Abstract: A series of oligomeric adducts of diols and diepoxides are disclosed which are precursors of amine resins for use in electrodeposition coatings. The adducts are epoxide-alcohol addition products of a polyaromatic and/or a mono-aromatic diol and a polyaromatic bis-glycidyl ether, and/or a monoaromatic bis-glycidyl ether and/or an alkoxy arylene bis-glycidyl ether, thioether or amine. The coatings which include amine resin, cross linking agent, grind resin and pigment exhibit excellent corrosion resistance.

Abstract: A low viscosity product is obtained when an adduct is prepared by reacting (A) at least one polyglycidyl ether of a compound containing an average of more than one phenolic hydroxy group per molecule and (B) at least one aliphatic monocarboxylic acid containing 7 to 15 carbon atoms per molecule; wherein components (A) and (B) are present in amounts which provide a ratio of carboxylic acid groups per epoxide group of from about 0.01:1 to about 0.2:1.

Abstract: A low viscosity product is obtained when an adduct is prepared by reacting (A) at least one polyglycidyl ether of: (1) a compound containing an average of more than one hydroxyl group per molecule and also at least one cycloalkadiene or oligomer of a cycloalkadiene per molecule or (2) a compound represented by the formula HO--(--A--Y--).sub.n --A--OH wherein each A is independently a divalent hydrocarbyl group having from about 2 to about 6 carbon atoms; each Y independently is --S-- or --S--S--; and n has a value from 1 to about 11; with (B) at least one aliphatic monocarboxylic acid containing from about 6 to about 18 carbon atoms per molecule; wherein components (A) and (B) are present in amounts which provide a ratio of carboxylic acid group per epoxide group of from about 0.01:1 to about 0.2:1.

Abstract: Co-advanced epoxy resins prepared by the reaction of polyethers of polyhydric phenols, diglycidyl ethers of di-secondary alcohols and dihydric phenols, said co-advanced resins being heat curable with suitable curing agents to afford cured coating compositions exhibiting a variety of excellent physical properties and performance characteristics.The diglycidyl ethers have the following formula: ##STR1## as defined in the specification.

Abstract: This invention provides a process for the preparation of cationic coating compositions, which comprises blending:(1) 5-35% w of a crosslinking compound, and(2) 65-95% w of a carboxylated amide group-containing amino binder being the reaction product of an amino group-containing resin binder and not more than about 0.1 mole of a cyclic anhydride per amino group equivalent of said amino group containing resin binder, which amino group-containing binder comprises the reaction product of(a) ammonia, and(b) a blend of(b.sub.1) a polyglycidyl ether having n epoxy groups per molecule, wherein 1<n<1.9, said polyglycidyl ether being the reaction product of a multifunctional polyglycidyl ether having x epoxy groups per molecule, wherein x>2, and (x-n) mol of a monofunctional phenol per mol of the multifunctional polyglycidyl ether, and(b.sub.

Abstract: An epoxy resin composition comprising a trifunctional epoxy resin derived from a trisphenol having the structure represented by the following general formula ##STR1## wherein R represents a hydrogen atom, an alkyl group or a halogen atom, and a novolak-type phenolic resin. This epoxy resin composition gives a cured product having excellent pliability and a high glass transition temperature. It is especially useful as a semiconductor encapsulating material.

Abstract: Thermoset products are prepared by polymerizing (A) at least one thermosettable compound which contains both a maleimide group and a cyanate group such as 3-(2,5-dihydro-2,5-dioxo-1H-pyrrol-1-yl)phenyl cyanate and optionally (B) at least one of (1) at least one aromatic polycyanate such as bisphenol A dicyanate; (2) at least one polymaleimide such as N,N'-(methylenedi-p-phenylene)bismaleimide; (3) at least one material having an average of more than one vicinal epoxide group per molecule such as a diglycidyl ether of bisphenol A; (4) at least one polymerizable ethylenically unsaturated material such as styrene; or (5) a mixture of any two or more of components 1-4 in any combination.

