Abstract: This is an enhanced thermoelectric cooler with superconductive heat-dissipative coolers for use in air-conditioner. This invention is comprised of a thermoelectric cooling chip sandwiched between two superconductive unidirectional heat-dissipative cooling devices. Each device consists of special superconductive pipes, heat-dissipative plates, and a fan. The cooling devices are to dissipate heat quickly from the thermoelectric cooling chip and to maintain constant hot to cold air flow.

Abstract: One aspect of the present invention may include a heat pump system having a Peltier unit in an outdoor space and an outdoor heat exchange unit in the outdoor space. The Peltier unit has a Peltier element with a heat-absorbing portion and a heat-radiating portion, a first substrate in contact with the heat-absorbing portion, a second substrate in contact with the heat-radiating portion, a metal case and a resin case. The metal case covers the first substrate and forms a first flow path between itself and the first substrate. The first flow path is connected in a loop-like fashion to the outdoor heat exchange unit by an outdoor piping. The resin case covers the second substrate and forms a second flow path between itself and the second substrate. The second flow path is connected in a loop-like fashion to the indoor heat exchange unit by an indoor piping.

Abstract: Various embodiments are directed to a thermoelectric device comprising a thermoelectric element, a first heat switch and a second heat switch. The thermoelectric element may comprise a first component in electrical contact with a second component at an interface. The first component may comprise a first material and the second component may comprise a second material different from the first material. The first heat switch may comprise a first terminal in thermal contact with the interface and a second terminal in thermal contact with a thermal reservoir. The second heat switch may comprise a first terminal in thermal contact with the interface and a second terminal in thermal contact with a thermal load.

Abstract: A method with the following steps is described for testing a Peltier element: applying a voltage to the Peltier element; switching off the voltage at the end of a defined period of time; measuring the voltage at the Peltier element; and comparing the measured voltage with a reference value. Furthermore, a small electrical appliance, such as an electric shaver, with a Peltier element is described, which small electrical appliance has a safety device which ensures that a malfunction of the Peltier element cannot result in danger to the user.

Abstract: A thermionic or thermotunneling generator or heat pump is disclosed, comprising electrodes substantially facing one another and separated by spacers disposed between the electrodes, wherein the substrate material for the cathode is preferably a single crystalline silicon wafer while the substrate for the anode is an organic wafer, and preferably a polished polyimide (PI) wafer. On the cathode side, standard silicon wafer processes create the 10-1000 nm thin spacers and edge seals from thermally grown oxide. Either wafer is partially covered with a thin film of material that is characterized by high electrical conductivity and low work function. In one embodiment, the cathode is partially covered with a thin film of Ag—Cs—O. In another embodiment, the anode is additionally covered with a thin film of Ag—Cs—O, in which case the work function of the cathode coating material is reduced further utilizing an Avto Metal structure of nanoscale patterned indents.

Abstract: A modular solid-state lamp has a plurality of replaceable and rearrangeable modules. The modular lamp uses active cooling and passive cooling for thermal management. One cooling system for the modular lamp includes at least one active cooling device and a graphite heat sink in thermal contact with the at least one active cooling device to further enhance the efficiency of the cooling system. The modular solid-state lamp includes at least two modules, a power supply module and a light source module. The power supply module includes a power supply and LED driver that are able to power one or more light source modules. The power supply module further includes sensors that further improve the energy-efficiency of the lamp.

Abstract: A cabinet for a solar power inverter is described. A solar power inverter receives DC current from a solar panel and transforms the DC current into AC current. To cool the inverter equipment, an air inlet receives ambient air drawn into the cabinet by an air pressurizer. The ambient air is urged into a pressurized air plenum, from which two ports channel the air into at least two air paths to flow over the equipment in the cabinet. The equipment in the cabinet is arranged such that the air passes over more heat-sensitive equipment before reaching less heat-sensitive equipment. The equipment in the cabinet can be separated by grounded, metal walls to contain and diminish electromagnetic interference. The equipment may be accessed from a single, front side of the cabinet.

