Abstract: A thermoelectric cooling system integrating quantum cold point connections with lateral thermoelectric element formation. A preferred system has an n-type and p-type thermoelectric element, each connected to a common conducting section. The thermoelectric elements are each tapered at the end where they contact the common conducting section. The thermoelectric elements preferably all occupy substantially the same plane as each other and as the common conducting section.

Abstract: Described herein is a temperature control system for cooling magnetic elements (14) in MRI apparatus (10). The control system comprises a wax (16) in contact with the elements (14) which is substantially maintained at its phase transition temperature between a solid state and a liquid state, but in a substantially solid state. A sensor (18) is immersed in the wax (16) and operates to provide a signal on the change of state of the wax (16). The sensor (18) is connected to a controller (20) which controls the operation of a heating element (26) also immersed in the wax (16) to control the temperature thereof. When the MRI apparatus is operational, heat is generated by the magnetic elements (14) is used to change the wax (16) to a liquid, this change being detected by the sensor (18) which sends signals to the controller (20) to turn off the heating element (26).

Abstract: A cascade thermoelectric cooler designed to cool to cryogenic temperatures of 30 to 120 K integrates high performance\high-ZT BixSb2−xTe3 and Bi2Te3−xSe3-based super-lattice-structure thin-film thermoelectric devices with a bulk-material based thermoelectric cooler including plural cascaded cold stages with each successive cascaded cold stage able to cool to a progressively lower temperature. Each cold stage in the bulk-material thermoelectric cooler includes a heat source plate, a heat sink plate, a p-type thermoelectric, and a n-type thermoelectric. Moreover, the thin-film thermoelectric cooler can have multiple stages in which each stage contains a heat source plate, a heat sink plate, a p-type super-latticed thermoelectric element, and a n type super-latticed thermoelectric element.

Abstract: A super cooler device including a thermo electric cooler on a digital micro mirror device.

Abstract: A cascade thermoelectric cooler designed to cool to cryogenic temperatures of 30 to 120 K. integrates high performance\high-ZT BixSb2−xTe3 and Bi2Te3−xSe3 based super-lattice-structure thin-film thermoelectric devices with a bulk-material based thermoelectric cooler including plural cascaded cold stages with each successive cascaded cold stage able to cool to a progressively lower temperature. Each cold stage in the bulk-material thermoelectric cooler includes a heat source plate, a heat sink plate, a p-type thermoelectric, and a n-type thermoelectric. Moreover, the thin-film thermoelectric cooler can have multiple stages in which each stage contains a heat source plate, a heat sink plate, a p-type super-latticed thermoelectric element, and a n type super-latticed thermoelectric element.

Abstract: An apparatus for cooling selected elements within an integrated circuit, such as active transistors or passive circuit elements used in a radio frequency integrated circuit is provided. In one embodiment, the cooling apparatus includes a cold plate thermally coupled to the region proximate the integrated circuit element, a thermoelectric cooler thermally coupled to the cold plate; and a hot plate thermally coupled to the thermoelectric cooler. Heat is removed from the integrated circuit element through the cold plate and transmitted to the hot plate through the thermoelectric cooler. In one form, the hot plate is located or coupled to an exterior surface of an integrated circuit, such that heat transmitted to the ambient from the integrated circuit element is dissipated into the atmosphere surrounding the integrated circuit. In another form, the hot plate is embedded in the integrated circuit substrate to locally cool elements of the integrated circuit while dumping the heat into the substrate.

Abstract: The preferred embodiment describes a regulating device (400) that regulates current flow through a thermoelectric cooler (TEC) (420) with higher power efficiency than conventional regulating methods. The regulating device includes a voltage controller (415) that receives an input voltage from a comparator (435) that has determined whether there has been a change in temperature surrounding a temperature sensitive device, such as a laser, by way of a thermistor (425). The controller (415) then controls two pulse width modulated (PWM) synchronous rectifiers (405, 410). The combination of the controller (415) and the synchronous rectifiers (405, 410) improves the power efficiency of the regulating device (400). Each PWM synchronous rectifier (405, 410) includes two field effect transistors (FETs) that supply substantially a constant current flow through the TEC (420) to either heat or cool a control surface (430).

Abstract: An apparatus and method for actively reducing the temperature gradient of a substrate. The substrate is placed in thermal contact with a heat dissipation structure so as to dissipate heat from the substrate. Current is passed through a thermoelectric device, so as to provide cooling to at least one hot spot on the substrate.