Abstract: Thermoset products are prepared by polymerizing (A) at least one thermosettable compound which contains both a maleimide group and a cyanate group such as 3-(2,5-dihydro-2,5-dioxo-1H-pyrrol-1-yl)phenyl cyanate and optionally (B) at least one of (1) at least one aromatic polycyanate such as bisphenol A dicyanate; (2) at least one polymaleimide such as N,N'-(methylenedi-p-phenylene)bismaleimide; (3) at least one material having an average of more than one vicinal epoxide group per molecule such as a diglycidyl ether of bisphenol A; (4) at least one polymerizable ethylenically unsaturated material such as styrene; or (5) a mixture of any two or more of components 1-4 in any combination.

Abstract: Uncured compositions are prepared from dialkanolamines and polyglycidyl ethers of tris(hydroxyphenyl)alkanes. These compositions are water soluble or water miscible.

Abstract: The invention relates to water-dispersible binders which are intended for cationic electropaints and are based on reaction products which are formed from modified epoxy resins and primary and/or secondary amines and which can, if desired, also contain crosslinking agents, pigments, flow-control agents and other customary auxiliaries. They contain as reaction products those which have been prepared by reacting(A) low molecular weight epoxy resins which contain epoxy compound aromatic groups and have an epoxide equivalent weight of less than 375 with(B) aliphatic and/or alicyclic polyfunctional alcohols having hydroxyl groups or carboxylic acids having carboxylic groups and both having a molecular weight of less than 350 and addition of the hydroxyl groups and carboxylic groups to the epoxy groups of (A) in such a way that the reaction products of (A) and (B) contain 10-45% of aromatic groups, calculated as the phenylene group, and have terminal epoxy groups.

Abstract: This invention is directed to adducts of a poly(active hydrogen) organic compound and a polyepoxide comprising the reaction product of a poly(active hydrogen) organic compound and a polyepoxide containing two or more epoxy groups per molecule, said poly(active hydrogen) organic compound being employed in an amount at least sufficient to effect substantially complete reaction of the epoxy groups of the polyepoxide. The adducts are useful in the formulation of high solids coating compositions, polyurethane elastomers, inks, sealants, adhesives and the like.

Abstract: The present invention relates to a new polymer composition having the processing characteristics of a thermosetting polymer along with an improved balance of properties including improved modulus/glass transition temperature/toughness balance. These new polymer compositions are prepared by reacting certain diphenolic compounds with certain diepoxide compounds to form linear units which are lightly crosslinked through the resulting secondary hydroxyl groups. Also disclosed and claimed are processes for preparing such compositions, cured compositions and end-use applications.

Abstract: The present invention relates to a new thermoplastic polymer composition having the processing characteristics of a thermosetting polymer along with an improved balance of properties including solvent resistance and improved modulus/glass transition temperature/toughness balance. These new polymer compositions are prepared by reacting certain diphenolic compounds with certain diepoxide compounds to form linear units which are lightly crosslinked through the resulting secondary hydroxyl groups. Also disclosed and claimed are processes for preparing such compositions, cured compositions and end-use applications.

Abstract: Liquid epoxy resins can be converted to non-sintering, relatively low equivalent weight, flakable solid opoxides having relatively low melt viscosities by advancing the resins with 1,1,1-tri(hydroxyphenyl)alkanes or -alkenes in which the alkane or alkene moiety contains from 1 to 11 carbons.

Abstract: An improvement in curable compositions which comprise a polyglycidyl ether such as the triglycidylether of tris(hydroxyphenyl)methane and a halogenated dihydric phenol such as tetrabromobisphenol A, the improvement being employing as the halogenated dihydric phenol one in which the halogen atoms are meta with respect to the hydroxyl groups such as 2,2',6,6'-tetrabromo-3 ,3',5,5'-tetramethyl-4,4'-biphenol. These compositions can be cured by heating in the presence or absence of a catalyst for reacting epoxy groups with phenolic hydroxyl groups such as 2-methyl imidazole. These compositions are particularly useful in the preparation of electrical laminates.