Abstract: A portable medicine cooler and a method of operating the same. In one embodiment, the portable medicine cooler includes: (1) a shell having a grille and further having a door configured to provide access to a cavity within the shell for containing a medicine to be cooled, (2) a cooling and receiver structure coupled to the shell and including a thermoelectric cooler interposing a heat sink and a vial receiver and (3) electronic cooling control and medicine efficacy indication circuitry coupled to the cooling and receiving structure and including a processor, at least one temperature sensor configured to provide a signal to the processor indicating a temperature associated with the portable medicine cooler, a battery configured to provide power to the processor and an indicator selected from the group consisting of at least one light-emitting diode and a liquid-crystal display and configured to provide an indication of an operation of the portable medicine cooler.

Abstract: An integrated circuit is cooled by microarchitecture controlled Peltier effect cooling. In one embodiment, a temperature sensor thermally coupled to at least a portion of the integrated circuit of a die is adapted to provide an output as a function of the temperature of an integrated circuit portion. Operation of a thermoelectric cooler thermally coupled to the integrated circuit portion is controlled as a function of the sensor output, wherein a controller of the integrated circuit controls the thermal electric cooler. Other embodiments are described and claimed.

Abstract: Disclosed herein is a thermoelectric apparatus, including: a power supply unit outputting AC power; a plurality of thermoelectric modules including substrates, electrodes and thermoelectric elements; a rectifier configured of a pair of diodes each connected in series at one side of the respective thermoelectric modules, the diodes having a different direction; and a path selection unit selecting any one of the pair of diodes having a different direction and connecting the diode to the power supply unit.

Abstract: A Peltier element cooling control circuit that accurately controls a small number of elements with a simple structure. First and second amplification circuits are connected between a current detection resistor detecting current of a Peltier element and a current control circuit performing current control on the Peltier element based on voltage proportional to the current. One of two resistors determines the amplification rate of the first amplification circuit includes a thermistor. When the ambient temperature is equal to a predetermined temperature or greater, the output voltage of the second amplification circuit is supplied to the current control circuit to control the current of the Peltier element so as to be constant. When the ambient temperature is less than the predetermined temperature, the output voltage of the first amplification circuit is supplied to the current control circuit to control the current of the Peltier element in accordance with the temperature characteristics.

Abstract: A cooling control circuit for a Peltier device comprises: a switching device 3; an LC filter 4, 13 connecting between the switching device 3 and the Peltier device 1, the LC filter 4, 13 smoothing an output from the switching device 3; an amplifier circuit 6 amplifying an output from the LC filter 4, 13; and a switching device control circuit IC configured to control an on-state and off-state of the switching device 3 based on a level of an output from the amplifier circuit 6. The amplifier circuit 6 delays and amplifies the output from the LC filter 4, 13 so that a maximum level of the output from the LC filter 4, 13 reaches a level at which the switching device control circuit IC brings a switching device 3 into the off-state.

Abstract: The invention is directed to an energy efficient thermoelectric heat pump assembly. The thermoelectric heat pump assembly preferably comprises two to nine thermoelectric unit layers capable of active use of the Peltier effect; and at least one capacitance spacer block suitable for storing heat and providing a delayed thermal reaction time of the assembly. The capacitance spacer block is thermally connected between the thermoelectric unit layers. The present invention further relates to a thermoelectric transport and storage devices for transporting or storing temperature sensitive goods, for example, vaccines, chemicals, biologicals, and other temperature sensitive goods. Preferably the transport or storage devices are configured and provide on-board energy storage for sustaining, for multiple days, at a constant-temperature, with an acceptable temperature variation band.

Abstract: In a thermoelectric module consisting of p- and n-conducting thermoelectric material pieces which are alternately connected to one another via electrically conductive contacts, the thermoelectric module (19) is thermally conductively connected to a micro heat exchanger (13) which comprises a plurality of continuous channels having a diameter of at most 1 mm, through which a fluid heat exchanger medium can flow.

Abstract: Disclosed herein is an AC powered thermoelectric device, including: a power supplier outputting AC power; a plurality of thermoelectric modules; and a plurality of rectifiers connected to each of the plurality of thermoelectric modules in series and applying the AC power having different polarities to each of the plurality of thermoelectric modules, whereby the positions of the hot side and the cold side are fixed to function as a heater and a cooler, while using the AC power.

