Abstract: A super cooler device including a thermo electric cooler on a digital micro mirror device.

Abstract: A compact, energy efficient blower that is controlled by a Peltier thermoelectric device to supply either hot or cold air. The Peltier device is sandwiched between a pair of heat exchangers that are surrounded by a plastic enclosure. Each heat exchanger includes a plurality of parallel aligned thermal energy conducting fins that are folded to maximize the surface area thereof. A fan is mounted atop the enclosure to pump a first supply of intake air through a first air flow path in a first heat exchanger at one side of the Peltier device to exhaust the waste energy emitted by the Peltier device and collected by the first heat exchanger. The fan also pumps a second supply of intake air through a second air flow path in the second heat exchanger at the opposite side of the Peltier device to blow the useful energy emitted by the Peltier device and collected by the second heat exchanger to an application device or a space within which the blower is located.

Abstract: A super cooler device including a thermo electric cooler on a digital micro mirror device.

Abstract: A device for storage of an opened food container such as a wine container. The device includes a housing for receiving the opened food container in a substantially vertical orientation. A poppet valve assembly is provided for insertion in an opening in the opened food container and biased to enable it to accommodate opened food containers of varying sizes. The device includes a pressurized source of heaver-than-air inert gas located within the housing, a regulator for reducing the pressure of the inert gas from a first pressure at the pressurized source of the heavier-than-air inert gas to second pressure at the poppet valve assembly. The poppet valve assembly also includes a spring-loaded check ball, low-pass port, shuttle and orifice to control pressure and flow path of the heavier-than-air inert gas and to direct the heavier-than-air inert gas to the opened food container thus displacing any air that may have been present therein through an exhaust port.

Abstract: A temperature controlled storage container integrated into the trim member of a vehicle comprising a storage container integrated into said trim member. A thermoelectric heat pump is employed to provide temperature control to the storage container and to selectively heat or cool the container. Optionally, a duct is added that is in communication with the thermoelectric heat pump wherein the duct is also in communication with air intake resulting from motion of the vehicle and wherein the duct is also capable of venting outside of said vehicle.

Abstract: A food chiller including an enclosed container supported on a base receives a flow of cooling air from a Peltier effect thermoelectric module in the base through cool air inlet openings into the container. Air is returned from the container to the base by a fan mounted in the air duct system in communication with the cold sink of the thermoelectric device. In each of the disclosed embodiments, duct length is minimized and air flow into the container is optimized by air hole placement and orientation.

Abstract: Apparatus is disclosed for providing auxiliary cooling and thermal stability to a temperature sensitive opto-electronic component. The disclosed apparatus comprising a primary thermal control system having a first thermal connection with a primary structure supporting at least one component of an optical system and a second thermal connection being thermally connected with an external environment; and an auxiliary thermal control system having a first thermal connection being thermally connected with the temperature sensitive opto-electronic component, and the auxiliary thermal control system having a second thermal connection being thermally connected with the primary thermal control system whereby the auxiliary thermal control system provides cooling to the temperature sensitive opto-electronic component and the primary thermal control system provides additional cooling to the auxiliary thermal control system through temperature regulation of the primary structure.

Abstract: A docking station is provided with a thermoelectric module to generate cool air of a first temperature to be fed into a docked computer.

Abstract: Apparatus and methods in accordance with the present invention utilize thermoelectric cooling (TEC) technology to provide enhanced power distribution and/or dissipation from a microelectronic die and/or microelectronic packages. Individual TEC devices are thermally interconnected with the microelectronic die in a number of placement configurations, including between the microelectronic die and the heat sink, on the integrated heat spreader (IHS) inner surface, and on the IHS outer surface. TEC devices comprise p- and n-type semiconducting material created using similar process as the microcircuits. The TEC devices are located in various regions within or on the microelectronic die, including directly below the microcircuits, on the backside of the microelectronic die, and on a separate substrate of microelectronic die material fabricated apart from the microelectronic die and subsequently thermally coupled to the backside of the microelectronic die.

Abstract: A device and method for controlling the temperature of a semiconductor module in which the semiconductor module is sandwiched by a first supporting unit and a second supporting unit. An area of the second supporting unit with which the semiconductor module comes into contact is shielded from heat of external ambient atmosphere, and has a temperature sensor provided thereat. The temperature of the first supporting unit is controlled so that the temperature of this area becomes equal to a predetermined temperature. The amount of heat moving from the heat-shielded area to the semiconductor module is small, so that the difference between the temperatures in the region extending from the heat-shielded area and the semiconductor module is small. The first and second supporting units may be separately controlled at different predetermined temperatures. By this, changes in the temperature of the semiconductor module caused by changes in outside air temperature are reduced.

