Abstract: A compact, volatile organic compound removal system is presented. The system has a metal condensation plate and a cooling source in intimate thermal contact with the metal condensation plate. The metal condensation plate has a channel formed in the plate, an inlet in the condensation plate for introducing a gas carrying volatile organic compound vapors into the channel, a high surface area metallic structure, such as foamed metal or metallic fins, in intimate contact with the walls of the channel, an outlet in the condensation plate for removing the gas from the channel and a drain in the condensation plate for removing volatile organic compound condensates from the channel. The cooling source cools the channel walls and the high surface area metallic structure so that the volatile organic compound vapors condense on the high surface area metallic structure to be removed from the gas.

Abstract: A thermal exchanger assembly for a wafer chuck and method of use therefor is disclosed. More particularly, complimentary manifolds, each having a plurality of fins, are positioned with respect to one another to provide interleaved spaced-apart fins. At least one thermo-electric device is disposed between alternating pairs of fins. The thermo-electric device is coupled to the fins to provide a thermally conductive path from one manifold to the other through the thermo-electric device. The thermal exchanger assembly may be located in a process chamber for processing a wafer, including but not limited to a semiconductor wafer.

Abstract: An insulated beverage cooling container for cooling and insulating a beverage. The insulated beverage cooling container includes a container having a base wall. A peripheral side wall is integrally coupled to a periphery of the base wall and extends upwardly therefrom for defining an interior space and an upper peripheral edge. The container further includes a generally horizontally orientated first intermediate face mounted to the peripheral side wall above and in general parallel orientation with the base wall for defining a first compartment. A perimeter wall is integrally coupled to and extends downwardly away from the periphery of the base wall for defining a space and a lower peripheral edge. A second intermediate face is mounted to the perimeter wall below and in general parallel orientation with the base wall for defining a second compartment and a lower peripheral edge. The second intermediate face has a plurality of holes therethrough.

Abstract: The operational range of the evaporative cooler means, particularly one chilling air and/or water to 79° F. or less when the outside ambient air temperature rises to 120° F. at a relative humidity as high as 50%, is extended by pre-cooling the intake water with a thermoelectric heating/cooling element, typically of about 5 kw. capacity. The extension of the operational range of the evaporative cooler so realized obviates, or reduces, use of an expensive parallel air conditioning system in the cooling of buildings, particularly houses, in hot but generally dry climates, such as in the inland regions of the Southwestern United States.

Abstract: A portable computer has enhanced cooling of its processor in a docked mode of operation. External cooling of the computer processor takes place using a thermoelectric cooler in the docking station which has its cold side engaged in heat conducting relation in a bottom mount configuration with a thermal port on the computer for transporting heat from the computer to a cooling mechanism in the docking station. The portable computer is a notebook computer operable in undocked and docked modes in an example embodiment.

Abstract: The present invention relates to a thermoelectric cooler, and more particularly, to a thermoelectric cooler, in which a thermoelectric module is applied to a blow system of a fan blade set and a motor, for converting a current blow system into a blow system having a cooling function with a low noise.

Abstract: A storage unit is provided for selectively heating and/or cooling items placed therein. The storage unit has a first storage compartment and a second storage compartment. A thermoelectric module is positioned in between the first and second storage compartments. The thermoelectric module regulates and maintains various desired temperatures within the storage compartments. Particularly, the thermoelectric module is capable of heating the first storage compartment and cooling the second storage compartment.

Abstract: A flexible thermoelectric module having a pair of flexible substrates, a plurality of electrically conductive contacts on one side of each of the flexible substrates, and a plurality of P-type and N-type thermoelectric elements electrically connected between opposing sides of the pair of flexible substrates having the plurality of conductive contacts where the plurality of conductive contacts connect adjacent P-type and N-type elements to each other in series and where each of the P-type and N-type elements has a first end connected to one of the plurality of conductive contacts of one of the substrates and a second end connected to one of the plurality of electrical contacts of the other of the substrates.

Abstract: Method for extracting an ingredient from plant, animal or mineral by heating water to create a vapor, contacting the ingredient under a state of decompression with the vapor, condensing the vapor by passing the vapor over one or more surfaces cooled by a thermoelectric cooler, and collecting the condensate.

Abstract: An object of the present invention is to provide a temperature control system in a simple constitution as well as be capable of strictly controlling the temperature on the side of the process device of the fluid supplied via the pathway from the chiller device.