Abstract: Apparatus and method are provided for facilitating cooling of an electronic component of varying heat load. The apparatus includes a refrigerant evaporator coupled in thermal communication with the electronic component, a refrigerant loop coupled in fluid communication with the refrigerant evaporator for facilitating flow of refrigerant through the evaporator, and a thermoelectric array disposed in thermal communication with the evaporator. The thermoelectric array includes one or more thermoelectric elements, and is powered by a voltage and by a current of switchable polarity, which are controlled to maintain heat load on refrigerant flowing through the refrigerant evaporator within a steady state range, notwithstanding varying of the heat load applied to the refrigerant flowing through the refrigerant by the at least one electronic component.

Abstract: A self-cooled electronic component comprising a vertical monolithic circuit, in which the vertical monolithic circuit is electrically connected in series with a Peltier cooler so that the D.C. current flowing through the circuit supplies the cooler and in which the circuit and the cooler are placed against each other so that the cold surface of the cooler is in thermal contact with the circuit.

Abstract: A thermally zoned substrate holder including a substantially cylindrical base having top and bottom surfaces configured to support a substrate. A plurality of temperature control elements are disposed within the base. An insulator thermally separates the temperature control elements. The insulator is made from an insulting material having a lower coefficient of thermal conductivity than the base (e.g., a gas- or vacuum-filled chamber).

Abstract: A controller for a thermoelectric cooling system comprises a sensor input that receives input from a sensor that measures a performance parameter of a thermoelectric cooling system. The thermoelectric cooling system comprises a plurality of thermoelectric devices electrically coupled in a combination of in series and in parallel with one another and electrically driven by a common driver. The controller also comprises a voltage control signal output, a processor, and a non-transitory memory having stored thereon a program executable by the processor to perform a method of controlling the thermoelectric cooling system. The method comprises receiving sensor data from the sensor input, determining a parameter of the voltage control signal based on the input sensor data, and transmitting a voltage control signal having the parameter to the driver to control heat transfer by the plurality of thermoelectric devices.

Abstract: The invention is new types of split-thermo-electric structures for cooling, heating, or stabilizing the temperature of an object or for electric power generation. In a first type of structure the transport of the electric current between the heat absorbing and the heat dispersing sides of the structure is disengaged from the flow of heat between the sides of the thermo-electric structure. In a second type of structure a layer of thermo-electric material on the heat absorbing side of the structure is connected by connection layers to two or more layers of thermo-electric material on the heat dispersing side of the structure. In a third type of structure the elements of which the structure is comprised are arranged to cause different values of electric current to flow at the heat absorbing and the heat dispersing sides of the structure and through different elements in the interior of the structure.

Abstract: A heat pump system including a heat pump having at least two Peltier elements arranged in series and connected to an energy supply, the heat pump system comprising an electrical dropping resistor arranged in series with the Peltier elements, wherein the Peltier elements and the dropping resistor are jointly supplied with energy by the energy supply. The heat pump system is preferably used in a household appliance, in particular a tumble drier.

Abstract: A semiconductor device comprises at least a semiconductor module including a semiconductor chip, a heat sink thermally connected to the semiconductor chip and a seal member for covering and sealing the semiconductor chip and the heat sink in such a manner as to expose the heat radiation surface of the heat sink. The radiation surface is cooled by a refrigerant. An opening is formed in a part of the seal member as a refrigerant path through which the refrigerant flows.

Abstract: A temperature calibration device uses Peltier cells for heating and cooling. The Peltier cells are connected to a relay that connects the cells to each other in one configuration for heating and a different configuration for cooling. The Peltier cells also receive supply voltages having different magnitudes and polarities for heating and cooling. By changing the manner in which the Peltier cells are connected to each other and using different supply voltages for heating and cooling, the cells are able to operate closer to their specified maximum temperature differential without sacrificing the useful life of the cells.

Abstract: A temperature control device for controlling temperature of an object substance, the temperature control device includes: a pulse width modulator for changeably providing current directions of a providing current; a low pass filter; a Peltier device electrically connected to the pulse width modulator via the low pass filter; and a diode placed the low pass filter in parallel.