Abstract: Liquid epoxy resins can be converted to non-sintering, relatively low equivalent weight, flakable solid epoxides having relatively low melt viscosities by advancing the resins with 1,1,1-tri(hydroxyphenyl)alkanes or -alkenes in which the alkane or alkene moiety contains from 1 to 11 carbons.

Abstract: A novel epoxy resin composition is obtained by modifying a bisphenol-type epoxy resin and/or a halogen-containing epoxy resin with a trisphenol represented by the following general formula: ##STR1## wherein each of R.sub.1 and R.sub.2 represents hydrogen or an alkyl group havng not more than 6 carbon atoms with the proviso that at least one of them is the alkyl group, each of R.sub.3, R.sub.4 and R.sub.5 represents hydrogen or an alkyl group having not more than 4 carbon atoms, and n represents a number of 0 or 1. The composition is suitable, for example, as a paint, a casting material or a molding material.

Abstract: An epoxy resin system is disclosed which is especially adapted for use in the pultrusion process. Such resin system comprises tris (hydroxyphenyl) methane-based epoxy resin and a combination of the cross-linking agents (methyl)-bicyclo(2,2,1) heptane-2,3-dicarboxylic anhydride and poly sebacic poly anhydride, the ratio of the dicarboxylic anhydride to the total amount of cross-linking agents ranging from 0.65 to 0.80 and the ratio of the poly anhydride to the total amount of cross-linking agents ranging from 0.35 to 0.20. The amount of total cross-linking agents to epoxy resin ranges from about 60 to about 80 parts total cross-linking agents, per 100 parts resin, by weight. A small amount of an imidazole accelerator, preferably 2-ethyl-4 methyl imidazole, is included.

Abstract: New and improved heat curable compositions are disclosed comprising epoxidic prepolymers and mono- and di-imidazole-carboxamides. The compositions are stable at room temperature, but cure readily at moderate temperatures of substantially less than about 250.degree. F., preferably at about 180.degree. F. to about 200.degree. F. and especially preferably at about 160.degree. F. to about 180.degree. F. The cured neat resins are useful as adhesives and as matrix resins in reinforced composites, with excellent physical properties.

Abstract: Diamines of the structure ##STR1## Wherein X is --SO.sub.2 -- or --CO--, Y is O or S, and Ar is a linear aryl ether moiety comprising from 1 to 80 aryl rings, are epoxy resin curing agents providing cured resins with improved moisture resistance and toughness. The resins are particularly useful in preparing prepregs and composites.

Abstract: Advanced epoxy resins prepared by the reaction of diglycidyl ethers of di-secondary alcohols and dihydric phenols, said advanced resins being heat curable with suitable curing agents to afford cured coating compositions exhibiting a variety of excellent physical properties and performance characteristics.

Abstract: Titled materials and their preparation. The materials contain a moiety such as, for example, 4-oxy-3,5-dimethyl-2,6-dibromobenzyl which can impart a high degree of thermal and hydrolytic stability to the materials, for example, epoxy thermosets such as in electronic encapsulations. For example, when used in electronic encapsulation formulations, these materials can provide a substantial increase in electronic device reliability. Their preparation involves an alkylation of an aromatic ring, for example, such as a Friedel-Crafts alkylation with 4-bromomethyl-3,5-dibromo-2,6-dimethylphenol or with 4-hydroxymethyl-3,5-dibromo-2,6-dimethylphenol.

