Abstract: A granular epoxy resin is made by pulverizing an epoxy resin which is solid at ordinary temperature and can exhibit excellent fluidity during molding because of its low melt viscosity in which the total content of components having a molecular weight of 500 or less among components of n1=0 in the following general formula (1) and/or components of n2=0 in the following general formula (2) is 50% by mass or more of the entire epoxy resin, or, the total content of components having a molecular weight 400 or less among components of n1=0 in the following general formula (1) and/or components of n2=0 in the following general formula (2) is 20% by mass or more of the entire epoxy resin. The content of low molecular weight compounds having a molecular weight 200 or less in the granular epoxy resin is 0.3% by mass or less. The granular epoxy resin allows easy handling because it hardly causes blocking during storage and transportation.

Abstract: The present invention relates to an epoxy resin composition a cure article thereof, a novel epoxy resin used therein, a polyhydric phenol compound suited for used as an intermediate thereof, and a process for preparing the same. One of the objects to be achieved by the present invention is to exert the heat resistance, the moisture resistance, the dielectric performances and the flame-resistant effect required of electric or electronic materials such as semiconductor encapsulating materials and varnishes for circuit boards in the epoxy resin composition.

Abstract: The present invention has an object to provide curatives for epoxy resins and curing accelerators for epoxy resins, which both have improved subliming and decomposing properties and which, when mixed with an epoxy resin, enable the mixture to be greatly improved in thermal stability that is extremely important for the control of a curing reaction and to have a prolonged pot life (stability as a one-pack mixture comprising the epoxy resin, curative, etc.) and improved curability at low temperatures.

Abstract: The present invention has an object to provide curatives for epoxy resins and curing accelerators for epoxy resins, which both have improved subliming and decomposing properties and which, when mixed with an epoxy resin, enable the mixture to be greatly improved in thermal stability that is extremely important for the control of a curing reaction and to have a prolonged pot life (stability as a one-pack mixture comprising the epoxy resin, curative, etc.) and improved curability at low temperatures.

Abstract: An object of the present invention is to obtain a novel polymeric material capable of forming a solid polymer electrolyte excellent not only in processability, solvent resistance and durability/stability but also in ion conductivity by introducing sulfonic acid group or phosphonic acid group into a polybenzazole compound having excellent properties in view of heat resistance, solvent resistance, mechanical characteristics and the like.

Abstract: This invention provides a compound suitable as an encapsulating material for electronic devices and having a high Tg, low moisture-absorption, high adhesion and fluidity which is a cyclopentylene compound represented by Formula (I) and its intermediate cyclopentenyl compound represented by Formula (III). In the formula, m is 0 or more, Ar1 and Ar2 are each a phenol residual group, a naphthol residual group or a fluorene derivative residual group, and each contain a hydroxyl group or a glycidyloxyl group.

Abstract: Provided is an industrially advantageous insulating film obtainable from a resin composition comprising (A) 100 parts by weight of a polyphenylene oxide having a structural unit of the following formula (1): and (B) 0.1 to 60 parts by weight of a copolymer having a functional group reactive with the above-mentioned polyphenylene oxide.

Abstract: Gel formation is prevented in the reaction between a sulfonyl-chloride-containing resin and a polyamine by first forming an adduct between the resin with an aminophenol. The prevention of gel formation enables sulfonyl-chloride containing resin to be used in admixture with acrylates and epoxy resin to form a polyamine-curable adhesive composition having excellent adhesive properties and chemical resistance.

Abstract: An epoxy resin composition comprising: (i) an epoxy resin having a melt viscosity of from 0.1 dPa to 5 dPa at 150° C. and having two or more repeating units each comprising: a methylene bond substituted by at least an aromatic ring; and a benzene ring substituted by at least a glycidyloxy group, wherein said aromatic ring is at least one member selected from the group consisting of (a) condensed aromatic rings and (b) combinations of aromatic rings in which two or more aromatic monocycles or condensed aromatic rings are connected directly to each other via a single bond; and (ii) a curing agent.

