Abstract: A method is provided for a process control based on tool health data. The method comprises processing a workpiece using a processing tool, receiving trace data associated with the processing of the workpiece from the processing tool and determining at least one value associated with a health of a portion of the processing tool based on at least a portion of the received trace data. The method further comprises adjusting processing of another workpiece based on the determined health value.

Abstract: A method for generating a predictor of failure of a manufacturing process. The predictor is generated by generating a candidate solution for the predictor and then determining a fitness of the candidate solution using fitness cases pertaining to the manufacturing process and a set of costs associated with the manufacturing process. The fitness may then be used to formulate a next generation of candidate solutions for a design method modeled on evolution.

Abstract: Based on a plurality of defects' position-coordinates and attribute detected by an inspecting apparatus, defects that are easily detectable by an observing apparatus are selected. With these selected defects employed as the indicator, the observing apparatus detects and observes the defects. Moreover, creating a coordinate transformation formula for representing a correlated relationship in the defects' position-coordinates between both the apparatuses, the observing apparatus transforms the defects' position-coordinates so as to observe the defects.

Abstract: The present invention relates to a method and system for efficiently determining grating profiles using dynamic learning in a library generation process. The present invention also relates to a method and system for searching and matching trial grating profiles to determine shape, profile, and spectrum data information associated with an actual grating profile.

Abstract: A system/method of establishing a two-way communication system between a testing/manufacturing site and a component vendor is disclosed. The system allows the test results related to a component failure to be immediately available to a vendor by allowing the vendor password protected access to a product database that contains information regarding the product being tested. The system automatically alerts the vendor associated with the defective component, and allows the vendor to download the vendor's failure analysis report to the product database as soon as it becomes available. Upon receipt of the vendor's failure analysis report, the appropriate testing/manufacturing personnel are notified.

Abstract: A system that includes a graphical user interface (GUI) connected to an input/output device of a computer system and one or more test instruments producing a set of electrical signals. The system also includes a probe card that has a multiple probe needles used for measuring electronic characteristics of each of the devices on a semiconductor wafer. Each device has cells. Each cell has a set of bond pads. The system also has a matrix switch and an interface conduit electrically connecting the one or more test instruments, the computer, the probe card, and the matrix switch together. The semiconductor wafer is moved so that the probe needles measure the electrical characteristics of each cell for each device selected for testing.

Abstract: A method and apparatus is provided for identifying a cause of a fault based on controller output. The method comprises processing at least one workpiece under a direction of the controller and detecting a fault associated with the processing of the at least one workpiece. The method further includes determining a plurality of possible causes of the detected fault, identifying a more likely possible cause out of the plurality of possible causes, providing fault information associated with the identified more likely possible cause to the controller. The method further includes providing fault information associated with the identified more likely possible cause to the controller. The method further comprises adjusting the processing of one or more workpieces to be processed next based on the fault information provided to the controller.

Abstract: A method for examining quality of a flat panel display device is disclosed, in which good/fail of the flat panel display device is automatically examined to improve efficiency of the operation and obtain exact examined result. The method for examining good/fail of a flat panel display device includes the steps of inputting defect data for each process step, automatically examining good/fail of the panel depending on the input defect data, and measuring good/fail and yield of a glass based on the examined result of the panel.

Abstract: A method and system are provided for analyzing defects having the potential to become electrical failures, during the inspection of particles and/or pattern defects of a wafer used in the manufacture of electronic devices such as semiconductor integrated circuits. Defect map data is processed along with failure probability data. Next, defect-dependent failure probability calculations are made to obtain the failure probability of each defect in the defect map data. That data is then used to prepare failure-probability-added defect map data. Further, a selection process of defects to be reviewed is used to reorder and filter defects from the failure-probability-added defect map data, thus selecting one or more defects for review.

Abstract: The present invention is directed to a system and method for providing access to semiconductor manufacturing information. The present invention system and method allows users to interface with semiconductor characteristic data and to data associated with manufacturing conditions over a network. The system includes at least one input device for entering manufacturing data. A data storage device capable of storing the database of manufacturing data, including semiconductor characteristic data and manufacturing conditions is networked to the at least one input device. A plurality of remote devices suitable for interfacing with the data are networked to the storage device, such that the manufacturing data is provided to a website for access upon occurrence of failure event.