Abstract: A fluid temperature control device, which is particularly suitably applied to the temperature control of a processing liquid in a semiconductor device manufacturing process, capable of performing quickly and precisely the temperature control of a temperature-controlled fluid, and the device can also be made as small as possible. This fluid temperature control device includes a body block having flow passage grooves formed therein; heat transfer plates which are disposed on surfaces of the body block to form flow passages where a temperature-controlled fluid flows; heaters which heat the temperature-controlled fluid flowing through the flow passages via at least one of the heat transfer plates; and thermoelectric modules which heat and cool the temperature-controlled fluid flowing through the flow passages via at least one of the heat transfer plates.

Abstract: Embodiments of the present invention provide a device for personal heat control, including a flexible housing comprising a cooling surface, a heating surface thermally insulated from the cooling surface, and a heat transfer unit configured to transfer heat from cooling surface to heating surface. Other embodiments of the present invention provide a system for cooling wearers of impact-resistant helmets, including an impact-resistant outer shell, foam pads affixed to an inside of the impact-resistant outer shell and configured to rest on a wearer's head, thermoelectric cooling devices spaced to avoid interference with foam pads and configured to rest against the head, a heat sink, and heat pipes thermally coupled at one end to thermoelectric cooling devices and at another end to the heat sink, and configured to transfer heat from thermoelectric cooling devices to heat sink with minimal heat loss, the heat pipes spaced to avoid interference with the foam pads.

Abstract: A number of compact, high-efficiency and high-power density thermoelectric systems utilizing the advantages of thermal isolation are described. Such configurations exhibit high system efficiency and power density. Some configurations exhibit a substantial reduction in the amount of thermoelectric material required.

Abstract: The subject matter disclosed herein relates to a method and/or system for adjusting a thermoelectric cooler.

Abstract: Example personal beverage warmers and coolers for vehicle seats are disclosed. A disclosed example apparatus to regulate the temperature of a beverage near a seat of a vehicle, the apparatus includes: a base including a thermally conductive material that conducts heat in a direction that is at least one of to or from a container seated thereon, a thermoelectric device thermally coupled with the base and to be energized to exchange heat with the base, and a heat exchanger thermally coupled with the thermoelectric device and a liquid medium to exchange heat therebetween.

Abstract: A temperature adjustment apparatus suppresses decline in temperature adjustment performance by avoiding even partial impairment of the function of a thermoelectric module in respective zones, which is accomplished due to the presence of terminals. A terminal is provided via an electrode extension section on a heat exchange plate side electrode of the thermoelectric module of inner zones apart from an outermost zone, of four zones. The electrode extension section is disposed at a position which is sandwiched between adjacent thermoelectric elements and over which a temperature adjustment side electrode spans. The terminals are disposed outside the thermoelectric module in the outermost zone.

Abstract: A method of forming a thermoelectric device may include providing a substrate having a surface, and thermally coupling a thermoelectric p-n couple to a first portion of the surface of a substrate. Moreover, the thermoelectric p-n couple may include a p-type thermoelectric element and an n-type thermoelectric element. In addition, a thermally conductive field layer may be formed on a second portion of the surface of the substrate adjacent the first portion of the surface of the substrate. Related structures are also discussed.

Abstract: A temperature control system is provided for efficiently controlling the temperature of an optical transmitter such as a laser diode. The temperature control system of the present invention reduces power consumption and achieves a higher efficiency by employing a voltage controller and a high-efficiency DC-DC step-down converter between the TEC controller, which drives the thermoelectric cooler, and the microcontroller, which governs the optical transmitter operation. The voltage controller converts an analog voltage command signal into a current-based command signal, which is then sent to the DC-DC step-down converter. The DC-DC converter produces a stepped-down voltage which it supplies to the TEC controller. The TEC controller receives the stepped-down voltage input from the DC-DC converter and outputs a corresponding current signal to the thermoelectric cooler.

Abstract: A cooling device controller for controlling a cooling device is provided. The cooling device controller includes: a capacitor for supplying an output voltage through a first terminal; a first switch between a first input terminal and the first terminal of the capacitor; a predetermined reference voltage applied to the first input terminal; a second switch between a second input terminal and the first terminal of the capacitor, wherein a temperature-sensing voltage is applied to the second input terminal, the temperature-sensing voltage varying according to a first sensed temperature; and a switch controller to receive a first voltage waveform having a duty ratio, the duty ratio dependent on a second sensed temperature, wherein the switch controller is operable to turn on and off the first switch and the second switch according to the duty ratio.

