Abstract: A system that prints three dimensional products, the system including at least one object incorporation device that incorporates non-printed objects into partially completed product, the non-printed objects not being printed by the system.

Abstract: A system and related methods for configuring and monitoring a spraying application system for installation and use at a site that is remotely located from the spraying system manufacturing site. The system provides a remote access module that provides spraying system operation and parametric information to be monitored at the manufacturing site to determine how the spraying system is operating and whether repair or maintenance should be initiated. Timer circuits are provided for determining time of usage so that repair/replacement alerts can be issued. Safety related parameters may also be monitored as a backup to the primary monitoring performed at the customer's site. The system also provides an extranet or other suitable site available, for example, via the Internet or other communication link, is used to provide an accessible database for historical data and configuration/installation information. A call-in feature is also provided as well as a system query log.

Abstract: A processor-based system for monitoring and optimizing an electrocoating operation comprising at least one data acquisition module configured to receive characteristics of the electrocoating operation and at least one process control module in communication with the at least one data acquisition module and the electrocoating operation. An electrocoating process that includes such a process or based system and methods of using the system are also disclosed.

Abstract: Semiconductor wafers are processed in conjunction with a manufacturing execution system using a run-to-run controller and a fault detection system. A recipe is received from the manufacturing execution system by the run-to-run controller for controlling a tool. The recipe includes a setpoint for obtaining one or more target wafer properties. Processing of the wafers is monitored by measuring processing attributes including fault conditions and wafer properties using the fault detection system and one or more sensors. Setpoints of the recipe may be modified at the run-to-run controller according to the processing attributes to maintain the target wafer properties, except in cases when a fault condition is detected by the fault detection system. Thus, data acquired in the presence of tool or wafer fault conditions are not used for feedback purposes. In addition, fault detection models may be used to define a range of conditions indicative of a fault condition.

Abstract: The present invention comprises systems and methods for providing electronic quality control in a process for applying a polyurethane to a substrate. One aspect of the present invention includes a computer-implemented method for providing electronic quality control during manufacturing of a polyurethane coated article. The method can include providing a user interface for a user to input at least one operating characteristic associated with a process for manufacturing a polyurethane coated article. Furthermore, the method can include receiving a selection of at least one operating characteristic from the user, and receiving at least one condition associated with the operating characteristic. Moreover, the method can include monitoring a process for manufacturing a polyurethane coated article, wherein a change to the operating characteristic can be detected. The method can also include generating a notification if the at least one condition is detected.

Abstract: The invention concerns a contactless numerical printing machine for products of average fluidity, such as varnish, glue, and conducting or scratchable ink, onto a substrate of variable thickness and dimensions. The machine includes a special device for printing without contact by projection. The projected materials are materials of average fluidity or composed of large-dimension molecules. The process used includes an electro-acoustic device for control of the projection, and a multiplicity of projection nozzles, each controlled individually. The machine also includes a production chain with different work stations, whose printing devices are controlled by a computer management system. The production chain allows printing with a certain precision in given zones located during the processing by an appropriate work station.

Abstract: A substrate processing apparatus includes a plurality of cells each including a predetermined processing unit, a transport mechanism, and a cell controller. The cell controller independently controls operations in each cell in accordance with transport setting and processing condition setting for each cell described in recipe data determined for each substrate unit to be processed. Because the processing and transport are performed independently of the operations of adjacent cells, substrates belonging to different substrate units are received through a feed inlet or the sane substrate inlet, are processed while being present in the same cell, and are transported to a feed outlet and a return outlet which are different substrate outlets. This allows the presence of different process flows in parallel.

Abstract: Shock waves occurring when opening a gate valve between two vacuum chambers and peeling of particles by a viscous force taking place when a gas is supplied into a vacuum chamber are necessary to be suppressed by the apparatus and method of the invention, whereby contamination of a substrate by particles is suppressed. If one vacuum chamber is a substrate processing chamber for performing a vacuum process on the substrate and the other chamber is a transfer chamber having a substrate transfer device therein, the gate valve is opened when inner pressures of both the vacuum chambers are less than 66.5 Pa and higher one thereof is less than twice a lower one thereof. Preferably, a purge gas for peeling of particles is supplied, before supplying the purge gas for pressure control, into the substrate processing chamber with a flow rate greater than that of the purge gas for pressure control.