Abstract: The invention relates to two-component preparations comprising components (I) and (II), wherein at least one component comprises epoxy compounds and the preparations cure by cationic polymerization, initiated by Lewis and/or Brönsted acids, after mixing of the two components, the preparations comprising the Lewis and/or Brönsted acids in the form of precursor compounds which are suitable for the formation of Lewis and/or Brönsted acids.

Abstract: The present invention provides a process for producing phenol-dicarbonyl condensates high in fluorescence by reacting a phenolic compound with a 1,2-dicarbonyl compound in the presence of a catalyst selected from one or more carboxylic acid(s) or one or more carboxylic acid precursor(s). The present invention further provides phenol-dicarbonyl condensates, epoxy resins, epoxy resin systems and laminates prepared using these phenol-dicarbonyl condensates.

Abstract: A new brominated epoxy resin has been developed, which consists of following components: A. multifunctional phenol-benzaldehyde epoxy resin (formula 1) 10˜70 weight %; B. difunctional epoxy resin 0˜55 weight %; C. bromine-containing difunctional epoxy resin 0˜20 weight %; D. tetrabromobisphenol-A epoxy resin 15˜40 weight %; The synthesis is that (D) tetra bromo bisphenol-A reacts with at least one of (A), (B)and (C), then adding the rest of (A),(B) and (C) and mixing them uniformly, the new brominated epoxy resin produced, which can be applied to glass fiber laminate, and showing proper reactivity and a broad working window. The laminate possesses high Tg and good heat resistance, and applying to electron material with high performance.

Abstract: This invention provides a compound suitable as an encapsulating material for electronic devices and having a high Tg, low moisture-absorptive, high adhesion and rich fluidity, which is a cyclopentylene compound represented by Formula (I) and its intermediate cyclopentenyl compound represented by Formula (III). In the formula, m is 0 or more, Ar1 and Ar2 are each a phenol residual group, a naphthol residual group or a fluorene derivative residual group, and each contain a hydroxyl group or a glycidyloxyl group.

Abstract: Alkylated and/or aralkylated polyhydroxy aromatic compounds prepared by reaction of a polyhydroxy aromatic compound (A) with an alkylene compound (B) at elevated temperature with the addition of a mixture (C) of oxalic acid and boric acid in a molar ratio of from 1:5 to 1:0, are useful, for example, as starting materials for the preparation of condensation polymers.

Abstract: Photographically useful materials are disclosed comprising a hyperbranched polymer segment and multiple pendant photographically useful groups. Such materials may be prepared by forming an active hyperbranched polymer segment with multiple functionalized end group sites, and reacting the active hyperbranched polymer segment with an active compound comprising a photographically useful group to form a hyperbranched polymer ended with photographically useful groups. The hyperbranched segment may comprise any kind of polymer segment with hyperbranched architecture, and the active end groups may comprise any kind of reactive site. The active hyperbranched polymer may comprise any kind of other functional groups which are located in either backbone or the ends.

Abstract: An epoxy compound formula (1), and a hydrogenation process for preparing thereof; wherein R1 to R4 each represent a hydrogen atom or an alkyl group having 1 to 6 carbon atoms; n represents an integer of 0 to 6; and Z1 and Z2 each represent a phenyl group substituted or unsubstituted by one or more alkyl groups or a cyclohexyl group substituted or unsubstituted by one or more alkyl groups.

Abstract: An epoxy resin composition comprising an epoxy resin containing 0-10% by weight of a 2-nucleus compound and 50-100% by weight of 3 to 5-nucleus compounds combined and having a dispersity (Mw/Mn) of 1.0-1.7, an inorganic filler, a curing catalyst, and optionally a phenolic resin, and having a Tg of lower than 15° C. in an uncured state is effective in forming a flexible film which is easy to work at room temperature. A laminate film includes a layer of the epoxy resin composition and a protective layer. By sealing a semiconductor chip with the film, there is obtained a semiconductor package having improved heat resistance, improved moisture resistance, low stress property.

Abstract: The present invention is directed to a polyglycidyl compound having on average more than two, preferably more than two and a half, particularly preferably more than three, glycidyl groups per molecule and a Tg value (determined by DSC, heating rate=20° C./min) higher than 20° C.

