Abstract: A circuit arrangement for a Peltier module for use in a Peltier heat pump for a tumble dryer with the circuit arrangement including a Peltier module having at least one series arrangement of Peltier elements, with each series arrangement of Peltier elements being configured to receive voltage; and a two-position transfer switch wherein at a first position voltage is applied to the Peltier module and at a second position voltage is not applied to the Peltier module and the Peltier module is connected to another electrical device.

Abstract: A method of applying a physical barrier to suppress thermal decomposition near a surface of a thermoelectric material including applying a continuous metal foil to a predetermined portion of the surface of the thermoelectric material, physically binding the continuous metal foil to the surface of the thermoelectric material using a binding member, and heating in a predetermined atmosphere the applied and physically bound continuous metal foil and the thermoelectric material to a sufficient temperature in order to promote bonding between the continuous metal foil and the surface of the thermoelectric material. The continuous metal foil forms a physical barrier to enclose a predetermined portion of the surface. Thermal decomposition is suppressed at the surface of the thermoelectric material enclosed by the physical barrier when the thermoelectric element is in operation.

Abstract: Active cooling technologies such as thermoelectrics can be used to introduce thermal “gain” into a cooling system and, when employed in combination with forced flow cooling loops, can provide an attractive solution for cooling high heat flux density devices and/or components. In such configurations, it can be advantageous to discontinuously flow thermal transfer fluid into thermal contact with the hot or cold side of a thermoelectric module (TEM), allow it to dwell while heat is transferred from or to the TEM, and resume the flow. In configurations in which the TEM operation is itself discontinuous, various relationships between thermal transfer fluid flow and TEM operation can be advantageously employed to temporally integrate thermoelectric action.

Abstract: An improved efficiency thermoelectric system is disclosed wherein convection is actively facilitated through a thermoelectric array. Thermoelectrics are commonly used for cooling and heating applications. Thermal power is convected through a thermoelectric array toward at least one side of the thermoelectric array, which leads to increased efficiency. Several different configurations are disclosed to provide convective thermal power transport, using a convective medium. In addition, a control system is disclosed which responds to one or more inputs to make adjustments to the thermoelectric system.

Abstract: New Peltier semiconductor heat transfer systems are presented herein. In particular, Peltier heat transfer systems of Peltier semiconductor elements of highly unique shapes are arranged to bias the cooling side with respect to its size and consequently performance. In effect, a Peltier heat transfer system is created whereby the Peltier called side is greatly reduced in size and the Peltier hot side is greatly expanded in size. Such ‘high aspect ratio’ Peltier systems promote ‘focused’ cooling effect, which is particularly useful in conjunction with high-performance electronic devices having a small footprint. The entire cooling fact of the Peltier device is brought to the small space approximated by a point. Thus a ‘point’ heat source such as a semiconductor laser are high-performance light emitting diode is more effectively cooled by these systems.

Abstract: In one exemplary embodiment, an assembly includes one or more thermoelectric modules, a compliant thermal interface, and a heat spreader. The compliant thermal interface is configured such that it may substantially conform against and intimately thermally contact an outer surface of a fluid conduit. The heat spreader is disposed generally between and thermally coupled to the compliant thermal interface and the one or more thermoelectric modules. The heat spreader may have greater flexibility than the one or more thermoelectric modules. The heat spreader may also have a thermal conductivity greater than the compliant thermal interface. The assembly may have sufficient flexibility to be circumferentially wrapped at least partially around a portion of the fluid conduit's outer surface, with the compliant thermal interface in substantial conformance against and in intimate thermal contact with the fluid conduit's outer surface portion.

Abstract: A thermoelectric system and method provides distributed localized heating, cooling, or both heating and cooling. The thermoelectric system includes a plurality of thermoelectric assemblies. Each thermoelectric assembly comprises a plurality of thermoelectric elements, and each thermoelectric assembly is in thermal communication with a first working fluid and in thermal communication with a region corresponding to the thermoelectric assembly. Each thermoelectric assembly is selectively operable either to heat the region corresponding to the thermoelectric assembly by transferring heat from the first working fluid to the region corresponding to the thermoelectric assembly or to cool the region corresponding to the thermoelectric assembly by transferring heat from the region corresponding to the thermoelectric assembly to the first working fluid. Each thermoelectric assembly is operable independently from operation of other thermoelectric assemblies of the plurality of thermoelectric assemblies.