Abstract: Halogenated aromatic epoxy resins are disclosed wherein the halogen atoms are in the meta position with respect to a glycidyl ether group attached to an aromatic ring.Advanced epoxy resins are disclosed which result from the reaction of a relatively low molecular weight epoxy resin and a polyhydric phenol wherein at least one of the reactants contains at least one halogen atom which is meta with respect to a glycidyl ether group or a hydroxyl group attached to an aromatic ring. These advanced epoxy resins, when cured with a suitable curing agent, possess an improvement as compared to an advanced epoxy resin containing halogen atoms which are ortho with respect to a glycidyl ether group in at least one of thermal stability, glass transition temperature, relationship of viscosity to molecular weight and resistance to forming hydrolyzed halides in the presence of a refluxing solution of an alkali metal hydroxide.

Abstract: Adducts are prepared from partially hydrolyzed epoxy resins having an average functionality of at least about 2.6 such as a partially hydrolyzed phenol-formaldehyde epoxy novolac resin and a polyamine such as diethylenetriamine. These adducts are useful in preparing low temperature curable epoxy resin compositions.

Abstract: Epoxides of the invention are those of the formula ##STR1## wherein J is H or F, the same in each occurrence; Q is a valence bond or --O--, the same in each occurrence; and Y is H or F, independently. When cured, these epoxides are superior in moisture resistance, flame retardance, and thermal stability to the corresponding non-fluorinated, prior art epoxides. The epoxides of the preceding formula may be made by first reacting an allylic halide of the formula CJ.sub.2 .dbd.CJ--CJ.sub.2 --X, wherein X is halogen, with a compound of the formula ##STR2## wherein Z is MO, hal.Mg or Ag; M is an alkali metal; and hal=Br or I; then if Y is to be F, converting the --CH group to a --CF group, and finally, oxidizing the CJ.sub.2 .dbd.CJ group to a ##STR3## group.

Abstract: Laminates are prepared for reinforced expoxy resin compositions comprising (A) a reinforcing material such as fiberglass, (B) one or more epoxy resins such as a hydrocarbon-phenol eposy resin and (C) one or more epoxy resin curing agents such as a hydrocarbon-phenol resin or phenol-formaldehyde novolac resin. These laminates are particularly suitable for use in electrical applications such as the manufacture of printed circuit boards.

Abstract: Vinyl ester resins are prepared by reacting a polyepoxide of a co-oligomerization product of a mixed cyanate of a polyphenol and a polymaleimide with a monounsaturated monocarboxylic acid.

Abstract: The invention relates to epxoy resins obtained by reaction of epichlorohydrin with selected mixtures of phenols for the production of thermosetting and cold-hardening moldings, coating compositions and adhesive compositions.

Abstract: A thermosetting epoxy resin composition of one pack type is provided which contains as indispensable constituents (I) an epoxy resin containing more than one adjacent epoxy groups on the average in the molecule and (II) a curing amount or curing-accelerating amount of a compound obtained by reacting (a) a specified amine/epoxy adduct with (b) phenolic resin(s) and/or polyhydric phenol compound(s) in a weight ratio of (a) to (b) of 1/0.1 to 1/0.8. The composition of the present invention has excellent storage stability and it is curable at a relatively low temperature to form a cured product having excellent mechanical strength, adhesiveness and water resistance.

Abstract: Curable thermosetting resin compositions comprising at least one cycloaliphatic epoxy resin having at least two 1,2-epoxy groups per molecule, and certain aromatic diamines having three aromatic rings in the molecule are disclosed. Resin compositions comprised of, for example, bis(2,3-epoxycyclopentyl)ether and 1,3-bis(4-aminophenoxy)benzene exhibit a highly desirable balance of physical and chemical properties which renders such compositions ideally suited for use in the fabrication of wet winding composites. The resin compositions prepared in accordance with the invention have unexpectedly low viscosity, high glass transition temperatures, high tensile properties and unexpectedly low water uptake. Accordingly, the resin compositions find particular application in the preparation of composites by wet winding procedures.

Abstract: Advanced epoxy resin products are prepared by reacting a triglycidyl ether of a trihydric phenol such as the triglycidyl ether of 1,1,1-tri(hydroxyphenyl)methane with a dihydric phenol such as bisphenol A. These advanced epoxy resins are non-sintering solid resins useful in the preparation of electrical potting or molding compositions.