Abstract: In a plasma processing method for monitoring data, first and second measurement data are obtained; and a first and a second model are formulated based on the first and the second measurement data. Further, third measurement data is obtained; and weight factors are obtained by setting the third measurement data as weighted measurement data wherein the weighted measurement data is obtained by multiplying each of the first and the second measurement data by one of the weight factors to produce first and second weighted data and summing the thus produced first and the second weighted data. Therefore, a third model is formulated by multiplying each of the first and the second model by one of the weight factors to produce first and second weighted models, and summing the thus produced first and the second weighted models.

Abstract: A three dimensional object creation system that prints objects layer by layer, the system including a plurality of printheads, the system printing at least part of each of multiple layers simultaneously, the system configured to enable at least one first printhead that is initially configured to print at least part of a first layer to be dynamically reconfigured to print at least part of a second layer, and wherein if at least one printhead initially configured to print the second layer fails whilst printing said second layer, said at least one first printhead is dynamically reconfigured to complete the printing of at least part of said second layer.

Abstract: A method for aligning multiple nozzle members in a solid free form build unit is disclosed. A geometric test shape having at least one investigational topographic region projecting outward from a central base is formed and analyzed for at least one physical characteristic correlative with nozzle member targeting accuracy. The physical characteristic is at least one of color hue shift, surface pattern irregularity, and dimensional accuracy.

Abstract: A system that prints three dimensional products, the system including at least one printhead that prints electrical connections to at least one object incorporated in the products.

Abstract: A method and system (1) for utilizing shaped orifices (e.g., sonic and simple orifices, and divergent nozzles) in the gas inject system (20) as part of a plasma process system. By utilizing the shaped orifices, directionality of gas flow (25) can be improved. This improvement is especially beneficial in high aspect ratio processing.

Abstract: Programmable material consolidation systems employing a machine vision system in combination with a 3-D printing system for accurately locating a position over a support element and optionally on a substrate on the support element, and forming structural features thereon. By use of the machine vision system, the precise location on a substrate or support element may be determined and communicated to the dispense element of the 3-D printing system such that a flowable material may be deposited and consolidated at a desired location to form a structural feature. Methods for forming various features and structures on a substrate employing the systems of the present invention are also disclosed.

Abstract: A three dimensional object creation system that prints objects layer by layer, the system including a plurality of printheads, the system printing at least part of each of multiple layers simultaneously.

Abstract: A method for rapid prototyping by using linear light as sources employs DLP (Radiation Hardening Formation) or LCD, together with the portable devices and linear light source to treat the raw material in two stages. The first stage is to spread the raw material to a selected zone by nozzles or rollers and illuminating the material to let the material being processed and have physical o mechanical changes. The second stage is to use more powerful linear light source with the cooperation of the portable DMD (Digital Micromirror Device) or LCD (Liquid Crystal Display) to illuminate the material to make it have a second times of physical o mechanical changes. By the piling up the layers of the material, a complete 3-D work piece is obtained.

Abstract: A system for creating three dimensional products is provided. The system has a plurality of subsystems, with each subsystem configured to print one layer of N1 of a plurality of layers making up a three dimensional product, where N1 is greater than 1 and to change the layer being printed on receipt of a change instruction. In the event that one of the subsystems fails, the system configures at least one of the remaining subsystems to synchronously change to print the layer of the failed subsystem without requiring transfer of data relating the respective layer to the said at least one remaining subsystems. When a subsystem is changed to printing a different layer, the system is arranged to reconfigure the subsystem to be capable of printing N2 of the plurality of layers, where N1 and N2 are the same number of layers.

Abstract: Manufacturing tools having a base and a working surface, such as trim steels, flange steels and die inserts, are formed by fabricating or casting a substrate out of a relatively ductile, low wear-resistant metal and forming the working surfaces such as cutting edges, flanging surfaces, die surfaces and die inserts by depositing layers of relatively hard, wear-resistant materials to the substrate by closed-loop direct-metal deposition or laser cladding. A multi-axis numerically controlled robot may be used to position and move a beam and deposition material over large substrates in forming such tooling.

Abstract: A method and system for utilizing a gas injection plate comprising a number of shaped orifices (e.g., sonic and simple orifices, and divergent nozzles) in the gas inject system as part of a plasma processing system. By utilizing the shaped orifices, directionality of gas flow can be improved. This improvement is especially beneficial in high aspect ratio processing.