Abstract: A microcomputer heat dissipation system comprising heat-absorbing units, wherein said heat-absorbing units can be bonded to heat-generating electrical components inside the microcomputer and are in communication with a fluid circulating unit, and, to said fluid-circulating unit, there can be serially connected at least a heat-radiating pipe bondable to a heat-radiating plate, with said heat-radiating plate disposed on the outer wall surface of the chassis. In this manner, most of the heat generated by the microcomputer is dissipated to the space outside of the microcomputer, and, at the same time, the elimination of the internal fans of the microcomputer permits a considerable reduction in the acoustic noise level during operation of the microcomputer.

Abstract: Heat dissipating IC devices including at least one IC die comprising a semiconductor substrate with circuitry which utilize thermoelectric effects to more effectively dissipate thermal energy from electronic circuits.

Abstract: A portable heater/cooler system comprises a thermal electric module conducting a current through the module; a heater/cooler cavity coupled to the thermal electric module; a variable speed fan for blowing air over the thermal electric module and into the cavity; a first temperature sensor coupled to the thermal electric module for measuring the temperature of the module; a second temperature sensor coupled to the heater/cooler cavity for measuring the temperature in the cavity; and a microprocessor for adjusting a speed of the fan and the current flow through the thermal electric module as a function of the measured temperatures of the thermal electric module and the cavity.

Abstract: A heating and cooling apparatus to be applied to an object to control the temperature of the object. A number of thermoelectric modules are adapted to be positioned in contact with the object in a pattern. A voltage source is adapted to apply a voltage to the thermoelectric modules to cause a temperature change in each thermoelectric module so as to control the temperature of the object in accordance with the pattern and with the voltage applied to thermoelectric modules.

Abstract: A compact and portable heating and cooling device having particular utility in handling formula containing bottles for infants. The device comprises a pair of elongated, generally circular cavities or receptacles for receiving the bottle(s), formed of a thermal conductive material. The respective cavities are heated and cooled by a shared solid state, ceramic, thermoelectric module disposed between and in contact with the respective cavities. Supporting components include a heat sink and fan for the hot side, and optionally a pair of thermostats for controlling operation of the thermoelectric module and fan.

Abstract: A compact, energy efficient blower that is controlled by a Peltier thermoelectric device to supply either hot or cold air. The Peltier device is sandwiched between a pair of heat exchangers that are surrounded by a plastic enclosure. Each heat exchanger includes a plurality of parallel aligned thermal energy conducting fins that are folded to maximize the surface area thereof. A fan is mounted atop the enclosure to pump a first supply of intake air through a first air flow path in a first heat exchanger at one side of the Peltier device to exhaust the waste energy emitted by the Peltier device and collected by the first heat exchanger. The fan also pumps a second supply of intake air through a second air flow path in the second heat exchanger at the opposite side of the Peltier device to blow the useful energy emitted by the Peltier device and collected by the second heat exchanger to an application device or a space within which the blower is located.

Abstract: Optical assemblies of the type supported on an optical bench and comprising a one or more components such as lasers, lenses, filters, isolators and waveguides, are sensitive to movement variation. One of the causes of movement is temperature tracking. Previously, thermo-electric coolers have been used to maintain the top-surface temperature of an optical bench within a certain range. However, although thermo-electric coolers are operable to maintain optical bench temperature they are themselves still sensitive to temperature tracking and can deform. Because an optical bench is typically supported on the top surface of a thermo-electric cooler this leads to deformation of the optical bench itself and as a result performance of the optical assembly is affected. An improved design of thermo-electric cooler is described where the top surface of the cooler is divided into separate regions, each having a neutral region in which deformation is minimal.

Abstract: A system, method and apparatus for temperature regulation of physiological fluids is disclosed. In an exemplary system for use in cardiopulmonary procedures, blood is entered into a proportionally long, narrow disposable container, is heated or cooled to a desired temperature, and exits from an opposite end. The disposable container includes a pair of long, flat surfaces facing each other in relatively, close proximity. The blood is transitioned from transport tubing into a thin laminar flow layer and back into tubing, inside the container. This container is placed in a heat exchange device having thermoelectric modules that contact the majority of surface area, opposite the blood side in the container. The thermoelectric modules act as fully reversible heat pumps and move heat from one side of the module to the other, dependant on the direction of the current supplied to the modules. Feedback from sensors in the fluid path independently control each thermoelectric module.

