Abstract: A method of assembling a structure comprises applying an epoxy composition to at least one of a first member and a second member, sandwiching the epoxy composition between the first and second members, and bonding the two members wherein the adhesive bond is a thermally cured mass. The epoxy composition contains an epoxy resin, a phenolic or amine compound as a chain extender, a basic catalyst and a polymeric toughener. The composition can be formulated in two parts wherein part A contains the catalyst and part B has the epoxy resin.

Abstract: Aqueous solutions of inorganic nitrate salts are used to accelerate the gelling of epoxy gelcoat resins without adversely affecting the glass transition temperature of the finally cured gelcoat. The aqueous accelerants may be used to accelerate gelling of gelcoats that are formed during initial fabrication of composite parts. The aqueous acclerants are also useful for shortening the gel time of gelcoats that are intended for use in repairing damaged structures.

Abstract: Novel polysilazane-modified polyamine hardeners for epoxy resins, such classes as glycidyl ether epoxy resins and novolac epoxy resins, including reaction mixtures, compositions and reaction products comprising such hardeners, impart enhanced high temperature properties, higher char yields and better adhesion properties to the cured epoxy resins relative to the same epoxy resins cured using unmodified polyamine hardeners.

Abstract: The present invention is directed to fast dry ambient temperature curable coating compositions especially suited for use in automotive refinish applications. A binder component of the two pack coating composition includes an epoxy resin having at least one acetoacetate functionality and at least one epoxy group, and one or more reactive components provided with at least two acetoacetate functionalities. Some of the suitable reactive components include structured reactive diluent, an acrylic polymer, a polyester, or a combination thereof. A crosslinking component of the coating composition includes polyamine, a blocked polyamine or a mixture thereof. The present invention is further directed to a method of producing a coating on a substrate from the coating composition.

Abstract: There is provided a modified epoxy resin composition including a reaction product of an epoxy resin and an alkyl-substituted acetoacetate and a reaction product of an alcohol having at least one hydroxyl group in one molecule and an alkyl-substituted acetoacetate; a production process for the same; and a solvent-free coating using the same. The composition provides a solvent-free epoxy resin composition which has a low viscosity and excellent low-temperature curability.

Abstract: Photocurable compositions and process for providing form-in-place gaskets using automated placement followed by photocuring of a pattern of a non-silicone composition comprising a liquid polyolefin oligomer, a reactive diluent, and a curative. The form-in-place gasket, after curing, has a level of total outgassing components of about 10 &mgr;g/g to about 45 &mgr;g/g. The curative responds to actinic radiation and heat, and may contain a photoinitiator. Optionally a photocurable, form-in-place gasket according to the present invention further comprises a thixotropic filler in an amount from about 8.0 wt. % to about 12.0 wt. %, and preferably comprises a fumed silica.

Abstract: Curable mixtures based on epoxy resins and amine hardeners, if required additionally using solvents, water, plasticisers, UV stabilisers, colourants, pigments, fillers, which mixtures contain as accelerator at least one compound of general formula (I), wherein R1, R2, R3, R4 are each independently of one another H or an unbranched or branched alkyl radical containing 1 to 15 carbon atoms, and n is 0 to 10.

Abstract: A single component epoxy coating precursor and a method for making such a precursor, a low VOC epoxy coating and a method for making such a coating, and a method for making a blocked amine which is more stable than previously known ones. The single component epoxy coating precursor includes an epoxy resin, a first solvent, and a blocked amine. The single component epoxy coating precursor has a viscosity after 30 days at a temperature of 55° C. of less than 16 stokes.

Abstract: The present invention provides a new class of materials effective as accelerators for curing anaerobic adhesives. The addition of these materials into anaerobic adhesives as a replacement for conventional curatives, such as APH and/or toluidines, surprisingly provides at least comparable cure speeds and physical properties for the reaction products formed therefrom.

Abstract: Provided herein are amine blends which may be used in place of N-aminoethyl piperazine as accelerator in the curing reaction of epoxy resins.

Abstract: The invention provides polyepoxide-based adhesives containing cycloaliphatic-containing polyepoxide resin, aromatic polyepoxide resin, and 9,9-bis(3-methyl-4-aminophenyl)fluorene. The adhesives provide improved peel and shear strength.

Abstract: A sheet resin composition is adhered to a silicon wafer. The sheet resin composition supports the silicon wafer during back grinding and dicing into chips. Further, the sheet resin composition interfacial underfills between a chip from the wafer and a substrate during subsequent fabrication of a semiconductor device, the chip being flip chip mounted to the substrate.