Abstract: A combination of a computer and an external heat transfer module to improve the heat removing capability of a computer's internal heat removal system, the combination includes a computer with a thermal interface port connected to the computer's internal heat removal system and a heat transfer module connected to the thermal interface port. The heat transfer module has a heat dissipation component and at least one heat transfer conduit having one end thermally coupled to the computer's internal heat removal system, and the other end thermally coupled to the heat dissipation component.

Abstract: A method and apparatus for cooling an electric motor is provided. The enclosure is adapted to house the internal components of an electric motor and protect the internal components of the electric motor from an external environment. The enclosure can be the actual shell of an electric motor or a separate housing. A thermoelectric cooling device is disposed between the interior of the enclosure and the external environment. An electric current is delivered to the thermoelectric cooling device to facilitate the transfer of heat from the enclosure interior to the external environment, thereby cooling the enclosure interior.

Abstract: The present invention relates to a thermoelectric cooler, and more particularly, to a thermoelectric cooler, in which a thermoelectric module is applied to a blow system of a fan blade set and a motor, for converting a current blow system into a blow system having a cooling function with a low noise. To do this, the present invention provides a thermoelectric cooler including a thermoelectric module having thermoelectric elements each for absorbing or dissipating a heat at a junction of two different metal depending on a direction of a current flowing through the junction, a fan blade set for blowing air cooled at a heat absorption side of the thermoelectric module to a desired place, and a motor for giving a rotating force to the fan blade set.

Abstract: A fluid conduit includes a hollow inner tube which is made of a heat-conducting material and which confines a first chamber, and a hollow outer tube which is made of a heat-conducting material, which is disposed concentrically around the inner tube, and which cooperates with the inner tube to form a second chamber. One of the first and second chambers is adapted to permit passage of fluid therethrough. The other one of the first and second chambers has opposing closed ends, and is filled with a superconductor material so as to provide the fluid conduit with an enhanced thermal conducting ability.

Abstract: A thermoelectric apparatus includes a power source, a body having a first side and a second with a defined perimeter where the first side and the second side are separated by a gap. It further includes an insulation means for providing a thermal barrier, a cooling means placed between the first side and the second side for cooling an object and a connecting means for securing the body into a defined shape around an object. A method of operating a thermoelectric apparatus includes wrapping a body around an object, with the body having a first side and a second side, a defined perimeter and the first side and second side separated by a gap containing an insulation means that forms a thermal barrier. Another step is engaging a connecting means for securing said body into a defined shape around the object, engaging a power source and then operating a cooling means placed between the first side and second side of the body in the gap for cooling the object.

Abstract: A heat exchanger using thermoelectric structures is provided for cooling a heat generating component of an electronic device. The heat exchanger includes a row of spaced passages, for example, formed by two or more separate tubes or a single coiled tube, for carrying a first cooling fluid. The heat exchanger further includes a thermoelectric structure disposed between adjacent spaced passages and exposed to a second cooling fluid. In one embodiment, the heat exchange also includes fins disposed between the same adjacent spaced passages so that the thermoelectric structure is disposed between the adjacent passages and the fins.

Abstract: An optoelectronic device comprising a laser and a lens for generating collimated light, a locker including an etalon for wavelength locking the collimated light, a first thermoelectric cooler coupled to the laser, and a second thermoelectric cooler coupled to the locker, wherein the first and second thermo-electric coolers arc independently controlled and the second thermo-electric cooler provides for temperature tuning of the etalon.

Abstract: An improved efficiency thermoelectric system and method of making such a thermoelectric system are disclosed. Significant thermal isolation between thermoelectric elements in at least one direction across a thermoelectric system provides increased efficiency over conventional thermoelectric arrays. Significant thermal isolation is also provided for at least one heat exchanger coupled to the thermoelectric elements. In one embodiment, the properties, such as resistance or current flow, of the thermoelectric elements may also be varied in at least one direction across a thermoelectric array. In addition, the mechanical configuration of the thermoelectric elements may be varied, in one embodiment, according to dynamic adjustment criteria.

Abstract: The temperature of a Peltier element is regulated by two control loops. In the ranges where only heating or only cooling are intended to be carried out, the regulation is provided via a voltage converter. In the critical operating range which covers the transition between heating and cooling, a low operating voltage is converted to a drive AC voltage with the aid of a polarity reversal switch and both heating and cooling are carried out, depending on the polarity. The temperature is then regulated by varying the duty ratio.