Abstract: A heat sink/heat spreader structure utilizing thermoelectric effects to efficiently transport thermal energy from a variety of heat sources including integrated circuits and other electronic components. A method for manufacturing the heat sink/spreader is also disclosed.

Abstract: Disclosed is an air conditioner using a thermoelectric module enabling to supply users individually with fresh and pleasant air for cooling/heating. The present invention includes a thermoelectric module having high and low temperature parts discharging and absorbing heat by an electric power, a heat-absorption accelerating means connected thermally to the low temperature part of the thermoelectric module so as to accelerate heat exchange between the low temperature part and an air, and a heat-dissipation accelerating means connected to the high temperature part of the thermoelectric module to accelerate heat exchange between the high temperature part and air so as to cool the high temperature part.

Abstract: The device comprises a cabinet with atmosphere controlled by refrigeration and/or supply of an inert gas to prevent the deterioration of the foodstuffs. Present in the cabinet is an automatic storage unit with container means for containing the products. The latter are to be fed towards an automatic slicing machine which carries out controlled slicing both as regards the thickness of the slices and as regards the number of slices and the weight of the sliced product. Finally, a delivery unit makes it possible to dispense the products outside the cabinet. Operation of the device is controlled by a unit, which is accessible to the user from outside the cabinet. Said unit is preferably arranged for payment using different paying means.

Abstract: A cascade thermoelectric cooler designed to cool to cryogenic temperatures of 30 to 120 K integrates high performance\high-ZT BixSb2−xTe3 and Bi2Te3−xSe3-based super-lattice-structure thin-film thermoelectric devices with a bulk-material based thermoelectric cooler including plural cascaded cold stages with each successive cascaded cold stage able to cool to a progressively lower temperature. Each cold stage in the bulk-material thermoelectric cooler includes a heat source plate, a heat sink plate, a p-type thermoelectric, and a n-type thermoelectric. Moreover, the thin-film thermoelectric cooler can have multiple stages in which each stage contains a heat source plate, a heat sink plate, a p-type super-latticed thermoelectric element, and a n type super-latticed thermoelectric element.

Abstract: Diode devices are disclosed in which the separation of the electrodes is set and controlled using piezo-electric, electrostrictive or magnetostrictive actuators. This avoids problems associated with electrode spacing changing or distorting as a result of heat stress. In addition it allows the operation of these devices at electrode separations which permit quantum electron tunneling between them. Pairs of electrodes whose surfaces replicate each other are also disclosed. These may be used in constructing devices with very close electrode spacings.

Abstract: An indirect thermoelectric cooling device comprises a thermoelectric cooling plate, in the indirect thermoelectric cooling device, a heat dispersing member is connected to the hot end of the thermoelectric cooling plate, and a cooling transmitting member is connected to the cold end of the thermoelectric cooling plate, characterized in that an inside mid-frame is provided between the heat dispersing member and cooling transmitting member, an outside mid-frame which is of a shape of sleeve is provided to surround the inside mid-frame, and the thermoelectric cooling plate is sandwiched between the inside mid-frame and the outside mid-frame. According to the present invention, there exist less connecting portions in the route of the cold or hot gas transferring, thus decreasing the heat resistant, and increasing the cooling or heating transmit efficiency, so that the heat dispersing and the cooling transmitting can be both realized in the same device.

Abstract: The present invention facilitates semiconductor cooling by combining a semiconductor die and a thermoelectric cooler into a single, integrated package or system. The thermoelectric cooler is controllably operated so as to dissipate thermal energy generated by the semiconductor die. Active thermal management of the package is performed by a controller, which monitors temperature(s) of the semiconductor die and increases or adjusts cooling such that desired performance levels can be obtained. The invention can also thermally manage one or more regions of a semiconductor die and can thermally manage a plurality of semiconductor dies.

Abstract: In a heat-dissipating module for an electronic device, a heat-conducting unit is adapted to be disposed in close contact with a heat-generating component, and includes inner and outer tubes that cooperatively confine an enclosed chamber filled with a thermal superconductor material. A fan unit is disposed to generate currents of air through a chamber confined by the inner tube so as to dissipate the heat transferred to the heat-conducting unit from the heat-generating component. Alternatively, the heat-conducting unit can be configured into a tubular member, and a heat-dissipating unit is provided on the tubular member to help dissipate heat.

