Abstract: This invention is directed to hydroxyl terminated azomethines formed by reacting aromatic dialdehydes or aromatic diketones with hdyroxyl-amino compounds. These azomethines may be reacted with epoxy resin to produce polymeric material having high glass transition temperatures.

Abstract: Curable compositions are disclosed which comprise a polyglycidyl ether such as the triglycidylether of tris(hydroxyphenyl)methane and a halogenated dihydric phenol such as tetrabromobisphenol A. These compositions can be cured by heating in the presence or absence of catalyst for reacting epoxy groups with phenolic hydroxyl groups such as 2-methyl imidazole. These compositions are particularly useful in the preparation of electrical laminates.

Abstract: Relatively high molecular weight epoxy resins cured with conventional curing agents are disclosed wherein the relatively high molecular weight epoxy resin is prepared in the presence of the curing agents. The resultant cured epoxy resin has an improvement in Tg or toughness and the mixture prior to reaction and curing is much easier to apply as a coating or in the preparation of castings, laminates and the like as compared to applications of mixtures of relatively high molecular weight epoxy resins and the curing agents.

Abstract: Described herein is a composition comprising a select group of substituted diamine hardeners and an expoxy resin containing two or more 1,2-epoxide groups per molecule. These compositions exhibit reduced moisture absorption, and controlled reactivity which comprises the processing characteristics of the composition.

Abstract: Heat-curable mixtures, containing (a) an epoxide resin having on average more than one epoxide group in the molecule, (b) an allyl-substituted or methallyl-substituted imide of the formula I ##STR1## in which E is allyl or methallyl, G is hydrogen or methyl, n is 1 or 2, and R is hydrogen, alkyl, alkenyl, cycloalkyl, aryl, benzyl or arylene, and (c) a curing catalyst, have good storage stability and processability and produce moulded materials having high mechanical strength values and good resistance to heat.

Abstract: A coating composition comprising the reaction product obtained by reacting an epoxy resin with a polynuclear polyhydroxy phenol having adjacent hydroxy groups, polyol esters of polyhydroxy phenolic carboxylic acids having adjacent hydroxy groups or a phosphorus compound.

Abstract: Compositions comprising a material containing (a) alkenyl phenyl cyanate groups, (b) a material containing epoxide groups and optionally any one or more of (c) an aromatic polycyanate, (d) a polymaleimide or (e) a polymerizable ethylenically unsaturated aromatic material are curable to products having excellent mechanical, thermal and chemical resistant properties.

Abstract: Novel hydroxyaromatic oligomers are prepared by the co-oligomerization reaction of a mixed cyanate of a polyphenol with an aromatic polyamine. These oligomers are useful in preparing epoxy resins therefrom.

Abstract: Oligomeric vinyl esters are prepared by reacting (A) an epoxy resin prepared by co-oligomerizing (1) a mixed cyanate of a polyphenol and (2) an aromatic polyamine with (B) a monounsaturated monocarboxylic acid.These vinyl ester resins are (oligomeric vinyl ester and copolymerizable monomer blend) useful in the preparation of laminates, composites, castings, coatings and the like.

Abstract: Epoxy resins are prepared by reacting a mixture of (A) a diglycidyl ether of a dihydric aliphatic material, (B) a polyglycidyl ether of a polyhydric phenol having an average of at least about 2.6 glycidyl ether groups per molecule and optionally (C) a diglycidyl ether of a dihydric phenol with a dihydric phenol in the presence of a catalyst.Coating compositions containing the aforementioned epoxy resins have improved chip resistance, chemical resistance or pencil hardness when cured.

Abstract: The thermosetting powder lacquer is suited for covering the weld seams in metal containers for foodstuffs or beverages and comprises a mixture of at least two aromatic epoxide resins, a first component of which contains a maximum of two epoxide groups per molecule on the average and a second component of which contains more than two epoxide groups per molecule on the average, a hardener and a catalyst. As a hardener there is used a condensation product formed from the diglycidylether of bisphenol-A and bisphenol-A and as a catalyst dimethylaminophenol is used.

Abstract: A method of making an epoxy prepolymer curing agent is disclosed. The method comprises the steps of reacting a mixture of piperidine and an epoxy resin so as to form an epoxy prepolymer adduct. The adduct is mixed with 2-ethyl-4-methylimidazole thereby forming the curing agent composition.

