is capable of providing a cured product having good properties because the amine compound has sufficient curability even though the amount of amine compound blended in an epoxy resin composition is small when the amine compound is used as an epoxy resin curing agent, and an amine composition and an epoxy resin curing agent, which contain the compound: wherein A is a 1,2-phenylene group, a 1,3-phenylene group, or a 1,4-phenylene group.

Abstract: The present invention relates to an amidine of the formula (I) and its use as a catalyst for crosslinking a curable composition. The amidine of the formula (I) contains at least one aliphatic amidine group. It is substantially odorless and nonvolatile at room temperature and accelerates the crosslinking of curable compositions very efficiently, without impairing the storage stability of the compositions. It is particularly suitable for compositions based on polymers containing silane groups, with which it is compatible, as a result of which such compositions do not have a tendency to separation or migration or evaporation of the catalyst.

Abstract: Fiber reinforced epoxy resin composites are produced using a specific epoxy resin system. The epoxy resin system contains at least one polyglycidyl ether of a polyphenol. The system also contains a hardener that contains a mixture of aminocyclohexanealkylamine and polyalkylene polyamine hardeners. The ratio of epoxy resin groups to amine hydrogen groups is from 1.05 to 1.50. The epoxy resin system contains a tertiary amine catalyst such as a tertiaryaminophenol, a benzyl tertiary amine or an imidazole compound.

Abstract: The present invention describes the use in epoxy resin compositions of semicarbazones of the general formula (I) having the meanings stated for the residues R1, R2, R3 and R4. These semicarbazones exhibit elevated latency in epoxy resin compositions and are thus outstandingly suitable as latent curing accelerators for single-component epoxy resin compositions.

Abstract: The present invention describes guanidine derivatives of the general formula (I) having the stated meanings for the residues R1, R2 and R3 as accelerators for cold-curing epoxy resin compositions. The curing of cold-curing epoxy resin systems may advantageously be accelerated with the assistance of these compounds.

Abstract: Provided is a method for producing a good epoxy resin composition for obtaining fiber-reinforced plastics. A production method for obtaining a fiber-reinforced composite material by impregnating a fiber assembly with an epoxy resin composition and then curing the epoxy resin composition, wherein the epoxy resin composition contains a component [A], a component [B] and a component [C] respectively satisfying the conditions described below. When the blending amount of the component [B] is set to b parts by mass and the blending amount of the component [C] is set to c parts by mass relative to 100 parts by mass of the component [A] contained in the epoxy resin composition, formula (2) is satisfied within the range of formula (1), formula (4) is satisfied within the range of formula (3), and formula (6) is satisfied within the range of formula (5).

Abstract: Compositions containing a divinylarene dioxide and a hydroxy-substituted dioxide compound and having relatively low viscosity and reduced volatility are used as underfills in the manufacture of electronic assemblies.

Abstract: Methods and formulations for distortional thermosets are disclosed that display enhanced composite mechanical performances and robust sorption resistance. The composition includes an epoxy resin of formula (I): and a diamine curing agent. The resultant distortional thermoset compositions possess superior out-life requirements and advantageous reaction kinetics for preparing prepreg compositions and materials.

Abstract: A process for curing epoxy resins which comprises curing epoxy resin compositions comprising a) epoxy resins and b) a compound of the general formula I in which R1 and R2 independently of one another are hydrogen, C1-C6-alkyl, C1-C4-alkoxy-C1-C4-alkyl, C5-C6-cycloalkyl, phenyl, phenyl-C1-C4-alkyl, C2-C6-alkenyl or C2-C6-alkynyl, or R1 and R2 together are a C3-C11-alkylene group; R3 and R4 independently of one another are hydrogen, C1-C6-alkyl, C1-C4-alkoxy-C1-C4-alkyl, C5-C6-cycloalkyl, phenyl, phenyl-C1-C4-alkyl, C2-C6-alkenyl or C2-C6-alkynyl, or R3 and R4 together are a C4-C6-alkylene group; by adding amino hardeners, and the curing takes place in the presence of a compound of the following formula II in which at least one of the radicals R11, R12 and R13 is a hydrocarbon group having 1 to 10 C atoms, which is substituted with a hydroxyl group and optionally remaining radicals R11 to R13 are an unsubstituted hydrocarbon group having 1 to 10 C atoms.