Abstract: A method for rapid prototyping by using plane light as sources treats the raw material by two stages. The first stage includes a step of spreading raw material onto a defined zone by nozzles and rolling the material to have a flat surface and a step of illuminating the raw materials by plane light and electronic beams to cause a first time of physical or chemical changes. The second stage includes a step of using more powerful plane light source with cooperation with portable Digital Micromirror Device (DMD) or Liquid Crystal Display (LCD) to scan the selected zones of the material to cause a second time of physical or chemical changes, and a step of stacking the 2-D images so as to obtain a solid work piece.

Abstract: A mobile client for the automated production of forms, shapes, or patterns communicates with a library server. The patterns have predetermined dimensions and may be applied to surfaces of vehicles for the protection of the surfaces. A business method involving the mobile client and the library server includes single-use transactions.

Abstract: A substrate processing apparatus includes a plurality of cells each including a predetermined processing unit, a transport mechanism, and a cell controller. The cell controller independently controls operations in each cell in accordance with transport setting and processing condition setting for each cell described in recipe data determined for each substrate unit to be processed. Because the processing and transport are performed independently of the operations of adjacent cells, substrates belonging to different substrate units are received through a feed inlet or the same substrate inlet, are processed while being present in the same cell, and are transported to a feed outlet and a return outlet which are different substrate outlets. This allows the presence of different process flows in parallel.

Abstract: A method for limiting exposure of a substrate to potentially damaging radiation from a radiating apparatus. A database of information associated with the substrate is compiled, and the substrate is identified prior to processing the substrate on the radiating apparatus. The database of information associated with the substrate is accessed, including its past irradiation history of dosage and type of irradiation, based on the substrate identification, and the operation of the radiating apparatus is selectively modified based at least in part on the information associated with the substrate.

Abstract: According to one embodiment of the invention, a system for fabricating a part includes a computer operable to control the fabrication of a three-dimensional part using a solid CAD model, a deposition station operable to deposit successive two-dimensional layers of material to fabricate the three-dimensional part, and a machining station operable to remove at least a portion of one or more of the deposited two-dimensional layers of material. The deposition station includes a substrate on which to fabricate the three-dimensional part, a welding-based deposition system having a welding torch, a laser-based deposition system having a laser head, a plasma powder cladding system having a plasma torch, and a multi-axis robot operable to, when directed by the computer, utilize one of the welding-based deposition system, laser-based deposition system, and plasma powder cladding system to deposit any of the two-dimensional layers of material.

Abstract: A facility for selecting and refining electrical parameters for processing a microelectronic workpiece in a processing chamber is described. The facility initially configures the electrical parameters in accordance with either a numerical of the processing chamber or experimental data derived from operating the actual processing chamber. After a workpiece is processed with the initial parameter configuration, the results are measured and a sensitivity matrix based upon the numerical model of the processing chamber is used to select new parameters that correct for any deficiencies measured in the processing of the first workpiece. These parameters are then used in processing a second workpiece, which may be similarly measured, and the results used to further refine the parameters.

Abstract: A system that executes a process, the system including a plurality of subsystems, each of which performs a stage of the process, each of the subsystems configured to perform one of a first subset of N1 of the stages, where N1 is greater than 1 and to change the stage of the subset being performed on receipt of a change instruction; wherein, in the event that one of the subsystems fails, at least one of the remaining subsystems synchronously changes to performing the respective stage of the failed subsystem without requiring transfer of data relating the respective stage to the said at least one remaining subsystems, and when a subsystem changes to performing a different stage, the system reconfigures the subsystem to be capable of performing a second subset N2 of the stages where N1 and N2 have the same number of stages.

Abstract: A central controller for a powder coating system has a single processor connected to a memory, a gun controller input/output device and gun control logic for controlling a characteristic of a spray gun. An air flow controller input/output device and air flow control logic for controlling a characteristic of a pump providing air flow may also be included. A process input/output device for electrically communicating with a process input or a process output may also be included. Part identification and tracking logic, gun triggering logic, gun movement logic, booth control logic, part profiling logic and system monitoring and logging logic may also be included.

Abstract: A laser-aided, direct metal deposition (DMD) fabrication process is used for dies and molds having integrated sensors for monitoring and controlling characteristics that determine the quality of an article being processed. A method of fabricating such devices, as well as the “smart” devices themselves are disclosed. A system of manufacturing articles uses smart dies or smart molds so that various characteristics that affect the quality of the finished article are monitored during the die-forming or injection-molding process. The sensors, which are an integral part of the product-shaping devices, include simple thermocouples for measuring the temperature in various locations, as well as piezoelectric sensors and strain gages to monitor the build-up of stress and strain history caused by fluctuations in temperature during the fabrication process.