Abstract: The present invention relates to a castable, aerogel-based, ultra-low thermal conductivity opacified insulation to suppress sublimation. More specifically, the present invention relates to an aerogel opacified with various opacifying or reflecting constituents to suppress sublimation and provide thermal insulation in thermoelectric modules. The opacifying constituent can be graded within the aerogel for increased sublimation suppression, and the density of the aerogel can similarly be graded to achieve optimal thermal insulation and sublimation suppression.

Abstract: A method and mechanism for eliminating one of the magnetic circuits in a conventional two motor Stirling cryocooler. The inventive cooler is a Stirling cycle cryogenic cooler with a magnetic circuit for generating a field of magnetic flux in two separate magnetic gaps; a first coil disposed in the flux field of one gap; and a second coil disposed in the flux field of the second gap. The second coil is mounted for independent movement relative to the first coil. In a specific embodiment, the first coil is a compressor coil and the second coil is a displacer coil. The coils are energized with first and second variable sources of electrical energy in response to signals from a controller.

Abstract: A thermoelectric module includes a first insulated substrate having a first opposing surface, a second insulated substrate having a second opposing surface, the second opposing surface faces the first opposing surface, a plurality of electrodes formed on the first and second opposing surfaces, a plurality of thermoelectric transducers provided between the first insulated substrate and the second insulated substrate, the plurality of thermoelectric transducers electrically connected with one another in series and/or in parallel via each electrode, and a conducting circuit electrically connecting the plurality of electrodes with an external power source, wherein the first insulated substrate includes a substrate body having the first opposing surface and a projecting portion being formed continuously from the substrate body and extending in a direction that intersects the substrate body, and the projecting portion includes a fixing surface extending in the direction that intersects the substrate body.

Abstract: Apparatus for thermoelectric cooling of an insulated enclosure having a plurality of thermoelectric cooling units, with their cold sides exposed to the enclosure interior, where they are affixed to an array of individual, self-sufficient interior heat pipes through a conductive metal connecting member. Their hot sides are exposed to the ambient exterior and similarly affixed to an array of individual, self-sufficient exterior heat pipes, each set of heat pipes having a stack of fins affixed; interior fins to collect heat and exterior fins to disburse heat.

Abstract: Different types of cooling devices using nanowires are described. For example, a cooling device may include a plurality of diamond nanowires coupled to a surface. The diamond nanowires conduct heat energy from the surface and dissipate the heat energy into a neighboring fluid.

Abstract: The present invention provides a measuring system to determine the quality of the heat pipe, comprising a heat pipe comprising a first end connected to a first temperature sensor and a second end connected to a second temperature sensor, a heater being connected to said first end and being connected to a multi-function heater controller; a multi-function heater controller being electrically connected to said heater and said one of the first or second temperature sensor, a thermal-electric cooler (TEC) module being connected to said second end; and a TEC controller being electrically connected to said TEC module and said one of the first or second temperature sensor, wherein said TEC controller comprises a proportional-integral-derivative controller, and said multi-function heater controller comprises both constant heating power and constant temperature control modes.

Abstract: Embodiments include systems and methods for selectively cooling heat-generating electronic components in an enclosure. According to one embodiment, an enclosure houses a plurality of heat-generating electronic components. Air enters the enclosure at the front and is exhausted at the rear. After passing through one or more upstream components, air diverges into at least first and second airstreams within the enclosure. The first airstream is re-cooled by a cooling system having a thermoelectric cooling module. The thermoelectric cooling module is configured such that a first side is cooled and a second side is heated in response to an applied voltage. A voltage regulator may govern the voltage in response to one or more temperatures sensed within the rack system.

