Abstract: A threshold detection circuit for developing a mode trigger signal includes an input that receives an input signal. In response to the input signal having approximately an input threshold value for a triggering time, the threshold detection circuit activates the mode trigger signal on an output. In response to the input signal being substantially different from the input threshold value or the input signal not having the input threshold value for the triggering time, the circuit deactivates the mode trigger signal. The threshold detection circuit may be contained in a variety of different mode detection circuits for detecting when an integrated circuit is to be placed in a test mode or other desired mode of operation, and such mode detection circuits may be contained in a variety of different types of integrated circuits, such as memory devices generally and SRAMs specifically.

Abstract: In one embodiment, an integrated circuit which uses one or more re-useable modules may use a signature generated by a duplicate state machine or an unmodified state machine to select, control, or otherwise affect a resource on the integrated circuit, where affecting the resource was not part of the original design and state diagram of the unmodified state machine. In one embodiment, a method and apparatus is provided for dynamically reconfiguring a plurality of test circuits in re-useable modules on an IC without modifying the controller state machine in the re-usable module.

Abstract: A memory built-in self test (MBIST) apparatus and method for testing dynamic random access memory (DRAM) arrays, the DRAM arrays in communication with a memory interface device that includes interface logic and mainline chip logic. The MBIST apparatus includes a finite state machine including a command generator and logic for incrementing data and addresses under test and a command scheduler in communication with the finite state machine. The command scheduler includes resource allocation logic for spacing commands to memory dynamically utilizing DRAM timing parameters. The MBIST apparatus also includes a test memory storing subtests of an MBIST test. Each of the subtests provides a full pass through a configured address range. The MBIST apparatus further includes a subtest pointer in communication with the test memory and the finite state machine. The finite state machine implements subtest sequencing of each of the subtests via the subtest pointer.

Abstract: In synchronization with a PLL clock PCK having a frequency four times that of an external clock ECK, n number of internal addresses IAD including an external address EAD are generated and, in synchronization with the PLL clock PCK, n bits of internal write data ITD are generated to be written into a RAM macro 12. Thereafter, the external address EAD is latched, n number of the internal addresses IAD including the external address EAD are generated in synchronization with the PLL clock PCK, n bits of internal read data ITQ corresponding to n number of the internal addresses IAD are read from the RAM macro 12 in synchronization with the PLL clock PCK and the internal read data ITQ corresponding to the internal address IAD which coincides with a latch address LAD among n number of the internal addresses IAD is outputted.

Abstract: A fixed-logic signal generated inside an integrated circuit is selectively supplied via selectors (Sm+1 to Sn) to input terminals (INm+1 to INn) of a function macro (1) for receiving signals whose logic levels are fixed to “H” or “L” on at least one test pattern. This eliminates any external input terminal for inputting such fixed-logic signal. When the integrated circuit includes function macros, they can be simultaneously tested with this construction.

Abstract: A method of testing an embedded memory at speed within an integrated circuit which includes providing a memory built in self test sequencer module, providing a satellite engine module coupled to the memory built in self test sequencer module and applying a march test to the embedded memory via the satellite engine module based upon information stored within the instruction buffer. The satellite engine module includes an instruction buffer and a sequence generation engine.

Abstract: A method and system for repairing defective memory in a semiconductor chip. The chip has memory locations, redundant memory, and a central location for ordered fuses. The ordered fuses identify in compressed format defective sections of the memory locations. The defective sections are replaceable by sections of the redundant memory. The ordered fuses have an associated a fuse bit pattern of bits which sequentially represents the defective sections in the compressed format. The method and system determines the order in which the memory locations are wired together; designs a shift register of latches through the memory locations in accordance with the order in which the memory locations are wired together; and associates each of the latches with a corresponding bit of an uncompressed bit pattern from which the fuse bit pattern is derived. The uncompressed bit pattern comprises a sequence of bits, representing the defective sections in uncompressed format.