Abstract: A method for avoiding irregular shutoff of production equipment, includes: measuring regularly time-series data of characteristics of a rotary machine used in the production equipment running for the production; obtaining first failure diagnosis data subjecting the time-series data to a first real-time analysis; obtaining second failure diagnosis data subjecting the first failure diagnosis data to a second real-time analysis; predicting a status of the production equipment several minutes later using the second failure diagnosis data; and shutting off during a production process if the result of the prediction determines that the production equipment will shut off irregularly, and switching to a purge sequence for conducting a gas purge of the production equipment.

Abstract: A plasma processing apparatus has a plasma processing chamber having a plasma excitation electrode, a radiofrequency generator connected to the plasma excitation electrode, and a matching circuit for matching the impedance between the plasma processing chamber and the radiofrequency generator. The loss capacitance CX1 at a later time t1 after delivery is measured between the plasma excitation electrode and ground potential positions which are grounded. The performance is evaluated by whether or not the loss capacitance CX1 is less than 26 times the plasma electrode capacitance Ce1 at the later time t1 between the plasma excitation electrode and a counter electrode which cooperate with each other.

Abstract: When two structural components are to be joined, for example, when an aircraft skin section is to be secured to a stringer by an adhesive bonding, it is important that the joining surface areas are plane to avoid the formation of air inclusions in the joint because air inclusions weaken the mechanical strength of the joint. Thus, a surface topography that is not plane must be smoothed out prior to the joining. For this purpose the surface areas to be joined are optically scanned to provide topographical information for each surface area that needs to be smoothed out for providing a plane joining surface. The topographical information is processed to ascertain the configuration and volume of the surface topography that needs to be filled with a filler material to produce a plane surface or at least a smooth surface without hills and dales.

Abstract: A system and a method of fabricating a three-dimensional object consolidates material increments in accordance with a description of the object using a process that produces an atomically clean faying surface between the increments without melting the material in bulk. The CAD system (60) interfaces with a numerical controller (70), which controls an actuation system. The actuation system brings the support feed unit (62) the support ultrasonic welding unit (66), the object feed unit (64) and the object ultrasonic welding unit (68) into proper position in the work area (75), so that the ultrasonic consolidation of the layers takes place according to the CAD description of the object. In alternative embodiments, electrical resistance, and frictional methodologies are used for object consolidation. The invention further facilitates the construction and repair of dense objects, including fiber-reinforced composites and aerospace structures.

Abstract: When vehicle wheels are powder-coated with powder coating, those surfaces on which no coating is wanted are always also coated. To suck off the powder coating from these surface areas before it is baked in, a device which includes a conveyor system, an electronic camera and a suction station is used. The electronic camera records the axial and angular position of the vehicle wheels which pass it, and supplies corresponding data to a controller. After a certain time delay, this causes a suction head in the suction station to move, in such a way that it approaches the vehicle wheel with appropriate alignment of its axis and angular position, and using suction nozzles sucks off those surfaces of the vehicle wheel on which the powder coating is not wanted. During the suction process, the suction head moves together with the vehicle wheel, at the same speed.

Abstract: An intrinsically safe microprocessor controlled pressure regulator for operation in a hazardous environment. The intrinsically safe microprocessor controlled pressure regulator receives control commands that are input to a microprocessor in the hazardous environment. The microprocessor generates control commands to control operation of an intrinsically safe solenoid valve and an intrinsically safe piezo electric valve. The piezo electric valve generates an output signal for controlling operating parameters of the paint gun. One or a plurality of microprocessors may operate within a hazardous environment in order to control one or a plurality of intrinsically safe valves in the hazardous environment.

Abstract: A method and apparatus for creating three dimensional solid forms in metals, ceramics, organics or any combination thereof is made possible using a computer controlled system to create local environmental conditions that favor deposition from a material stream, precursor gas, weld process or plasma. In order to increase control and accuracy, the material can also be placed while the target area is monitored by a broadband poly-spectral imaging system, which provides dimensional, geometrical, chemical composition, stress and temperature feedback to the computer controlling the process. The local environmental conditions in the deposition area are controlled for magnetic, electric, and acoustic fields as well as for temperature, pressure, flow dynamics, and atmospheric composition. Complex materials can be “written” to match a computer's file of a three dimensional shape with virtually any material composition, surface finish, and geometrical complexity.