Abstract: A thermosetting epoxy resin composition having a low environmental load and a high flame retardancy includes a compound represented by the following formula 1 and a novolac compound represented by the following formula 2 as essential components:X--R.sub.1 --X Formula 1X being a functional group, capable of reacting with a functional group Y of the formula 2; and R.sub.1 being a crystalline functional group having a phenyl group, ##STR1## Y being a functional group capable of reacting with the functional group X in the compound of the formula 1; R.sub.2 being a functional group capable of reacting with the functional group X, a hydrocarbon having 1 to 3 carbon atoms, or hydrogen; and n is an integer of 0 to 20.

Abstract: The present invention provides an epoxy resin composition, comprising:(A) a phenol epoxy resin represented by the following formula (I) ##STR1## wherein each R.sup.1 is the same or different and is independently selected from the group consisting of hydrogen, C.sub.1 to C.sub.6 hydrocarbyl groups, C.sub.6 to C.sub.10 aromatic groups, and C.sub.1 to C.sub.6 hydrocarbyl-substituted C.sub.6 to C.sub.10 aromatic groups,each R.sup.2 is the same or different and is independently selected from the group consisting of hydrogen, C.sub.1 to C.sub.6 hydrocarbyl groups, C.sub.6 to C.sub.10 aromatic groups, and C.sub.1 to C.sub.6 hydrocarbyl-substituted C.sub.6 to C.sub.10 aromatic groups, ##STR2## wherein R.sup.3 is selected from the group consisting of hydrogen, C.sub.1 to C.sub.6 hydrocarbyl groups, C.sub.6 to C.sub.10 aromatic groups, and C.sub.1 to C.sub.6 hydrocarbyl-substituted C.sub.6 to C.sub.10 aromatic groups, each R.sup.

Abstract: An epoxy resin which is useful as adhesives, resins for coatings, encapsulants, resins for a lamination board, casting materials, molding compounds, and electric insulators, and which can provide a cured resin having excellent heat resistance and moisture resistance is provided which comprises (A) an epoxy resin containing a trisepoxy compound represented by general formula (I), and (B) a curing agent for an epoxy resin, ##STR1## wherein R.sub.1 is a methyl group, n is an integer of 0 to 2, and Ar is a group selected from general formula (II) ##STR2## wherein R.sub.2 and R.sub.3 are an alkyl group having a carbon number of 1 to 6, an alkoxy group having a carbon number of 1 to 6, or a halogen atom, and m and p are an integer of 0 to 2.

Abstract: Modified epoxy resin having an elevated softening point obtained from an epoxy resin having a low softening point without modifying the properties of the cured product and to improve the workability in the production of an epoxy resin composition. The modified epoxy resin is obtained by adding 4,4'-dihydroxybiphenyl to a specified phenol compound and epoxidizing the resultant mixture. Also disclosed is an epoxy resin composition containing the modified epoxy resin and the cured product thereof.

Abstract: Provided is a curable composition comprising (A) a phenolic compound having a carbon-carbon double bond, (B) a compound having an SiH group, and (C) a foaming agent. The composition can be foamed and cured at room temperature or under heat at relatively low temperatures, and is poorly corrodable and poorly toxic.

Abstract: Polymer compositions made by reacting a polyol with an aromatic hydrocarbon containing only a single reactive functionality have been discovered to be useful demulsifiers for crude oil compositions. The aromatic hydrocarbon should have at least one aryl group and only one functionality reactive with a hydroxyl. The polyol may optionally be crosslinked prior to reaction with the aromatic hydrocarbon, and the crosslinking agent may be a diepoxide.

Abstract: The present invention relates to polyglycidyl ether compounds containing at least three mono- or divalent radicals A of the general formula wherein R.sub.

