Abstract: A composite dry adhesive includes (a) an adhesive layer comprising a shape memory polymer and (b) a resistive heating layer comprising a shape memory polymer composite on the adhesive layer. The shape memory polymer composite includes conductive particles dispersed in a shape memory polymer matrix, where the conductive particles have a concentration sufficient to form a conductive path through the resistive heating layer.

Abstract: A tannic acid curing agent and a preparation method thereof are provided. The present invention uses tannic acid as a raw material and the long fatty chain of 10-undecenoyl chloride is introduced into the tannic acid structure to obtain the tannic acid curing agent. The preparation method includes the following steps: mixing tannic acid, 10-undecenoyl chloride, a catalyst and a solvent for a substitution reaction to obtain undecylenyl tannic acid, in which the catalyst includes an acid binding agent and 4-diaminopyridine, and the solvent includes ethyl acetate and N,N-dimethylformamide; mixing the undecylenyl tannic acid, a mercapto compound, a solvent and a photoinitiator for an addition reaction under an ultraviolet irradiation to obtain the tannic acid curing agent, in which the mercapto compound is a mercapto carboxylic acid compound or a mercapto alcohol compound.

Abstract: Provided is a resin composition for a fiber-reinforced composite material that has low tackiness when turned into a prepreg, has satisfactory handleability, and can be suppressed in deformation at the time of its release from a mold in a PCM method. The resin composition is a resin composition for a fiber-reinforced composite material including, as essential components: a liquid epoxy resin (A); a novolac-type epoxy resin (B); a polymer component (C) having a molecular weight of 10,000 or more; dicyandiamide (D); and an imidazole-based curing aid (E), wherein the resin composition includes 10 parts by mass to 35 parts by mass of the liquid epoxy resin (A), and 10 parts by mass to 25 parts by mass of the polymer component (C) out of 100 parts by mass of the total of the components (A) to (E), and has a glass transition temperature of 0° C. or more before its curing.

Abstract: A preparation method of thermadapt shape memory polymers includes: (1) synthesis of pendant hydroxyl groups functionalized epoxy oligomer using epoxy resin and alcohol amine; (2) synthesis of alkoxyl groups terminated silane crosslinking agent by isocyanate silane coupling agent and diamine; (3) crosslinked shape memory polymers were prepared by condensation reaction of pendant hydroxyl groups functionalized epoxy oligomer and alkoxyl groups terminated silane crosslinking agent. The thermadapt shape memory polymers show high glass transition temperatures and high tensile strength. The original shape of thermadapt shape memory polymers can be reconfigured to a new permanent shape as needed, and thus effectively solving the bottleneck problems of reprocessing or reshape in the traditional crosslinked polymers once after molding.

Abstract: A reagent that enhances acid generation of a photoacid generator and composition containing such reagent is disclosed.

Abstract: Provided herein are telechelic polymers and methods for producing the same. In some embodiments, provided herein are compounds having the formula and methods for producing the same.

Abstract: A photonic device is provided having a two or three-dimensionally periodic structure of interconnected members with alterable spacing between the members. The structure is composed of a shape memory polymer configured to be thermo-mechanically tunable to display a plurality of optical properties under a series of temperature changes and stress. A method of producing a photonic device based on a shape memory polymer is provided. A mold, having a two or three-dimensionally periodic structure of interconnected components with a characteristic spacing between the components, is infiltrated with a shape memory polymer precursor to form a composite structure. The composite structure is solidified. The mold is removed from the composite structure to form a photonic device as an inverse replica of the mold.

Abstract: A method for producing a semiconductor device includes the steps of: applying a composition for forming a resist underlayer film for EUV lithography including a novolac resin containing a halogen atom onto a substrate having a film to be fabricated for forming a transferring pattern and baking the composition so as to form a resist underlayer film for EUV lithography; and applying a resist for EUV lithography onto the resist underlayer film for EUV lithography, irradiating, with EUV through a mask, the resist underlayer film for EUV lithography and a film of the resist for EUV lithography on the resist underlayer film, developing the film of the resist for EUV lithography, and transferring an image formed in the mask onto the substrate by dry etching so as to form an integrated circuit device.

