Abstract: The present disclosure provides a display device and a manufacturing method thereof. In an embodiment, the display device includes a display panel, a touchpad and a joint. The touchpad is located on a display side of the display panel and includes a main body area and a bonding area. The joint is arranged on a side of the display panel facing the touchpad and is configured to electrically connect the touchpad and a driving chip. A side of the bonding area facing the display panel is configured to be joined with the joint.

Abstract: The present invention provides an analysis method for a semiconductor device for analyzing a plurality of electrical parameters of a HKMG fin field effect transistor and a plurality of process parameters for manufacturing the transistor, comprising: performing key process parameter correlation analysis for each electrical parameter, wherein the key process parameter correlation analysis comprises: constructing multiple electrical-process models of the electrical parameter corresponding to each process parameter respectively; performing sensitivity analysis for each of the electrical-process models; determining a plurality of key process parameters from the plurality of process parameters based on the obtained sensitivity analysis results of the electrical-process models; and determining a relationship between the electrical parameter and the plurality of key process parameters based on a knowledge database.

Abstract: A data processing method includes a step of obtaining scores of time-series data by comparing the time-series data with reference data in order to process time-series data acquired in a substrate processing apparatus having one or more processing units, a step of classifying the scores into a plurality of levels, and a step of displaying an evaluation result screen including a display area including a graph showing an occurrence rate of each level of the scores, the number of occurrences of each level, and a graph showing temporal change in the number of occurrences of a worst level of the scores when substrates have been processed through a predetermined method with respect to each of the two or more processing units. Accordingly, a data processing method through which a state of the substrate processing apparatus can be easily ascertained is provided.

Abstract: Data structures and applications are defined with the point-and-click visual tools or speech recognition and recorded as metadata descriptions, which are converted at runtime to generate underlying software code (e.g., C #, SQL, JavaScript, etc.) to implement the application. The data structures include application data elements described in a data serialization format, such as JSON, are stored in a NoSQL database. Each application data element includes fields that each represent an individual value. Each field is defined with a label, a data type, and attributes. The data structures also describe relationships or links between application data elements, as well as data-driven or time-based rules that drive further data manipulation and interactions within and external to the programming development environment through a variety of interfaces (e.g., HTTP, SMTP, SMS).

Abstract: The invention relates to a treatment system for treating workpieces. Devices and methods of the disclosure are configured to perform at least one treatment operation on the workpiece, as well as at least one receiving unit for accommodating the workpiece on or in the treatment device. A transport device is provided that comprises at least one transport unit, with which the workpiece is transferable into a transfer position, from which the workpiece is transferable by means of the at least one receiving unit into a treatment position, as well as a control device for controlling the at least one treatment unit, the at least one receiving unit, and the at least one transport unit.

Abstract: A user interface for designing, configuring and/or editing a control flow representing a control strategy associated with a semiconductor manufacturing process, the user interface including: a library of control elements having at least a control element representing a task of simulation and each control element being selectable by a user; a control flow editor configured to organize the control elements into a control flow representing the control strategy; and a communication interface for communicating the control flow to a calculation engine configured to evaluate the control flow.

Abstract: A method of manufacturing a reticle includes: disposing the reticle in a reticle pod, the reticle pod forming a sealed space to accommodate the reticle, and the reticle pod comprising a window arranged on an upper surface of the reticle pod and configured to allow a radiation at a predetermined wavelength to pass through; and performing an inspection operation on the reticle through the window.

Abstract: Production past record information showing the execution time point of each step is accumulated for each product loaded in a production system. A supporting system calculates, for each step, a retention increase rate at each time point on the basis of the production past record information. The “retention increase rate” is an amount of increase in retention number per unit time. The supporting system displays a holistic chart for a production situation, which has a time axis and a step axis (axis perpendicular to the time axis and corresponding to steps). A display mode of each position in the holistic chart depends on whether a retention increase rate for the time point and step corresponding to the position is a negative value, zero, or a positive value, and a difference between the retention increase rate and a rate reference value (a reference value for the retention increase rate).

Abstract: The program code, when executed by a processor, causes the processor to input fabrication data including a plurality of parameters associated with a semiconductor fabricating process to a framework to generate a first class for analyzing the fabrication data, to extract a first parameter targeted for analysis and a second parameter associated with the first parameter from the plurality of parameters and generate a second class for analyzing the first parameter as a sub class of the first class, to modify the first parameter and the second parameter into a data structure having a format appropriate to store in the second class, so as to be stored in the second class, to perform data analysis on the first parameter and the second parameter, to transform the first parameter and the second parameter into corresponding tensor data, and to input the tensor data to the machine learning model.