Abstract: Disclosed is a phenol resin composition containing a specific triazines-modified novolak phenol resin comprising phenols, triazines and aldehydes, and a method for producing the triazines-modified novolak phenol resin comprising the steps of as a first step reaction, successively effecting processes (i), (ii) and (iii), wherein said process (i) is a process for adjusting a pH of a system of a mixture of phenols, triazines and aldehydes in a range of 5 to 10, said process (ii) is a process for reacting said mixture under the condition that the aldehydes are not volatilized and said process (iii) is a process for removing a reaction water in the system; then as a second step reaction, successively effecting said processes (ii) and (iii) at a higher temperature than that of the first step reaction; thereafter as a third step reaction, successively effecting said processes (ii) and (iii) at a higher temperature than that of the second step reaction; and further, depending upon a necessity, repeating the second st

Abstract: A number of new phenolepoxy resins are prepared by reacting polyphenol, epihalohydrin and imidazole in a homogeneous reaction medium.

Abstract: The stilbene epoxy resin having two different aryl groups and an epoxy resin mixture including this stilbene epoxy resin have lower melting points than those of the stilbene epoxy resin having two identical aryl groups and the epoxy resin mixture of the latter stilbene epoxy resin. Compared with the conventional resins, the present resin or resin mixture has improved working and molding properties, which shortens the time required for the molding and working process, resulting in economic advantages and a preferred affect on productivity. The present epoxy resin or resin mixture is preferably used as an adhesive, a coating, an insulating material, an electrical or electronic material for laminated sheets or the like. It is especially suited for use as material for encapsulating electronic parts.

Abstract: Aqueous synthetic resin dispersions comprising (A) an ionic resin, based on aralkylated epoxy resins, (B) a blocked polyisocyanate and (C) a polymer of at least one olefinically unsaturated monomer which is capable of undergoing free-radical polymerization are useful, for example, as binders in processes of coating by electrodeposition.

Abstract: Disclosed is a method of preparing a fluorescent polymer, whereby an ethylenically unsaturated monomer is copolymerized with a polynuclear aromatic hydrocarbon or a substituted aromatic derivative thereof, such that the resultant polymer is fluorescent. Also disclosed are coating compositions containing such fluorescent polymers.

Abstract: A polyepoxy composition comprising a trisepoxide represented by general formula (I) described below which is well-balanced between thermal stability and water resistance is provided. ##STR1## In the formula, R represents a methyl group, X represents an alkyl group having a carbon number of 1 to 6, an alkoxy group having a carbon number of 1 to 6, or a halogen atom, which may be identical or different, respectively, Y represents a hydrogen atom or a methyl group, and m and n represent an integer of 0 to 2.

Abstract: The present invention provides a production method for a photo-sensitive resin, characterized in reacting a difunctional epoxy resin (B) having two epoxy groups in a molecule with carboxyl groups contained in a resin (A) having two or more (meth)acryloyl groups and at least one carboxyl group in a molecule. Since the photo-sensitive resin prepared by extending the resin (A) to a high molecular weight linearly via the difunctional epoxy resin (B) is obtained, a resist layer having an excellent tack-free property can be formed. Further, a resist layer irradiated with rays through a patterning film can be developed rapidly and correctly in an alkaline aqueous solution. Accordingly, it has been possible to provide the high-performance liquid photo-sensitive resin compositions useful for a solder resist used for producing printed circuit boards and for an electroless plating resist or useful for producing black matrices and color filters for liquid crystal displays.

Abstract: Described herein are polyesters and polyamides which contain repeat units derived from novel dicarboxylic acids comprising arylene groups having ortho ethers substituted thereon. Also disclosed are novel compounds from which these polymers can be made. The polymers are especially useful for molding resins and coatings.

Abstract: Monomers of formula (I) ##STR1## where ##STR2## is a mesogen, ##STR3## is a spacer, and --X is a group having an epoxy function exhibit a reduced tendency to undergo self-condensation via addition polymerization and afford liquid crystalline polymers upon condensation with a crosslinking agent.