Abstract: A cooling system is provided for cooling a heat generating component of an electronic device. The cooling system includes at least two cooling subsystems for a staged reduction of the temperature of a cooling fluid exposed to heat generated by the heat generated component. A first stage cooling subsystem reduces the temperature of the cooling fluid to ambient temperature or above, while a second stage cooling subsystem reduces the temperature of the cooling fluid exiting the first stage cooling subsystem to below ambient temperature. The first stage cooling subsystem is passive while the second stage cooling subsystem is active and can include one or more thermoelectric modules.

Abstract: A cooling apparatus for cooling an optical element provided in a vacuum atmosphere includes a radiational cooling part, arranged apart from the optical element, for cooling the optical element by radiation heat transfer, and a controller for controlling temperature of the radiation cooling part.

Abstract: An automated storage library including: an enclosure having a cartridge storage area in an interior of the enclosure; a plurality of media cartridges disposed in the cartridge storage area; and a cooling unit operatively connected to the enclosure for cooling at least the cartridge storage area of the enclosure. Preferably, the enclosure has an exterior wall and the cooling unit is at least partially disposed in the exterior wall. More preferably, the cooling unit is a thermoelectric cooler having a hot side disposed on an exterior of the enclosure and a cold side disposed in the interior of the enclosure.

Abstract: An optical device module using an integral heat transfer module. The heat transfer module has an integrally formed heat source and a temperature sensor for reading temperature. A heat transfer path is simplified in packaging the optical device module, so that the optical device can avoid performance degradation due to nonuniform temperature distribution. The amount power consumption can be reduced and excellent workability can be ensured.

Abstract: A thermal cup includes a hollow inner cup body having an inner surrounding wall and an outer surrounding wall that confine an enclosed chamber therebetween, and an outer cup body made of a heat insulating material and disposed to surround the outer surrounding wall of the inner cup body. The inner surrounding wall further confines a space for containing liquid therein. The outer cup body cooperates with the outer surrounding wall of the inner cup body to confine a clearance therebetween. A thermal conductor unit is provided on the outer surrounding wall of the inner cup body, and is disposed in the clearance.

Abstract: A thermoelectric particle precipitator for removing and collecting particles from a fluid stream. The thermoelectric particle precipitator utilizes one or more thermoelectric modules to create a temperature gradient which causes suspended particles in a fluid stream to undergo thermophoretic movement and precipitate on a surface on the cooled side of the temperature gradient. The collection surface may be a cooled surface of the thermoelectric module or a cooled surface of a thermal mass. The collected particles may be analyzed to determine their composition.

Abstract: A sealing member for a thermoelectric assembly includes an elastomeric body having one or more apertures formed therethrough for sealingly receiving an electrical wire projecting from the thermoelectric module. Sealing engagement between each electrical wire and each aperture may be enhanced by the use of a sealing agent, or by molding the wire, its sheath or a wire connector to each aperture. Preferably, a pair of wire guides project from the sealing member, each having a central channel in substantial registry with one of the apertures and providing additional surface area for wire support which reduces any tendency to create spaces between the wires and apertures. The sealing member may include one or more peripheral channels to capture water vapor, one or more indexing guides which receive fasteners from the assembly to locate the sealing member therein, as well as insulative filler material, and/or a central insulative channel.

Abstract: A cascade thermoelectric cooler designed to cool to cryogenic temperatures of 30 to 120 K integrates high performance\high-ZT BixSb2−xTe3 and Bi2Te3−xSe3-based super-lattice-structure thin-film thermoelectric devices with a bulk-material based thermoelectric cooler including plural cascaded cold stages with each successive cascaded cold stage able to cool to a progressively lower temperature. Each cold stage in the bulk-material thermoelectric cooler includes a heat source plate, a heat sink plate, a p-type thermoelectric, and a n-type thermoelectric. Moreover, the thin-film thermoelectric cooler can have multiple stages in which each stage contains a heat source plate, a heat sink plate, a p-type super-latticed thermoelectric element, and a n type super-latticed thermoelectric element.

Abstract: Counter-current heat flow systems are disclosed, where heat containing medium flows in adjacent conduits arranged anti-parallel to one another so that the medium flowing from a warm zone to a cool zone flows adjacent to the medium flowing from the cool to the warm zone in the opposite direction. A plurality of heat pumps are distributed along the conduits to actively pump heat between adjacent points of the conduits. Little energy is required to pump heat between the adjacent points yet a large temperature difference can be maintained between the warm and the cool zones. The heat containing medium can be a fluid or an electric current. The medium in one conduit may have a different heat capacity than the medium in the other conduit. A controller may be included to regulate the plurality of heat pumps and/or the flow of the media to maintain a desired temperature at the warm zone or the cool zone.