Abstract: A curing agent for one package epoxy resin systems is disclosed as a imidazole blocked naphthyl diisocyanate which, when incorporated in epoxy resins, has an extended shelf life and can be cured by exposure to relatively low temperatures. The curing agent is insoluble in epoxy resins that are liquid at room temperature and is useful in connection therewith.

Abstract: Compounds containing (a) a fluoroaliphaticsulfonamido moiety, and (b) a moiety containing (1) at least two oxirane groups, (2) at least two non-terminal N-.beta.-hydroxyalkylene groups, or (3) at least one oxirane group and at least one non-terminal N-.beta.-hydroxyalkylene group. The compound is capable of being cured with a curing agent to give a cured product having excellent water resistance and oil resistance.

Abstract: Resin compositions are prepared by reacting an epoxy resin with an amine-substituted aromatic sulfonic acid amide at a temperature up to about 130.degree. C. The resultant product can be cured by heating to a temperature of at least about 150.degree. C. in the presence of suitable curing agents and in some instances in the absence of any curing agent.

Abstract: A polyglycidyl derivative of an aromatic diamine, aminophenol, or polyphenol and a diglycidyl ether of a bisphenol are reacted with a bisphenol, in the presence of a catalyst at elevated temperature, to yield a reaction product wherein each glycidyl group is effectively endcapped with a moiety containing a free hydroxyl group. The ratio of equivalents of polyglycidyl compound to diglycidyl compound is 1 to 4 to 1 to 1, and of bisphenol to total glycidyl compounds is 1.8 to 1 to 2.4 to 1. Said product is useful for curing solid epoxy resins. The epoxy resins cured by said product have a dense crosslinked network resulting in concomitant superior coating properties especially chemical resistance while maintaining good flexibility.

Abstract: Water-soluble or water-dispersible resinous salts are prepared by `tipping` an epoxy resin with a phenol, then carrying out a Mannich reaction with an aldehyde (usually formaldehyde) and an aminosulfonic or aminophosphonic acid, followed by salt formation on the free acid groups, preferably using an aliphatic amino alcohol, e.g., 2-dimethylaminopropan-1-ol.Such salts may be crosslinked by heating in the presence of an aminoplast, a phenol-formaldehyde resin or a blocked polyisocyanate or, when the salts contain free methylol groups, by heating alone. They can be used for preparing coating compositions.

Abstract: Advanced epoxy resins are prepared which contain triazine groups or both triazine and oxazoline groups. When cured, these resins have higher heat distortion temperatures and/or higher elongation values than advanced epoxy resins which do not contain triazine groups or triazine and oxazoline groups.

Abstract: Epoxy resin compositions are disclosed which are the reaction products resulting from reacting (A) the reaction product of a cyanuric halide and at least one dihydric or polyhydric phenol with (B) at least one dihydric or polyhydric phenol and (C) at least one epoxy resin having an average of more than one epoxy group per molecule. These epoxy resin compositions are suitable for use as electrical laminates, structural laminates, coatings, castings, electrical encapsulation and the like.

Abstract: Phosphorus-containing epoxy resins are prepared by reacting an epoxy resin with a polyhydric phenolic compound and a phosphoramide.

Abstract: Branched epoxy novolacs having from 5 to 10 (or more) glycidyl ether groups per molecule are prepared by the epoxidation of novolacs made by the reaction of mono- or dihydric phenols with mono- or dinuclear diphenols ring-substituted with 3- or 4-methylol and/or alkoxymethyl groups.

Abstract: An epoxy resin substantially represented by the general formula ##STR1## where Ar.sup.1 is a residual group of a dihydric phenol derived from a compound having one or two benzene nuclei, Ar.sup.2 is residual group of a halogen-substituted benzenoid compound having two halogen atoms on its nuclei and represented by the formula --Ar.sup.3 --Y--Ar.sup.4 -- where each of Ar.sup.3 and Ar.sup.4 is a hydrocarbon group having a divalent benzene nucleus and Y is a sulfone group or a carbonyl group, and n is an integer of from 1 to 50.