Abstract: Provided are a thermoplastic epoxy resin composition comprising (A) an epoxy compound having two epoxy groups in one molecule, (B) a compound having two phenolic hydroxyl groups in one molecule, and at least one compound selected from the group consisting of dihexylamine, diheptylamine, di(2-ethylhexyl)amine, N-ethylhexylamine, trihexylamine, dioctylamine, tri n-octylamine, N,N-dimethyl-n-octylamine, and N,N-dimethyldecylamine as (C) a curing accelerator, and a thermoplastic cured epoxy resin with transparency to visible light produced by curing the thermoplastic epoxy resin composition.

Abstract: A process for curing an epoxy resin composition containing an epoxy resin and a compound of the general formula I: where R1 and R2 independently are hydrogen, C1-C6-alkyl, C1-C4-alkoxy-C1-C4-alkyl, C5-C6-cycloalkyl, phenyl, phenyl-C1-C4-alkyl, C2-C6-alkenyl or C2-C6-alkynyl, or R1 and R2 together are a C3-C11-alkylene group; and where R3 and R4 independently are hydrogen, C1-C6-alkyl, C1-C4-alkoxy-C1-C4-alkyl, C5-C6-cycloalkyl, phenyl, phenyl-C1-C4-alkyl, C2-C6-alkenyl or C2-C6-alkynyl, or R3 and R4 together are a C4-C6-alkylene group. The process includes adding amino hardeners, where 0.1% to 50% by weight of the amino hardeners are aliphatic, cycloaliphatic or aromatic amine compounds having 1 to 4 primary amino groups and optionally further functional groups, selected from secondary amino groups, tertiary amino groups, and hydroxyl groups.

Abstract: The present invention relates to an etheramine mixture containing a monoether diamine and its method of production by alkyloxating an initiator with an alkylene oxide to produce a precursor polyol and reductively aminating the precursor polyol to form the etheramine mixture. The etheramine mixture may be used in variety of applications including as a curing agent for an epoxy resin or as a reactant in the production of polyurea materials.

Abstract: The present invention provides a resin composition for an adhesive sheet, comprising an acrylic copolymer containing (A) an acrylate ester, methacrylate ester, or a mixture thereof, (B) acrylonitrile, methacrylonitrile, or a mixture thereof, and (C) an unsaturated carboxylic acid; an epoxy resin; and a curing agent, wherein the curing agent comprises at least one selection from Lewis acid-amine complexes.

Abstract: A phosphorus-containing epoxy resin and a method for synthesizing the same are disclosed. The method includes the step of catalytically reacting compound (i) with compound (ii) to synthesize the phosphorus-containing epoxy resin having the structure of compound (I). R is methyl or phenyl, and n is the integer from 1 to 9.

Abstract: The present invention describes the use in epoxy resin compositions of semicarbazones of the general formula (I) having the meanings stated for the residues R1, R2, R3 and R4. These semicarbazones exhibit elevated latency in epoxy resin compositions and are thus outstandingly suitable as latent curing accelerators for single-component epoxy resin compositions.

Abstract: A functionalized polymer is disclosed that comprises the reaction product of a polymer having one or more pendant reactive functional groups and a color changing indictor having a co-reactive functional group. The co-reactive functional group of the color changing is able to react with the reactive functional group of the polymer to form a covalent bond. Therefore, the color changing indicator is pendant from the polymer. The color changing indicator maintains its ability to produce a visually discernable color change in the presence of an associated stimulus.