Abstract: The present invention optimizes the performance of integrated circuits by adjusting the circuit operating voltage using feedback on process/product parameters. To determine a desired value for the operating voltage of an integrated circuit, a preferred embodiment provides for on-wafer probing of one or more reference circuit structures to measure at least one electrical or operational parameter of the one or more reference circuit structures; determining an adjusted value for the operating voltage based on the measured parameter; and establishing the adjusted value as the desired value for the operating voltage. The reference circuit structures may comprise process control monitor structures or structures in other integrated circuits fabricated in the same production run. In an alternative embodiment, the one or more parameters are directly measured from the integrated circuit whose operating voltage is being adjusted.

Abstract: A circuit and method for testing an eDRAM through a test controller with direct access (DA) mode logic is provided. The circuit and method of the present invention allows the testing of eDRAMs with a conventional memory tester. The present invention provides a semiconductor device including an embedded dynamic random access memory (eDRAM) for storing data, the eDram including a plurality of memory cells, and a test controller for testing the plurality of memory cells to determine if the cells are defective, the test controller including built-in self-test (BIST) logic circuitry for performing tests and for interfacing to a logic tester, and direct access mode logic circuitry for interfacing the eDRAM with an external memory tester. The test controller further comprises a multiplexer for multiplexing data, commands, and addresses from the BIST logic circuitry and the direct access mode logic circuitry to the eDRAM.

Abstract: A jitter generator produces a jittery test signal for use in performing a jitter test on an integrated circuit (IC) device under test (DUT). The jitter generator includes a programmable delay circuit for delaying a non-jittery input signal with a varying delay controlled by input digital delay control data to produce the test signal. A pattern generator supplies a sequence of delay control data to the programmable delay circuit causing it to produce a desired jitter pattern in the test signal. During a calibration process, a measurement unit feeds the test signal back to the input of the programmable delay circuit, causing the test signal to oscillate with a period proportional to the delay through the delay circuit. The measurement unit then measures the period of the test signal for various values of delay control data and reports measurement results.

Abstract: A programmable logic device (PLD) has the ability to test the configuration memory either independently or during configuration. The PLD may include a selector for selecting a particular column or row of the configuration memory array, and an input data storage device for storing configuration data required to be stored in the selected column or row, or test data for testing the selected column or row. The PLD may also include an output data storage device for storing the output from the selected column or row, and test logic that provides control signals for verifying the correct operation of the data lines of the configuration memory array without disturbing the data stored in the memory array.

Abstract: A microcode programmable built-in-self-test (BIST) circuit and method for testing a multiported memory via multiple ports, either simultaneously or sequentially, as directed by a microcode instruction word. The microcode instruction word contains a plurality of executable subinstructions and one bit of information that controls whether the test operations prescribed in the plurality of subinstructions shall be executed in parallel or in series. The executable subinstructions are dispatched by a primary controller to subcontrollers which perform test operations at each port according to the subinstructions. The microcode programable BIST architecture flexibly facilitates the testing of multiple devices, multiported devices, including multiported memory structures and complex dependent multiported memory structures. The BIST supports in-situ testing of the functionality of the memory at wafer, module, and burn-in, as well as system-level testing.

Abstract: An integrated circuit device can be tested using a built-in test circuit, in the IC device, that tests the operation of an I/O cell. The built-in test circuit includes a pattern generator for generating a series of simulation signals. The built-in test circuit successively stores and retrieves the simulation signals from an I/O buffer of the I/O cell. For each iteration of storing and retrieving, test logic of the built-in test circuit compares the stored and retrieved data to check whether the data matches. If a mismatch is detected, the test logic issues a fail signal. The fail signal can cause a unique signal at the pad of the I/O cell that alerts a tester to the failure of the IC device. The fail signal can also cause the issuance of a device failure signal that can be detected at other pins of the IC device.

Abstract: A method for checking a microprocessor for correct operation, the microprocessor having a plurality of gates, each having a plurality of transistors, in which during the intended running of a computer program on the microprocessor a self-test is cyclically executed, and as part of the self-test, gates in the microprocessor are checked for correct operation. In order to check the microprocessor for correct operation in such a way that the functional check is able to detect at an early stage such errors which occur only during the intended operation of the microprocessor, and to the extent possible not to make use of models of the open-loop or closed-loop control algorithms, at least those gates of the microprocessor whose state has an impact on the intended running of the computer program on the microprocessor are checked during one run of the self-test.