Abstract: Resins (5, 6) are interposed as insulating layers between heat radiation side and heat absorption side heat exchange bodies (2, 3) and heat radiation side and heat absorption side electrodes (41, 42) of a thermoelectric conversion element module (4). The resin (5) is fusion bonded to the heat radiation side heat exchange body (2), and the resin (6) is fusion bonded to the heat radiation side heat exchange body (3). The material of the resins (5, 6) is, for example, a thermosetting plastic. The thermosetting plastic becomes soft when heated and then cures. At the time of fusion bonding of the resins (5, 6) to the heat exchange bodies (2, 3), the heat exchange bodies (2, 3) and the resins (5, 6) are heated and pressed. Then, the resins (5, 6) become soft and enter the cavities and flaws formed in the surfaces of the heat exchange bodies (2, 3). The resins (5, 6) having entered the cavities and flaws cure to fill the cavities in the surfaces of the heat exchange bodies (2, 3).

Abstract: An apparatus and associated method to provide localized cooling to a microelectronic device are generally described. In this regard, according to one example embodiment, a cooling system comprising one or more thermoelectric cooler(s) is thermally coupled to a heat spreader to provide cooling to one or more hot spot(s) of a microelectronic device.

Abstract: A cooling device for cooling an electronic component (semiconductor module) includes a cooling tube adapted to be disposed in contact with the electronic component and having an internal coolant flow channel for the passage therethrough of a cooling medium, and a high-pressure tube disposed adjacent to a surface of the cooling tube that faces away from the electronic component, the high-pressure tube having a hollow interior that can be filled with a high-pressure fluid having a pressure higher than that of the cooling medium. An electric power conversion device comprised of a plurality of semiconductor modules and the cooling device as means for cooling the semiconductor modules is also disclosed.

Abstract: A magnetic refrigerator includes independent hot heat exchange unit and cold heat exchange unit wherein separate heat transfer fluids are circulated.

Abstract: An improved efficiency thermoelectric system is disclosed wherein convection is actively facilitated through a thermoelectric array. Thermoelectrics are commonly used for cooling and heating applications. Thermal power is convected through a thermoelectric array toward at least one side of the thermoelectric array, which leads to increased efficiency. Several different configurations are disclosed to provide convective thermal power transport, using a convective medium. In addition, a control system is disclosed which responds to one or more inputs to make adjustments to the thermoelectric system.

Abstract: In one embodiment of the invention, a system for controlling the temperature of water in a water reservoir includes a water reservoir, an inlet operable to deliver water to the water reservoir, an outlet operable to dispense at least a portion of the water from the water reservoir, and a staged water cooler having a first thermoelectric cooler stage coupled to a second thermoelectric cooler stage, the staged water cooler operable to control the temperature of the water in the water reservoir.

Abstract: The present invention generally provides multistage thermoelectric coolers and methods for their fabrication. For example, in one aspect, a multistage thermoelectric cooler is disclosed that includes at least two cooling stages, each of which comprises a p-type leg portion and an n-type leg portion coupled to form a p-n junction. The p-n junctions of the two stages are thermally and electrically coupled such that at least a portion of a current flowing, during operation of the device, through one stage is coupled to the other. Further, at least one of the p- or n-type leg portions of one stage forms a unitary structure with a corresponding p- or n-type leg portion of the other stage.

Abstract: Systems and methods for controlling the temperature of an electrical device is described. The system includes a heat sink system in conjunction with a thermoelectric assembly. The systems and methods are particularly suitable in NEMA-4 electrical enclosures used in electrical submersible pump applications.

Abstract: A temperature control system may include a thermoelectric device and a controller electrically coupled to the thermoelectric device. The controller may be configured to sense a first value of an electrical characteristic of the thermoelectric device, and to generate a first electrical control signal to pump heat through the thermoelectric device in response to sensing the first value of the electrical characteristic of the thermoelectric device. The controller may be further configured to sense a second value of the electrical characteristic of the thermoelectric device wherein the first and second values of the electrical characteristic are different, and to generate a second electrical control signal to pump heat through the thermoelectric device in response to sensing the second electrical characteristic of the thermoelectric device with the first and second electrical control signals being different. Related methods are also discussed.

Abstract: An apparatus including a socket having a socket body and a cavity within the socket body. The apparatus further including a thermoelectric cooler coupled to an in-substrate voltage regulator positioned within the cavity. A method including coupling a thermoelectric cooler to an in-substrate voltage regulator positioned within a cavity of a socket and electrically coupling the thermoelectric cooler to the socket using a contact of the socket. A system including an electronic appliance having a processor including an in-substrate voltage regulator positioned within a cavity of a socket coupled to the processor. The system further including a thermoelectric cooler positioned within the cavity and coupled to the in-substrate voltage regulator.