Abstract: A method and system for testing an integrated circuit. The method comprises the steps of obtaining periodic optical emissions over a defined period of time and from a defined area of an integrated circuit operating with time-varying internal currents, and time resolving said emissions by photon timing to estimate the number of switching events occurring in said defined area over said defined period. The method further comprises the steps of providing an optical emission model, and comparing the optical emissions from the area of the integrated circuit with the optical emission model to determine whether any of a group of defined conditions are present on the integrated circuit. For example, this test may be used to detect local power supply loading under high power density operation, or to derive changes in mobility due to heating effects.

Abstract: A method and an apparatus are provided for adjusting a sampling rate based on a state estimation result. The method comprises receiving metrology data associated with processing of workpieces, estimating a next process state based on at least a portion of the metrology data and determining an error value associated with the estimated next process state. The method further comprises processing a plurality of workpieces based on the estimated next process state and adjusting a sampling protocol of the processed workpieces that are to be measured based on the determined error value.

Abstract: A system and method for measuring an object using different measurement apparatuses located at various measurement stations, and for gathering measurement data on the object automatically. The system comprises a plurality of measurement computers (100) located at a plurality of measurement stations (160) for executing measurement programs for the object and gathering measurement data on the object, a plurality of measurement apparatuses (120) linked with each measurement computer at each corresponding measurement station for measuring the object, a server (130) for storing various measurement programs for the object and measurement data on the object, and a data process computer (150) for collecting measurement data on the object gathered from the measurement apparatuses at the various measurement stations and for generating a measurement data report on the object.

Abstract: A method and systems for automatically adjusting the parameters of signal emitter in a synchronous high-speed transmission system, is disclosed. According to the method of the invention, the quality of a high-speed received signal is analyzed for a plurality of sets of parameter values and the one producing the best signal quality is selected. In a first embodiment, the quality of the high-speed received signal is determined by analyzing a digital eye characterizing the signal behavior, obtained by over-sampling the high-speed received signal. In a second embodiment, the quality of the high-speed received signal is determined by analyzing the behavior of the phase rotator used for data sampling. Finally, in a third embodiment, the quality of the high-speed received signal is determined by analyzing a digital eye, obtained by moving the position of a phase rotator from one end to the other and sampling data at each position.

Abstract: The method and respective device monitors the quality of data transmission over wavelength-division-multiplexed channels on an optical waveguide using an analog check signal. The analog check signal is formed by decoupling and combining a fraction p of the signals of each of the wavelengths being monitored at a starting point of a monitoring path, and is then transmitted on an additional wavelength in parallel with the wavelengths being monitored. At a monitoring point on the monitoring path provided for the purpose, a fraction p of the signals on the wavelengths being monitored are decoupled again, as well as at least a fraction of the analog check signal. These decoupled signals are evaluated in order to determine if these has been any change in the intensities of the signals on the wavelengths being monitored between the starting point and the monitoring point.

Abstract: A method and apparatus for providing quality control in a medical analysis instrument is provided. The method includes the steps of: 1) sending one or more quality control specimens to an operator of the analytical instrument; 2) directly or indirectly communicating control data to the analytical instrument, wherein the control data relates acceptable standards to the analytical instrument; 3) analyzing the quality control specimen using the analytical instrument and thereby creating instrument analysis data; 4) evaluating the instrument analysis data using the control data to determine a functional status of the analytical instrument; 5) providing notice to the operator regarding the functional status of the analytical instrument; and 6) optionally preventing the reporting of patient data from the instrument if the functional status is unacceptable.

Abstract: An electronic test system with a test results view filter that enables the user to filter the test results of a test program according to their particular datapoint value status. The test results view filter is preferably comprised of graphical elements representing a plurality of test results view filter option buttons grouped together in said test results view filter. Each test result view filter option button is capable of filtering an entire test program for their respective datapoint value status and displaying said filtered datapoint value status. The test results view filter option buttons are selected from the group consisting of: all datapoint value status, failed datapoint value status, marginal datapoint value status, and selected datapoint value status.