Abstract: The present invention is directed to a color selection method, which includes the steps of selecting colors in accordance with identification criteria supplied, for example, by a vehicle manufacturer; displaying the colors in the form of color reference chips on the screen of a display unit attached to a computer; selecting a desired color chip from the color reference chips on the screen; accessing and displaying color formulas; and then finally selecting a desired color formula that lists all the ingredients needed to prepare a coating composition, such as automotive refinish paint or architectural paint, from the color formulas displayed on the screen. The technician can then mix the ingredients, such as tints, in the proportions provided in the desired color formula to make the coating composition.

Abstract: A manufacturing method of a circuit substrate, in which an electronic circuit is formed on a surface of a base member by a solution jetting device. The manufacturing method comprises: jetting liquid drops of a solution which is supplied into a nozzle having a discharge port with an inner diameter of 0.1 &mgr;m to 100 &mgr;m and includes a plurality of fine particles to form an electronic circuit by melting and sticking to one another and a dispersant for dispersing the fine particles, from the discharge port toward the surface of the base member by applying a voltage of an arbitrary waveform to the solution to charge the solution; and exposing the jetted liquid drops received on the surface of the base member to light or heat to make the fine particles melt and stick to one another.

Abstract: A plasma processing apparatus has a plasma processing chamber having a plasma excitation electrode, a radiofrequency generator connected to the plasma excitation electrode, and a matching circuit for matching the impedance between the plasma processing chamber and the radiofrequency generator. The loss capacitance CX1 at a later time t1 after delivery is measured between the plasma excitation electrode and ground potential positions which are grounded. The performance is evaluated by whether or not the loss capacitance CX1 is less than 26 times the plasma electrode capacitance Ce1 at the later time t1 between the plasma excitation electrode and a counter electrode which cooperate with each other.

Abstract: A method is provided of adaptively controlling a paint system for painting vehicle bodies. The method includes the steps of obtaining an estimated Jacobian that identifies characteristics of the paint system and using the estimated Jacobian to determine initial conditions to be implemented for the next vehicle body to be painted in the paint system. The method also includes the steps of storing a database of appropriate initial conditions that resulted in satisfactory transient response in a rule-base and using the rule-base at start-up of the paint system or if the paint system fails to be satisfactorily controlled.

Abstract: A mobile client for the automated production of forms, shapes, or patterns communicates with a library server. The patterns have predetermined dimensions and may be applied to surfaces of vehicles for the protection of the surfaces. A business method involving the mobile client and the library server includes single-use transactions.

Abstract: A method for monitoring and assessing operation of a semiconductor fabrication facility comprises the steps of connecting a monitoring and assessment system to a system bus which is connected directly or indirectly to a manufacturing execution system and a plurality of semiconductor fabrication tools. Through a user interface, the state models can be configured for the semiconductor fabrication tools where each state model is based upon a set of defined triggers for each tool. During monitoring various messages are transmitted on the system bus between the semiconductor fabrication tools and the manufacturing execution system and the monitoring and assessment system, and appropriate triggers are generated based upon the messages where the triggers are selected from a set of defined triggers. During operation, the state models are updated for each tool affected by one of the triggers and transitions within the state models are recorded in a tracking database.

Abstract: A method of vacuum treatment is performed using a vacuum treatment system (1) comprising a vacuum treatment unit (31) for treating a wafer (W) placed on a wafer stage (10) and a controller (51) for controlling the vacuum treatment unit (31). A sensor wafer (11) of substantially the same shape and size as a wafer (W), which includes a detector element (11d) for detecting data about the state of a vacuum treatment and a data processing element (11p) for processing the detected data, is placed on the wafer stage (10) and treated in a vacuum by the vacuum treatment unit (31). While the sensor wafer (11) is subjected to a vacuum treatment, data on the state of the vacuum treatment is detected and processed. Based on the processed data, the controller (51) controls the vacuum treatment unit (31) to treat the wafer (W).

Abstract: Method of measuring extent of cure of a coating comprising operating a metal-containing substrate coating operation to provide a coated metal-containing substrate; positioning an investigative apparatus near the coated metal-containing substrate; and operating the investigative apparatus to obtain an extent of cure reading, the reading corresponding to an area on the coated metal-containing substrate

Abstract: Methods, systems and computer program products for controlling plating pulse rectifiers are provided by identifying one of the plurality of plating pulse rectifiers as a master plating pulse rectifier and identifying at least one of the plurality of plating pulse rectifiers, other than the master plating pulse rectifier, as a slave plating pulse rectifier. A recipe comprising a pulse pattern is downloaded to the master plating pulse rectifier and the slave plating pulse rectifier. A synchronization signal is transmitted from the master plating pulse rectifier upon initiating the pulse pattern of the recipe to the at least one slave plating pulse rectifier so as to cause the slave plating pulse rectifier to initiate the pulse pattern of the downloaded recipe. Plating pulse rectifiers suitable for use as master/slave plating pulse rectifiers and systems incorporating such plating pulse rectifiers are also provided.