Abstract: An apparatus has an integrated circuit that includes a seed register, a linear feedback shift register to load a test vector into a number of scan chains, and a signature register to receive a test response from the scan chains. The seed register, the linear feedback shift register, and the signature register each have the same register length. The linear feedback shift register and the signature register have the same shift frequency that is greater than a frequency at which a seed vector is loaded into the seed register. The linear feedback shift register is adapted to be selectively provided with bits to control a degree to which its vector is dependent on previous vectors. The scan chains may be configured as a single group providing a test response to a single input signature register or a set of groups providing a test response to a multiple input signature register.

Abstract: A data processing apparatus controls cross-triggering of diagnostic processes on a plurality of processing devices. The data processing apparatus comprises a routing module having a plurality of broadcast channels, one or more of the broadcast channels being operable to indicate the occurrence of a diagnostic event on one or more of the plurality of processing devices. The data processing apparatus also comprises an mapping module associated with a corresponding processing device. The interface module programmably asserts diagnostic event signals from the associated processing device to one or more of the plurality of broadcast channels and programmably retrieves diagnostic events signals from processing devices other than the associated processing device from one or more of the plurality of broadcast channels. The retrieved diagnostic event data is used to facilitate triggering of a diagnostic process on the associated processing device in dependence upon said retrieved diagnostic event data.

Abstract: Method of testing the functionality of a memory which operates at a high operating clock frequency, the method specifically having the following steps, generation of test data, copying of the generated test data at the high operating clock frequency, comparison of the copied test data with the generated test data, generation of a functionality-indicating signal for indicating the functionality of the memory if the copied test data are identical to the generated test data.

Abstract: A flexible Boundary Scan test system is disclosed. The system includes an interpreter module operable to execute a program element selected from a plurality of program elements that include at least one instruction type having an interface to identify and execute selected functions wherein each of the selected functions has associated therewith at least one data information item. In one aspect of the invention, selected ones of the functions are composed of a plurality of functions. In another aspect of the invention, the instruction includes parameters and adornments for determining the selected function execution.

Abstract: In a testing method for a semiconductor memory using a memory BIST process, when it is difficult to carry out a comparing process in one cycle, a pipelining process is used for an expected value comparison, and in this case, in order to cut the number of flip-flops and to reduce an occupied area, at the time of a memory BIST process, a pipeline-use flip-flop and a scan-observing-use flip-flop and/or a scan-control-use flip-flop are used.

Abstract: A method for testing a device-under-test (DUT) includes examining a test data file that includes test data for testing the structure, functionality and/or performance of the DUT. The method also includes separating a first plurality of data units from a second plurality of data units contained in the test data file. The first plurality of data units correspond to a first plurality of DUT pins, and the second plurality of data units correspond to a second plurality of DUT pins.

Abstract: The invention provides a test device for testing circuit units (101a–101n) to be tested, having connecting units (106a–106n) for connecting the circuit units (101a–101n) to be tested to the test device, a test system (100) and an output unit (108) for outputting test result data, the test device having a determining unit (103) for determining those of the measurement data (110a–101n) which correspond for a predeterminable number of circuit units (101a–101n) to be tested, and for defining the corresponding measurement data (110a–110n) as the expected data (111); and comparison units (104a–104n) for comparing the measurement data (110a–110n) generated by the circuit units (101a–101n) to be tested in a manner dependent on the test data (112) written in with the expected data (111) in order to obtain comparison data (115a–115n).

Abstract: An integrated circuit includes a core memory array and a test mode compression circuit. The test mode compression circuit receives test mode data from the core memory array. A multiplexer receives read data from the core memory array and test mode data from the test mode compression circuit. The multiplexer receives a test mode compression signal and selectively transfers one of the read data and the test mode data dependent at least in part upon the test mode compression signal.