Abstract: The internal temperature of a small, temperature-sensitive device, such as a microdrive, can be controlled using a thermoelectric unit to permit the temperature-sensitive device to be used in a wider range of installations. In particular, a thermoelectric unit is provided at the housing of the temperature-sensitive device. A Peltier thermoelectric module is advantageously used to thereby provide an environmental shell that operates in either a heating or a cooling mode.

Abstract: The electrical junctions of either or both sides of a thermoelectric module are placed in direct thermal contact with a heat source or sink or a material to be thermally modified (that is, heated or cooled), thereby eliminating the conventional substrate typically found in such modules and its associated thermal resistance. In one embodiment, the conductive junction passes through a conduit carrying a material to be heated or cooled. In the conduit, the conductive material can be configured into an effective heat transfer shape such as a vane which extends through non-conducting conduit walls. In another embodiment, the geometry of the conductor forming the electrical junction forms a pipe or tube through which material to be heated or cooled is passed. A protection layer of high thermal conductivity can be applied to the conductive surfaces in order to prevent corrosion or short-circuiting of the device in applications where an electrolytic or ionic fluid is passed by the junction.

Abstract: An improved continuous process and apparatus for treating an impure liquid to produce purified liquid, particularly, water, the process having an electrically activating a thermoelectric module to provide a first heated surface and a cooler surface; feeding the impure liquid to the first heated surface to produce vapour of the liquid; and transferring the vapour to the cooler surface to effect heat transfer to the cooler surface, the improvement being directing a minor portion of the vapour to the cooler surface to maintain the cooler surface at a temperature at or near the boiling point of the liquid; and transferring a major portion of the vapour to a condenser remote from the module to effect heat transfer and condensation of the vapour to produce the purified liquid and collecting the purified liquid from the condenser. The process is continuous in that it does not need to be intermittently stopped, or require auxiliary cooling of the module.

Abstract: A cooling mechanism and device for digital x-ray imagers. The x-ray imager is positioned on a thermal spreader plate which in turn is positioned on a thermoelectric cooler. The thermal spreader plate is the prime thermally conductive interface between the x-ray imager and the cooled surface of the thermoelectric heat pump/cooler. The device maintains the x-ray imager at a constant temperature with a small and consistent uniform temperature gradient across its bottom surface.

Abstract: A compact self-contained thermoelectric cooler (TEC) is provided by utilizing a DC to DC active power supply to provide compact size. The compactness and flatness of the DC to DC active power supply allows the unit to be completely self-contained. The compactness and flatness of the DC to DC active power supply allow the power supply assembly to be located on the hot side of the TEC. A non-planar barrier between the hot side and cold side of the TEC also provides compactness and allows the TEC to be completely self-contained. A mounting frame is disposed between the hot and cold side. The mounting frame includes a power pack cutout allowing a non-planar barrier between the hot and cold side. Electrical components of the power supply are mounted to a power pack heat sink. The power pack heat sink is attached to the mounting frame with electrical components protruding through the power pack cutout.

Abstract: A manifold having such a built-in and round thermoelectric module that is capable of coming into an efficient contact with heat exchanging media, to afford an improved efficiency of heat exchange. The module easy to manufacture has a structure facilitating the multiplication of its thermoelectric elements. The manifold (1) generally consisting of a heating side section (2) and a cooling side section (3) has a cooling side agitator (5), a heating side agitator (6), the module (7) and a motor assembly (8), all incorporated in or attached to the manifold. The module has heat transfer upright faces (50,51) so that any bubbles coming into cavities (52,55) are allowed to ascend along the faces and then leave the manifold (1) through outlets (22,43) protruding from an upper portion of the manifold. Permanent magnets (33) accompanying the agitators (5,6) act to transmit torque from one of them (6) to the other (5).

Abstract: An air conditioning unit is provided for a parked truck/boat to cool the sleeping cabin. The cabin air conditioner having a cooling unit comprising a cooling chamber with at least one insulated wall having on opposite sides there of a heat sink and a cooling block having there between thermoelectric chip(s) or a high efficient D.C. compressor or cold storage phase change material. The air conditioning unit also comprises an air intake conduit, a cool air conduit, an exhaust conduit and means of supplying power to the cooling unit. A method for cooling the. sleeping cabin through the use of the air conditioning unit disclosed in the invention is also provided.