Abstract: The present invention provides systems and methods of controlling local environment. In one embodiment, incoming air enters a contactor such the Direct Contact Cooler-Condenser (DCCC) where the air contacts water distributed on the contact media. After passing through the DCCC, the air is saturated at a temperature equal or close to that of the water. Depending on the state of the incoming air, in the DCCC will be humidified or dehumidified to yield saturated air at the desired humidity ratio. In one embodiment, a blower draws air through the DCCC and blows into the heater. The heater heats the air to the desired dry-bulb temperature. Before exiting, the air may pass through a filter.

Abstract: A thermoelectric cooler apparatus for a fiber optic system includes a first plate coupled to the fiber optic system and a second plate for coupling to a heat sink. The apparatus includes a first plurality of thermoelectric units and a second plurality of thermoelectric units being sandwiched between the first plate and the second plate for enhancing or retarding a heat transfer between the first plate and the second plate. The first plurality of thermoelectric units is connected to each other electrically in series. The second plurality of thermoelectric units is connected to each other electrically in series but insulated from the first plurality of thermoelectric units. The first plurality of thermoelectric units and the second plurality of thermoelectric units are configured such that a cross-section of the apparatus includes one or more of the second plurality of thermoelectric units being sandwiched by the first plurality of thermoelectric units.

Abstract: A self-powered fan for circulating air for use in cooperation with a heat source, such as a wood stove, and having a first heat transfer member thermally and physically connected with the heat source. The fan blades operably create a first or warm air flow and a second or cooler air flow. The fan has a second heat transfer member with a thermocouple module structure located between the two heat transfer members. The first heat transfer member is of suitable material, size, mass and shape as to provide a suitable temperature gradient between the thermocouple structure and the heat source to operably allow of such sufficient heat transfer from the first heat transfer member to the thermocouple to generate sufficient power to effect rotation of the blades, but not to cause thermal damage to the thermocouple structure.

Abstract: The present invention provides a system for controlling the climate of a hybrid vehicle. The system includes a thermoelectric module, a heat exchanger, a pump, and a valve. The thermoelectric module includes thermoelectric elements powered by electric energy. The thermoelectric elements emit or absorb heat energy based on the polarity of the electrical energy provided. A tube containing coolant runs proximate the thermoelectric elements. To aid in the transfer of heat energy, a blower is provided to generate an air flow across the thermoelectric elements and the tube. The coolant is provided from the thermoelectric module to a heat exchanger that heats or cools the air flow provided to the cabin of the vehicle. The pump and valve are in fluid communication with the heat exchanger and thermoelectric module. The pump pressurizes the coolant flow through the tube and coolant lines. In a cooling mode, the valve is configured to selectively bypass the engine coolant system of the vehicle.

Abstract: A solid state thermal device for conducting heat from a source and transferring the heat to an exhaust tunnel or converter for controlling the current flow passing through the solid state device. The device includes a plurality of diode arrays which interface between heat conductors and an exhaust tunnel, The device includes a thermal cable connected at one end to the heat source and connected at its other end to an interface of solid state devices, such as a diode array. Conductance of the heat to the interface diode array is via a graphite heat conducting composite material conducting heat at least five times the rate of copper. A thermal conversion unit is coupled to the diode interfacing arrays that controllably transfers the heat for introduction into a plurality of graphite composition stages or members, which are included in the unit. A blower is provided in the tunnel for forcibly conducting the heat radiated from the graphite composition members.

Abstract: By limiting a current change rate of a power to be supplied to a peltier element by using a pulse width control means for controlling to increase/decrease a pulse width of a pulse signal so that a temperature change of the peltier element does not exceed a predetermined temperature gradient and a switching means for controlling to turn on/off a drive current to be supplied to the peltier element based on a pulse signal having a pulse width controlled by the pulse width control means, an abrupt change of a rate of expansion and a rate of shrinkage of respective parts of the peltier element are suppressed and a stress imposed to the peltier element can be reduced, consequently, a lifetime of the peltier element can be maintained long.