Abstract: An epoxy resin composition comprises a) a polyepoxide, b) a cure inhibitor of boric acid, a Lewis acid derivative of boron, an alkyl borane, a mineral acid having a nucleophilicity value “n” of greater than zero and less than 2.5, or an organic acid having a pKa value of 1 or more, a catalyst which can be complexed with the cure inhibitor, and c) more than 30 parts by weight per 100 parts by weight of polyepoxide of a cross-linker such as a polycarboxylic acid or anhydride including a copolymer of an ethylenically unsaturated anhydride and a vinyl compound, or a hydroxy-functional compound such as a copolymer of styrene and hydroxystyrene.

Abstract: The present invention provides a process for producing phenol-dicarbonyl condensates high in fluorescence by reacting a phenolic compound with a 1,2-dicarbonyl compound in the presence of a catalyst selected from one or more carboxylic acid(s) or one or more carboxylic acid precursor(s). The present invention further provides phenol-dicarbonyl condensates, epoxy resins, epoxy resin systems and laminates prepared using these phenol-dicarbonyl condensates.

Abstract: An epoxy resin composition comprising, as main components, (a) 100 parts by weight of a polyfunctional epoxy resin which stays liquid at an ordinary temperature and has two or more glycidyl groups in the molecule thereof, (b) 3 to 80 parts by weight of a curing agent and (c) 1 to 100 parts by weight of a modified epoxy resin, is suitable as an underfill sealing agent, is capable of heat-curing in a short time with a good productivity, is capable of surely connecting a semiconductor device such as a CSP and a BGA on a wiring board without giving an adverse effect on each part disposed on the wiring board by heat-curing at a relatively low temperature, has excellent heat shock property (temperature cycling property) and impact resistance, is free from bleeding of contaminants from its cured product, and is capable of easily detaching the CSP or BGA from the wiring board in the case where a defect is found, making it possible to reuse a normal wiring board or semiconductor device.

Abstract: Epoxy resin compositions comprising (a) an epoxy resin, (b) a latent curing agent with curing power at 100° C. or below and (c) an aromatic amine-based curing agent and/or an alicyclic amine-based curing agent, which are curable in two stages, or epoxy resin compositions further comprising (d) a curing accelerator, as well as a prepregs comprising reinforcing fiber materials impregnated with the epoxy resin compositions. The compositions give die-releasable cured products by primary curing at low temperature, give highly heat-resistant cured products by secondary curing, and exhibit satisfactory stability at room temperature.

Abstract: A clear coat dicyandiamide cured epoxy powder coating for non-metallic substrates wherein the finish coat is visually haze-free as a result of the addition of a small amount of an aromatic substituted urea compound. Non-metallic substrates, such as brass, cannot withstand extremely high temperatures which are required to cure well known powder coatings. However, coating systems which cure at lower temperatures often produce a haze within the finish clear coat. The present invention alleviates this problem.

Abstract: A structure comprising a filled thermosetting polymer composition. The filled thermosetting polymer composition has a mineral filler content of at least 92% by weight and not more than 8% by weight of thermosetting polymer and a co-efficient of thermal expansion that is less than 15×10−6 in/in/° C. The filler is a mineral particulate filler with generally rounded edges and the thermosetting polymer composition has a density that is at least 95% of the theoretical density for the filler and polymer. Embodiments of the composition per se may be used to form a structure for resisting acid solutions.

Abstract: A controlled conversion resin having an epoxy functionality of greater than 2 and comprising moieties derived from epoxy resin, dihydric phenol, acid anhydride, or amine. The resin is prepared by reacting an epoxy resin with a dihydric phenol, an acid anhydride, or amine or other branching agent in the presence of a catalyst and terminating the reaction at a point such that the reaction product contains both epoxy and terminal hydroxyl groups.

Abstract: A curable underfill composition comprising an epoxy containing a curing agent component and a latent accelerator component. The accelerator component comprises a material which produces a resin with an exotherm below 300 J/g. Further, the combination may be utilized in an unfilled state which allows the epoxy to remain very viscous and thus increases the speed of the underfill process in comparison to filled epoxy compositions and epoxy compositions containing different accelerator components.

Abstract: The present invention relates to novel flame-retardant phosphorus-containing epoxy resins with an epoxy value of from 0.05 to 1.0 moll 100 g containing structural units which derive from (A) polyepoxy compounds having at least two epoxy groups per molecule, and (B) organic phosphinic acids. The invention further relates to a process for their preparation, and to their use. Besides their flame retardancy, the novel flame-retardant phosphorus-containing epoxy resins have especially good storage stability.