Abstract: Epoxy resin compositions which on curing yield cured resins having a high glass transition temperature, high ductility, and low moisture pick-up are disclosed. To obtain such cured resins, 9,9-bis(aminophenyl)fluorenes are used as curing agents.

Abstract: Novel 3-ring tetraglycidates having the formula ##STR1## wherein X=O, S, ##STR2## --CH.sub.2 --, C.dbd.O; Y=halogen, C.sub.1 -C.sub.4 alkyl; and p0 n=0 to 4, are disclosedEpoxy resin systems exhibiting good tensile properties and moisture sensitivity can be made by copolymerizing the tetraglycidates with a polyamine curing agent. Prepregs can be made by combining the epoxy resin systems with a fiber reinforcement. The epoxy resin system may include a co-epoxide.

Abstract: Solid non-sintering epoxy resin products are prepared by reacting a trihydric phenol such as 1,1,1-tri(hydroxyphenyl)methane with an epihalohydrin such as epichlorohydrin in the presence of an alkali metal hydroxide such as sodium hydroxide. These epoxy resins are non-sintering solid resins useful in the preparation of electrical potting or molding compositions.

Abstract: A curable epoxy resin mixture containing an adduct of an epoxy resin with a bifunctional phenol or a bifunctional aromatic carboxylic acid of the formula ##STR1## where A=SO.sub.2 or CO, Ar is ##STR2## and X is OH or COOH, and an aromatic amine as a curing agent.

Abstract: Hydroxyaromatic oligomers are prepared by (I) reacting (A) an aromatic hydroxyl-containing material such as bisphenol A with (B) a cyanogen halide such as cyanogen bromide in the presence of a base such as triethylamine and (II) co-oligomerizing the cyanate-containing product from (I) with (C) a polymaleimide such as the reaction product of maleic anhydride with methylenedianiline optionally in the presence of (D) a co-oligomerization catalyst such as cobalt naphthenate. These oligomers are useful in the preparation of epoxy resins.

Abstract: A composition of matter comprising either at least about 80 wt. % of a monomeric or oligomeric polyglycidyl ether of tris(hydroxyphenyl)alkanes;or at least about 80 wt. % of an epoxy phenol-formaldehyde or cresol-formaldehyde novolac resin in monomeric or oligometric form, e.g., dimers, trimers, tetramers and some higher oligomers in an amount of as little as 5 up to about 95 wt. %;in combination with from about 0.1 to about 20 wt. % of a divinyl benzene compound of the formula: ##STR1## wherein each A independently represents H, F, Cl, Br or CH.sub.3 but no more than 2 of A are CH.sub.3.

Abstract: Vinyl ester resins are prepared by reacting a polyepoxide of a co-oligomerization product of a mixed cyanate of a polyphenol and a polymaleimide with a monounsaturated monocarboxylic acid.

Abstract: An adhesive composition comprising, by weight, (1) 100 parts of triglycidyl ether of trisphenol, (2) 0-40 parts of a polyfunctional epoxy resin, (3) a diamine type curing agent selected from (a) an aromatic diamine compound and (b) a reaction product having an amino group at each terminal thereof, prepared by reacting together an aromatic diamine compound, divinylsilane compound and bismaleimide compound, and, if desired, (4) a powdery inorganic filler.

Abstract: The disclosure is directed to thermoset resinous compositions having utility in the area of surface coating and molding applications, the latter including the preparation of high performance composites and the use in reaction injection molding processes. The contemplated compositions are obtained by polymerizing a reaction mixture comprising a polyfunctional 2-oxazoline compound, a compound or oligomer containing a plurality of aromatic hydroxyl groups and a polyfunctional epoxide.

Abstract: Imide functional polyphenols are prepared by reacting an excess of a phenol with an unsaturated diimide which is prepared by reacting an unsaturated polycycloaliphatic dicarboxylic acid anhydride with a diamine.These materials are useful in the preparation of castings, coatings, laminates and the like.