Abstract: An apparatus for testing a memory device having a plurality of data lines includes an input circuit, a compression circuit, and an output circuit. The input circuit is adapted to receive at least a first subset of the data lines and a plurality of enable signals. Each enable signal is associated with at least one of the first subset of data lines. The compression circuit is coupled to the input circuit and is adapted to detect a predetermined pattern on the first subset of data lines. The output circuit is coupled to the compression circuit and adapted to provide at least a pass signal when the predetermined pattern is detected on the first subset of data lines. The input circuit is capable of masking at least one of the first subset of data lines from the compression circuit based on the associated enable signal.

Abstract: A method, apparatus, system, computer program and medium, for inspecting a wide variety of circuit boards. A controller generates test data and reference data according to characteristic information of a circuit board. Using the test data, the circuit board generates processed data. A comparator compares the processed data with the reference data on a bit-by-bit basis. Based on the comparison result, the comparator determines acceptability of the circuit board. In addition, the comparator is capable of specifying a specific portion of the circuit board causing a defect.

Abstract: An apparatus for testing an on-chip ROM and a method thereof are provided. By embedding the on-chip ROM test apparatus in a semiconductor chip and externally providing only minimal information, the apparatus and the method can prevent the possible exposure of ROM data stored in the ROM. Also, according to the apparatus and method, information related to the ROM address at which an error occurred can be provided together with the test result and by feeding the ROM address information back to the manufacturing process, product yield can be improved.

Abstract: An improved Built-In-Self-Test (BIST) architecture for Content Addressable Memory (CAM) devices, including a bit scanner for reading out the contents of the matchlines of the CAM cells as a serial bit stream; a bit transition detector that detects and determines the address of each bit transition in the serial bit stream; a state machine that generates bit addresses for each expected transition in the serial bit stream; and an analyser that compares expected transition bit addresses with detected transition addresses and declares a BIST failure if expected and detected transition addresses do not match at any point in the bit stream.

Abstract: Techniques are provided for testing routing resources that route control signals on programmable integrated circuits (ICs). Control signals (such as clock signals) are routed through a logic gate to a test register. Values of the control signals are stored in the test register, transmitted outside the IC, and then compared to expected values to identify defects in the programmable interconnections. An enable circuit couples the control signals to functional registers on the programmable IC during user mode. The enable circuit decouples the control signals from the functional registers so that the control signals do not interfere with tests of the functional registers during test mode. During the test procedures, the control signals are treated as data signals and are not used to control other registers on the IC.

Abstract: A system and method enhance observability of IC failures during burn-in tests. Scan automatic test pattern generation and memory built-in self-test patterns are monitored during the burn-in tests to provide a mechanism for observing selective scan chain outputs and memory BIST status outputs.

Abstract: An identifier is provided for an integrated circuit with a memory composed of a multiplicity of memory cells. The circuit has a manufacture-related memory cell defect pattern formed of defective memory cells. The method of identifying the integrated circuit utilizes the memory cell defect pattern to generate a circuit identification number for identifying the integrated circuit.

Abstract: Methods and systems for reducing the volume of test data associated with built in self testing (BIST) test methodologies (e.g., logical BIST, array BIST, etc.) and pattern structures are provided. Embodiments of the present invention store a limited number of “dynamic” test parameters for each test sequence that have changed relative to a previous test sequence.

Abstract: A method and apparatus for providing a system-on-a-chip comprising a processor and a configurable system logic (CSL) including a plurality of banks arranged in an array coupled to the processor. The system on a chip further includes a built-in self test (BIST) mechanism coupled to the CSL to perform tests on the CSL to verify that the banks and interconnections between the banks are functioning properly.

Abstract: An apparatus is adapted for self-test. The apparatus includes a microcontroller and a number of relay drivers having outputs electrically connected to form a single input for self-test monitoring. The microcontroller is electrically connected to each of the relay drivers and is adapted to energize each of the relay drivers during self-test. The results of the self-test are monitored via a single input line to the microcontroller or by a single input line to a LED.