Abstract: A recipe comparison system having recipe management ability in both offline accessing and online operating modes. The recipe comparison system includes an equipment server, an analysis module, and a recipe management module. The equipment server receives an upload signal, and then sends a recipe to the analysis module based on the upload signal. Then, the analysis module parses the recipe into internal-format-data according to a parsing rule, and outputs the internal-format-data to the recipe management module. If the recipe comparison system is in offline accessing mode, the recipe management module checks whether the internal-format-data obeys a specification definition. If the recipe comparison system is in the online operating mode, the recipe management module compares the internal-format-data with a standard recipe stored in a storage module.

Abstract: In the step (S11), chip classification data in which a plurality of chips are classified into four sorts on the basis of presence/absence of (new) defects and pass/fail (of integrated circuits) is obtained. Next, in the step (S12) set is a situation where chips are randomly extracted out of all the chips with the number of chips with defect used as random extraction number on the basis of the chip classification data obtained in the step (S11). After that, in the step (S13) obtained is the random probability of failure (P(N4)) which is a probability that the number of faulty chips included in the randomly-extracted chips should be not less than the equivalent of the number (N4) of faulty chips with defect. Thus obtained is a defect analysis method and a method of verifying chip classification data, by which the analysis result on the basis of the chip classification data can be enhanced.

Abstract: The present invention is generally directed to a method and a structure for calibrating a scatterometry-based metrology tool used to measure dimensions of features on a semiconductor device. In one illustrative embodiment, the method comprises measuring a critical dimension of at least one production feature formed above a wafer using a scatterometry tool, measuring at least one of a plurality of grating structures formed above the wafer using the scatterometry tool, each of the grating structures having a different critical dimension, and correcting the measured critical dimension of the at least one production feature based upon the measurement of the at least one grating structure.

Abstract: The present invention is a method to monitor and analyze the performance of a hydrocarbon-processing unit such as pipestill or hydrocracker unit. The invention includes the steps of collecting historical data relating to the hydrocarbon processing unit, from a process history database, validating the historical data, correcting the data performing a workup to determine the output measurements for the hydrocarbon processing unit, and storing the results of the workup in the process history database.

Abstract: The present invention includes a central control system and method for fine tuning a cigarette manufacturing process. A measurement device captures measurements of particular cigarette properties. The measurement data is sent to and stored in a central database. Once sufficient measurement data has been stored, the data is loaded into an optimization program that outputs optimized controlled parameters that may be used by individual control systems to better control the properties of the cigarettes during manufacture. The central control system and method may be used with both off-line and in-line measurement devices, and can communicate and control such devices regardless of the manufacturer thereof.

Abstract: A method and system for processing a claim for a failed material supplied by a material supplier to an equipment owner, wherein the failed material is received by a claim initiator on behalf of the equipment owner. The claim initiator is provided with access to an automated claim system, which includes a database, via a claim initiator interface. A failed material claim report, which includes information related to the failed material, is received from the claim initiator via the claim initiator interface. A failed material claim record, which includes at least some of the information related to the failed material, is created in the database. An electronic message is generated to notify the equipment owner of the failed material claim report. An electronic message also is generated to notify the material supplier of the failed material claim report. The material supplier is then provided with access to the automated claim system via a supplier interface.

Abstract: Method and apparatus for providing dynamic testing of electronic assemblies during their manufacture. A production line includes a communication network to interconnect assembly and inspection equipment. Events impacting the manufacture of the assemblies are communicated among the equipment, allowing the testing to be dynamically adjusted in response to events. Dynamic adjustment allows the process to quickly detect defects introduced by events. The concept is illustrated with a production line that has a pick and place machine and an inspection station. When an operator changes a reel of components at the pick and place machine, the inspection station will switch test programs to quickly verify that the correct reel has been loaded.

Abstract: A method and system in metrology for integrated circuits, for incorporating the effects of small metrology hardware-based and material-based parameter variations into a library of simulated diffraction spectra. In a first embodiment, a method is disclosed for determining metrology hardware specification ranges that correspond to specified CD measurement accuracy. In a second embodiment, a method for modifying a library of simulated diffraction spectra for optimization to the particular parameters of a specific piece of metrology hardware and specific material batches is disclosed.

Abstract: A method and system for providing quality control through random sampling is provided. The system includes several modules for supporting the random sampling. A first module is adapted to select a technician for performing a procedure in association with an instrument. A second module is adapted to identify a random position for placement of a quality control on the equipment. A third module is adapted to select a random time interval for the selected technician to perform the procedure. A fourth module is adapted to select any analyzable specimen for repeat analysis or for selecting a patient sample for repeat analysis. Accordingly, the four modules enable random selection of several variables including the selection of the technician, instrument, position, time, and repeat testing.