Abstract: A method for separating a workpiece along a separation line by using ultrashort laser pulses of a laser beam includes splitting the laser beam, using a beam splitter optical unit, into a plurality of partial laser beams. Each partial laser beam is focused by a focusing optical unit onto a surface and/or into a volume of the workpiece so that the partial laser beams are arranged next to one another and spaced apart from one another along the separation line. The method further includes implementing material ablation in the workpiece along the separation line by introducing the ultrashort laser pulses into the workpiece. The partial laser beams are repeatedly moved away from an initial position along the separation line by a deflection value and are subsequently moved back into the initial position. The deflection value is less than or equal to a distance between two adjacent partial laser beams.

Abstract: A transport system is provided. The transport system includes a stocker configured to store an assigned wafer carrier and having a gate port. The transport system also includes a semiconductor apparatus configured to transmit a request signal including a processed time according to a processing wafer carrier loaded on the semiconductor apparatus. The transport system further includes a vehicle configured to transport the assigned wafer carrier from the gate port to the semiconductor apparatus and a control system configured to control the vehicle. When the control system receives the request signal, the control system controls the stocker to transport the assigned wafer carrier inside of the stocker to the gate port at a start time, which is earlier than the processed time, and the control system controls the vehicle to transport the assigned wafer carrier from the gate port to the semiconductor apparatus.

Abstract: Metrology methods, modules and systems are provided, for using machine learning algorithms to improve the metrology accuracy and the overall process throughput. Methods comprise calculating training data concerning metrology metric(s) from initial metrology measurements, applying machine learning algorithm(s) to the calculated training data to derive an estimation model of the metrology metric(s), deriving measurement data from images of sites on received wafers, and using the estimation model to provide estimations of the metrology metric(s) with respect to the measurement data. While the training data may use two images per site, in operation a single image per site may suffice—reducing the measurement time to less than half the current measurement time. Moreover, confidence score(s) may be derived as an additional metrology and process control, and deep learning may be used to enhance the accuracy and/or speed of the metrology module.

Abstract: The present disclosure provides an apparatus for determining mounting information. The apparatus according to the present disclosure may be configured to acquire solder measurement information indicating a state of a solder printed on a first substrate, determine whether or not the state of the solder is changed from states of solders printed on second substrates, which are measured prior to measurement of the first substrate, based on the solder measurement information, upon the determination that the state of the solder is not changed, determine mounting information indicating a mounting condition for mounting a first component on the first substrate using one or more models, and deliver the mounting information to a mounter. The one or more models may be configured to output the mounting information based on a correlation between states of a second component before and after a reflow process for each of the second substrates.

Abstract: A height measuring device includes a light source that emits light in a direction oblique to a top surface of a specimen, a slit that shapes the light from the light source to form a slit image on the specimen, an imaging element that detects reflected light reflected by the specimen, and an arithmetic unit. The arithmetic unit: identifies a slit image of the reflected light reflected by the top surface of the specimen from among a plurality of slit images based on respective positions of the plurality of slit images on a detection surface of the imaging element; and determines the height of the top surface of the specimen based on the position of the slit image of the reflected light reflected by the top surface of the specimen on the detection surface.

Abstract: Embodiments of the present disclosure generally relate to apparatus and methods for reducing substrate backside damage during semiconductor device processing. In one implementation, a method of chucking a substrate in a substrate process chamber includes exposing the substrate to a plasma preheat treatment prior to applying a chucking voltage to a substrate support. In one implementation, a substrate support is provided and includes a body having an electrode and thermal control device disposed therein. A plurality of substrate supporting features are formed on an upper surface of the body, each of the substrate supporting features having a substrate supporting surface and a rounded edge.

Abstract: A system and method for identifying latent reliability defects (LRD) in semiconductor devices are configured to perform one or more stress tests with one or more stress test tools on at least some of a plurality of wafers received from one or more in-line sample analysis tools to determine a passing set of the plurality of wafers and a failing set of the plurality of wafers, perform a reliability hit-back analysis on at least some of the failing set of the plurality of wafers, analyze the reliability hit-back analysis to determine one or more geographic locations of one or more die fail chains caused by one or more latent reliability defects (LRD), and perform a geographic hit-back analysis on the one or more geographic locations of the one or more die fail chains caused by the LRD.