Abstract: The present invention relates to an etheramine mixture containing a monoether diamine and its method of production by alkyloxating an initiator with an alkylene oxide to produce a precursor polyol and reductively aminating the precursor polyol to form the etheramine mixture. The etheramine mixture may be used in variety of applications including as a curing agent for an epoxy resin or as a reactant in the production of polyurea materials.

Abstract: A carbon/epoxy resin composition and a method of producing a carbon-epoxy dielectric using the same. The carbon/epoxy resin composition includes about 45 volume percent (volume %) to about 50 volume % of an epoxy composition, the epoxy composition including a bisphenol-based epoxy compound and an alicyclic epoxy compound, based on a total volume of the carbon/epoxy resin composition, about 2.0 volume % to about 3.1 volume % of carbon black, based on a total volume of the carbon/epoxy resin composition, about 80 parts by volume to about 104 parts by volume of an acid anhydride-based curing agent, based on 100 parts by volume of the epoxy composition, and about 1 part by volume to about 3 parts by volume of a tertiary alkylamine-based curing catalyst, based on 100 parts by volume of the epoxy composition.

Abstract: A two-component epoxy resin composition, including: a resin component which includes at least one epoxy resin and at least one aldehyde, and a hardener component which includes at least one polyamine having at least one primary amino group.

Abstract: Compositions comprising at least one epoxy resin and/or reactive diluents, at least one hardener for the at least one epoxy resin, at least one curing indicator, wherein the colour of the composition changes depending on the curing degree, a process for determining sufficient cure of a composition comprising providing a composition comprising at least one epoxy resin and a hardener for the epoxy resin, adding a curing indicator, applying curing conditions to the coloured composition until the composition changes its colour and use of polymeric colourants as curing degree indicator, wherein the curing indicator is a polymeric colourant consisting of chromophores which are chemically bound to polymers having reactive groups.

Abstract: A hardener composition for epoxy resins, the hardener composition including a mixture of 1,3-bis(aminomethyl)cyclohexane and 1,4-bis(aminomethyl)cyclohexane. A prepolymer hardener composition for epoxy resins, the prepolymer hardener composition comprising the reaction product of an epoxy with a mixture of 1,3-bis(aminomethyl)cyclohexane; and 1,4-bis(aminomethyl)cyclohexane.

Abstract: The present invention discloses one liquid type cyanate ester-epoxy composite resin composition comprised of (A) cyanate ester resin, (B) epoxy resin and (C) latent curing agent. The present one liquid type cyanate ester-epoxy composite resin composition is characterized in that the above (C) latent curing agent is comprised of a modified amine (a), which has one or more amino group having active hydrogen within a molecule, obtained by a reaction of a polyamine compound (a-1) with an epoxy compound (a-2), and a phenol resin (b), and that the above polyamine compound (a-1) is a polyether polyamine compound and/or the above epoxy compound (a-2) is a polyether polyepoxy compound.

Abstract: Curable epoxy resin compositions, cured epoxy resin compositions, and processes of forming the same, including at least one epoxy resin, at least one sterically hindered amine curing agent and at least one non-sterically hindered amine curing agent which provides toughness properties to the curable composition and resultant cured product made from the curable composition.

Abstract: A process for the production of a thermoplastic cured epoxy resin which is transparent to visible light, characterized by curing (A) an epoxy compound having two epoxy groups in one molecule with (B) a compound having two phenolic hydroxyl groups in one molecule by means of (C) a cure accelerator consisting of at least one compound represented by general formula (1): Rn-NHm??(1) [wherein R is a monovalent C2-10 hydrocarbon group which may have a hydroxyl group at the ? position to the nitrogen atom (with the proviso that when R has three or more carbon atoms, R includes both straight-chain and branched-chain hydrocarbon groups); when R has no hydroxyl group, R has a number of carbon atoms of 3 to 10; n is an integer of 1 to 3, and m is an integer of 2 to 0, with the sum of n and m being 3; and when multiple Rs are present, the Rs may be the same or different].

