Abstract: An integrated circuit includes a multiple number of processor cores and a system management unit. The multiple number of processor cores each operate at one of a multiple number of performance states. The system management unit is coupled to the multiple number of processor cores, for setting performance states of the multiple number of processor cores. The system management unit boosts a first performance state of a first processor core of the multiple number of processor cores based on both a first temperature calculated from an estimated power consumption, and a second temperature based on a temperature measurement.

Abstract: A method, system and computer program product implement memory performance management and enhanced memory reliability of a computer system accounting for system thermal conditions. When a primary memory temperature reaches an initial temperature threshold, reads are suspended to the primary memory and reads are provided to a mirrored memory in a mirrored memory pair, and writes are provided to both the primary memory and the mirrored memory. If the primary memory temperature reaches a second temperature threshold, write operations to the primary memory are also stopped and the primary memory is turned off with DRAM power saving modes such as self timed refresh (STR), and the reads and writes are limited to the mirrored memory in the mirrored memory pair. When the primary memory temperature decreases to below the initial temperature threshold, coherency is recovered by writing a coherent copy from the mirrored memory to the primary memory.

Abstract: A system is provided that automatically converts an input into one or more haptic effects in near real-time. The system senses the input in near real-time. The system automatically converts the sensed input into one or more haptic signals in near real-time. The system generates the one or more haptic effects based on the one or more haptic signals.

Abstract: A physical quantity sensor includes a sensor element, an integrated circuit that is electrically connected to the sensor element, and a ceramic package (base body) on which the integrated circuit is mounted. A first conductor pattern (interconnection pattern) for electrical connection with the outside is provided on one surface of the ceramic package. A second conductor pattern is provided to be electrically connected to the interconnection pattern. The second conductor pattern includes an interconnection pattern that passes through the inside of the ceramic package, and a metallized region that is exposed on the other surface of the ceramic package. The interconnection pattern is longer than a distance between the one surface and the other surface of the ceramic package.

Abstract: A data storage system and method for cold storage. The data storage system includes a plurality of data storage devices (DSD). Each DSD includes a processor, two ports, and a storage medium. The second port of each DSD is connected to the first port of a neighboring DSD, forming a sequential connection. A data command is sent to the first DSD in the sequential connection and the first DSD's processor determines whether the first DSD is a destination for the data command. If the first DSD is the destination, the storage medium of the first DSD is powered up. If the first DSD is not the destination, the data command is sent to a next DSD via the second port of the first DSD. The data command is sent through the sequential connection until it reaches the destination DSD, which services the data command.

Abstract: In managing temperature in a system on chip (SOC), a main temperature signal is generated using a main sensor, where the main temperature signal is a signal having a value corresponding to a main temperature of the SOC. Subsidiary temperature signals are generated using subsidiary sensors, where the subsidiary temperature signals are pulse signals having frequencies corresponding to subsidiary temperatures of subsidiary blocks in the SOC, respectively. An operation of the SOC is controlled based upon the main temperature signal and the subsidiary temperature signals.

Abstract: Proactively providing corrective measures for storage arrays includes: receiving data from a storage array, the data including one or more events; detecting, in dependence upon a problem signature, one or more events from the data indicative of a particular problem, where the problem signature comprises a specification of a pattern of events indicative of the particular problem experienced by at least one other storage array; determining whether the particular problem violates an operational policy of the storage array, the operational policy specifying at least one requirement for an operational metric of the storage array; and if the particular problem violates the operational policy of the storage array, deploying automatically without user intervention one or more corrective measures to prevent the storage array from experiencing the particular problem.

Abstract: Various embodiments of a thermal control methodology and apparatus are disclosed. In one embodiment, an integrated circuit includes one or more thermal sensors, comparison circuitry, and control circuitry. The comparison circuitry is configured to receive temperature readings from the one or more thermal sensors. The control circuitry is configured to reduce a performance level of one or more controlled subsystems responsive to the comparison circuitry determining that at least one temperature reading from the one or more thermal sensors exceeds one of one or more threshold values. A software-based thermal control mechanism may also execute concurrently with the apparatus.