Abstract: A fruit chiller includes a bowl-like fruit container and a removable cover, each of which has a two layer wall defining therebetween annular cooling air flow passages. Cool air is delivered from a lower base and, when the cover is on the container, cool air flows upwardly through the interconnected annular passages and into the container at the top of the cover. The air flows downwardly and exits the container at the bottom, thereby maximizing the distance between the cool air inlet and outlet to maximize the time the cool air remains within the container.

Abstract: A portable thermoelectric cooling and heating appliance device and associated method of using the device are disclosed. The device comprises: a generally rectangular box, a hinge, a generally rectangular lid, a locking means, and a power cord. The box has a divider wall which defines a partition between a left and a right chamber within the box. The box further includes: an outer shell; an insulation layer; a inner shell; a power input plug; a first heat transfer unit; a first network of cooling/heating coils; a first control knob having a first voltage regulator and a first thermostat operationally connected to each other; a first spigot having a first button and a first drain; a second heat transfer unit; a second network of cooling/heating coils; a second control knob having a second voltage regulator and a second thermostat operationally connected to each other; and a second spigot having a second button and a second drain. The hinge is attached to the outer shell of the box.

Abstract: A computer system is described having additional cooling capabilities in a docking station for a mobile computer. The docking station includes P- and N-doped semiconductor thermoelectric components. The thermoelectric components are connected in series when the mobile computer engages with the docking station. A current flowing through a doped semiconductor causes heat to be transferred either in a direction of a current through the semiconductor component or in a direction opposite to a current in the thermoelectric components, depending on their doping. The thermoelectric components alternate from being P-doped to N-doped and the direction in which current flows alternates accordingly so that heat is transferred in one direction only. A heat pumping effect is created by the thermoelectric components which does not require high-pressure contact upon engagement of the mobile computer with the docking station.

Abstract: An apparatus for the real-time monitoring and control of a wafer temperature in a semiconductor process chamber, such as a plasma assisted deposition chamber or etch chamber, is provided. The apparatus is constructed by a wafer platform, a heat exchanger for flowing a heat exchanging medium into the wafer platform, an optical sensor for sensing the temperature of a wafer positioned on the wafer platform, and a controller for receiving a signal from the optical sensor, comparing to a pre-stored value and sending a signal to the heat exchanger to increase or decrease a flow of the heat exchanging medium. In another embodiment, a plurality of thermoelectric cooling modules is utilized for enhancing the temperature control capability of the heat exchanger by embedding the modules in the wafer platform, such as an electrostatic chuck.

Abstract: A cooling system is provided for cooling a heat generating component of an electronic device. The cooling system includes at least two cooling subsystems for a staged reduction of the temperature of a cooling fluid exposed to heat generated by the heat generated component. A first stage cooling subsystem reduces the temperature of the cooling fluid to ambient temperature or above, while a second stage cooling subsystem reduces the temperature of the cooling fluid exiting the first stage cooling subsystem to below ambient temperature. The first stage cooling subsystem is passive while the second stage cooling subsystem is active and can include one or more thermoelectric modules.

Abstract: A cryoprobe system utilizing a monolithic, insulated, hand-held thermal mass having an exposed tip for cryosurgical applications and the like, as well as a heat extraction base configured to interface with the thermal mass to quickly and efficiently reduce the heat of the thermal mass to cryogenic temperatures. The heat extraction base of the preferred embodiment of the present invention is configured to interface with the tip of the thermal mass, such that the tip plugs in securely to the base, to permit an efficient thermal transfer of heat from the thermal mass through the base via a heat exchange system communicating with the base which employs a low temperature cryo-refrigeration unit.

Abstract: An apparatus to substantially minimize low-cycle fatigue of at least one electrical connection between a first component and a second component includes at least one thermoelectric device to thermally contact at least the first component and includes at least one sensor that is coupled to at least one of the first component or the second component. A controller is provided and coupled to the at least one thermoelectric device and to the at least one sensor. The controller controls operation of the thermoelectric device to substantially minimize low-cycle fatigue by transferring heat from at least the first component in response to signals from the at least one sensor.

Abstract: An improved thermoelectric power generation system utilizes rotary thermoelectric configurations to improve and increase thermal power throughput. These systems are further enhanced by the use of hetrostructure thermoelectric materials, very thin plated materials, and deposited thermoelectric materials, which operate at substantially higher power densities than typical of the previous bulk materials. Several configurations are disclosed.