Abstract: A farming machine is configured to identify and treat plants in a field. The farming machine includes one or more light sensors for measuring a characteristic of light. The one or more light sensors are coupled to the farming machine and are directed a substantially upwards orientation away from the plants. A control system adjusts settings of an image acquisition system based on a characteristic of light measured by the one or more light sensors. The image acquisition system captures an image of a plant using one or more image sensors coupled to the farming machine, the one or more image sensors directed in a substantially downwards orientation towards the plants. The control system identifies a plant in the image and actuates a treatment mechanism to treat the identified plant.

Abstract: A method is provided for cleaning of a processing system comprising a wafer processing chamber and a pumping line in fluid connection with the wafer processing chamber. The method includes initiating cleaning of the wafer processing chamber by activating a chamber cleaning source and initiating cleaning of at least a portion of the pumping line by activating a foreline cleaning source coupled to the pumping line. The method also includes monitoring, at a downstream endpoint detector coupled to the pumping line, a level of a signature substance. The method further includes determining, by the downstream endpoint detector, at least one of a first endpoint of the cleaning of the wafer processing chamber or a second endpoint of the cleaning of the pumping line based on the monitoring.

Abstract: Disclosed is a malfunction early-warning method for production logistics delivery equipment. After a sensor obtains past signal data, performing feature extraction and dimensionality reduction so as to obtain a feature vector; using a growing neural gas (GNG) algorithm to divide normal state data into different operation situations so as to obtain several cluster centers, and calculating the Euclidean distance between the feature vector and the cluster centers obtained from current operation data, so as to obtain a similarity trend; constructing a past memory matrix, using an improved particle swarm algorithm to optimize an LS-SVM regression model parameter, and calculating the residual value of the current state. Finally, combining the residual value and the similarity trend to obtain a risk coefficient, assessing the equipment state, and issuing an early warning for an equipment malfunction.

Abstract: Multi-zone reactors, systems including a multi-zone reactor, and methods of using the systems and reactors are disclosed. Exemplary multi-zone reactors include a movable susceptor assembly and a moveable plate. The movable susceptor assembly and movable plate can move vertically between reaction zones of a reactor to expose a substrate to multiple processes or reactants.

Abstract: Embodiments disclosed herein include a diagnostic substrate, comprising a baseplate, and a first plurality of image sensors on the baseplate, where the first plurality of image sensors are oriented horizontal to the baseplate. In an embodiment, the diagnostic substrate further comprises a second plurality of image sensors on the baseplate, where the second plurality of image sensors are oriented at a non-orthogonal angle to the baseplate. In an embodiment, the diagnostic substrate further comprises a printed circuit board (PCB) on the baseplate, and a controller on the baseplate, where the controller is communicatively coupled to the first plurality of image sensors and the second plurality of image sensors by the PCB. In an embodiment, the diagnostic substrate further comprises a diffuser lid over the baseplate, the PCB, and the controller.

Abstract: A method, apparatus and device for determining production capacity boundaries are provided. In the method, related data for producing a run size of elements by a production device lot by lot is acquired and time intervals between production ending time points of adjacent lots are determined according to the related data; the determined time intervals are sorted to obtain a time interval sequence; distribution features of time intervals at two boundaries are parsed respectively to determine whether a data removing condition is satisfied; if Yes, an outlier is determined according to a mean value of the present time interval sequence, the time interval of the extraction step length where the outlier is located is removed, and whether the data removing condition is satisfied is determined; and if No, production capacity boundaries are determined according to minimum and maximum time intervals of the present time interval sequence and the run size.

Abstract: A substrate processing system includes: a measuring unit provided detachably with respect to a placement portion of a placement stage; a measuring jig for measuring a processing liquid; a liquid processing unit including a supplier which supplies the processing liquid to the measuring jig; a transfer mechanism for transferring the measuring jig between the measuring unit and the liquid processing unit; and a controller. The controller executes: a process of transferring the measuring jig in the measuring unit from the measuring unit to the liquid processing unit; a process of ejecting the processing liquid from the supplier to the measuring jig; a third process of transferring the measuring jig from the liquid processing unit to the measuring unit; and a fourth process of calculating an ejection amount of the processing liquid based on a measurement value in the measuring unit.

Abstract: An apparatus for controlling precursor flow. The apparatus may include a processor; and a memory unit coupled to the processor, including a flux control routine. The flux control routine may be operative on the processor to monitor the precursor flow and may include a flux calculation processor to determine a precursor flux value based upon a change in detected signal intensity received from a cell of a gas delivery system to deliver a precursor.