Abstract: A system and method for reducing heat in a portable computing device includes clocking a processor such that it is provided with a full frequency over time t0 to t1. A timer is set to trigger a forced power collapse (“FPC”) that removes all power to the processor from time t1 to time t2. At time t2, the processor may be awakened such that it can resume processing at the full frequency. Advantageously, during the FPC, no leakage power (“PL”) is consumed by the processor between t1 and t2. The result is that the processor averages the same processing efficiency over time t0 to t2 as it otherwise would have if a reduced frequency had been provided to it. However, because no PL was consumed during the FPC, the generation of heat between time t1 and t2 that is related to PL is avoided.

Abstract: A temperature measurement system includes at least one filament configured to emit thermal radiation in a relatively broad and substantially continuous wavelength band that is at least partially representative of a temperature of the at least one filament. The system also includes an optical system configured to receive at least a portion of the thermal radiation emitted from the filament. The optical system includes a wavelength splitting device configured to split the emitted thermal radiation into at least one relatively narrow wavelength band of thermal radiation. The optical system also includes a detector array configured to receive the at least one relatively narrow wavelength band of thermal radiation and to generate electrical signals at least partially representative of the received thermal radiation. The temperature measurement system further includes a controller communicatively coupled to the detector array.

Abstract: A method that includes receiving data from a sensor that is configured to supply data related to an ice layer thickness on a skin surface, calculating the ice layer thickness, comparing the ice layer thickness to a threshold thickness, vibrating the skin surface using at least one mechanical element for a sufficient duration, sufficient frequency, and sufficient displacement to result in removal of a first portion of the ice layer thereby resulting in at least a partially deiced skin surface, and heating the partially deiced skin surface using at least one heating element. The method further includes heating from a leading edge of the skin surface to a trailing edge of the skin surface and heating the surface to result in a sufficient temperature increase in the skin surface for removal of a second portion of the ice layer.

Abstract: A cooling method is provided to remove heat generated by one or more electronic systems. The method includes providing a coolant-based cooling apparatus, redundant pumping units, redundant backup blowers, and multiple separate controllers. The cooling apparatus includes one or more heat exchange assemblies discharging heat from coolant of the cooling apparatus, and the redundant pumping units, which are coupled in parallel fluid communication, separately facilitate pumping of the coolant. The redundant backup blowers are disposed to provide, when activated, backup airflow across the electronic system(s). The multiple controllers control operation of the redundant pumping units and redundant backup blowers based, at least in part, on one or more sensed parameters.

Abstract: A cooling system is provided to remove heat generated by one or more electronic systems. The cooling system includes a coolant-based cooling apparatus, redundant pumping units, redundant backup blowers, and multiple separate controllers. The cooling apparatus includes one or more heat exchange assemblies discharging heat from coolant of the cooling apparatus, and the redundant pumping units, which are coupled in parallel fluid communication, separately facilitate pumping of the coolant. The redundant backup blowers are disposed to provide, when activated, backup airflow across the electronic system(s). The multiple controllers control operation of the redundant pumping units and redundant backup blowers based, at least in part, on one or more sensed parameters.

Abstract: An IHS includes an IHS chassis. A processor is located in the IHS chassis. At least one fan is located in the IHS chassis and in fluid communication with the processor. A temperature sensor is located in the IHS chassis. A fan controller is coupled to the processor, the at least one fan, the temperature sensor, and a storage device that includes a plurality of processor target temperatures that are each associated with a different ambient temperature. The fan controller is operable to receive a first ambient temperature from the temperature sensor, determine a first processor target temperature that is associated with the first ambient temperature, receive a temperature of the processor, and operate the at least one fan in order to reduce the temperature of the processor to the first processor target temperature.

Abstract: A system is disclosed comprising memory configured to store a temperature value based on a cost of a given energy resource, wherein the cost-based temperature value differs from a temperature value based on a temperature schedule. The system also comprises a controller operatively coupled to the memory and configured to compare the cost-based temperature value to the schedule-based temperature value, and to direct one of a cooling system and a heating system to maintain a temperature of an environment at the one of the cost-based temperature value and the schedule-based temperature value that results in an energy cost savings.