Abstract: Water based lignoepoxy resins, and methods for their preparation and use are provided. Methods of making lignoepoxy resins without the use of volatile organic compounds are also provided.

Abstract: A metal-clad phenolic resin laminate obtained by heating and pressing a lamination which comprises: (i) a central layered portion comprising one paper base prepreg which is made of a paper base impregnated with a first phenolic resin composition containing a resol-based resin, or a predetermined number of the paper base prepregs laid on each other; (ii) outer layered portions laid on an upper and a lower sides of the central layered portion, in which each of the outer layered portions comprises one glass fiber substrate prepreg which is made of a glass fiber substrate impregnated with a second phenolic resin composition containing a resol-based resin, or a predetermined number of the glass fiber substrate prepregs laid on each other; and (iii) a metal foil laid at least on one of the outer layered portions laid on the upper and lower sides of the central layered portion.

Abstract: This invention relates to a cardanol modified epoxy resin composition, especially, relates to a cardanol and/or dihydric phenol modified epoxy resin composition, a process making thereof and its application in low VOC high solids coating.

Abstract: An epoxy resin composition prepared from a dihydroxydiphenyl-cycloalkane compound to form a diglycidyl ether of dihydroxydiphenyl cycloalkane compound which may be useful for making various products including, for example, powder coatings, composites and electrical laminates.

Abstract: A cyclic compound represented by formula (1): wherein L, R1, R?, and m are as defined in the specification. The cyclic compound of formula (1) is highly soluble to a safety solvent, highly sensitive, and capable of forming resist patterns with good profile. Therefore, the cyclic compound is useful as a component of a radiation-sensitive composition.

Abstract: Disclosed is a polymer which is useful for the preparation of an epoxy resin composition or a cured product thereof in film or sheet exhibiting high heat resistance, high thermal conductivity, low thermal expansion, high gas barrier property, and high toughness. The polymer is a thermoplastic aromatic ether polymer comprising a unit represented by the following general formula (1) at a ratio of 10 to 100 mol % and having a weight average molecular weight of 3,000 or more; in formula (1), X is an oxygen atom or a sulfur atom, R1 and R2 each is a hydrogen atom, an alkyl group of 1 to 8 carbon atoms, an aryl group, an alkoxy group, an aralkyl group, or a halogen atom, and n is a number of 1 to 3.

Abstract: Water based lignoepoxy resins, and methods for their preparation and use are provided. Methods of making lignoepoxy resins without the use of volatile organic compounds are also provided.

Abstract: Disclosed are oligomeric phosphonates including oligophosphonates, random or block co-oligo(phosphonate ester)s and co-oligo(phosphonate carbonate)s produced using a condensation process terminated with hydroxyl, epoxy, vinyl, vinyl ester, isopropenyl, isocyanate groups, and the like. These materials can be used as a reactive additive to other polymers, oligomers or monomer mixtures to impart flame resistance without diminishing melt processability which is important in the fabrication of polymers for many applications.

Abstract: One embodiment includes compositions of shape memory epoxy polymers.

Abstract: To provide phosphorus-containing epoxy resins and phosphorus-containing epoxy resin compositions having high levels of appearance, yield and economic efficiency and cured products thereof that are used for various applications. A phosphorus-containing phenol compound represented by Formula (3) obtained by reacting a compound represented by Formula (2) with a compound represented by Formula (1), wherein in the peak area (A) of the component represented by Formula (1) on a chromatogram measured under specific conditions by gel permeation chromatography, peak area (B) on the high-molecular-weight side of the component of Formula (1), and total area (C) of peak area (A) and peak area (B), the value obtained by dividing peak area (B) by total area (C) is 8 area % or less, and epoxy resin compositions and cured products comprising the phosphorus-containing phenol compound as an essential ingredient.