Abstract: A method includes: storing a carrier containing material in a storage; recording environmental data of the storage to a database while the material is in the storage; generating a forecast for the material in the carrier based on the environmental data; receiving a request for the material from a semiconductor fabrication tool; and providing the carrier to the semiconductor fabrication tool based on the forecast.

Abstract: A system and a method are disclosed for aligning process data to a flow of material in a manufacturing process. That is, the disclosed embodiments enable tracking of material as that material travels (e.g., via a transportation mechanism such as a conveyor belt) between various processing devices in the manufacturing process. Each processing device may include one or more sensors. For example, the disclosed system and method enable tracking the same material over different manufacturing steps.

Abstract: A method for characterizing post-processing data in terms of individual contributions from processing stations, the post-processing data relating to a manufacturing process for manufacturing integrated circuits on a plurality of substrates using a corresponding processing apparatus for each of a plurality of process steps, at least some of the processing apparatuses each including a plurality of the processing stations, and wherein the combination of processing stations used to process each substrate defines a process thread for the substrate; the method including: obtaining post-processing data associated with processing of the plurality of substrates in a cyclic sequence of processing threads; and determining an individual contribution of a particular processing station by comparing a subset of the post-processing data corresponding to substrates having shared process sub-threads, wherein a process sub-thread describes the process steps of each process thread other than the process step to which the particu

Abstract: A design method of a metal mask, a manufacturing method of the metal mask and a computer-readable storage medium are provided. The design method of a metal mask includes: calculating amounts of deformations of the metal mask in two directions perpendicular to each other based on a stretching force of the metal mask in use and deformation properties of the metal mask in the two directions; and compensating the deformations of the metal mask in the two directions by compensation amounts for the deformations, which are identical and opposite to the amounts of the deformations of the metal mask in the two directions, respectively.

Abstract: A dimension tolerance determining method and a system are disclosed. The method includes: determining initial tolerances of parts in assembled product; generating a plurality of tolerance data sets according to initial tolerances of parts, each tolerance data set containing a calculated part tolerance of each part; inputting the plurality of tolerance data sets into a key parameter generation module to generate a plurality of key parameters corresponding to the assembled product, wherein each key parameter corresponds to one tolerance data set; when the key parameters are located within a design range, calculating a plurality of assembly yield rates based on the tolerance data sets corresponding to the key parameters located within the design range; and selecting the tolerance data set corresponding to one of the assembly yield rates as the tolerances of the parts in the assembled product; wherein the key parameter generation module includes a neural network model.

Abstract: Embodiments of the present invention provide a connecting apparatus and a system. The connecting apparatus includes N interconnection units, M line processing units, and X switch processing units, where each interconnection unit is connected to at least one switch processing unit, each switch processing unit is connected to only one interconnection unit, each interconnection unit is connected to the M line processing units, each line processing unit is connected to the N interconnection units, M is a positive integer, N is a positive integer, and X is greater than or equal to N. In addition, the embodiments of the present invention further provide another connecting apparatus and system. According to the foregoing technical solutions, a connecting mode between an LPU and an SPU is relatively flexible.

Abstract: Embodiments of the present disclosure generally relate to a system used in a semiconductor device manufacturing process. More specifically, embodiments provided herein generally include apparatus and methods for synchronizing and controlling the delivery of an RF bias voltage signal and a pulsed voltage waveform to one or more electrodes within a plasma processing chamber. Embodiments of the disclosure include a method and apparatus for synchronizing a pulsed radio frequency (RF) waveform to a pulsed voltage (PV) waveform, such that the pulsed RF waveform is on during a first stage of the PV waveform and off during a second stage. The first stage of the PV waveform includes a sheath collapse stage. The second stage of the PV waveform includes an ion current stage.

Abstract: A method for categorizing a substrate subject to a semiconductor manufacturing process including multiple operations, the method including: obtaining values of functional indicators derived from data generated during one or more of the multiple operations on the substrate, the functional indicators characterizing at least one operation; applying a decision model including one or more threshold values to the values of the functional indicators to obtain one or more categorical indicators; and assigning a category to the substrate based on the one or more categorical indicators.

Abstract: A realistic feather growth may be represented between two surface manifolds in a modeling system. To perform the feather growth, a feather groom for a plurality of feathers between an inner shell of a creature and an outer shell of the creature is received. An inner manifold for the inner shell and an outer manifold for the outer shell is determined with a plurality of follicle points and a plurality of tip points. A first surface contour definition for the inner manifold and a second surface contour definition for the outer manifold is determined and used to determine a volumetric vector field between the inner manifold and the outer manifold. Thereafter, the plurality of feathers is generated between the inner manifold and the outer manifold using the follicle points, the tip points, and the volumetric vector fields.