Abstract: Systems and methods perform comparison of data represented as charts, for example, bar graphs, pie charts, line charts or stacked bar charts. The charts present visual representations mapping source values to target values. A user can select charts associated with a data records for comparison from an index of data records. The user selects a chart and a particular source value from the reference chart. The target values corresponding to the source value from other charts are compared against the target value from the reference chart. An aggregate of the target values associated with the source value from each chart may be presented to the user. The user can also use multi-touch input to select object representing data and drag them to perform actions associated with the objects. The actions performed on the objects depend on the locations of the objects as the user drags them.

Abstract: The invention relates to a thermal validation apparatus including at least one lining, each lining defining a sink and intended to be inserted into a respective recess of the thermal processing device for heating or cooling biological samples, as well as a respective temperature probe arranged in each sink. Each sleeve is made of a plastic material.

Abstract: In an embodiment, a processor includes a first domain with at least one core to execute instructions and a second domain coupled to the first domain and including at least one non-core circuit. These domains can operate at independent frequencies, and a power control unit coupled to the domains may include a thermal logic to cause a reduction in a frequency of the first domain responsive to occurrence of a thermal event in the second domain. Other embodiments are described and claimed.

Abstract: There is provided a capacitive touch system including a gain control unit sequentially receiving a plurality of digital detected signals of a detection frame. The gain control unit includes a gain buffer and a control circuit. The gain buffer is configured to store a current gain sheet. The control circuit calculates a first gain sheet according to a setpoint and the digital detected signals of the detection frame, compares a current roughness of the current gain sheet with a first roughness of the first gain sheet and replaces the current gain sheet in the gain buffer by the first gain sheet when the first roughness is flatter than the current roughness.

Abstract: A memory control apparatus includes a temperature obtaining unit, a priority determination unit, and a write processing unit. The temperature obtaining unit is configured to obtain, in a memory having a plurality of measurement areas each including a plurality of unit areas, temperatures measured in the plurality of measurement areas. The priority determination unit is configured to determine a priority for each unit area in accordance with a degree of consumption and the temperature of the measurement area including the unit areas, the degree of consumption being a degree of consumption of the unit area which is caused by a write process performed. The write processing unit is configured to preferentially perform the write process with respect to the unit area having a higher priority as a data write destination.

Abstract: Provided are an image scanning device that can prevent a rise in the temperature and overloading or overheating of a conveying motor during continuous conveying of document sheets, and a conveying device that includes the image scanning device. According to the present invention, the temperature of a drive motor and the temperature of the periphery of the drive motor are predicted, and based on the predicted values, the conveying mode is selected.

Abstract: A controller determines a mode at a current time point, and corrects, on the basis of the determined mode and an elapsed time from a start time of the mode clocked by a timer to a current time point, an in-apparatus temperature detected by an in-apparatus temperature sensor on the basis of correction data so that the corrected temperature is calculated as an outside-air temperature.

Abstract: A data processing system and processor are provided for tracing thermal data via performance monitoring. A performance monitor is set into a tracing mode. Temperatures are sensed by a digital thermal sensor over a time period. The sensed temperatures are stored in a data structure and a trace of the sensed temperatures is graphically displayed.

Abstract: According to one embodiment, a first joint unit and a second joint unit are disposed with space on a heat radiation substrate. A joint area of the second joint unit is larger than that of the first joint unit. An insulated substrate is disposed on the first joint unit and the second joint unit. A corner region of the insulated substrate contacts the first joint unit. A first sensor to measure an acceleration of vibration applied to the insulated substrate is disposed thereon. The first sensor is more adjacent to the first joint unit than the second joint unit. A response spectrum of the acceleration is calculated. An extension status of joint failure of the first joint unit is decided by comparing a frequency of a maximum peak of the response spectrum with a reference frequency.