Abstract: The invention relates to curable compositions comprising a) an epoxy resin, b) an aminic curing agent and c) a curing accelerator, which comprise as curing accelerator c) at least one or more than one compound selected from c1) a compound of formula (I) wherein R1 and R2 are each independently of the other a hydrocarbon radical having from 1 to 12 carbon atoms, c2) a reaction product of a compound of formula (I) with formaldehyde, and c3) a reaction product of a compound of formula (I) with formaldehyde and a phenolic compound, in an amount of from 0.1 to 25% by weight, based on the sum of components a), b) and c), and to a process for the production of cured products using those compositions.

Abstract: Provided are a latent curing agent that gives an epoxy resin composition with improved storage stability and low-temperature curability; and a curable epoxy resin composition prepared by mixing the said curing agent and an epoxy compound. The epoxy resin composition has improved storage stability, and cures at lower temperatures for a shorter period of time than conventional ones. The latent curing agent for epoxy resin comprises two components, (A) a radically polymerized polymer of a monomer having at least a polymerizable double bond, which has at least a tertiary amino group in the molecule, and (B) a polymer having at least a hydroxyl group in the molecule, and forms a solid solution that is solid at 25° C.

Abstract: A curable epoxy resin formulation comprising a) 40 to 100% by weight of an epoxy group-terminated polyester of a dimerised or trimerised fatty acid and a polyhydric alcohol, and 0 to 60% by weight of a diepoxide which is not an epoxy group-terminated polyester, b) a hardener for epoxy resins consisting of 50 to 99% by weight of a polyoxyalkylene di- or triamine and 1 to 50% by weight of a hardener which is not a polyoxyalkyleneamine, and comprising as further optional components c) a curing accelerator, and d) customary modifiers for epoxy casting resins, with the proviso that the sum of the constituents in component a) as well as in component b) is in each case 100% by weight, is suitable for use as casting resin formulation for encapsulating electrical or electronic components.

Abstract: A two-part composition useful as an adhesive comprises an epoxy resin, a chain extender selected from an amine or a phenolic compound, a base catalyst and a polymeric toughener wherein Part A contains the catalyst and Part B with the epoxy resin.

Abstract: The subject invention pertains to an aqueous primer for use on metal surfaces to which a composite or a metal adherend is bonded. The primer composition includes an aqueous dispersion of: (a) at least one thermosetting resin curable at an elevated temperature; (b) at least one organosilane, each said organosilane containing at least ore hydrolyzable group; and (c) a curing agent. The aqueous primer composition contains substantially no volatile organic solvent, is environmentally superior to solvent-based primers, is storage stable, exhibits excellent solvent resistance and performs without loss of physical properties.

Abstract: The present invention is directed to fast dry ambient temperature curable coating compositions especially suited for use in automotive refinish applications. A binder component of the two pack coating composition includes an epoxy resin having at least one acetoacetate functionality and at least one epoxy group, and one or more reactive components provided with at least two acetoacetate functionalities. Some of the suitable reactive components include structured reactive diluent, an acrylic polymer, a polyester, or a combination thereof. A crosslinking component of the coating composition includes polyamine, a blocked polyamine or a mixture thereof. The present invention is further directed to a method of producing a coating on a substrate from the coating composition.

Abstract: An epoxy-amine composition includes an epoxy resin, an amine curing agent and elemental sulfur as a cure accelerator. The degree of acceleration is highly regulated by the concentration of sulfur in the epoxy-amine composition and the time and conditions of the contact between sulfur and the amine curing agent of the epoxy-amine composition.

Abstract: The invention relates to new high-functional polyaddition compounds which contain free isocyanate groups with an average isocyanate functionality of 2.1 to 8.0, a concentration of uretdione of 10 to 18 wt. %, a concentration of urethane of 10 to 20 wt. % and a concentration of ester groups —CO—O and/or carbonate groups —O—CO—O of 1 to 17 wt. %, a process for the preparation thereof and their use as starting components for the preparation of polyurethane plastics, in particular as cross-linking agents for heat-curable powder coatings.