Abstract: A securing apparatus is used to secure an electronic component, such as a thermoelectric cooler in a thermoelectric cooling system. The securing apparatus includes a clamping mechanism that clamps the electronic component between a first plate, such as a heat sink plate, and a second plate, such as a mounting plate. The clamping mechanism applies compression forces to the electronic component to secure the electronic component without using shear forces capable of damaging the electronic component. The clamping mechanism preferably provides thermal isolation between the heat sink plate and the mounting plate.

Abstract: A sealing member for a thermoelectric assembly includes an elastomeric body having one or more apertures formed therethrough for sealingly receiving an electrical wire projecting from the thermoelectric module. Sealing engagement between each electrical wire and each aperture may be enhanced by the use of a sealing agent, or by molding the wire, its sheath or a wire connector to each aperture. Preferably, a pair of wire guides project from the sealing member, each having a central channel in substantial registry with one of the apertures and providing additional surface area for wire support which reduces any tendency to create spaces between the wires and apertures. The sealing member may include one or more peripheral channels to capture water vapor, one or more indexing guides which receive fasteners from the assembly to locate the sealing member therein, as well as insulative filler material, and/or a central insulative channel.

Abstract: A thermoelectric sleeve-type beverage insulator apparatus with a printable sleeve-type insulated jacket with a rigid enclosure mean, a thermoelectric engine assembly incorporated into the sleeve-type insulated jacket, an electrical connection mean connected to the thermoelectric engine assembly and secured to the rigid enclosure mean of the sleeve-type insulated jacket, a support base with mechanical connection mean and electrical connection mean, and an electrical power transmission mean between a power source and the support base. A preferred embodiment includes the printable sleeve-type insulated jacket that is made of printable tubular foam insulating member having an open top and closed base, an inner surface and partially exposed outer surface, a longitudinal groove on the inner surface reaching from the open top to the closed base and extending to the radial middle of the closed base, where the printable tubular foam insulating member allows use of the apparatus as an advertising medium.

Abstract: A support element is described which can combine components used in Microsystems technology to form a single unit. Because of the very small dimensions of the support element, it is difficult to keep the components at different temperatures if this is required for them to operate. With the support element, this difficulty is avoided by the fact that at least one thermal insulation device, which shields the plate and the cover of the support element with respect to internal and external environments in certain regions, is provided.

Abstract: A super cooler device including a thermo electric cooler on a digital micro mirror device.

Abstract: Solid state thermioninc refrigerators with elements having at least one barrier segment connected to wire-equivalent segments. The barrier segment has solid state regions that establish a potential energy barrier to electric carriers. This barrier is such that the circulation of a negative electrical charge from one of such regions to another region experiences an increasing potential energy. Elements can be superconducting or nonsuperconducting. Elements can also include an inverse barrier.

Abstract: A low-cost thermoelectric module utilizing a greatly reduced quantity of thermoelectric material as compared to similar prior art thermoelectric modules. An egg crate design containing thermoelectric elements is utilized in the present invention. However, the walls of the egg crate in the parts of the module separating the thermoelectric elements are made thick so that the total cross sectional area of the elements is less than 75 percent of the total module cross sectional area. The spaces above and below the elements are filled with a high heat and electric conducting material such as aluminum. This produces funnel-shaped conductors funneling heat and electric current into and out of each of the thermoelectric elements. The payoff to this approach is that the heat flux through the hot and cold module surfaces can be maintained while producing the same power output with about half the thermoelectric material or less.

Abstract: A cryoprobe system utilizing a monolithic, insulated, hand-held thermal mass having an exposed tip for cryosurgical applications and the like, as well as a heat extraction base configured to interface with the thermal mass to quickly and efficiently reduce the heat of the thermal mass to cryogenic temperatures. The heat extraction base of the preferred embodiment of the present invention is configured to interface with the tip of the thermal mass, such that the tip plugs in securely to the base, to permit an efficient thermal transfer of heat from the thermal mass through the base via a heat exchange system communicating with the base which employs a low temperature cryo-refrigeration unit.