Abstract: A method for measuring the number of yield loss chips and the number of poor chips by type due to defects of semiconductor chips by which it is possible to remarkably improve the yield of semiconductor chips by measuring the number of yield loss chips due to defects of the chips, the maximum number of yield loss chips, and the number of the specific type of poor chips in an arbitrary process, an arbitrary equipment, and an arbitrary process section among semiconductor fabrication processes, thus managing the defects of the chips, is provided.

Abstract: Method, apparatus and product for analyzing a quality control regimen comprising one or more quality control tests, to determine if the tests are in statistical control, and therefore could be removed from the regimen or sampled at a different rate. On sample data relating to each of the tests, there is determined Cpi, a measure of the spread of the data, which is simply the ratio of the magnitude of the actual range of the data, to the magnitude of calculated statistical range of the data. There is also determined CPKi, which is a measure of how close the spread of the data is to the upper or lower limit of the data. For convenience, the magnitude of Cpi is represented as a vertical bar graph, with the value of CPKi shown as a position of the bar graph within normalized limits. Using Cpi and CPKi decisions regarding removal of each the test can be made.

Abstract: An improved method and system for solving a combinatorial optimization problem, such as a tracking problem, to define a plurality of associations of measurements taken of a plurality of objects is provided. In one aspect, a method, a system and a computer program product are provided for constructing a plurality of updated tracks by solving a Lagrangian dual in which each of the measurement constraints has been relaxed. In another aspect, a hybrid branch and bound and LR technique is provided to select a plurality of updated tracks from among a plurality of candidate tracks having respective initial costs. In this regard, a search tree of the candidate tracks is ordered based upon the initial costs of the candidate tracks as adjusted by the dual variables that have been defined as a result of solving a Lagrangian dual.

Abstract: A method of performing an operation comprises operation steps and evaluation steps. The evaluation steps comprise: identifying a set of performance shaping factors which influence the outcome of the operation; allocating a probability value to each performance shaping factor, the probability value representing the influence of the respective performance shaping factor on the performance of the operation; allocating a weighting value to each performance shaping factor, the weighting value representing the significance of the respective performance shaping factor relative to at least one other of the performance shaping factors; calculating, from the probability values and the weighting values, an effectiveness value representing the effectiveness of the operation. The operation may be an inspection process, for example on an aircraft or a fleet of aircraft.

Abstract: A method of predicting the effect of blob test in GSP sample testing is disclosed.

Abstract: A quality control system implemented by a service provider for a user via the utilization of sophisticated software algorithms in creating a library of profiles based on product specification. These libraries of profiles are compared with profiles of manufactured products to ensure that manufactured products are within the specification. While the measurement of the manufactured products can be taken in real time, the generation of the profile library is very computationally intensive and requires the use of a highly parallel set of computer workstations for its operation. The system allows for the separation of the computational intensive process from the real-time measurement reading, and creates an opportunity for a service provider to generate and maintain the libraries offsite.

Abstract: The present invention relates to the marking and identification of defective die sites on a mounting substrate. A mounting substrate is provided which is inspected and tested for visual and electrical defects. Information relating to the functionality and/or various defects of one or more die sites is then encoded in the form of a designator placed on the substrate. The information encoded on the designator may then be read or scanned by, for example, computer-driven video equipment and used in a die-attach process to discriminately place semiconductor dice only on known good die sites. Embodiments of the designator include information encoded in the form of a bar code, a series of identifying marks, a strip of magnetic tape or a computerized map of a mounting substrate. Correlated data regarding die site functionality can then be electronically transferred to a die-bonding apparatus.

Abstract: A method of manufacturing IC devices from semiconductor wafers includes providing the wafers and fabricating IC's on the wafers. At probe, a unique fuse ID is stored in each IC, and an electronic wafer map is electronically stored for each wafer indicating the locations of good and bad IC's on the wafer and the fuse ID's of the IC's on the wafer. Each IC is then separated from its wafer to form an IC die, and the IC dice are assembled into IC devices. At the opens/shorts test at the end of assembly, the fuse ID of each IC in each device is automatically retrieved so the wafer map of the IC device may be accessed and evaluated to identify any IC devices containing bad IC's that have accidentally been assembled into IC devices. Any “bad” IC devices are discarded while remaining IC devices continue on to back-end testing.