Abstract: New and improved heat curable compositions are disclosed comprising epoxidic resin(s) and aromatic ether-sulfone polyamines, alone or in combination with other diamine curing agents and/or curing catalysts alone, or in further combination with reinforcements, e.g., graphite fibers and, optionally modified with second resins. The cured neat resins and fiber resin matrix compositions exhibit high toughness, compression strength and short beam shear strength under dry, wet and hot/wet conditions.

Abstract: A thermosetting resin composition having an improved crack resistance comprising 100 weight parts of a curable epoxy resin and 30 to 300 weight parts of a phenol compound-added conjugated diolefin polymer, which is prepared in the presence of aluminum phenoxide as the catalyst. The composition is suitable for resin encapsulation of electronic components.

Abstract: Epoxy resins reacted with an oxirane group containing phosphonate of the formula: ##STR1## wherein R is hydrogen or lower alkyl and R.sub.1 is lower alkyl are described. The backbone of the epoxy resin contains a functional substituent which reacts with (I) preferably a hydroxyl substituent. The cured epoxy resins reacted with the phosphonate (I) have improved flame resistance or glass temperatures.

Abstract: Hydroxyaromatic compounds are amido-alkylated or cyano-alkylated to form the corresponding compounds by:(a) heating said compounds with an alkylating agent in the presence of water and a catalyst, e.g., benzyltrimethylammonium chloride;(b) adding an alkaline agent, e.g., NaOH, to the heated mixture of (a); and(c) continuing to heat the resulting mixture until the corresponding amido- or cyano-alkylated compound is formed.Fully or partially amido-alkylated compositions are useful in the preparation of copolymers with epoxy resins.

Abstract: Imide functional polyphenols are prepared by reacting an excess of a phenol with an unsaturated diimide which is prepared by reacting an unsaturated polycycloaliphatic dicarboxylic acid anhydride with a diamine.These materials are useful in the preparation of castings, coatings, laminates and the like.

Abstract: Electrically insulating wire coatings are resistant to prolonged exposure to 200.degree. C. when formed from a powder which, in a preferred composition, is a blend of(a) epoxy-terminated adduct of hydantoin diepoxide and aromatic dicarboxylic acid imide dissolved in hydantoin diepoxide,(b) acid-terminated polyester of aromatic dicarboxylic acid and diphenol containing one aromatic ring pendant from a central carbon atom,(c) bismaleimide, and(d) fumaric acid.

Abstract: Curable compositions are disclosed which comprise a multiglycidyl ether such as the triglycidylether of tris(hydroxyphenyl)methane and an amine substituted sulfonic acid amide such as sulfanilamide. These compositions can be cured by heating in the presence or absence of an accelerator such as 2-methyl imidazole. These compositions are particularly useful in the preparation of electrical laminates.

Abstract: Resinous materials are produced in the substantial absence of a solvent by feeding to an extruder operated at a temperature sufficient to cause a reaction between the reactants (A) at least one material having an average of more than one vicinal epoxy group per molecule, (B) at least one material having an average of more than one group reactive with component (A) such as hydroxyl, thiol, carboxyl, isocyanate, thioisocyanate or secondary amine groups or a combination of such groups per molecule or a material having only one primary amine group per molecule, (C) at least one catalyst for promoting a reaction between components (A) and (B) if a catalyst is required to effect the reaction between components (A) and (B), and (D) optionally one or more chain terminators and thereafter recovering a resinous material resulting from the reaction between components (A) and (B) from said extruder.This process is useful in preparing advanced epoxy resins and phenoxy thermoplastic resins.

Abstract: This invention is directed to hydroxyl terminated azomethines formed by reacting aromatic hydroxyl aldehydes or ketone compounds with diamines. These azomethines may be reacted with epoxy resin to produce polymeric material having high glass transition temperatures.