Abstract: A phosphorus-containing epoxy resin and a method for synthesizing the same are disclosed. The method includes the step of catalytically reacting compound (i) with compound (ii) to synthesize the phosphorus-containing epoxy resin having the structure of compound (I). R is methyl or phenyl, and n is the integer from 1 to 9.

Abstract: This invention provides an epoxy resin composition for encapsulating a semiconductor exhibiting higher flame resistance, good flowability and adequately higher solder-reflow resistance to allow for the use of a lead-free solder without a flame retardant, as well as a highly reliable semiconductor device in which a semiconductor element is encapsulated with a cured product from the composition.

Abstract: A self-adhesive coating for electrical steel and its uses is described. The coating includes 81-99.9 weight parts of aqueous epoxy resin emulsion, 0.07-17 weight parts of curing agent, and optionally 0.3 weight parts of accelerant. The coating optionally contains additives selected from diluent, filler, toughener, colorant, fire retardant, antirusting agent, antisettling agent, thixotropic agent or antifoamer, thickener, pigment dispersant, preservative, and the like. The coating can be used as electrical steel coating. The coating is capable of making electrical steel with a self-adhesive coating by naked-flame heat, and also there are no poisonous organic solvents to volatilize during the entire process. The coating can avoid use of an apparatus for burning organic solvents, which reduced cost.

Abstract: Process for preparing polyether alcohols by polymerization by means of double metal cyanide catalysts (DMC catalysts), characterized in that, before or during the polymerization, one or more, optionally mixed additives consisting of compounds having one or more aromatic structures which may be monosubstituted or else polysubstituted and which have at least one hydroxyl group on the aromatic system are added to the reaction mixture.

Abstract: Curable compositions are provided which contain a curable component and particular m-hydroxybenzene derivatives, wherein such derivatives function as aging inhibitors. Such curable compositions are useful as coating agents and adhesives having improved aging resistance.

Abstract: Resistor compositions are disclosed, made from polymer thick film resistor formulations comprising a polyimide component, a sterically hindered hydrophobic epoxy component and a solvent component having a Hanson polar solubility parameter between 2.1 and 3.0 and having a normal boiling point between 210 and 260° C. The weight ratio of polyimide component (“A”) to epoxy component (“B”) is A:B, where A is between and including 1 to 15 and where B is 1.

Abstract: Low-cure powder coating compositions are disclosed. The compositions comprise a polyepoxide and a material having the structure wherein R1 is an organic radical having 6 to 25 carbon atoms; R2 is an organic radical having 1 to 20 carbon atoms; R3 and R4 are independently alkyl or phenyl groups having 1 to 8 carbon atoms; Z is oxygen or nitrogen, and when Z is oxygen R5 is absent and when Z is nitrogen R5 is hydrogen or is and n is 1 to 4. The material can optionally be reacted with an acidic hydrogen-containing compound. The compositions are curable without the use of crosslinking agents or accelerators. Methods for coating a substrate using these compositions, and substrates coated thereby, are also disclosed, as are additional catalysts useful for the same purpose.

Abstract: An epoxy resin composition for semiconductor encapsulation includes at least one epoxy resin, at least one curing agent, at least one filler, and at least one first curing accelerator, the first curing accelerator having a tetracyanoethylene, a 7,7,8,8-tetracyanoquinodimethane, a compound having the chemical structure of Formula 1, or a mixture thereof, wherein each of R1 through R7, independently, represents a hydrogen atom or a C1-C12 hydrocarbon group, provided that when R1 through R7 are C1-C12 hydrocarbon groups, R1 and R2, R2 and R3, R3 and R4, R4 and R5, R5 and R6, and R6 and R7 can be joined to each other to form a cyclic structure.

Abstract: This invention provides an epoxy resin composition for encapsulating a semiconductor exhibiting higher flame resistance, good flowability and adequately higher solder-reflow resistance to allow for the use of a lead-free solder without a flame retardant, as well as a highly reliable semiconductor device in which a semiconductor element is encapsulated with a cured product from the composition.