Abstract: A method for coating a surface of a substrate material, such as a semiconductor wafer. The method includes providing a host controller, providing a self-controlled treatment module, connecting the self-controlled treatment module to the host controller, issuing treatment instructions from the host controller to the self-controlled treatment module, receiving the treatment instruction from the host controller at the self-controlled treatment module, and controlling the treatment of the material with the self-controlled treatment module to maintain compliance with the treatment instruction.

Abstract: There is provided an experimental management apparatus and experimental management program for electroplating that can carry out an electroplating experiment more efficiently and can manage experimental data more efficiently. The electroplating experimental management apparatus has a computer body 1a, which includes a central processing unit 101, a program memory 102, and a data memory 103. The program memory 102 stores a predicted value calculation program 102a for working out a predicted value of an experimental result based upon a physical property data file 103a and an arithmetic expression data file 103b read out of the data memory 103; an experimental data management program 102b for obtaining experimental data; and a data analysis program 102c for working out experimental data at each point of time during experiment based upon analysis of the experimental data obtained by the experimental data management program 102b.

Abstract: A supply system of a compound for CVD is provided with not only an order-processing device, an inventory data base, and a charging-processing device but also an analyzing unit having an analysis information output unit capable of analyzing a spent compound that is returned from a customer, and outputting, as analysis information, at least a weight of an unreacted compound in the spent compound; a regenerating unit having a regeneration information output unit for separating an unreacted compound from a spent compound and refining a separated unreacted compound, and for outputting, as regeneration information, at least an amount of regenerated compound; and a stock-material information database for storing shipment information of the spent compound at the time of initial shipment. When a shipment request comes from a customer, an order-processing device judges whether shipment is possible based on the information of an inventory data base and performs shipment processing if the shipment is possible.

Abstract: Direct metal deposition (DMDtm) is used to fabricate customized three-dimensional artificial joint components, thereby leading to enormous savings in terms of labor, cost and lead-time. The DMD fabrication process is interfaced directly to digital data derived through CAT scans, MRI or X-ray topography. A computer-aided design (CAD) file is then constructed in accordance with the digital data, and a tool path is generated as a function of the CAD file. The desired implant, or a portion thereof (such as just the outer surface) is then be fabricated by depositing material increments along the tool path using direct metal deposition (DMD). The process may be used for both solid and scaffold structure suitable to bone ingrowth or ongrowth. In the preferred mbodiment, a closed-loop DMD process is used wherein the size of the increments are controlled through optical monitoring. The materials forming the implant may include one or more metals, polymers, or ceramics, including zirconia or alumina.

Abstract: Standard samples including at least a polycrystalline semiconductor film are produced by the energy beam annealing method. Dependencies on wavelength of refractive index and damping coefficients of standard samples are measured by means of a spectral ellipsometer, and grain sizes are measured to be quantified. An estimated sample consisting of a polycrystalline semiconductor film is produced by means of the energy beam annealing method. A dependency on wavelength of a refractive index and a damping coefficient of the estimated sample is measured to be compared with the results of the standard sample. Thus, the optically measured results can be quantified, so that it is possible to accurately measure a mean grain size of a polycrystalline silicon of a sample to be estimated, in a short time of about 5 seconds to calculate mobility to accurately select non-defective from defective in a short time.

Abstract: An apparatus and a method for performing a chemical vapor deposition process that reduces particle contamination of a wafer, wherein a cleaning gas including a fluorine radical is introduced into the process chamber to clean the chamber. After loading a wafer in the process chamber, a deposition gas is introduced into the chamber to form a film on the wafer. An inert gas as a back flow-preventing gas is introduced into the process chamber through a cleaning gas supply line to prevent the deposition gas from flowing back toward the cleaning gas supply line. Thus, the cleaning gas supply line is prevented from being contaminated by the deposition gas and particle formation on the wafer during deposition of the film is reduced, so that yield and reliability of the semiconductor device may be improved.