Abstract: A device and method for controlling the temperature of a semiconductor module in which the semiconductor module is sandwiched by a first supporting unit and a second supporting unit. An area of the second supporting unit with which the semiconductor module comes into contact is shielded from heat of external ambient atmosphere, and has a temperature sensor provided thereat. The temperature of the first supporting unit is controlled so that the temperature of this area becomes equal to a predetermined temperature. The amount of heat moving from the heat-shielded area to the semiconductor module is small, so that the difference between the temperatures in the region extending from the heat-shielded area and the semiconductor module is small. The first and second supporting units may be separately controlled at different predetermined temperatures. By this, changes in the temperature of the semiconductor module caused by changes in outside air temperature are reduced.

Abstract: A high-strength, single-staged, composite thermoelectric cooler (18) for stabilizing the temperature of an uncooled, infrared detector (16) comprising a pair of ceramic plates (20, 22), a plurality of thermoelectric elements (24) sandwiched between the plates (20, 22) such that the thermoelectric elements (24) and the ceramic plates (20, 22) define a plurality of chambers (26), and a thermoelectric insulator (28) which substantially fills the chambers (26) inside the thermoelectric cooler (18) forming a high-strength composite structure with the thermoelectric elements (24) and the ceramic plates (20, 22).

Abstract: A thermal exchanger assembly for a wafer chuck and method of use therefor is disclosed. More particularly, complimentary manifolds, each having a plurality of fins, are positioned with respect to one another to provide interleaved spaced-apart fins. At least one thermo-electric device is disposed between alternating pairs of fins. The thermo-electric device is coupled to the fins to provide a thermally conductive path from one manifold to the other through the thermo-electric device. The thermal exchanger assembly may be located in a process chamber for processing a wafer, including but not limited to a semiconductor wafer.

Abstract: A cascade thermoelectric cooler designed to cool to cryogenic temperatures of 30 to 120 K integrates high performance\high-ZT BixSb2−xTe3 and Bi2Te3−xSe3-based super-lattice-structure thin-film thermoelectric devices with a bulk-material based thermoelectric cooler including plural cascaded cold stages with each successive cascaded cold stage able to cool to a progressively lower temperature. Each cold stage in the bulk-material thermoelectric cooler includes a heat source plate, a heat sink plate, a p-type thermoelectric, and a n-type thermoelectric. Moreover, the thin-film thermoelectric cooler can have multiple stages in which each stage contains a heat source plate, a heat sink plate, a p-type super-latticed thermoelectric element, and a n type super-latticed thermoelectric element.

Abstract: A thermoelectric cooler and a system and method for fabricating the thermoelectric cooler are provided. In one embodiment, the thermoelectric cooler includes a first magnetic element, a second magnetic element composed of magnetic or magnetically susceptible material, a first thermoelectric sub-component, and a second thermoelectric sub-component. The first thermoelectric sub-component and the second thermoelectric sub-component are situated between the first and second magnetic elements. The first and second magnetic elements are selected such that a compressive force is exerted on the first and second thermoelectric elements. The magnetic elements are selected and adjusted in magnetic attraction such that the force exerted on the first and second thermoelectric elements establishes and maintains a contact of selected pressure between the first and second thermoelectric sub-components.

Abstract: A multi-layer circuit board with heat pipes and a method forming a multi-layer circuit board with heat pipes is disclosed. The circuit board includes a heat pump which communicates with the heat pipe to circulate an amount of cooling material within the heat pipe effective to efficiently dissipate heat from the circuit board.

Abstract: A cryogenic inertial Micro-Electro-Mechanical System (MEMS) device is provided. The device may include a vibratory gyroscope operable to sense a rotational acceleration. The device may also include a pre-amplifier co-located in a close proximity to the vibratory gyroscope. The device may be operated at substantially low temperatures, such as cryogenic temperatures, to reduce electrical noise and improve stability of outputs of the system.

Abstract: In an apparatus for conducting thermal energy, a thermoelectric unit in thermal communication with a thermal conductor is electrically operable so as to operate in a heat-absorbing mode, where the thermoelectric unit absorbs heat from the thermal conductor to reduce temperature of the thermal conductor, and a heat-radiating mode, where the thermoelectric unit radiates heat to the thermal conductor. A processor is operable so as to enable a power control circuit to control supply of electric power to the thermoelectric unit according to temperature of the thermal conductor and the thermoelectric unit sensed by a temperature sensor when the thermoelectric unit is operated in a selected one of the heat-absorbing mode and the heat-radiating mode.