Abstract: The present invention relates to crosslinkable thermoplastic compositions comprising a plurality of crosslinkable moieties, capable of undergoing addition polymerization, incorporated by functionalization of the precursor poly(hydroxy ethers). The poly(hydroxy ethers) comprise recurring moieties derived from aromatic dihydroxy compounds. The crosslinkable polymeric compositions are crosslinked to obtain crosslinked thermoset polymeric compositions of the invention. The polymeric compositions of the inventions can be suitably used either as an active guiding layer, and/or as a NLO active upper and lower cladding layers in an electro-optic device. The polymeric compositions can also be used as non-NLO polymers for the upper and lower cladding layers, prior to orientation by the application of an electric field.

Abstract: The present invention relates to an epoxy composition represented by the formula (I) below, wherein G is a glycidyl group or a halogen atom. It is produced by reacting a halogenated polyhydric phenol compound with epihalohydrin in the presence of an alkali metal hydroxide. It is incorporated into a resin to render it flame retardant.

Abstract: The invention relates to an epoxy resin composition for semiconductor encapsulation comprising at least an epoxy resin, hardener, inorganic filler, and accelerator, wherein said epoxy resin is one which is composed of about 20 to about 90 parts by weight of 4,4'-bisphenol F type epoxy resin and about 10 to about 80 parts by weight of either a polyhydric phenolic type epoxy resin which has slightly polar hydrocarbon groups (Z) lying between the phenyl nuclei, or a biphenol type epoxy resin.

Abstract: Epoxy resins containing rodlike mesogenic moieties are prepared from phenolic hydroxyl containing compounds which contain such moieties.

Abstract: A charge transporting polymer represented by formula ##STR1## wherein R represents a hydrogen atom, an alkyl group, an acyl group or --CONH--R, wherein R' represents an alkyl group or a substituted or unsubstituted aryl group; R.sub.1 and R.sub.2, which may be the same or different, each represent a hydrogen atom, an alkyl group, an alkoxy group, a substituted amino group, a halogen atom, or a substituted or unsubstituted aryl group; X represents a substituted or unsubstituted divalent aromatic group; y represents 0 or 1; m represents 0 or 1; n represents an integer of 1 to 5; and p represents an integer of 5 to 5000,a process for producing the same, and an organic electron device containing the same, such as an electrophotographic photoreceptor are disclosed. The charge transporting polymer is excellent in solubility, film-forming properties, mechanical strength, positive hole mobility, and stability to repeated use.

Abstract: A epoxy resin composition comprising (A) an epoxy resin bearing at least one monovalent hydrocarbon group on a benzene ring, (B) a phenolic resin, (C) an inorganic filler, and (D) 2-phenyl-4,5-dihydroxymethylimidazole as a curing accelerator has a low melt viscosity, a long gel time and a high curing rate, and provides cured products having improved properties. Semiconductor devices encapsulated with cured products of the inventive composition are reliable.

Abstract: The invention provides a cis-stilbene type epoxy resin having lower melting point and lower viscosity than the trans-stilbene type epoxy resin hitherto known. The stilbene type epoxy resin has a cis-isomer content of essentially 100%, or in the alternative, at least about 10% with the rest being the trans-isomer, and is based on the following general formula (1): ##STR1## wherein R.sub.1 to R.sub.8 are independently an acyclic or cyclic alkyl group, a hydrogen atom, or a halogen atom. Production processes for these epoxy resins are also disclosed.

Abstract: A thermosetting epoxy resin powder coating composition is provided that comprises an epoxy resin composed of a diglycidyl ether of bisphenol A, a curing agent composed of a bisphenol A encapped diglycidyl ether of bisphenol A, and a cure catalyst composed of an imidazole adducted to a diglycidyl ether of bisphenol A, in which the ratio of curing agent to epoxy resin is below 70% stoichiometry, and preferably between about 10% and 60% stoichiometry. The thermosetting epoxy resin powder coating composition not only exhibits the desired flexibility and fast cure speeds, but also exhibits superior adhesion and superior resistance to delamination and cathodic disbondment, preferably having cathodic disbondment values typically less than 4 mm radial disbondment, and preferably less than 2 mm radial disbondment. Such properties are highly advantageous for protective powder coatings used on rebars and pipelines.