Abstract: A positioning method for particles on a reticle includes: data of positions passed by a target reticle within a preset period of time is determined according to path data of the target reticle that includes particle information of the target reticle at each scan moment; position information of the target reticle when particles are present on a surface of the target reticle is determined according to the data of positions, to obtain target position data of the target reticle; reticle position data of the target reticle within adjacent scan moments is determined according to the target position data, and a particle source position of the particles on the surface of the target reticle is determined from the reticle position data according to position priorities; and a particle position analysis report of the target reticle within the preset period of time is generated according to the particle source position.

Abstract: Example artificial intelligence systems and methods provide parallel storage of data to primary storage and notification to a model server supported by the primary storage. A primary storage system receives operations on a training data set from a model trainer and sends a model instance of a computational model to a model server. When a new data element is received by a data ingester, the model server is initiated to evaluate the new data element using the model instance while the primary storage system stores the new data element in parallel.

Abstract: A method of evaluating tool health of a plasma tool is provided. The method includes providing a virtual metrology (VM) model that predicts a wafer characteristic based on parameters measured by module sensors and in-situ sensors of the plasma tool. A classification model is provided that identifies a plurality of failure modes of the plasma tool. An initial test is performed on an incoming wafer to determine whether the incoming wafer meets a preset requirement. The wafer characteristic is predicted using the VM model when the incoming wafer meets the preset requirement. A current failure mode is identified using the classification model when the wafer characteristic predicted by using the VM model is outside a pre-determined range.

Abstract: Processing raw data stored in an historian device for determining an amount of products passed through a process element in a process control environment is described. A count value is incremented by a counter at a rate at which products pass through the process element. The count value rolls over to zero when the count value reaches a rollover value R. An historian device periodically receives count value data points from the counter. A deadband value D is set in the historian device for distinguishing between rollovers, resets, and reversals. A client device queries the historian device for an amount of products passed through the process element for a timeframe. The historian device selects a set of count value data points from within the queried timeframe. The historian device determines, based on the selected data points and their quality, an amount of products passed through the process element.

Abstract: Aspects of the invention include systems and methods for implementing a CMOS circuit design that uses a sea-of-gates fill methodology to provide latch-up avoidance. A non-limiting example computer-implemented method includes identifying a fill cell in the circuit design. The fill cell can include a power rail, a ground rail, and a field-effect transistor (FET) electrically coupled to the power rail through a via. The method can include disconnecting the via from the power rail and moving the via to a disconnected node in the fill cell. Moving the via decouples a source or drain of the fill cell from a well of the fill cell, preventing latch-up while maintaining via and metal shape density.

Abstract: A method comprises receiving an integrated circuit (IC) chip design, and generating, by one or more processors, a wafer image and a wafer target from the IC chip design. The method further comprises generating, by the one or more processors, sensitivity information based on a determination that the wafer image and the wafer target converge, and outputting the sensitivity information. The sensitivity information is associated with writing a mask written for the IC chip design.

Abstract: A recognition method of a kerf includes a bonding step of bonding a workpiece to a dicing tape greater in size than the workpiece, a pre-machining imaging step of imaging an optimal region of the dicing tape where the workpiece is not bonded, a kerf forming step of forming a kerf in the optimal region by a cutting machine, a post-machining imaging step of imaging the optimal region with the kerf formed therein, and a recognition step of comparing intensities of light received at each two corresponding pixels in respective images of the optimal region as acquired by the pre-machining imaging step and the post-machining imaging step, subtracting the each two pixels where intensities of received light are the same, and recognizing as the kerf a region formed by the remaining pixels.

Abstract: An information processing apparatus configured to control display on a user interface includes an acquisition unit configured to acquire recipe data regarding a processing condition of a substrate processing apparatus configured to process a substrate and layout data regarding a layout of a processed portion of the substrate processed by the substrate processing apparatus, and a display control unit configured to perform control to display, on the user interface, information regarding the layout data and information regarding the recipe data related to the layout data, the layout data and the recipe data being acquired by the acquisition unit, in association with each other.