Abstract: The present invention relates to techniques including a phenolic oligomer of general formula (1): wherein n is an integer of 0 to 15, Rs are allyl groups, a1 and a3 are each independently 0, 1, 2 or 3, each a2 is independently 0, 1 or 2, each R? is independently a hydrogen atom, an alkyl group having 1 to 10 carbon atoms or an aryl group, and proviso that at least one of a1, each a2 and a3 represents 2, and a method for producing such phenolic oligomer.

Abstract: Provided are a crystalline resin cured product which shows high thermal conductivity, low thermal expansion, high heat resistance, low moisture absorption, and good gas barrier properties and a crystalline resin composite material produced therefrom. Further provided is a method for producing the crystalline resin cured product and the crystalline resin composite material. The crystalline resin cured product is obtained by the reaction of an aromatic diglycidyl compound or a diglycidyl resin with an aromatic dihydroxy compound or with a dihydroxy resin and it shows a heat of melting of 10 J/g or more in differential thermal analysis while the endothermic peak corresponding to the melting appears in the range of 120 to 320° C. The crystalline resin composite material is obtained by combining the crystalline resin cured product with a filler or a base material. The crystalline resin cured product has a unit represented by -A-O—CH2—CH(OH)—CH2—O—B—, wherein A and B are divalent aromatic groups.

Abstract: The invention relates to a curable composition comprising one or more epoxy compounds, one or more amino hardeners, and an addition of one or more dendritic polymers selected from the group of the dendritic polyester polymers, where the dendritic polyester polymers can be produced through an Ax+By synthesis route.

Abstract: An object of the present invention is to provide a water-soluble epoxy resin that has high water-solubility, maintains emulsion stability for epoxy resin, and is capable of forming a cured product that has excellent coating film strength corrosion resistance and water resistance. The present invention provides a water-soluble epoxy resin obtained by causing an epoxy resin (B) having two or more epoxy groups in a molecule to react with a carboxy-group-containing compound (A) obtained by reacting a polyethylene glycol monoalkyl ether (A-1) having a number-average molecular weight of 400 to 10000 and an acid anhydride (A-2) derived from a polyvalent carboxylic acid; a water-soluble epoxy resin composition containing the water-soluble epoxy resin and an epoxy resin having two or more epoxy groups in a molecule; and a water-based epoxy resin composition in which the water-soluble epoxy resin composition is dispersed in an water-based solvent.

Abstract: A fluorine-containing novolac resin represented by the following formula, as well as a fluorine based surfactant and a fluorine based surfactant composition, which include the fluorine-containing novolac resin. In the formula, R represents a fluorinated alkyl-containing substituent, R? represents a hydrogen atom or a methyl group, R? represents a hydrogen atom or a non-fluorinated substituent, —X— represents any one of following four types of linking groups, —X? represents any one of three following types of substituents, n represents 0 or an integer of 1 or more, m represents an integer of 1 or more, and n+m is an integer of 2 or more.

Abstract: A variety of curing agents for epoxy resins and methods for preparation thereof are disclosed, including compounds having the structures of formulas III and IV: wherein each of R1, R2, R3, R4, and R5 is independently selected from the group consisting of H, methyl, ethyl, n-propyl, iso-propyl, a butyl, and phenyl. Epoxy-based compositions including various curing agents are also disclosed. Other epoxy curatives containing amino, phenol, and/or imine groups are disclosed.

Abstract: An epoxy resin composition including an epoxy resin and a curing agent as essential components, in which the curing agent comprises a phenol resin which has each structural moiety of a phenolic hydroxyl group-containing aromatic hydrocarbon group (P), an alkoxy group-containing aromatic hydrocarbon group (B) and a divalent aralkyl group (X), and also has, in a molecular structure, a structure in which the phenolic hydroxyl group-containing aromatic hydrocarbon group (P) and the alkoxy group-containing aromatic hydrocarbon group (B) are bonded with the other phenolic hydroxyl group-containing aromatic hydrocarbon group (P) or alkoxy group-containing aromatic hydrocarbon group (B) via the divalent aralkyl group (X).