Abstract: A thermosetting resin composition for prestressed concrete tendon, wherein the composition does not harden until the completion of the straining of the tendon, which is the inherent object in the post-tension technique, even if the heat storage temperature in the concrete structures elevates from 30° C. to 80° C. or higher due to heat of hydration reaction in setting a concrete, particularly 95° C. that is the maximum temperature in solidifying a concrete, and the composition including the site of 30° C. or lower where there is substantially no partial heat storage due to heat of hydration reaction in setting the concrete hardens within the prescribed period of time under spontaneous environmental temperature after the subsequent natural cooling, thereby achieving anti-rust and anti-corrosion of the tendon and also adhesion and integral bonding of the tendon and the concrete, a use method thereof and a prestressed concrete tendon.

Abstract: A method for rendering nondetonble energetic materials, such as are contained in or removed from decommissioned ordnance. The energetic materials are either combined with epoxy hardener or are combined with other compounds, preferably amine compounds, to form a substance that functions as an epoxy hardener. According to the invention, energetic materials (including TNT, RDX and Composition B) that are treated according to the invention method yield a reaction product that is non-explosive, that serves to harden or cure conventional epoxy resin to form a stable, nonexplosive waste product. Epoxy hardener made using the method of the invention is also described.

Abstract: An amino compound obtained by addition reaction of diamine represented by the following formula (1) and an alkenyl compound and a process for producing the same.

Abstract: Polyester-based aqueous coating compositions comprising a mixture of a carboxyl-functional polyester resin (A), a water-insoluble epoxy resin (B), and a hydrophobic solvent (C), the mixture being neutralized with neutralizer (D) and dispersed or dissolved in water. The compositions have excellent film forming and processing characteristics, and are particularly useful in coating the interior surface of cans and as automobile coatings.

Abstract: An epoxy resin mixture is prepared by a) the reaction of (i) a diglycidyl compound, (ii) a bisphenol compound and (iii) at least one monophenol at temperatures of from 160 to 170° C. in the presence of an advancement catalyst that can be thermally deactivated, (b) upon completion of the reaction, the catalyst is deactivated by heating to a temperature of approximately 180° C. wherein (A1) one or more epoxy resins having an epoxy functionality of greater than two is added, and c) the resulting epoxy resin mixture is homogenized at that temperature.

Abstract: The present invention provides a curable resin composition with excellent low temperature curability and good storage stability, which comprises (A) a polyepoxide compound, (B) a curing agent containing at least one functional group selected from carboxyl group and acid anhydride group, and (C) a potential curing catalyst composed of a reaction product of an onium salt and diphenyl phosphate.

Abstract: The present invention provides a thermosetting resin composition useful as an underfilling sealant composition which rapidly fills the underfill space in a semiconductor device, such as a flip chip assembly which includes a semiconductor chip mounted on a carrier substrate, enables the semi-conductor to be securely connected to a circuit board by short-time heat curing and with good productivity, and demonstrates acceptable heat shock properties (or thermal cycle properties). The thermosetting resin composition which is used as an underfilling sealant between such a semiconductor device and a circuit board to which the semiconductor device is electrically connected, includes an epoxy resin component and a latent hardener component. The latent hardener component includes a cyanate ester component and an imidizole component.

Abstract: Epoxy resin compositions comprising polyepoxides having at least two 1,2-epoxide groups, which can be obtained by reaction of diepoxides or polyepoxides or mixtures thereof with monoepoxides, and one or more amines sterically hindered amines, such as disecondary polyoxyalkylenediamines, and/or diprimary diamines, if desired with the addition of further 1,2-epoxide compounds and also hardeners, and use thereof as a coating for crack bridging, as an adhesive and in powder surface coatings.

Abstract: The invention provides for a process for the preparation of an advanced epoxy resin by reaction of a compound having on average more than one epoxy group per molecule and a compound having on average one or more hydroxyl group or carboxyl group per molecule in the presence of a catalyst at elevated temperature, the process comprising (1) mixing the epoxy compound, the hydroxyl compound or the carboxyl compound and the catalyst, and (2) transferring the mixture as a feedstream to a surface which is at least intermittently moving with respect to the feedstream. In a preferred embodiment an endless conveyer belt with additional heating means and optional cooling means are used.

Abstract: Halogen-free epoxy resins that arise from the addition of an epoxy component to a phenol component with base catalysis are disclosed, whereby the molar mass can be adjusted by means of the molar ratios of the initial materials. The resulting resins can be used in the field of electronics, both as molding compounds and as circuit board materials and adhesives.