Abstract: A thermoelectric cooling device using heat pipes for heat conducting and dispersing, comprising a multi-bundle of the heat pipe conducting plates installed at the cold end of the thermoelectric cooling member and converged to condenser, a multi-bundle of the heat pipe heat exchangers installed at the hot end of the thermoelectric cooling member with fin plates or fin stripes and converged to the evaporator. It performs a fast cooling and heat dispersing by heat pipes and high efficient phase change and heat transport of the working medium. It can eliminate the heat exchange produced by the heat accumulation on the cold and hot ends, so as to run at the minimum operation temperature differences in order to obtain the maximum cooling capacity.

Abstract: A vapor compression refrigeration system using a capillary as an expansion device has a liquid refrigerant subcooler between a condenser and the capillary which is controlled to vary the refrigerant flow.

Abstract: An apparatus for controlling the temperature of a fluid by use of a thermoelectric device comprises at least one temperature control unit, which is composed of a first heat-transfer member having at least one channel, through which the fluid flows, a pair of thermo-modules each incorporating the thermoelectric device, which are placed on opposite surfaces of the first heat-transfer member, and a pair of second heat-transfer members, each of which has a flange on its periphery and is placed on the thermo-module. The temperature control unit is stably held between a pair of holding frames each having an aperture such that each of the holding frames is pressed against the flange of the second heat-transfer member through a sealing material having elasticity, and a part of the second heat-transfer member is exposed through the aperture. This apparatus is capable of cooling the fluid without chlorofluorocarbons (CFCs) used as a coolant for conventional refrigerators.

Abstract: A water/air dual cooling method CPU cooling arrangement includes a metal water accumulator attached to the CPU to be cooled, a heat exchanger, a pump adapted to pump water through the metal water accumulator and the heat exchanger, keeping cooling water continuously circulated through the metal water accumulator to carry heat away from the CPU, a heat sink attached to the metal water accumulator, and a fan mounted on the heat sink and adapted to cause currents of air toward the heat sink.

Abstract: A self contained air conditioned seat to control the temperature climate in an air bubble generated around the seat occupant is described. It includes an air bubble at a controlled temperature for the upper body and seat of the occupant, a separate air bubble for the legs of the occupant and a controller which allows the occupant to have personal control of the temperature in the two zones. Temperature sensors are located in one or more of the tips of the am rests, the heat rest, beneath the seat bottom and in the return air ducts, to help maintain the air bubble temperature in the two zones.

Abstract: A thermal transfer comb includes numerous upwardly extending pins received in spaces around and between the sample containing wells of a well plate. Peltier effect modules are in contact with a base panel of the thermal transfer comb to apply heat to or remove heat from the comb. A heat sink and fan transfer heat from or to the modules.

Abstract: Apparatus and method for sub-ambient cooling using thermoelectric cooling in convention with dynamics conventional cooling techniques. In one form, a vapor phase cooling system provides a temperature (T) and is associated with a thermoelectric cooler. The thermoelectric cooler provides a differential temperature &Dgr;T utilizing thermodynamics such as Peltier cooling. The thermoelectric cooler therefore provides a temperature of approximately T−&Dgr;T to an object.

Abstract: A thermoelectric-cooling temperature control apparatus for a semiconductor device fabrication facility maintains a temperature condition, such as the temperature of a wafer, stable during the fabrication process.

Abstract: A cascade thermoelectric cooler designed to cool to cryogenic temperatures of 30 to 120 K integrates high performance\high-ZT BixSb2−xTe3 and Bi2Te3−xSe3-based super-lattice-structure thin-film thermoelectric devices with a bulk-material based thermoelectric cooler including plural cascaded cold stages with each successive cascaded cold stage able to cool to a progressively lower temperature. Each cold stage in the bulk-material thermoelectric cooler includes a heat source plate, a heat sink plate, a p-type thermoelectric, and a n-type thermoelectric. Moreover, the thin-film thermoelectric cooler can have multiple stages in which each stage contains a heat source plate, a heat sink plate, a p-type super-latticed thermoelectric element, and a n type super-latticed thermoelectric element.

Abstract: A multi-layer circuit board with a thermoelectric or “Peltier” cooler and a method forming a multi-layer circuit board with a thermoelectric or “Peltier” cooler is disclosed. The circuit board includes a thermoelectric cooler which is integrally formed within the circuit board and which is effective to efficiently absorb and dissipate heat from the circuit board.