Abstract: A thermosetting resin composition comprising (A) at least one polyfunctional epoxy compound and (B) at least one polyfunctional nitrile compound and a prepolymer thereof can give a cured product having excellent heat resistance and mechanical properties such as flexibility.

Abstract: The hydrolyzable "chloride" contents of epoxides prepared from epihalohydrins and phenols, aromatic amines or >N-H group-containing heterocycles are considerably reduced by a second dehydrochlorination step which comprises dissolving the epoxide in a solvent having the characteristics of a 1:1 by weight blend of methylethylketone and toluene and treating it with amounts of base and water ensuring a final base concentration equivalent to that of about 4 wt. % aqueous NaOH.

Abstract: A polyol for a polyurethane produced by reacting an epoxide with a reaction product obtained by reacting at least four components of (a) a phenol compound having the formula A--OH (A represents an aromatic ring having at least two reactive sites), (b) an aromatic amine having the formula B--NH.sub.2 (B represents an aromatic ring having at least two reactive sites), (c) an aldehyde and (d) an alkanolamine.

Abstract: The invention sets forth novel telechelic (terminally functional) prepolymers which may be reacted to form curable epoxides. On account of the incorporation of saturated elastomer chains into the prepolymers improved epoxides arise having increased moisture resistance and less brittleness than conventional epoxides. These prepolymers may be straight chain or three-armed star, emanating from a common phenyl ring nucleus. Molecular weights of the prepolymers range from about 700 to 50,000 (linear) and from about 1000 to about 75,000 (three-arm star). The epoxides are useful as coatings, in adhesives, as additives, and the like.

Abstract: A water based epoxy resin composition is disclosed. The epoxy resin is useful as an adhesive.The composition comprises a modified diepoxide with a latent curative in aqueous medium. The diepoxide is modified by partial reaction with a polyoxyalkyleneamine containing variable amounts of ethylene oxide.

Abstract: Epoxy resins are cured with salicyloyl hydrocarbyl amines such as N,N'-disalicyloyl-1,2-propylenediamine. The cured resins have an improvement in one or more properties such as color, tensile strength and flexural strength or improved pot life when compared to amine curing agents such as methylene dianiline.

Abstract: New epoxy resins are prepared by reacting a hydroxybenzamide or derivative thereof with an epihalo-hydrin followed by dehydrohalogenation. These epoxy resins have crystalline melting points, self-cure at elevated temperatures and cure rapidly in the presence of the usual epoxy resin curing agents. Also disclosed are hydrolyzed products of these epoxy resins and subsequent reactions with polyisocyanates.

Abstract: The invention comprises polyglycidyl ethers of tris(hydroxyphenyl)alkanes, their blends with other epoxy compounds and their cured products. The invention also comprises a process wherein the coupling reaction is carried out in the absence of coupling catalysts and solvents and the subsequent dehydrohalogenation is done in the presence of a methylethylketone/toluene mixture or an equivalent solvent. The epoxides of the invention have superior and unexpected high-temperature properties, without sacrificing other properties such as flex strength, flex modulus and the like.

Abstract: A curable epoxy resin composition of substantially improved curing time and high temperature properties comprising a polyepoxide of the formula: ##STR1## wherein R is H or an alkyl of up to about 18 carbon atoms, X is H or halogen, Y is an alkyl of up to about 18 carbon atoms or methoxy, Z' is H or CH.sub.3, m is an integer of not less than 1, n is an integer of up to 2, and from about 25 to about 120 parts by weight, per 100 parts by weight of the polyepoxide, of an epoxy resin hardener.

Abstract: Polymeric phenolic benzylic ether compositions are obtained by an intermolecular redox reaction thermolysis of tetraalkyldiphenoquinones at a minimum of about 150.degree. C. The compositions are useful as non-volatile oxidation inhibitors in polymers at high temperatures, as polymerization inhibitors for vinyl monomers, and as crosslinking co-monomers for epoxy and polycarbonate resins.

Abstract: Hardenable mixtures which contain a polyepoxide compound with, on average, more than one epoxide group in the molecule, and a hardener of the formula I ##STR1## The symbol n is an integer from 3 to 5. The methylene carbon atoms can be substituted by one or two methyl or ethyl groups.The hardenable mixtures can be used, for example, in the fields of the protection of surfaces or of adhesives technology.