Abstract: Compositions and methods for forming surfactants, aqueous dispersions, and curing agents are provided. In one aspect, the invention relates to improved epoxy functional surfactants prepared by reaction of an epoxy composition and an amidoamine composition formed from a blend of acid-terminated polyoxyalkylene polyols. The improved epoxy functional surfactants may be reacted with an excess of epoxy composition and water to result in an aqueous dispersion. The amidoamone composition may be a reaction mixture of a diamine compound and an acid terminated polyoxyalkylene composition formed from two or more polyoxyalkylene polyol compounds. The epoxy functional surfactant may be reacted with amine compounds to form a compound suitable as a curing agent.

Abstract: A phenol aralkyl type phenolic resin represented by the general formula (1), wherein the total content of the compounds represented by formulae (2) to (4) is 58 to 92% as determined by GPC and the contents of the compounds represented by formulae (2) to (4) as determined by HPLC satisfy the following relationship: 0.60?(2a+b)/(2a+2b+2c)?0.90 wherein a is the content of the compound of formula (2); b is the content of the compound of formula (3); and c is the content of the compound of formula (4).

Abstract: An object of the present invention is to provide a cationic curable composition which has low viscosity, can be rapidly photo-cured even in the air, has good adhesion to a substrate such as glass or resin, and is excellent in glass cleaner resistance and water resistance; an ink jet ink, a gravure ink and a hard coating material which comprise the composition; and cured products thereof. A cationic curable composition comprising: (A) 1 to 100 parts by weight of a phenol derivative having 3 or more aromatic rings per molecule, wherein the aromatic ring has a structure in which some or all of hydrogen atoms of phenolic hydroxyl groups of the aromatic ring are substituted by polymerizable functional groups; (B) 1 to 500 parts by weight of a cationic polymerizable compound; and (C) 0.05 to 20 parts by weight of a photo- and/or thermo-cationic initiator is provided.

Abstract: Epoxy resins and mixtures of polyphenolic compounds which comprise cycloaliphatic moieties, processes for the production thereof and mixtures and cured products which comprise these resins and/or mixtures.

Abstract: Various embodiments of the present invention are directed to methods for manufacturing complex, anisotropic materials with desirable properties for information storage, processing, and display. Certain of these methods involve employing a magnetic field during manufacture to induce desired orientations of precursors, subunits, and/or molecular subassemblies. The applied magnetic field steers the precursors, subunits, and/or molecular subassemblies into desirable orientations while the precursors, subunits, and/or molecular subassemblies are assembled or self-assemble into a complex, anisotropic material. One embodiment of the present invention is a class of new, complex, well-ordered, network-like materials that include a ferromagnetic-material-based framework in which organic and/or organometallic compounds are organized.

Abstract: To provide an epoxy resin giving a cured object having high heat resistance, which is improved in impact resistance and moisture resistance as compared with conventional high-heat-resistance epoxy resins. The epoxy resin is obtained by glycidylating one or more phenol compounds comprising 95% or more 1,1,2,2-tetrakis (hydroxyphenyl)ethane, and is characterized in that in an examination by gel permeation chromatography, the epoxy resin has a tetranucleus-form content of 50 to 90% by area and an octanucleus-form content of at least 5% by area and has a total chlorine content of 5,000 ppm or smaller.

Abstract: An epoxy-crosslinked sulfonated poly(phenylene) copolymer composition used as proton exchange membranes, methods of making the same, and their use as proton exchange membranes (PEM) in hydrogen fuel cells, direct methanol fuel cell, in electrode casting solutions and electrodes, and in sulfur dioxide electrolyzers. These improved membranes are tougher, have higher temperature capability, and lower SO2 crossover rates.