Abstract: A heat dissipating apparatus includes a base member that has an upright surrounding wall portion confining a receiving space, and a top wall for closing a top side of the receiving space. The base member is adapted to be disposed on a circuit board with an integrated circuit device accommodated within the receiving space. The top wall is formed with a serpentine fluid groove that opens downwardly, and that has a fluid inlet in fluid communication with a first groove end, and a fluid outlet in fluid communication with a second groove end. A thermoelectric cooling unit is disposed in the receiving space, and has a heat-absorbing side adapted to be placed in contact with a heat-generating side of the integrated circuit device, and a heat-releasing side opposite to the heat-absorbing side. The cooling unit is adapted to separate the integrated circuit device from the fluid groove. A washer member is disposed in the receiving space below the cooling unit.

Abstract: An apparatus for a space study generates visually impressive fluffy frost effects from the controlled freezing of water. This apparatus has transparent side walls and contains thermal elements and electrodes that can be either round or planar. The thermal elements can be Peltiers. Applying a DC voltage across the electrodes controls the generation of the artful frost effects. The apparatus can also contain, displays, illuminators and other components for enhancing the visual effect.

Abstract: A thermoelectric cooling system having an electric circuit including a direct current (“d.c.”) power source providing direct current through the electric circuit, a thermoelectric module having at least one heat sink and at least one heat source capable of being cooled to a predetermined temperature range, and a control assembly. The d.c. power source, the control assembly, and the thermoelectric module being connected to each other in series. The control assembly comprising a thermostat control switch mechanism and a resistive element connected to each other in parallel. The thermostat control switch having a sensor generally coupled to the heat source of the thermoelectric module, the thermostat control switch mechanism being open in the predetermined temperature range.

Abstract: A super cooler device including a thermo electric cooler on a digital micro mirror device.

Abstract: An ice cream machine for household use employs semiconductor refrigeration to produce an efficient, compact and non-polluting appliance. The ice cream machine includes a refrigeration plate, a heat radiator, a cold container, a motor and a stirring shaft. The refrigeration plate includes a plurality of P-N junction semiconductor refrigerators. The ice cream maker includes a power supply to provide 12VDC power to the semiconductor refrigerators. A thermal guiding device conducts heat from the cold container to the refrigeration plate.

Abstract: A Peltier element 4 is fixedly brought in close contact with a surface of a heat exchange block 3 with a large heat capacity which performs heat exchange with an end portion 2a of a heat pipe 2, heat transferring means 5 is disposed on a side of the Peltier element 4 which is opposed to the heat exchange block 3, the heat pipe 2 has at least one heat conduction extending portion 2b projecting from the heat exchange block 3, and heating medium about the heat conduction extending portion 2b is temperature-controlled by the operation control of the Peltier element 4 via the heat exchange block 3 and the heat conduction extending portion 2b of the heat pipe 2.

Abstract: In a power generating mechanism, a heat sink is mounted on a CPU of a notebook PC to diffuse heat generated by the CPU. A Seebeck element module is mounted in the heat sink to cause a large difference in temperature based on heat emitted from the heat sink and ventilation carried out by a fan unit. Electromotive force obtained from the Seebeck element module is used to drive selected components of the notebook PC.

Abstract: Air traps 37a, 37b are disposed on one side adjacent at least one of suction and discharge ports of circulating pumps 14a, 14b forming a heat radiating or heat absorbing cycle. Also, the circulating pumps 14a, 14b are disposed at a level higher than heat-radiating and cooling heat exchangers 10, 20 and first and second heat exchanging portions 26a, 26b to recover air bubbles mixed therein so that the air bubbles circulated can be reduced to improve the heat efficiency.

Abstract: A hard disk system having a disk housing shock mounted in an environmental housing employs a device to transfer heat from the disk housing while avoiding any mechanical connection that would impose significant rigidity between the disk housing and the environment housing so as to defeat the shock mounting. In one embodiment, a Peltier effect heat pump has a cold side in contact with the disk housing and a hot side in contact with heat-conducting spring fingers contacting the environmental housing. In another embodiment, a fan is positioned in a space between the outside of the disk housing and the inside of the environmental housing to circulate air around the disk housing, while a Peltier effect heat pump moves heat to the environmental housing.