Abstract: Cilia-like micro surface actuators are applied to fins of a heat sink to improve heat dissipation. The surface actuators act as active surface features whose motion disrupts the boundary layer fluid flow by entraining cool fluid towards the heat transfer surfaces of the fins and ejecting relatively warmer fluid away from the surfaces. This disruption reduces the thermal resistance between the heat sink fins and the fluid (e.g., the convection resistance). The motion of the surface actuators also induces a net flow along the surface of the fin(s) and can, therefore, be viewed analogously to a “pump” moving fluid (such as air) over the surface. The surface actuators can be fabricated using plastic microelectromechanical systems (MEMS) technology and can be actuated to generate their motion using several techniques.

Abstract: A fluid temperature control apparatus performing precise control of the temperature, in which a high sealing performance in a heat transfer chamber is maintained even under a situation of repetitive thermal cycle accompanying the cooling and heating. The fluid temperature control apparatus includes a heat transfer block formed with an inflow port, an outflow port and a concave portion; a heat transfer plate which constitutes the heat transfer chamber by covering the concave portion of the heat transfer block; a holding unit for holding the heat transfer block and the heat transfer plate by using an elastic member so as to prevent plastic deformation of the heat transfer block by means of expansion or contraction of the elastic member following thermal expansion or thermal contraction of the heat transfer block; and temperature controlling unit for performing heat exchange with the fluid via the heat transfer plate.

Abstract: A heat exchanger 17 for an electronic heat pump 11 includes a thermally conductive base plate 18 having first and second surfaces, the first surface being flat and adapted to make intimate surface contact with a surface of the electronic heat pump and the second surface being obverse to the first surface and supporting an array of thermally conductive fins 21. The adjacent fins 21 define there between a plurality of micro channels.

Abstract: An object of the present invention is to provide a heat exchanger for a temperature control which can take a large area for transferring the heat to the fluid while it is compact, has a good efficiency for exchanging the heat, can increase and decrease the heat transferring area in conformity to the user's needs and the manufacturing cost thereof is low. The heat exchanging boards 2, 3 with a plate constitution and plural thermo modules are superposed alternately so that they have a laminate constitution. The heat exchanging board has a construction such that a flowing path defining board 5, in which a flowing path with a labyrinth construction is formed, is folded by a thin shell 7. The shell has an inflow hole into which the fluid flows and an outflow hole from which a fluid flows out passing through said flowing path with the labyrinth construction. A peltier element is used as the thermo module.

Abstract: A gas-flow heat exchanger comprising a set of parallel, spaced, heat-conductive areas providing between them a stack of pockets each containing parallel baffles (24) which define a platen of passageways (26) guiding the gas-flow path through the pocket between inlet and outlet openings (22, 23). The openings being arranged in four parallel lines at the sides of the stack, two of the lines respectively containing the inlet and outlet openings (22, 23) associated with the gas flow paths of alternative pockets. The remaining two lines respectively containing the inlet and outlet openings associated with the remaining pockets. Each pocket containing a removable frame (21) formed with the openings provided at the ends of the gas flow path through it and supporting within the frame the parallel baffles (24) which divide the gas-flow path into the platen of passageways (26). All of the passageways (26) provide a substantially equal dwell time to gas passing therethrough.

Abstract: An apparatus for the real-time monitoring and control of a wafer temperature in a semiconductor process chamber, such as a plasma assisted deposition chamber or etch chamber, is provided. The apparatus is constructed by a wafer platform, a heat exchanger for flowing a heat exchanging medium into the wafer platform, an optical sensor for sensing the temperature of a wafer positioned on the wafer platform, and a controller for receiving a signal from the optical sensor, comparing to a pre-stored value and sending a signal to the heat exchanger to increase or decrease a flow of the heat exchanging medium. In another embodiment, a plurality of thermoelectric cooling modules is utilized for enhancing the temperature control capability of the heat exchanger by embedding the modules in the wafer platform, such as an electrostatic chuck.

Abstract: Disclosed is an air conditioner using a thermoelectric module enabling to supply users individually with fresh and pleasant air for cooling/heating. The present invention includes a thermoelectric module having high and low temperature parts discharging and absorbing heat by an electric power, a heat-absorption accelerating means connected thermally to the low temperature part of the thermoelectric module so as to accelerate heat exchange between the low temperature part and an air, and a heat-dissipation accelerating means connected to the high temperature part of the thermoelectric module to accelerate heat exchange between the high temperature part and air so as to cool the high temperature part.