Abstract: A diagnostic device for a temperature sensor is provided in a power transfer device that transfers drive power generated by a drive power source in a vehicle. The diagnostic device includes: a warm-up state determining unit to determine whether the drive power source is in a predetermined warm-up completion state; and a low temperature offset malfunction determining unit to determine a low temperature offset malfunction in the temperature sensor when the warm-up state determining unit determines that the warm-up completion state is established, and the detected value from the temperature sensor is lower than a predetermined low temperature threshold.

Abstract: A test circuit of a semiconductor apparatus includes a test temperature information generation section, an erroneous operation prevention unit, and a refresh cycle adjustment unit. The test temperature information generation section outputs test temperature information having a plurality of bits in a test operation mode, and irregularly changes logic values of the plurality of bits and transition time points of the logic values. The erroneous operation prevention unit generates a temperature compensation signal in response to the test temperature information. The refresh cycle adjustment unit changes a cycle of a reference refresh signal in response to the temperature compensation signal, and generates a refresh signal.

Abstract: A method for discovering thermal relationships in a data processing environment is provided in the illustrative embodiments. An output temperature of a cooling unit operating in the data processing environment is changed from a previous output temperature to a new output temperature. The difference between the previous and the new output temperatures is a change in the output temperature. A change in an ambient temperature proximate to a data processing system is measured. The change in the ambient temperature is a difference between a previous ambient temperature and a new ambient temperature. An expression that represents a relationship between the change in the output temperature and corresponding change in the ambient temperature is determined. The expression is used to determine a cooling correspondence between the cooling unit and the data processing system.

Abstract: Provided is an apparatus for estimating an external temperature for monitoring a tire pressure. The apparatus includes a sensor transmitter configured to transmit stop time information which is obtained by measuring a stop time of a vehicle at certain intervals, by using wireless communication, and a sensor receiver configured to receive the stop time information through the wireless communication, and measure the external temperature by using the received stop time information.

Abstract: An ambient temperature determining modeling method using distorted ambient temperature compensation may include, (A) a distortion compensation factor applying step of applying a coolant temperature, an intake air temperature, an air volume, a vehicle speed, a soak time, and a gradient to ambient temperature determining modeling, (B) an ambient temperature learning prohibiting step of checking a “Hot Soak” condition and a “Long Idle” condition, and setting ambient temperature model learning prohibition when the “Hot Soak” condition and the “Long Idle” condition are satisfied at the same time, and (C) an ambient temperature distortion removing step of determining ambient temperature update conditions when the “Hot Soak” condition and the “Long Idle” condition are not satisfied at the same time, and adding the gradient to determine an ambient temperature.

Abstract: Devices and methods are described herein that are configured for use in laboratory testing, such as, for example, during a procedure including the monitoring and detection of chemical reactions. For example, the systems and devices described herein can be used during a procedure to monitor and detect polymerase chain reactions (PCR). In some embodiments, a sample container includes a container body that defines an interior volume and has an open end in fluid communication with the interior volume. A cap is sealingly engageable with the open end of the container body. The cap defines a receptacle that is configured to extend within a portion of the interior volume of the container body when the cap is sealingly engaged thereto. The receptacle can receive therein a sensor, such as, a temperature sensor that can monitor the temperature of a sample material disposed within the container body.

Abstract: A series of time-sequenced heat energy data arrays or data stream sets of a weld process region are processed by a weld data array or data stream processing system to produce a heat energy data set output that is related to weld process region features or weld process region heat energy data. The heat energy data set output can be displayed to a system user and modified by system user input to the weld data array or data stream processing system; alternatively, or in combination, the system user output and input, the heat energy data set output, or data produced from the heat energy data set output by the weld data array or data stream processing system, can be transmitted to a weld process controller to adjust parameters in the weld process responsive to the output of the weld data array or data stream processing system.

Abstract: An on die thermal sensor (ODTS) of a semiconductor memory device includes a high voltage generating unit for generating a high voltage having a voltage level higher than that of a power supply voltage of the semiconductor memory device; and a thermal information output unit for sensing and outputting a temperature as a thermal information code, wherein the thermal information output unit uses the high voltage as its driving voltage.

Abstract: A temperature is measured for each terminal of the battery unit. The magnitude and sign of a temperature differential is calculated from the temperatures. The temperature differential is then correlated to a deteriorating condition of the battery unit.