Abstract: This invention is directed to latent thermal curing agents for epoxy resins comprising cyanourea compounds of the formula: ##STR1## wherein R is the organic moiety of a mono- or poly-isocyanate remaining after reaction of the isocyanate group or groups to form cyanourea groups and n is 1 or more, preferably 1 to 2. The epoxy-curing agent system is stable at room temperature and cures at temperatures above 100.degree. C. to form a crosslinked, solid material suitable as an adhesive, sealant or coating. The polymeric form polymerized from dicyanourea compound can be dissolved in a solvent and admixed with an epoxy resin to form a thermoset adhesive, sealant or coating on heating above 100.degree. C. The polymeric form from the combination of cyanourea and dicyanourea or dicyanourea per se dissolving in epoxy resin also forms a thermosetting adhesive, sealant or coating on heating above 100.degree. C.

Abstract: New epoxy resins are prepared by reacting a hydroxybenzamide or derivative thereof with an epihalohydrin followed by dehydrohalogenation. These epoxy resins have crystalline melting points, self-cure at elevated temperatures and cure rapidly in the presence of the usual epoxy resin curing agents. Also disclosed are hydrolyzed products of these epoxy resins and subsequent reactions with polyisocyanates.

Abstract: Compositions containing a relatively low equivalent weight epoxy resin and an advancement catalyst for reacting said epoxy resin with a polyhydric phenol are stable at high storage temperatures when the advancement catalyst is a phosphonium salt of phosphoric acid, phosphorous acid or polyphosphoric acid.

Abstract: A novel composition of matter capable of being cured to a solid resinous material obtained as a result of the reaction of (1) a coal derivative comprising a mixture of monocyclic, polycyclic, multifunctional carboxylic acids, resulting from the interaction of coal with nitric acid with (2) an oxirane, and a process for producing a solid resinous material therefrom by heating the same under pressure.

Abstract: A coating composition containing as essential components(A) a prepolymer of epoxy resin and polyhydroxy phenolic compound selected from the group consisting of:(i) poly-nuclear polyhydroxy phenols having adjacent hydroxy groups,(ii) polyol esters of polyhydroxy phenolic carboxylic acids having adjacent hydroxy groups,(iii) a mixture thereof, and(B) an organic hardener for epoxy resins.This coating composition can be coated on rusty metal surfaces.

Abstract: Novel unitary, storable, heat-curable epoxy resin systems are prepared which contain a polyepoxide and a curing amount of a salt of piperazine and a C.sub.3 -C.sub.21 polycarboxylic acid. In a preferred aspect the salt is present in a stoichiometric amount. The resin system is cured into an insoluble, infusible resin product by heating thereof at a temperature greater than 50.degree. C., preferably 50.degree.-250.degree. C., for a time sufficient to complete the cure.

Abstract: An epoxy resin composition which comprises (1) an epoxy resin having at least two epoxy groups per molecule and (2) an amine having at least one perfluoroalkyl group and at least one primary and/or secondary amino groups per molecule can be readily cured to afford a cured product, which shows excellent water resistance, oil resistance and stainproof property.

Abstract: Amine compounds, adaptable to use as a hardener for epoxy compounds, prepared by the reaction, with amine exchange and liberation of secondary amine, of a Mannich base and a member selected from the group consisting of aminoamides, aminoimidazolines, aminoamides containing an imidazoline group, and polyamines, said Mannich base being prepared by reacting formaldehyde, a monophenol or polyphenol, and a secondary amine are disclosed, as are a method of making epoxy polyadducts (i.e. cured epoxy resins) by the reaction of said amine hardener compounds with an epoxy compound and the epoxy polyadducts (i.e. cured epoxy resins) so prepared.

Abstract: A N-substituted piperazine or N-substituted homopiperazine adduct with a polyepoxide is used as a co-curing agent in epoxy resin systems containing a polyepoxide and a known curing agent such as dicyandiamide, a carboxylic acid anhydride, or a dihydrazide. The preferred adducts have a ratio of epoxy groups to secondary amino groups of between 1.2:1 and 3:1. The preferred polyepoxides are polyglycidyl ethers of 4,4'-isopropylidenediphenol (bisphenol A). Suitable adducts are prepared from N-methyl-, N-(2-hydroxyethyl)-, N-octyl-, N-phenyl- and N-benzyl piperazine and N-methyl homopiperazine.