Abstract: A fluorine-containing novolac resin represented by the following formula, as well as a fluorine based surfactant and a fluorine based surfactant composition, which include the fluorine-containing novolac resin. In the formula, R represents a fluorinated alkyl-containing substituent, R? represents a hydrogen atom or a methyl group, R? represents a hydrogen atom or a non-fluorinated substituent, —X— represents any one of following four types of linking groups, —X? represents any one of three following types of substituents, n represents 0 or an integer of 1 or more, m represents an integer of 1 or more, and n+m is an integer of 2 or more.

Abstract: An epoxy prepolymer having excellent thermal conductivity is obtained by reacting an epoxy compound having a mesogenic skeleton and a trinuclear bisphenol represented by the following formula: (wherein each of R1, R2, R3, R4, R5, R6, R7, R8, R9, R10, R11 and R12 represents a hydrogen atom or an alkyl group and each may be the same or different while at least one represents an alkyl group).

Abstract: A phenol aralkyl type phenolic resin represented by the general formula (1), wherein the total content of the compounds represented by formulae (2) to (4) is 58 to 92% as determined by GPC and the contents of the compounds represented by formulae (2) to (4) as determined by HPLC satisfy the following relationship: 0.60?(2a+b)/(2a+2b+2c)?0.90 wherein a is the content of the compound of formula (2); b is the content of the compound of formula (3); and c is the content of the compound of formula (4).

Abstract: To provide a resin composition which is advantageous not only in that the resin composition can be produced at low cost, but also in that it is unlikely to thermally expand, a prepreg, a laminate, and a wiring board. A resin composition for use in production of a laminate, the resin composition comprising an insulating resin having an aromatic ring, wherein the insulating resin having an aromatic ring has a molecular weight between crosslinking sites of 300 to 1,000 on the stage after the production of the laminate, as determined from an elastic shear modulus of the insulating resin measured at a temperature of Tg or higher.

Abstract: The invention provides an improvement to the useable lifetimes of phenolic-epoxy, phenolic-benzoxazine, phenolic-epoxy-benzoxazine mixtures and other phenolic mixtures through the use of protected phenolics, where a phenolic compound, polymer, or resin is released on demand by the addition of a deblocking agent.

Abstract: [Problems] To provide an epoxy resin giving a cured object having high heat resistance, which is improved in impact resistance and moisture resistance as compared with conventional high-heat-resistance epoxy resins. [Means for Solving Problems] The epoxy resin is obtained by glycidylating one or more phenol compounds comprising 95% or more 1,1,2,2-tetrakis(hydroxyphenyl)ethane, and is characterized in that in an examination by gel permeation chromatography, the epoxy resin has a tetranucleus-form content of 50 to 90% by area and an octanucleus-form content of at least 5% by area and has a total chlorine content of 5,000 ppm or smaller.

Abstract: The present invention provides an adamantyl group containing epoxy-modified (meth)acrylate and a resin composition containing it which are imparted by transparency, optical characteristics such as (durable) light resistance and the like, heat-resistance, and good mechanical properties. For example, they are an adamantyl group containing epoxy-modified (meth)acrylate having the following general formula (I) and a composition containing it. In the formula, R1 represents a hydrogen atom or a methyl group, and R2 represents a halogen atom or an aliphatic hydrocarbon group which may contain a hetero atom. Plural R2 may be the same or different, and m represents an integer of 0 to 4 and n represents an integer of 0 or more.

Abstract: The present invention has an object to provide curatives for epoxy resins and curing accelerators for epoxy resins, which both have improved subliming and decomposing properties and which, when mixed with an epoxy resin, enable the mixture to be greatly improved in thermal stability that is extremely important for the control of a curing reaction and to have a prolonged pot life (stability as a one-pack mixture comprising the epoxy resin, curative, etc.) and improved curability at low temperatures.