Abstract: A method, system and apparatus are described. The apparatus includes a first device to adjust a polarity associated with a thermoelectric (TEC) module. The adjustment is to control the flow of heat. The flow of heat is directed toward a thermal interface material (TIM) in order to melt the TIM up to an acceptable melt level. The apparatus further includes a second device to determine whether the TIM has melted up to the acceptable melt level. The apparatus includes an application device to apply the TIM to a heat sink if the TIM is melted has melted up to the acceptable melt level.

Abstract: A device for heating or cooling air, has a housing with an inlet and an outer, as well as an inlet plenum and an outlet plenum for passing air through the housing. A heat sink defines a plurality of air passages between the inlet and outlet and fans in the housing move air through the inlet plenum, across the passages, into the outlet plenum. A plurality of Peltier modules in the housing each have one surface in heat transfer contact with the heat sink and an opposite surface in contact with a heat transfer circuit such as a flow or water in pipes, for cooling or heating the opposite surfaces. A purely relay-based, or PWM-based power circuit is connected to the modules for powering the modules and fans to cool or heat the heat sink.

Abstract: A temperature control apparatus is provided which controls temperature of a control target disposed on the side of an A-side of a Peltier device. The apparatus includes a temperature regulator which performs regulating operation on temperature of a B-side of the Peltier device opposite to the A-side on the basis of a drive voltage for the Peltier device.

Abstract: An apparatus for adjusting temperature of an object includes a heat radiation member, a deflection member to deflect heat radiation from the heat radiation member toward a region of the object, and an adjusting system to adjust temperature of the heat radiation member.

Abstract: The thermoelectric heat pump comprises one or more thermoelectric modules having a hot side connected to a first heat exchanger and a cold side connected to a second heat exchanger, and is characterized in that it comprises a pair of elongated bar-like elements made of an electrically and thermally insulating material which are arranged at two parallel sides of the heat exchangers, at least partly interposed between facing flanges of said heat exchangers, at least one of said elongated bar-like elements including electric conductors for supplying power to the thermoelectric modules, as well as conductors for supplying control signals therefor, and that said heat exchangers contacting the thermoelectric modules are linked one another via a plurality of fasteners, each fastener being formed of a substantially C-shaped metal clip.

Abstract: A shroud for mounting a fan is provided. The shroud may include a plate, a hub, a first leg, and a second leg. The plate may include an aperture edge of an aperture in a surface of the plate. The hub includes a bore defining an axis of rotation of a fan. The first leg and the second leg are mounted to and extend between the hub and the aperture edge. The first leg includes a first leg portion having a first curve shape in a plane perpendicular to the axis of rotation. The second leg may include a second leg portion having a second curve shape in the plane. The first curve shape may be an arc of a circle. A fan housing may include the shroud, an actuator to effect rotation of the fan, and a mounting bracket, which mounts the actuator to the shroud.

Abstract: A heat dissipating device for an electronic element includes a thermoelectric cooler (TEC) attached to the heat conductor, a heat sink attached on the TEC, a fan attached on the heat sink, and a temperature control circuit. The TEC absorbs heat from the electronic element, and transfers the heat to the heat sink. The temperature control circuit receives a rotation speed signal from the fan, when rotation speed of the fan is higher than a given level, the temperature control circuit controls the TEC to cool the electronic element, when rotation speed is lower than the given level, the temperature control circuit controls the TEC to stop cooling the electronic element.

Abstract: A device includes a liquid metal and a ferrofluid contained in a closed tube. Many electrode groups are connected to the closed tube. A feedback device is connected to the electrode groups. The feedback device switches power to each electrode group in series to circulate the liquid metal and move the ferrofluid in the closed tube.

Abstract: A thermoelectric structure and device including at least first and second material systems having different lattice constants and interposed in contact with each other, and a physical interface at which the at least first and second material systems are joined with a lattice mismatch and at which structural integrity of the first and second material systems is substantially maintained. The at least first and second material systems have a charge carrier transport direction normal to the physical interface and preferably periodically arranged in a superlattice structure.

Abstract: An air cooling/heating device includes: a housing unit having first and second compartments, formed with a first opening and a first mounting hole in spatial communication with the first compartment, and further formed with a second opening unit and a second mounting hole in spatial communication with the second compartment; a thermal energy storing unit and a pipe disposed in the first compartment, and adapted to contain antifreeze liquid; a pump connected in series to the pipe, and operable to deliver the antifreeze liquid between the thermal energy storing unit and the pipe; a thermoelectric semiconductor device disposed in the second compartment, and in thermal contact with the thermal energy storing unit; and a turbulence unit including first and second fans that are mounted in the first and second mounting holes in the housing body, respectively.