Abstract: The present invention provides a method for ensuring image consistency of an image printed onto a plurality of substantially identical objects printed by different vendors at different times and/or locations: The method involves receiving a plurality of inks and a product-printing facilitating kit which provides a three step printing process which may be carried out by multiple vendors to provide the same image on all of the objects. The product-printing facilitating kit comprises a film-positive standard having a black image in a plurality of different tones thereon, a digital file encoding said film-positive standard, a plurality of test-print standards each of said test-print standards having one of said inks printed thereon in a plurality of different tones, and a list of suggested parameters for producing a test film positive and a plurality of test-printed objects.

Abstract: The present invention provides a system by which the host can receive an ongoing reliability audit of a component supplier's production test results over the Internet. This invention analyses and graphs the test results to determine component reliability and to detect changes in reliability over time. One parameter used to detect these changes is mean time between failure (MTBF). This invention uses statistical analysis to determine the reliability status and to detect changes in reliability.

Abstract: A method includes measuring a characteristic of a workpiece at a plurality of locations. A uniformity profile is generated based on the characteristic measurements. At least one acceptable region of the workpiece is identified based on the uniformity profile. At least one unacceptable region of the workpiece is identified based on the uniformity profile. The uniformity profile is filtered to remove at least a portion of the characteristic measurements associated with the second unacceptable region. At least one parameter of an operating recipe for performing a process on the workpiece is determined based on the filtered uniformity profile.

Abstract: A systematic method for control the quality of the present invention is used at the packaging station of an assembling production line of an information product. The packaging station has a digital weighing device and a computing device. The systematic method for quality control of the present invention includes the following steps. An information product package is weighed on a digital weighing device and getting a weight value. The configuration data of the information products is input into a computing device to calculate a reference weight data. The weight value of the product package is input into the computing device and is compared the weight value of the information product with the reference weight data thereof on the computing device. The compared result is displayed on the computing device.

Abstract: Method and system for quality control on a production line. Troubles with quality are prevented by detecting a trend in quality characteristics of the production line or fluctuations in an early stage. The absolute values of the differences between same kinds of the data obtained at given measurement points regarding of the quality control data or the absolute values of the differences between same items of one kind of SPC data are used as a controlled item for detecting a trend in quality control characteristics or fluctuations of the quality control characteristics. The difference between maximum and minimum values of the quality control data at plural measurement points within the same lot or within the same wafer is used as the differences between same kinds of the quality control data, for example.

Abstract: Sites to be measured on a device that is to be fabricated using at least one fabrication process, are selected based on a pattern-dependent model of the process. A metrology tool to measure a parameter of a semiconductor device includes a control element to select sites for measurement based on a pattern dependent model of a process with respect to the device. Problematic areas, within a chip or die and within a wafer, are identified that result from process variation. The variation is identified and characterized, and the location of each site is stored. The sites may be manually entered into a metrology tool or the method will automatically generate a measurement plan. Process variation and electrical impact are used to direct the measurement of within-die and wafer-level integrated circuit locations.

Abstract: A method and system for minimizing inter-coefficient crosstalk in imaging the internal properties of a scattering medium. The method and system minimizing inter-coefficient. crosstalk in image reconstruction by solving a system of linear perturbation equations with the use of relative detector values, weight matrix scaling, and constraints based on either the know or unknown direction of the perturbations in the medium's properties. The constraint being either (1) positive or negative corresponding to the direction of a known perturbations, or (2) solving the system of equations with both positive and negative constraints and summing the results where the direction of the perturbations are unknown. The advantages of the inventive method and system result in effective isolation of absorption and scattering coefficient variations, even for complex combinations of perturbations in these coefficients.

Abstract: The invention described herein includes a method of testing a specimen such as urine to determine whether the specimen contains specific substances such as drugs of abuse. An on-site screening test provides a preliminary test result either by visual or machine analysis of a screening test device, and the result and user data are entered on a provided form. An electronic image of the form is sent to a central data location, where it is received and the data on the form is recognized by machine and stored. If the on-site screening test provided a nonnegative result a sample is sent to a laboratory for further testing, and if the test provides only negative results no further testing is done. The testing laboratory performs further testing for verification of nonnegative screening test results, and all data is collected at the central data location. Results are then reported to the client or whomever the client designates to receive test results.