Abstract: A fluid temperature control device, which has a high cooling capacity, wide controllable temperature range and an excellent temperature control accuracy. A transparent cylinder (3) is inserted in a cylindrical-shaped vessel (1), and a columnar-shaped heating lamp (5) is inserted in the transparent cylinder (3). A fluid desired to be temperature controlled is made to flow in a passage (25) between the vessel (1) and the transparent cylinder (3). Joined to an outer peripheral surface of the vessel (1) is a thermoelectric conversion element (7), to an outer surface of which is joined a cooling pipe (9). A cooling liquid is made to flow in the cooling pipe (9). Fluid heating is effected by the heating lamp (5). Fluid cooling is effected by the cooling liquid and the thermoelectric conversion element (7) forcedly absorbs heat from the fluid and discharges heat to the cooling liquid to thereby cool the fluid rapidly and cool the fluid to a temperature lower than that of the cooling liquid.

Abstract: Apparatus and method for sub-ambient cooling using thermoelectric dynamics in conjunction with novel configuration schemes to maximize energy transport to thereby increase the efficiency of thermoelectric cooling. In one form, a junction maximizes energy transport being positioned between and coupled to thermoelectric elements having minimal spacing to provide efficient thermoelectric cooling.

Abstract: A cooler of an optical fiber draw tower, situated below a melting furnace for melting a preform for an optical fiber, for cooling the optical fiber drawn from the preform melted in the melting furnace, includes at least one heat exchanger installed with a predetermined length surrounding the optical fiber drawn from the melting furnace, for cooling the drawn optical fiber. The heat exchanger is formed of a thermoelectric cooler (TEC) for taking electrical energy through one heat absorbing surface to emit heat to the other heat emitting surface and has a tubular shape in which the heat absorbing surface of the TEC surrounds the optical fiber drawn from the melting furnace along the drawing direction by a predetermined length, and the drawn optical fiber is cooled as it passes through the tubular TEC. Also, the cooler further includes an auxiliary cooler attached to the heat emitting surface of the TEC, for cooling the emitted heat.

Abstract: A heat exchanger for executing heat exchange between heat exchange between heat exchange bodies (6) on a heat radiation side and heat exchange bodies (3) on a heat absorption side, having low thermal resistance and high performance of heat conduction includes heat exchange bodies 6 on a heat radiation side and heat exchange bodies 3 on a heat absorption side, each being disposed hierarchically, thermoelectric conversion element modules 2 interposed between the heat exchange body 6 on the heat radiation side and the heat exchange body 3 on the heat absorption side through an insulating coat 16, and having a plurality of thermoelectric conversion elements 12, 13, wherein the insulating coat 16 is formed integrally on a surface of at least one of the heat exchange body 6 on the heat radiation side and the heat exchange body 3 on the heat absorption side, and a metal coat 17 keeping electric contact with a surface of the thermoelectric conversion elements 12, 13 on either the heat radiation side or the heat absor

Abstract: In a radiator assembly of a water cooled engine driven vehicle, heating is performed by a compartment heat exchanger. As long as the temperature of the cooling water is low, it does not suffice to sufficiently heat by compartment heat exchanger shortly after engine start and an auxiliary heating equipment is used. The auxiliary heating equipment includes a heat exchanger at the heating side, a heat exchanger at the endothermic side and a Peltier element. The Peltier element leads to high energy efficiency because it provides a quantity of heat which is more than the quantity of energy charged into the Peltier element, since it transfers Joule heat generated by the charge energy to the heat exchanger and further transfers a quantity of heat to heat exchanger as absorbed in a heat exchanger at the endothermic side from an endothermic surface of the Peltier element by a Peltier effect to the exothermic side.

Abstract: An object of the present invention is to provide a temperature control system in a simple constitution as well as be capable of strictly controlling the temperature on the side of the process device of the fluid supplied via the pathway from the chiller device.

Abstract: A cooling assembly for an integrated circuit chip module wherein an evaporator-cooled IC module is enclosed within an insulated housing which is surrounded by an atmosphere of dehumidified air.