Abstract: An apparatus comprising (i) a first circuit configured to generate one or more node signals at one or more internal nodes and (ii) a second circuit configured to present one or more of the node signals and a trigger signal in response to one or more control signals.

Abstract: Embodiments of the present invention provide an integrated circuit. In one embodiment, the integrated circuit comprises logic blocks, a measurement circuit and a control circuit. The measurement circuit is configured to measure operating parameters of the integrated circuit and the logic blocks and provide operating parameter data. The control circuit is configured to receive the operating parameter data, evaluate the operating parameter data to obtain configuration data and configure the integrated circuit with the configuration data.

Abstract: A test apparatus for a semiconductor device, which improves the reliability of an operational test on target devices on a wafer using BOST (Built Out Self Test) and BIST (Built In Self Test). The test apparatus includes an external test unit, the BIST circuit formed in the semiconductor device, and BOST device which is coupled between the external test unit and the semiconductor device. Pattern data for a pattern dependency test is stored in the BIST circuit and pattern data for a timing dependency test is stored in the BOST device.

Abstract: In one aspect, the invention is an integrated circuit (IC) for use in testing a device. The IC includes a pin electronics (PE) driver having an output and a pin. The IC also includes a buffer connected to the output of the PE driver and the pin. The first voltage measured at the pin is greater than a second voltage measured at the output. The IC may include a first amplifier having an input connected to a voltage source. The IC may also include a second amplifier having an input connected to the output of the PE driver.

Abstract: Technique to perform logic and embedded memory tests using logic scan chain testing procedures in parallel with memory built in self test (BIST). This is accomplished with a combination of voltage isolation between memory and logic segments, and isolation between logic and memory test clocks. A test algorithm is introduced to enable and disable the scan chain operation during BIST operation.

Abstract: The invention relates to a test method and a test apparatus for a semiconductor integrated circuit device having a high-speed input/output device, and it has for its object to perform the test of the high-speed I/O exceeding 1 GHz, promptly by a simple board construction, without altering a test system for individual I/O specifications. A semiconductor integrated circuit device (1) having a high-speed input/output device (2) is set on a load board (3) which is provided with loopback paths (4) each connecting the external output terminal and external input terminal of the semiconductor integrated circuit device (1) by transmission lines, and the operation of the high-speed input/output device (2) is tested within the semiconductor integrated circuit device (1) by utilizing test means (5) disposed inside the semiconductor integrated circuit device (1), and the loopback paths (4).

Abstract: A semiconductor integrated circuit that allows a self test of an integrated circuit built into a system to be conducted through a circuit structure on a smaller scale and achieves an improvement in the accuracy of the self test is provided. An integrated circuit includes functional modules respectively provided with built-in self testing circuits and a self test control circuit that individually controls the built-in self testing circuits. This structure allows self tests to be automatically performed within the integrated circuit without requiring external components. The scale of the system having the built-in integrated circuit may thus be reduced. Also, by building up the built-in self testing circuits in the individual functional modules to a sufficient degree, a high-quality self test comparable to that conducted prior to shipment can be performed even after the integrated circuit is built into the system.

Abstract: Disclosed are novel methods and apparatus for efficiently providing instruction-based BIST of memory interconnects. In an embodiment of the present invention, a method of testing a memory interconnect between an external memory module and a chip is disclosed. The method includes: providing an on-chip memory controller coupled to the external memory module, the on-chip memory controller sending and receiving data to and from the external memory module; providing an on-chip built-in self-test (BIST) module coupled to the on-chip memory controller, the BIST module including an instruction register to store a plurality of instructions; testing the external memory module; and once the external memory module has successfully passed the testing, utilizing the external memory module in testing the memory interconnect.

Abstract: The invention includes an integrated circuit. The integrated circuit includes a test controller, at least one logic unit controller, and a test bus connected between the test controller and the logic unit controller. A design for test feature is connected to the logic unit controller. Moreover, a logic unit can be connected to the design for test feature.