Abstract: A temperature controlled drawer assembly incorporates a thermoelectric device and a control system to selectively heat or cool the contents of a drawer which is selectively movable into and out of a cabinet designed to be part of an end table, such as a nightstand, or other cabinet remote from a household kitchen. In a cooling mode of operation, a fan, disposed in the cabinet, draws air from inside the drawer and blows the air over a cold side of a heat sink to cool the air. The treated air is blown through plenums, back into the drawer. At the same time, heat is drawn away from the cold side and directed out of the cabinet. The current through the heat sink may be reversed to flip the cold and hot sides of the heat sink to enable the contents of the drawer to be heated.

Abstract: A freezing sucker has a base plate, a main panel disposed on the base plate, a plurality of chilling chips disposed on the main panel, a top plate disposed on the chilling chips, and a plurality of temperature sensors disposed between the main panel and the top plate. A freezing machine has a controller and a control panel. A connector is connected to the main panel. A water pipe is connected to the connector and the freezing machine.

Abstract: An indirect thermoelectric cooling device comprises a thermoelectric cooling plate, in the indirect thermoelectric cooling device, a heat dispersing member is connected to the hot end of the thermoelectric cooling plate, and a cooling transmitting member is connected to the cold end of the thermoelectric cooling plate, characterized in that an inside mid-frame is provided between the heat dispersing member and cooling transmitting member, an outside mid-frame which is of a shape of sleeve is provided to surround the inside mid-frame, and the thermoelectric cooling plate is sandwiched between the inside mid-frame and the outside mid-frame. According to the present invention, there exist less connecting portions in the route of the cold or hot gas transferring, thus decreasing the heat resistant, and increasing the cooling or heating transmit efficiency, so that the heat dispersing and the cooling transmitting can be both realized in the same device.

Abstract: The present invention is directed to method and apparatuses for modifying the air of a localized zone to suit personal comfort. This invention includes the heating or cooling of the air in the localized zone with a novel apparatus and inhibiting the concurrent release of byproduct air at undesirable temperatures while using a heat pump. The apparatus includes a thermal storage mass that provides a reservoir for the undesirable heating or cooling effects for later restoration. This restoration would occur at a predetermined time in predetermined amounts, typically when the localized zone is unoccupied.

Abstract: An apparatus for quick freezing tissue specimens has the advantage of precise predictable embedding orientation. The apparatus includes embedding wells, chucks and over-chuck cooling blocks. Additional components include a cooled cutting board, freezing plate griddle and elevated freezing block. Tools created to use with the system include a dislodging bar, a spatula/pry tool, a dispensing slide and a flattening tool. The combination of these elements function at −25 to −30 degrees C. to precisely prepare tissue specimens for frozen sectioning. The apparatus can be cooled and adapted by several methods: (1) as a stand-alone bench top cryoembedding station refrigerated by compressor and Peltier devices: (2) as modular portable units cooled in a separate refrigeration device such as a cryostat or freezer; and (3) built into cryostat work chambers as part of the internal embedding center.

Abstract: A high performance thermoelectric system is taught which is capable of rapidly cooling a thermal load with a thermoelectric module. A thermal ballast is in simultaneous thermal communication with both the thermoelectric module and the thermal load, and compensates for the difference between the characteristics of the thermoelectric module and the demands of the thermal load, allowing a thermoelectric module to handle significantly larger thermal loads than would normally be possible, albeit for a reduced period of time. Also taught is a means to implement a demand cooler for drinking water. Also taught is a means to implement a high performance cooler for removable fluid containers, adaptable to the rapid cooling of wine bottles and the like.

Abstract: A self contained air conditioned seat to control the temperature climate in an air bubble generated around the seat occupant is described. It includes an air bubble at a controlled temperature for the upper body and seat of the occupant, a separate air bubble for the legs of the occupant and a controller which allows the occupant to have personal control of the temperature in the two zones. Temperature sensors are located in one or more of the tips of the arm rests, the heat rest, beneath the seat bottom and in the return air ducts, to help maintain the air bubble temperature in the two zones.

Abstract: In a thermoelectric device such as a thermoelectric manifold having a plurality of stages of thermoelectric modules, not only are distributions of heat at endothermic and exothermic surfaces equalized to increase the heat exchange efficiency and also to suppress thermal strains in the thermoelectric modules, but also heat transmission between the thermoelectric modules is facilitated even though bowing occurs. For this purpose, in the thermoelectric device utilizing the plural thermoelectric modules, a fluid serving as a heat transfer medium is intervened between the thermoelectric modules and is utilized to achieve a transmission of heat from the exothermic surface of the thermoelectric module on a cooling side to the endothermic surface of the thermoelectric module on a heating side.