Abstract: A computer (2) has a plurality of heat-producing components, including a microprocessor chip (10). A heat transfer device (22) through which a liquid coolant (C) is circulated is mounted in heat exchanging contact on the component (10). The device (22) may be mounted directly or via a Peltier thermoelectric cooler (14) positioned between the component (10) and the device (22). Coolant (C) from the device (22) is circulated to and through a reservoir (42) mounted on an inner mounting surface (38) of a radiator (34). The radiator (34) has heat dissipating fins (40) exposed to ambient air. The power supply (6) of the computer (2) is mounted directly on the mounting surface (38) so that heat produced by the power supply (6) will be dissipated by the radiator (34). Preferably, a plurality of transistors (66) of the power supply (6) are mounted on the mounting surface (38) separately from the mounting board (64) of the power supply 6).

Abstract: A cooling assembly for an integrated circuit chip module wherein a spot cooling evaporator is mounted on the hat of the module in a position opposite the integrated chip within the module.

Abstract: A thermoelectric element (1) comprises a partitioning plate (2) having electrical insulating properties; equal numbers of p-type thermoelectric semiconductor elements (3A) and n-type thermoelectric semiconductor elements (3B) fixed to the partitioning plate (2) in a state in which they pass through the partitioning plate (2); flat copper electrodes (4) fixed to upper sides of the p-type thermoelectric semiconductor elements (3A) and n-type thermoelectric semiconductor elements (3B); and T-shaped copper electrodes (5) fixed to lower sides of the p-type thermoelectric semiconductor elements (3A) and n-type thermoelectric semiconductor elements (3B). Lower portions protruding from the lower surface of the partitioning plate (2) are accommodated within a cooling vessel and are cooled directly by a coolant or air.

Abstract: A System for capturing, storing and delivering energy, comprises a capture means (1; 9; 15) for capturing energy; storage means (22) for storing captured energy; and charging means (20, 21; 23, 24, 25, 26) for charging said captured energy into said storage means (22), wherein said capture means (1; 9; 15) provides electrical energy and said storage means is an electrolyte-based rechargeable battery (22) in which the electrolyte comprises adenosine triphosphate (ATP). A Solar panel (1; 9; 15) used in this system comprises reflectors (2, 3; 7, 8) directing reflected photons onto the panel (1; 9).

Abstract: An electronic appliance includes a heat-dissipating apparatus mounted in a housing that has a heat-producing electronic component disposed therein. The heat-dissipating apparatus includes a thermoelectric semiconductor module operable so as to provide low and high temperature surfaces, a cool air blower unit including a first fan casing in heat-conductive contact with the low temperature surface, and a hot air exhaust unit including a second fan casing in heat-conductive contact with the high temperature surface. The cool air blower unit further includes a first fan mounted in the first fan casing and operable so as to draw air into the first fan casing via a first air inlet and so as to blow the air out of the first fan casing via a first air outlet. The air passing from the first air inlet to the first air outlet is cooled when the thermoelectric semiconductor module is operated due to contact between the first fan casing and the low temperature surface.

Abstract: The present invention is a thermoelectric device and method designed to create a martensitic state in a shape memory alloy. The invention allows for prolonged use without overheating, and is more less expensive and easier to use than current art. The device is comprised of a cooling tip that is made of a thermally conductive material in contact with the thermoelectric module powered by an external DC converter. A heat sink is in thermal contact with the heating face of the module with cooling fins to draw heat away from the module. A continuous supply of cooling gas or liquid flows over the cooling fins or liquid channels to further cool the module. The DC power supply is controlled by a pneumatic device that will only operate under positive gas pressure, thus ensuring proper cooling of the heat sink of the invention. The cooling tip extends from the front end of an insulating body, the body having a threaded chucking hold for easy removal and changeout of the cooling tip.

Abstract: With an object to provide a thermoelectric converter excellent in performance, this invention provides a thermoelectric converter provided with a first thermal converter 1, a blocked second thermal conductor 2 connected to a predetermined position of the first conductor 1, a frame 6 made of a synthetic resin and surrounding the second conductor 2, a thermally-conductive substrate 5 with the frame 6 fixed at a basal end portion 8 thereof on the substrate and also with a group of thermoelectric elements 4 supported inside the substrate, and a heat-insulating layer 31 interposed between the first thermal conductor 1 and the thermally-conductive substrate 5 such that the frame 6 is surrounded at an outer periphery thereof by the heat-insulating layer. The second thermal conductor 2 and the thermally-conductive substrate 5 are opposing each other and are maintained in close contact with each other via the group of thermoelectric elements 4.