Abstract: The present invention relates to a novel oxirane pre-polymer comprised of the catalyzed or uncatalyzed reaction product of tris or tetraphenyl intermediates with a difunctional oxirane oligomer having at least one aromatic moiety and at least one aliphatic moiety, characterized in that substantially hydrolyzable oxygen atoms in said phenyl are bonded to said oligomers, and there is substantially no bonding between oligomer moieties. In a particularly preferred embodiment the present invention relates to a novel oxirane prepolymer comprising the reaction product of a phenyl intermediate with an inorganic oxide having at least one hydrolyzable oxygen and a difunctional oxirane oligomer aliphatic moiety characterized in that a majority of all hydrolyzable oxygen atoms in said oxide are bonded to at least one of the phenyl groups of the tris-phenyl and one phenyl group of the tris-phenyl group is bonded to said oligomer and there is substantially no bonding between oligomer moieties.

Abstract: An epoxy resin composition for sealing a photosemiconductor element includes(A) an epoxy resin component which comprises an epoxy resin having at least three epoxy groups per molecule,(B) a phenolic resin component which is represented by the following general formula (I) and has a phenolic hydroxyl group equivalent weight (g/eq) of 200 to 800, and(C) a cure accelerator component, ##STR1## wherein n is an integer of from 0 to 14, the phenolic resin component being a mixture of at least two phenolic resins represented by the general formula (I) with at least two different values of n, the resin with n=0 being not more than 20% by weight of the phenolic resin component;and a photosemiconductor device is sealed with the epoxy resin composition.

Abstract: Disclosed is a thermosetting resin composition comprising cyanate resin, a compound containing at least one or more than one of a phenolic hydroxyl radical and an epoxy resin, wherein said resin has excellent adhesive and heat resistant properties while at the same time possessing a low hardening contraction rate and contributing to higher dimensional stability, and method of making the same.

Abstract: Blends compriseA) from 55 to 99% by weight of a matrix of copolyarylene ether sulfones composed ofa.sub.1) from 91 to 97 mol % of structural units ##STR1## a.sub.2) from 3 to 9 mol % of structural units ##STR2## B) from 1 to 45% by weight of a disperse phase comprising copolyarylene ether sulfones, composed ofb.sub.1) from 91 to 97 mol % of structural units II andb.sub.2) from 3 to 9 mol % of structural units I,C) from 0 to 40% by weight of rubber impact modifiers,D) from 0 to 60% by weight of fibrous or particulate fillers or of mixtures thereof andE) from 0 to 40% by weight of processing assistants and/or additives.

Abstract: Cure of a novel trisepoxy resin-based composition provides a thermoset having high Tg, low dielectric constant, low water absorption and good flexural strength.

Abstract: Disclosed is an epoxy resin composition for sealing semiconductors which comprises as essential components: (A) an epoxy resin containing a biphenyl type epoxy resin represented by the following formula (1) in an amount of 30-100% by weight on the basis of the total amount of the epoxy resin, ##STR1## wherein R.sub.1 -R.sub.8 are the same or different atoms or groups selected from hydrogen, halogens and alkyl groups, (B) a hardener containing a phenolic resin hardener represented by the following formula (2a) or a naphthol resin hardener represented by the following formula (2b) in an amount of 30-100% by weight on the basis of the total amount of the hardener, ##STR2## wherein R.sub.1 -R.sub.8 are the same or different atoms or groups selected from hydrogen, halogens and alkyl groups, R.sub.

Abstract: Curing components containing amino groups for curing epoxy resins are obtained by the reaction of alkylated polyhydroxy aromatics (A) with polyamines (B) and aldehydes (C) by the mechanism of the Mannich reaction. The preparation of curable mixtures and varnish formulations is also disclosed. The curing components and curable mixtures can also be employed at a low temperature.

Abstract: Curing components containing amino groups for curing epoxy resins are obtained by the reaction of alkylated polyhydroxy aromatics (A) with polyamines (B) and aldehydes (C) by the mechanism of the Mannich reaction. The preparation of curable mixtures and varnish formulations is also disclosed. The curing components and curable mixtures can also be employed at a low temperature.