Abstract: Real-time intervention of an industrial process can include searching for a batch of candidate configurations for use by the industrial process, the batch of candidate configurations searched for by performing a batch Bayesian optimization (BBO). The batch of candidate configurations is transmitted to the industrial process to use in running the industrial process. A result of the run is received from the industrial process. Using the result in the BBO, a next batch of candidate configurations is searched. Whether a stopping criterion is met is determined, based on the next batch of candidate configurations and by applying a function to a BBO acquisition score. Responsive to determining that the stopping criterion is met, searching for the next batch of candidates is terminated.

Abstract: Methods, systems, and non-transitory computer readable medium are described for generating assessment maps for corrective action. A method includes receiving a first vector map including a first set of vectors each indicating a distortion of a particular location of a plurality of locations on a substrate. The method further includes generating a second vector map including a second set of vectors by rotating a position of each vector in the first set of vectors. The method further includes generating a third vector map including a third set of vectors based on vectors in the second set of vectors and corresponding vectors in the first set of vectors. The method further includes generating a fourth vector map by subtracting each vector of the third set of vectors from a corresponding vector in the first set of vectors. The fourth vector map indicates a planar component of the first vector map.

Abstract: A method to set up the parameters of solder paste screen printer while in a new product introduction (NPI). The method includes establishing a solder-printing database of a predetermined product and a database of different specifications of products, and training a first prediction model by reference to a solder paste screen printer (SPSP) and a solder paste inspection (SPI) based on the solder-printing database. A second prediction model is trained by reference to the SPI based on the database of different products. The method further includes predicting parameters for products with different specifications under multiple sets of printing parameters based on the first and second prediction models. An objective function based on the predicted measurements is established, and a specification of a product and a printing expectation parameters are input to the objective function for outputting many sets of printing-suggestion parameters of the new product.

Abstract: A method and a system for recording an integrated circuit version are provided. The method is adapted to a register in an integrated circuit, which includes the following steps: recording the integrated circuit version with N bits, in which N is an integer greater than 1; and amending only a bit value of at least one bit selected from the N bits that have not been used for denoting any past integrated circuit version each time when the integrated circuit is revised.

Abstract: Methods and apparatus for detecting a vacuum leak within a processing chamber are described herein. More specifically, the methods and apparatus relate to the utilization of a spectral measurement device, such as a spectral gauge, to determine the leak rate within a process chamber while the process chamber is held at a leak test pressure. The spectral measurement device determines the rate of increase of one or more gases within the processing chamber and can be used to determine if the processing chamber passes or fails the leak test.

Abstract: A sample testing system comprising: a transporting apparatus; a testing apparatus for obtain a sample and performing testing on the obtained sample; and a controller. The controller executes operation of: controlling the transporting apparatus so as to transport the sample rack in first direction, such that each sample container held in a sample rack is transported to a obtaining position on which the testing apparatus obtains a sample and then the sample rack is transported toward the second position; changing, when retesting of a sample contained in a sample container is necessary, the transporting direction from the first direction to second direction, and then controlling the transporting apparatus so as to transport the sample container accommodating the sample, for which retesting is necessary, to the obtaining position again. Sample testing method and a computer program product are also disclosed.

Abstract: A process control system for controlling a process including a plurality of sub-processes, the process control system including a plurality of control modules each associated with one of the plurality of sub-processes. At least one of the plurality of control modules includes a model, a communicator, and a controller. The model includes a sub-process model defining a relationship between variables of the associated sub-process, and an inter-sub-process model defining a relationship between a variable of another sub-process and at least one of the variables of the associated sub-process. The communicator communicates with control module associated with the another sub-process to determine an updated value for the variable of the another sub-process. The controller uses the model and the updated value to determine a control signal for adjusting a manipulated variable of the associated sub-process. The process control method is also provided that is performed by the process control system.

Abstract: A substrate treating method includes measuring an alignment state of a substrate placed on a hand of a transfer unit that transfers the substrate, transferring the substrate to a substrate alignment unit by the transfer unit when the alignment state of the substrate is faulty, aligning a location of the substrate by the substrate alignment unit, and temporarily correcting the location of the substrate before the substrate is loaded on the substrate alignment unit when it is measured in the measuring of the alignment state that the alignment state of the substrate exceeds a sensor reading range.

Abstract: A method involving obtaining a resist deformation model for simulating a deformation process of a pattern in resist, the resist deformation model being a fluid dynamics model configured to simulate an intrafluid force acting on the resist, performing, using the resist deformation model, a computer simulation of the deformation process to obtain a deformation of the developed resist pattern for an input pattern to the resist deformation model, and producing electronic data representing the deformation of the developed resist pattern for the input pattern.