Abstract: An apparatus is provided that includes a first circuit to determine when a battery current falls below a threshold, a second circuit to measure a battery voltage and current in response to the first circuit determining that the battery current falls below the threshold, and a third circuit to store the measured battery voltage and current.

Abstract: The invention comprises a system for calculating a value for the effective thermal mass of a building. The climate control system obtains temperature measurements from at least a first location conditioned by the climate system. One or more processors receive measurements of outside temperatures from at least one source other than the control system and compare the temperature measurements from the first location with expected temperature measurements. The expected temperature measurements are based at least in part upon past temperature measurements obtained by said HVAC control system and said outside temperature measurements. The processors then calculate one or more rates of change in temperature at said first location.

Abstract: A device for signal processing. The device includes a signal generator, a signal detector, and a processor. The signal generator generates an original waveform. The signal detector detects an affected waveform. The processor is coupled to the signal detector. The processor receives the affected waveform from the signal detector. The processor also compares at least one portion of the affected waveform with the original waveform. The processor also determines a difference between the affected waveform and the original waveform. The processor also determines a value corresponding to a unique portion of the determined difference between the original and affected waveforms. The processor also outputs the determined value.

Abstract: A temperature sensor includes a constant current source and a transistor stack connected to the constant current source. The transistor stack includes a first transistor having a base connected to the constant current source and a collector coupled to a supply voltage. The collector of the first transistor is electrically isolated from the base of the first transistor. The transistor stack includes a second transistor connected to the first transistor. The second transistor has a collector connected to an emitter of the first transistor and has a base connected to the collector of the second transistor. The transistor stack includes an output node disposed between the constant current source and the base of the first transistor. A voltage of the output node is indicative of a temperature.

Abstract: According to one aspect, a portable electronic device having a heat generating component, a thermal sensor, an energy storage device for powering the portable electronic device, a thermal element thermally coupled to the heat generating component, the energy storage device, and the thermal sensor. The thermal element is sized and shaped so that heat generated by the heat generating component flows through the thermal element towards the thermal sensor and interacts with the energy storage device. The thermal sensor is used to monitor a thermal profile for the thermal element, and the monitored thermal profile is compared with an expected thermal profile to determine if the integrity of the portable electronic device has been compromised.

Abstract: A thermal sensor includes a comparator having a first and second input nodes. A reference voltage generator is electrically coupled with the first input node. The reference voltage generator is configured to provide a reference voltage that is substantially temperature-independent. A temperature sensing circuit is electrically coupled with the second input node. The temperature sensing circuit is configured to provide a temperature-dependent voltage. The temperature sensing circuit includes a current mirror. A first metal-oxide-semiconductor (MOS) transistor is electrically coupled between the current mirror and ground. A first resistor is electrically coupled with the current mirror. A second MOS transistor is electrically coupled with the first resistor in series. The second MOS transistor and the first resistor are electrically coupled with the first MOS transistor in a parallel fashion.

Abstract: A method to determine the heat transfer through some enveloping surface is being presented, where a convective as well as a radiation heat-transfer is considered.

Abstract: A method for correcting an ambient pressure measurement, a method for calculating a temperature, and an apparatus for affecting the same for an aircraft measuring system are provided. The methods include the steps of receiving an airspeed measurement from a laser sensor, receiving a total pressure measurement, and calculating an ambient pressure correction. A corrected ambient pressure or a calculated temperature may be calculated. The apparatus includes a laser sensor configured to provide an airspeed measurement, an aircraft instrument configured to provide a total pressure measurement, and a processing system.

Abstract: A temperature measurement apparatus for estimating a temperature profile in a process container, includes a radiation temperature measurement unit configured to measure the temperature of plural temperature measurement areas at a surface of the rotating table in a radius direction of the rotating table by scanning the surface of the rotating table in the radius direction; an operation control unit that controls to start heating of the process container by a heater while keeping the rotating table immobilized, and controls to repeat a scanning operation, in which the radiation temperature measurement unit scans the surface of the rotating table in the radius direction to obtain the temperature of the plural temperature measurement areas while the rotating table is rotated in a circumferential direction of the rotating table, after a predetermined period has passed from starting the heating of the process container.