Abstract: A thermoelectric conversion device has a series circuit including P-type thermoelectric elements and N-type thermoelectric elements which are alternately arranged and connected with each other in series by electrode portions, heat-exchanging portions directly connected with the electrode portions, an insulating board from which the heat-exchanging portions protrude to be held and are electrically insulated, and an insulating layer which is electrically insulating and arranged at least a substantially whole surface of the protrusion side of the heat-exchanging portion. An adhesive layer covers exposure portions of the heat-exchanging portions from an outer side of the insulating layer. The exposure portions are exposed to a side of the heat transfer media.

Abstract: A personal portable environmental control system, which includes a thermoelectric device, two heat sinks, an exhaust fan for blowing ambient air across one heat sink and a blower for blowing ambient air across the other heat sink such that the blown air is conditioned (either heated or cooled). The thermoelectric device is disposed between the two heat sinks.

Abstract: A heat radiator having a thermo-electric cooler uses a plurality of heat radiation modules to induce forced thermal conduction at respective hot spots. The heat radiator comprises a first heat radiation module with a radiator fin set in which the fins are connected by a thermal conduction member attached onto a heat source. The thermo-electric cooler is attached to the heat source, whereby heat will be delivered from the heat absorption terminal to the heat release terminal thereof. The heat radiator further comprises a second heat radiation module with a radiator fin set in which the fins are connected by a thermal conduction member attached onto the thermo-electric cooler. Thereby, the heat generated in a heat source, such as a central processing unit (CPU) and an accelerated graphic chip, is dissipated through not only the first heat radiation module but also the thermo-electric cooler at the second heat radiation module.

Abstract: A heat exchanger for a vehicle is shown, wherein the heat exchanger includes a plurality of tubes having integrated thermoelectric devices disposed thereon to facilitate heat transfer between the tubes and an atmosphere surrounding the tubes.

Abstract: An exposure apparatus includes an optical system for guiding light to an object, a holding member for holding the object, a first refrigerator located near a holding side of the holding member without contacting the holding side, and a second refrigerator located near a backside of the holding member without contacting the backside.

Abstract: A refrigerator apparatus includes a housing with an interior chamber, thermoelectric devices that are thermally coupled to the interior chamber, and dual redundant electronics configured to generate and apply input power to the thermoelectric devices.

Abstract: A refrigerator apparatus includes a housing with an interior chamber, a thermoelectric device that is thermally coupled to the interior chamber, a temperature sensing device that is thermally coupled to the interior chamber, the temperature sensing device providing a temperature measurement; and electronics configured to generate and apply input power to the thermoelectric device, and to adjust the input power maintaining a functional relationship between the input power and the temperature measurement.

Abstract: A method for transferring heat from a first location to a second location includes thermoelelectrically transferring heat from the first location to a third location; and transferring heat from the third location to the second location through a magneto-hydrodynamic (MHD) flow. A cooling system includes a thermoelectric cooling (TEC) component; and a magnetohydrodynamic (MHD) component, wherein the MHD component and the TEC component are in thermal contact.

Abstract: Apparatus is provided including an assembly (22) and a control unit (36). The assembly (22) includes a housing (34) configured to be applied to a nerve (20) of a subject, and at least one cathode (30) and at least one Peltier cooler (32), which are fixed to the housing (34). The control unit (36) is configured to drive the cathode (30) to apply an activating current to the nerve (20) that generates action potentials traveling in first and second directions (38 and 40) in the nerve (20), and the Peltier cooler (32) to cool the nerve (20) sufficiently to block propagation of at least a portion of the cathode-generated action potentials traveling in the second direction (40). Other embodiments are also described.

Abstract: The electric motor is equipped with an electronic control, for example in the form of a frequency converter (2) and comprises at least one Seebeck element (6) whose one side is connected to the motor (1) in a heat-conducting manner and whose other side is in heat-conducting connection with a cooling medium. The electrical output power of the Seebeck element (6) is led to the electronic control (2) of the motor (1).