Abstract: An amine curing component which can be used with various types of prepolymers including a urethane prepolymer having a reactive functional group of highly reactivity is provided. Also provided is a curable resin composition containing such curing component. This curable resin composition exhibits good surface and depth curability in the curing, and adjustment of pot life is also easy. The curing component contains an amino group-containing compound (A), a ketone compound (B), a ketimine compound (C), and water (D), and the curable resin composition contains this curing component.

Abstract: An object of the present invention is to provide a material which resolves the drawbacks associated with polyimide polymers, and yet retains the advantages offered by conventional polyimide polymers. An amino group containing phenol derivative of the present invention is represented by a general formula (1) show below, and the present invention also provides a polyimide precursor produced using such an amino group containing phenol derivative. (wherein, R1, R2 and R3, which may be the same or different, each represent an alkyl group of 1 to 9 carbon atoms, an alkoxy group of 1 to 10 carbon atoms, a COOR group (in which R represents an alkyl group of 1 to 6 carbon atoms) or a hydrogen atom; R4 and R5, which may be the same or different, each represent an alkyl group of 1 to 9 carbon atoms or a hydrogen atom; X represents —O—, —S—, —SO2—, —C(CH3)2—, —CH2—, —C(CH3)(C2H5)—, or —C(CF3)2—; and n represents an integer of 1 or greater).

Abstract: A curable underfill encapsulant composition which is especially useful in the no-flow underfill encapsulation process. The composition contains an epoxy resin, a fluxing agent, a linear polyanhydride, a core shell polymer and a catalyst. In an alternative embodiment, the composition also contains a linear anhydride. Various additives, such as surfactants and coupling agents may also be added to the composition.

Abstract: An object of the present invention is to provide a material which resolves the drawbacks associated with polyimide polymers, and yet retains the advantages offered by conventional polyimide polymers. An amino group containing phenol derivative of the present invention is represented by a general formula (1) show below, and the present invention also provides a polyimide precursor produced using such an amino group containing phenol derivative. (wherein, R1, R2 and R3, which may be the same or different, each represent an alkyl group of 1 to 9 carbon atoms, an alkoxy group of 1 to 10 carbon atoms, a COOR group (in which R represents an alkyl group of 1 to 6 carbon atoms) or a hydrogen atom; R4 and R5, which may be the same or different, each represent an alkyl group of 1 to 9 carbon atoms or a hydrogen atom; X represents —O—, —S—, —SO2—, —C(CH3)2—, —CH2—, —C(CH3)(C2H5)—, or —C(CF3)2—; and n represents an integer of 1 or greater).

Abstract: Epoxy resin composition curing agents, which include a primary amino alcohol, are disclosed. Specifically, the invention relates to curing agents which include a primary amino alcohol physically blended therewith. Alternatively, the invention relates to curing agents which include a primary amino alcohol reacted into a resinous phenolic compound. Resin systems utilizing the curing agents of the invention exhibit enhanced hot wet adhesion to metal substrates and are particularly useful in the manufacture of powder coatings for pipe.

Abstract: The present invention relates to a novel epoxy resin curing system comprising a cationic latent catalytic curing agent containing a hexafluoroantimonate, characterized by exhibiting no shrinkage of volume or inducing an expansion of volume during the curing reaction of the epoxy resin. By the use of the epoxy resin curing system comprising a cationic latent catalytic curing agent containing a hexafluoroantimonate, it is possible to inhibit the shrinkage of volume or to induce the expansion of volume during the curing reaction of the epoxy resin. The development of such curing systems made it possible to improve the dimensional stability and to remove the residual stress, which has caused problems for decades in the production of various molded articles. Furthermore, the curing systems according to the present invention have excellent adhesive properties, thereby making it possible to develop adhesives for accurate spatial infiltration.

Abstract: Provided herein are amine blends which may be used in place of N-aminoethyl piperazine as accelerator in the curing reaction of epoxy resins.

Abstract: This invention describes epoxy-amine compositions that have low mix viscosity and a fast drying property at temperatures below freezing.