Abstract: A method and system for managing one or more thermal policies of a portable computing device (PCD) includes monitoring temperature of the portable computing device with internal thermal sensors and external thermal sensors. If a change in temperature has been detected by at least one thermal sensor, then a thermal policy manager may increase a frequency in which temperature readings are detected by the thermal sensors. The thermal policy manager may also determine if a current temperature of the portable computing device as detected by one or more of the thermal sensors falls within one or more predetermined thermal states. Each thermal state may be assigned a unique set of thermal mitigation techniques. Each set of thermal mitigation techniques may be different from one another. The sets of thermal mitigation techniques may differ according to quantity of techniques and impacts on performance of the PCD.

Abstract: Temperature is determined by measuring the time it takes to charge a capacitor with a resistive temperature sensor. A clock, time counter, a voltage comparator and voltage reference are used in determining a coarse time measurement. The time measurement resolution is enhanced with the addition of a constant current source charging another timing capacitor within a single clock pulse time to provide a fine time measurement.

Abstract: An adaptive algorithm running on a processing device receives a temperature value that represents a temperature at a gate terminal of a transistor. The adaptive algorithm, determines a drive strength value that represents a drive strength for a signal based on the temperature value. A signal with the determined drive strength is applied to the gate terminal of the transistor.

Abstract: A method and system is disclosed for monitoring switchgear. The current supplied to the main bus is measured. The current flowing through a plurality of feeder circuits is also measured. The temperature of the main bus at one or more nodes is measured, wherein a node is a connection point between the main bus and each feeder circuit. The current flowing through one of the nodes is determined by subtracting the current flow through each the feeder circuit upstream from the node, from the current supplied by the input circuit. An alarm condition is determined if the temperature at a node exceeds a predetermined temperature value for a given current flow through the node. The alarm condition is thereafter displayed to a switchgear operator.

Abstract: According to one embodiment, a carbon dioxide separation recovery system includes an absorption tower that allows carbon dioxide to be absorbed to an absorption liquid, a regeneration tower that regenerates the absorption liquid, a reboiler that heats the absorption liquid of the regeneration tower, using a heating medium, and a measuring device that measures an amount of heat supplied to the absorption liquid from the heating medium. The measuring device includes a cooler that cools the heating medium discharged from the reboiler, and obtains the amount of heat that is supplied to the absorption liquid from the heating medium by subtracting an amount of heat that is retained by the heating medium cooled by the cooler and an amount of heat, which is removed from the heating medium in the cooler, from an amount of heat that is retained by the heating medium supplied to the reboiler.

Abstract: According to one embodiment, a temperature sensor includes: a voltage generating part generating (2N?1)-midpoint voltages (N is a natural number equal to or larger than 2) based on a reference voltage which does not depend on a temperature; a sense part generating a temperature sensing voltage which depends on the temperature; and an arithmetic part is configured to generate N-bit temperature data by executing first to N-th operations each comparing the temperature sensing voltage with one of the (2N?1)-midpoint voltages.

Abstract: A device may receive thermal event data corresponding to thermal activity. The thermal event data may be received from a sensor device corresponding to a detection zone. The device may determine whether the thermal event data exceeds a detection threshold. The device may create a response to the thermal event data when the thermal event data exceeds the detection threshold. When the thermal event data does not exceed the detection threshold, the device may disregard the thermal event data.

Abstract: A method for determining a bed temperature setpoint for use with a powder in a selective laser sintering machine is disclosed. The method includes the step of providing a powder comprising a polymer for use in a selective laser sintering machine. The method further includes the step of determining a ratio of a liquid portion of the powder to a solid portion of the powder as a function of temperature within a temperature range. A bed temperature setpoint is selected in the temperature range corresponding to a desired ratio of the liquid portion of the powder to the solid portion of the powder. A temperature of a bed of a selective laser sintering machine is set to the selected bed temperature setpoint, and a part is built from the powder using the selective laser sintering machine.