Abstract: Heat dissipating IC devices including at least one IC die comprising a semiconductor substrate with circuitry which utilize thermoelectric effects to more effectively dissipate thermal energy from electronic circuits.

Abstract: A gas-flow heat exchanger comprising a set of parallel, spaced, heat-conductive areas providing between them a stack of pockets each containing parallel baffles (24) which define a platen of passageways (26) guiding the gas-flow path through the pocket between inlet and outlet openings (22, 23). The openings being arranged in four parallel lines at the sides of the stack, two of the lines respectively containing the inlet and outlet openings (22, 23) associated with the gas flow paths of alternative pockets. The remaining two lines respectively containing the inlet and outlet openings associated with the remaining pockets. Each pocket containing a removable frame (21) formed with the openings provided at the ends of the gas flow path through it and supporting within the frame the parallel baffles (24) which divide the gas-flow path into the platen of passageways (26). All of the passageways (26) provide a substantially equal dwell time to gas passing therethrough.

Abstract: An air conditioning unit is provided for a parked truck/boat to cool the sleeping cabin. The cabin air conditioner having a cooling unit comprising a cooling chamber with at least one insulated wall having on opposite sides there of a heat sink and a cooling block having there between thermoelectric chip(s) or a high efficient D.C. compressor or cold storage phase change material. The air conditioning unit also comprises an air intake conduit, a cool air conduit, an exhaust conduit and means of supplying power to the cooling unit. A method for cooling the. sleeping cabin through the use of the air conditioning unit disclosed in the invention is also provided.

Abstract: A contained beverage cooling apparatus for cooling and keeping cool a beverage placed in the apparatus. The contained beverage cooling apparatus includes a housing. The housing has a bottom wall and a top wall. A peripheral side wall extends between and is integrally coupled to a periphery of the top and bottom walls. The housing has a front side and a back side. The top wall has a hole therein for receiving a cylindrical can or cup. The hole is positioned generally adjacent to the front side of the housing. A cooling means for cooling a beverage placed in the hole includes a duct. The duct has an open first end and an open second end. The duct is positioned in a spaced relationship with the top wall such that the second end extends away from the back side of the housing. A first heat sink is securely attached to an interior of the top wall. A second heat sink is securely mounted to an interior surface of the duct. A thermo-electric device is positioned between the duct and the top wall.

Abstract: An improved read/write head for use in computer hard drives is provided. In one embodiment, the read/write head includes first and second thermally conducting plates and a first and second stage of microcoolers. The second thermally conducting plate is thermally coupled to a read sensor of the read/write head. The second microcooler includes a hot plate and a cold plate, wherein the cold plate extends proximate the read sensor so as to cool the sensor to ambient or below temperatures. The first thermally conducting plate extends between the write coil and the read sensor in the read/write head and is thermally coupled to the hot plate of the second microcooler. The hot plate of the first microcooler is thermally coupled to one or more heat dissipation elements.

Abstract: A super cooler device including a thermo electric cooler on a digital micro mirror device.

Abstract: A heat exchanger 17 for an electronic heat pump 11 includes a thermally conductive base plate 18 having first and second surfaces, the first surface being flat and adapted to make intimate surface contact with a surface of the electronic heat pump and the second surface being obverse to the first surface and supporting an array of thermally conductive fins 21. The adjacent fins 21 define there between a plurality of micro channels.

Abstract: An apparatus for cooling selected elements within an integrated circuit, such as active transistors or passive circuit elements used in a radio frequency integrated circuit is provided. In one embodiment, the cooling apparatus includes a cold plate thermally coupled to the region proximate the integrated circuit element, a thermoelectric cooler thermally coupled to the cold plate; and a hot plate thermally coupled to the thermoelectric cooler. Heat is removed from the integrated circuit element through the cold plate and transmitted to the hot plate through the thermoelectric cooler. In one form, the hot plate is located or coupled to an exterior surface of an integrated circuit, such that heat transmitted to the ambient from the integrated circuit element is dissipated into the atmosphere surrounding the integrated circuit. In another form, the hot plate is embedded in the integrated circuit substrate to locally cool elements of the integrated circuit while dumping the heat into the substrate.

Abstract: A super cooler device including a thermo electric cooler on a digital micro mirror device.