Abstract: The present invention provides a thermal insulator for construction including: a thermoelectric module inserted in a wall or floor of a building and including a plurality of thermoelectric elements; a power supply module for supplying power to the thermoelectric module; and a power control module for controlling size and polarity of the power supplied to the thermoelectric module from the power supply module. This thermal insulator for construction can provide much better thermal insulation performance in comparison with a conventional thermal insulator, and it is possible to reduce thickness of the wall or floor in comparison with when using the conventional thermal insulator since the thermoelectric element has very small size. Further, it is possible to implement a cooling or heating effect only by changing polarity and size of applied current.

Abstract: The present invention provides for a system and method for regulating and monitoring heat dissipation of an integrated circuit by employing a heat regulating device with a thermal structure net work assembly. Each thermal structure can act as a heat conducting pathway for inducing heat into and/or dissipating heat away from the integrated circuit, thus creating a more uniform temperature gradient across the semiconductor body.

Abstract: The present invention relates to a battery test rig, comprising a test cell (3) in which a battery (2) to be tested is arranged, a holder (13) which is arranged in the test cell (3) and is able to hold the battery (2), a regulation unit (4) which can be connected to a battery (2) arranged in the holder (13), at least one sensor device (5, 6) for monitoring the battery (2), wherein the sensor device (5, 6) is connected to the regulation unit (4), and a cooling apparatus (7), which is connected to the regulation unit (4) and is designed to cool the battery (2) in the test cell (3) from the outside in a hazard situation.

Abstract: Apparatus and systems, as well as methods and articles, may operate to actively cool an electronic device using a first heat removing cooling element, and to induce a thermal gradient in a heat pipe by conducting heat from a hot side of the first heat removing cooling element to a cold side of a second heat removing cooling element using the heat pipe. The heat pipe may comprise a variable conductance heat pipe. The apparatus and system may operate in a downhole environment, including logging and drilling operations.

Abstract: A thermoelectric structure for cooling an integrated circuit (IC) chip comprises a first type superlattice layer formed on top of the IC chip connected to a first voltage, and a second type superlattice layer formed on the bottom of the IC chip connected to a second voltage, the second voltage being different from the first voltage, wherein an power supply current flows through the first and second type superlattice layer for cooling the IC chip.

Abstract: An object of the present invention is to provide a cooling device that is easy to attach and that ensures intimate contact at a contact surface between a heat absorbing surface of a Peltier element and an object to be cooled and a contact surface between a heat radiating surface of the Peltier element and a cooling part.

Abstract: A CPU cooling circuit for a CPU includes a thermoelectric element and a current source circuit. The thermoelectric element includes a first thermoelectric substrate attached to the CPU, a second thermoelectric substrate opposite to the first thermoelectric substrate, a plurality of n-type semiconductor units and p-type semiconductor units alternately sandwiched between the first and the second thermoelectric substrates and electrically connected in series between a positive power supply input and a negative power supply input. The current source circuit is configured for providing driving current to flow through the n-type semiconductor units and the p-type semiconductor units of the thermoelectric element according to a temperature of the CPU.

Abstract: Systems and methods for controlling the temperature of an electrical device is described. The system includes a heat sink system in conjunction with a thermoelectric assembly. The systems and methods are particularly suitable in NEMA-4 electrical enclosures used in electrical submersible pump applications.

Abstract: A system for using a thermal cycle for heating or cooling. The system comprises a thermoelectric module flowing a gas; and an internal heat exchanger flowing the gas and exchanging heat between the gas and another fluid; the gas flow from at least one of the thermoelectric module and the internal heat exchanger flowing for heating or cooling. The system may be for using a closed cycle to remove a liquid from at least one object comprising moisture, the system comprising an enclosure containing the at least one object and arranged to receive a hot and dry gas for flow over the at least one object and thereby to produce a flow of moist gas at an intermediate temperature. The internal heat exchanger is arranged to exchange heat between the flow of the moist gas at the intermediate temperature and a flow of cold dry gas, thereby producing cooled moist gas and pre-warmed dry gas.