Abstract: Present invention relates to a process for preparing a high molecular weight epoxy resin which has a weight average molecular weight value more than 40,000 and an epoxy equivalent weight less than 10,000 g/eq. This high molecular weight epoxy is prepared by a reaction of a divalent epoxy resin with a bisphenol compound in the presence of a catalyst and a solvent characterized in utilizing 1.10 to 1.03/1 of molar ratio of epoxy group/phenolic hydroxyl group.

Abstract: A curable epoxy resin composition comprising (A) an epoxy resin, (B) a thixotropic agent in an amount sufficient to induce thixotropic properties, and a hardener comprising (C) at least one polyethyleneimine and (D) at least one other amine having at least 2 amino hydrogen atoms, the combined amounts of (C) and (D) being sufficient to effect cure of the epoxy resin.

Abstract: A curing agent having less odor and providing a cured resin which is excellent in appearance, mechanical properties, water resistance and chemical resistance, and a one-component type humidity-curing resin composition having excellent storage stability and providing a cured matter which is excellent in appearance and physical properties. Specifically, provided are polyaminoamide or ketimine obtained by dehydration of 2,5- and/or 2,6-bis(aminomethyl)-bicyclo[2.2.1]heptane with carboxylic acids or ketones, a curing agent for epoxy resins using the same and a one-component type humidity-curing epoxy resin or urethane prepolymer composition containing the curing agent.

Abstract: The present invention provides pourable curable composition which comprises the product obtained by mixing (a) a liquid epoxy resin containing a sufficient amount of a thixotropic agent to induce thixotropic properties with (b) a hardener composition which contains a tertiary amine compound in an amount sufficient to at least cause the mixture to become pourable after mixing.

Abstract: The present invention relates to a diglycidyl ether represented by the following general formula (I): ##STR1## (wherein, R.sup.1 and R.sup.2 are the same or different, and represent lower alkyl having 1.about.6 carbon atoms), a composition including the glycidyl ether and epoxy resin, and epoxy resin cured product obtained by the composition. The glycidyl ether can be used as a reactive diluent for epoxy resins.

Abstract: Provided is a curable composition comprising (A) a phenolic compound having a carbon-carbon double bond, (B) a compound having an SiH group, and (C) a foaming agent. The composition can be foamed and cured at room temperature or under heat at relatively low temperatures, and is poorly corrodable and poorly toxic.

Abstract: The invention provides for a process for the preparation of an advanced epoxy resin by reaction of a compound having on average more than one epoxy group per molecule and a compound having on average one or more hydroxyl group or carboxyl group per molecule in the presence of a catalyst at elevated temperature, the process comprising (1) mixing the epoxy compound, the hydroxyl compound or the carboxyl compound and the catalyst, and (2) transferring the mixture as a feedstream to a surface exposed to an elevated temperature sufficient to produce an advanced epoxy resin which is at least intermittently moving with respect to the feedstream. In a preferred embodiment an endless conveyer belt with additional heating means and optional cooling means are used.

Abstract: A method for making a polyester resin comprises reacting a first polyfunctional alcohol or polyfunctional thiol and a carbonate in the presence of a catalyst to form an alkoxylated intermediate. The catalyst comprises: (1) a metal, a salt of a metal, or mixtures thereof and (2) a quaternary ammonium salt, a tertiary amine, an imidazole, or mixtures thereof. The alkoxylated intermediate is then reacted with a polyfunctional organic acid or anhydride thereof to form the polyester resin.

Abstract: An epoxy sealer/healer formulation for sealing and strengthening cracked concrete comprising an epoxy resin, an amine and a dialkylene triamine-alkylene oxide adduct, where the formulation provides a modulus and/or compressive strength at least that of uncracked concrete and effective for penetrating a concrete crack at a rate of at least 10 mm/min for a crack 0.5 mm wide when applied by gravity feed. The epoxy sealer/healer preferably has a viscosity of less than 100 centipoise and a tack-free time of less than 12 hours. The epoxy sealer/healer is advantageous in being able to bond to moist concrete surfaces. A method of using the epoxy sealer/healer for sealing and restoring the strength of cracked concrete is also set forth.

Abstract: A hardener for epoxy resins is disclosed the use of which imparts improved resistance in the resins to aging on exposure to ultraviolet radiation. The hardener comprises (a) at least one amine selected from the group consisting of trimethylhexamethylenediamine and isophoronediamine and (b) at least one inorganic salt which contains nitrate ion.

Abstract: The present invention relates to polyglycidyl ether compounds containing at least three mono- or divalent radicals A of the general formula wherein R.sub.