Abstract: A programmable built in self test, BIST, system for testing a memory, comprises an instruction register formed in the same chip as the memory; a circuit for loading the register by successive instructions, each instruction comprising at least one address control field, a first number (m) of operation fields, a number-of-operations field specifying a second number t+1, with t+1?m; a circuit controlled by the address control field to determine successive addresses; and a cycle controller for executing, for each successive address, the second number (t+1) of successive operations, each of which is determined by one of the t+1 first operation fields.

Abstract: The multi-port memory device includes a plurality of ports supporting serial I/O interface, and the plurality of ports includes a transmission pad and a reception pad. The multi-port memory device includes: a memory core; a control block for generating an internal command signal, an internal address and a control signal, which correspond to the command and are necessary for an operation of the memory core, using commands and addresses inputted to the plurality of ports packet form; and a mode selection block for combining signals applied to plurality of mode selection pads and generating a test mode flag signal, in which I/O data assigned to the transmission pad and the reception pad in a test mode in response to the test mode flag signal are exchanged with the memory core through the ports.

Abstract: A circuit for testing a chip. The chip has an intellectual product circuit module, and the circuit has a multiplexer controller, several registers and a MUX finite state machine controller to configure these registers in different states according to the test patterns. In the next state, a test activating signal is provided to the intellectual product circuit module. The intellectual product circuit module is then operated and tested according to the output of the registers.

Abstract: A die frame logic analyzer unit. For one aspect, a programmable logic analyzer unit is provided, wherein at least a first portion of the programmable logic analyzer unit is provided in a die frame. The programmable logic analyzer unit is to test a function of an integrated circuit on a wafer that includes the die frame.

Abstract: Method and apparatus for hardware co-simulation clocking is described. More particularly, single-step clocking is used to load one or more test vectors and to output test results from such test vectors after processing. The test vectors are processed with the hardware using a free-running clock, for example to speed up test time and to generate information related to operational speed. A simulation of the hardware is used, where single-step clocking out the test results facilitates verification of the hardware test results with simulation test results.

Abstract: A voltage-glitch detection circuit includes a voltage comparator having two input terminals with different capacitance resistance charge/discharge time. Voltage dividers are coupled to the two input terminals of the voltage comparator respectively, and commonly receive a supply voltage. One of the voltage dividers is supplied to the voltage comparator as a reference voltage of the voltage comparator, and the other is supplied as a glitch detection voltage to the voltage comparator.

Abstract: System for testing a group of functionally independent memories (102) and for replacing failing memory words of the group of functionally independent memories (102) by redundant memory words, comprising: redundancy means 108) including at least one array of redundant memory words (108a) and address registers (108b) connected to at least one array of redundant memory words (108a); a test means (114); a group of first multiplexers (110) following the test means (114) and preceding the memories (102) and the at least one array of redundant memory words (108a); and a group of second multiplexers (112) following the memories (102) and the at least one array of redundant memory words (108a), wherein each second multiplexer (112) is connectable to the test means (114).

Abstract: A search engine apparatus having a built-in functional test may include an input generator, a search engine, a pseudo search engine and a comparator. The inputs generator is suitable for generating outputs including commands and points associated with the commands. The search engine and the pseudo search engine are communicatively coupled to the inputs generator. The search engine suitable for performing search and edit operations and the pseudo search engine is suitable for simulating the search engine by generating pseudo search engine outputs. The comparator is communicatively coupled to the search engine and the pseudo search engine, and is suitable for comparing outputs received from the search engine and pseudo search engine.

Abstract: A chip stack includes a field programmable gate array (FPGA) and an auxiliary component coupled to the FPGA with intercommunicated clock, control and/or data signals. The auxiliary component has a functionality mapped into the FPGA. The pin definition of the FPGA is redefined so that the FPGA and the auxiliary component in combination operate as a modified FPGA. A test circuit is programmed into the FPGA to exercise the auxiliary component to test functionality and timing performance at full speed. The functionality of the auxiliary component mapped into the FPGA is parameterized, such as for the data word width for reading and/or writing data words of different lengths into the auxiliary component in both an aligned and nonaligned manner. A memory interface allows multiple auxiliary circuits to be accessed through the FPGA either together to generate a wider data word or serially to achieve a greater memory depth.