Abstract: This trash cooling unit system includes a Thermoelectric cooling system (TEC) which requires no harmful Freon or refrigerant liquids. It has a temperature controller to maintain a constant temperature. This system will operate on DC 24V at 12 Amps and move up to 40 watts of heat. Also, it has an AC adapter. The capacity of the trash unit is: width: approx. 10½,? Depth: approx. 9½,? Height: approx. 22?. The interior enclosure has a temperature of about 45° F. in a 80° F., 80% relative humidity ambient. This corresponds to approximately 17 watts of passive heat load from air convection and conduction through 2? of Polystyrene which prevents any condensation.

Abstract: A structure, system and method for controlling a temperature of a heat generating device in a solid medium, wherein heat is extracted from the medium into at least one heat extraction device, the heat extraction device dissipates heat into an environment apart from the medium by a heat sink thermally coupled to the heat extraction device; and heat from the medium is dissipated into the heat sink by a first thermal interface material thermally coupling the heat sink to the medium.

Abstract: Disclosed is a cooling apparatus including: a heat receiving plate to which a plurality of heating elements are attached; a radiator plate to which a plurality of Peltier devices are attached; a thermal transport heat pipe that couples the heat receiving plate with the radiator plate; and a heat dissipating device being provided on an exothermic side of the Peltier devices; wherein the plurality of heating elements are arranged along a longitudinal direction of the thermal transport heat pipe, and the plurality of Peltier devices are arranged along the longitudinal direction of the thermal transport heat pipe, whereby, when using a plurality of Peltier devices, reducing power consumption thereof by equalizing each operation of the respective Peltier devices.

Abstract: A temperature control apparatus is provided which controls temperature of a control target disposed on the side of an A-side of a Peltier device. The apparatus includes a temperature regulator which performs regulating operation on temperature of a B-side of the Peltier device opposite to the A-side on the basis of a drive voltage for the Peltier device.

Abstract: Systems and methods for controlling a thermoelectric cooler (TEC) in an optical transceiver. A TEC system includes a processor that interacts with a power supply and a TEC controller to prevent inrush current. The power supply is switched by the processor and turned on only at a particular time. The power supply has a relatively large time constant such that it ramps slowly to its full value. In the meantime, the processor and TEC controller cause the temperature to ramp to a target value by repeatedly incrementing or decrementing a target value over time and by controlling when the maximum available voltage can be applied to the TEC.

Abstract: An improved efficiency thermoelectric system is disclosed wherein convection is actively facilitated through a thermoelectric array. Thermoelectrics are commonly used for cooling and heating applications. Thermal power is convected through a thermoelectric array toward at least one side of the thermoelectric array, which leads to increased efficiency. Several different configurations are disclosed to provide convective thermal power transport, using a convective medium. In addition, a control system is disclosed which responds to one or more inputs to make adjustments to the thermoelectric system.

Abstract: A cooling system cools an electrically rechargeable portable device accommodated in a docking station. The cooling system includes a docking station having a non-forced air active cooling unit and a housing. The cooling unit maintains a first heatsink surface at a temperature below an ambient temperature and a second heatsink surface at a temperature exceeding said first heatsink surface temperature. The housing accommodates an electrically re-chargeable portable device. The housing re-charges said portable device and seats said portable device in a position providing thermal contact between said docking station first heatsink surface and a heat spreader of said portable device while re-charging of said portable device.

Abstract: A voltage regulator is configured to receive an input voltage from a power supply, measure a temperature associated with a heat transfer medium, produce an output voltage to drive a thermo-electric cooler, and vary the output voltage in accordance with changes in the measured temperature. Varying the output voltage results in: 1) extracting of heat from the heat transfer medium when the measured temperature is above a threshold value, or 2) supplying of heat to the heat transfer medium when the measured temperature is below a threshold value. The voltage regulator can cap upper and lower bounds of the output voltage to prevent the thermo-electric cooler from reaching its saturation point. The voltage regulator can be configured to produce an output voltage having reduced voltage ripple.