Abstract: Methods and systems for generating a quality enhancement project report. In one embodiment, the methods and systems generate a report of a Six Sigma quality enhancement project directed to a selected process. The project report in this embodiment includes a starting process capability, an ending process capability, a confidence level for the process capabilities, a performance chart that graphically depicts a process improvement and economic data corresponding to the overall cost savings that should result from implementing the process improvement. In one embodiment, a user automatically generates a project report by entering basic project information into various fields on a computer-implemented form displayed on a computer screen. This basic information can include starting process performance data, ending process performance data, and economic data such as labor reductions and implementation costs.

Abstract: A system and method for quality performance evaluation and reporting allows for easy entry of quality performance data via spreadsheet or other file format, or directly, into a quality performance system. Data elements are associated across data types, allowing searches to be performed on the entire corpus of quality performance data. A typical data may be displayed as well, allowing users to focus on problematic quality performance. Data in reports may be displayed graphically or in tabular form; printed or displayed on screen; and searched for once, periodically, or upon other triggers.

Abstract: The present invention provides for a method and an apparatus for using scatterometry to perform feedback and feed-forward control. A processing run of semiconductor devices is performed. Metrology data from the processed semiconductor devices is acquired. Error data is acquired by analyzing the acquired metrology data. A determination is made whether the error data merits modification to the processing of semiconductor devices. A feedback modification of the processing of semiconductor devices is performed in response to the determination that the error data merits modification to the processing of semiconductor devices. A feed-forward modification of the processing of the semiconductor devices is performed in response to the determination that the error data merits modification to the processing of semiconductor devices.

Abstract: A system and method for controlling critical dimension in a semiconductor manufacturing process. The system 10 controls critical dimension by altering focus and exposure settings, based on a single measured attribute (i.e., critical dimension) and on a process model equation. The system 10 further systematically varies focus and exposure settings (e.g., by introducing variable deviation values), in order to provide unique and stable solutions for parameters within the process model equation.

Abstract: A measurement test instrument voltage management system for an accessory device has a accessory device interface that provides a voltage to a memory device in the accessory device. A sensing circuit receives a sensing signal from the accessory device when it is connected to the interface. The sensing circuit generates an interrupt signal that is coupled to a controller. The controller initiates the generation of a clock signal that is coupled to the accessory device through the interface to retrieve accessory device data stored in the device memory. The controller determines if the connected accessory device is a valid device capable of being supported by the measurement test instrument. The controller generates an enable signal for a valid and supported device that is coupled to a voltage switching circuit. The voltage switching circuit generates at least a first output voltage that is coupled to the accessory device via the interface to provide power to the accessory device.

Abstract: The present invention quickly resolves troubles in an analyzer and performs effective external quality control management. An analyzer (2) and a control device (1) are connected by a network (3). Error data and sample data taken from assay of a quality control substance are transmitted from the control device (1) to the analyzer (2). The analyzer (2) is made to be remotely operable from the control device (1) and when troubles arise repair from the control device (1) is possible. The control device (1) tallies sample data, and provides the tally results to a Web page. The analyzer (2) accesses the Web page using a WWW browser, and can perform external quality control in real time.

Abstract: A general method of anomaly detection from time-correlated sensor data is disclosed. Multiple time-correlated signals are received. Their cross-signal behavior is compared against a fixed library of invariants. The library is constructed during a training process, which is itself data-driven using the same time-correlated signals. The method is applicable to a broad class of problems and is designed to respond to any departure from normal operation, including faults or events that lie outside the training envelope.

Abstract: The detection of a processing deviation in a multiple stage wafer processing system is achieved by assigning individual wafers a set of positional coordinates each time the wafer moves within the wafer processing system. In an example embodiment, a wafer is placed into a first processing stage and it is rotated to a certain angle of rotation. As the wafer moves from one processing stage to another the wafer is given a different angle of rotation; both the rotation angle and the wafer location are then recorded as a set of positional coordinates. The processed wafer is examined for surface deviations arising from variations in the processing parameters. The positional coordinates are used to develop a wafer movement map that aids in identifying the processing stage location where the deviation in the processing parameters occurred. An important advantage is the increased processing deviation traceability that the method brings to wafer processing.