Abstract: The invention relates to a modified hydrocarbylphenol-aldehyde resin prepared by reacting a hydrocarbylphenol-aldehyde resin with a primary or secondary amine and further with an epoxide. The invention also provides a process for preparing a modified, hydrocarbylphenol-aldehyde resin and a rubber composition containing such resin.

Abstract: One embodiment includes compositions of shape memory epoxy polymers.

Abstract: Compositions useful in circuitry substrates are described which have a polyimide component, and a sterically hindered hydrophobic epoxy component. Generally, a flowable precursor is applied and then cured to a wholly or partially solidified mass. The invention is also directed to methods of forming a passive electrical component upon or into a circuit board.

Abstract: Various embodiments of the present invention are directed to methods for manufacturing complex, anisotropic materials with desirable properties for information storage, processing, and display. Certain of these methods involve employing a magnetic field during manufacture to induce desired orientations of precursors, subunits, and/or molecular subassemblies. The applied magnetic field steers the precursors, subunits, and/or molecular subassemblies into desirable orientations while the precursors, subunits, and/or molecular subassemblies are assembled or self-assemble into a complex, anisotropic material. One embodiment of the present invention is a class of new, complex, well-ordered, network-like materials that include a ferromagnetic-material-based framework in which organic and/or organometallic compounds are organized.

Abstract: Branched polyarylene polymers are provided comprising monovalent endcappers, divalent linear units, and polyvalent branching units. The composition of the polymers is controlled by adjusting the ratio of the three types of monomers.

Abstract: Poly-o-hydroxyamides include binaphthyl substituents as repeating units. The poly-o-hydroxyamides can be cyclized to give the polybenzoxazole by heating. Pore formation occurs, so that a dielectric having a very low dielectric constant k of less than 2.5 is obtained.

Abstract: In the technical field where a difunctional epoxy resin having increased molecular weight is used to impart flexibility or improving dielectric properties, the present invention has remarkably improved moisture resistance and water resistance when used to produce a cured epoxy resin article. The epoxy resin composition comprises a difunctional epoxy resin (A) having a structure wherein an aromatic hydrocarbon group (a1) having a bonding site in an aromatic nucleus and a hydrocarbon group (a2) having an ether bond or the other hydrocarbon group (a3) are bonded via an acetal bond (a4), and also has a structure wherein a glycidyloxy group is bonded to the aromatic hydrocarbon group (a1); and a curing agent (B) as essential component.

Abstract: A compound including an epoxy group that has a heat curing property and a chalcone group that has a radiation curing property is represented by the following formula: wherein n is an integer from 1 to 10,000, and each of R1, R2, R3, R4, R5, R6, R7 and R8 is selected from a group consisting of a hydrogen atom, alkyl group, alkoxy group, halogen atom and nitro group. The compound has a high curing efficiency. A photoresist composition including the compound above substantially prevents the formation of remnant in a photoresist pattern used in the manufacturing of a color filter. In addition, the color filter pattern that is formed using the photoresist composition has high color reproductivity and brightness.

Abstract: This invention relates to novel epoxy resins and epoxy resin compositions comprising said epoxy resins or cured articles thereof. The cured articles have excellent properties in respect to flame retardance, adhesiveness, moisture resistance and heat resistance and can be used in applications such as lamination, molding, casting and adhesion. The epoxy resins of this invention are represented by the following formula (3) wherein Y1 denotes a glycidyloxyarylmethyl group represented by —CH2—Ar—OG, Y2 and Y3 denote independently a glycidyl group or the aforementioned glycidyloxyarylmethyl group, Ar denotes a phenylene group which can be substituted with up to two hydrocarbon groups and G denotes a glycidyl group.

Abstract: The object of the present invention is to provide an epoxy resin and epoxy resin composition having a low viscosity which can afford a cured product having an excellent heat resistance. The present invention is characterized by using an epoxy resin which is obtained by reacting 5-methylresorcin with epihalohydrin in the presence of alkali metal hydroxide.