Abstract: A moulding composition consisting of an epoxy resin adduct of a low molecular diglycidyl ether of bisphenols and an aromatic diamine together with a filler, an accelerator, and an aromatic polyol as hardener. Mouldings having excellent resistance to cracking can be obtained from this moulding composition.

Abstract: An epoxy resin useful for coatings, adhesives and molding materials which is derived from a by-product tar produced as by-product in manufacturing resorcinol or resorcinol and hydroquinone via hydroperoxide of m-diisopropylbenzene or of a combination of m- and p-diisopropylbenzenes and containing m-substituted phenolic constituents or a combination of m- and p-substituted phenolic constituents as major constituents, or is derived from a polymerization product of said by-product tar.

Abstract: Disclosed herein are tricyclic and pentacyclic polyamines having a secondary or tertiary amine group on an amine functional substituent and at least one primary amine group on each of two amine functional substituents in the molecule. These compounds function excellently as non-visably carbonating epoxy curing agents and in addition unlike most other amines exhibit a mild amine odor.

Abstract: Phenolic curing agents, especially suitable for use in powder coatings, are prepared by reacting a dihydric phenol (diphenylol propane), a diepoxide (liquid diglycidyl ether of diphenylol propane), and a dicarboxylic acid (adipic acid) with the phenolic functionality in excess over the difference between the epoxy functionality and the acid functionality.

Abstract: The title compounds are of the formula: ##STR1## wherein R is a chemical bond, oxygen, sulfur, alkylene or alkylidene; W is hydrogen or a (--CR.sub.1 R.sub.2 --CR.sub.3 R.sub.4 --NHR.sub.5) group with the proviso that at least two W groups are (--CH.sub.1 R.sub.2 --CR.sub.3 R.sub.4 --NHR.sub.5) groups; wherein R.sub.1 -R.sub.4 are each independently hydrogen, lower alkyl or hydroxy-substituted lower alkyl; R.sub.5 is hydrogen or a ##STR2## group, wherein R.sub.6 is hydrogen, hydrocarbyl or inertly substituted hydrocarbyl; X, Y and Z are each independently inert substituents; m and p are each independently integers of from zero to four, inclusive; n is an integer of from zero to three, inclusive; q is a number of from zero to about ten; and M is alkylene or alkylidene. They are conveniently prepared by reacting a 2-oxazoline of the formula: ##STR3## with a polyhydric polyphenol of the formula: ##STR4## in the presence of certain metal salt catalysts (e.g. zinc acetate).

Abstract: There is disclosed a class of N-alkylpolyamines and their use as curing agents for epoxy resins, and in particular to such polyamines having the formula R--[NH(CH.sub.2).sub.x ].sub.y --NHR' where R is an aliphatic hydrocarbon radical having from 5 through 8 carbon atoms, R' is H, R or R", x is an integer of 2 or 3 and y is an integer of 2-4. A monoepoxide adduct of the monoalkyl substituted polyamine is also disclosed wherein R" may then become an aliphatic substituent (2-14 carbon atoms) which may contain (a) an oxygen atom, (b) a hydroxyl group or (c) an aromatic substituent such as a phenyl ring.

Abstract: The adhesion properties of amine-cured epoxy resins are enhanced by addition of certain polyether diureide additives in combination with specific amine curing agents. The adhesively superior epoxy resin composition comprises a vincinal polyepoxide, a curing amount of an aminopropyl ethylenediamine curing agent, and an effective amount of a polyether diureide having terminal ureido or monosubstituted ureido groups and a molecular weight of from about 2000 to about 3000.

Abstract: Powder coating compositions comprise an epoxide resin and a carboxylic acid of formula ##STR1## where R.sup.1 represents a phenylene or naphthylene group or a group comprising 2 or 3 phenylene radicals linked by one or two carbon-carbon bonds, ether oxygen atoms, sulfur atoms, or sulfonyl, sulfoxide, carbonyl or alkylene groups,R.sup.2 represents a saturated alkyl group, a benzenoid group or an aralkyl group, andboth n are the same and represent zero or 1.